JP2010214302A - Exhaust gas treatment apparatus and exhaust gas treatment method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an exhaust gas treatment apparatus and an exhaust gas treatment method, for effectively utilizing heat that an exhaust gas has. <P>SOLUTION: The exhaust gas treatment apparatus 10a includes a first treatment tank 11 filled with a first treating agent 51 for treating a gas to be treated, and a second treatment tank 21 which is the treatment tank in a double pipe structure, wherein a first space "a" is formed by an inner cylinder 22 disposed on the inner side and an outer cylinder 23 disposed on the outer side, a second space b is formed on the inner side of the inner cylinder 22, the inner cylinder 22 configures a heat exchanger for exchanging heat between the first space "a" and the second space "b", and a second treating agent 52 different from the first treating agent 51 is filled in one of the first space "a" and the second space "b". Further, first piping 42 for sending the exhaust gas which has passed through the other of the first space "a" and the second space "b" to the first treatment tank 11 is provided. Also, the first treatment tank 11 has an exhaust gas discharge port 12, and the exhaust gas discharge port 12 is connected to the space filled with the second treating agent 52 so as to be communicated with the space. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an exhaust gas treatment apparatus and an exhaust gas treatment method that effectively use the heat of exhaust gas.

In an etching process for manufacturing a semiconductor, a liquid crystal panel, or the like, HBr gas or Cl ₂ gas is often used as an etching gas. Further, NF ₃ gas is often used as a cleaning gas for the chamber in the manufacturing apparatus after the etching process. In addition, CO may be generated as a by-product in the manufacturing process.

  A part of the gas used in the above process remains in the gas (exhaust gas) discharged from the manufacturing process of semiconductors, liquid crystal panels, etc., and may contain CO. Since these gases are harmful to the human body, the exhaust gas cannot be discarded as it is. For this reason, the exhaust gas is taken out from the semiconductor manufacturing apparatus or the like by a vacuum pump, and the exhaust gas is discarded after these gases are removed from the exhaust gas by an exhaust gas treatment device installed downstream of the vacuum pump. As one of the methods for removing these gases, there is a method in which a solid treatment agent is filled in a treatment tank of an exhaust gas treatment apparatus, exhaust gas is passed through the treatment tank, and these gases and the solid treatment agent are brought into contact with each other. .

For example, as shown in FIG. 4, the exhaust gas discharged from the semiconductor manufacturing apparatus 90 is sucked by the vacuum pump 131 disposed outside the casing 160 of the exhaust gas processing apparatus 110, and first the first processing of the exhaust gas processing apparatus 110 is performed. It is sent to the cylinder 111. The first processing cylinder 111 is filled with synthetic zeolite or the like as a solid processing agent, and HBr and Cl ₂ contained in the exhaust gas are removed by physical adsorption or chemical adsorption to the solid processing agent. In a high temperature state exceeding 100 ° C., the possibility that the physically adsorbed gas is desorbed from the processing agent is increased, and therefore the adsorption is performed at room temperature.
Next, the exhaust gas from which HBr and Cl ₂ have been removed in the first processing cylinder 111 is sent to the second processing cylinder 121. The second treatment cylinder 121 is filled with a metal oxide as a solid treatment agent and is removed by oxidizing CO contained in the exhaust gas. Since removal of CO is difficult at room temperature, the second processing cylinder 121 includes a heater 124, the inside of the second processing cylinder 121 is heated to 60 ° C. or more, and the heated solid processing agent and CO are brought into contact with each other. Let Further, when NF ₃ is contained in the exhaust gas, the inside of the second processing cylinder 121 needs to be further heated. For example, Patent Document 1 describes a method of excluding NF ₃ at 250 ° C. or higher. In addition, the solid processing agent (for example, oxides of transition metals such as manganese, iron, and copper) used for removing CO and NF ₃ is poisoned when the acidic gas is passed, and the processing performance is lowered. Therefore, when removing CO or NF ₃ , it is necessary to remove in advance the acidic gas (HBr, Cl _2, etc.) contained in the exhaust gas.

Japanese Patent Publication No. 5-39649

Removal of harmful gases as described above is performed in the order of removing acidic gases such as HBr and Cl _{2 at} room temperature, and then removing CO and NF ₃ with a heated solid processing agent. However, the exhaust gas discharged from the normal vacuum pump 131 (see FIG. 4) is 100 ° C. or higher due to compression heat or the like. The exhaust gas at 100 ° C. or higher is radiated while passing through a pipe disposed between the vacuum pump 131 and the first processing cylinder 111 of the exhaust gas processing apparatus 110, and after the heat is lost to about room temperature, the first processing cylinder 111 is discharged. Flows in. The exhaust gas from which the acid gas has been removed at room temperature is then heated by the heater 124 in the second processing cylinder 121 in order to remove CO and NF ₃ . In this way, the heat of the exhaust gas discharged from the vacuum pump is released without being effectively used, and the exhaust gas that has reached room temperature is heated again when CO or NF ₃ is removed.
Accordingly, an object of the present invention is to provide an exhaust gas treatment apparatus and an exhaust gas treatment method that effectively use the heat of exhaust gas for the treatment of the gas to be treated contained in the exhaust gas.

In order to solve the above-described problem, an exhaust gas treatment apparatus according to the first aspect of the present invention is an exhaust gas for treating a gas to be treated contained in exhaust gas by passing the exhaust gas through a treating agent, for example, as shown in FIG. A processing apparatus, which is a first processing tank 11 filled with a first processing agent 51 that passes exhaust gas and processes a gas to be processed, and a processing tank having a double pipe structure, and is disposed inside. A first space a is formed by the inner cylinder 22 and the outer cylinder 23 disposed on the outer side, a second space b is formed on the inner side of the inner cylinder 22, and the inner cylinder 22 has the first space a and the second space b. A heat exchanger that exchanges heat with the first space a is configured, and one of the first space a and the second space b is filled with a second processing agent 52 that is different from the first processing agent 51. The second treatment tank 21 and the pipe through which the exhaust gas passes, and the other of the first space a and the second space b The first treatment tank 11 has an exhaust gas outlet 12, and the exhaust gas outlet 12 is filled with a second treatment agent 52. It is connected to the space so as to communicate with the space.
The “gas to be treated” is a gas contained in the exhaust gas, which is a gas to be treated of the treatment agent filled in the treatment tank of the exhaust gas treatment apparatus.

  If comprised in this way, the temperature of waste gas is higher than the processing temperature of a 1st processing tank, the processing temperature of a 2nd processing tank is higher than the processing temperature of a 1st processing tank, When the processing in the processing tank and the processing in the second processing tank have to be performed in this order, the second processing tank can be heated with the heat of the exhaust gas, so the inside of the second processing tank is heated. After that, the exhaust gas can be passed through the first treatment tank and the second treatment tank in this order, and the heat of the exhaust gas can be used effectively.

  In the exhaust gas treatment apparatus according to the second aspect of the present invention, in the first aspect of the present invention, the first pipe 42 is a pipe having a higher heat dissipation effect than a bare pipe.

  If comprised in this way, when the processing temperature of a 1st processing tank is lower than the processing temperature of a 2nd processing tank, the heat | fever which the waste gas which passed the 2nd processing tank has will have a higher heat dissipation effect. Since it passes through, it is easy to dissipate heat, and the temperature of the exhaust gas can be easily adjusted to a temperature suitable for the treatment temperature in the first treatment tank.

  The exhaust gas treatment apparatus according to the third aspect of the present invention is, for example, as shown in FIG. 2, in the first or second aspect of the present invention, the inner cylinder 22 is disposed on the outer periphery of the inner cylinder 22. The outer cylinder 23 has a donut plate-like fin 27 having an inner circumference of the outer cylinder 23 as an outer circle on the inner circumference of the outer cylinder 23. Have.

  If comprised in this way, the inner cylinder 22 which comprises a heat exchanger will become easier to convey heat with the fin 26. FIG. Further, the exhaust gas passing through the first space a and the second treatment agent can be brought into uniform contact by the fins 26 and the fins 27.

  As shown in FIG. 1, for example, the exhaust gas treatment apparatus according to the fourth aspect of the present invention includes a gas transfer device 31 that transfers exhaust gas, and the gas transfer device 31 is housed in a casing 60 of the exhaust gas treatment device 10a. ing. The gas transfer machine 31 is typically a centrifugal blower, but may be a reciprocating pump or the like when the flow rate is small.

  If comprised in this way, since the gas transfer machine and the processing tank are arrange | positioned in the housing | casing of an exhaust gas processing apparatus, compared with the case where a gas transfer machine is provided in the exterior of an exhaust gas processing apparatus, from a gas transfer machine to a processing tank The exhaust gas transfer distance can be shortened. Therefore, when the heat of the exhaust gas discharged from the gas transfer machine is lost due to heat dissipation while being transferred from the gas transfer machine to the treatment tank, the amount of heat lost can be further reduced.

  An exhaust gas treatment method according to a fifth aspect of the present invention is an exhaust gas treatment method for treating a gas to be treated contained in exhaust gas by passing the exhaust gas through the treatment agent, wherein the exhaust gas removes the second treatment agent. A step of heating to a second temperature, and a gas to be treated contained in the exhaust gas at a first temperature lower than the second temperature and a first treatment agent different from the second treatment agent A step of treating, and a step of treating a gas to be treated contained in the exhaust gas with the second treatment agent heated by the exhaust gas.

  If comprised in this way, after heating a 2nd processing agent with the heat | fever which waste gas has, it becomes the method of processing using the to-be-processed gas contained in waste gas in order of a 1st processing agent and a 2nd processing agent. . Therefore, even when the temperature of the exhaust gas is higher than the treatment temperature with the first treatment agent and the treatment temperature with the second treatment agent is higher than the treatment temperature with the first treatment agent, It becomes a method which can utilize the heat which has effectively.

  In the exhaust gas treatment apparatus of the present invention, when the gas to be treated contained in the exhaust gas is treated in the order of the first treatment tank and the second treatment tank, the temperature of the exhaust gas before flowing into the first treatment tank is the first. Even when the processing temperature in the second processing tank is higher than the processing temperature in the first processing tank, and even if the processing temperature in the second processing tank is higher than the processing temperature in the first processing tank, the heat of the exhaust gas is used. The second treatment tank can be heated, and the heat of the exhaust gas can be used effectively.

FIG. 1 is a configuration diagram (schematic cross-sectional view) of an exhaust gas treatment apparatus 10a according to a first embodiment of the present invention. FIG. 2 is a diagram illustrating fins included in the second processing cylinder. FIG. 3 is a configuration diagram (schematic cross-sectional view) of an exhaust gas treatment apparatus 10b according to the second embodiment of the present invention. FIG. 4 is a diagram (schematic cross-sectional view) illustrating a conventional exhaust gas treatment apparatus.

  Embodiments of the present invention will be described below with reference to the drawings. In the drawings, the same or corresponding members are denoted by the same or similar reference numerals, and redundant description is omitted. Further, the present invention is not limited to the following embodiments.

  The exhaust gas treatment apparatus of the present invention achieves the object of effectively using the heat of the exhaust gas for the treatment of the gas to be treated contained in the exhaust gas with the following configuration of the exhaust gas treatment apparatus.

  FIG. 1 is a configuration diagram (schematic longitudinal sectional view) of an exhaust gas treatment apparatus 10a according to a first embodiment of the present invention. The configuration of the exhaust gas treatment apparatus 10a will be described with reference to FIG. In addition, the broken line in FIG. 1 has shown the housing | casing 60 of the waste gas processing apparatus 10a. As shown in FIG. 1, the exhaust gas treatment apparatus 10 a includes a first treatment cylinder 11 as a cylindrical first treatment tank that is filled with a first treatment agent 51 and allows exhaust gas to pass through. Furthermore, a second processing cylinder 21 as a second processing tank that constitutes a double pipe structure with a cylindrical inner cylinder 22 and a cylindrical outer cylinder 23 arranged so as to surround the inner cylinder 22 is provided. Prepare. As described above, in the second processing cylinder 21, the first space a sandwiched between the inner cylinder 22 and the outer cylinder 23 is formed on the outer periphery of the inner cylinder 22, and the second space is formed inside the inner cylinder 22. b is formed. The first processing cylinder 11 and the inner cylinder 22 and the outer cylinder 23 of the second processing cylinder are formed in a cylindrical shape. Forming in a cylindrical shape is preferable because it is easy to manufacture, makes it possible to uniformly contact the exhaust gas and the treatment agent, and is excellent in pressure resistance. However, it does not necessarily have to be cylindrical. Further, a heat insulating material (not shown) for suppressing heat radiation from the outer surface of the outer cylinder 23 may be wound around the outer cylinder 23. Further, the second processing cylinder 21 has a heater 24 for adjusting the temperature in the second processing cylinder 21 on the outer periphery of the outer cylinder 23. The inner cylinder 22 functions as a heat exchanger for exchanging heat between the first space a and the second space b. Moreover, it is preferable to manufacture the inner cylinder 22 with the stainless steel excellent in corrosion resistance.

Further, as shown in FIG. 2, the inner cylinder 22 of the second processing cylinder 21 has a plurality of donut plate-like fins 26 with the outer periphery of the inner cylinder 22 as an inner circle so as to surround the outer periphery thereof. . Therefore, the heat in the second space b is transmitted to the fins 26 of the inner cylinder 22 so that the heat can be easily transmitted to the second processing agent 52 filled in the first space a. Further, the outer cylinder 23 has a donut plate-like fin 27 along the inner periphery of the outer cylinder 23 and having the inner periphery of the outer cylinder 23 as an outer circle. The fins 26 and the fins 27 allow the exhaust gas to pass while staying when passing through the first space a. Furthermore, by having the fins 27, the heat of the heater 24 when the heater 24 is used can be easily transmitted to the second treatment agent 52 filled in the first space a. In FIG. 2, the fins 26 are installed perpendicular to the outer surface of the inner cylinder 22, and the fins 27 are installed perpendicular to the inner surface of the outer cylinder 23, but are not necessarily perpendicular. Any angle that can improve the heat transfer effect and any angle that can retain the exhaust gas may be used. Similarly, the fin 26 and the fin 27 do not necessarily have a donut plate shape because heat is easily transmitted to the second treatment agent 52 and the exhaust gas can be retained.
In the exhaust gas treatment apparatus 10a according to the first embodiment, the second treatment agent 52 is filled in the first space a.

Further, as shown in FIG. 1, the exhaust gas treatment apparatus 10 a includes a vacuum pump 31 as a gas transfer machine that sucks exhaust gas from the semiconductor manufacturing apparatus 90 and transfers the exhaust gas. Further, the exhaust gas discharged from the vacuum pump 31 is discharged from the pipe 41 connected so as to flow into the second space b of the second processing cylinder 21 and the second space b of the second processing cylinder 21. The exhaust gas discharged from the exhaust gas outlet 12 of the first processing cylinder 11 and the piping 42 as the first piping connected so that the exhaust gas discharged into the first processing cylinder 11 flows into the second processing cylinder 21. The pipe 43 connected so as to flow into the first space a and the exhaust gas discharged from the first space a of the second processing cylinder 21 were connected to flow out of the exhaust gas processing apparatus 10a. A pipe 44 is provided. In addition, it is preferable that the piping 42 is a pipe | tube with a high heat dissipation effect compared with a bare pipe so that it may discharge | release the heat | fever which waste gas has easily. For example, if the whole or a part of the pipe 42 is constituted by a bellows pipe, the surface area of the pipe 42 is increased, so that the heat of the exhaust gas is easily radiated from the pipe 42. As a result, the temperature of the exhaust gas discharged from the second space b of the second processing cylinder 21 can be easily lowered to about room temperature before flowing into the first processing cylinder 11. Further, the heat radiation effect may be improved by attaching fins (not shown) to the outer surface of the pipe 42 and increasing the heat radiation surface of the pipe 42.
If the pipe 42 is constituted by a bellows pipe, when the first processing cylinder 11 and the second processing cylinder 21 are installed in the same housing 60, the bellows pipe acts as a displacement displacement, The effect of facilitating installation also occurs.
In addition, the formation material in particular of exhaust gas processing apparatus 10a is not restrict | limited, The material normally used for this kind of gas processing apparatuses, such as a nickel-type alloy, can be used suitably.

The first treatment cylinder 11 is filled with synthetic zeolite, activated carbon, or alumina, silica gel, copper oxide (CuO), manganese dioxide (MnO ₂ ), or metal oxide such as hopcalite as the first treatment agent 51. Remove the acidic gas in the exhaust gas. Further, in the first space a of the second processing cylinder 21, metal oxide such as iron oxide (Fe ₂ O ₃ ), copper oxide (CuO), or manganese dioxide (MnO ₂ ) as the second processing agent 52 is used. The product and catalyst are filled, and CO and NF ₃ gas are removed by an oxidation reaction. Note that the first space a of the first processing cylinder 11 and the second processing cylinder 21 may be filled with two or more kinds of processing agents, respectively.

Further, when CO or NF ₃ contained in the exhaust gas is removed by heat oxidation in the second processing cylinder 21, it is necessary to introduce air or oxygen into the second processing cylinder 21. Therefore, the second processing cylinder 21 is provided with an air inlet 25 for introducing air or oxygen when processing the gas to be processed. When the introduction destination of air or oxygen in the second processing cylinder 21 (that is, the space filled with the second processing agent 52) is positive pressure, a pump, a blower or the like (not shown) is used. It is necessary to introduce air or oxygen. Alternatively, a suction blower, a fan, or a vacuum pump (not shown) may be provided on the downstream side of the pipe 44, and in that case, the space filled with the second processing agent 52 has a negative pressure, so that air is introduced. It is not necessary to push in air or oxygen from the port 25 using a pump or a blower. Furthermore, the position of the air inlet 25 is preferably provided at a position where the flow direction of air or oxygen is the same as the flow direction of the exhaust gas. Since air or oxygen only needs to be introduced into the second processing cylinder 21, the air inlet 25 may be provided on the pipe 42 or the pipe 43. Note that it is preferable to provide the pipe 43 on the downstream side of the first processing cylinder 11.

The first processing cylinder 11 is filled with synthetic zeolite as the first processing agent 51, and iron oxide (Fe ₂ O ₃ ) is used as the second processing agent 52 in the first space a of the second processing cylinder 21. Taking the case of filling as an example, the flow of exhaust gas from the exhaust gas treatment apparatus 10a will be described.
As shown in FIG. 1, the exhaust gas discharged from the semiconductor manufacturing apparatus 90 is sucked by the vacuum pump 31 disposed in the exhaust gas processing apparatus 10a, passes through the pipe 41, and the second space of the second processing cylinder 21. b. At this time, the temperature of the exhaust gas discharged from the vacuum pump 31 is 100 ° C. or higher. When the exhaust gas of 100 ° C. or higher flows into the second processing cylinder 21 and passes through the second space b, the heat of the exhaust gas is transmitted to the inner cylinder 22. Further, the heat transferred to the inner cylinder 22 is transferred from the outer surface and the fins 26 (see FIG. 2) to the second processing agent 52 filled in the first space a, and the second processing agent 52 is passed through the second processing agent 52 by 60 ° C. or more. Heat to. The exhaust gas that has passed through the second space b dissipates heat while passing through the pipe 42, and its temperature drops to about room temperature. The exhaust gas that has reached about room temperature flows into the first processing cylinder 11. In the first treatment cylinder 11, acidic gases such as HBr and Cl ₂ contained in the exhaust gas come into contact with the synthetic zeolite filled in the first treatment cylinder 11 and are adsorbed and removed from the exhaust gas.
The exhaust gas from which the acid gas has been removed flows through the pipe 43 and into the first space a of the second processing cylinder 21. In the case where CO is heated and oxidized, the processing temperature in the second processing cylinder 21 needs to be 60 ° C. or higher, but iron oxide (Fe ₂ O ₃ ) filled in the first space a is Since it has been heated to 60 ° C. or higher by the exhaust gas that has already passed through the second space b, CO contained in the exhaust gas is removed by thermal oxidation. In addition, the 2nd processing agent 52 with which the position away from the inner cylinder 22 (for example, the vicinity of the outer cylinder 23) was filled may be insufficient. In that case, the second treatment agent 52 may be heated using the heater 24.

  Further, when the exhaust gas passes through the second space b of the second processing cylinder 21, the temperature in the second space b is higher on the inflow side of the exhaust gas (that is, the side where the vacuum pump 31 is disposed). Become. On the other hand, when the exhaust gas passes through the first space a (the space filled with the second processing agent 52) of the second processing cylinder 21, the exhaust gas is generated by the heat or oxidation reaction of the heated processing agent. Since the reaction heat is transmitted along the flow of the exhaust gas to the exhaust gas outflow side, the temperature in the first space a is higher on the exhaust gas outflow side. Therefore, in order to make the temperature distribution in the second processing cylinder 21 uniform, the exhaust gas flowing through the first space a and the second space b should flow in the same direction (parallel flow). Is preferred.

When the exhaust gas contains NF ₃ in addition to CO, it is necessary to heat the second treatment agent 52 in the second treatment cylinder 21 to about 250 ° C. In this case, in the conventional exhaust gas treatment apparatus 110 as shown in FIG. 4, normal temperature exhaust gas flows from the first treatment cylinder 111 into the second treatment cylinder 121, so that it is near the inlet of the second treatment cylinder 121. The processing agent filled in is cooled by exhaust gas at normal temperature. Therefore, the treatment agent filled in the vicinity of the inflow port cannot reach a predetermined temperature, and has always been 50 ° C. or lower. As described above, a region (dead zone) of 50 ° C. or lower that cannot reach the predetermined temperature is generated in the second processing cylinder 121. In the region of 50 ° C. or lower, not only NF ₃ but also CO cannot be removed. For this reason, some of the processing agents filled in the region do not contribute to the processing and are replaced despite having processing capability, resulting in the waste of the processing agent. However, in the exhaust gas treatment apparatus 10 a according to the embodiment of the present invention, as shown in FIG. 1, the exhaust gas at 100 ° C. or higher discharged from the vacuum pump 31 is passed through the second space b of the second treatment cylinder 21. Thus, in the second processing cylinder 21, the second processing agent 52 filled in the vicinity of the inflow side of the exhaust gas from the first processing cylinder 11 can be heated to 60 ° C. or higher. Therefore, CO can be removed by the second treatment agent 52 filled in the vicinity of the exhaust gas inflow side, the occurrence of a dead zone can be prevented, and waste of the treatment agent can be suppressed.
Further, when NF ₃ is removed by the second processing cylinder 21 of the exhaust gas processing apparatus 10a, NOx (NO or NO ₂ ) gas is generated as a by-product. Therefore, you may install the process cylinder (not shown) for processing NOx in the downstream of the 2nd process cylinder 21 with respect to the flow of waste gas.

When CO or NF ₃ is removed by thermal oxidation, the first space a of the second processing cylinder 21 (the second processing agent 52 is filled) from the air inlet 25 of the second processing cylinder 21. It is necessary to introduce air or oxygen into the space. In introducing the air or oxygen, air or oxygen that has been heated to a predetermined temperature or higher (60 ° C. or higher for removing CO and 250 ° C. or higher for removing NF ₃ ) may be introduced.

As described above, in the exhaust gas treatment apparatus 10a, the heat of the exhaust gas is effectively used to suppress the power consumed by the heater 24 and improve the treatment efficiency of the gas to be treated. Furthermore, the processing agent is effectively consumed.
Further, as shown in FIG. 1, since the exhaust gas treatment apparatus 10 a includes the vacuum pump 31 in the housing 60, the second treatment cylinder 21 can be disposed immediately after the vacuum pump 31. Therefore, it is possible to prevent the heat of the exhaust gas from being lost due to heat dissipation or the like before flowing into the second processing cylinder, and the heat can be efficiently utilized.
Further, as shown in FIG. 2, the heat of the exhaust gas flowing through the second space b of the second processing cylinder 21 is easily transmitted to the second processing agent 52 filled in the first space a by the fins 26. Yes.
Further, the exhaust gas flowing through the first space a is likely to stay in the first space a by the fins 26 and 27, and the contact between the CO and NF ₃ contained in the exhaust gas and the second treatment agent 52 is facilitated. Becomes uniform and the processing efficiency can be increased.

  FIG. 3 is a configuration diagram (schematic cross-sectional view) of an exhaust gas treatment apparatus 10b according to the second embodiment of the present invention. The configuration of the exhaust gas treatment device 10b will be described with reference to FIG. In the exhaust gas treatment device 10 b, the pipe 41 is connected so that the exhaust gas discharged from the vacuum pump 31 passes through the pipe 41 and flows into the first space a of the second processing cylinder 21. Furthermore, the piping 43 is connected so that the exhaust gas discharged from the first processing cylinder 11 flows into the second space b of the second processing cylinder 21. The second treatment agent 52 is filled in the second space b. Thus, in the exhaust gas treatment apparatus 10b, the exhaust gas for heating is passed through the first space a of the second processing cylinder 21 and the exhaust gas for treating the gas to be treated is passed through the second space b. It becomes. Configurations and symbols other than the second treatment cylinder 21 are the same as those in the exhaust gas treatment apparatus 10a. In the exhaust gas treatment apparatus 10b, it is preferable that fins (not shown) are installed in the second space b (inside the inner cylinder 22).

As described above, the embodiments of the present invention have been described as the exhaust gas treatment apparatus that effectively uses the heat of the exhaust gas discharged from the semiconductor manufacturing apparatus and taken out by the vacuum pump, but the heat of the exhaust gas discharged from the semiconductor manufacturing apparatus. It is not limited to the exhaust gas treatment apparatus using In addition to exhaust gases emitted from manufacturing processes such as semiconductors and liquid crystal panels, for example, exhaust gases treated at combustion exhaust gas treatment devices and catalytic exhaust gas treatment devices and discharged at high temperatures are further included in the exhaust gas. Even when the gas to be processed is required to be processed, the heat of the exhaust gas can be used effectively.
In addition, the treatment in the first treatment cylinder is not limited to room temperature, but for the treatment in the first treatment cylinder, the heat of the exhaust gas is released (the temperature of the exhaust gas is lowered), and further the second The present invention is also effective in the case where heating is required again for the treatment in the treatment cylinder (the temperature of the exhaust gas is increased).
Thus, it is apparent that various modifications can be made to the embodiments without departing from the scope of the present invention.

10a, 10b Exhaust gas treatment device 11 First treatment tank, first treatment cylinder 12 Exhaust gas outlet 21 Second treatment tank, second treatment cylinder 22 Inner cylinder 23 Outer cylinder 24 Heater 25 Air inlet 26, 27 Fin 31 Gas Transfer Machine, Vacuum Pump 41 Pipe 42 First Pipe, Pipe 43 to 44 Pipe 51 First Treatment Agent 52 Second Treatment Agent 60 Case
90 Semiconductor manufacturing apparatus 110 Exhaust gas treatment apparatus 111 First treatment cylinder 121 Second treatment cylinder 124 Heater 131 Vacuum pump 160 Housing a First space b Second space

Claims (5)

An exhaust gas treatment apparatus for treating a gas to be treated contained in exhaust gas by passing the exhaust gas through the treatment agent;
A first treatment tank filled with a first treatment agent for passing exhaust gas and treating the gas to be treated;
A treatment tank having a double-pipe structure, in which a first space is formed by an inner cylinder arranged inside and an outer cylinder arranged outside, and a second space is formed inside the inner cylinder, The cylinder constitutes a heat exchanger that exchanges heat between the first space and the second space, and the first treatment agent is in one of the first space and the second space. A second treatment tank filled with a different second treatment agent;
A pipe through which the exhaust gas passes, and a first pipe that sends the exhaust gas that has passed through the other of the first space and the second space to the first treatment tank;
The first treatment tank has an exhaust gas outlet;
The exhaust gas outlet is connected to the space so as to communicate with the space filled with the second treatment agent;
Exhaust gas treatment equipment. The first pipe is a pipe having a higher heat dissipation effect than a bare pipe;
The exhaust gas treatment apparatus according to claim 1. The inner cylinder has a donut plate-like fin on the outer periphery of the inner cylinder, the outer periphery of the inner cylinder being an inner circle;
The outer cylinder has a donut plate-like fin on the inner periphery of the outer cylinder, the inner periphery of the outer cylinder being an outer circle;
The exhaust gas treatment apparatus according to claim 1 or 2. A gas transfer machine for transferring the exhaust gas;
The gas transfer machine is housed in a casing of the exhaust gas treatment device,
The exhaust gas treatment apparatus according to any one of claims 1 to 3. An exhaust gas treatment method for treating a gas to be treated contained in exhaust gas by passing exhaust gas through a treatment agent;
Exhaust gas heating the second treating agent to a second temperature;
Treating the gas to be treated contained in the exhaust gas with a first treatment agent different from the second treatment agent at a first temperature lower than the second temperature;
Treating the gas to be treated contained in the exhaust gas with the second treatment agent heated by the exhaust gas;
Exhaust gas treatment method.

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