JP2010204080A - Testing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To miniaturize a testing apparatus without reducing throughput. <P>SOLUTION: The testing apparatus for testing a plurality of devices to be tested and formed on a semiconductor wafer 101 includes: a probe card 300 having a plurality of contact points to be connected to contact points of the devices, respectively, on a connecting surface placed over the semiconductor wafer and corresponding to the rear surface of the connecting surface; and a testing head for testing the devices on the semiconductor wafer, by sequentially connecting with some of the contact points of the probe card. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a test apparatus and a test method.

  Patent Document 1 below describes an inspection apparatus that collectively inspects a plurality of semiconductor integrated circuits formed on a single wafer. This shortens the inspection time per wafer and improves productivity.

JP 2006-278949 A

  As the degree of integration increases and the size of the substrate increases, the scale of the test object when testing in units of substrates is also increasing. On the other hand, if the same number of test circuits and contact terminals as the number of semiconductor integrated circuits are provided, the scale of the test apparatus also increases. For this reason, the test apparatus is large and expensive, which affects the manufacturing cost of the semiconductor device.

  In order to solve the above problems, as a first aspect of the present invention, there is provided a test apparatus for testing a plurality of devices under test formed on a semiconductor wafer, wherein a plurality of devices under test are formed on a connection surface superimposed on the semiconductor wafer. A probe card connected to each contact of the device and provided with a plurality of contacts corresponding to the back surface of the connection surface, and a plurality of contacts on the semiconductor card by sequentially connecting to a part of the plurality of contacts of the probe card. And a test head for testing a device under test.

  According to a second aspect of the present invention, there is provided a test method for testing a plurality of devices under test formed on a semiconductor wafer, each having contact points of the plurality of devices under test on connection surfaces superimposed on the semiconductor wafer. By preparing a probe card that is connected and provided with a plurality of contacts corresponding to the back surface of the connection surface, and sequentially connecting a test head to each of the plurality of contacts of the probe card, A test method comprising: testing a plurality of devices under test.

  The above summary of the present invention does not enumerate all necessary features of the present invention. Also, a sub-combination of these feature groups can be an invention.

1 is a front view of a test apparatus 100. FIG. 1 is a partial longitudinal sectional view of a test apparatus 100. FIG. 2 is a partial horizontal sectional view of the test apparatus 100. FIG. 4 is a partial longitudinal sectional view of alignment unit 400. FIG. 2 is a cross-sectional view of a test head 200. FIG. 2 is an exploded view of a probe card 300. FIG. 4 is a partially enlarged sectional view of a membrane unit 370. FIG. It is a partial expanded sectional view of PCR sheet | seats 340 and 360. FIG. 3 is a partial cross-sectional view of an interposer 350. FIG. 3 is a plan view of a wiring board 320. FIG. 3 is a plan view of a wiring board 320. FIG. 2 is a partially exploded perspective view of a contactor 202. FIG. It is an expanded sectional view of the contactor 202. FIG. It is a figure which shows the signal arrangement | sequence in the contactor housing 280. FIG. 2 is a cross-sectional view of a test head 200 and a probe card 300. FIG. 2 is a cross-sectional view of a test head 200 and a probe card 300. FIG. 3 is a plan view showing a test execution area 103. FIG. 3 is a plan view showing a test execution area 103. FIG.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a front view showing the entire test apparatus 100. The test apparatus 100 includes an EFEM 110, an operation unit 120, a load unit 130, and a chiller 140.

  The EFEM 110 incorporates a mechanism for transporting a substrate to be tested inside the test apparatus 100. Since the EFEM 110 has the largest dimension among the test apparatuses 100, the signal lamp 112 indicating the operation state of the test apparatus 100 and the EMO 114 operated when the test apparatus 100 is emergency stopped are arranged at a high position on the front surface of the EFEM 110. The

  The operation unit 120 is also supported by the EFEM 110. The operation unit 120 includes a display 122, an arm 124, and an input device 126. One end of the arm 124 is coupled to the EFEM 110 and the other end of the arm 124 supports the display 122 and the input device 126 movably.

  The display 122 includes, for example, a liquid crystal display device and the like, and displays the operation state of the test apparatus 100, echo back of the input content from the input device 126, and the like. The input device 126 may include a keyboard, a mouse, a trackball, a jog tire, and the like, and accepts settings, operations, and the like of the test apparatus 100.

  The load unit 130 includes a load table 132 and a load gate 134. On the load table 132, a container that contains a semiconductor wafer to be tested is placed. The load gate 134 opens and closes when the semiconductor wafer is loaded into or unloaded from the test apparatus 100. Thereby, the semiconductor wafer can be loaded from the outside without reducing the cleanliness inside the test apparatus 100.

  The chiller 140 supplies the cooled refrigerant when the wafer whose temperature has been raised by the test operation in the test apparatus 100 is cooled before unloading. For this reason, the chiller 140 has a heat exchanger and is arranged in the vicinity of the test head that performs the test. The chiller 140 is often used for the purpose of cooling the refrigerant. However, it may be used to heat the heat medium for the purpose of supplying a heat source for heating. In addition, when a supply source of a cooled or heated heat medium is separately prepared outside the test apparatus 100, the chiller 140 may be omitted from the test apparatus 100.

  FIG. 2 is a partial longitudinal sectional view of the test apparatus 100. Elements that are the same as those in FIG. 1 are given the same reference numerals, and redundant descriptions are omitted. The test apparatus 100 includes a load unit 130, an EFEM 110, a main frame 160, an alignment unit 400, a probe card 300, and a test head 200. In this figure, the chiller 140 is not shown.

  In the test apparatus 100, a load unit 130, an EFEM 110, and a main frame 160 are sequentially arranged adjacently from the front surface (left side in the figure) to the rear side (right side in the figure). The alignment unit 400, the probe card 300, and the test head 200 are stacked on the main frame 160.

  A FOUP 150 is placed on the load table 132 of the load unit 130. The FOUP 150 stores a plurality of wafers 101 to be tested. Further, when the wafer 101 after the test is collected, the wafer is stored in the FOUP 150.

  The EFEM 110 incorporates a robot arm 116. The robot arm 116 is mounted on a column 117 that travels along the rail 115, and conveys the wafer between the load unit 130 and the alignment unit 400. For this reason, the load unit 130 and the EFEM 110 and the alignment unit 400 and the EFEM 110 communicate with each other in an airtight manner, and the inside thereof is kept highly clean.

  The main frame 160 controls the overall operation of the test apparatus 100. For example, it is connected to the operation unit 120, receives an input from the input device 126, and reflects it on each unit of the test apparatus 100. Further, display contents reflecting the operation state of the test apparatus 100 are generated and displayed on the display 122.

  Further, the main frame 160 synchronizes the operations of the load unit 130, the EFEM 110, and the alignment unit 400 to transfer the wafer 101 to each other. Further, when the EMO 114 is operated, the operation of each part of the test apparatus 100 is immediately stopped. Since these operations are required regardless of the type of wafer 101 to be tested and the content of the test, the main frame 160 is constantly installed in the test apparatus 100.

  The alignment unit 400 includes an alignment stage 410. In other words, by replacing the probe card 300, the test apparatus 100 can correspond to the wafer 101 having a different layout.

  The alignment stage 410 travels along the rail 402 with the wafer tray 450 and the wafer 101 mounted thereon. In addition, the alignment stage 410 can expand and contract in the vertical direction to raise or lower the mounted wafer 101. Thereby, after aligning the wafer 101 with respect to the probe card 300, the wafer 101 is pressed against the upper probe card 300.

  The probe card 300 is interposed between the test head 200 and the wafer 101 and electrically connects the test head 200 and the wafer 101 when the test apparatus 100 executes a test. As a result, an electrical signal path is formed between the test head 200 and the wafer 101.

  The test head 200 stores a plurality of pin electronics 210. The pin electronics 210 is mounted with an electric circuit required according to the test target and the content of the test. In other words, the test head 200 is electrically connected to the probe card 300 via the contactor 202 attached to the lower surface.

  In the test apparatus 100 as described above, the wafer 101 to be tested is mounted on the load table 132 while being accommodated in the FOUP 150. The robot arm 116 takes out the wafers 101 one by one through the load gate 134 and conveys them to the alignment unit 400.

  In alignment unit 400, wafer 101 is mounted on wafer tray 450 on alignment stage 410. The alignment stage 410 aligns the mounted wafer 101 with the probe card 300 and then presses it against the probe card 300 from below. Subsequent operations will be described later.

  FIG. 3 is a partial horizontal sectional view of the test apparatus 100. Elements common to those in FIGS. 1 and 2 are denoted by the same reference numerals, and redundant description is omitted. The test apparatus 100 includes four load units 130 and four test heads 200. Each load unit 130 is loaded with a FOUP 150.

  One EFEM 110 and one alignment unit 400 are arranged. The alignment unit 400 includes a single alignment stage 410.

  In the EFEM 110, the column 117 that supports the robot arm 116 moves along the rail 115 over substantially the entire width of the EFEM 110. Therefore, the robot arm 116 can transfer the wafer 101 to all of the four load units 130 and the four test heads.

  A pre-aligner 118 is disposed at the end of the EFEM 110 opposite to the chiller 140. The pre-aligner 118 adjusts the mounting position of the wafer 101 with respect to the robot arm 116 with a considerably higher accuracy than the accuracy required by the test head 200.

  Thereby, the initial position accuracy when the robot arm 116 mounts the wafer 101 on the wafer tray 450 is improved, and the time required for alignment with the probe card 300 is shortened. In addition, the throughput of the test apparatus 100 can be improved.

  The alignment unit 400 includes rails 402 and 422, a stage carrier 420, an alignment stage 410 and a microscope 430. The rail 402 is disposed over substantially the entire width of the bottom surface of the housing 401. The stage carrier 420 moves in the longitudinal direction of the housing 401 along the rail 402.

  The stage carrier 420 has a rail 422 that goes directly to the rail 402 of the housing 401 on the upper surface. The alignment stage 410 moves on the rail 422 in the lateral direction of the housing 401.

  A part of the microscope 430 is arranged in the vicinity of each of the probe cards 300 corresponding to each of the test heads 200. These microscopes 430 are arranged downward on the ceiling surface of the housing 401.

  A pair of microscopes 430 are mounted on the stage carrier 420 together with the alignment stage 410. The pair of microscopes 430 moves together with the alignment stage 410. These microscopes 430 are arranged upward.

  By using these microscopes 430, the wafer 101 on the alignment stage 410 can be aligned with the probe card 300. That is, at the stage of being mounted on the alignment stage 410, the position of the wafer 101 is positioned with the accuracy of pre-alignment. Therefore, the position of the wafer 101 can be accurately detected by detecting, for example, the edge of the wafer 101 with the microscope 430 facing downward.

  On the other hand, the relative position of the microscope arranged in the housing 401 with respect to the probe card 300 is known. As a result, the difference between the position of the wafer 101 and the position of the probe card 300 can be detected, and the alignment stage 410 can be moved so as to compensate for the difference, thereby aligning the wafer 101 and the probe card 300.

  The detection of the wafer 101 is not limited to the detection of the edge portion, and the image of the microscope 430 may be displayed on the display 122 and may be manually aligned. Further, the test apparatus 100 may automatically align the position with reference to the futuristic marks provided on the wafer tray 450 or the like.

  FIG. 4 is a partial longitudinal sectional view showing the structure of the alignment unit 400. Elements common to FIGS. 1 to 3 are given the same reference numerals, and redundant description is omitted. The alignment unit 400 includes a housing 401, an alignment stage 410, and a hanger hook 440.

  The casing 401 has a width corresponding to a plurality of test heads 200, for example, four test heads 200. In addition, four probe cards 300 are mounted on the upper surface of the housing 401 corresponding to each of the test heads 200. Further, on the ceiling surface inside the housing 401, hanger hooks 440 that are opened and closed are arranged at positions corresponding to the test heads 200, respectively.

  When closed, the hanger hook 440 hangs the wafer tray 450 and holds it directly under the probe card 300. When the hanger hook 440 is opened, the wafer tray 450 is opened. As a result, alignment unit 400 stands by wafer tray 450 immediately below each of test head 200 and probe card 300.

  The alignment stage 410 can be moved below any of the test heads 200 along the rail 402 disposed on the bottom surface of the housing 401. Further, the alignment stage 410 can expand and contract in the vertical direction to raise or lower the mounted wafer tray 450 and the like.

  In alignment unit 400 having the above-described structure, wafer tray 450 held on hanger hook 440 is once mounted alone on alignment stage 410 by raising alignment stage 410 from below. Subsequently, the wafer tray 450 is released from the hanger hook 440 by lowering the alignment stage 410 with the hanger hook 440 opened and opened.

  Further, the robot arm 116 of the EFEM 110 mounts the wafer 101 on the wafer tray 450 whose upper surface is opened by the lowering of the alignment stage 410. Thus, the alignment stage 410 can mount the wafer 101 in a state of being placed on the wafer tray 450.

  Next, the alignment stage 410 raises the wafer tray 450 and presses it against the lower surface of the probe card 300 while aligning the wafer 101 with the probe card 300. The probe card 300 sucks the pressed wafer tray 450 and wafer 101. The structure in which the probe card 300 sucks the wafer 101 and the wafer tray 450 will be described later.

  The alignment stage 410 moves leaving the wafer 101 and the wafer tray 450, and carries another wafer 101. In this way, the wafer 101 can be loaded into the test head 200.

  When the wafer 101 that has been tested is collected, the above series of operations may be executed in the reverse order. As a result, the wafer 101 can be unloaded by the robot arm 116 and the wafer tray 450 stands by just below the test head 200.

  In the illustrated example, the wafer tray 450 and the wafer 101 are adsorbed to the probe card 300 immediately below the right test head 200 in the drawing. The hanger hook 440 is closed but is not in contact with the wafer tray 450.

  Immediately below the second test head 200 from the right, the alignment stage 410 pushes up the mounted wafer tray 450 and wafer 101 so as to be in close contact with the lower surface of the probe card 300. Under the other test head 200, a hanger hook 440 holds the wafer tray 450 and stands by.

  As described above, the alignment unit 400 is equipped with the wafer tray 450 corresponding to each of the four test heads 200. Thereby, each of the test heads 200 can test the wafer 101 individually.

  Note that the plurality of test heads 200 may perform the same type of test, or may perform different types of tests. In the latter case, the throughput of the test apparatus 100 can be improved by causing a plurality of test heads to perform a time-consuming test.

  As described above, in the test apparatus 100, the single alignment stage 410 and the robot arm 116 are used for the plurality of test heads 200. As a result, it is possible to improve the utilization efficiency of the alignment stage 410 and the robot arm 116 that are not required during the test execution period.

  FIG. 5 is a cross-sectional view of the test head 200. Elements common to FIGS. 1 to 4 are denoted by the same reference numerals, and redundant description is omitted. The test head 200 includes a housing 201, a contactor 202, pin electronics 210, a motherboard 220, and a flat cable 230.

  Inside the housing 201, a mother board 220 having a plurality of relay connectors 224 is disposed horizontally. The relay connector 224 has receptacles on the upper surface side and the lower surface side of the mother board 220, respectively, and forms a signal path that penetrates the mother board 220.

  On the upper surface of the motherboard 220, the pin electronics 210 is attached to each of the relay connectors 224 via the angle connectors 222. With such a structure, the pin electronics 210 can be exchanged according to the specification of the test object and the test content.

  The plurality of pin electronics 210 may have the same specifications or different specifications. Further, the pin electronics 210 may not be attached to some relay connectors 224.

  On the lower surface of the motherboard 220, a small board 228 is connected to each relay connector 224 via an angle connector 226. One end of a flat cable 230 is connected to the small board 228. Thereby, the pin electronics 210 inside the housing 201 and the contactor 202 described later can be connected via the flat cable 230.

  A contactor 202 is attached to the lower surface of the housing 201. The contactor 202 includes a support substrate 240, a three-dimensional actuator 250, a contactor substrate 260, a sub substrate 270, and a contactor housing 280.

  The support substrate 240 has an upper surface fixed to the casing 201 and supports the upper end of the three-dimensional actuator 250 on the lower surface. The lower end of the three-dimensional actuator 250 supports the contactor substrate 260. Further, the sub-board 270 and the contactor housing 280 are fixed to the lower surface of the contactor board 260.

  The three-dimensional actuator 250 can move in the horizontal direction along the lower surface of the support substrate 240 and expands and contracts in the vertical direction. Thereby, the contactor substrate 260 can be moved three-dimensionally. When the contactor substrate 260 moves, the sub substrate 270 and the contactor housing 280 also move together with the contactor substrate 260.

  Note that the lower end of the flat cable 230 is coupled to a terminal, for example, a spring pin, held by the contactor housing 280. Thereby, the pin electronics 210 is electrically connected to the lowermost surface of the test head 200.

  FIG. 6 is an exploded view of the probe card 300. The probe card 300 includes a wiring board 320, PCR sheets 340 and 360, an interposer 350 and a membrane unit 370.

  The wiring substrate 320 is formed of an insulating substrate having a relatively high mechanical strength, for example, a polyimide plate. The peripheral portions of the wiring board 320 are stacked on each other and fastened by screws 316, and are sandwiched between a frame-shaped upper frame 312 and lower frame 314, respectively. Thereby, the mechanical strength of the wiring board 320 is further improved.

  Further, the wiring board 320 has a plurality of guide units 330 on the upper surface. The guide unit 330 guides and positions the contactor 202 when the contactor 202 contacts the wiring board 320.

  Further, a plurality of contact pads 323 that can obtain electrical connection by contact are disposed on the lower surface of the wiring board 320. The contact pad 323 is electrically connected to a contact pad (not shown) disposed inside the guide unit 330 on the upper surface of the wiring board 320.

  The PCR sheet 340 has a through electrode 341 penetrating the front and back. In addition, the through electrode 341 of the PCR sheet 340 has the same layout as the contact pad 323 on the lower surface of the wiring board 320. Thereby, when the wiring board 320 and the PCR sheet 340 are closely stacked, the contact pad 323 and the through electrode 341 are electrically connected to each other.

  Interposer 350 has contact pads 351 and 353 on the upper surface and the lower surface, respectively. The contact pad 351 on the upper surface has the same layout as the through electrode 341 of the PCR sheet 340. As a result, when the PCR sheet 340 and the interposer 350 are closely stacked, the through electrode 341 and the contact pad 351 are electrically connected to each other.

  The contact pad 353 on the lower surface of the interposer 350 has a different layout from the contact pad 351 on the upper surface. For this reason, the pitches of the contact pads 351 and 353 are different between the front and back sides of the interposer 350. However, the contact pad 353 on the lower surface has a corresponding contact pad 351 on the upper surface, and the corresponding contact pads 351 and 353 are electrically connected to each other.

  The PCR sheet 360 has a through electrode 361 penetrating the front and back. The through electrode 361 of the PCR sheet 360 has the same layout as the contact pad 353 on the lower surface of the interposer 350. Thereby, when the interposer 350 and the PCR sheet 360 are closely stacked, the contact pad 353 and the through electrode 361 are electrically connected to each other.

  The membrane unit 370 includes an elastic sheet 372, contact pads 371, bumps 373, and a frame 376. The elastic sheet 372 is formed of an insulating material having elasticity.

  The contact pad 371 is arranged on the upper surface of the elastic sheet 372 with the same layout as the through electrode 361 on the lower surface of the PCR sheet 360. Therefore, when the PCR sheet 340 and the membrane unit 370 are stacked closely, the through electrode 361 and the contact pad 371 are electrically connected to each other.

  The bump 373 is disposed on the lower surface of the elastic sheet 372. The frame 376 holds the elastic sheet 372 in a flat state by gripping the peripheral edge of the elastic sheet 372.

  Each of the PCR sheets 340 and 360, the interposer 350, and the membrane unit 370 has through holes 344, 354, 364, and 374 penetrating the front and back. The through holes 344, 354, 364, and 374 are laid out at substantially the same position. As a result, when the PCR sheets 340 and 360, the interposer 350 and the membrane unit 370 are stacked, the through holes 344, 354, 364 and 374 communicate with each other to assist the exhaust between the members.

  FIG. 7 is a partial enlarged cross-sectional view of the membrane unit 370. In the membrane unit 370, the bumps 373 are arranged in the same layout as the device pads used for the test in the circuit on the wafer 101 to be tested.

  The bumps 373 form a set including a plurality of bumps 373 corresponding to the individual circuits on the wafer 101, and the number of the sets is the same as the number of circuits on the wafer 101. Further, each of the bumps 373 has a shape with the center protruding downward. Thereby, the bump 373 functions as a probe terminal for the wafer 101 on the lowermost surface of the probe card 300.

  In addition, each of the bumps 373 is electrically connected to one of the contact pads 371 through a through hole 375 embedded in the elastic sheet 372. As already described, the contact pad 371 has the same layout as the through electrode 361 of the PCR sheet 360 and the contact pad 353 on the lower surface of the interposer 350. Therefore, when the membrane unit 370, the PCR sheet 360, and the interposer 350 are stacked on each other, an electrical connection from the bump 373 to the interposer 350 is formed.

  FIG. 8 is a partial enlarged cross-sectional view of the PCR sheets 340 and 360. The PCR sheets 340 and 360 have through electrodes 341 and 361, frames 342 and 362, and elastic support portions 343 and 363.

  The frames 342 and 362 are formed of a material having a relatively high rigidity such as metal, and have a plurality of through holes 346 and 366 having an inner diameter larger than the outer diameter of the through electrodes 341 and 361. Each of the through electrodes 341 and 361 is supported from the frame 362 via the elastic support portions 343 and 363 inside the through holes 346 and 366.

  The elastic support portions 343 and 363 are formed of a flexible material such as silicon rubber. The through electrodes 341 and 361 have a length larger than the thickness of the frame 362. As a result, when the PCR sheets 340 and 360 are sandwiched between the interposer 350 and the wiring substrate 320 or between the interposer 350 and the membrane unit 370, the unevenness of each member is absorbed and good electrical bonding is achieved. Form.

  FIG. 9 is a partial cross-sectional view of the interposer 350. The substrate 352 of the interposer 350 has a plurality of through holes 355 penetrating the substrate 352 on the front and back sides. Each of the through holes 355 is connected to the contact pads 351 and 353 through the wiring layer 357. Thereby, the contact pads 351 and 353 on the front and back of the substrate 352 are electrically connected.

  Further, since the wiring layer 357 is interposed between the through hole 355 and the contact pads 351 and 353, different layouts can be given to the contact pad 351 on the upper surface and the contact pad 353 on the rear surface. Therefore, even when the contact pads 353 on the lower surface of the interposer 350 are matched with the device pads of the wafer 101 to be tested, the contact pads 351 on the upper surface of the interposer 350 can be arbitrarily laid out.

  More specifically, since the device pads of the wafer 101 are built in an integrated circuit, each area and the pitch between the device pads are small. However, by adjusting the pitch P2 of the contact pads 353 on the lower surface of the interposer 350 to the device pad, and increasing the pitch P1 of the contact pads 351 on the upper surface of the interposer 350, the PCR sheet 340 and the wiring board stacked on the upper side of the interposer 350 In 320, the pitch between the through electrode 341 and the contact pad 323 can be increased.

  Thus, the pitch of the contact pads 321 arranged on the upper surface of the probe card 300 can be made wider than the bumps 373 of the spring pin membrane unit 370 of the contactor 202. Further, the area of the contact pad 321 can be made larger than that of the bump 373. Thereby, the connection between the contactor 202 and the probe card 300 may be facilitated.

  Further, by making the area of the contact pad 351 on the upper surface of the interposer 350 larger than the area of the contact pad 353 on the lower surface, the interposer 350, the PCR sheet 340 and the wiring board 320 can alleviate mutual positional accuracy requirements, and contact Electrical characteristics resulting from resistance and the like can also be improved.

  FIG. 10 is a plan view of the wiring board 320. The wiring board 320 has a rectangular planar shape slightly larger than the rectangle circumscribing the wafer 101 indicated by the dotted line. The stiffener 310 surrounds the outside of the wiring board 320. The stiffener 310 has a cross member 318 that crosses the wiring board 320.

  The cross member 318 is attached to the frame-shaped stiffener 310 with high rigidity. Thereby, the bending rigidity of the entire wiring board 320 integrated with the stiffener 310 is improved and the torsional rigidity is also increased. Accordingly, deformation such as warping of the wiring board 320 can be suppressed. Note that the entire stiffener 310 including the cross member 318 may be integrally formed from the beginning.

  A large number of guide units 330 are arranged in parallel with each other on the upper surface of the wiring board 320 between the stiffener 310 and the cross member 318. In addition, a plurality of contact pads on the upper surface of the wiring board 320 are gathered inside each guide unit 330 to form a pad group 324. Thus, the plurality of contact pads 321 of the probe card 300 may be formed by n sets of pad groups 324 having the same signal arrangement.

  The pad group 324 has the same arrangement. Each of the contact pads forming the pad group 324 is electrically connected to one of the contact pads 321 on the lower surface of the wiring board 320, but the signal arrangement for each contact pad is common among the pad groups 324. .

  As described above, the pad group 324 to be tested in one connection by the contactor 202 may be arranged corresponding to device pads having the same signal arrangement on the wafer 101. Thereby, an electrical connection can be formed in the pad group 324 using the contactor 202 having the same specification. In addition, one contactor 202 can be moved to form an electrical connection to the plurality of pad groups 324.

  The wiring board 320 has contact pads disposed also in a region overlapping with the wafer 101, and has an occupation area close to that of the wafer 101. Therefore, it contributes to miniaturization of the probe card 300 including the wiring board 320 and also contributes to space saving of the test apparatus 100.

  FIG. 11 is a plan view of a wiring board 320 in which the layout of the pad group 324 is different. Except for the points described below, it has the same structure as the wiring substrate 320 shown in FIG. Therefore, common elements are denoted by the same reference numerals, and redundant description is omitted.

  A plurality of guide units 330 are arranged on the wiring board 320, and a pad group 324 is arranged inside each guide unit 330. However, in this wiring board 320, the number of pad groups 324 arranged differs depending on the guide unit 330.

  That is, for example, when the number of device pads on the wafer 101 to be tested by the test apparatus 100 is small, the number of contact pads 321 in the probe card 300 may be reduced. Thereby, the cost of the probe card 300 can be suppressed and the cost for the test can be reduced. Also, the load on the test apparatus 100 can be reduced.

  FIG. 12 is a partially exploded perspective view of the contactor 202. The contactor 202 has a sub-board 270 and a contactor housing 280. The sub board 270 may have a length substantially equal to the longitudinal dimension of the contactor housing 280 and a width larger than the width of the contactor housing 280.

  In addition, the sub-board 270 has a screw hole 272 and a receptacle 276 that penetrates the sub-board 270 in the thickness direction. The screw hole 272 has the same arrangement as a screw hole 282 of the contactor housing 280 described later, and has an inner diameter through which the screw 279 can be inserted.

  The receptacle 276 has a shape complementary to the contact pin 234 that protrudes downward from the connector housing 232. The connector housing 232 is attached to the lower end of the flat cable 230, and each of the contact pins 234 is electrically connected to each strand of the flat cable 230.

  The receptacle 276 is connected to a wiring (not shown) of the sub-board 270. Thereby, when the contact pin 234 is inserted in the receptacle 276, the flat cable 230 and the wiring of the sub-board 270 are electrically connected.

  An insulating sheet 271, a reinforcing member 275, and a mounting component 274 are disposed on the upper surface of the sub substrate 270. The insulating sheet 271 and the reinforcing member 275 each have substantially the same occupied area as the contactor housing 280. The insulating sheet 271 and the reinforcing member 275 have the same arrangement as the screw holes 272 of the sub-substrate 270, and have screw holes 273 and 277 that penetrate each other in the thickness direction.

  The insulating sheet 271 is formed of a dielectric material, and is interposed between the sub substrate 270 and the reinforcing member 275. Accordingly, even when a circuit is formed on the upper surface of the sub-substrate 270, a conductive metal or the like can be used as the reinforcing member 275.

  The mounting component 274 may be an electrical element such as a bypass capacitor. By mounting this type of element on the sub-substrate 270, noise can be suppressed in the immediate vicinity of the wafer 101.

  In addition, the dimension of the sub board | substrate 270 can be changed according to a request | requirement. That is, when a large number of mounting components 274 are mounted on the sub-board 270, the size of the sub-board 270 can be increased as long as it does not interfere with the sub-board 270 of the adjacent contactor housing 280. On the other hand, in the case of adopting another structure such as directly connecting the flat cable 230 to the contactor housing 280, the sub board 270 can be omitted.

  The contactor housing 280 has a large number of housing holes 284 that open to the upper surface, and a step that is formed on the side surface and includes an inclined portion 283 and a horizontal portion 285. The housing hole 284 passes through the contactor housing 280 in the height direction. The horizontal portion 285 and the inclined portion 283 are arranged in the middle in the height direction of the contactor housing 280, and a part in the longitudinal direction forms a passage portion 281 having no step.

  The reinforcing member 275, the insulating sheet 271 and the contactor housing 280 are fastened by screws 279 with the sub-board 270 interposed therebetween. Thereby, the sub board | substrate 270, the insulating sheet 271, and the reinforcement member 275 are mutually integrated, and exhibit high mechanical strength.

  The guide unit 330 includes a channel member 332, a roller 333, an operation bar 335, and a spindle 337. The channel member 332 has a shape in which both ends of a pair of vertical walls are coupled by a pair of horizontal connecting portions 334. A screw hole 336 is disposed at the center of the connecting portion 334.

  The elongated hole 331 passes through the vertical wall of the channel member 332 and extends in the longitudinal direction of the channel member 332. The roller 333 is supported by one end of a spindle 337 inserted through the elongated hole 331 and is disposed inside the channel member 332. The other end of the spindle 337 is connected by an operation bar 335.

  Thereby, when the operation bar 335 moves in the longitudinal direction of the channel member 332, the plurality of rollers 333 also move at the same time. The guide unit 330 is attached to the upper surface of the wiring board 320 with screws 339 inserted through the screw holes 336.

  FIG. 13 is an enlarged cross-sectional view of the contactor 202. Elements that are the same as those in the other drawings are given the same reference numerals, and redundant descriptions are omitted.

  The contactor housing 280 incorporates a spring pin 286 in each of the housing holes 284. Both ends of the spring pin 286 are biased in the extending direction. Accordingly, when the contactor housing 280 is mounted on the sub-board 270, the upper end of the spring pin 286 is pressed against the contact pad 278 on the lower surface of the sub-board 270 and is electrically connected to the wiring of the sub-board 270.

  When the test is performed in the test apparatus 100, the contactor housing 280 enters the inside of the guide unit 330. The distance between the rollers 333 of the guide unit 330 is substantially equal to the width of the contactor housing 280 in the portion above the step. Therefore, the roller 333 can be moved along the step by moving the operation bar 335 when the roller 333 that has passed through the passage 281 reaches the upper side of the step.

  The roller 333 that has passed through the inclined portion 283 from the passage portion 281 eventually runs on the horizontal portion 285. In this process, the contactor housing 280 is pushed down toward the wiring board 320. Thus, the lower end of each spring pin 286 is pressed against the contact pad 321 on the upper surface of the wiring board 320. Thus, a signal path from the probe card 300 including the wiring board 320 to the test head via the contactor 202 and the flat cable 230 is formed.

  Note that the above structure is merely an example of the structure of the contactor 202. Depending on the function required for the contactor 202, for example, the strength of the contactor housing 280 can be increased and the reinforcing member 275 and the insulating sheet 271 can be omitted. Further, the receptacle 276 may be disposed on the upper surface of the contactor housing 280 so that the entire sub-board 270 can be omitted.

  Note that the contactor housing 280 is individually attracted by the guide unit 330 and pressed against the wiring board 320. Therefore, reliable electrical coupling can be obtained without applying a large pressure to the entire contactor 202. Further, since the contactor housing 280 and the guide unit 330 are attracted individually, electrical coupling can be obtained without applying a large pressure to the entire probe card 300.

  In the above example, the roller 333 disposed on the guide unit 330 is engaged with the step provided on the side surface of the contactor housing 280 to attract the contactor 202, but such a function can be formed in various forms. For example, a structure in which a pin pin or a roller is provided on the contactor housing 280 side and a step or the like is provided on the guide unit 330 side may be employed. Moreover, it is good also as a structure where guide unit 330 itself moves instead of providing the roller 333 which moves with respect to the guide unit 330.

  FIG. 14 is a diagram showing a signal arrangement of the spring pins 286 in the contactor housing 280. One contactor housing 280 is provided with three groups of housing holes 284. By making the signal arrangement of the spring pins 286 inserted into each group constant, it is possible to form an electrical connection to the pad group 324 using the contactor 202 having the same specifications. In addition, one contactor 202 can be moved to form an electrical connection to the plurality of pad groups 324.

  In the illustrated example, a power line 287 is allocated to the spring pin 286 located at the end of the contactor housing 280, a signal line 289 is allocated to the spring pin 286 in the middle of the contactor housing 280, and a ground line 288 is disposed between them. ing. With this arrangement, the power supply line 287 is shared, and the number of spring pins 286 is reduced. Further, noise jumping from the power supply line 287 to the signal line 289 is suppressed.

  FIG. 15 is a cross-sectional view of the test head 200 and the probe card 300. Elements that are the same as those in the other drawings are given the same reference numerals, and redundant descriptions are omitted.

  The wafer tray 450 has flow paths 452 and 454 and a diaphragm 456. The flow path 452 opens at one end in a region where the wafer 101 is mounted on the upper surface of the wafer tray 450. The other end of the flow path 452 is coupled to the reduced pressure source 510 via the valve 512. Thereby, when the valve 512 is communicated with the wafer 101 mounted, the wafer tray 450 sucks and holds the wafer 101.

  The flow path 454 of the wafer tray 450 opens outside the area where the wafer 101 is mounted on the upper surface of the wafer tray 450. The other end of the flow path 454 is coupled to the reduced pressure source 520 via the valve 522.

  Diaphragm 456 is formed of an elastic material and is airtightly attached to the peripheral portion of wafer tray 450 further outside the opening of flow path 454. When the alignment stage 410 is raised and the wafer 101 is pressed against the lower surface of the probe card 300, the upper end of the diaphragm 456 is also in contact with the lower surface of the probe card 300 and hermetically seals between the wafer tray 450 and the probe card 300. As a result, when the valve 522 is communicated with the wafer 101 mounted, the wafer tray 450 attracts the lower surface of the probe card 300 and presses the held wafer 101 against the probe card 300.

  Furthermore, a through hole 374 is provided in the elastic sheet 372 of the membrane unit 370 located on the lowermost surface of the probe card 300. Therefore, when the space between the probe card 300 and the wafer tray 450 is decompressed, the inside of the probe card 300 is also decompressed. Thereby, the wiring board 320, the PCR sheets 340 and 360, the interposer 350, and the membrane unit 370 of the probe card 300 are pressed against each other, and a signal path from the wafer 101 to the test head 200 is reliably formed.

  As described above, the test apparatus 100 tests a plurality of devices formed on the wafer 101, and is connected to the plurality of device pads on the lower surface of the probe card 300 superimposed on the wafer 101, and is connected to the upper surface of the probe card 300. A test apparatus 100 including a probe card 300 on which a plurality of corresponding contact pads 321 are arranged and a contactor 202 that is sequentially connected to each of a part of the plurality of contact pads 321 of the probe card 300 is formed.

  FIG. 16 is a cross-sectional view of the test head 200 and the probe card 300. This figure is the same as FIG. 15 except that the contactor substrate 260 and the contactor housing 280 of the contactor 202 are moved and fitted to a guide unit 330 different from that in FIG. Therefore, the same reference numerals are assigned to the common elements, and duplicate descriptions are omitted.

  By moving the operating bar 335 of the guide unit 330 and moving the roller 333 to the position of the passage portion 281, the contactor housing 280 can be raised from the guide unit 330. In this state, by operating the three-dimensional actuator 250 in the contactor 202, the contactor substrate 260, the sub-substrate 270 and the contactor housing 280 can be pulled up, and the contactor housing 280 can be pulled out from the guide unit 330.

  Further, by operating the three-dimensional actuator 250, the contactor substrate 260, the sub-substrate 270, and the contactor housing 280 are moved horizontally (right side in the illustrated example) and lowered again at other positions, so that FIG. In this state, the contactor housing 280 can be inserted into the guide unit 330 that is vacant. Even in the other guide unit 330, the pulling mechanism by the roller 333 and the signal arrangement for the contact pad 321 are common, so that the same test can be executed in the other guide unit 330 using the same test head 200.

  FIG. 17 is a plan view showing a region in the wafer 101 where a test is executed. When the contactor 202 and the probe card 300 are connected as shown in FIG. 15, for example, among the plurality of device regions 102 of the wafer 101, every other device region 102 from the leftmost column is hatched in the drawing. As shown, this is a test execution area 103 where the test is performed.

  Further, the remaining element region 102 corresponds to the guide unit 330 to which the contactor 202 is not connected, and becomes a test non-execution region 105 in which no test is executed.

  FIG. 18 is also a plan view showing a region in the wafer 101 where a test is executed. However, FIG. 18 shows a case where the contactor 202 is displaced and the contactor 202 and the probe card 300 are connected as shown in FIG.

  In this case, the element region 102 which is the test execution region 103 in FIG. 17 becomes the test non-execution region 105. Further, the area that was the test non-execution area 105 in FIG. 17 becomes the test execution area 103.

  As described above, each of the pad groups 324 on the probe card 300 may be sequentially connected to the adjacent element regions 102 in the wafer 101. Thus, by moving the contactor 202, the entire wafer 101 can be tested in two steps. In other words, the scale of the test head 200 can be halved as compared with the case where the entire wafer 101 is tested at one time.

  Further, the contactor 202 has a structure in which the contact pads 321 are in contact with and separated from the upper surface of the probe card 300 in which the pitch and area of the contact pads 321 are increased. Therefore, there is a margin in the positioning accuracy of the contactor 202. Thereby, the contactor 202 can be moved up and down at high speed, and the throughput of the test apparatus 100 can be improved.

  Note that the number of times that the entire wafer 101 is tested by testing each part is not limited to two, but a plurality of spring pins 286 corresponding to a plurality of n element regions 102 in the array on the wafer 101. By sequentially connecting the contactors 202 including, the entire wafer 101 can be tested in n times. When the execution of the test for one wafer 101 is divided into n times, the force for pressing the contactor 202 against the probe card 300 becomes 1 / n, and there is a margin in the strength and power source of the test apparatus 100. Further, there is a margin in the strength of the probe card 300 and the like, and the test can be performed without applying a large load that causes the wafer 101 to be warped.

  Furthermore, even when the contactor 202 is pressed with such a small pressing force, the electrical connection between the contactor 202 and the probe card 300 can be reliably obtained. Depending on the number of devices formed on the wafer 101, the number of guide units 330 having the effective pad group 324 on the wiring substrate 320, and the like, the number of connection times when the contactor 202 is connected every n is n. It may not be a time.

  Further, the arrangement of the test execution area 103 and the test non-execution area 105 is not limited to the illustrated example. For example, the heat generated in the element region 102 by the test may be uniformly distributed on the wafer 101 so that the test execution region 103 draws a pine pattern.

  As described above, the contactor 202 has a plurality of contactors 202 corresponding to some of the many element regions 102 arranged on the wafer 101, and is connected to the wafer 101 sequentially through the probe card 300. The test may be performed separately. As a result, the number of electrical contacts and the number of pin electronics that have a high impact on cost can be reduced, and the cost of the test apparatus 100 can be reduced.

  In addition, the size of the test apparatus 100 can be reduced by reducing the number of components as described above. For example, although the four test heads 200 are provided in the above example, the individual dimensions of the test head 200 can be substantially halved by reducing the number of pin electronics 210 mounted on each test head 200 by half. it can.

  Further, since one EFEM 110 is commonly used by the four test heads 200, the number of robot arms 116 to be used can be reduced, and a plurality of test heads 200 can be arranged close to each other. Thereby, the whole test apparatus 100 can be reduced in size significantly. Furthermore, the number of load units 130 can be reduced to further reduce the size and cost of the test apparatus 100.

  In the above embodiment, the contactor 202 is moved with respect to the fixed probe card 300 to connect the contactor 202 to different pad groups 324. However, the structure of the test apparatus 100 is not limited to this, and the probe card 300, the wafer 101, and the wafer tray 450 can be moved integrally by fixing the contactor 202.

  In the above example, the case where the connection between the wafer 101 and the probe card 300 or the connection between the probe card 300 and the contactor 202 is due to the contact of the bump 373, the contact pad 321 and the like has been described. However, in the test apparatus 100, the connection may be formed by signal transmission by capacitive coupling between adjacent conductors, optical signal transmission between opposing end faces, or the like.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The execution order of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before”, “prior”, etc. It should be noted that it can be implemented in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

100 test apparatus, 101 wafer, 102 element area, 103 test execution area, 105 test non-execution area, 110 EFEM (Equipment Front End Module), 112 signal lamp, 114 EMO (EMmergency Off), 115, 402, 422 rail, 116 Robot arm, 117 columns, 118 pre-aligner, 120 operation unit, 122 display, 124 arm, 126 input device, 130 load unit, 132 load table, 134 load gate, 140 chiller, 150 FOUP (Front Opening Unified Pod), 160 main frame , 200 test head, 201, 401 housing, 202 contactor, 210 pin electronics, 22 0 Motherboard, 222, 226 Angle connector, 224 Relay connector, 228 Small board, 230 Flat cable, 232 Connector housing, 234 Contact pin, 240 Support board, 250 Three-dimensional actuator, 260 Contactor board, 270 Sub board, 271 Insulation sheet, 272, 273, 277, 282, 336 Screw holes, 274 Mounting parts, 275 Reinforcement member, 276 Receptacle, 278, 321, 323, 351, 353, 371 Contact pads, 279, 316, 339 Screws, 280 Contactor housing, 281 Passing Part, 283 inclined part, 284 housing hole, 285 horizontal part, 286 spring pin, 287 power supply line, 288 ground line, 289 signal line, 300 probe 310, stiffener, 312 upper frame, 314 lower frame, 318 cross member, 320 wiring board, 324 pad group, 330 guide unit, 331 long hole, 332 channel member, 333 roller, 334 connecting portion, 335 actuating bar, 337 Spindle, 340, 360 PCR sheet (Sensitive Conductive Sheet), 341, 361 Through electrode, 343, 363 Elastic support, 342, 362 Frame, 344, 346, 354, 364, 366, 374 Through hole, 350 Interposer, 352 Substrate, 355, 375 through-hole, 357 wiring layer, 370 membrane unit, 372 elastic sheet, 373 bump, 376 frame, 400 alignment unit, 410 alignment stage, 420 stage carrier, 430 microscope, 440 hanger hook, 450 wafer tray, 452, 454 flow path, 456 diaphragm, 510, 520 decompression source, 512, 522 valve

Claims (6)

A test apparatus for testing a plurality of devices under test formed on a semiconductor wafer,
A probe card connected to the contact points of the plurality of devices under test on the connection surface superimposed on the semiconductor wafer, and a plurality of contact points corresponding to the back surface of the connection surface;
A test apparatus comprising: a test head for testing the plurality of devices under test on the semiconductor wafer by sequentially connecting to a part of the plurality of contacts of the probe card.   The test apparatus according to claim 1, wherein the plurality of contacts of the probe card are formed by n sets of contact groups having the same signal arrangement. The plurality of contacts are divided into a plurality of contact groups including two or more contacts,
The test apparatus according to claim 1, wherein each of the contact groups is sequentially connected to the devices under test adjacent to each other on the semiconductor wafer. A test method for testing a plurality of devices under test formed on a semiconductor wafer,
Preparing a probe card to be connected to the contacts of the plurality of devices under test on the connection surface superimposed on the semiconductor wafer, and provided with a plurality of contacts corresponding to the back surface of the connection surface;
Testing the plurality of devices under test on the semiconductor wafer by sequentially connecting a test head to a portion of the plurality of contacts of the probe card;
A test method comprising: A test apparatus for testing a plurality of devices under test formed on a semiconductor wafer,
A probe card connected to the contact points of the plurality of devices under test on the connection surface superimposed on the semiconductor wafer, and a plurality of contact points corresponding to the back surface of the connection surface;
A test apparatus comprising: a plurality of test heads each for testing the plurality of devices under test on the semiconductor wafer by sequentially connecting to a part of the plurality of contacts of the probe card. A test apparatus for testing a plurality of devices under test formed on a plurality of semiconductor wafers,
A plurality of probe cards respectively connected to the contact points of the plurality of devices under test on the connection surface superimposed for each semiconductor wafer, and a plurality of contact points corresponding to the back surface of the connection surface;
A test apparatus comprising: a plurality of test heads for testing the plurality of devices under test on the plurality of semiconductor wafers by sequentially connecting each of the probe cards to a part of the plurality of contacts.

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