JP2010221365A - Suction head for electronic component transfer device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an attracting head for an electronic component transfer device, capable of reliably vacuum attracting an electronic component whose face is inclined to be attracted and thrusting the electronic component while uniforming pressure distribution. <P>SOLUTION: The suction head includes (a) a fixed part 12 to be fixed to the electronic component transfer device, (b) a front end part 20 held by the fixed part 12 and protruded from the fixed part 12, (c) a first member 30, and (d) a second member 40. The second member 40 has an attracting hole 48 formed in a front end face 42s protruded from the front end part 20 and the first member 30 to vacuum contact the electronic component. The second member 40 is rockingly supported on the first member 30 around a first axis 34 parallel to the front end face 42s. The first member 30 is rockingly supported on the fixed part 20 around a second axis 24 parallel to the front end face 42s of the second member 40 and across the first axis 34. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a suction head for an electronic component transfer device, and more particularly to a suction head for an electronic component transfer device that is mounted on an electronic component transfer device and vacuum-sucks the electronic component.

  Conventionally, an electronic component transfer device has been used to fix and remove electronic components. The electronic component transfer device is equipped with a suction head that vacuum-sucks the electronic component. The electronic component is transferred by moving the suction head while the electronic component is sucked by the suction head. A suction hole for vacuum suction is formed on the tip surface of the suction head on which the electronic component is sucked. Generally, the tip surface of the suction head is a flat surface.

  When the attracted surface of the electronic component is a convex curved surface, as shown in the enlarged sectional view of the main part of FIG. 5, the contact opening 12b of the tip 12k of the suction head in which the suction hole 12a is formed is It has been proposed to form a substantially arc shape in accordance with the shape of the attracted surface A of the electronic component P (see, for example, Patent Document 1).

JP 2002-283265 A

  When the electronic component fixed on the surface of the transport tape or the electronic component attached to the jig is sucked by the suction head, the transport tape surface itself or the jig itself may be inclined. In addition, when the electronic component is a module component having a metal cap or the like, the upper surface of the metal cap to be adsorbed may be inclined due to variations in the attachment of the metal cap.

  If the suction surface of the electronic component is tilted in this way, a gap is generated between the suction head and the suction surface, and the electronic component cannot be sufficiently sucked. Parts may fall. In addition, if the metal cap of the electronic component is attached at an inclination, the pressure distribution becomes uneven when the metal cap of the electronic component is pressed with the suction head to be attached to the measuring jig, and the electronic component terminal and A contact failure may occur between the terminals provided on the jig.

  In view of such circumstances, the present invention provides a suction head for an electronic component transfer device capable of reliably vacuum-sucking an electronic component even when the suction surface of the electronic component is inclined and pressing the electronic component so that the pressure distribution is uniform. Is to provide.

  In order to solve the above problems, the present invention provides a suction head for an electronic component transfer device configured as follows.

  The suction head for the electronic component transfer device is mounted on the electronic component transfer device and moves to vacuum-suck the electronic component. The suction head for an electronic component transfer device includes: (a) a fixed portion fixed to the electronic component transfer device; (b) a tip portion held by the fixed portion and protruding from the fixed portion; and (c) the tip. A first member that is swingably supported by the portion; and (d) a second member that is swingably supported by the first member. The second member has a tip surface that protrudes more than the tip portion and the first member, and a suction hole for vacuum-sucking electronic components is formed on the tip surface, and the second member is parallel to the tip surface. The first member is supported so as to be swingable about one axis. The first member is supported by the fixed portion so as to be swingable about a second axis that is parallel to the distal end surface of the second member and intersects the first axis.

  In the above configuration, the front end surface of the second member to which the electronic component is attracted is swingable about the first axis and swingable about the second axis. It can be tilted in any direction around the intersection where the axis intersects. Therefore, even if the attracted surface of the electronic component is inclined, the electronic component can be reliably attracted and the electronic component can be pressed so that the pressure distribution is uniform.

  Preferably, the distal end portion is held by the fixing portion so as to be movable in a direction in which the tip portion protrudes and protrudes from the fixing portion. An elastic member that elastically biases the tip portion in a direction in which the tip portion protrudes from the fixing portion is further provided inside the fixing portion.

  In this case, when the distal end surface of the second member is pressed against the electronic component, the distal end surface of the second member is retracted toward the fixed portion by the elastic force of the elastic member such as a spring or rubber. The tip surface of the second member can be pressed against the electronic component with an appropriate pressure. Moreover, since the impact when the front end surface of the second member contacts the electronic component is alleviated by the elastic member, the electronic component can be prevented from being damaged or broken.

  Preferably, the first axis and the second axis are orthogonal to each other.

  In this case, the front end surface of the second member can be inclined most smoothly in an arbitrary direction.

  Preferably, the first member and the second member are disposed outside the tip portion.

  In this case, since the area of the front end surface of the second member can be made larger than the area of the front end surface of the front end portion, an electronic component having a size larger than that when the electronic component is attracted to the front end surface of the front end portion It becomes possible to respond.

  Preferably, the front end surface of the second member is larger than a surface to be attracted of an electronic component that is vacuum-sucked to the front end surface of the second member.

  In this case, even if the attracted surface of the electronic component is inclined, it can be attracted in a state where the entire attracted surface of the electronic component is covered with the tip surface of the second member, and the tilt of the attracted surface of the electronic component can be reliably absorbed. Therefore, it is easy to reduce adsorption failure and uneven pressing.

  Preferably, the first member and the second member are cylindrical members arranged coaxially. The intersection of the first axis and the second axis is disposed on the central axis of the first member and the second member.

  In this case, the front end surface of the second member is configured to swing uniformly in any direction, and the suction force of the electronic component can be improved.

  The suction head for an electronic component transfer device according to the present invention can reliably vacuum-suck the electronic component even if the suction surface of the electronic component is inclined, and presses the electronic component so that the pressure distribution is uniform. Can do.

It is the (a) partial cross section schematic front view of a suction head, (b) sectional drawing. (Example) It is sectional drawing of a suction head. (Comparative example) It is explanatory drawing which shows operation | movement of a suction head. (Example) It is explanatory drawing which shows operation | movement of a suction head. (Comparative example) It is a principal part expanded sectional view of a suction head. (Conventional example)

  Hereinafter, embodiments of the present invention will be described with reference to FIGS.

  <Example> The suction head 10 for electronic component transfer apparatuses of the Example of this invention is demonstrated referring FIG.1 and FIG.3.

  FIG. 1A is a schematic front view of a partial cross section schematically illustrating a configuration of an adsorption head 10 for an electronic component transfer device according to an embodiment of the present invention. FIG.1 (b) is sectional drawing cut | disconnected along line AA of Fig.1 (a).

  As shown in FIGS. 1A and 1B, the suction head 10 has a fixed portion 12, a tip portion 20, a first member 30, and a second member 40 arranged coaxially.

  The fixing portion 12 has a substantially cylindrical space 13 and is fixed to an electronic component transport device (not shown). The distal end portion 20 is movably held in the substantially cylindrical space 13 of the fixed portion 12 at the proximal end 20 a side, and the distal end 20 b side protrudes from the fixed portion 12. In the substantially cylindrical space 13 of the fixed portion 12, a spring member 14 that urges the tip portion 20 in a direction in which the tip portion 20 protrudes from the fixed portion 12 is disposed, and the tip 20 b of the tip portion 20 extends from the fixed portion 12 to a predetermined position. It is designed to protrude.

  The first member 30 is a substantially cylindrical cap member having a cylindrical portion 31 and a bottom portion 32, and is disposed coaxially with a gap provided outside the fixed portion 12 and the distal end portion 20. The second member 40 is a substantially cylindrical cap member having a cylindrical portion 41 and a bottom portion 42, and is arranged coaxially with a gap provided outside the first member 30.

  As shown in FIG. 1B, in the first member 30, both ends of the first shaft 24 penetrating the distal end 20 b side of the distal end portion 20 are inserted into a pair of through holes 31 y formed in the cylindrical portion 31. The first end portion 20 is swingably supported via the first shaft 24. In the second member 40, a pair of second shafts 34 projecting from the cylindrical portion 31 of the first member 30 are inserted into a pair of through holes 41 x formed in the cylindrical portion 41, respectively. The first member 30 is supported so as to be capable of swinging.

  As shown in FIGS. 1A and 1B, the central axis Y of the first shaft 24 and the central axis X of the second shaft 34, the fixed portion 12, the tip portion 20, and the first member arranged coaxially. 30 and the center axis Z of the second member 40 intersect at one point O and are orthogonal to each other.

  As shown in FIG. 1A, a through hole 48 is formed in the bottom 42 of the second member 40, one end of a flexible tube 16 is connected to the through hole 48, and the other end of the tube 16 is a vacuum pump or the like. The vacuum suction means (not shown) is connected to be sucked from the through hole 48. Thereby, an electronic component can be adsorbed to the outer surface 42 s of the bottom 42 of the second member 40, that is, the distal end surface 42 s. The front end face 42s is perpendicular to the central axis Z, and the first axis 24 and the second axis 34 are parallel to the front end face 42s.

  The front end surface 42 s of the second member 40 on which the electronic component is attracted is swingable about the first shaft 24 and swingable about the second shaft 34. It can be inclined in any direction around the intersection O with the two axes 34. Therefore, even if the attracted surface of the electronic component is inclined, the electronic component can be reliably attracted to the tip surface 42s of the second member 40, and the pressure distribution is uniform on the tip surface 42s of the second member 40. It is possible to press the electronic component.

  Next, the operation of the suction head 10 for the electronic component transfer device will be described with reference to FIG. FIG. 3 is an explanatory diagram of the operation of the suction head 10 for the electronic component transfer device according to the embodiment.

  First, as shown in FIG. 3A, with the electronic component 6 placed in the jig 80, an electronic component transfer device (not shown) to which the fixing portion 12 of the suction head 10 is fixed is operated to perform suction. The head 10 is moved to above the electronic component 6 placed in the jig 80, and the outer surface 42 s of the bottom 42 of the second member 40 of the suction head 10, that is, the front end surface 42 s is opposed to the electronic component 6. . In the electronic component 6, the metal cap 4 is bonded to the substrate 2 so as to cover the substrate 2, and the tip surface 42 s of the suction head 10 faces the upper surface 5 of the metal cap 4. As described above, the first member 30 is supported by the distal end portion 20 so as to be swingable about the first shaft 24 as indicated by the arrow 25. As indicated by an arrow 35, the second member 40 is supported by the first member 30 so as to be swingable about the second shaft 34.

  Next, as shown in FIGS. 3B and 3C, the electronic component transfer device lowers the suction head 10 as indicated by arrows 11 b and 11 c, and the tip surface 42 s of the suction head 10 is moved to the electronic component 6. It is made to contact the upper surface 5.

  At this time, as shown in FIG. 3B, when the upper surface 5 of the metal cap 4 is bonded to the substrate 2 in a state where the metal cap 4 is inclined so that the right side in the drawing is lowered, the lowering of the suction head 10 is lowered. First, the front end surface 42 s comes into contact with the left side in the drawing of the upper surface 5 of the electronic component 6. When the suction head 10 is further lowered, the first member 30 and the second member 40 rotate in the clockwise direction around the first shaft 24, and eventually the tip surface 42 s of the suction head 10 and the entire upper surface 5 of the electronic component 6 are moved. Abut.

  After the tip surface 42s of the suction head 10 contacts the entire upper surface 5 of the electronic component 6, when the fixing portion 12 of the suction head 10 is further lowered by the electronic component transfer device, the pressure distribution on the upper surface 5 of the electronic component 6 is changed to an arrow. It becomes uniform as shown at 70.

  At this time, the distal end portion 20, the first member 30, and the second member 40 retreat toward the fixing portion 12 against the elasticity of the spring 14, so that the second member 40 can be moved with an appropriate pressure through the spring 14. The front end surface 42 s can be pressed against the upper surface 5 of the electronic component 6. Moreover, since the impact when the front end surface 42 s of the second member 40 contacts the upper surface 5 of the electronic component 6 is alleviated by the spring 14, damage or failure of the electronic component 6 can be prevented.

  On the other hand, as shown in FIG. 3C, when the metal cap 4 is inclined and joined to the substrate 4 so that the front side in the figure of the upper surface 5 of the metal cap 4 is lowered, the tip of the lowering suction head 10 is lowered. First, the surface 42s contacts the back side in the drawing of the upper surface 5 of the electronic component 6, and when the suction head 10 is further lowered, the front side 42s of the suction head 10 is lowered so that the front side of the front surface 42s is lowered. The member 40 rotates around the second shaft 34, and eventually the tip surface 42 s of the second member 40 comes into contact with the entire upper surface 5 of the electronic component 6.

  When the fixing portion 12 of the suction head 10 is further lowered by the electronic component transfer device, the front end surface 42 s of the second member 40 presses the upper surface 5 of the electronic component 6 as indicated by an arrow 72.

  At this time, the distal end portion 20, the first member 30 and the second member 40 retreat toward the fixing portion 12 against the elasticity of the spring 14, so that the second member 40 can be moved with an appropriate pressure via the spring 16. The front end surface 42 s can be pressed against the upper surface 5 of the electronic component 6. Moreover, since the impact when the front end surface 42 s of the second member 40 contacts the upper surface 5 of the electronic component 6 is alleviated by the spring 14, damage or failure of the electronic component 6 can be prevented.

  When the upper surface 5 of the electronic component 6 is tilted in directions other than those shown in FIGS. 3B and 3C, the second operation is performed by combining the operation in FIG. 3B and the operation in FIG. The front end surface 42s of the member 40 contacts the entire upper surface 5 of the electronic component 6 so that the pressure distribution is uniform.

  As shown in FIG. 3, when the tip surface 42 s of the second member 40 is larger than the top surface 5 of the electronic component 6 attracted to the tip surface 42 s of the second member 40, the top surface 5 of the electronic component 6 is inclined. Even in this case, the electronic component 6 can be adsorbed in a state where the entire upper surface 5 of the electronic component 6 is covered with the tip surface 42s of the second member 40, and the inclination of the upper surface 5 of the electronic component 6 can be reliably absorbed. It is easy to reduce uneven pressing.

  3B and 3C, even when the upper surface 5 of the electronic component 6 is inclined, the tip surface 42s of the second member 40 is in contact with the entire upper surface 5 of the electronic component 6, When the electronic component 6 is sucked by vacuum suction from the suction hole 48, the electronic component 6 can be reliably sucked, so that a suction failure does not occur and the electronic component does not fall during transportation.

  <Comparative example> Next, the suction head 10x for electronic component transfer apparatuses of a comparative example is demonstrated, referring FIG.2 and FIG.4.

  FIG. 2 is a partial front view schematically showing a configuration of a suction head 10x for an electronic component transfer device of a comparative example.

  As shown in FIG. 2, the suction head 10 x of the comparative example includes a fixed portion 12, a tip portion 20, a spring 14, and a tube 16 as in the embodiment. However, unlike the embodiment, the first member 30 and the second member 40 are not provided.

  A through hole 28 is formed in the bottom portion 22 of the distal end portion 20, and one end of the flexible tube 16 is connected to the through hole 28. Thereby, an electronic component can be adsorbed to the outer surface 22s of the bottom portion 22 of the distal end portion 20, that is, the distal end surface 22s.

  Next, the operation of the suction head 10x of the comparative example will be described with reference to FIG. FIG. 4 is an explanatory diagram of the operation of the suction head 10x of the comparative example.

  As shown in FIG. 4A, the electronic component transfer device (not shown) to which the fixing portion 12 of the suction head 10 x is fixed moves the suction head 10 x to above the electronic component 6 attached to the jig 80. The outer surface 22 s of the bottom portion 22 of the distal end portion 20, that is, the distal end surface 22 s is opposed to the electronic component 6. In the electronic component 6, the metal cap 4 is bonded to the substrate 2 so as to cover the substrate 2, and the front end surface 22 s of the suction head 10 faces the upper surface 5 of the metal cap 4.

  Next, as shown in FIGS. 4B and 4C, the electronic component transfer device lowers the suction head 10 as indicated by arrows 11 s and 11 t, and the tip surface 22 s of the suction head 10 is moved to the electronic component 6. It is made to contact the upper surface 5.

  At this time, as shown in FIG. 4B, when the upper surface 5 of the metal cap 4 of the electronic component 6 is joined to the substrate 2 with the metal cap 4 tilted so that the left side is higher in the drawing, the lowering is performed. First, the front end surface 22s of the suction head 10x contacts the left side of the upper surface 5 of the electronic component 6 in the figure. When the suction head 10x is further lowered, the left side in the drawing of the electronic component 6 is pushed down, the electronic component 6 rotates counterclockwise in the drawing, and the tip surface 42s of the suction head 10x eventually comes into contact with the entire top surface 5 of the electronic component 6. . At this time, as indicated by an arrow 74, the left side of the electronic component 6 is pushed down relatively strongly, and the right side is pushed down relatively weakly, resulting in uneven pressure distribution.

  Even if the metal cap 4 of the electronic component 6 is joined to the substrate 2 without being inclined, as shown in FIG. 4C, when the jig 80 itself to which the electronic component 6 is attached is inclined, When the top surface 5 of the electronic component 6 is pressed by the tip surface 42 s of the second member 40, the pressure distribution becomes non-uniform as indicated by an arrow 76.

  As shown in FIGS. 4B and 4C, when the pressure distribution becomes non-uniform, between the terminal (not shown) of the electronic component 6 and the terminal (not shown) provided on the jig 80 at a place where the pressure is weak. As a result, the electronic component 6 cannot be measured or the measurement error becomes large.

  On the other hand, since the suction head 10 of the embodiment can press the electronic component 6 so that the pressure distribution is uniform, contact failure between terminals can be prevented and the electronic component can be accurately measured. .

  Further, as shown in FIGS. 4B and 4C, when the upper surface 5 of the electronic component 6 is inclined and a gap is generated between the distal end surface 22s of the distal end portion 20 and the upper surface 5 of the electronic component 6, suction holes are formed. Even if vacuum suction is performed from 28, the electronic component 6 cannot be sufficiently adsorbed, resulting in poor adsorption or the electronic component falling during transportation.

  On the other hand, in the suction head 10 of the embodiment, the front end surface 42 s of the second member 40 is inclined according to the inclination of the upper surface 5 of the electronic component 6, and the front end surface 42 s of the second member 40 and the upper surface 5 of the electronic component 6. Therefore, the electronic component 6 can be reliably adsorbed, and the adsorbing failure does not occur and the electronic component does not fall during transportation.

  <Summary> As described above, by configuring the tip surface of the second member to be freely tiltable in an arbitrary direction, the electronic component can be reliably secured even when the attracted surface of the electronic component is tilted. The electronic component can be pressed so that the pressure distribution is uniform.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

  For example, a configuration in which a spring member that urges the tip portion is not provided is also possible. A configuration in which the first axis and the second axis are not orthogonal to each other is also possible.

  The inside / outside relationship between the tip portion, the first member, and the second member is arbitrary. For example, the first member is arranged inside the second member, and the tip portion is arranged inside the first member. Or the front-end | tip part may be arrange | positioned inside a 2nd member, and the structure by which a 1st member is arrange | positioned inside a front-end | tip part may be sufficient. It is also possible to adopt a configuration in which the tip portion and the first member and the second member are not arranged coaxially.

  The first member and the second member are not limited to a substantially cylindrical cap member, but may be any shape that is supported in a swingable manner. Moreover, the front end surface of the second member that sucks the electronic component may be the same size as the attracted surface of the electronic component or may be smaller than the attracted surface of the electronic component.

5 Adsorbed surface 6 Electronic component 10, 10x Adsorption head for electronic component transfer device 12 Fixing portion 14 Spring (elastic member)
16 pipe 20 tip portion 22s tip surface 24 first shaft 28 suction hole 30 first member 34 second shaft 40 second member 42s tip surface 48 suction hole

Claims (6)

A suction head for an electronic component transfer device that is mounted on an electronic component transfer device and moves to vacuum-suck the electronic component,
A fixing portion fixed to the electronic component transfer device;
A tip portion held by the fixing portion and protruding from the fixing portion;
A first member swingably supported by the tip portion;
A second member swingably supported by the first member;
With
The second member has a tip surface that protrudes more than the tip portion and the first member, and a suction hole for vacuum-sucking electronic components is formed on the tip surface, and the second member is parallel to the tip surface. Supported by the first member so as to be swingable about one axis;
The first component is supported by the fixed portion so as to be swingable about a second axis that is parallel to the distal end surface of the second member and intersects the first axis. Vacuum head for equipment. The distal end portion is held by the fixed portion so as to be movable in a direction in which the tip portion appears and disappears.
The electronic component according to claim 1, further comprising an elastic member that elastically biases the tip portion in a direction in which the tip portion protrudes from the fixing portion. Adsorption head for transfer device.   The suction head for an electronic component transfer device according to claim 1, wherein the first axis and the second axis are orthogonal to each other.   The suction head for an electronic component transfer device according to any one of claims 1 to 3, wherein the first member and the second member are disposed outside the tip portion.   The said front end surface of the said 2nd member is larger than the to-be-adsorbed surface of the electronic component vacuum-sucked by the said front end surface of the said 2nd member, The any one of Claim 1 thru | or 4 characterized by the above-mentioned. Suction head for electronic component transfer device. The first member and the second member are cylindrical members arranged coaxially,
6. The intersection point between the first axis and the second axis is disposed on a central axis of the first member and the second member, according to any one of claims 1 to 5. Suction head for electronic component transfer device.

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