JP2010225714A - Mounting substrate with vibration device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting substrate with a vibration device, which has a sufficiently small thickness, and on which the vibration device and a control device are mounted. <P>SOLUTION: The mounting substrate 1000 with a vibration device has: a mounting substrate 100 having a recess 180; and a vibration device 200 and a control device 300 mounted on the mounting substrate 100. The vibration device 200 or the control device 300 is mounted in the recess 180, and the vibration device 200 and control device 300 are interconnected by bumps 400. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a mounting substrate with a vibration device.

  A vibrating device such as a crystal oscillator has a vibrating piece. In order to prevent the dissipation of energy due to friction with a gas, the resonator element is often enclosed in an airtight container called a package. Since such a package is larger than other electronic elements, a dead space is likely to occur in a mounting substrate with a vibration device in which the vibration device is mounted on a wiring board or the like. Reducing the dead space has become an important technology as the mounting substrate with the vibration device on which the vibration device is mounted and the electronic device on which the mounting substrate with the vibration device is mounted are downsized.

  As a technique for reducing such dead space, for example, JP 2008-104151A discloses a piezoelectric device (vibration device) in which a driving IC (control device) is arranged under a package. Yes. The publication discloses that the planar dimensions of the piezoelectric device can be reduced by doing so.

JP 2008-104151 A

  However, even if the vibration device and the control device can be planarly overlapped to reduce the planar occupation area and increase the integration degree of the mounting substrate with the vibration device, the thickness of the mounting substrate with the vibration device is not necessarily It wasn't getting smaller. For this reason, the three-dimensional integration degree of the mounting substrate with the vibration device has not necessarily increased. Further, reducing the thickness of the vibration device is reaching a limit because it is necessary to form a space in the package.

  One of the objects according to some aspects of the present invention is to provide a mounting substrate with a vibration device having a sufficiently small thickness on which the vibration device and the control device are mounted.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following aspects or application examples.

[Application Example 1]
One aspect of the mounting substrate with a vibration device according to the present invention is:
A mounting substrate having a recess;
A vibration device and a control device mounted on the mounting substrate;
Have
The vibration device or the control device is mounted in the recess;
The vibration device and the control device are connected to each other by a bump.

  Such a mounting substrate with a vibration device can have a sufficiently small thickness because the vibration device or the control device is disposed in the recess of the mounting substrate. In addition, such a mounting substrate with a vibration device can reduce stray capacitance because the vibration device and the control device are arranged close to each other.

[Application Example 2]
In application example 1,
The mounting substrate with a vibration device, wherein the thickness of the vibration device or the control device mounted in the recess is substantially the same as the depth of the recess.

  Here, “substantial” means that even if a slight error occurs due to a manufacturing error or the like, such an error is included when the same effect can be obtained.

  In such a mounting substrate with a vibration device, the surface of the mounting substrate other than the concave portion and the surface of the vibration device or the control device are formed on the same plane. Therefore, various devices can be easily mounted across the vibration device or the control device and the surface other than the concave portion on the surface of the mounting substrate.

[Application Example 3]
In application example 1 or application example 2,
A mounting substrate with a vibration device, wherein the vibration device is mounted in the recess.

  Such a mounting substrate with a vibrating device can be more effectively reduced in thickness because at least a part of the vibrating device is disposed in the recess.

[Application Example 4]
In application example 3,
The vibration device includes a case body, a lid body that seals the case body, and a vibrating piece provided in a cavity formed by the case body and the lid body,
The lid is a mounting substrate with a vibration device fixed to a bottom surface of the recess.

  Such a mounting substrate with a vibration device can use a terminal formed on the case body of the vibration device as a mounting terminal. Therefore, the mounting density in the planar direction can be improved.

[Application Example 5]
In application example 4,
The mounting substrate has a conductive layer on the bottom surface of the recess,
The control device has a grounding terminal;
The mounting body with a vibration device, wherein the lid is electrically connected to the grounding terminal through the conductive layer.

  Such a mounting substrate with a vibrating device can make the lid of the vibrating device have the same potential as the ground terminal of the control device. Therefore, the operation of the vibration device or the control device can be further stabilized.

[Application Example 6]
In application example 4,
The mounting substrate has a conductive layer on the bottom surface of the recess,
The vibration device has wiring for electrically connecting the vibrating piece and the lid, and an external connection terminal formed on the case body,
The control device has a first drive terminal and a second drive terminal,
The external connection terminal is electrically connected to the first drive terminal,
The mounting body with a vibration device, wherein the lid is electrically connected to the second driving terminal via the conductive layer.

  In such a mounting substrate with a vibration device, the lid of the vibration device can be used as an electrode for driving the vibration device. Therefore, the number of terminals can be reduced, and the degree of integration of the mounting substrate with the vibration device can be further increased.

[Application Example 7]
In any one of Application Examples 1 to 6,
The mounting board is a multilayer wiring board, a mounting board with a vibration device.

  Such a mounting substrate with a vibration device can easily form a recess and can increase the degree of freedom of wiring.

[Application Example 8]
In any one of Application Examples 1 to 7,
A mounting substrate with a vibration device, wherein the recess is molded.

  In such a mounting substrate with a vibration device, since the vibration device or the control device is molded in the recess, the mechanical and electrical reliability can be further improved.

[Application Example 9]
In any one of Application Examples 1 to 8,
The control device has an oscillation circuit,
The oscillation circuit is electrically connected to a clock wiring formed on the mounting substrate,
The mounting board with a vibration device, wherein the clock wiring is electrically connected to an electronic component to be supplied mounted on the mounting board.

  In such a mounting board with a vibration device, the control device includes an oscillation circuit that supplies a clock signal to an electronic component to be supplied mounted on the mounting board, so that a good clock signal can be supplied by reducing stray capacitance. Can do.

Sectional drawing which shows typically the mounting substrate 1000 with a vibration device of embodiment. Sectional drawing which shows typically the mounting board | substrate 2000 with a vibration device of embodiment. Sectional drawing which shows typically the mounting board | substrate 3000 with a vibration device of embodiment. Sectional drawing which shows typically the mounting board | substrate 4000 with a vibration device of embodiment. Sectional drawing which shows typically the mounting board | substrate 5000 with a vibration device of embodiment. Sectional drawing which shows typically the mounting board | substrate 6000 with a vibration device of embodiment. Sectional drawing which shows typically the mounting board | substrate 7000 with a vibration device of embodiment. Sectional drawing which shows typically the mounting board | substrate 8000 with a vibration device of embodiment. Sectional drawing which shows typically the vibration device 200 of embodiment. Sectional drawing which shows typically the mounting board | substrate 9000 with a vibration device of embodiment.

  Preferred embodiments of the present invention will be described below with reference to the drawings. In addition, the following embodiment demonstrates the example of this invention.

(First embodiment)
1. Mounting Board with Vibration Device FIGS. 1 to 8 are cross-sectional views schematically showing a mounting board with a vibration device according to this embodiment.

  The mounting substrate with a vibration device according to the present invention can be variously modified. Therefore, hereinafter, the mounting substrate 1000 with the vibration device of FIG. 1 will be described as a standard configuration, and the mounting substrates 2000 to 8000 with the vibration device of FIGS. 2 to 8 will be described as modified embodiments. In addition, the aspect of each deformation | transformation can be applied to this embodiment individually or in combination of multiple.

  A mounting substrate 1000 with a vibration device according to the present embodiment includes a mounting substrate 100, a vibration device 200, and a control device 300. In the present embodiment, the vibration device 200 is mounted in the recess 180 of the mounting substrate 100, and the control device 300 is mounted on the mounting surface 100 a of the mounting substrate 100.

1.1. Mounting Board The mounting board 100 is a member that becomes a base of the mounting board 1000 with the vibration device. The planar shape of the mounting substrate 100 is not limited. Examples of the mounting substrate 100 include a multilayer or single-layer wiring substrate. In the example of the mounting substrate 1000 with the vibration device in FIG. 1, the mounting substrate 100 is a multilayer wiring substrate. The number of layers of the multilayer wiring board has a four-layer laminated structure in the illustrated example, but is not limited to this. In the example of the mounting substrate 2000 with the vibration device in FIG. 2, the mounting substrate 100 is a single-layer substrate. The mounting substrate 100 may be a silicon substrate or a compound semiconductor substrate. As shown in FIG. 1, an internal conductive layer 120 for electrical connection and a plug 140 can be formed inside the mounting substrate 100. The arrangement of the internal conductive layer 120 and the plug 140 is not limited. The mounting substrate 100 can be, for example, a motherboard. Examples of the material of the mounting substrate 100 include polymer materials such as polyimide, and semiconductor materials such as silicon and compound semiconductors.

  The mounting substrate 100 has a mounting surface 100a. The mounting surface 100 a can be one main surface or both main surfaces of the mounting substrate 100. Various electronic components can be mounted on the mounting surface 100a by bump bonding, wire bonding, or the like.

  A plurality of electrode pads 160 are formed on the mounting surface 100a. The planar shape of the electrode pad 160 is not limited. The electrode pad 160 may also serve as wiring on the mounting surface 100a. The electrode pad 160 can be electrically connected to the plug 140 or the like. In the example of FIG. 1, three electrode pads 160 are drawn.

  The electrode pad 160 can be used as a bump bonding pad. When the electrode pad 160 is used as a bump bonding pad, the thickness of the electrode pad 160 can be adjusted in consideration of the distance from the electrode pad to which the electrode pad 160 is connected. For example, when the mounting substrate 100 and the control device 300 are electrically and / or mechanically connected by the bump 400, and the thickness of the vibration device 200 and the depth of the recess 180 are different (see FIG. 3). In addition, the thickness of the electrode pad 160 may be adjusted so that the size of the plurality of bumps 400 is uniform. That is, the electrode pad 160a of the mounting substrate 3000 with the vibration device in FIG. 3 is formed thick enough to eliminate the step between the mounting surface 100a and the upper surface of the vibration device 200. Thereby, each bump 400 of the mounting substrate 3000 with the vibration device is formed to have substantially the same size. In this way, mounting of the control device 300 and the like on the mounting substrate 100 can be facilitated. The electrode pad 160 may be a single layer or a multilayer structure. Examples of the material of the electrode pad 160 include tungsten, molybdenum, gold, nickel, and the like.

  The mounting substrate 100 has a recess 180. The recess 180 is formed on the mounting surface 100 a of the mounting substrate 100. The planar external shape of the recess 180 is not particularly limited as long as it is larger than the planar external shape of the vibration device 200 described later. The depth of the recess 180 is not limited as long as a part or all of the vibration device 200 is accommodated in the recess 180.

  Examples of the method for forming the recess 180 in the mounting substrate 100 include mechanical processing and chemical processing by etching. Further, when the mounting substrate 100 is a multilayer wiring substrate, for example, the recess 180 can be formed by providing an opening in the wiring substrate constituting each layer and laminating. When a multilayer wiring board is selected as the mounting substrate 100, for example, as shown in the figure, the opening 180 is not formed in the lower one layer, but the opening 180 is formed in the upper three layers to form the recess 180. Can do. When the mounting substrate 100 is a multilayer wiring substrate, the degree of freedom of routing of wiring and the like in the mounting substrate 100 is high.

1.2. Vibration Device In the present embodiment, the vibration device 200 is mounted in the recess 180 of the mounting substrate 100. The vibration device 200 includes at least the case body 10, the lid body 20, the vibration piece 30, and the electrode pad 40. The vibration device 200 is provided such that the lid 20 faces the bottom surface of the recess 180. That is, the vibration device 200 is accommodated in the recess 180 so that the outer bottom surface 10 s of the case body 10 on which the electrode pads 40 are formed faces the same direction as the mounting surface 100 a of the mounting substrate 100. Each member of the vibration device 200 will be described later.

  The vibration device 200 is connected to the control device 300 by bump bonding or the like. In the example illustrated in FIG. 1, the vibration device 200 is fixed to the control device 300 via the bumps 400, and the control device 300 is fixed to the mounting surface 100 a of the mounting substrate 100. As a result, the vibration device 200 is mounted in the recess 180. Note that the vibration device 200 may or may not be in contact with the bottom surface of the recess 180 of the mounting substrate 100.

  An adhesive may be used in combination for mounting the vibration device 200 on the mounting substrate 100. For example, the vibration device 200 can be fixed in the recess 180 of the mounting substrate 100 with an adhesive, a mold resin, or the like. In the example of FIG. 1, the vibration device 200 is fixed to the mounting substrate 100 via the control device 300, and is further fixed by an adhesive layer 220 provided on the bottom surface of the recess 180 of the mounting substrate 100. In the example of the mounting substrate 4000 with the vibration device in FIG. 4, the vibration device 200 is fixed to the mounting substrate 100 via the control device 300 and is further fixed by the mold layer 240 provided in the recess 180 of the mounting substrate 100. Has been. By doing so, the vibration device 200 is firmly mounted on the mounting substrate 100, and the mechanical and electrical reliability of the mounting substrate 1000 with the vibration device can be further improved.

  The vibration device 200 will be specifically described below. FIG. 9 is a cross-sectional view schematically showing the vibration device 200.

1.2.1. Case Body The case body 10 has a container shape that can accommodate the resonator element 30. The outer bottom surface 10s of the case body 10 has a flat shape. Examples of the planar shape of the case body 10 include a rectangle and a circle. In the example of FIG. 9, the case body 10 has a configuration in which a bottom material 12 that forms the bottom of the container and a wall material 14 that forms the side wall of the container are joined. In the case body 10, the bottom member 12 and the wall member 14 may be integrated. The upper portion of the case body 10 has an opening that allows the vibrator 30 to be placed inside the case body 10. The opening of the case body 10 can be hermetically sealed by the lid body 20. A wiring 11 may be formed on the inner wall of the case body 10. The wiring 11 can be electrically connected to the vibrating piece 30. Examples of the material of the wiring 11 include tungsten, molybdenum, gold, nickel, and the like. The bottom material 12 can have a through hole. The through hole is filled with a conductive material, and can be a via hole 16 that electrically connects the wiring 11 inside the case body 10 to the external electrode pad 40 and the like. The number of via holes 16 is two in the illustrated example, but is not limited thereto. Examples of the conductive material used for the via hole 16 include tungsten and molybdenum. The via hole 16 can have airtightness. Examples of the material of the case body 10 include inorganic materials such as crystal, ceramic, and glass.

1.2.2. Lid Body The lid body 20 has a flat plate shape that seals the upper opening of the case body 10. The planar shape of the lid body 10 is arbitrary as long as the opening of the case body 10 can be sealed. Examples of the material of the lid body 10 include ceramic, glass, and metal. When the lid 20 is made of a conductive material such as metal, the lid 20 can also be used as a terminal for external connection. Adhesion between the case body 10 and the lid body 10 can be performed using, for example, plasma welding, seam welding, ultrasonic bonding, or an adhesive. The cavity 18 formed by the case body 10 and the lid body 20 becomes a space for the vibration piece 30 to operate. Further, since the cavity 18 can be sealed, the resonator element 30 can be installed in the decompression space.

1.2.3. The vibrating piece 30 is provided in a cavity 18 formed by the case body 10 and the lid body 20. The vibration piece 30 may be any form of vibration piece. Examples of the vibration piece 30 include an AT vibration piece, a tuning fork type vibration piece, a SAW vibration piece, and a walk type vibration piece. Further, the resonator element 30 itself may be formed of a piezoelectric material such as quartz, lithium tantalate, or lithium niobate, or may be formed of a material that does not have piezoelectricity. When the vibration piece 30 is formed of a material that does not have piezoelectricity, for example, a piezoelectric element may be further included in the configuration of the vibration piece 30. An electrode (not shown) or the like may be formed on the vibrating piece 30.

  The vibration piece 30 can be fixed to a wall surface in the cavity 18 (in the example of FIG. 9, the upper surface of the bottom material 12) by, for example, an adhesive, a paste, a brazing material, or the like. Further, as in the example of FIG. 9, the resonator element 30 may be fixed to the wiring 11 formed on the upper surface of the bottom member 12 by the conductive adhesive layer 38. In this way, the conductive adhesive layer 38 can also function as fixing of the vibrating piece 30 and electrical connection between the vibrating piece 30 and the wiring 11. Examples of the material of the conductive adhesive layer 38 include a conductive paste and a metal brazing material.

1.2.4. Electrode Pad The electrode pad 40 is formed on the outer bottom surface 10 s of the case body 10. A plurality of electrode pads 40 may be formed. The planar shape of the electrode pad 40 is arbitrary. The electrode pad 40 may also serve as wiring on the outer bottom surface 10 a of the case body 10. At least one of the electrode pads 40 has a function of bump-bonding the vibration device 200 and the control device 300. The electrode pad 40 can be connected to the via hole 16. In the example of FIG. 9, the vibrating device 200 includes an electrode pad 40 connected to the via hole 16 and an electrode pad 40 not connected to the via hole 16.

  In the example of FIG. 1, two electrode pads 40 of the vibration device 200 are bonded to the control device 300 by bumps 400. In the example of FIG. 1, all the electrode pads 40 are connected to the control device 300 by the bumps 400, but other electrode pads that do not have such a function may be formed in the vibration device 200. .

  The electrode pad 40 can be used as a pad for bump bonding. When the electrode pad 40 is used as a bump bonding pad, the thickness of the electrode pad 40 can be adjusted in consideration of the distance from the electrode pad of the connection destination. For example, when the vibration device 200 and the control device 300 are electrically and / or mechanically connected by the bump 400, the thickness of the vibration device 200 is smaller than the depth of the recess 180 (see FIG. 5). The thickness of the electrode pad 40 can be adjusted to make the bumps 400 uniform in size. That is, the electrode pad 40a of the vibration device 200 of the mounting substrate 5000 with the vibration device in FIG. 5 is formed thick enough to eliminate the step between the mounting surface 100a and the upper surface of the vibration device 200. Thereby, each bump 400 of the mounting substrate 5000 with the vibration device is formed in substantially the same size. In this way, mounting of the control device 300 and the like on the mounting substrate 100 can be facilitated.

  The electrode pad 40 may be a single layer or a multilayer structure. Examples of the material of the electrode pad 40 include tungsten, molybdenum, gold, nickel, and the like.

1.3. Control Device In the present embodiment, the control device 300 is mounted on the mounting surface 100 a of the mounting substrate 100. The control device 300 is mounted so as to straddle the recess 180 of the mounting substrate 100. Therefore, it is possible to have sufficient mechanical strength for mounting the control device 300 and the vibration device 200. Examples of a method for mounting the control device 300 on the mounting substrate 100 include fixing by bump bonding or the like, fixing by an adhesive, or the like. When the control device 300 is mounted by bump bonding, resin sealing or the like may be used in combination.

  The control device 300 has at least one electrode pad 310 for connecting to the vibration device 200 via the bump 400. In addition, the control device 300 can have a plurality of terminals for connecting to the mounting substrate 100. The control device 300 can have a grounding terminal. In the example of FIG. 1, the control device 300 has three electrode pads 320 for connecting to the mounting substrate 100. In the illustrated example, the control device 300 includes electrode pads 310 and 320 on the mounting surface 300a, and the control device 300 and the mounting substrate 100 are connected by the electrode pads 320 and the bumps 400. 200 is connected to the electrode pad 310 and the bump 400. When the control device 300 and the mounting substrate 100 are connected by a method other than bump bonding, the terminals of the control device 300 may be provided on a surface other than the mounting surface 300a. Examples of electrical connection methods other than bump bonding include wire bonding. Examples of mechanical connection methods other than bump bonding include fixing with an adhesive.

  The electrode pads 310 and 320 can be used as bump bonding pads. When the electrode pads 310 and 320 are used as bump bonding pads, the thicknesses of the electrode pads 310 and 320 can be adjusted in consideration of the distance from the connection-target electrode pad. For example, when the control device 300, the vibration device 200, and the mounting substrate 100 are electrically and / or mechanically connected by the bump 400, the thickness of the vibration device 200 is different from the depth of the recess 180 (see FIG. 3 and FIG. 5), the thickness of the plurality of bumps 400 can be made uniform by adjusting the thickness of the electrode pads 310 and 320. That is, the electrode pad 320a of the control device 200 of the mounting board 3000 with the vibration device in FIG. 3 is formed thick enough to eliminate the step between the mounting surface 100a and the upper surface of the vibration device 200. Further, the electrode pad 310a of the control device 200 of the mounting board with vibration device 5000 in FIG. 5 is formed thick enough to eliminate the step between the mounting surface 100a and the upper surface of the vibration device 200. As a result, the bumps 400 of the vibration device-equipped mounting substrates 3000 and 5000 are formed to have substantially the same size. In this way, mounting of the control device 300 and the like on the mounting substrate 100 can be facilitated. The electrode pads 310 and 320 may have a single layer or a multilayer structure. Examples of the material of the electrode pads 310 and 320 include tungsten, molybdenum, gold, and nickel.

  The control device 300 can include an oscillation circuit that oscillates the resonator element 30 (vibration device 200) and outputs a clock signal. In that case, a clock signal can be supplied from the control device 300 to one or a plurality of supplied electronic components (not shown) mounted on the mounting substrate 100 via the internal conductive layer 120 (clock wiring). Examples of electronic components to be supplied include various electronic components that require a clock signal such as a CPU, a microcomputer, and a memory.

  The control device 300 can include a sensor circuit that performs excitation and vibration detection of the vibrating piece 30 (vibrating device 200). The sensor circuit may include a circuit that performs temperature correction. For example, the temperature correction circuit measures the temperature with a thermocouple or the like provided in the control device 300 and calibrates the vibration characteristics and the like of the resonator element 30 based on the temperature. The control device 300 of the present embodiment is connected to the vibration device 200 by bump bonding. Therefore, the spatial distance between the control device 300 and the vibration device 200 is small. Thereby, when the control device 300 has a temperature correction circuit, the temperature of the resonator element 30 can be grasped more accurately, and the accuracy of temperature correction can be increased.

  Moreover, since the control device 300 is connected to the vibration device 200 by bump bonding as described above, the electrical connection distance between the control device 300 and the vibration device 200 is small. Thereby, the stray capacitance when controlling the vibration device 200 can be reduced.

1.4. Bump Bump 400 electrically and mechanically connects vibration device 200 and control device 300. In addition, the bump 400 can electrically and / or mechanically connect the control device 300 and the mounting substrate 100 as necessary. As the bump 400, for example, a gold bump or a solder bump can be used. Examples of the solder bump material include a plurality of metal alloys selected from the group consisting of gold, tin, lead, silver, copper, bismuth, silicon, germanium, and antimony. The size of the bump 400 is not limited. For example, when the control device 300, the vibration device 200 and the mounting substrate 100 are electrically and mechanically connected by the bump 400, the thickness of the vibration device 200 is larger than the depth of the recess 180 (FIG. 6). Reference) can make the sizes of the bumps 400 different from each other. In other words, the mounting substrate 6000 with the vibration device in FIG. 6 includes a bump 400a that connects the mounting surface 100a and the control device 300, and a bump 400b that connects the control device 300 and the vibration device 200, and the bump 400a is a bump. Bulk is larger than 400b. Although not illustrated, when the thickness of the vibration device 200 is smaller than the depth of the recess 180, the bump 400a can be made less bulky than the bump 400b.

1.5. Modification of Electrical Connection FIG. 7 is a cross-sectional view schematically showing a mounting substrate with a vibration device 7000 according to a modification of the present embodiment. The mounting board 7000 with the vibration device is the same as the mounting board 1000 with the vibration device except that the lid 20 of the vibration device 200 is electrically connected to the ground terminal of the control device 300, and other matters will be described. Omitted.

  A conductive layer 182 is formed on the bottom surface of the recess 180 of the mounting substrate 100 of the mounting substrate 7000 with the vibration device. The conductive layer 182 is connected to the internal conductive layer 120 in the mounting substrate 100. Although not shown, when the mounting substrate 100 is a single layer substrate, the conductive layer 182 can be routed through the side surface of the recess 180. The lid 20 of the vibration device 200 of the mounting substrate 7000 with the vibration device is made of a conductive material. The conductive layer 182 is electrically connected to the lid body 20. On the other hand, the conductive layer 182 is electrically connected to the ground terminal (the electrode pad 320c in FIG. 7) of the control device 300. In this way, the lid 20 of the vibration device 200 of the mounting substrate with a vibration device 7000 can have the same potential as the ground potential of the control device 300. Therefore, the mounting substrate with a vibration device 7000 can further stabilize the operations of the vibration device 200 and the control device 300.

  FIG. 8 is a cross-sectional view schematically showing a mounting substrate 8000 with a vibration device according to a modification of the present embodiment. The mounting substrate with vibration device 8000 is the same as the mounting substrate with vibration device 1000 except that the vibration device 200 is electrically connected to the control device 300 via the lid body 20, and other matters will be described. Omitted.

  The vibration device 200 of the mounting substrate 8000 with the vibration device includes a wiring 11 a that is electrically connected to the lid 20 in the cavity 18. The wiring 11a is electrically connected to the electrode of the vibrating piece 30. If the resonator element 30 has a plurality of electrodes with different potentials, the wiring 11a can be connected to one of the electrodes. In addition, the vibration device 200 of the mounting substrate with a vibration device 8000 includes at least one external connection terminal (electrode pad 40 in FIG. 8) on the outer bottom surface 10 s of the case body 10. The external connection terminal is electrically connected to the electrode of the resonator element 30. The vibration device 200 having such a configuration can be driven by appropriately connecting the lid 20 and the electrode pad 40 to the control device 300.

  The control device 300 of the mounting substrate with a vibration device 8000 has a first drive terminal (electrode pad 310d in FIG. 8) and a second drive terminal (electrode pad 320d in FIG. 8) for driving the vibration device 200.

  A conductive layer 182 is formed on the bottom surface of the concave portion 180 of the mounting substrate 100 of the mounting substrate 8000 with the vibration device. The conductive layer 182 is connected to the internal conductive layer 120 in the mounting substrate 100. When the mounting substrate 100 is a single layer substrate, the conductive layer 182 can be routed through the side surface of the recess 180. The lid 20 of the vibration device 200 of the mounting substrate 8000 with the vibration device is made of a conductive material. The conductive layer 182 is electrically connected to the lid body 20.

  The external connection terminal of the vibration device 200 of the mounting board with vibration device 8000 is electrically connected to the first drive terminal of the control device 300 by bump bonding. On the other hand, the lid 20 is electrically connected to the second drive terminal of the control device 300. With such electrical connection, the vibration device 200 of the mounting substrate 8000 with the vibration device can be driven and controlled by the control device 300.

  The mounting substrate with vibration device 8000 uses the lid 20 for electrical connection of the vibration device 200. By adopting such an aspect, the number of terminals formed in the vibrating device 200 can be reduced. Thereby, the integration degree of the mounting substrate with the vibration device can be further increased.

  In the above description, the vibration device 200 is provided so that the lid 20 faces the bottom surface of the recess 180. Although not illustrated, the outer bottom surface 10 s of the vibration device 200 can be provided so as to face the bottom surface of the recess 180 by forming a plurality of the conductive layers 182 of the above-described modification.

  As described above, in the mounting substrate with a vibration device according to the present embodiment, a part or all of the vibration device 200 is accommodated in the recess 180 of the mounting substrate 100. Therefore, it can have a sufficiently small thickness. Moreover, since the vibration device 200 and the control device 300 are disposed close to each other in the mounting substrate with the vibration device according to the present embodiment, the stray capacitance can be reduced.

(Second Embodiment)
2. Mounting Board with Vibration Device FIG. 10 is a cross-sectional view schematically showing a mounting board with vibration device 9000 according to the present embodiment.

  The mounting substrate 9000 with the vibration device according to the present embodiment includes the mounting substrate 100, the vibration device 200, and the control device 300. In the present embodiment, the control device 300 is mounted in the recess 180 of the mounting substrate 100, and the vibration device 200 is mounted on the mounting surface 100 a of the mounting substrate 100.

2.1. Mounting Board The mounting board 100 of this embodiment is substantially the same as the mounting board 100 described in the first embodiment. In the present embodiment, the planar outer shape of the recess 180 of the mounting substrate 100 is not particularly limited as long as it is larger than the planar outer shape of the control device 300 described later. The depth of the recess 180 is not limited as long as a part or all of the control device 300 is accommodated in the recess 180.

2.2. Vibration Device In the present embodiment, the vibration device 200 is mounted on the mounting surface 100 a of the mounting substrate 100. The vibration device 200 is mounted so as to straddle the concave portion 180 of the mounting substrate 100. Therefore, it is possible to have sufficient mechanical strength for mounting the vibration device 200 and the control device 300.

  In the present embodiment, the vibration device 200 is provided so that the case body 10 faces the mounting surface 100 a of the mounting substrate 100.

  Examples of the mounting method of the vibration device 200 on the mounting substrate 100 include fixing by bump bonding, fixing by an adhesive, and the like. When the vibration device 200 is mounted by bump bonding, resin sealing or the like may be performed.

  The vibration device 200 has at least one electrode pad 40 for connecting to the control device 300 via the bump 400. The vibration device 200 has a plurality of terminals for connecting to the mounting substrate 100. In the example of FIG. 10, the vibration device 200 includes electrode pads 40 c and 40 d, the vibration device 200 and the mounting substrate 100 are connected by the electrode pads 40 d and the bumps 400, and the vibration device 200 and the control device 300 are The electrode pads 40c and the bumps 400 are connected. When the vibration device 200 and the mounting substrate 100 are connected by a method other than bump bonding, the terminals of the vibration device 200 may be provided on a surface other than the outer bottom surface 10 s of the case body 10. Examples of electrical connection methods other than bump bonding include wire bonding. Examples of mechanical connection methods other than bump bonding include fixing with an adhesive.

  The electrode pads 40c and 40d can be used as bump bonding pads. Since the deformations and materials related to the thicknesses of the electrode pads 40c and 40d are substantially the same as those of the electrode pads 310 and 320 of the control device 300 of the first embodiment, the description thereof is omitted.

  In addition, the specific contents (respective members and their modifications) of the vibration device 200 of the present embodiment are substantially the same as those of the first embodiment, and thus description thereof is omitted.

2.3. Control Device In the present embodiment, the control device 300 is mounted in the recess 180 of the mounting substrate 100. The control device 300 is provided so that the surface opposite to the mounting surface 300 a faces the bottom surface of the recess 180. In other words, the control device 300 is accommodated in the recess 180 so that the mounting surface 300a on which the electrode pads 310 are formed faces the same direction as the mounting surface 100a of the mounting substrate 100. Since the mounting method and the like of the control device 300 are substantially the same as the mounting method of the vibrating device 200 of the first embodiment, description thereof is omitted. Further, the configuration of the control device 300 of the present embodiment is the same as that of the control device 300 of the first embodiment, and thus the description thereof is omitted.

  Also in this embodiment, since the control device 300 is electrically connected to the vibration device 200 by bump bonding, the distance of the electrical connection between the control device 300 and the vibration device 200 is small. Thereby, the stray capacitance when controlling the vibration device 200 can be reduced. In addition, when the control device 300 includes a temperature compensation circuit, the vibration device 200 is close to the control device 300, so that the temperature of the resonator element 30 can be grasped more accurately and temperature correction accuracy can be improved. it can.

2.4. Bumps The bumps 400 of the mounting substrate 9000 with the vibration device of the present embodiment are the same as those described in the section “1.4. Bump” of the first embodiment, and thus detailed description thereof is omitted. Further, the deformation of the bump 400 is substantially the same as that of the first embodiment, and the description thereof will be appropriately replaced with the vibration device 200 and the control device 300.

2.5. Various Modifications The mounting substrate with a vibration device 9000 of the present embodiment can be variously modified. At least the modifications of the first embodiment can be applied to the present embodiment alone or in combination of a plurality.

  As described above, in the mounting substrate with a vibration device according to the present embodiment, a part or all of the control device 300 is accommodated in the recess 180 of the mounting substrate 100. Therefore, it can have a sufficiently small thickness. Moreover, since the vibration device 200 and the control device 300 are disposed close to each other in the mounting substrate with the vibration device according to the present embodiment, the stray capacitance can be reduced.

  In particular, when the control device 300 according to the present embodiment includes an oscillation circuit that supplies a clock signal to an electronic component to be supplied mounted on the mounting substrate 100, a good clock signal is supplied by reducing stray capacitance. Can do.

  The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the present invention includes configurations that are substantially the same as the configurations described in the embodiments (for example, configurations that have the same functions, methods, and results, or configurations that have the same purposes and effects). In addition, the present invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that achieves the same effect as the configuration described in the embodiment or a configuration that can achieve the same object. Further, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

DESCRIPTION OF SYMBOLS 10 ... Case body, 10s ... Outer bottom face, 11, 11a ... Wiring, 12 ... Bottom material, 14 ... Wall material,
16 ... via hole, 18 ... cavity, 20 ... lid, 30 ... vibrating piece,
38 ... conductive adhesive layer, 40, 40a, 40b, 40c, 40d ... electrode pad,
DESCRIPTION OF SYMBOLS 100 ... Mounting board, 100a ... Mounting surface, 120 ... Internal conductive layer, 140 ... Plug,
160, 160a ... electrode pad, 180 ... recess, 200 ... vibration device,
220 ... Adhesive layer, 240 ... Mold layer, 300 ... Control device, 300a ... Mounting surface,
310, 310a, 310d, 320, 320a, 320d ... electrode pads,
400, 400a ... bump, 1000-9000 ... mounting board with vibration device

Claims (9)

A mounting substrate having a recess;
A vibration device and a control device mounted on the mounting substrate;
Have
The vibration device or the control device is mounted in the recess;
The mounting board with a vibration device, wherein the vibration device and the control device are connected to each other by a bump. In claim 1,
The mounting board with a vibration device, wherein the vibration device or the control device mounted in the recess has the same thickness as the recess. In claim 1 or claim 2,
A mounting substrate with a vibration device, wherein the vibration device is mounted in the recess. In claim 3,
The vibration device includes a case body, a lid body that seals the case body, and a vibrating piece provided in a cavity formed by the case body and the lid body,
The lid is a mounting substrate with a vibration device fixed to a bottom surface of the recess. In claim 4,
The mounting substrate has a conductive layer on the bottom surface of the recess,
The control device has a grounding terminal;
The mounting body with a vibration device, wherein the lid is electrically connected to the grounding terminal through the conductive layer. In claim 4,
The mounting substrate has a conductive layer on the bottom surface of the recess,
The vibration device has wiring for electrically connecting the vibrating piece and the lid, and an external connection terminal formed on the case body,
The control device has a first drive terminal and a second drive terminal,
The external connection terminal is electrically connected to the first drive terminal,
The mounting body with a vibration device, wherein the lid is electrically connected to the second driving terminal via the conductive layer. In any one of Claims 1 thru | or 6,
The mounting board is a multilayer wiring board, a mounting board with a vibration device. In any one of Claims 1 thru | or 7,
A mounting substrate with a vibration device, wherein the recess is molded. In any one of Claims 1 thru | or 8,
The control device has an oscillation circuit,
The oscillation circuit is electrically connected to a clock wiring formed on the mounting substrate,
The mounting board with a vibration device, wherein the clock wiring is electrically connected to an electronic component to be supplied mounted on the mounting board.

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