JP2011072950A - Treatment apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a treatment apparatus which can be utilized with less preparation time. <P>SOLUTION: The treatment apparatus, supplied with a treatment liquid W from a liquid storage tank 11 to a discharge head unit 110 to treat the surface of an object to be treated 50 with the treatment liquid W discharged from the discharge head unit 110, is constituted so as to have a bubble generating mechanism 13, 15 generating fine bubbles in the treatment liquid W up to the time when the treatment liquid W from the liquid storage tank 11 is discharged from the discharge head unit 110. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a processing apparatus for processing a surface of an object to be processed by applying a liquid containing fine bubbles to the surface of the object to be processed.

  In recent years, it has been considered to use a liquid containing ultrafine bubbles for processing such as cleaning of an object surface. It is said that the potential at the interface between the ultrafine bubble and the liquid promotes the cleaning effect and oxidation action, and the energy when the ultrafine bubble attached to the object surface bursts contributes to the removal of dirt from the object surface. The ultrafine bubbles are called microbubbles, micronanobubbles, and nanobubbles as the size decreases.

  Conventionally, a cleaning apparatus using such ultrafine bubbles has been proposed (see Patent Document 1). In this cleaning device, a microbubble generator is provided in the cleaning liquid storage tank, and the microbubble generator generates fine bubbles called microbubbles in the cleaning liquid in the cleaning liquid storage tank. Then, when the microbubbles are filled in the cleaning liquid in the cleaning liquid storage tank, the cleaning liquid containing fine bubbles is supplied from the cleaning liquid storage tank to the spray nozzle by the pump, and the cleaning liquid is silicon to be cleaned from the spray nozzle. It is ejected to the surface of the wafer.

  According to such a cleaning apparatus, the cleaning power against impurities adhering to the surface of the silicon wafer (object to be cleaned) is improved by the cleaning action and the oxidizing action of the ultrafine bubbles (microbubbles) contained in the cleaning liquid. Will be able to.

JP 2009-54792 A

  However, in the above-described conventional cleaning apparatus, the cleaning liquid cannot be used for cleaning until a large amount of cleaning liquid stored in the cleaning liquid storage tank is filled with the fine bubbles. Is required.

  The present invention has been made in view of such circumstances, and provides a processing apparatus that can be used with less start-up preparation time.

  A processing apparatus according to the present invention is a processing apparatus for supplying a processing liquid from a liquid storage tank to a discharge head unit, and processing the surface of the object to be processed with a processing liquid discharged from the discharge head unit. A configuration having a bubble generating mechanism for generating fine bubbles in the processing liquid before the processing liquid from the liquid storage tank is discharged from the discharge head unit.

  With such a configuration, since fine bubbles are generated in the processing liquid before the processing liquid from the liquid storage tank is discharged from the discharge head unit, the processing containing fine bubbles is performed. Even if the liquid is not stored, a processing liquid containing fine bubbles can be provided on the surface of the object to be processed.

  In the processing apparatus according to the present invention, the bubble generating mechanism includes a mechanism that melts gas in the processing liquid from the liquid storage tank to generate a gas-dissolved processing liquid, and pressurizes the gas-dissolved processing liquid to discharge the discharge head. A mechanism for supplying the unit to the unit and a pressure release mechanism for releasing a pressurized state of the gas-dissolved processing solution and generating fine bubbles in the processing solution can be provided.

  With such a configuration, the processing solution is supplied from the liquid storage tank to the discharge head unit, and the gas-dissolved processing solution is generated until the processing solution is discharged from the discharge head unit. By being released from the pressed state, a processing liquid containing fine bubbles can be generated.

  Further, in the processing apparatus according to the present invention, the discharge head unit includes the pressure release mechanism, and generates a processing liquid containing fine bubbles from a gas-dissolved processing liquid supplied under pressure to the discharge head unit. The treatment liquid can be discharged.

  With such a configuration, in a discharge head unit to which a pressurized gas-dissolved processing liquid is supplied, a processing liquid containing fine bubbles is generated, and the processing liquid is discharged from the discharge head unit.

  Further, in the processing apparatus according to the present invention, the discharge head unit includes a processing liquid storage unit that stores the processing liquid, a nozzle that discharges the processing liquid stored in the processing liquid storage unit, and the dissolved gas that is supplied under pressure. A treatment liquid introduction section as the pressure release mechanism formed with an orifice for guiding the treatment liquid to the treatment liquid storage section, and the gas-dissolved treatment liquid supplied under pressure passes through the orifice of the treatment liquid introduction section The pressurization state can be released when the operation is performed.

  With such a configuration, when the pressurized gas-dissolved processing liquid is introduced into the processing liquid storage section through the orifice formed in the processing liquid introduction section, fine bubbles are generated in the processing liquid, The processing liquid containing fine bubbles is temporarily stored in the processing liquid storage part. And the process liquid containing the fine bubble stored in the process liquid storage part is discharged from a nozzle.

  Furthermore, in the processing apparatus according to the present invention, the discharge head unit includes a processing liquid storage section that stores the pressurized gas-dissolved processing liquid while maintaining its pressurized state, and a gas dissolution of the processing liquid storage section. A nozzle as the pressure release mechanism that discharges the processing liquid while releasing the pressurization state, so that fine bubbles are generated in the processing liquid while the gas-dissolved processing liquid is discharged from the nozzle. Can be configured.

  With such a configuration, the pressurized gas-dissolved processing liquid is temporarily stored in the processing liquid reservoir, and the gas-dissolved processing liquid in the processing liquid reservoir is discharged from the nozzle while the pressurized state is released. When the gas-dissolved processing liquid is discharged from the nozzle, fine bubbles are generated by releasing the pressurized state, and the processing liquid containing the fine bubbles is discharged from the nozzle.

  Moreover, the processing apparatus which concerns on this invention WHEREIN: It can comprise so that it may have a filter which removes a foreign material from the said gas dissolved process liquid, before the said gas dissolved process liquid is pressurized and supplied to the said pressure release mechanism.

  With such a configuration, foreign substances are removed by the filter before the pressurized state of the gas-dissolved processing solution is released and fine bubbles are generated, so the fine bubbles generated together with the foreign substances are removed by the filter. It will not be done.

  Furthermore, in the processing apparatus according to the present invention, the discharge head unit can be configured as a two-fluid tool that mixes and delivers the processing liquid discharged from the nozzle and high-pressure gas.

  With such a configuration, the processing liquid containing fine bubbles can be mixed with the high-pressure gas from the discharge head unit and sprayed onto the surface of the object to be processed.

  Further, in the processing apparatus according to the present invention, a gas supply mechanism that supplies a gas to be melted in the processing liquid from the liquid storage tank to the processing liquid, and a molten gas that detects an amount of the gas melted in the processing liquid The detection unit and a unit that outputs information representing the amount of gas that is melted in the processing liquid detected by the molten gas detection unit may be employed.

  With such a configuration, information indicating the amount of gas dissolved in the processing liquid is output. From the output information, the user generates a fine bubble having an appropriate amount of gas currently dissolved in the processing liquid. It is possible to determine whether or not it is suitable for the purpose. Then, based on the determination, the user can perform an operation of adjusting the gas supply amount.

  The means for outputting information representing the amount of gas is not particularly limited as long as the information can be provided to the user, and the information is displayed, the information is printed out, or the information is displayed. The information can be output by voice.

  Furthermore, in the processing apparatus according to the present invention, a gas supply mechanism that supplies a gas to be melted in the processing liquid from the liquid storage tank to the processing liquid, and a molten gas that detects the amount of gas that is melted in the processing liquid Detection means, and control means for controlling the amount of gas supplied from the gas supply mechanism to the processing liquid based on the amount of gas melted in the processing liquid detected by the molten gas detection means. It can be configured.

  With such a configuration, the amount of gas supplied to the processing liquid can be controlled based on the amount of gas melted in the processing liquid, so that the amount considering the amount of gas dissolved in the processing liquid Gas can be supplied.

  Control of the amount of gas supplied from the gas supply mechanism to the processing liquid based on the amount of gas melted in the processing liquid detected by the molten gas detection means should be generated by a bubble generation mechanism. It can be decided according to the situation of fine bubbles. For example, in the processing liquid supplied to the bubble generating mechanism by controlling the amount of gas supplied to the processing liquid so that the amount of gas to be melted (detected amount) in the processing liquid is within a predetermined range. The amount of gas dissolved in the gas becomes stable. As a result, the amount of fine bubbles generated in the processing liquid by the bubble generation mechanism can be more stable. In addition, the amount of gas supplied to the treatment liquid can be controlled so that the dissolved gas in the treatment liquid becomes supersaturated. In this case, the bubble generating mechanism can always generate the maximum amount of fine bubbles in the processing liquid.

  Further, in the processing apparatus according to the present invention, the gas supplied from the gas supply mechanism to the processing liquid is oxygen, and the molten gas detecting means detects a concentration of dissolved oxygen in the processing liquid. It can be set as the structure which is a sensor.

  Furthermore, in the processing apparatus according to the present invention, the gas supplied from the gas supply mechanism to the processing liquid is a gas other than oxygen, and the molten gas detection means detects the concentration of oxygen melted in the processing liquid. A dissolved oxygen concentration sensor, wherein the control means controls the amount of gas other than oxygen supplied from the gas supply mechanism to the treatment liquid based on the concentration of oxygen detected by the dissolved oxygen concentration sensor. It can be.

  With such a configuration, even if there is no dissolved gas concentration sensor dedicated to a gas other than oxygen dissolved in the treatment liquid, the magnitude of the concentration of the gas in the treatment liquid is smaller than the relative oxygen concentration in the treatment liquid. Since the concentration of gas other than oxygen dissolved in the treatment liquid can be detected by the dissolved oxygen concentration sensor, a wider variety of gases can be used.

  According to the processing apparatus of the present invention, a fine bubble is generated in the processing liquid until the processing liquid from the liquid storage tank is discharged from the discharge head unit, and the processing liquid contains fine bubbles. Since it is possible to apply the treatment liquid to the surface of the object to be treated even if the material is not stored, it can be used with less start-up preparation time.

It is a figure which shows the structure of the processing apparatus which concerns on the 1st Embodiment of this invention. It is front sectional drawing which shows an example of the internal structure of the discharge head unit used for the processing apparatus shown in FIG. It is side surface sectional drawing which shows an example of the internal structure of the discharge head unit used for the processing apparatus shown in FIG. It is front sectional drawing which shows another example of the internal structure of the discharge head unit used for the processing apparatus shown in FIG. It is a figure which shows the structure of the processing apparatus which concerns on the 2nd Embodiment of this invention. It is a figure which shows the structural example of the control system in the processing apparatus shown in FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  The processing apparatus according to the first embodiment of the present invention is configured as shown in FIG. This processing apparatus is a substrate cleaning apparatus for cleaning a glass substrate which is an object to be cleaned.

  In the substrate cleaning apparatus shown in FIG. 1, one end of the transmission pipe 12 is connected to the discharge port of the liquid storage tank 11 in which the cleaning liquid W (for example, pure water) is stored, and the other end of the transmission pipe 12 is connected. The section is connected to the input port of the pump 14. A gas (for example, nitrogen gas, oxygen gas, etc.) from the gas supply unit 13 is jetted and supplied to a predetermined portion of the delivery pipe 12 up to the pump 14. A transmission pipe connected to the output port of the pump 14 is connected to the high-pressure tank 15. The high-pressure tank 15 temporarily stores the bubble-containing cleaning liquid W supplied through the transmission pipe 12 while maintaining a high pressure. While the bubble-containing cleaning liquid W is maintained in a high-pressure state in the high-pressure tank 15, the gas forming the bubbles melts in the cleaning liquid W and the gas concentration in the cleaning liquid W increases. That is, the gas-dissolved cleaning liquid W is generated in the high-pressure tank 15.

  A discharge head unit 110 that discharges the cleaning liquid W downward is installed in the cleaning chamber 100, and a glass substrate 50 that is an object to be cleaned is disposed below the discharge head unit 110 so as to face the discharge head unit 110. Even if the glass substrate 50 is placed on a turntable installed opposite to the ejection head unit 110 and rotated (spin processing apparatus), a lower part of the ejection head unit 110 is set below the ejection head unit 110 by a transport mechanism. It may move at a speed.

  The high-pressure tank 15 and the discharge head unit 110 described above are connected to each other by a transmission pipe 16. A filter 17 for removing foreign matter is provided in the delivery tube 16. The gas-dissolved cleaning liquid W is pressurized and supplied from the high-pressure tank 15 to the discharge head unit 110 through the transmission pipe 16. Although the detailed structure of the discharge head unit 110 will be described later, the discharge head unit 110 has a so-called two-fluid tool structure. The cleaning liquid W is pressurized and supplied through the transfer pipe 16 by high-pressure air introduced through the air introduction pipe 111. Is sprayed in the form of a mist.

  In the cleaning chamber 100, a receiving container 120 is installed below the glass substrate 50, and the cleaning liquid W used for cleaning the glass substrate 50 is collected in the receiving container 120. The receiving vessel 120 is connected to a delivery pipe 18 extending toward the liquid storage tank 11, and the cleaning liquid W collected in the receiving container 120 is returned to the liquid storage tank 11 through the delivery pipe 18 and again. It can be used for cleaning.

  The ejection head unit 110 described above is configured as shown in FIGS. 2 is a front sectional view showing the internal structure of the ejection head unit 110, and FIG. 3 is a side sectional view showing the internal structure of the ejection head unit 110. As shown in FIG.

  2 and 3, the discharge head unit 110 has an air tank part 114 that stores high-pressure air and a cleaning liquid storage part 115 that stores the cleaning liquid W. A plurality of nozzles 117 extending downward from the cleaning liquid storage unit 115 are formed in the discharge head unit 110, and are opened outward from the tips of the plurality of nozzles 117 from the air tank unit 114 through the outer periphery of the cleaning liquid storage unit 115. Thus, an air passage 116 is formed (see FIG. 3).

  An air introduction port 112 that allows the air tank unit 114 and the outside to communicate with each other is formed in the outer wall portion of the discharge head unit 110, and an end of an air introduction tube 111 (see FIG. 1) is connected to the air introduction port 112. Thereby, high-pressure air can be supplied to the air tank part 114 through the air introduction pipe 111. Further, the discharge head unit 110 has a gas-dissolved cleaning liquid W introduction portion 113, and a plurality of orifices 113 a are formed in the introduction portion 113. The end of the delivery pipe 16 (see FIG. 1) is connected to the introduction section 113, and the gas-dissolved cleaning liquid W pressurized and supplied through the delivery pipe 16 passes through the plurality of orifices 113a and the cleaning liquid storage section 115. To be introduced.

  Next, the operation of the substrate cleaning apparatus having the above-described structure will be described.

  When the pump 14 is driven, the cleaning liquid W from the liquid storage tank 11 flows through the transmission pipe 12 toward the input port of the pump 14. In the process, the gas from the gas supply unit 13 is jetted and supplied to the cleaning liquid W in the transmission pipe 12, and the cleaning liquid W flowing through the transmission pipe 12 becomes a bubble-containing cleaning liquid W mixed with bubbles to the pump 14. It will be drawn. Then, the bubble-containing cleaning liquid W output from the pump 14 is supplied to the high-pressure tank 15. In the high-pressure tank 15, since the bubble-containing cleaning liquid W is maintained at a high pressure, the gas forming the bubbles melts in the cleaning liquid W and the gas concentration in the cleaning liquid W increases. Then, the gas-dissolved cleaning liquid W having a high gas concentration passes through the filter 17 from the high-pressure tank 15, and is pressurized and supplied to the discharge head unit 110 of the cleaning chamber 100 through the transmission pipe 16.

  The gas-dissolved cleaning liquid W that reaches the discharge head unit 110 in a pressurized state through the delivery pipe 16 is released when it is introduced into the cleaning liquid storage unit 115 through each orifice 113a of the introduction unit 113. . The gas melted in the gas-dissolved cleaning liquid W due to the release of the pressurized state appears as bubbles, particularly as fine bubbles. Thereby, the cleaning liquid W containing the fine bubbles is stored in the cleaning liquid storage unit 115. Then, the cleaning liquid W containing the fine bubbles temporarily stored in the cleaning liquid storage unit 115 is discharged from each of the plurality of nozzles 117. The fine bubbles are referred to as microbubbles, micronanobubbles, and nanobubbles in order of increasing size.

  On the other hand, high-pressure air is supplied to the air tank portion 114 of the discharge head unit 110 through the air introduction pipe 111. Then, the high-pressure air supplied to the air tank unit 114 passes through the air passage 116 and is ejected outward from the tip of each nozzle 117 discharged by the cleaning liquid W containing fine bubbles as described above. When this high-pressure air is ejected outward from the tip portion of each nozzle 117 through the air passage 116, the cleaning liquid W discharged from each nozzle 117 is pulverized, atomized, and ejected in the form of a mist.

  In this way, the cleaning liquid W ejected in the form of mist from the tip portions of the plurality of nozzles 117 of the discharge head unit 110 is sprayed on the surface of the glass substrate 50, thereby cleaning (processing) the surface of the glass substrate 50. . The mist-like cleaning liquid W sprayed on the glass substrate 50 contains fine bubbles, and the surface of the glass substrate 50 can be cleaned well by the cleaning effect and oxidation action of the bubbles.

  In the substrate cleaning apparatus described above, the gas-dissolved cleaning liquid W is generated in the process of supplying the cleaning liquid W from the liquid storage tank 11 to the discharge head unit 110, and the gas-dissolved cleaning liquid W is introduced into the cleaning liquid storage unit 115 of the discharge head unit 110. At this time, fine bubbles are generated in the cleaning liquid W, so that fine bubbles are discharged from the discharge head unit 110 on the surface of the glass substrate 50 without storing the cleaning liquid W containing fine bubbles in advance. The cleaning liquid W contained can be provided. Accordingly, the substrate cleaning apparatus can be used with less start-up preparation time.

  In the substrate cleaning apparatus described above, since the pressurized state of the gas-dissolved cleaning liquid W is released in the discharge head unit 110 to generate fine bubbles, in the delivery tube 16 from the high-pressure tank 15 toward the discharge head unit 110, The filter 17 does not remove fine bubbles from the cleaning liquid W together with foreign matter.

  The discharge head unit 110 can be configured as shown in FIG. In this example, instead of the introduction part 113 (see FIG. 2) in which a plurality of orifices 113a are formed, an introduction port 118 to which the feed pipe 16 extending from the high-pressure tank 15 is connected is formed. The other structure is the same as the above-described example (see FIG. 3).

  In this case, the gas-dissolved cleaning liquid W pressurized and supplied from the high-pressure tank 15 through the delivery pipe 16 is introduced into the cleaning liquid storage unit 115 of the discharge head unit 110 while maintaining the pressurized state. Then, when the gas-dissolved cleaning liquid W temporarily stored in the cleaning liquid storage unit 115 is discharged outward from each of the plurality of nozzles 117, the pressurized state is released. The gas melted in the gas-dissolved cleaning liquid W appears as fine bubbles due to the release of the pressurized state when discharging from the nozzle 117. As a result, the cleaning liquid W containing fine bubbles is discharged from each nozzle 117, and the cleaning liquid W is further atomized by the high-pressure air passing through the air passage 116 to be applied to the surface of the glass substrate 50 as a mist.

  Also in this case, the gas-dissolved cleaning liquid W is generated in the process of supplying the cleaning liquid W from the liquid storage tank 11 to the discharge head unit 110, and when the gas-dissolved cleaning liquid W is discharged from each nozzle 117 of the discharge head unit 110, Bubbles are generated in the cleaning liquid W, so that the cleaning liquid W containing fine bubbles is discharged from the discharge head unit 110 onto the surface of the glass substrate 50 without storing the cleaning liquid W containing fine bubbles in advance. Will be able to give. Therefore, similarly to the above-described example, the substrate cleaning apparatus can be used with less start-up preparation time.

  In each of the above-described examples, the pressurized state of the gas-dissolved cleaning liquid W is released in the discharge head unit 110 to generate the cleaning liquid W containing fine bubbles. However, the cleaning liquid W from the liquid storage tank 11 is discharged from the discharge head unit 110. The cleaning liquid W containing fine bubbles can be generated at any position as long as the nozzle 117 is discharged.

  Next, a processing apparatus according to the second embodiment of the present invention will be described. The processing apparatus according to the second embodiment of the present invention is configured as shown in FIG. This processing apparatus differs from the processing apparatus according to the first embodiment described above in that the concentration of the gas melted in the cleaning liquid W is monitored. In FIG. 5, the same parts as those shown in FIG.

  5, this processing apparatus is similar to the processing apparatus shown in FIG. 1. The storage tank 11 stores the cleaning liquid W, the gas supply unit 13, the pump 14, the high-pressure tank 15, the filter 17, and the transmission pipes 12 and 16. , 18 and a cleaning chamber 100. The delivery pipe 16 extending from the filter 17 to the cleaning chamber 100 is provided with a dissolved gas concentration sensor 19 that detects the concentration of gas dissolved in the cleaning liquid W passing through the delivery pipe 16 (corresponding to the amount of dissolved gas). At the same time, an opening / closing valve 20 whose opening degree is adjusted by an actuator 21 is provided in a supply gas supply passage extending from the gas supply unit 13 to the transmission pipe 12. In the second embodiment, the gas supplied from the gas supply unit 13 is oxygen gas, and the dissolved gas concentration sensor 19 is the dissolved oxygen concentration sensor 19.

  The control system in this processing apparatus is configured as shown in FIG. In FIG. 6, a dissolved oxygen concentration sensor 19 and an actuator 21 are connected to a processing unit 25, and the processing unit 25 adjusts the opening degree of the on-off valve 20 based on a detection signal from the dissolved oxygen concentration sensor 19. The drive control is performed. The on-off valve 20, the actuator 21 and the processing unit 25 constitute a control means for controlling the amount of oxygen (gas) supplied to the cleaning liquid W (processing liquid). Further, a display unit 26 is connected to the processing unit 25, and the processing unit 25 determines the concentration of oxygen dissolved in the cleaning liquid W (corresponding to the amount of oxygen) from the detection signal from the dissolved oxygen concentration sensor 19. Display data to be displayed is generated, and the concentration of oxygen dissolved in the cleaning liquid W is displayed (output) on the display unit 26 based on the display data.

  In such a processing system, the processing unit 25 controls the amount of oxygen gas supplied from the gas supply unit 13 so that the oxygen concentration represented by the detection signal from the dissolved oxygen concentration sensor 19 falls within a predetermined concentration range. To do. Specifically, the opening degree of the on-off valve 20 is adjusted by driving control of the actuator 21, and an amount of oxygen gas corresponding to the opening degree of the on-off valve 20 is supplied from the gas supply unit 13 to the cleaning liquid W passing through the transmission pipe 12. Will come to be.

  According to such a processing apparatus, since the amount (concentration) of oxygen dissolved in the cleaning liquid W supplied to the cleaning chamber 100 is stabilized, stable fine bubbles are generated in the cleaning liquid W in the cleaning chamber 100. Accordingly, the amount of fine bubbles contained in the cleaning liquid W discharged from each nozzle 117 of the discharge head 110 is also stabilized. As a result, effective cleaning of the glass substrate 50 can be performed stably.

  Further, since the concentration of oxygen dissolved in the cleaning liquid W is displayed on the display unit 26, the user can supply the cleaning liquid W that can generate an appropriate amount of fine bubbles to the cleaning chamber 100 based on the displayed oxygen concentration. It can be determined whether or not it is supplied.

  Further, when the concentration of oxygen dissolved in the cleaning liquid W is displayed (output) on the display unit 26, the opening / closing valve 20 is not adjusted by the actuator 21 but can be adjusted manually. It may be. In this case, the user can manually adjust the opening degree of the on-off valve 20 according to the oxygen concentration displayed on the display unit 26.

  In the processing apparatus according to the second embodiment of the present invention, the oxygen gas is supplied from the gas supply unit 13, but a gas other than oxygen, for example, a nitrogen gas may be supplied. In this case, the dissolved oxygen concentration sensor 19 can be used as it is. When the amount of nitrogen gas supplied from the gas supply unit 13 increases and the concentration of nitrogen gas dissolved in the cleaning liquid W increases, the dissolved oxygen concentration relatively decreases. Therefore, when the oxygen concentration represented by the detection signal from the dissolved oxygen concentration sensor 19 decreases, the concentration of nitrogen gas dissolved in the cleaning liquid W increases. Based on this correlation, the processing unit 25 can detect the concentration of nitrogen gas (the amount of nitrogen gas) in the cleaning liquid W based on the detection signal from the dissolved oxygen concentration sensor 19. The processing unit 25 drives the actuator 21 that adjusts the opening degree of the on-off valve 20 based on the detected concentration of nitrogen gas. As a result, the concentration of nitrogen gas dissolved in the cleaning liquid W can be stabilized.

  In each of the above-described embodiments, the cleaning apparatus cleans the surface of the object to be cleaned using the cleaning liquid W containing fine bubbles. However, the processing liquid containing the fine bubbles may be treated other than cleaning (for example, It can also be used for organic matter decomposition treatment.

  As described above, the processing apparatus according to the present invention has an effect that it can be used with less start-up preparation time, and applies a liquid containing fine bubbles to the surface of the object to be processed. It is useful as a processing apparatus for processing the surface of an object to be processed.

DESCRIPTION OF SYMBOLS 11 Liquid storage tank 12 Feeding pipe 13 Gas supply part 14 Pump 15 High pressure tank 16 Feeding pipe 17 Filter 18 Feeding pipe 19 Dissolved gas concentration sensor (dissolved oxygen concentration sensor)
20 On-off valve 21 Actuator 25 Processing unit 26 Display unit 50 Glass substrate (object to be processed)
DESCRIPTION OF SYMBOLS 100 Cleaning chamber 110 Discharge head unit 111 Air introduction pipe 112 Inlet 113 Introducing part 113a Orifice 114 Air tank part 115 Cleaning liquid storage part 116 Air path 117 Nozzle

Claims (11)

A processing apparatus for supplying a processing liquid from a liquid storage tank to a discharge head unit, and processing the surface of the object to be processed with a processing liquid discharged from the discharge head unit,
A processing apparatus having a bubble generating mechanism for generating fine bubbles in the processing liquid before the processing liquid from the liquid storage tank is discharged from the discharge head unit. The bubble generating mechanism is a mechanism for generating a gas-dissolved processing liquid by melting gas in the processing liquid from the liquid storage tank;
A mechanism for pressurizing and supplying the gas-dissolved processing liquid toward the discharge head unit;
The processing apparatus according to claim 1, further comprising: a pressure release mechanism that releases a pressurized state of the gas-dissolved processing liquid and generates fine bubbles in the processing liquid. The discharge head unit has the pressure release mechanism,
The processing apparatus according to claim 2, wherein a processing liquid containing fine bubbles is generated from a gas-dissolved processing liquid supplied under pressure to the discharge head unit, and the processing liquid is discharged. The discharge head unit includes a processing liquid storage unit that stores processing liquid;
A nozzle for discharging the processing liquid stored in the processing liquid storage section;
A treatment liquid introduction part as the pressure release mechanism formed with an orifice for guiding the gas-dissolved treatment liquid supplied under pressure to the treatment liquid storage part;
The processing apparatus according to claim 3, wherein the pressurized state is released when the gas-dissolved processing liquid supplied under pressure passes through an orifice of the processing liquid introduction section. The discharge head unit includes a processing liquid storage unit that stores the pressurized gas-dissolved processing liquid while maintaining its pressurized state;
A nozzle as the pressure release mechanism that discharges the gas-dissolved processing liquid in the processing liquid storage section while releasing the pressurized state;
The processing apparatus according to claim 3, wherein fine bubbles are generated in the processing liquid while the gas-dissolved processing liquid is discharged from the nozzle.   The processing apparatus according to any one of claims 2 to 5, further comprising a filter that removes foreign substances from the gas-dissolved processing liquid before the gas-dissolved processing liquid is pressurized and supplied to the pressure release mechanism.   The processing apparatus according to claim 1, wherein the discharge head unit is configured as a two-fluid tool that mixes and discharges the processing liquid discharged from the nozzle and a high-pressure gas. A gas supply mechanism for supplying a gas to be melted in the processing liquid from the liquid storage tank to the processing liquid;
Molten gas detection means for detecting the amount of gas melted in the treatment liquid;
3. A processing apparatus according to claim 2, further comprising means for outputting information representing an amount of gas melted in the processing liquid detected by the molten gas detecting means. A gas supply mechanism for supplying a gas to be melted in the processing liquid from the liquid storage tank to the processing liquid;
Molten gas detection means for detecting the amount of gas melted in the treatment liquid;
3. Control means for controlling the amount of gas supplied from the gas supply mechanism to the processing liquid based on the amount of gas melted in the processing liquid detected by the molten gas detection means. The processing apparatus as described. The gas supplied to the treatment liquid from the gas supply mechanism is oxygen,
The processing apparatus according to claim 9, wherein the molten gas detection means is a dissolved oxygen concentration sensor that detects a concentration of oxygen melted in the processing liquid. The gas supplied from the gas supply mechanism to the treatment liquid is a gas other than oxygen,
The molten gas detection means is a dissolved oxygen concentration sensor that detects the concentration of oxygen melted in the treatment liquid,
The processing apparatus according to claim 9, wherein the control unit controls an amount of gas other than oxygen supplied from the gas supply mechanism to the processing liquid based on an oxygen concentration detected by the dissolved oxygen concentration sensor.

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