JP2010206320A - Communication body for signal transmission, and coupler - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a communication body for signal transmission and a coupler, which are suitable for performing the data transmission of a wide band and a large capacity in a high frequency band such as a millimeter wave band, have a long communicable distance and need no space on a communication surface. <P>SOLUTION: The communication body 201 for signal transmission includes a disk-like external conductor 11 provided with a rotated trapezoid shape cavity TCV in the inside. The respective central axes of a rotated trapezoid shape internal conductor 12 disposed inside the rotated trapezoid shape cavity TCV in the state of being insulated from the external conductor 11 and the rotated trapezoid shape cavity TCV coincide, and the lower bottom surface of the rotated trapezoid shape internal conductor 12 matches with the first main surface of the external conductor 11. An internal dielectric layer 13 is provided in a region other than the region occupied by the internal conductor 12 inside the rotated trapezoid shape cavity TCV of the external conductor 11. By disposing the communication bodies 201 for the signal transmission closely and oppositely, the coupler capable of communication between the both communication bodies is configured. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a communication body for a signal transmission device that performs communication in a proximity state and a coupler that is coupled to each other in a proximity state.

The following prior art documents are listed as background art of the present invention.
[Patent Document 1]
FIG. 1 is a perspective view of a communication device disclosed in Patent Document 1. In FIG. The coupling electrode 108 and the folded stub 103 are formed on the upper and lower surfaces of the insulating spacer 109, and the coupling electrode 108 is connected to the central portion of the stub 103 through the through hole 110 in the spacer 109. . On the printed circuit board 101, a signal line pattern drawn from the transmission / reception circuit module 105 and a conductor pattern 112 connected to the ground conductor 102 through the through hole 106 in the printed circuit board 101 are formed. When the spacer 109 is mounted on the printed circuit board 101, both ends of the stub 103 are connected to the signal line pattern 111 and the conductor pattern 112, respectively.

JP 2008-154267 A

However, the conventional communication apparatus as shown in FIG. 1 has the following problems.
(A) The communication range is only about a half wavelength of the center frequency, and the communicable distance is limited to about several millimeters at high frequencies such as millimeter waves.

(B) Folded stubs need to be formed on the printed circuit board for frequency adjustment, and that much space is required on the printed circuit board.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a signal transmission communication body suitable for performing wideband and large-capacity data transmission in a high frequency band such as a millimeter wave band, having a large communicable distance and requiring no space on the communication surface. And providing a coupler.

The communication body for signal transmission according to the present invention has a first main surface and a second main surface that are parallel to each other, and is arranged with an outer conductor having a hollow portion therein and in an insulated state in the hollow portion. An inner dielectric layer filled outside the region occupied by the inner conductor in the cavity, and an outer dielectric layer disposed on the first main surface side of the outer conductor,
The hollow portion has a rotation surface with a straight line perpendicular to the first main surface as a rotation center axis as a side surface (inner surface), the first main surface is a lower bottom surface, and the second main surface is smaller in diameter than the lower bottom surface. It is a rotating trapezoid with a small top and bottom surface,
The inner conductor has a rotating surface with the straight line as the rotation center axis as a side surface (outer surface), the first main surface as a lower bottom surface, and the second main surface as an upper bottom surface having a smaller diameter than the lower bottom surface. Shape,
An outer surface of the outer dielectric layer is used as an input / output surface for communication electromagnetic waves, and a position corresponding to the upper bottom surface of the inner conductor is used as a signal input / output unit.

  The “rotary trapezoidal shape” is not used in the meaning of [rotary table] and [shape] but in the meaning of [rotation] [trapezoid] and [shape].

  The ratio of the diameter of the lower bottom surface to the height of the inner conductor is 4 or less. Alternatively, the ratio of the diameter of the lower bottom surface of the rotary trapezoidal cavity to the height of the rotary trapezoidal cavity is set to 4 or less.

  The thickness of the external dielectric layer is a frequency used for communication, for example, smaller than a dimension corresponding to about 0.2 wavelength.

  The inner conductor and the outer conductor are composed of conductors formed on a plurality of layers of a multilayer substrate, for example, and the inner dielectric layer is composed of a dielectric layer of the multilayer substrate.

  The coupler according to the present invention includes at least one signal transmission communication body on each of the transmission side and the reception side, and is configured such that the bottom surfaces of the outer conductor and the inner conductor face each other.

  It is assumed that at least one of the signal transmission communication bodies on the transmitting side or the receiving side is arranged at a pitch of approximately half a wavelength or more.

According to the present invention, the following effects can be obtained.
(A) Since the basic structure of the communication body is that the inner conductor as a signal line and the outer conductor as a ground conductor are both of a rotary trapezoid, the coaxial structure maintains a self-similar shape, and single-mode electromagnetic waves are propagated to wideband It has characteristics.

(B) Since the basic structure of the communication body is a rotationally symmetric structure along the central axis of the turntable-shaped inner conductor, a degree of freedom of rotation along the central axis is ensured.

(C) Since the inner dielectric layer is loaded between the inner conductor and the outer conductor, and the outer dielectric layer is loaded on the first main surface side of the outer conductor, the size of the communication body can be reduced by the wavelength shortening effect. Is possible.

(D) If two communication bodies for signal transmission are arranged substantially in parallel, communication can be performed and the degree of freedom of arrangement in the in-plane direction is increased.

(E) Radio wave interference to other peripheral systems can be reduced by adjusting each dimension of the communication body for signal transmission so that the coupling range in the plane direction and the interval direction of the two communication bodies becomes a desired range.

1 is a perspective view of a communication device disclosed in Patent Document 1. FIG. 2A is a perspective view of the signal transmission communication body according to the first embodiment, FIG. 2B is a top view thereof, and FIG. 2C is a cross-sectional view taken along line AA in FIG. 2B. FIG. 2D is a bottom view of the signal transmission communication body 201. FIG. 3 is an enlarged view of a central portion in a cross-sectional view of the signal transmission communication body 201 illustrated in FIG. It is a perspective view of the coupler 301 which concerns on 2nd Embodiment. It is a figure which shows the difference in the characteristic by the magnitude | size of the diameter (phi) Lb of the lower bottom face of the inner conductor 12 of the two communication bodies 201 and 202 for signal transmission. It is a figure which shows the difference in the characteristic by the magnitude | size of diameter (phi) La of the lower bottom face of the rotary trapezoid-shaped cavity part of two communication bodies for signal transmission 201,202. It is a figure which shows the difference in the characteristic by the magnitude | size of the height (thickness) dimension c of the outer conductor 11 of the communication bodies 201 and 202 for signal transmission. It is a figure which shows the characteristic change by the change of the thickness dimension d of the outer dielectric layer 14 of the two communication bodies 201 and 202 for signal transmission. It is a figure which shows the characteristic change by the relative positional relationship of the two communication bodies 201 and 202 for signal transmission shown in FIG. FIG. 10A is a cross-sectional view of a signal transmission communication body 203 according to the third embodiment, and FIG. 10B is a bottom view thereof. 11A is a perspective view of the signal transmission communication body 204 according to the fourth embodiment, FIG. 11B is a top view thereof, and FIG. 11C is a front view thereof. It is a perspective view of the coupler 302 which concerns on 5th Embodiment. It is a perspective view of coupler 303 concerning a 6th embodiment.

<< First Embodiment >>
2A is a perspective view of the signal transmission communication body according to the first embodiment, FIG. 2B is a top view thereof, and FIG. 2C is a cross-sectional view taken along line AA in FIG. 2B. FIG. 2D is a bottom view of the signal transmission communication body 201.

  This signal transmission communication body 201 includes a disk-shaped outer conductor 11 having a rotary trapezoidal cavity TCV therein. The signal transmission communication body 201 includes a rotary trapezoidal inner conductor 12 disposed in an insulated state from the outer conductor 11 in the rotary trapezoidal cavity TCV of the outer conductor 11. The central axis of the rotary trapezoidal inner conductor 12 and the rotary trapezoidal cavity TCV coincide with each other. A lower bottom surface (a plane having a larger area) of the rotary trapezoidal inner conductor 12 coincides with a first main surface of the outer conductor 11 (upper surface in the direction of FIG. 2A). That is, they share the same surface. In addition to the region occupied by the inner conductor 12 in the rotary trapezoidal cavity TCV of the outer conductor 11, an inner dielectric layer 13 is provided. That is, the space between the outer conductor 11 and the inner conductor 12 is filled with the inner dielectric layer 13. An outer dielectric layer 14 is provided on the first main surface side of the outer conductor 11.

  The outer conductor 11, the inner conductor 12, and the inner dielectric layer 13 have a structure in which the inner diameter of the outer conductor (the outer diameter of the rotary trapezoidal cavity TCV) and the outer diameter of the inner conductor gradually change while maintaining the coaxial line structure. ing.

  Here, the diameter of the lower bottom surface of the rotary trapezoidal cavity portion TCV is φLa, the diameter of the upper bottom surface (plane having a smaller area) of the rotary trapezoidal cavity portion TCV is φUa, the diameter of the lower bottom surface of the inner conductor 12 is φLb, When the diameter of the upper bottom surface of the conductor 12 is φUb and the heights of the outer conductor 11 and the inner conductor 12 are c, these have the following relationship.

φLa / φLb ≧ φUa / φUb
That is, when viewed along the common central axis of the rotary trapezoidal cavity TCV formed in the outer conductor 11 and the inner conductor 12, the ratio between the inner diameter of the outer conductor 11 and the outer diameter of the inner conductor 12 is constant. There is a greater change in the way the rotating trapezoidal cavity TCV spreads. That is, the rotary trapezoidal cavity portion TCV of the outer conductor and the inner conductor 12 are similar or substantially similar. For this reason, the diameter of the lower bottom surface (upper surface in FIG. 3) of the rotary trapezoidal cavity TCV of the outer conductor can be greatly increased, and the characteristic impedance of the coaxial line does not change abruptly. In addition, stable characteristics of reflection characteristics can be obtained.

There is also the following relationship.
φLb / c ≦ 4
That is, the ratio (that is, the shape ratio) of the diameter φLb of the lower bottom surface to the height c of the inner conductor 12 is about 4 or less. With this structure, as shown in a specific example in the second embodiment, a frequency band with low reflection and good transmission characteristics can be defined.
Note that φLa / c ≦ 4, that is, the ratio of the diameter φLa of the bottom surface to the height c of the rotary trapezoidal cavity TCV of the outer conductor 11 may be about 4 or less. Even in such a case, it is possible to adjust a frequency band with low reflection and good transmission characteristics.
FIG. 3 is an enlarged view of a central portion in the cross-sectional view of the signal transmission communication body 201 shown in FIG. The dimensions of each part in the figure are as follows, for example.

φLa = 5.0mm
φLb = 2.0mm
φUa = 1.1mm
φUb = 0.5mm
d = 0.3mm
c = 1.0mm
e = 0.1mm
The inner dielectric layer 13 and the outer dielectric layer 14 are each a dielectric having a relative dielectric constant of 2.2 (for example, a fluorine resin material or polyethylene).

  As shown in FIG. 3, in the portion indicated by the thickness dimension e, the diameter of the rotary trapezoidal cavity TCV (the inner diameter of the outer conductor 11) and the outer diameter dimension of the inner conductor 12 are constant and act as a coaxial line. The opening formed by the rotary trapezoidal cavity TCV of the outer conductor 11 has a very acute angle at the position of the second main surface (the lower surface in the direction of FIG. 3), and processing and subsequent handling becomes difficult. 11 has a portion with a constant inner diameter and an outer diameter of the inner conductor 12.

  The second main surface of the outer conductor 11 is used as a signal input / output unit of a coaxial line system. The outer surface of the external dielectric layer 14 is used as an input / output surface for communication electromagnetic waves.

<< Second Embodiment >>
The configurations of the signal transmission communication body and the coupler according to the second embodiment will be described with reference to FIGS.
FIG. 4 is a perspective view of a coupler 301 according to the second embodiment. The coupler 301 includes a first signal transmission communication body 201 and a second signal transmission communication body 202. The configurations of the first signal transmission communication body 201 and the second signal transmission communication body 202 are the same as those shown in FIGS. 2 and 3 as the first embodiment. However, in the example illustrated in FIG. 4, the outer diameter of the outer conductor 11 of the second signal transmission communication body 202 is configured to be smaller than the outer diameter of the outer conductor 11 of the second signal transmission communication body 201. In the second embodiment, reference is made to FIG. 3 for symbols indicating the dimensions of the respective parts.

  The second signal transmission communication body 202 is close to the first signal transmission communication body 201 such that the outer dielectric layer 14 faces the outer dielectric layer 14 of the first signal transmission communication body 201. Is done.

  In FIG. 4, the central axis of the second signal transmission communication body 202 is shifted from the Z axis (center axis) of the first signal transmission communication body 201 by dr along the XY plane. Further, the outer surface of the outer dielectric layer 14 of the second signal transmission communication body 202 and the outer surface of the outer dielectric layer 14 of the first signal transmission communication body 201 are generated by a distance dz.

  A TEM mode signal propagates to the first signal transmission communication body 201 and the second signal transmission communication body 202 in the same manner as the coaxial cable. On the other hand, when the first signal transmission communication body 201 and the second signal transmission communication body 202 face each other, a parallel plate structure is formed by the respective outer conductors 11-11. Mode electromagnetic field propagates. Therefore, the signal transmission modes are converted by the two signal transmission communication bodies 201 and 202 in the order of TEM mode → parallel plate mode → TEM mode, and the signal is transmitted. This acts as a coupler that performs communication in the proximity state.

  FIG. 5 is a diagram illustrating a difference in characteristics depending on the diameter φLb of the bottom surface of the inner conductor 12 of the two signal transmission communication bodies 201 and 202. FIG. 5A shows reflection characteristics in a frequency range (50 GHz to 70 GHz) including a use frequency band using the diameter φLb as a parameter. FIG. 5B shows a use frequency band using the diameter φLb as a parameter. It is a transmission characteristic in a frequency range (50 GHz to 70 GHz) including. In any case, the diameter of the bottom surface of the rotary trapezoidal cavity TCV is a value proportional to the diameter φLb of the bottom surface of the inner conductor, and the other dimensions are the values shown in the first embodiment. Further, the horizontal shift dr shown in FIG. 4 is 0, and the gap dz is 0.

  As shown in FIG. 5A, it can be seen that the frequency at which reflection is lowest tends to increase as the diameter φLb of the bottom surface of the inner conductor 12 decreases. Further, as shown in FIG. 5B, it can be seen that the peak frequency of transmission characteristics (the frequency with the lowest insertion loss) increases as the diameter φLb of the lower bottom surface decreases. Accordingly, the diameter φLb of the bottom surface of the inner conductor 12 may be determined according to the frequency band to be used.

  FIG. 6 is a diagram showing a difference in characteristics depending on the diameter φLa of the bottom surface of the rotary trapezoidal cavity TCV of the two signal transmission communication bodies 201 and 202. 6A shows reflection characteristics in a frequency range (50 GHz to 70 GHz) including a use frequency band using the diameter φLa as a parameter, and FIG. 6B shows a use frequency band using the diameter φLa as a parameter. It is a transmission characteristic in a frequency range (50 GHz to 70 GHz) including. In any case, the diameter of the lower bottom surface of the inner conductor 12 is a value proportional to the diameter φLa of the rotary trapezoidal cavity TCV, and the other dimensions are the values shown in the first embodiment. Further, the horizontal shift dr shown in FIG. 4 is 0, and the gap dz is 0.

  As shown in FIG. 6A, it can be seen that the frequency at which the reflection is lowest tends to increase as the diameter φLa of the lower bottom surface of the rotary trapezoidal cavity TCV decreases. Further, as shown in FIG. 6B, it can be seen that the peak frequency of transmission characteristics (the frequency with the lowest insertion loss) increases as the diameter φLa of the lower bottom surface decreases. Therefore, the diameter φLa of the bottom surface of the rotary trapezoidal cavity TCV may be determined according to the frequency band to be used.

  FIG. 7 is a diagram showing a difference in characteristics depending on the height (thickness) dimension c of the outer conductor 11 of the signal transmission communication bodies 201 and 202. FIG. 7A shows reflection characteristics in a frequency range (50 GHz to 70 GHz) including a used frequency band with the height dimension c as a parameter, and FIG. 7B similarly uses the height dimension c as a parameter. It is a transmission characteristic in a frequency range (50 GHz to 70 GHz) including a use frequency band. In both cases, the horizontal shift dr shown in FIG. 4 is 0, and the gap dz is 1 mm.

  As shown in FIG. 7A, it can be seen that the higher the height dimension c, the lower the frequency band where reflection loss is lowest. Further, as shown in FIG. 7B, it can be seen that the frequency at which the transmission loss becomes the lowest decreases as the height dimension c increases.

  In this way, by appropriately designing the diameter of the bottom surface of the inner conductor 12 and the height c of the outer conductor 11, a coupler having low reflection characteristics and low insertion loss characteristics can be configured in the operating frequency band.

  FIG. 8 is a diagram showing a change in characteristics due to a change in the thickness dimension d of the outer dielectric layer 14 of the two signal transmission communication bodies 201 and 202. FIG. 8A shows reflection characteristics in a frequency range (50 GHz to 70 GHz) including a use frequency band with the thickness dimension d as a parameter, and FIG. 8B shows a use frequency with the thickness dimension d as a parameter. It is a transmission characteristic in a frequency range (50 GHz to 70 GHz) including a band.

  As shown in FIG. 8A, the frequency at which the low reflection characteristic is obtained decreases as the thickness dimension d of the outer dielectric layer 14 increases. However, if it is too thick (in this example, d = 0.7 mm), a surface wave is generated in the outer dielectric layer 14 portion, so that the reflection characteristics are disturbed.

  As shown in FIG. 8B, it can be seen that the frequency at which the transmission loss is lowest decreases as the thickness d is increased.

  Therefore, by appropriately determining the thickness dimension d of the external dielectric layer 14 within a range where no surface wave is generated in the external dielectric layer 14, a coupler having low reflection characteristics and low insertion loss characteristics can be configured at the operating frequency. In the example shown in FIGS. 8A and 8B, the operating frequency is 60 GHz, the wavelength is 2 to 3.5 mm in the outer dielectric layer 14, and d = 0.5 mm or less and low reflection characteristics. Low insertion loss characteristics are obtained. Accordingly, the thickness d of the external dielectric layer 14 may be a frequency used for communication, which is a wavelength within the external dielectric layer and thinner than a dimension corresponding to about 0.2 wavelength.

  FIG. 9 is a diagram illustrating a characteristic change due to a relative positional relationship between the two signal transmission communication bodies 201 and 202 illustrated in FIG. 4. FIG. 9A is a diagram showing the transmission characteristics using the gap dimension dz between the two signal transmission communication bodies 201-202 as a parameter. FIG. 9B is a diagram showing transmission characteristics using the horizontal shift dr between the central axes between the two signal transmission communication bodies 201-202 as a parameter.

  9A shows characteristics when the horizontal shift dr between the central axes of the signal transmission communication bodies 201-202 is 0, and FIG. 9B shows two signal transmission communication bodies 201-202. This is the characteristic when the gap dimension dz is 1 mm.

  As shown in FIG. 9A, it can be seen that when the gap dz is 0 mm or 1 mm, a transmission characteristic of −5 dB can be obtained over a wide frequency band (50 to 70 GHz). It can also be seen that if the gap dz exceeds 2 mm, the transmission characteristics deteriorate rapidly. In this example, a coupler capable of communicating between two signal transmission communicators close to each other within 1 mm is configured. When the distance is 5 mm or more, the signal transmission communication bodies do not affect each other.

  As shown in FIG. 9B, the transmission characteristics decrease as the radial shift dr increases. In this example, dr is 10 mm equal to the diameter of the lower bottom surface of the rotary trapezoidal cavity TCV formed on the outer conductors of the two signal transmission communication bodies 201 and 202, and the transmission characteristic is −20 dB. However, even if such a large deviation occurs, flat characteristics are maintained over a wide frequency band. Therefore, it can be seen that communication is possible if the bottom surfaces of the rotary trapezoidal cavity TCV formed in the outer conductors of the two signal transmission communication bodies 201 and 202 are even slightly opposed to each other.

<< Third Embodiment >>
FIG. 10A is a cross-sectional view of a signal transmission communication body 203 according to the third embodiment. FIG. 10B is a bottom view thereof.
The signal transmission communication body 203 is provided with a signal input / output unit with respect to the signal transmission communication body 201 shown in FIGS. An outer conductor 11, an inner conductor 12, an inner dielectric layer 13, and an outer dielectric layer 14 are provided in the main part of the signal transmission communication body 203. These portions are the same as those shown in the signal transmission communication body 201 shown in FIG.

  A dielectric substrate 20 is provided on the lower surface of the plate-like outer conductor 11. On the upper surface (the side in contact with the outer conductor 11) of the dielectric substrate 20, an upper surface ground conductor 21 is formed in a portion in contact with the outer conductor 11. A center conductor 22 and a lower surface ground conductor 23 are formed on the lower surface of the dielectric substrate 20 as shown in FIG.

  Inside the dielectric substrate 20, an inner conductor via 26 is formed to conduct between the end of the inner conductor 12 and the end of the center conductor 22. Further, outer conductor vias 25 are formed so as to energize between the lower surface ground conductor 23 and the upper surface ground conductor 21 so as to surround the center conductor 22. An equivalent coaxial line is constituted by the inner conductor via 26 and the outer conductor via 25 which are formed inside the dielectric substrate 20.

  The center conductor 22, the lower surface ground conductor 23, and the upper surface ground conductor 21 constitute a grounded coplanar line. Therefore, line conversion between a grounded coplanar line and a coaxial line is performed by the various conductor patterns formed on the dielectric substrate 20, and a grounded coplanar between the high frequency circuit of an electronic device using the signal transmission communication body 203 is used. It can be connected by a track.

  If the lower surface ground conductor 23 is not provided, the upper surface ground conductor 21 and the center conductor 22 in FIG. 10 constitute a microstrip line. Therefore, it is possible to connect the high frequency circuit with a microstrip line.

  In this way, the dielectric substrate can be made thin together with the main part of the signal transmission communication body constituted by the outer conductor 11, the inner conductor 12, the inner dielectric layer 13, and the outer dielectric layer 14, so that A flat signal transmission communication body 203 can be configured.

<< Fourth Embodiment >>
11A is a perspective view of the signal transmission communication body 204 according to the fourth embodiment, FIG. 11B is a top view thereof, and FIG. 11C is a front view thereof.
The signal transmission communication body according to the fourth embodiment is constituted by a multilayer substrate. The multilayer substrate 30 is obtained by laminating and firing a plurality of ceramic green sheets on which conductors and vias having a predetermined pattern are formed. Each layer is formed with an outer conductor 31 except for a circular region. However, the diameter of the circular portion varies depending on the position of the number of layers. It should be noted that the outer conductor 31 is provided with a circular opening rather than having an opening in the dielectric portion of the ceramic green sheet. In addition, an outer conductor via 35 is formed to connect the outer conductors 31 adjacent to each other in the thickness direction. With this structure, an outer conductor having a “rotary trapezoidal cavity” as a whole is configured.

  Similarly, inner conductors 32 having a circular pattern are formed in each of the plurality of layers of the multilayer substrate 30, and inner conductor vias 36 are formed to connect the inner conductors 32 adjacent in the thickness direction. With this structure, a rotary trapezoidal inner conductor is formed.

  In FIG. 11C, the “rotating trapezoidal cavity” and the rotating trapezoidal inner conductor are formed in the layer region DW of the multilayer substrate 30. Further, as shown in FIG. 11C, an external dielectric layer is formed in the vicinity of the surface of the multilayer substrate 30 with a layer region ED of only a dielectric layer having a predetermined thickness. Furthermore, as shown in FIG. 11C, the layer region CW near the lower surface of the multilayer substrate 30 includes an inner conductor having an inner diameter equal to the narrowest inner diameter of the “rotary trapezoidal cavity”, and the rotary table. An outer conductor having an outer diameter equal to the narrowest outer diameter of the shaped inner conductor is formed. This layer region CW acts as a coaxial line.

  A microstrip line or a grounded coplanar line for inputting / outputting signals to / from the coaxial line portion formed in the layer region CW may be formed in the multilayer substrate 30.

<< Fifth Embodiment >>
FIG. 12 is a perspective view of a coupler 302 according to the fifth embodiment. The coupler 302 includes a signal transmission communication body 210 and a signal transmission communication body 201. A signal transmission communication body 211, 212, 213, 214 is configured in the signal transmission communication body 210.

  An assembly 210 of signal transmission communication bodies is generally configured by laminating a plate-like outer conductor 11 and a dielectric substrate 20. The configuration of each of the signal transmission communication bodies 211 to 214 is the same as that of the signal transmission communication body 203 shown in FIG.

  An upper surface ground conductor is formed in a portion in contact with the outer conductor 11 on the upper surface (the side in contact with the outer conductor 11) of the dielectric substrate 20. A line conductor 24 is formed on the lower surface of the dielectric substrate 20 in the figure, and the line conductor 24 and the upper surface ground conductor constitute a microstrip line.

  The line conductor 24 is branched as shown in FIG. 12 and is electrically connected to the inner conductors of the signal transmission communication bodies 211 to 214. Thereby, power is supplied to each of the communication bodies 211 to 214 for signal transmission.

  On the other hand, the structure of the signal transmission communication body 201 is the same as that of the signal transmission communication body shown in FIGS. When the signal transmission communicator 201 comes close to the signal transmission communicator aggregate 210 in a face-to-face state, communication is performed between the two. Depending on the position in the horizontal plane parallel to the XY plane of the signal transmission communicator 201 with respect to the signal transmission communicator aggregate 210, the degree of coupling between them changes, and the amount of transmission and reflection changes. The arrangement pitch of the communication bodies for signal transmission 211 to 214 is determined so as to be within a predetermined range of transmission and reflection at any position.

<< Sixth Embodiment >>
FIG. 13 is a perspective view of a coupler 303 according to the sixth embodiment. The coupler 303 includes an assembly 220 of signal transmission communication bodies and a signal transmission communication body 201. The signal transmission communication bodies 221, 222, 223, and 224 are configured in the signal transmission communication body 220.

  The assembly 220 of signal transmission communication bodies is generally configured by laminating a plate-like outer conductor 11 and a dielectric substrate 20. The configuration of each of the signal transmission communication bodies 221 to 224 is the same as that of the signal transmission communication body 203 shown in FIG. Also, the arrangement pattern of the signal transmission communication bodies 221 to 224 is different from the example shown in FIG.

  An upper surface ground conductor is formed in a portion in contact with the outer conductor 11 on the upper surface (the side in contact with the outer conductor 11) of the dielectric substrate 20. A line conductor 24 is formed on the lower surface of the dielectric substrate 20 in the figure, and the line conductor 24 and the upper surface ground conductor constitute a microstrip line.

  The line conductor 24 is branched as shown in FIG. 13 and is conducted to the inner conductors of the signal transmission communication bodies 221 to 224. Accordingly, power is supplied to each of the signal transmission communication bodies 221 to 224.

  The structure of the signal transmission communication body 201 is the same as that of the signal transmission communication body shown in FIGS. When the signal transmission communication body 201 comes close to the signal transmission communication body 220 in a face-to-face state, communication is performed between the two. As in the case of the coupler shown in FIG. 12, the degree of coupling between the two is dependent on the position in the horizontal plane parallel to the XY plane of the signal transmission communication body 201 with respect to the signal transmission communication body 220. The amount of transmission and reflection changes. Accordingly, the arrangement pitch of the communication bodies for signal transmission 221 to 224 is determined in advance so as to be within a predetermined range of transmission amount / reflection amount at any position.

  In both cases of the fifth embodiment and the sixth embodiment, if the arrangement pitch of two adjacent signal transmission communication bodies is a half wavelength, the signal transmission communication body is positioned at an intermediate position between the two signal transmission communication bodies. When the signal transmission communication body on the other side faces, the coupling amount becomes 0. Therefore, the arrangement pitch of the signal transmission communication bodies 211 to 214 may be arranged at a half wavelength or more.

  In both cases of the fifth embodiment and the sixth embodiment, when one of the signal transmission communication bodies facing each other is the transmission side, the other is the reception side. Both the transmission side and the reception side The signal transmission communication body may be an aggregate of a plurality of signal transmission communication bodies.

  Further, in each of the embodiments described above, the example in which both the rotary trapezoidal inner conductor and the rotary trapezoidal cavity are frustoconical has been shown. However, the rotation with the straight line perpendicular to the first main surface as the rotation center axis is shown. The surface does not necessarily have to be a conical side.

  That is, if the impedance is gradually converted by changing the cross-sectional shape of the rotary trapezoidal inner conductor 12 and the rotary trapezoidal cavity TCV so that impedance matching can be achieved between the coaxial input / output portion and the bottom bottom of the rotary trapezoid. Therefore, the rotation surface does not necessarily have to be a conical side surface, and may be, for example, a curved horn shape.

DESCRIPTION OF SYMBOLS 11 ... Outer conductor 12 ... Inner conductor 13 ... Inner dielectric layer 14 ... Outer dielectric layer 20 ... Dielectric substrate 21 ... Upper surface ground conductor 22 ... Center conductor 23 ... Lower surface ground conductor 24 ... Line conductor 25 ... Outer conductor via 26 ... inner conductor via 30 ... multilayer substrate 31 ... outer conductor 32 ... inner conductor 35 ... outer conductor via 36 ... inner conductor vias 201, 202, 203, 204 ... signal transmission communication body 210,220 ... signal transmission communication Aggregation of bodies 211, 212, 213, 214 ... Communications for signal transmission 221,222,223,224 ... Communications for signal transmission 301,302,303 ... Coupler TCV ... Turn trapezoidal cavity

Claims (6)

An outer conductor having a first main surface and a second main surface parallel to each other and having a cavity therein; an inner conductor disposed in an insulated state in the cavity; and in the cavity An inner dielectric layer filled in a region other than the region occupied by the inner conductor, and an outer dielectric layer disposed on the first main surface side of the outer conductor,
The hollow portion has a rotation surface with a straight line perpendicular to the first main surface as a rotation center axis as a side surface, the first main surface as a lower bottom surface, and the second main surface as an upper bottom surface having a smaller diameter than the lower bottom surface. And a rotating trapezoid shape
The inner conductor has a rotary trapezoidal shape in which a rotation surface having the straight line as a rotation center axis is a side surface, the first main surface is a lower bottom surface, and the second main surface is an upper bottom surface having a smaller diameter than the lower bottom surface. ,
A signal transmission communication body in which an outer surface of the outer dielectric layer is an input / output surface for electromagnetic waves for communication, and a position corresponding to the upper and lower surfaces of the inner conductor is a signal input / output unit.   The ratio of the diameter of the bottom surface to the height of the inner conductor is 4 or less, or the ratio of the diameter of the bottom surface of the rotating trapezoidal cavity to the height of the rotating trapezoidal cavity is 4 or less. Item 4. The communication body for signal transmission according to Item 1.   3. The signal transmission communication body according to claim 1, wherein a thickness of the external dielectric layer is a frequency used for communication and is thinner than a dimension corresponding to about 0.2 wavelength. 4.   The inner conductor and the outer conductor are composed of conductors formed on a plurality of layers of a multilayer substrate, and the inner dielectric layer is composed of a dielectric layer of the multilayer substrate. The communication body for signal transmission described.   5. A coupler comprising at least one communication body for signal transmission according to claim 1 on each of a transmission side and a reception side, wherein the bottom surfaces of the outer conductor and the inner conductor face each other.   The coupler according to claim 5, wherein at least one of the signal transmission communication bodies on the transmission side or the reception side is arranged at three or more at a pitch of approximately half wavelength or more.

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