JP2010212519A - Substrate cleaning device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate cleaning device capable of preventing damage to a very fine element formed on a substrate and cleaning a minute foreign material, by more uniformly reducing a particle diameter of injected droplet. <P>SOLUTION: The substrate cleaning device includes a substrate mounting unit 70 on which a washed substrate 80 is mounted, a gas supply unit 50 which supplies a gas generating and accelerating minute droplet, a minute bubble contained liquid generation unit 60 which generates minute bubbles and generates a minute bubble including liquid, and a two-fluid nozzle 1 injecting the minute droplet. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate cleaning apparatus that cleans microelements formed on a substrate, and more particularly, to a substrate cleaning apparatus that prevents damage to microelements formed on a substrate and enables cleaning of minute foreign matters. About.

  When cleaning the surface of a substrate on which a fine pattern is processed, such as a semiconductor wafer or a glass substrate for display, two-fluid jet cleaning is used to prevent damage to the pattern. FIG. 2 is a structural diagram showing a conventional two-fluid nozzle. In FIG. 2, the two-fluid nozzle 5 includes a droplet generation unit 15, a droplet acceleration unit 25, a gas introduction unit 35, and a liquid introduction unit 45.

  When the liquid is supplied from the liquid introduction unit 45 to the droplet generation unit 15 and the high-pressure gas is supplied from the gas introduction unit 35 to the droplet generation unit 15, the supplied gas becomes a high-speed fluid and becomes a liquid. The droplet is accelerated by the droplet accelerating unit 25 and sprayed onto the object to be cleaned to clean the surface of the object to be cleaned. However, if the particle size of the droplet is large, the processed element may be damaged. For this reason, this damage has been mitigated by making the droplets to be ejected finer, the liquid supply method and the shape of the nozzle, and the pressure adjustment of the liquid and gas to be supplied. To prevent damage.

  In Patent Document 1, a supersaturated liquid in which gas for generating bubbles is dissolved in advance and a gas for injection are mixed to form droplets, and the droplets are ejected to make the size of the droplets uniform. There is a description of a cleaning method and a cleaning apparatus that are reduced in size and remove foreign substances and the like adhering to the surface without destroying elements formed on the surface of the object to be cleaned. However, even in a supersaturated liquid, the amount of gas dissolved in the liquid is very small, so the effect of miniaturizing the droplets is small.

JP 2006-22395 A

  The present invention has been made to solve such a problem, and the object thereof is to further reduce the particle size of the droplets to be ejected into a fine element formed on the substrate. Provided is a substrate cleaning apparatus capable of preventing damage and cleaning minute foreign matters.

  The substrate cleaning apparatus of the present invention is a substrate cleaning apparatus for cleaning fine elements formed on a substrate, and includes a substrate mounting portion on which a substrate to be cleaned is mounted, and a gas for generating and accelerating micro droplets. A gas supply unit for supplying, a microbubble-containing liquid generating unit that generates microbubbles to generate a microbubble-containing liquid, and a two-fluid nozzle that generates, accelerates, and ejects microdroplets .

  The two-fluid nozzle of the substrate cleaning apparatus of the present invention has a gas introduction part, a microbubble-containing liquid introduction part, a microdroplet generation part, and a microdroplet acceleration part, and the gas introduction part and the microdroplet generation part And the microdroplet acceleration unit are integrated into a nozzle shape, the microbubble-containing liquid introduction unit is disposed inside the microdroplet generation unit, the gas supply unit is connected to the gas introduction unit, and the microbubbles The contained liquid generating part is connected to the microbubble-containing liquid introducing part.

  The microbubble-containing liquid generation unit of the substrate cleaning apparatus of the present invention has a microbubble control unit that controls the size and quantity of microbubbles in the liquid.

  According to the present invention, the particle size of the droplets to be ejected can be further miniaturized, so that damage to the microelements formed on the substrate can be prevented, and fine foreign matter can be cleaned. An apparatus can be provided.

The apparatus block diagram which shows the structure of the board | substrate cleaning apparatus by this invention. FIG. 6 is a structural diagram showing the structure of a conventional two-fluid nozzle.

  Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an apparatus configuration diagram showing the configuration of a substrate cleaning apparatus according to the present invention. In FIG. 1, a substrate cleaning apparatus 100 generates a microbubble by generating a substrate platform 70 on which a substrate 80 to be cleaned is placed, a gas supply unit 50 that supplies a gas that generates and accelerates microdroplets. It has a microbubble-containing liquid generating section 60 that generates a microbubble-containing liquid and a two-fluid nozzle 1 that ejects microdroplets.

  The two-fluid nozzle 1 includes a gas introduction unit 30, a microbubble-containing liquid introduction unit 40, a microdroplet generation unit 10, and a microdroplet acceleration unit 20, and the gas introduction unit 30 and the microdroplet generation unit 10. And the micro droplet acceleration unit 20 are integrated to form a nozzle shape. The microbubble-containing liquid introduction unit 40 is disposed inside the gas introduction unit 30 and the microdroplet generation unit 10, the gas supply unit 50 is connected to the gas introduction unit 30, and the microbubble-containing liquid generation unit 60 is a microbubble. It is connected to the contained liquid introduction part 40. The microbubble-containing liquid generation unit 60 has a microbubble control unit 65 that controls the size and quantity of microbubbles in the liquid.

  Next, the operation of the substrate cleaning apparatus 100 will be described. The microbubble-containing liquid generating unit 60 is supplied with a desired liquid for cleaning and a gas for generating microbubbles. The microbubble control unit 65 that controls the size and quantity of microbubbles in the liquid adjusts the pressure, flow rate, etc. of the supplied gas so that microbubbles of a desired size and quantity are generated in the liquid. Spray into cleaning liquid. Thereby, microbubbles called microbubbles or nanobubbles are generated, and a microbubble-containing liquid is generated. In this case, since the gas does not need to be dissolved in the liquid and exists as bubbles, the gas is not limited to carbon dioxide gas, and any gas that satisfies the cleaning condition can be selected.

  The generated microbubble-containing liquid is supplied to the microdroplet generating section 10 of the two-fluid nozzle 1 through the microbubble-containing liquid introducing section 40. At this time, a desired gas such as air or nitrogen gas is supplied from the gas introducing unit 30 to the micro droplet generating unit 10 via the gas introducing unit 30 in order to generate more micro droplets. As a result, a large amount of minute droplets are generated in the minute droplet generator 10. Since microbubbles of microbubbles and nanobubbles exist uniformly in the liquid, the particle diameters of the generated microdroplets are uniform.

  The uniform and large amount of micro droplets are accelerated by the high pressure gas from the gas introducing unit 30 in the micro droplet accelerating unit 20 and jetted onto the substrate to be cleaned 80 mounted on the substrate mounting unit 70. At this time, since the pressure state of the ejected micro droplet is released from the pressurized state to the atmospheric pressure at the tip of the two-fluid nozzle 1, bubbles in the droplet expand and repel, And sprayed onto the substrate 80 to be cleaned. This makes it possible to clean minute foreign matters without damaging the microelements formed on the substrate.

  As described above, according to the present invention, the particle size of the droplets to be ejected can be further miniaturized, so that damage to the microelements formed on the substrate can be prevented, and the cleaning of micro foreign matters can be performed. A possible substrate cleaning apparatus can be provided.

DESCRIPTION OF SYMBOLS 1, 5 2 Fluid nozzle 10 Minute droplet generating part 15 Droplet generating part 20 Minute droplet accelerating part 25 Droplet accelerating part 30, 35 Gas introducing part 40 Microbubble containing liquid introducing part 45 Liquid introducing part 50 Gas supplying part 60 Microbubble-containing liquid generating unit 65 Microbubble control unit 70 Substrate placing unit 80 Substrate to be cleaned 100 Substrate cleaning device

Claims (3)

A substrate cleaning apparatus for cleaning fine elements formed on a substrate,
A substrate placement unit on which a substrate to be cleaned is placed, a gas supply unit that supplies gas that generates and accelerates microdroplets, and a microbubble-containing liquid generator that generates microbubbles and generates a microbubble-containing liquid And a two-fluid nozzle for generating, accelerating, and jetting fine droplets. The two-fluid nozzle has a gas introduction part, a microbubble-containing liquid introduction part, a microdroplet generation part, and a microdroplet acceleration part,
The gas introduction unit, the micro droplet generation unit, and the micro droplet acceleration unit are integrated to form a nozzle shape,
The microbubble-containing liquid introduction part is arranged inside the microdroplet generation part,
The substrate cleaning apparatus according to claim 1, wherein the gas supply unit is connected to the gas introduction unit, and the microbubble-containing liquid generation unit is connected to the microbubble-containing liquid introduction unit.   The substrate cleaning apparatus according to claim 1, wherein the microbubble-containing liquid generating unit includes a microbubble control unit that controls the size and quantity of the microbubbles in the liquid.

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