JP2010199591A - Method for producing metal pattern on substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for forming a metal pattern of high fineness on a substrate at a cost as low as possible. <P>SOLUTION: The method for forming the metal pattern on the substrate is characterized in that, first, an electroplating step 8 is executed after a polymerizing step 4 by a conductive polymer using a pattern electrode 2, and a removing step 16 of a polymer pattern is executed after a transfer step to a substrate of the metal pattern and/or a transfer step 12 to a substrate of the polymer pattern, thus solving the problem. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a metal pattern on a substrate.

  In the prior art, many different methods are known for producing a conductive pattern on a wiring board. The differences in the known methods are, along with the equipment costs required for each production, mainly the fineness (Aufloesung), surface quality and speed of the method that can be achieved with the method. The wiring for electrically connecting the electronic members is usually produced on the wiring board by masking / etching, an appropriate printing method or laser processing. Basically, the wiring board can be of various types, in particular flexible printed wiring boards, films, ceramics and the like.

  In this regard, the prior art knows electronic devices, units and applications, and in particular printed electronic circuits that apply wiring completely or partially to a wiring board by means of suitable printing methods. In this case, printing is performed with a liquid or paste functional material instead of the printing ink.

  Regarding the laser processing method used for producing wiring on the wiring board, LDI (laser direct drawing) and LDP (laser direct patterning) are particularly mentioned. In direct laser drawing, metallization is first performed, but usually the wiring board is metallized in a planar shape. A photoresist is applied on this, and it is directly drawn on it with a laser, or it is covered and exposed with a mask. Subsequently, the metal is etched and the resist is removed.

  On the other hand, in the laser direct patterning method, patterning is performed directly by running the shaped laser beam on the upper surface of the mask. The advantage of this method is that it is faster than laser direct drawing, but requires a very thin metal layer.

  A common point of methods known from the prior art for producing wiring on a wiring board is that the fineness is no longer sufficient for many applications in the electronics industry and will become less satisfactory in the future.

  Furthermore, it is known from the prior art how to make a metal pattern on a substrate, the feature of which is first to apply a thin metal film to the substrate extensively. Photoresist is applied on the metal film, and it is removed photochemically or by laser technique to supplementarily form a desired pattern. The metal pattern remaining in this refill area is then etched away. Finally, the photoresist still bonded to the metal pattern is dissolved away with, for example, a solvent.

  Another feature of the prior art is mainly the printing process and the electroplating process. In this method, a so-called seed layer is first printed on a substrate. This printing is performed so that a desired pattern is formed on the seed layer. For this purpose, a suitable printing agent is a conductive polymer dissolved in a solvent. After printing, the solvent is in a gas aggregation state, and the conductive polymer adheres to the substrate. The seed layer is then contacted with the electrolyte. A substance to be deposited by an electroplating process is introduced into the electrolytic solution, and this deposition is performed by an electrolytic method. What is necessary for electroplating is an electrode and a counter electrode. The electrode is formed on the substrate by a seed layer. Therefore, when designing the seed layer, care must be taken that any small sub-elements of the seed layer have side wiring with respect to the corner where the substrate is electrically connected. This is because, in order to deposit metal on the seed layer by electroplating, complete deposition is possible if any partial region of the seed layer is connected to the first potential and the counter electrode is connected to a potential other than the first potential. It is because it is performed. Actually, there are almost no examples in which the desired pattern is side-connected to the corner as described above. Therefore, in order to allow this connection, the seed layer often has an additional partial surface. If the product is used later, this connection is disliked. The additional deposition of the metal on the substrate is restored in a later processing step.

  The common point of the above steps is that the maximum fineness of the metal pattern is low.

  An object of the present invention is to provide a method capable of forming a highly fine metal pattern on a substrate at as low a cost as possible.

  It would be advantageous if a metal pattern could be produced by this method even in a continuous process.

  Furthermore, it is advantageous if the metal pattern can be produced with a high fineness, particularly in the range of 5 micrometers.

The subject is a method of manufacturing a metal pattern on a substrate, and the following method steps:
a. Polymerization process,
In this step, at least one pattern electrode having a first region (electrode contact region) of a settable pattern and the remaining second region (electrode replenishment region) on the surface is used. One electrode can be connected, and at least a part of the electrode contact region is contacted with a first electrolyte, preferably in a liquid state. At this time, a polymerized and / or crosslinkable compound is introduced into the first electrolyte. In addition, a first current is generated through the first electrolyte through the pattern electrode, and a conductive polymer film having a set pattern is formed in the electrode contact area in contact with the first electrolyte (polymer pattern). )
b. Electroplating process,
In this step, at least a part of the polymer pattern is brought into contact with the second electrolyte, which is preferably liquid, and at this time, a metallic substance is introduced into the second electrolyte. A second current is generated through the second electrolyte, and a conductive metal film having a set pattern is formed and / or deposited in the region of the polymer pattern in contact with the second electrolyte (metal pattern).
c. Step of transferring metal pattern to substrate and / or step of transferring polymer pattern to substrate In the former step, at least a part of the metal pattern is applied to the substrate, and in the latter step, at least part of the polymer pattern is applied. This is solved by a method of manufacturing a metal pattern on a substrate, characterized in that a part is applied to the substrate.

  According to the present invention, a highly fine metal pattern can be produced on a substrate at low cost. For this purpose, a polymerization process is first performed. At this time, at least one pattern electrode having a first region (electrode contact region) and a remaining second region (electrode replenishment region) that can be set on the surface of the pattern electrode is provided. use. In this case, the electrode contact region can be connected to the first potential, and at least a part of the electrode contact region is preferably in contact with the liquid first electrolyte. At that time, a polymerization and / or crosslinkable compound is introduced into the first electrolyte, and a first current is generated by the first electrolyte through the pattern electrode. At that time, a conductive film having a set pattern made of a polymerizable and / or crosslinkable compound is formed in the electrode contact region in contact with the first electrolyte (polymer pattern). Thereafter, the pattern electrode is removed from the first electrolyte, and at least a part of the electrode contact region coated with the conductive film is brought into contact with the second electrolyte, which is preferably liquid. At that time, metal ions are introduced into the second electrolyte, and a current is generated by the second electrolyte via the pattern electrode. At this time, a metal pattern is formed and / or deposited on the conductive film in the electrode contact region that is in contact with the second electrolyte.

  The purpose of this method is to produce a metal pattern on a substrate. This substrate may be a base material or an outermost layer thereof. A synthetic resin substrate is preferred. Further, it is preferable that the substrate is insulated, in particular, it is electrified. The shape of the surface of the substrate may be arbitrary. However, it is preferable that the surface of the substrate is at least approximately flat. In a preferred embodiment, the substrate is a wiring board and / or substrate, or a substrate of a printed circuit board.

  The subject of the invention is also a metal pattern on a substrate produced by this method. This means that at least most of the metal pattern is only on the substrate. However, it is also possible for the metal pattern and the substrate to be joined by a shape connection, a friction connection and / or a material connection. Basically, the shape of the metal pattern can be arbitrarily formed. The pattern can cover any part of the substrate surface. In particular, when the substrate is a wiring board, the metal pattern can cover a part, a plurality of portions, or the entire surface of the functional surface of the substrate. The functional surface of the substrate may be a surface that is provided so that this portion can interact with other functional materials, functional materials and / or other devices. The interaction may in particular be retention.

  The metal pattern is particularly advantageous if it is a specific, particularly set pattern. That is, the settable pattern may be a surface pattern.

  The electronic elements are preferably connected to each other by wiring. The electronic elements may be connected to each other by a metal pattern on the substrate. In this case, the metal pattern may be a wiring between members on the substrate. It is fundamentally undesirable for all connections of all members of the electrical circuit to be electrically connected to each other in a “star shape”. Rather, the electrical circuit often draws a pattern. In that sense, an electrical circuit is rather configured to form only the selected connections, in particular only the wiring between the electrical members.

  One preferred and important step of the process is the polymerization step. For the polymerization process, at least one pattern electrode having a first area (electrode contact area) and a remaining second area (electrode replenishment area) of a pattern that can be set on the surface of the pattern electrode is used. We have already mentioned that there are configurable patterns. This settable pattern can be, for example, a pattern and / or surface arrangement of an electrical circuit or a surface pattern of electrical (connection) wiring of the circuit. It is preferable that at least a part of the surface of the pattern electrode forms a pattern corresponding to the settable pattern so that the metal pattern on the substrate can form the set pattern. In this sense, the pattern electrode has an electrode contact region. The electrode contact area may be a surface associated with the pattern electrode surface. In practice, however, there are few cases where it is preferred. The form of the electrode contact region is characterized in that this region is composed of a plurality of surface regions that are not related to the pattern electrode. The plurality of unrelated regions may be the first region of the pattern electrode. The electrode supplement area may be the remaining second area on the surface of the pattern electrode. The electrode supplement area may be an associated partial area of the pattern electrode surface. The electrode replenishment region may be composed of a plurality of partial regions on the pattern electrode surface. Therefore, there may be a portion where the electrode contact region and the electrode supplement region overlap and / or no intersection. The surface of the pattern electrode can be considered as a functional surface of the pattern electrode. The functional surface of the pattern electrode may be a surface that is defined so as to be in contact with the electrolyte. The connection region of the pattern electrode is preferably excluded from the surface of the pattern electrode. The pattern electrode may basically have electrode characteristics known in the prior art. Here, since this electrode has at least two regions, it is named a pattern electrode.

  Another scope of the present invention is that the electrode contact region can be connected to the first potential. Therefore, the electrode contact region can be connected to the first potential by at least one lead wire. In particular, it is easy to apply if the electrode contact region or particularly part of the pattern electrode is electrically connected to each other. The connected electrode contact region may be connected to the first potential, particularly with a lead wire. A power supply typically has at least two potentials with different voltage levels. Since the power supply usually has a voltage connector, the device can access this potential. As a result, the electrode contact region can also be connected to the first potential connector of the power supply by lead connection. The electrode contact area of the pattern electrode is therefore preferably conductive. On the contrary, the electrode replenishment region may be insulating.

  In the polymerization step, at least a part of the electrode contact region is brought into contact with the first electrolyte, which is preferably liquid. For this purpose, the pattern electrode can be at least partially immersed in the first electrolyte. At that time, it is not absolutely necessary to immerse the entire pattern electrode in the first electrolyte. Rather, only a part of the pattern electrode can be brought into contact with the first electrolyte. For this purpose, the pattern electrode can be partially immersed, for example, half, in the first electrolyte. However, it is preferable to bring the entire surface of the pattern electrode and / or the entire functional surface into contact with the first electrolyte. Basically, the first electrolyte can be in any agglomerated state. That is, the first electrolyte can be a solid, liquid, or gas. The electrolyte can contain a solvent that can dissolve organic substances if possible. The first electrolyte may be a liquid. The solvent is preferably methanol, ethanol, acetone, isopropanol, NMP, methylene chloride or water. Also possible are mixtures of two or more solvents, for example water, acetonitrile, propylene carbonate and / or methylene chloride. A particularly preferred electrolyte is a conductive solution, particularly containing cations and anions. Furthermore, a polymerization and / or crosslinkable compound may be introduced into the first electrolyte. The polymerizable compound is preferably a monomer. The polymerizable compound can essentially be a small molecule and / or a reactive molecule that can be bound to a polymer, for example unbranched or capable of binding to a branched polymer. The polymerizable compound may have reactive double bonds and / or particularly unsaturated organic compounds. A crosslinkable compound is understood as a molecule, in particular a macromolecule, that can bind to a three-dimensional crosslink. The crosslinkable compound can be selected to promote and / or induce polymerization.

  A feature of a preferred embodiment of the process is that the first electrolyte advantageously contains an organic solvent and / or a salt dissolved in the solvent, in which polymerization and / or cross-linking properties, in particular low molecular compounds, are present in the electrolyte. The first electrolyte is selected so that it can be dissolved. As the solvent, propylene carbonate, acetonitrile, monohydric or polyhydric alcohol, tetrahydrofuran or water can be used alone or as an arbitrary mixture. For example, tetraethylammonium-tetrafluoroborate, tetraethylammonium-hexafluorophosphate, tetraethylammonium perchlorate, or poly (styrenesulfonic acid) -sodium salt may be used alone or in any combination. it can.

  Another preferred embodiment of the method is characterized in that the compound introduced into the first electrolyte is pyrrole, 3-alkylpyrrole, in particular 3-methyl-, 3-ethyl-, 3-propylpyrrole, N-alkylpyrrole, in particular N-methyl-, N-ethyl-, N-propylpyrrole, N-alkylpyrrole, especially N-phenyl-, N- (4-amino) phenyl-, N- (4-methoxy) phenyl-, N-naphthylpyrrole N-heteroarylpyrrole, in particular N- (3-thienyl)-, N- (2-thienyl)-, N- (3-furanyl)-, N- (2-furanyl)-, N- (3-seleno Phenyl)-, N- (2-selenophenyl)-, N- (3-pyrrolyl) pyrrole, thiophene, 3-alkylthiophene, especially 3-methyl-, 3-ethyl-, 3-propylthio , Furan, 3-alkylfuran-, 3-methyl-, 3-ethyl-, 3-propylfuran, selenophene, 3-alkylselenophene, especially 3-methyl-, 3-ethyl-, 3-propylselenophene , Tellurophen, aniline, biphenyl, azulene, 2- (alpha-thienyl) thiophene, 2- (alpha- (3-alkyl) thienyl) thiophene, 2- (alpha- (3-alkyl) thienyl)-(3-alkyl) Thiophene, 2- (alpha-thienyl) furan, 2- (alpha- (3-alkyl) thienyl) furan, 2- (alpha- (3-alkyl) thienyl)-(3-alkyl) furan, 2- (alpha- Thienyl)-(3-alkyl) furan, 2- (alpha-thienyl) pyrrole, 2- (alpha- (3-alkyl) Enyl) pyrrole, 2- (alpha- (3-alkyl) thienyl)-(3-alkyl) pyrrole, 2- (alpha-thienyl)-(3-alkyl) pyrrole, 2- (alpha-furanyl) pyrrole, 2- (Alpha- (3-alkyl) furanyl) pyrrole, 2- (alpha- (3-alkyl) furanyl)-(3-alkyl) pyrrole, 2- (alpha-furanyl)-(3-alkyl) pyrrole, 2- ( Alpha-pyrrolyl) pyrrole, 2- (alpha- (3-alkyl) pyrrolyl) pyrrole, 2- (alpha- (3-alkyl) pyrrolyl)-(3-alkyl) pyrrole, 2- (alpha-pyrrolyl)-(3 -Alkyl) pyrrole, 2- (alpha-selenophenyl) selenophene, 2- (alpha- (3-alkyl) selenophenyl) seleno Phen, 2- (alpha- (3-alkyl) selenophenyl)-(3-alkyl) selenophene, 2- (alpha-thienyl) selenophene, 2- (alpha- (3-alkyl) thienyl) selenophene, 2- (alpha -(3-alkyl) thienyl)-(3-alkyl) selenophene, 2- (alpha-thienyl)-(3-alkyl) selenophene, 2- (alpha-selenophenyl) furan, 2- (alpha- (3-alkyl) ) Selenophenyl) furan, 2- (alpha- (3-alkyl) selenophenyl)-(3-alkyl) furan, 2- (alpha-selenophenyl)-(3-alkyl) furan, 2- (alpha-selenophenyl) ) Pyrrole, 2- (alpha- (3-alkyl) selenophenyl) pyrrole, 2- (alpha- (3- Ruyl) selenophenyl)-(3-alkyl) pyrrole, 2- (alpha-selenophenyl)-(3-alkyl) pyrrole, thienothiophene, thienofuran, thienoselenophene, thienopyrrole, 2-phenylthiophene, 2-phenylfuran, 2-phenylpyrrole, 2-phenylselenophene, 2-phenyl tellurophene, N-vinylcarbazole, N-ethynylcarbazole, 3.4-ethylenedioxythiophene, 2- (alpha- (3.4-ethylenedioxy) Thienyl) thiophene, 2- (alpha- (3.4-ethylenedioxy) thienyl) -3.4-ethylenedioxythiophene, 2- (alpha- (3.4-ethylenedioxy) thienyl)-(3- Alkyl) thiophene, 2- (alpha- (3.4-ethylenedi) Xyl) thienyl) furan, 2- (alpha- (3.4-ethylenedioxy) thienyl)-(3-alkyl) furan, 2- (alpha- (3.4-ethylenedioxy) thienyl) pyrrole, 2- (Alpha- (3.4-ethylenedioxy) thienyl)-(3-alkyl) pyrrole, 2- (alpha- (3.4-ethylenedioxy) thienyl) selenophene, or 2- (alpha- (3.4 -Ethylenedioxy) thienyl)-(3-alkyl) selenophene, each alone or in any combination or as a monomer unit of an oligomer.

  The electrolyte may be a second class conductor or an ionic conductor. In this sense, the electroconductivity of the electrolyte can be generated by dissociating or separating at least one of the molecular bonds. In the electrolyte, in this way, electrically charged ions can be generated. The conductivity of the electrolyte can be attributed to charged, particularly freely moving ions. Thus, the electrolyte can be a substance that allows the movement of charge carriers, preferably between two different high voltage levels, under the influence of an electric field. That is, the electrolyte may be a substance that can pass an electric current.

  The pattern electrode and / or the electrode contact region can be connected to the first potential. In a preferred form, the counter electrode is connected to the electrolyte. Therefore, the counter electrode cannot be a pattern electrode. Furthermore, the counter electrode can be a particularly independent electrode. Furthermore, the counter electrode can be coupled to a second, preferably a potential different from the first potential. Therefore, there may be a potential difference between the first potential and the second potential. A preferred embodiment of the present invention is that the electrode supplemental region can be connected to a second potential. In this sense, the first potential and the second potential can be connected to the pattern electrode. The electrode supplement region of the pattern electrode may be conductive. The electrode contact area may be configured to be insulated from the electrode supplement area. Therefore, the pattern electrode can provide an insulator between the electrode contact region and the electrode supplement region.

  Before, during and / or after contacting at least a portion of the electrode contact region with the first electrolyte, the electrode contact region is a first potential, and / or the counter electrode is a second potential, and / or an electrode. The replenishment region can be connected to the second potential. It is also a characteristic of the polymerization process that the first current is generated by the first electrolyte through the pattern electrode. Therefore, an electric field can be formed by the first electrolyte. This electric field can be caused by a potential difference. In particular, the first current may be caused by an electric field formed between the first potential and particularly the second potential. That is, the charge carrier can be moved by the electrode contact region between the first electrolyte and the pattern electrode. That is, the first current is generated through the electrode contact region and electrolysis. In other words, a current flows through the electrode contact region between the first electrolyte and the pattern electrode (in this sense, through the pattern electrode).

  It is within the scope of the present invention that a conductive polymer film (polymer pattern) having a set pattern is formed in the electrode contact region to be brought into contact with the first electrolyte. The polymer film and / or polymer pattern is preferably formed by polymerization introduced into the first electrolyte and / or polymerization of a crosslinkable compound. Polymerization can be interpreted as a chemical reaction in which a compound is bound to a macromolecule. These compounds may be polymerized and / or crosslinkable compounds introduced into the first electrolyte. The polymerized macromolecule may have almost the same chemical composition as the compound used for synthesis and / or production. However, the macromolecule may have another molecular structure. When the polymerization and / or crosslinkable compound has a double bond, it is convenient for polymerization. For when energy is applied, these double bonds are “opened”. The first current can be supplied as energy to the polymerizing and / or crosslinking compound. Compounds having double bonds that are “open” by the energy supply or current of the polymerized and / or crosslinkable compounds can bind to molecular chains and macromolecules. In this way, a polymer film, particularly a conductive polymer film can be formed. It is preferred that current flow through the electrolyte through the electrode contact region. Accordingly, the polymerization and / or crosslinkable compound of the first electrolyte is advantageously polymerized at and / or in the vicinity of the electrode contact area. In other words, because the first electrolyte is at least partially in contact with the electrode contact area and the polymerized and / or crosslinkable compound is polymerized particularly in the electrode contact area, the polymer film is mostly only in the electrode contact area. It is deposited. That is, the polymerization of the first electrolyte and / or the crosslinkable compound is deposited particularly in the electrode contact area, in which the electrochemical polymerization is advantageously carried out particularly at the contact surface.

  A feature of a preferred embodiment of the method is further that the polymer film formed when the polymerized and / or crosslinkable compound is deposited is doped with electrolyte ions, making the polymer film conductive. Corresponding methods are known in the prior art. Such a method is described in patent DE10140666C2. A feature of a preferred embodiment of this method is that the first potential is chosen so that the electrode contact area is the anode. Therefore, the second potential can be selected so that the counter electrode becomes the cathode.

  Since the formed polymer pattern may be doped with ions of the first electrolyte during deposition, the first electrolyte directly affects the material properties of the polymer pattern. Therefore, the conductivity of the polymer pattern strongly depends on the ion amount of the first electrolyte and / or the potential difference between the electrode contact region and the counter electrode. In order to weaken or strengthen the conductivity of the polymer pattern, the electrode coated or connected with the polymer pattern is “third” together with the second counter electrode after the polymerization step and before the electroplating step. Can be immersed in an electrolyte. This third electrolyte contains only the salt in addition to the solvent and / or does not contain any polymerizing and / or crosslinking compound.

  When a voltage is applied between the pattern electrode and the counter electrode, the ion amount of the polymer pattern can be changed. When a voltage is applied in the reverse direction (relative to the voltage of the polymerization process), the amount of ions in the polymer pattern can be reduced. As a result, the conductivity of the polymer pattern can be weakened, and in particular, the polymer pattern can be converted to almost insulating properties. If a voltage is applied in the same direction as the polymerization step, the ion amount of the polymer pattern can be increased or the conductivity of the polymer pattern can be increased. Basically, the conductivity is limited by the electrical properties of the polymerizing and / or crosslinkable compounds.

  That is, a particularly conductive polymer pattern can be deposited on the substrate by the polymerization process. Furthermore, the polymer pattern may have the same pattern as that of the electrode contact region. This can be achieved advantageously by performing electrochemical polymerization in the contact area between the electrode contact area and the first electrolyte.

  The thickness of the polymer film should be very thin, with a maximum of 50 mm, especially 0.1 nm to 1 mm, preferably 1 μm to 100 μm, more preferably 20 nm to 500 nm.

  The method for producing a metal pattern on a substrate is characterized in that there is an electroplating step in addition to the polymerization step. The electroplating step is preferably performed after the polymerization step. For the electroplating process, it is preferable that at least a part of the polymer pattern is brought into contact with the liquid second electrolyte if possible. At that time, a metallic substance is introduced into the second electrolyte. That is, the second electrolyte may contain a metallic substance. What is considered as a metallic substance is preferably a conductive substance, which is also a highly conductive substance. Metallic materials can be pure materials, mixtures (especially homogeneous mixtures) and / or are or contain solder, stainless steel, transition metals, metal compounds, alloys, nanometals, or copper (especially pure copper). Things are possible. Further, the metallic material may contain a semiconductive and / or non-conductive material. Particularly preferred metallic materials are copper, silver, aluminum, nickel, chromium, tin, lead, gold and / or titanium, or an alloy containing at least one of these metals. The metallic substance may be a solid. Furthermore, the metallic substance may be at least a part of the electrode. Other forms of metallic materials are also conceivable. For example, it may be a powdery or crumb-like metallic substance. In particular, the powdered metallic substance or metal salt can be mixed in and / or with the second electrolyte and / or form a suspension or solution with the electrolyte. Basically, the second electrolyte may be a heterogeneous mixture with the introduced metallic substance.

  In a particularly preferred embodiment, the second electrolysis is liquid or dissolved. The second electrolyte can form a suspension or solution with the introduced metallic substance. That is, the second electrolysis includes a liquid that can dissolve the metallic substance and / or can suspend the metallic substance in the liquid.

  In particular, a liquid electrolyte can basically be interpreted as a conductive solution containing ions, particularly cations and anions. Ions can be positively or negatively charged atoms and / or molecules. These can be generated by the decomposition of a salt, acid or alkali solution into positively or negatively charged atoms and / or molecules. The cation and / or anion can be a charge carrier for the electrolyte.

  In the electroplating process, at least a part of the polymer pattern can be brought into contact with the second electrolyte. Preferably, the polymer pattern is at least partially immersed in the second electrolyte. Preference is given to contacting the entire polymer pattern with the second electrolyte.

  For the electroplating process, a second current is generated by the second electrolyte through the polymer pattern. Here, it is preferable that a current flows between the cathode and the anode, particularly by an electrolyte. To that end, the cathode and anode can be connected to a power source. Preferably, the second current flows through the polymer pattern. To that end, the polymer pattern can be designed to be at least part of the cathode surface. In particular, the polymer pattern can form the cathode surface. It is preferable that the current for the electroplating process flows only in the region of the polymer pattern between the cathode and the electrolyte.

  The anode can be any electroplating anode known from the prior art. Therefore, the anode preferably contains a metallic substance. In particular, the anode can be formed of almost metallic material.

  For the electroplating process, it is highly preferred if the anode voltage is higher than the cathode voltage, advantageously significantly higher. In other words, the anode can form a positive electrode and the cathode can form a negative electrode.

  A preferred embodiment of the method is also characterized in that the sacrificial electrode or at least one region of the sacrificial electrode surface layer is a metallic material.

  Another range of the present invention is that a conductive metal film having a set pattern is formed and / or deposited in a region of a polymer pattern that comes into contact with the second electrolyte (metal pattern). That is, it is preferable that a metal layer, particularly a layer of a metallic substance is deposited on the polymer pattern by electroplating. By applying a voltage between the polymer pattern and the counter electrode, in particular, a counter electrode made of a metal material or containing a metal material, atoms or molecules of the metal material are positively charged metal ions (here Can be oxidized to cations). This metal ion can be reduced to metal by a polymer pattern (here a cathode). Thereby, the metallic substance can be deposited on the polymer pattern. By changing the height of the voltage and the time for applying the voltage, the thickness of the metal layer deposited on the polymer pattern can be determined and controlled. When only a part of the polymer pattern comes into contact with the second electrolyte, electroplating also deposits only in this range.

  Again, it should be clearly pointed out that the deposition by electroplating of the metallic material is preferably performed only on the polymer pattern region and / or on the polymer pattern. For this reason, the deposition of a metallic substance by electroplating may be at least hardly performed on the surface of the electrode and / or the cathode that is not covered and / or not formed with the conductive polymer pattern (pattern). preferable. In the region where the surface is at least partly formed and / or covered with the polymer pattern, in particular in contact with the second electrolyte, the electrode, in particular the cathode, is filled and / or the rest of the polymer pattern. The surface portion may be insulated and / or contain an insulating material and / or covered with an insulating material. The insulating material is provided in a radial direction or thickness so that the polymer pattern and the insulating material are approximately smooth and / or have a continuous surface.

  Another feature of the method according to the invention is that the metal pattern is transferred to the substrate, wherein at least a part of the metal pattern is applied to the substrate. For this purpose, the metal pattern can first come into contact with the substrate. In particular, the upper surface of the metal pattern can be brought into contact with the upper surface of the substrate. Furthermore, the contact surface and / or contact area between the metal pattern and the substrate can be configured to bond between and / or after contacting the substrate and the metal pattern. There are various ways of bonding between the substrate and the metal pattern, which can be shape connections, friction connections, and / or material connections.

  A feature of a particularly preferred method embodiment is that the metal pattern and / or polymer pattern applied to the substrate is bonded to the substrate, preferably in material connection, with an adhesive (substrate adhesive). Further, regarding the substrate adhesive, the substrate adhesive may be selected so that the adhesion between the electrode and the polymer pattern is weaker than the adhesion between the substrate adhesive and the metal pattern, the substrate and / or the polymer pattern. In addition, a substrate pressure-sensitive adhesive that allows the metal pattern, polymer pattern, and / or substrate to adhere to the pressure-sensitive adhesive can be selected. The substrate adhesive can at least partially form a thin film or ultrathin layer between the substrate and the metal or polymer pattern. The adhesive can be applied to the substrate (especially partially) and / or the metal pattern (especially partially) and / or the polymer pattern (especially partially) prior to transfer of the metal pattern and / or polymer pattern. After the metal pattern and / or the polymer pattern is transferred to the substrate, the substrate and the metal pattern or the polymer pattern can be fixed with an adhesive.

  Features of other embodiments of the preferred method are characterized in that the metal pattern and / or polymer pattern applied to the substrate is connected to the substrate, preferably by a thermal bonding method such as soldering, welding, lamination and / or ultrasonic, preferably to the material. Is to combine them. In the case of soldering or welding, the metal pattern, polymer pattern and / or substrate can be concentrated only in the expected contact area between the substrate and the metal pattern or polymer pattern, and energy, in particular thermal energy, can be applied. In the case of welding, the metal pattern, the polymer pattern, and / or the substrate each reach the liquidus temperature and can be interconnected by cooling. In the case of soldering, a solder agent is used to position the solder between the substrate and the metal pattern or polymer pattern, and in particular heat energy is applied to the solder. The solder has a lower liquidus temperature than the metal pattern, polymer pattern and / or substrate. Nanometal, especially nanosilver, can be used for soldering. The solder can bond the metal pattern and the substrate, especially during cooling.

  Lamination methods include thermal lamination and cold lamination. The laminating method may be characterized in that the metal pattern and / or polymer pattern is adhered to the substrate with an adhesive film. At this time, the adhesive film can press the metal pattern and / or polymer pattern against the substrate. It is preferable not to attach an adhesive film to a portion where the metal pattern and the substrate or the polymer pattern and the substrate are in direct contact with each other.

  Rather, the adhesive film can be adhered to portions of the substrate that are not covered with the metal pattern and / or polymer pattern. The shape of the adhesive film can also be an adhesive cover. In this case, the adhesive film can bond the substrate and the metal pattern and / or polymer pattern applied to the substrate while adhering from the outside. A feature of the laminating method is that the metal pattern and the substrate and / or the polymer pattern and the substrate are interconnected in a frictional connection. In this case, the adhesive film can be a factor of frictional connection.

  In addition, the metal pattern and the substrate and / or the polymer pattern and the substrate can be joined by ultrasonic or friction welding.

  The method according to the invention is comprehensively suitable for producing a metal pattern on a substrate. Therefore, the method can be applied in various technical fields. A particularly preferred embodiment of the method is characterized in that the substrate is a wiring board. A printed circuit board can be basically interpreted as a support element (Traegerelement) or a support device (Traegervorrichtung) for electronic components and wiring. Electronic elements and / or wiring can be fixed on the printed circuit board. The printed circuit board or substrate may be electrically isolated. For this reason, it is preferable to interconnect the electronic elements by electrical wiring. A preferred embodiment of this method is characterized in that the metal pattern is a wiring. Thus, the metal pattern is also one or more wires on the printed circuit board (ie, on the board). The metal pattern may also be composed of bumpy component elements. Each element of the metal pattern can be configured to be non-conductively interconnected and / or non-substance interconnected.

  In particular, in the case of wiring, it is preferable that the electrical resistance is as low as possible, or the electrical resistance can be determined by selecting a material. A preferred embodiment of the method is that the electroplating process can be carried out several times in succession, in particular using a variety of metals such as copper, silver, platinum and gold, in particular using alternating metallic materials. Is a feature. That is, the electroplating process can be continuously performed many times. Therefore, at least once, for example, silver and gold can be configured to be electroplated with a highly conductive metallic material such as platinum. For example, it is known that the current density at the outermost edge of the electrical wiring may be higher than the center due to the skin effect. In order to provide a metal pattern with as low a particularly efficient resistance as possible, it is preferred to carry out the first and / or last step of the electroplating process which is carried out several times, in particular with a highly conductive metallic material. Therefore, as an example, nickel and copper can be deposited to improve the soldering effect. For this purpose, copper can be deposited before nickel is deposited. In this way, nickel can be disposed on the outside to facilitate soldering.

  The important features of the method according to the invention are basically the polymerization process, the electroplating process and the transfer of the metal pattern to the substrate. A preferred embodiment of the method is characterized in that the electroplating step is performed with a polymer-coated patterned electrode. Therefore, it is preferable that the polymer pattern is not peeled off from the pattern electrode after the polymerization step and before the electroplating step. The polymer pattern can be particularly electrically connected to the pattern electrode. In particular, the back side of the polymer pattern can be connected. That is, in the polymerization step, the pattern electrode can be at least partially in contact with the first electrolyte.

  In this case, a polymer pattern can be formed or deposited on the pattern electrode. Thereafter, the pattern electrode can be removed from the first electrolyte. In some cases, the surface can be cleaned. In particular, the cleaning method can clean the surface with a liquid. The patterned electrode to which the polymer pattern is fixed can then be contacted at least partially with the second electrolyte. A metal substance can be deposited on the polymer pattern by the electroplating process. In this case, the current flows through the pattern electrode (especially through the electrode contact region of the pattern electrode), preferably only the electrode contact region of the pattern electrode, through the polymer pattern whose back surface is particularly in electrical contact, so that most of the metal deposition occurs. Only done with polymer patterns. In the electroplating process and / or the polymerization process, the layer thickness of the metal pattern or polymer pattern can be controlled by the strength of current, the height of voltage, and / or the charge, that is, the product of current and time.

  The method according to the invention is particularly advantageous if a process product called a metal pattern on the substrate can be produced at the lowest possible cost and / or as fast as possible. A particularly preferred feature is that particularly expensive parts can be reused and / or do not “stop” in many steps (preferably “released” after each step).

  A preferred embodiment is that the pattern electrode can be reused.

  With respect to the material of the pattern electrode surface, particularly the electrode contact region and / or the electrode replenishment region, a material that can be sufficiently fixed to the polymer pattern (however, it is better not to be too strong) can be selected. The material on the surface of the pattern electrode in the electrode contact area may be made of platinum, gold or stainless steel, or a substance containing platinum, gold or stainless steel. For example, the surface of the patterned electrode in the electrode contact region can be coated (particularly by vapor deposition) with a material containing platinum, gold, and / or stainless steel. Also, the surface of the pattern electrode can be polished. By performing such surface treatment, the roughness of the surface of the pattern electrode can be made as small as possible or the degree of fixation with the polymer pattern can be adjusted according to the purpose. The electrode replenishment region of the pattern electrode may be a substance containing glass and / or diamond-like carbon (DLC), or one made of these substances. Basically, the electrode replenishment area is designed so that very little material sticks here. The electrode replenishment region is connected by wiring inside.

  A preferred embodiment is a patterned electrode made of highly doped silicon. Since silicon is oxidized on the surface, an insulating oxide film is formed on the surface, and the surface is covered with CR / Au without an oxide film corresponding to the set pattern.

  A conductive wafer is used on the back of the pattern electrode, and basically everything can be interconnected.

  In addition, it has been found that when an organic solvent is used for the first electrolytic solution, the deposited polymer pattern can be peeled off from the first electrode particularly easily. Therefore, a feature of a preferred embodiment of the method is that the electrolyte contains an organic solvent.

  By selecting a material suitable for the pattern electrode surface, increasing the mechanical resistance of the pattern electrode surface, and / or using a suitable solvent for the first electrode (especially an organic solvent), the pattern can be used even in the polymerization process. By peeling the polymer pattern from the electrode, the pattern electrode can be prevented from being damaged or broken. Therefore, the pattern electrode can be used again for the production of the polymer pattern. Further, the first and second electrolytes can be used many times or can be regenerated stepwise or continuously until the charged compound is consumed.

  Basically, the pattern electrode surface needs to be patterned only once. For this purpose, the pattern electrode surface is divided into an electrode contact area and an electrode supplement area. There are many subranges in both areas. Therefore, a conventional method can be arbitrarily used (particularly, a high-cost one) for patterning the pattern electrode. In view of the total cost required for the production of the metal pattern on the substrate, the pattern electrode can be reused in mass production, so it is hardly a problem (even at high cost). Furthermore, it is advantageous that the conductive polymer is deposited only where the settable pattern is to be formed. The same is true for the electroplating process. Therefore, in the metal pattern manufacturing on the substrate, material consumption and related costs can be kept to a minimum.

  That is, it is basically possible to separate the polymer pattern from the pattern electrode without destroying it. A preferred embodiment of the method is characterized in that at least a part of the polymer pattern and / or the metal pattern that adheres to the substrate can be peeled off from the pattern electrode without any particular destruction. In principle, the substrate can be rigid and / or rigid. However, it is also advantageous that the substrate is flexible and / or elastic and / or bendable. In this way, the substrate can be matched to or “adapted” to the shape of the electrode, polymer pattern and / or metal pattern. Furthermore, the polymer pattern and / or the metal pattern can be more strongly fixed to the substrate than that of the pattern electrode. For this purpose, the substrate surface can be adjusted and / or formed in such a manner that the substrate adhesive is more strongly fixed to the substrate than the pattern electrode. In other methods, a non-adhesive coating can be applied to the surface of the pattern electrode, particularly to the electrode replenishment region, so that the substrate adhesive cannot be fixed here.

  Moreover, it can also be comprised so that a polymer pattern may not contact a board | substrate directly. In that case, the degree of adhesion of the metal pattern with the substrate by the substrate adhesive is greater than the degree of adhesion of the metal pattern with the polymer pattern and / or the degree of adhesion of the polymer pattern with the electrode contact region, And / or greater than the mechanical stability of the polymer pattern.

In order to describe other particularly preferred embodiments, the following description is required first.
The role of the pattern electrode is not only that of the electrode. The pattern electrode can at least indirectly determine the pattern of the polymer pattern and / or the metal pattern according to the pattern of the electrode contact area, ie the configurable pattern. Therefore, the pattern electrode has at least two functions. One may be passing current. The second role may be the formation of a polymer pattern and / or a metal pattern. For at least one embodiment of the method, if the pattern electrode is released from the first role, the second current does not flow through the pattern electrode and / or does not depend on the pattern electrode, and a metal pattern can be deposited on the polymer pattern. Would be advantageous.

  A feature of a preferred embodiment of the method is to transfer at least part of the polymer pattern and / or at least part of the metal pattern to a transfer substrate. In this case, at least a part of the polymer pattern and / or the metal pattern can be brought into contact with the transfer substrate. Transfer of at least part of the polymer pattern to the transfer substrate can be performed after the polymerization step and before the electroplating step. The step of transferring at least a part of the polymer pattern, and particularly at least a part of the metal pattern bonded to the polymer pattern, to the substrate can be performed after the polymerization step and before transferring the metal pattern to the substrate. The bond between the polymer pattern and / or the metal pattern and the transfer substrate can be bonded by a shape connection, a friction connection, and / or a material connection. At least a part of the polymer pattern or at least a part of the metal pattern is an adhesive (transfer adhesive), particularly an adhesive substance, and is preferably bonded to the transfer base material in a material connection. That is, for the transfer adhesive, it is preferable to select a transfer adhesive that allows the transfer substrate, polymer pattern and / or metal pattern to adhere to the transfer adhesive. The transfer adhesive can be self-hardening. The transfer adhesive may also be an adhesive that cures upon application of energy, particularly thermal energy. Further, the transfer adhesive may be an adhesive. The transfer adhesive is preferably formed between the transfer substrate and the polymer pattern and / or the metal pattern, particularly for its adhesive action. Also, the transfer adhesive can be insulating.

  A feature of a preferred embodiment of the method is to transfer at least part of the polymer pattern and / or at least part of the metal pattern to the substrate. In this case, at least part of the polymer pattern and / or the metal pattern can be bonded to the substrate. The at least part of the polymer pattern can be transferred to the substrate after the polymerization process and before the electroplating process. Transferring at least a portion of the polymer pattern and / or at least a portion of the metal pattern, particularly bonded to the polymer pattern, to the substrate can be performed after the electroplating process. Polymer pattern and / or metal pattern substrates can be joined by shape connection, friction connection, and / or material connection. It is preferred that at least a part of the polymer pattern and at least a part of the metal pattern are bonded to the substrate, preferably in material connection, with a substrate adhesive, in particular an adhesive substance. For the substrate adhesive, a substrate adhesive may be selected so that the transfer substrate, polymer pattern and / or metal pattern can be fixed to the substrate adhesive. The substrate adhesive can be self-hardening. The substrate pressure-sensitive adhesive may also be a pressure-sensitive adhesive that is cured by applying energy, particularly heat energy. Furthermore, the substrate adhesive may be an adhesive. A substrate adhesive, in particular its adhesive action, can be formed between the substrate and the polymer pattern and / or between the substrate and the metal pattern. The substrate adhesive may be insulative.

  A feature of the preferred embodiment is that the fluid is cured to form a transfer substrate. In this case, the fluid can be cured by removing the solvent, irradiating with ultraviolet rays and / or adding a curing agent. The curing agent can be cured by applying energy and / or heat.

  Other preferred embodiments of the method are characterized by a non-conductive polymer solution (transfer polymer), particularly a UV curable two-component adhesive (particularly dissolved in a volatile solvent), in order to form a transfer substrate. Epoxy), adhesive films and / or polymer films with adhesive coatings are applied in a particularly extensive manner to polymer patterns, metal patterns and / or electrode replenishment areas. In this case, the solvent may be an organic solvent. The vaporization temperature of the solvent can be much lower than the vaporization temperature or sublimation temperature of the transfer polymer. In order to form a transfer substrate, the solvent can be converted to a gas-aggregated state. Conversion can also be done by applying energy or heat. When heating or energy is applied, heating or energy can be applied so that the transfer polymer does not change to a gas-aggregated state. The transfer polymer can also be selected such that the polymer pattern and / or metal pattern is fixed to the transfer polymer, and in particular, the polymer pattern and / or metal pattern is more strongly fixed to the transfer polymer than the pattern electrode.

  It has been previously described that at least a portion of the polymer pattern and / or metal pattern that adheres to the substrate can be separated and / or peeled away so as not to be broken if possible from the pattern electrode. Furthermore, in this case, the factors that can be peeled off without breaking, or the favorable properties and relations for utility for that purpose were also explained. The same applies to the transfer substrate. A feature of a preferred embodiment of the method is that at least a portion of the polymer pattern and / or metal pattern that adheres to the transfer substrate can be separated and / or peeled from the pattern electrode, preferably without breaking. In other words, the polymer pattern or metal pattern that adheres to the transfer substrate can be separated and / or peeled off after the polymerization process and before the electroplating process, without particularly breaking. After the electroplating process and before transferring the metal pattern to the substrate, the polymer pattern and the metal pattern bonded to the polymer pattern by electroplating can be separated and / or peeled from the pattern electrode without any particular destruction. With the transfer adhesive, the polymer pattern and / or the metal pattern can be fixed more strongly to the transfer substrate than to the pattern electrode.

  Other preferred method features include suitable selection of transfer polymer and / or transfer adhesive and / or mechanical and / or chemical treatment of the surface of the electrode replenishment region to provide a transfer substrate for the electrode replenishment region. And / or the adhesion strength to the transfer adhesive is extremely weakened, and / or the adhesion strength to the transfer substrate and / or transfer adhesive in the electrode replenishment region is changed to a transfer substrate and / or transfer adhesion of a polymer pattern and / or a metal pattern. It should be much weaker than the bond strength to the agent. The electrode replenishment region can be, for example, applied with a non-stick coating and / or polished. The roughness of the electrode replenishment region is also preferably very low. The surface of the patterned electrode in the electrode replenishment region can contain, for example, and / or consist of oxide, glass or similar, preferably insulating materials.

  Another preferred embodiment feature of the method is that at least the metal pattern and / or at least a portion of the metal pattern can be separated and / or stripped from the pattern electrode, preferably without breaking. In particular, when separating from the pattern electrode, the polymer pattern is preferably a defined cutting point and / or a defined cutting layer. The fact that the polymer pattern acts as a defined cutting point and / or a defined cutting layer can be utilized in various (partial) processes. If the metal pattern and / or polymer pattern is (at least indirectly) in particular firmly bonded to the substrate or transfer substrate, the polymer pattern may break or tear between the pattern electrode and the metal pattern under the influence of force, If the polymer pattern is deformed so that the polymer pattern is divided into at least two parts, the metal pattern can be separated and / or peeled from the pattern electrode. In this case, the polymer pattern may be divided into several parts. Therefore, a part of the polymer pattern may adhere to the metal pattern. Other portions may be fixed to the pattern electrode.

  It would be advantageous to take advantage of material properties to separate the metal pattern, transfer substrate and / or pattern electrode from the polymer pattern as easily as possible. It has already been explained that the polymer pattern can be defined dividing points and / or defined dividing layers.

  A feature of a preferred embodiment of the method is that the metal pattern, the substrate bonded to the metal pattern and / or the transfer substrate bonded to the metal pattern can be separated from at least part of the polymer pattern. The method can dissolve at least part of the polymer pattern, preferably liquid and / or preferably polymer pattern, particularly by dissolution and / or etching, but with a solvent that hardly dissolves or corrodes the metal pattern. A method of separating and / or liquefying a polymer pattern by applying energy or heat (wherein the melting point of the polymer pattern is lower than the melting point of the metal pattern), and in particular by applying energy and / or heat A method of vaporizing and separating into gas aggregates (wherein the vaporization temperature or sublimation temperature of the polymer pattern is much lower than the melting temperature of the metal pattern) and / or for example water jets, air jets, doctor blades, sandblasts, and / or Or grinding process etc. There is 械的 separation methods.

  According to the embodiment, the polymer pattern, the pattern electrode, and / or the transfer substrate can be peeled from the metal pattern. That is, according to the above method, at least a part of the polymer pattern or other object such as a transfer substrate is destroyed, and in particular, the metal pattern is separated and / or destroyed without destroying the metal pattern. It can be peeled off without any problems.

  In this manner, the polymer pattern between the metal pattern and the pattern electrode or the transfer substrate can be removed by etching. The substrate, transfer substrate, transfer adhesive, substrate adhesive and / or pattern electrode can be designed so as not to be damaged and / or damaged by etching. The same consideration can be made for the thermal dependence. That is, the polymer pattern can be heated to a temperature at which the polymer pattern liquefies and / or vaporizes. Then, the metal pattern can be separated from the substrate and / or the transfer substrate. This is because the liquid polymer pattern has almost no adhesive action. The same can be said for the polymer pattern converted to a gas-aggregated state. This is because the vaporized polymer pattern no longer has a sticking action.

  There is basically the possibility that the substrate, pattern electrode, substrate adhesive, transfer adhesive and / or transfer substrate are not sufficiently resistant to chemical action and / or corrosive solvents. Therefore, it is preferable to provide a method capable of separating the metal pattern from at least a part of the polymer pattern by utilizing this characteristic. A feature of the preferred embodiment of the method is that the tensile strength and breaking strength of the polymer pattern are weaker than the pattern electrode, the pattern electrode surface, the metal pattern, the substrate adhesive, the transfer adhesive, the transfer substrate and / or the substrate. Then, the metal pattern can be mechanically separated from at least a part of the polymer pattern by force action. Since the tensile strength and breaking strength of the polymer pattern are weak, it acts as a specified cutting point and a specified cutting layer.

  The feature of the invention is also basically that the metal pattern is transferred from the transfer substrate to the substrate. For transfer, for example, a transfer adhesive and / or a substrate adhesive has been introduced. A feature of a preferred embodiment of the method is that the substrate adhesive and the transfer adhesive are different adhesives, particularly different adhesives. It is possible that the melting point (or melting temperature) of the substrate adhesive and the transfer adhesive are different and / or the melting temperature of the transfer adhesive is much lower than that of the substrate adhesive. It is also possible that the substrate pressure-sensitive adhesive and the transfer pressure-sensitive adhesive have different sublimation and / or vaporization temperatures, and that the transfer pressure-sensitive adhesive has a sublimation temperature and / or vaporization temperature much lower than that of the substrate pressure-sensitive adhesive. The metal pattern can be transferred or transferred from the transfer substrate to the substrate due to at least one of the difference in characteristics between the transfer adhesive and the substrate adhesive described above. By applying energy, the state of the transfer adhesive can be changed so that the strength at which the transfer adhesive adheres to the metal pattern is much weaker than the strength at which the substrate adhesive adheres to the metal pattern. A feature of a preferred embodiment of the method is that the transfer adhesive is a defined cut point and / or a defined cut layer, particularly when separating the transfer substrate from the metal pattern. In this sense, a feature of a preferred embodiment of the method is that the transfer adhesive can be dissolved in a solvent such as water, alcohol, acetone, methanol, ethanol, isopropanol, NMP and / or dichloromethane in particular. It is preferable that a solvent that can dissolve the transfer adhesive cannot dissolve the substrate adhesive and / or the substrate.

  It has been previously described that the use of a transfer substrate allows the pattern electrode to be used many times in the method. Even before the electroplating process, the polymer pattern can be selectively transferred to the transfer substrate. After the electroplating process on the pattern electrode, the metal pattern and polymer pattern can be transferred to the transfer substrate. Transfer to the transfer substrate can be performed according to one of the appropriate methods known in the prior art. One preferred embodiment of the method according to the invention is to form a transfer substrate, in particular an organic (eg polyurethane-based) self-curing, photochemically curable and / or thermosetting material, in particular a silicone adhesive. It is characterized in that an agent or a thermal adhesive is applied over a particularly wide area to the polymer pattern, metal pattern and / or electrode replenishment area. At that time, a self-curing material is preferably selected so that the polymer pattern and / or the metal pattern are preferably fixed to the self-curing material. In order to adhere between the transfer substrate and the polymer pattern and / or metal pattern, the transfer adhesive is not absolutely necessary in this case. Rather, the transfer substrate introduced here can be sufficiently fixed to the polymer pattern and / or the metal pattern. The transfer adhesive may be bonded to the transfer substrate, polymer pattern and / or metal pattern in a shape connection, friction connection, and / or material connection. Thus, in particular, the transfer substrate can be combined with the polymer pattern and / or the metal pattern in a shape connection, a friction connection and / or a material connection. The reason for such material-connected bonding is that the transfer adhesive and / or transfer polymer polymer has a chemical bond with the transfer substrate, polymer pattern and / or metal pattern, or constitutes a chemical bond. It is possible that Furthermore, it is conceivable that the transfer adhesive and / or the polymer of the transfer polymer swells during curing, so that the transfer substrate, the polymer pattern and / or the metal pattern are interconnected in a shape-connected manner.

  If the polymer pattern is transferred after the polymerization process and before the electroplating process, or if another electroplating process is performed after transferring the polymer pattern and metal pattern to the transfer substrate, for example, the electroplating process is indirect Can be applied to a transfer substrate. A feature of a preferred embodiment of the method is that an electroplating step is applied to the polymer pattern bonded to the transfer substrate and / or substrate. That is, the electroplating process is performed on the polymer pattern fixed to the transfer substrate and / or the substrate. When electroplating with a pattern electrode, a metallic material can be deposited, preferably on the opposite side of the pattern electrode of the polymer pattern and / or metal pattern. It can be similarly deposited on a transfer substrate and / or substrate. In this way, in the electroplating process, a metal material can be deposited on the opposite side of the polymer pattern or metal pattern from the transfer substrate and / or substrate.

  In an electroplating process that can be performed indirectly with an electrode, the polymer pattern and / or the metal pattern can be conductively connected through the electrode contact area of the electrode. When the polymer pattern and the metal pattern are transferred to the transfer substrate, this connection can be cut. This connection no longer exists, especially when the electrode is cut from the polymer pattern. In particular, therefore, a preferred embodiment of the method is characterized in that the polymer pattern and / or the metal pattern are electrically connected to the transfer substrate. For this purpose, the transfer substrate can be designed to be at least partially conductive, in particular the surface. A preferred embodiment of the method is characterized in that the surface of the transfer substrate contains a conductive substance. The conductive material can form a particularly wide, continuous surface of the transfer substrate, and in particular can form a surface facing the polymer pattern. In other words, the transfer substrate can have a fairly large area with a conductive surface. A polymer pattern and / or a metal pattern can be transferred to this region. Thus, the transfer allows the polymer pattern to be electrically interconnected with the transfer substrate. In particular, any subelement of the polymer pattern can be electrically interconnected. Therefore, the conductive material of the transfer substrate has a slight specific resistance. In particular, the conductive material on the surface of the transfer substrate is a metallic material and / or a metal such as silver, gold and / or platinum in particular. In summary, the surface of the transfer substrate and the polymer pattern and / or metal pattern that can be transferred to the transfer substrate can be conductive. At that time, it is particularly preferable that the transfer adhesive is conductive and also highly conductive.

  It is less preferred to contact the transfer substrate with the polymer pattern adhering and / or the metal pattern adhering at least indirectly, with the second electrolyte. This is because the metallic material of the second electrolyte is also deposited directly on the transfer substrate in the electroplating process performed under this boundary condition. Therefore, it is preferable to protect the electrolytic substance and the metallic substance from entering the direct gap of the polymer pattern. This procedure may be useful in particular in the above-mentioned poor case, as well as in any other case associated with the method according to the invention. One preferred embodiment of the method is characterized by filling the gaps in the polymer pattern. In this case, a non-conductive polymer solvent, particularly dissolved in a volatile solvent, can be applied to at least a part of the electrode (that is, particularly the replenishment region) or the transfer substrate that is not covered with the polymer pattern. In doing so, the solution can first be distributed over a wide range in polymer patterns or gaps. Thereafter, the surface of the polymer pattern can be peeled off. In this way, the solution and / or non-conductive polymer can only be in the gaps between the polymer pattern and / or the metal pattern. Volatile solvents can then be converted into a gas-aggregated state, particularly by applying energy or thermal energy. That is, the transfer substrate can have a wide range of conductive surfaces. Polymer patterns and / or metal patterns can be particularly conductively connected to this conductive surface. The gap between the polymer patterns can be formed insulative. As a result, the transfer substrate with the polymer pattern or metal pattern can be brought into contact with the second electrolyte to perform the electroplating process. At this time, the metallic substance of the second electrolyte is deposited on the polymer pattern and / or the metal pattern by the current. Here, in particular, no metal is directly deposited on the transfer substrate. This is because the transfer substrate is covered with a polymer pattern, and the electrode supplement region is covered with an insulating material, particularly a polymer.

  The conductive surface of the transfer substrate can be connected by side connection or internal electrical wiring. The conductive surface of the transfer substrate can thus be connected to a potential.

  Another preferred embodiment of the method is characterized in that the transfer substrate and / or the substrate is insulating. In this case, the conductive region can be formed by a conductive polymer pattern, and the polymer pattern can be electrically connected.

  As regards other preferred embodiments of the invention, all are the subject of the German patent application DE 10 2009 010 434.8, particularly with regard to “apparatus and / or method” for producing conductive wiring on a wiring board. The details, advantages, features, and characteristics that are clearly specified are also within the scope of this patent application.

Flowchart with various forms for carrying out the method of the present invention. Cross section of pattern electrode Schematic diagram of the polymerization station for carrying out the polymerization process Cross section of patterned electrode with polymer pattern Cross section of pattern electrode with polymer pattern and transfer substrate Sectional view of a patterned electrode with a polymer pattern, at least partially peeled off by a transfer substrate Schematic of electroplating station for performing electroplating process Cross section of transfer substrate with polymer and metal patterns Sectional view of patterned electrode with polymer pattern and metal pattern Cross section of transfer substrate with polymer pattern and metal pattern combined with substrate Sectional view of patterned electrode with polymer pattern and metal pattern combined with substrate Sectional view of the defined cutting point with a polymer pattern that is at least partially bonded to the transfer substrate Other cross-sections of defined cut points by polymer pattern, at least partially joined with pattern electrode Cross section of metal pattern on substrate

  The following figures illustrate other details, advantages and characteristics of the invention.

  FIG. 1 shows a flowchart. This flowchart includes various methods for performing the steps of the present invention. Before describing this route in detail, the symbols used in the flowchart schematics will be described. In the rectangle, the starting state and the target state are shown. The rectangles are joined by arrows. The direction of the arrow points to the preferred state change. Beside the arrows, operations that affect changes in each state are shown.

  In order to achieve the advantageous goal of the method according to the invention, ie the metal pattern on the substrate, it is first assumed that there is a pattern electrode 2. Polymerization 4 is performed using the pattern electrode 2. By polymerization, a conductive polymer is electrochemically deposited on the pattern electrode 2. This deposition is performed only at least in a pattern range that can be set. This settable pattern is an electrode contact area. That is, the conductive polymer is deposited on the electrode contact region of the pattern electrode 2. Therefore, it can also be called the polymer pattern 6 on the pattern electrode. The polymer pattern 6 on the pattern electrode is further subjected to a polymerization step 6, a transfer 31 to the substrate, an electroplating step 8, or a transfer 20 to the transfer substrate. Starting from the polymer pattern 6 on the pattern electrode, four selectable steps can be performed. First, the process starting with the electroplating process 8 is performed. The electroplating process 8 deposits a metal material on the polymer pattern. No or little metal material is deposited in the region that fills the polymer pattern. The pattern electrode 2 is bonded to the multilayer material by the polymerization process 4 and the electroplating process 8. In other words, the pattern electrode 2 is combined with the multilayer material. This is because the pattern electrode is first bonded to the polymer pattern. The polymer pattern is bonded to the metal pattern on the opposite side of the pattern electrode. Thereby, the metal pattern is coupled with the pattern electrode at least indirectly. Based on the material arrangement, that is, based on the fact that the pattern electrode is first combined with the polymer pattern and the polymer pattern is also combined with the metal pattern, this arrangement is hereinafter referred to as “metal-polymer pattern on the pattern electrode” 10 You can name it. The nomenclature for this name depends on the arrangement of materials and / or layers, from the outside to the inside. Starting from the metal / polymer pattern 10 on the pattern electrode, a transfer 12 to the substrate and / or a transfer 30 to the transfer substrate and / or other electroplating steps 8 can be performed. The path starting with the “transfer to transfer substrate 30” operation will be described in a later paragraph. Characterized by the electroplating 8 (First, the path to the metal / polymer pattern 10 on the pattern electrode will be described in a later paragraph. From the metal / polymer pattern 10 on the pattern electrode, the path is “transfer 12 to the substrate”. In this case, the metal pattern and the polymer pattern are transferred onto the substrate 14. In a simple case, the substrate is applied to the metal pattern or the metal / polymer pattern 10 on the pattern electrode (viewed from the substrate). Therefore, the layer order of the metal pattern and the substrate pattern is reversed.) The metal pattern is preferably directly bonded to the substrate, and optionally a substrate adhesive can be placed between the metal pattern and the substrate. On the opposite side, the metal pattern is bonded to the polymer pattern, ie the polymer pattern is at least Similar to the nomenclature used for pattern electrodes, the substrate is bonded to the polymer / metal pattern, so that the metal / polymer pattern 10 on the pattern electrode is transferred to the substrate. 12 results in a “polymer / metal pattern on the substrate” 14. Removal of the polymer pattern 16 from the polymer / metal pattern 14 on the substrate leaves a metal pattern 18 on the substrate.

  There are various branches in the path to reach the goal made in the paragraph, but each branch follows a unique path. Therefore, it jumps back to the first branch, that is, returns to the polymer pattern 6 on the pattern electrode.

  The polymer pattern 6 on the pattern electrode can be copied by transfer 20 to the transfer substrate. In one embodiment, the polymer pattern can be affixed to a transfer substrate with a transfer adhesive. Since the transfer substrate is more strongly fixed to the polymer pattern than the pattern electrode, the polymer pattern can be separated and / or peeled from the pattern electrode by force. This is facilitated by making the adhesion of the surface of the pattern electrode very low and making the components of the polymer pattern appropriate. An electroplating process 24 can be performed using the polymer pattern 22 on the transfer substrate. At that time, a current flows through the polymer pattern. The surface of the transfer substrate that is not covered with the polymer pattern can be covered in particular with an additional insulating material. The metal material is deposited only on the polymer pattern by the electroplating process. Therefore, the electroplating step 24 generates a metal / polymer pattern 26 on the transfer substrate. This nomenclature is used in the same manner as the metal / polymer pattern 10 on the pattern electrode, and is also used for the polymer / metal pattern on the substrate. That is, the metal / polymer pattern 26 on the transfer substrate is a stack of materials or a device. At this time, the polymer pattern is particularly directly bonded to the transfer substrate. Furthermore, the polymer pattern may be bonded to the metal pattern on the opposite side of the transfer substrate. This is due to the sequence in which the polymerization step 4 is followed by the electroplating step 24. Starting from the metal / polymer pattern 26 on the transfer substrate, an electroplating step 24 leading again to the metal / polymer pattern 26 on the transfer substrate can be performed, or a transfer 28 to the substrate can be performed. The electroplating process 24 will be described in a later paragraph. First, the “transfer 28 to substrate” will be described in detail. This is because the metal pattern and polymer pattern of the transfer substrate can be transferred to the substrate by the transfer 28 to the substrate. In this case, the metal pattern can be combined with the substrate. Particularly suitable in this case is adhesive bonding. Furthermore, the transfer substrate does not adhere to the polymer pattern as strongly as the metal pattern and / or transfer adhesive adheres to the substrate. Therefore, the polymer pattern can be separated and / or peeled from the substrate at least by dividing it. In this case, it is quite possible that the polymer pattern will crack and / or break. Therefore, the polymer pattern can act as a specified cutting point. The metal pattern and at least a part of the polymer pattern remain on the substrate. That is, the polymer / metal pattern 14 is thus formed on the substrate.

  Two crossroads were introduced in the previous paragraph. This paragraph is associated with another route starting from the first route of the two branches. Therefore, it jumps again here and returns to the polymer pattern 10 on the second branch (two previous paragraphs, that is, the pattern electrode).

  The metal / polymer pattern 10 on the pattern electrode is copied by the transfer 30 to the transfer substrate. In this case, it is advantageous to apply the transfer substrate to the metal pattern and then to separate and / or peel the transfer substrate together with the metal pattern from the pattern electrode or polymer pattern. In this case, the polymer pattern may be crushed and / or divided into a number of pieces. In other words, the polymer pattern can be used as a prescribed cutting point. After the metal / polymer pattern is transferred to the transfer substrate, the polymer / metal pattern 32 is formed on the transfer substrate. In this case, the polymer pattern may consist of a plurality of portions of the deposited original polymer pattern. This polymer pattern can be removed, for example, chemically and / or mechanically. Removal of the polymer pattern 34 leaves a metal pattern 36 on the transfer substrate. Thereafter, transfer 38 to the substrate is performed. Here, the metal pattern can be combined with the substrate. In particular, the metal pattern can be bonded to the substrate by the substrate adhesive. The transfer substrate can then be separated and / or removed. Separation and / or removal can be performed chemically or mechanically. The transfer substrate can be eluted from the metal pattern and / or the substrate, particularly with a solvent suitable for the transfer substrate. After transfer, a metal pattern on the substrate occurs.

  At each crossroad of the route towards the goal mentioned so far, we have been traveling a specific route. However, there remains another path, i.e. a path starting again from the polymer pattern 6 on the pattern electrode.

  The polymer pattern 6 on the pattern electrode can also be copied by transfer 31 to the substrate. In one embodiment, the polymer pattern can be affixed to the substrate using a substrate adhesive. Since the substrate adheres to the polymer pattern more strongly than the pattern electrode, the polymer pattern can be separated and / or peeled from the pattern electrode by force action. Peeling is facilitated by the weak adhesion of the surface of the pattern electrode and / or the appropriate polymer pattern component. An electroplating process 35 can be performed using the polymer pattern 33 on the substrate. A current then flows through the polymer pattern. The surface of the substrate that is not covered with the polymer pattern can be covered in particular with an additional insulating material. By the electroplating process, the metal material is deposited only on the polymer pattern. Therefore, a metal pattern 37 on the substrate is generated by the electroplating process 35. This nomenclature is used in the same manner as the metal / polymer pattern 10 on the pattern electrode, and is also used for the polymer / metal pattern on the substrate. That is, the metal / polymer pattern 37 on the substrate is a stack of materials or a device. At this time, the polymer pattern is particularly directly bonded to the substrate. Further, the polymer pattern can be bonded to the metal pattern on the opposite side of the transfer substrate. This is due to the sequence in which the polymerization step 4 is followed by the electroplating step 24. Therefore, the polymer pattern can also act as an adhesive layer.

  Next, the electroplating steps 8, 35 and / or 24 will be described in detail. The basics of the electroplating steps 8, 24 and 35 are the same. This is because the metal / polymer pattern 10 on the pattern electrode, the metal / polymer pattern 26 on the transfer substrate, or the metal / polymer pattern 37 on the substrate is produced by the electroplating process 8, 24 or 35. . Therefore, it is basically possible to further provide electroplating steps 8, 24, and 35 thereafter. In this case, it is advantageous to use another metal material different from the previously used metal material for the subsequent electroplating steps 8, 24, 35. That is, the metal material of the first electroplating process is, for example, copper or can contain copper. If a high current is intended to flow through the metal pattern, it is advantageous that the outermost metal layer comprises a highly conductive metal material, for example nickel. This should be taken into account in the corresponding electroplating steps 8, 24, 35.

  The same applies to polymerization 4 which can be carried out several times in succession. At this time, it is preferable to use another polymerizable and / or crosslinkable compound different from the previously used polymerizable and / or crosslinkable compound in the subsequent polymerization step 6.

  FIG. 2 shows a cross-sectional view of the pattern electrode 50. The pattern electrode 50 has a support material 40. A functional support layer 52 is provided on the support material 40. The functional support layer 52 includes a conductive electrode surface layer 42 and a non-conductive electrode surface layer 44. There is an electrode contact region 46 on the conductive surface of the electrode surface layer 42 opposite to the support material 40. On the non-conductive surface of the electrode surface layer 44 opposite to the support material 40, there is an electrode supplement region 48. The electrode contact area 46 and the electrode supplement area 48 may each consist of an individual partial surface of the pattern electrode.

  In a less advantageous embodiment, the support layer 40 is glass, the conductive electrode surface layer 42 is indium tin oxide, and the nonconductive electrode surface layer 44 is an insulating material (particularly an insulating polymer).

An alternative advantageous embodiment is that the support layer 40 is conductive in order to electrically connect all the conductive electrode surface layers 42 and / or electrode contact regions 46. The conductive electrode surface layer 42 can be made of a material different from the material of the support material 40. For example, the support material 40 is a Si wafer, where the conductive support material is silicon. The conductive electrode surface layer 42 is Cr / Au or contains Cr / Au. In addition, the non-conductive electrode surface layer 44 may be SiO ₂ or contain it.

  FIG. 3 schematically shows a polymerization station 54 for carrying out the polymerization process. The pattern electrode 50 is at least partially immersed in or brought into contact with the first electrolyte 56. At this time, the first electrolyte 56 can be put in the container 60. The pattern electrode 50 is connected to at least the first electrolyte 56 so that at least a part of the electrode contact region 46 and the electrode replenishment region 48 of the pattern electrode 50 can contact the first electrolyte. Further, the counter electrode 58 is connected to the first electrolyte 56. The pattern electrode 50 and the counter electrode 58 are connected to the power source 60 by a wiring 62. Electrochemical polymerization of the polymerization station 54 deposits a conductive polymer in the electrode contact region 46. For this purpose, a voltage is applied between the pattern electrode 50 and the counter electrode 58.

Therefore, for the examples, the polymer pattern can be made from doped poly (3-methylthiophene). The first electrolysis consists of a solvent of 0.03 Et ₄ NBF ₄ in dry propylene carbonate. In the polymerization step, the pattern electrode 50 is an anode and the counter electrode 58 is a cathode. The counter electrode may contain platinum or consist of platinum. When the power supply 60 is switched on, a voltage of 10 V, for example, is applied between the pattern electrode 50 and the counter electrode 58. Electrochemical polymerization is performed in the electrode contact region 46 of the pattern electrode 50. At this time, a polymer film made of doped poly (3-methylthiophene) having a pattern corresponding to a settable pattern is deposited. When the deposited polymer film or polymer pattern reaches the desired thickness, here 0.5 mm (after about 30 seconds), the voltage can be turned off. Thereafter, the pattern electrode 50 can be taken out from the first electrolyte 56. Thereafter, the patterned electrode 50 having the polymer film (polymer pattern) 46 formed in the electrode contact region 46 can be used in other process steps.

  FIG. 4 shows the polymer film 66 deposited on the electrode contact region 46 of the pattern electrode 50. Since there is a settable pattern in the electrode contact region 46, the deposited conductive polymer film, that is, the polymer pattern 66 is almost the set pattern. This is because the current flowing in the polymerization process flows only in the electrode contact region 46. No current flows through the non-conductive electrode surface layer 44 and / or the electrode supplement region 48. Therefore, electrochemical polymerization is not performed in the electrode replenishment region 48. Therefore, no polymer is deposited from the first electrolyte here. Therefore, the pattern of the electrode contact region 46 also determines the pattern of the polymer pattern 66 in consideration of isotropic stacked growth.

  FIG. 5 shows a cross section of the pattern electrode 50 including the polymer pattern 66 and the transfer substrate 68. At this time, the polymer pattern 66 and the transfer substrate 68 are bonded by the transfer adhesive 70. The transfer adhesive 70 can be applied to the polymer pattern 66 before the transfer substrate 68 and the pattern electrode 50 are brought into contact with each other. After contacting the transfer substrate 68 and the pattern electrode 50, the transfer adhesive 70 is cured. Thereby, the transfer substrate 68 and the polymer pattern 66 are bonded by force and / or material. Further, the transfer adhesive may chemically bond with the polymer pattern 66 and / or the transfer substrate 68. The strength at which the transfer adhesive 70 adheres to the non-conductive electrode surface layer 44 and / or the electrode supplement region 48 of the pattern electrode 50 is much lower than the strength to adhere to the transfer substrate 68 and / or the polymer pattern 66. Therefore, the polymer pattern 66 can be separated from the pattern electrode 50 and / or peeled off, particularly by force action.

  FIG. 6 shows a cross-sectional view of a patterned electrode 50 with a polymer pattern 66 that is at least partially separated by a transfer substrate 68. In this embodiment, the polymer pattern 66 adheres more strongly to the transfer substrate 68 and / or the transfer adhesive 70 than the conductive electrode surface layer 42 of the pattern electrode 50 and / or the electrode contact region 46 of the pattern electrode 50. Therefore, the polymer pattern 66 can be peeled and / or separated from the pattern electrode 50 by the transfer substrate 68. When the separation and / or peeling is started from the side and / or spread through the side surface of the pattern electrode 50, the cutting region 74 can be formed. This cutting area 74 may be wedge-shaped. In this manner, the polymer pattern is transferred from the pattern electrode 50 to the transfer substrate 68.

FIG. 7 schematically shows an electroplating station 80 for performing an electroplating process. The electroplating station 80 has a container 82. A second electrolyte 84 is placed in the container 82. The electrolyte contains copper. In this sense, a metal salt such as copper sulfate (CuSO ₄ ) can be contained. Further, a counter electrode 86 made of, for example, copper and / or containing copper is introduced into the container 82 and / or in contact with the second electrolyte 84. Further, the polymer pattern 66 is brought into contact with the second electrolyte 84. In this case, the polymer pattern can be bonded to the pattern electrode 50 or the transfer substrate 68. As long as the polymer pattern 66 is connected to the pattern electrode 50, the pattern electrode can be at least partially in contact with the second electrolyte 82. As already described with reference to FIGS. 4 and 2, the pattern electrode 50 has a non-conductive electrode surface layer 44 and / or an electrode supplement region 48. Due to the electroplating process, no or almost no metal is deposited in the electrode supplement region 48 of the pattern electrode 50. Metal deposition is performed on the polymer pattern 66. The metal pattern 92 is generated in the polymer pattern 66 by the metal deposition.

  As long as the transfer substrate 68 is used instead of the pattern electrode 50 in the polymerization step, the transfer substrate 68 can be at least partially in contact with the second electrolyte. The polymer pattern 66 is bonded to the transfer substrate 68. Further, the transfer substrate 68 has a non-conductive region 70. The non-conductive region can be complementary to the polymer pattern 66. In the case of the antecedent, the non-conductive region 70 of the transfer substrate 68 is particularly covered with a non-conductive transfer adhesive. A metal material is deposited on the polymer pattern 66 from the second electrolysis 84 by the polymerization process. No or little metal material is deposited on the non-conductive region 70 of the transfer substrate 68.

  Basically, the deposition of the metal material can be controlled by switching the power supply 90 on or off. This is because both the counter electrode 86 and the polymer pattern are connected to the power supply 90 by connection wiring. Therefore, deposition occurs only when the power source is switched on and / or when there is a voltage difference between the counter electrode and the polymer pattern.

  In summary, the metal material of the second electrolyte 84 is deposited on the polymer pattern 66 by electroplating, and at that time, the polymer pattern 66 is connected to the pattern electrode 50 and / or the transfer substrate 68.

  The figure with the reference “a” shown in the subsequent figures shows the electroplating process performed on the transfer material 68. The figure accompanied with the symbol “b” is obtained by performing an electroplating process on the pattern electrode 50.

  FIG. 8 a shows a cross section of a transfer substrate 68 with a polymer pattern 66 and a metal pattern 92. The metal pattern 92 is bonded only to the polymer pattern 66 or almost only bonded to the polymer pattern 66. The metal pattern 92 hardly extends at least on the side surface beyond the surface of the polymer pattern 66 opposite to the transfer substrate 68. In particular, depending on the voltage and / or time of the electroplating process, the metal pattern 92 has a specific thickness 94. The pattern of polymer pattern 66 creates a pattern of metal pattern 92 because metal deposition occurs at least almost exclusively on polymer pattern 66. The patterns are preferably almost the same, in particular the same thickness. The pattern advantageously corresponds to a settable pattern of pattern electrodes. No metal is deposited on the transfer adhesive 70 by the electroplating process.

  FIG. 8 b shows a cross-sectional view of the patterned electrode 50 with the polymer pattern 66 and the metal pattern 92. The metal material is deposited only on the polymer pattern 66 by the electroplating process. For this reason, the metal pattern 92 does not spread or hardly extend to the side beyond the polymer pattern 66. Depending on the voltage and / or the time during which the voltage is applied in the electroplating process, the metal pattern 92 has a specific thickness 92. At least by electrochemical electroplating, no metal is deposited in the electrode supplement region 48 of the pattern electrode 50. Therefore, the pattern of the polymer pattern 66 creates the pattern of the metal pattern 92. The two patterns are at least almost the same as the settable patterns of the pattern electrode 50.

  FIG. 9 a shows a cross section of a transfer substrate 68 with a polymer pattern 66 and a metal pattern 92 bonded to the substrate 96. The metal pattern 92 is bonded to the substrate 96 on the side 100 opposite the polymer pattern 66 and / or the transfer substrate 68. Before bonding the substrate 96 and the metal pattern 92, a substrate adhesive is applied or introduced into the substrate, the metal pattern 92 and / or the gap 98. The substrate adhesive adheres to both the substrate 96 and the metal pattern 92. The substrate 96 is insulative. In particular, the insulating support material 102 is included.

  FIG. 9 b shows a cross section of the patterned electrode 50 with the polymer pattern 66 and the metal pattern 92 bonded to the substrate 96. The connection region between the metal pattern 92 and the substrate 96 is formed similarly to the connection region of FIG. 9a. Again, substrate 96 is bonded to the metal pattern with substrate adhesive 98. However, the substrate adhesive 98 does not bond the polymer pattern 66 to the metal pattern 92 and / or the substrate 96. The advantages, features and / or characteristics of the substrate 96, transfer adhesive 98, metal pattern 92, and / or contact and / or bonding area between the metal pattern 92 and the substrate described in FIG. Applicable to

  FIG. 10 a shows a cross-sectional view of the defined cut 106 by the polymer pattern 66 that is at least partially bonded to the transfer substrate 68. The polymer pattern 66 is separated from the transfer substrate 68 and the substrate by means of at least approximately normal, outward force action or in other directions, for example, diagonally outward peel forces, / Or can be used as a normal fault. The strength of the polymer pattern 66 and / or the transfer adhesive 70 is therefore particularly low, and in particular the specific strength is lower than the specific strength of the metal pattern 92, the substrate 96, the transfer adhesive and / or the transfer substrate 68. The strength and / or specific strength can be breaking strength. With the force action described above, the polymer pattern can therefore crack at an angle as shown in FIG. 10a. At that time, the polymer pattern 66 may be crushed into a large number of parts or separated. For this reason, the polymer pattern 66 may remain partially adhered to the transfer substrate 68. The portion of the polymer pattern that remains adhered to the transfer substrate 68 is then separated from the portion of the polymer pattern 66 that remains adhered to the metal pattern 92.

  Instead (not shown), the polymer pattern 66 can be separated from the metal pattern 92 together with the transfer substrate 68, in particular almost completely. Therefore, the bond between the polymer pattern 66 and the metal pattern 92 can be formed such that an insufficient force action is required to break, break, or tear the polymer pattern 66 in order to separate the two patterns. In other words, for this purpose, the breaking strength of the polymer pattern 66 is stronger than the bond strength between the polymer pattern 66 and the metal pattern 92. The breaking strength of the polymer pattern and / or the bond strength between the polymer pattern and the metal pattern is advantageously determined by the selection of an appropriate solvent for the first electrolyte, the polymerizability of the first electrolyte and / or the appropriate selection of the crosslinkable compound. .

  FIG. 10 b is another cross-sectional view of the defined cut 106 with a polymer pattern 66 that is at least partially bonded to the pattern electrode 50. The polymer pattern is broken and / or separated into the first portion 66 a and the second portion 66 b by the outward force action on the pattern electrode 50 and the substrate 96. The force action is applied to the pattern electrode 50 and the substrate 96, at least approximately normal outside or other direction of force, particularly as in FIG. 10a. The strength of the polymer pattern 66, particularly the breaking strength, is lower than that of the pattern electrode 50, particularly the conductive electrode surface layer 42 and / or the electrode contact region 46, the metal pattern 92, the transfer adhesive 98 and / or the substrate 96.

  FIG. 11 is a cross-sectional view of the metal pattern 92 on the substrate 96. The polymer that is still bonded to the metal pattern 92 in FIG. 10a or 10b, in particular the polymer pattern 66 or a portion 66b of the polymer pattern, is removed from the metal pattern 99 thermally, chemically and / or mechanically. The transfer adhesive can also be removed (at least partially). For this purpose, mechanical, thermal and / or chemical methods are suitable. Therefore, FIG. 11 shows an important member, that is, a metal pattern 92 on the substrate 96.

  2 pattern electrodes, 4 polymerization, 6 polymer pattern on the pattern electrode, 8 electroplating process, 10 metal / polymer pattern on the pattern electrode, 12 transfer to substrate, 14 polymer / metal pattern on substrate, 16 removal of polymer pattern , 18 Metal pattern on substrate, 20 Transfer to transfer substrate, 22 Polymer pattern on transfer substrate, 24 Electroplating process, 26 Metal / polymer pattern on transfer substrate, 28 Transfer to substrate, 30 Transfer to transfer substrate , 31 Transfer to substrate, 32 Polymer / metal pattern on transfer substrate, 33 Polymer pattern on substrate, 34 Removal of polymer pattern, 35 Electroplating process, 36 Metal pattern on transfer substrate, 37 Metal / polymer on substrate Pattern, 38 Transfer to substrate

Claims (14)

In a method for producing a metal pattern on a substrate, the following method steps:
a. Polymerization process,
In this step, at least one pattern electrode having a first region (electrode contact region) of a settable pattern and the remaining second region (electrode replenishment region) on the surface is used. One electrode can be connected, and at least a part of the electrode contact region is contacted with a first electrolyte, preferably in a liquid state. At this time, a polymerized and / or crosslinkable compound is introduced into the first electrolyte. In addition, a first current is generated through the first electrolyte through the pattern electrode, and a conductive polymer film having a set pattern is formed in the electrode contact area in contact with the first electrolyte (polymer pattern). )
b. Electroplating process,
In this step, at least a part of the polymer pattern is brought into contact with the second electrolyte, which is preferably liquid, and at this time, a metallic substance is introduced into the second electrolyte. A second current is generated through the second electrolyte, and a conductive metal film having a set pattern is formed and / or deposited in the region of the polymer pattern in contact with the second electrolyte (metal pattern).
c. Step of transferring metal pattern to substrate and / or step of transferring polymer pattern to substrate In the former step, at least a part of the metal pattern is applied to the substrate, and in the latter step, at least part of the polymer pattern is applied. A method for producing a metal pattern on a substrate, characterized in that a part is applied to the substrate.   The method according to claim 1, wherein the substrate is a wiring board.   The metal pattern and / or polymer pattern applied to the substrate is preferably combined with the substrate by means of an adhesive (substrate adhesive) and / or by means of a thermal bonding technique, in particular soldering, welding, lamination and / or ultrasonic bonding. The method according to claim 1 or 2, characterized in that the materials are connected in a material connection.   2. The substrate adhesive is selected so that the adhesion between the electrode and the polymer pattern is weaker than the adhesion between the substrate adhesive and the metal pattern, the substrate and / or the polymer pattern. 4. The method according to any one of up to 3.   At least a part of the polymer pattern and / or at least a part of the metal pattern is transferred to a transfer substrate, wherein at least a part of the polymer pattern and / or the metal pattern is bonded to the transfer substrate. 5. The method according to any one of 1 to 4.   The method according to claim 1, wherein the fluid is cured to form a transfer substrate.   7. The method according to claim 6, characterized in that the fluid is cured by removing the solvent, irradiating with ultraviolet light and / or adding a curing agent.   8. A method according to any one of claims 1 to 7, characterized in that the electrode can be reused.   9. The polymer pattern and / or the metal pattern adhering to the transfer substrate is peeled off from the pattern electrode without being particularly broken down. the method of.   The metal pattern and / or the substrate bonded to the metal pattern is separated from at least part of the conductive polymer pattern, but in particular preferably the liquid and / or preferably dissolves the polymer pattern, but the metal pattern In particular by dissolving and / or corroding at least part of the polymer pattern with a solvent that does not substantially dissolve and / or corrode and / or liquefy the polymer pattern, particularly by applying energy and / or heat. The melting point of the polymer pattern is lower than the melting point of the metal pattern, and / or in particular, energy and / or heat is applied to transform the polymer pattern into a gaseous state, The vaporization temperature of the polymer pattern is lower than the melting point of the metal pattern And / or in particular by mechanical separation, for example by water jet method, air jet method, doctor blade method, sand blasting method and / or grinding method. The method according to item.   The tensile strength and / or breaking strength of the polymer pattern is lower than that of the pattern electrode, the pattern electrode surface, the metal pattern, the substrate adhesive, the transfer adhesive, the transfer substrate and / or the substrate. The method according to any one of the above.   12. The melting point (or melting temperature) of the substrate pressure-sensitive adhesive and the transfer pressure-sensitive adhesive is different and / or the melting point of the transfer pressure-sensitive adhesive is particularly much lower than the melting point of the substrate pressure-sensitive adhesive. The method according to any one of the above.   13. The sublimation temperature of the substrate adhesive and the transfer adhesive are different and / or the sublimation temperature of the transfer adhesive is particularly much lower than the sublimation temperature of the substrate adhesive, The method according to any one of the above.   14. The compound introduced into the first electrolyte is at least partly a low molecular compound, preferably a monomer, dimer or other short-chain basic structural unit of the polymer. The method according to any one of the above.

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