JP2010221174A - Method of forming surface protective film of surface-mounted electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of forming a surface protective film, which occupies a small space, has few production man-hours and excellent mass productivity, the method sticking powder coating to all except for a terminal surface for mounting by forming the surface protective film by the powder coating on a plurality of surface-mounted electronic components and therefore dispensing with a cutting process. <P>SOLUTION: When forming the surface protective film by the powder coating on the surface-mounted electronic components, by arranging the plurality of surface-mounted electronic components while the terminal surfaces for mounting of the surface-mounted electronic components is abutted on a support member, the powder coating is stuck to all except for the terminal surface for mounting of the surface-mounted electronic components by a coating apparatus, and the powder coating stuck to the surface-mounted electronic component is fixed by heating. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for forming a surface protective film in which a powder coating material is adhered to all surfaces other than a mounting terminal surface of a surface-mounted electronic component by a coating apparatus.

Conventionally, a surface protective film has been formed for the purpose of insulating and shielding light from a surface-mounted electronic component and preventing fragments from being dropped due to cutting. FIG. 4 is a conceptual diagram illustrating a conventional method for forming a surface protective film in which a surface-mounted electronic component is molded by resin and cut into pieces.
In order to form a protective film on a surface other than the mounting terminal surfaces of a plurality of surface-mounted electronic components in a state where the mounting terminal surfaces of the surface-mounted electronic components are in contact with the support member, it is generally cut into pieces. The surface mounted electronic component 1 is expanded or arranged on a support member 4 such as a dicing sheet, the surface mounted electronic component 1 is covered with a mold or a metal mask, and then a surface protective film is formed by a resin molding or printing method. 3 is then cut along the cutting portion 8 using a blade dicer or the like, and singulated again.

  Further, as shown in Patent Document 1 and Patent Document 2, it is also known to use powder coating as a means for forming a surface protective film of an electronic component.

  Patent Document 1 describes a method of manufacturing a piezoelectric component covered with a second exterior body made of a powder paint. FIG. 5 is a sectional view of a conventional piezoelectric component having a lead wire, and FIG. 6 is a diagram for explaining a conventional powder coating method.

Here, a process of forming the second exterior body 14 on the piezoelectric component 10 will be described.
As shown in FIG. 6, the piezoelectric component 10 having the lead conductors 11 is preheated with a heater 12, subsequently immersed in a fluidized powder coating 13, and the powder coating is attached around the piezoelectric component 10 and then lifted. Preheat with heater 12. After repeating this process about 2 to 3 times, the powder coating material is cured, and a piezoelectric component complete body 9 having the second exterior body 14 as shown in FIG. 5 is obtained.

Patent Document 2 describes a method of applying a powder coating material to a leadless chip type component. FIG. 7 is a cross-sectional view for explaining a conventional powder coating method for chip-type components.
The chip-type component 15 is inserted between the two tapes 17 and the chip-type component is preheated, and then the powder coating material is fused to perform powder coating only on a desired portion.

  Patent Document 3 describes a method for forming a coating film using a powder coating material.

JP-A-6-188670 JP-A-10-137671 JP 2000-153222 A

  When a surface protective film is formed by a resin molding and printing method using, for example, a dicing sheet as a support member for an electronic component, the apparatus cost for forming the protective film is high, and the space occupied by the apparatus is widened. In addition, in order to form a surface protection film, a dedicated mold is required for resin molding, and a dedicated metal mask is required for printing. Production costs are incurred and manufacturing costs are high.

  Furthermore, in order to obtain a finished product after forming the surface protective film, it is necessary to divide into pieces by cutting, so that a cutting device and a cutting process are required.

  In addition, the method for forming a protective film by immersion as shown in Patent Document 1 is not suitable for mass production because the protective film is individually formed on the electronic component, and the manufacturing cost is high.

  In the protective film forming method as shown in Patent Document 2, the chip-type component is mounted and fixed between two tapes before the surface protective film is formed, or the chip-type component is inserted between the two tapes after the surface protective film is formed. As the electronic component becomes smaller, the difficulty of the operation increases.

  The present invention has been made to solve such problems, and is an easy manufacturing method and mass productivity for forming a surface protective film by powder coating on all surfaces other than the mounting terminal surface of the surface mounting type electronic component. An object of the present invention is to provide a method for forming a surface protective film excellent in the above.

  The present invention provides a plurality of surface-mounted electronic components in a state where a mounting terminal surface of the surface-mounted electronic component is in contact with a support member when forming a surface protective film on the surface-mounted electronic component by powder coating. The powder coating material is attached to all surfaces other than the mounting terminal surface of the surface-mounted electronic component by a coating apparatus, and the powder coating material attached to the surface-mounted electronic component is fixed by heating.

  The support member is a heat-resistant sheet and is a method for forming a surface protection film of a surface-mount type electronic component made of a tape material that has poor adhesion to the powder paint.

  The support member is a heat-resistant sheet and is a method for forming a surface protective film of a surface-mount type electronic component made of a magnetic material.

  The powder coating is a film forming method for surface protection of a surface mount electronic component which is a powder coating capable of electrostatic coating.

  The powder coating material other than the powder coating material adhering to the surface mount electronic component is a method for forming a surface protective film of the surface mount electronic component to be collected.

  The surface-mounted electronic component is a surface-mounted electronic component obtained by cutting and dividing a mother board having a plurality of product regions, and the support member is a dicing sheet in a cutting process, and the mother board is cut. After that, the dicing sheet is expanded, and the surface protection film forming method of the surface mount electronic component in which powder coating is performed in a state where the interval between the plurality of the surface mount electronic components is widened.

  The surface-mounted electronic component is a surface-mounted electronic component obtained by cutting and dividing a mother board having a plurality of product regions, and after cutting the mother board, in the transfer device, the support member, A method for forming a surface protection of a surface-mounted electronic component in which a plurality of the surface-mounted electronic components are arranged at predetermined intervals and powder coating is performed.

  The present invention does not require an expensive apparatus for use in resin molding or printing methods, occupies less space for the apparatus, and can reduce manufacturing costs even when electronic components are changed.

Since the surface protective film can be fixed after collecting the excess surface protective film material,
A cutting step after the formation of the surface protective film by the resin molding or printing method becomes unnecessary.

According to the present invention, it is possible to provide an easy manufacturing method for forming a surface protective film by powder coating on all surfaces other than a mounting terminal surface of a surface-mounted electronic component, and a method for forming a surface protective film excellent in mass productivity.

FIG. 1 is a cross-sectional view of a surface-mounted electronic component, where (a) is before the surface protective film is formed, and (b) is after the surface protective film is formed. It is a figure explaining the powder coating-material application | coating process in a present Example. It is a figure explaining the state which collect | recovered powder coating materials other than the surface protective film formed in the surface mount-type electronic component in a present Example. It is a conceptual diagram explaining the surface protection film formation method of resin-molding the conventional surface mount type electronic component, and cutting into pieces by cutting. It is sectional drawing of the piezoelectric component which has the conventional lead wire. It is a figure explaining the conventional powder coating method. It is sectional drawing explaining the powder coating method to the conventional chip type | mold component.

  The present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view of a surface-mount type electronic component according to the present invention, where (a) is before the surface protective film is formed and (b) is after the surface protective film is formed. FIG. 2 is a diagram for explaining the powder coating application process in the present embodiment. FIG. 3 is a diagram for explaining a state in which the powder coating material other than the surface protective film formed on the surface mount electronic component in the present embodiment is collected.

  Here, the surface-mount type electronic component according to the present invention is formed on a mother board having a plurality of product areas, as in the case of a conventional piezoelectric component. In a state where the mounting terminal surface 2 is crimped and fixed to a dicing sheet that is the support member 4, the mother board is cut into each product region to be singulated.

After dividing into individual pieces, the dicing sheet is expanded, and a plurality of surface-mounted electronic components 1 are powder-coated as shown in FIG.
It is also possible to carry out powder coating by transferring the separated surface-mounted electronic component 1 from a dicing sheet, placing it on the support member 4 at a predetermined interval, and pressing and fixing it.

  As a coating method of the powder coating, an electrostatic coating method is applied in which a high voltage of several tens of kilovolts is applied to the powder coating by the electrostatic coating apparatus 5 to charge static electricity and apply to the grounded component by electrostatic force.

  The mounting terminal surface 2 is shielded by being in close contact with the support member 4, and a surface protective film 3 is formed on the entire surface other than the mounting terminal surface 2 as shown in FIG. I can do it.

  As shown in FIG. 3, the surface coating film 3 other than the powder coating material 6 attached to the surface mount electronic component 1 is collected, and the powder coating material 6 attached to the surface mount electronic component 1 is fixed by heating to form the surface protective film 3. To do. At this time, the surface protective film 3 is not formed on the mounting terminal surface 2 fixed to the support member 4.

  Thereafter, the surface-mounted electronic component 7 having the surface protective film 3 formed thereon is completed without being separated into pieces by conventional cutting.

  The material of the support member sheet is not particularly limited as long as it retains the strength for firmly pressing and fixing the surface-mounted electronic component. However, the powder coating is a polyimide sheet or a sheet coated with Teflon (registered trademark). Is somewhat expensive, but is preferable in terms of heat resistance.

  The material of the powder coating is not particularly limited with respect to the object of the present invention, but in order to form a surface protective film on the electronic component, the epoxy resin-based powder coating imparts adhesion, insulation and light shielding properties. From the point of view, it is preferable. The particle size of the powder coating wraps around the gap between the sheet and the mounting terminal surface of the surface-mounted electronic component, and in order to form a uniform protective film shape, the appropriate consistency with the surface-mounted electronic component shape and size is required. It is necessary to measure.

DESCRIPTION OF SYMBOLS 1 Surface mount type electronic component 2 Terminal surface for mounting 3 Surface protective film 4 Support member 5 Electrostatic coating apparatus 6 Powder coating material 7 Surface mount type electronic component in which surface protective film was formed 8 Cutting part 9 The 2nd exterior body was provided Completed piezoelectric component 10 Piezoelectric component 11 Lead conductor 12 Heater 13 Fluid powder coating 14 Second exterior body 15 Leadless chip-shaped component 16 Powder coating 17 Tape

Claims (7)

When forming a surface protective film by powder coating on surface mount electronic components,
A plurality of the surface mount electronic components are arranged in a state where the mounting terminal surface of the surface mount electronic component is in contact with a support member,
A powder coating is applied to all surfaces other than the mounting terminal surface of the surface mount electronic component by a coating device,
A method for forming a surface protective film for a surface mount electronic component, wherein the powder coating material adhered to the surface mount electronic component is fixed by heating. The support member is
2. The method for forming a surface protection film for a surface-mount electronic component according to claim 1, wherein the surface protection film is made of a tape material that is a heat-resistant sheet and has poor adhesion to the powder paint. The support member is
2. The method for forming a surface protective film for a surface mount electronic component according to claim 1, wherein the surface protective film is made of a heat-resistant sheet and a magnetic material. The powder coating is
The method for forming a surface protective film for a surface-mount type electronic component according to any one of claims 1 to 3, wherein the method is a powder paint capable of electrostatic coating.   5. The surface protective film forming method for a surface mount electronic component according to claim 1, wherein a powder paint other than the powder paint attached to the surface mount electronic component is collected. . The surface mount electronic component is:
It is a surface-mount electronic component obtained by cutting and dividing a mother board having a plurality of product areas,
The support member is
It is a dicing sheet in the cutting process,
6. The powder coating is performed in a state where the dicing sheet is expanded after the mother substrate is cut and a space between the plurality of surface mount electronic components is widened. 6. A method for forming a surface protective film for a surface-mount type electronic component according to claim 1. The surface mount electronic component is:
It is a surface-mount electronic component obtained by cutting and dividing a mother board having a plurality of product areas,
6. The method according to claim 1, wherein after the mother substrate is cut, a plurality of surface-mount type electronic components are arranged at predetermined intervals on the support member by a transfer device, and powder coating is performed. The surface protection formation method of the surface mount electronic component as described in any one.

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