JP2010199210A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component that can suppress damage to a cutting blade or dicer during cutting of a mother laminate to reduce a DC resistance value, and can also suppress deformation of the laminate. <P>SOLUTION: The laminate 12a is formed by laminating rectangular magnetic layers 16. A coil L is incorporated in the laminate 12a. A lead-out conductor 22a is connected to the coil L, and extends on a magnetic layer 16d along a short side A1 in contact with the short side A1 and also comes into contact with a long side A2. A lead-out conductor 24a is connected to the coil L, and extends on a magnetic layer 16e along the short side A1 in contact with the short side A1 and comes into contact with a long side A3. An external electrode is connected to the lead-out conductors 22a and 24a, and provided on a surface of the laminate 12a. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component, and more particularly, to an electronic component including a laminate that incorporates a circuit element.

  As a conventional electronic component, a multilayer electronic component having a built-in coil is known. Such a laminated electronic component is produced by laminating an insulator layer on which a coil pattern is formed to produce a laminate, and forming external electrodes on the surface of the laminate. FIGS. 7A and 7B are diagrams showing an example of the insulator layers 210 and 310 used in the multilayer electronic component.

  An internal conductor 212 is provided on the main surface of the insulator layer 210 shown in FIG. The inner conductor 212 includes a coil conductor 214 and lead conductors 216a and 216b. The lead conductors 216 a and 216 b are provided along the entire short side of the insulator layer 210. The coil conductor 214 is provided so as to connect the lead conductors 216a and 216b.

  In the multilayer electronic component using the insulator layer 210, the insulator layer 210 shown in FIG. 7A and the insulator layer not provided with the internal conductor 212 are stacked to produce a laminate. . At this time, in order to be able to simultaneously manufacture a plurality of stacked electronic components, a mother stacked body is manufactured using a large-sized insulator layer in which internal conductors 212 are provided in a matrix. Then, the mother laminate is cut into individual laminates by a cutting blade or a dicer. Then, an external electrode is produced in the laminated body to obtain an electronic component.

  By the way, in the multilayer electronic component using the insulator layer 210, there is a problem that the cutting blade and the blade of the dicer are easily painful. More specifically, when cutting the mother laminate along the long side of FIG. 7A, it is necessary to cut the lead conductors 216a and 216b together with the insulator layer 210. The lead conductors 216a and 216b are made of, for example, a conductive paste mainly composed of Ag and are harder than the insulator layer 210. Therefore, the cutting blade and the dicer are damaged when the mother laminate is cut.

  Therefore, for example, it is conceivable to use the insulator layer 310 shown in FIG. On the main surface of the insulator layer 310, an internal conductor 312 is provided. The inner conductor 312 has a coil conductor 314 and lead conductors 316a and 316b. The lead conductors 316 a and 316 b are provided along the short side of the insulator layer 310. However, the lead conductors 316 a and 316 b are not in contact with the long side of the insulator layer 310. The coil conductor 314 is provided so as to connect the lead conductors 316a and 316b.

  In the multilayer electronic component using the insulator layer 310, it is not necessary to cut the lead conductors 316a and 316b when cutting the mother multilayer body along the long side of FIG. Therefore, the cutting blade and the dicer are less painful when the mother laminate is cut.

  However, in the insulator layer 310, the lead conductors 316 a and 316 b are provided only on a part of the short side of the insulator layer 310. Therefore, the contact area between the external electrode and the lead conductors 316a and 316b is smaller than the contact area between the external electrode and the lead conductors 216a and 216b. Therefore, the multilayer electronic component using the insulator layer 310 has a problem that the DC resistance value becomes large or the connection reliability between the external electrode and the extraction electrodes 316a and 316b is lowered.

  As an electronic component that can solve the above problem, for example, a multilayer chip inductor described in Patent Document 1 is known. FIG. 7C is a perspective view when the multilayer chip inductor 410 is viewed in plan from the lamination direction. The multilayer chip inductor 410 includes a multilayer body 411 and external electrodes 418a and 418b. The multilayer body 411 includes an internal conductor 412 serving as a coil. The inner conductor 412 has a coil conductor 414 and lead conductors 416a and 416b. The coil conductor 414 forms a spiral coil, and overlaps each other when viewed in plan from the stacking direction to form a rectangular ring as shown in FIG. The lead conductors 416a and 416b are provided along the short side of the multilayer body 411, and are in contact with either one of the long sides of the multilayer body 411.

  In the multilayer chip inductor described in Patent Document 1 having the above-described configuration, the lead conductors 416a and 416b are in contact with only one of the long sides. Therefore, when cutting the mother laminated body along the long side of FIG. 7C, it is sufficient to cut one end of each of the lead conductors 416a and 416b in the short side direction. Therefore, in the multilayer chip inductor, the cutting blade and the dicer are less painful when the mother multilayer body is cut than in the electronic component using the insulator layer 210 of FIG.

  In the multilayer chip inductor described in Patent Document 1, the lead conductors 416 a and 416 b are provided along the short side of the multilayer body 411 and are in contact with one of the long sides of the multilayer body 411. On the other hand, in the insulator layer 310 of FIG. 7B, the lead conductors 316a and 316b are not in contact with both long sides. Therefore, in the multilayer chip inductor described in Patent Document 1, it is easier to increase the length of the lead conductors 416a and 416b in the short side direction than the electronic component using the insulator layer 310 of FIG. Therefore, the contact area between the external electrodes 418a and 418b and the lead conductors 316a and 316b is likely to be larger than the contact area between the external electrode and the lead conductors 316a and 316b. Therefore, the multilayer chip inductor described in Patent Document 1 can reduce the DC resistance value.

  However, the multilayer chip inductor described in Patent Document 1 has a problem that the multilayer body 411 is deformed into an irregular shape when cut. More specifically, the inner conductor 412 is made of a conductive material mainly composed of Ag and is harder than the multilayer body 411. Therefore, the cutting blade or the dicer is bent by the force from the lead conductors 416a and 416b when the lead conductors 416a and 416b are cut. As a result, the side surface of the stacked body 411 is inclined with respect to the upper surface of the stacked body 411. In particular, in the multilayer chip inductor, the lead conductors 416a and 416b are provided only at two of the four corners of the multilayer body 411 when viewed in plan from the lamination direction. Therefore, when the mother laminated body is cut, the side surfaces in the vicinity of the lead conductors 416a and 416b are locally inclined, and the laminated body 411 is deformed distorted.

Japanese Utility Model Publication No. 5-69916

  Accordingly, an object of the present invention is to provide an electronic component capable of suppressing the cutting blade and dicer from being damaged when cutting the mother laminated body, reducing the DC resistance value, and suppressing the occurrence of distorted deformation in the laminated body. Is to provide.

  An electronic component according to an aspect of the present invention includes a stacked body formed by stacking rectangular insulating layers, a circuit element built in the stacked body, and a circuit element connected to the circuit element. A first lead conductor extending along the first side while being in contact with the first side on the insulator layer and adjacent to the first side. A first lead conductor that is in contact with the second side and not in contact with the third side adjacent to the first side, and a second lead conductor connected to the circuit element, The insulating layer different from the insulating layer provided with the first lead conductor extends along the first side while being in contact with the first side, and A second lead conductor that is in contact with the side of 3 and not in contact with the second side; Is connected to the first lead conductor and the second lead conductor, and that it and a first external electrode provided on the surface of the laminate, and wherein.

  ADVANTAGE OF THE INVENTION According to this invention, it can suppress that a cutting blade and a dicer hurt at the time of cutting of a mother laminated body, can reduce direct-current resistance value, and can suppress that a laminated body deform | transforms.

1 is an external perspective view of an electronic component according to an embodiment of the present invention. It is a disassembled perspective view of the laminated body of the electronic component which concerns on one Embodiment of this invention. It is the figure which showed the ceramic green sheet which should become a magnetic body layer. It is the graph which showed the experimental result, and has shown the value of W2-W1 of a sample. It is a disassembled perspective view of the laminated body of the electronic component which concerns on a 1st modification. It is a disassembled perspective view of the laminated body of the electronic component which concerns on a 2nd modification. FIG. 7A and FIG. 7B are diagrams showing an example of an insulator layer used in a multilayer electronic component. FIG. 7C is a perspective view of the multilayer chip inductor described in Patent Document 1. FIG.

  The electronic component according to the embodiment of the present invention will be described below.

(Configuration of electronic parts)
The configuration of an electronic component according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an external perspective view of electronic components 10a to 10c according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the multilayer body 12a of the electronic component 10a. In the electronic component 10a, the z-axis direction indicates the stacking direction. Further, the direction along the long side of the multilayer body 12a is defined as the x-axis direction, and the direction along the short side of the multilayer body 12a is defined as the y-axis direction. The positive direction and the negative direction in the x-axis direction, the y-axis direction, and the z-axis direction are based on the center of the stacked body 12a.

  As shown in FIGS. 1 and 2, the electronic component 10a includes a multilayer body 12a, external electrodes 14a and 14b, lead conductors 22a, 24a, 26a and 28a, and a coil (circuit element) L. The stacked body 12a is configured by stacking the magnetic layers 16 (16a to 16h), and has a rectangular parallelepiped shape. Moreover, the laminated body 12a incorporates the coil L.

  The magnetic layer 16 is a rectangular layer made of a magnetic material (for example, Ni—Cu—Zn based ferrite). The magnetic layer 16 has short sides A1 and A4 that are parallel to each other and extend in the y-axis direction, and long sides A2 and A3 that are parallel to each other and extend in the x-axis direction. ing. The short side A1 is located on the negative direction side in the x-axis direction, and the short side A4 is located on the positive direction side in the x-axis direction. The long side A2 is located on the positive direction side in the y-axis direction, and the long side A3 is located on the negative direction side in the y-axis direction. In FIG. 2, the symbols of the short sides A1 and A4 and the long sides A2 and A3 are attached only to the magnetic layer 16d in order to avoid complication of the drawing.

  The lead conductors 22a and 26a are provided on the main surface of the magnetic layer 16d. The lead conductor 22a extends in the y-axis direction along the short side A1 while being in contact with the short side A1 on the magnetic layer 16d. The lead conductor 22a is in contact with the long side A2 adjacent to the short side A1, and is not in contact with the long side A3 adjacent to the short side A1. Therefore, a gap SP1 is provided between the lead conductor 22a and the long side A3.

  The lead conductor 26a extends in the y-axis direction along the short side A4 while being in contact with the short side A4 parallel to the short side A1 on the magnetic layer 16d. The lead conductor 26a is in contact with the long side A3 adjacent to the short side A1, and is not in contact with the long side A2 adjacent to the short side A1. Therefore, a gap SP2 is provided between the lead conductor 26a and the long side A2.

  The lead conductor 24a extends in the y-axis direction along the short side A1 while being in contact with the short side A1 on the magnetic layer 16e. The lead conductor 24a is in contact with the long side A3 adjacent to the short side A1, and is not in contact with the long side A2 adjacent to the short side A1. Therefore, a gap SP3 is provided between the lead conductor 24a and the long side A2.

  The lead conductor 28a extends in the y-axis direction along the short side A4 while being in contact with the short side A4 parallel to the short side A1 on the magnetic layer 16e. The lead conductor 28a is in contact with the long side A2 adjacent to the short side A1, and is not in contact with the long side A3 adjacent to the short side A1. Therefore, a gap SP4 is provided between the lead conductor 28a and the long side A3.

  The coil L is composed of coil conductors (element conductors) 20a and 20b. The coil conductor 20a extends in the x-axis direction between the lead conductors 22a and 26a on the magnetic layer 16d. Thus, the lead conductors 22a and 26a are connected to the coil L. The coil conductor 20b extends between the lead conductors 24a and 28a in the x-axis direction on the magnetic layer 16e. Thus, the lead conductors 24a and 28a are connected to the coil L.

  The coil conductors 20a and 20b are provided so as to overlap when viewed in plan from the z-axis direction, and are provided so as to connect the midpoint of the short side A1 and the midpoint of the short side A4. Thereby, the lead conductors 22a and 26a and the coil conductor 20a have a line-symmetric shape with respect to the intersection of the diagonal lines of the magnetic layer 16d. Similarly, the lead conductors 24a and 28a and the coil conductor 20b have a line-symmetric shape with respect to the intersection of diagonal lines of the magnetic layer 16e.

  As shown in FIG. 1, the external electrode 14a is provided on the side surface (surface) on the negative side in the x-axis direction of the multilayer body 12a, and is connected to the lead conductors 22a and 24a. The external electrode 14a is folded back on the upper and lower surfaces at both ends in the z-axis direction and the side surfaces at both ends in the y-axis direction. As shown in FIG. 1, the external electrode 14b is provided on the side surface (surface) on the positive side in the x-axis direction of the multilayer body 12a, and is connected to the lead conductors 26a and 28a. The external electrode 14b is folded back on the upper and lower surfaces at both ends in the z-axis direction and the side surfaces at both ends in the y-axis direction.

(Method for manufacturing electronic parts)
Next, a method for manufacturing the electronic component 10a will be described with reference to FIGS. FIG. 3 is a view showing a ceramic green sheet to be the magnetic layers 16d and 16e.

First, a ceramic green sheet to be the magnetic layer 16 is prepared. Specifically, ferric oxide (Fe ₂ O ₃ ), zinc oxide (ZnO), nickel oxide (NiO), and copper oxide (CuO) were weighed at a predetermined ratio and each material was put into a ball mill as a raw material. Wet preparation. The obtained mixture is dried and pulverized, and the obtained powder is calcined at 800 ° C. for 1 hour. The obtained calcined powder is wet pulverized by a ball mill, dried and then crushed to obtain a ferrite ceramic powder.

  A binder (vinyl acetate, water-soluble acrylic, etc.), a plasticizer, a wetting material, and a dispersing agent are added to the ferrite ceramic powder, followed by mixing with a ball mill, and then defoaming is performed under reduced pressure. The obtained ceramic slurry is formed into a sheet shape on a carrier sheet by a doctor blade method and dried to produce a ceramic green sheet to be the magnetic layer 16. The ceramic green sheet to be the magnetic layer 16 does not have the size of one magnetic layer 16 but a size in which a plurality of magnetic layers 16 are arranged in a matrix. have.

  Next, a conductive paste mainly composed of Ag, Pd, Cu, Au, or an alloy thereof is applied to the ceramic green sheets to be the magnetic layers 16d and 16e by a method such as a screen printing method or a photolithography method. By applying, the coil conductors 20a and 20b and the lead conductors 22a, 24a, 26a and 28a are formed. Here, when forming the coil conductors 20a, 20b and the lead conductors 22a, 24a, 26a, 28a, as shown in FIG. 3, with respect to a large-sized ceramic green sheet, in the x-axis direction and the y-axis direction, The coil conductors 20a and 20b and the lead conductors 22a, 24a, 26a and 28a are formed so that the coil conductor 20a and the lead conductors 22a and 26a and the coil conductor 20b and the lead conductors 24a and 28a are alternately arranged.

  Next, each ceramic green sheet is laminated. Specifically, a ceramic green sheet to be the magnetic layer 16h is disposed. Next, the ceramic green sheet to be the magnetic layer 16g is disposed on the ceramic green sheet to be the magnetic layer 16h. Thereafter, the ceramic green sheet to be the magnetic layer 16g is pressure-bonded to the ceramic green sheet to be the magnetic layer 16h. The pressure bonding conditions are a pressure of 100 to 120 tons and a time of about 3 seconds to 30 seconds. Thereafter, the ceramic green sheets to be the magnetic layers 16f, 16e, 16d, 16c, 16b, and 16a are similarly laminated and pressure-bonded in this order.

  Here, the lamination of the ceramic green sheets to be the magnetic layers 16d and 16e will be described in more detail. A ceramic green sheet shown in FIG. 3 is used as the ceramic green sheet to be the magnetic layers 16d and 16e. First, as a ceramic green sheet to be the magnetic body layer 16e, the ceramic green sheet shown in FIG. 3 is laminated on the ceramic green sheet to be the magnetic body layer 16d. Next, the ceramic green sheet shown in FIG. 3 is laminated on the ceramic green sheet to be the magnetic body layer 16e as the ceramic green sheet to be the magnetic body layer 16d. At this time, the ceramic green sheet shown in FIG. 3 is shifted in the x-axis direction or the y-axis direction by one magnetic layer 16. As a result, as shown in FIG. 2, the coil conductor 20a and the lead conductors 22a and 26a are positioned on the coil conductor 20b and the lead conductors 24a and 28a.

  Note that, next to the region where the coil conductor 20a and the lead conductors 22a and 26a are located on the coil conductor 20b and the lead conductors 24a and 28a, the coil conductor 20b and the lead conductor 24a are on the coil conductor 20a and the lead conductors 22a and 26a. , 28a is present. However, the coil conductor 20a and the lead conductors 22a and 26a have a point-symmetric structure with respect to the intersection of the diagonal lines of the magnetic layer 16d, and the coil conductor 20b and the lead conductors 24a and 28a have the magnetic layer 16e. It has a point-symmetric structure with respect to the intersection of the diagonal lines. Therefore, the region where the coil conductor 20b and the lead conductors 24a and 28a are located on the coil conductor 20a and the lead conductors 22a and 26a is located on the coil conductor 20b and the lead conductors 24a and 28a. The region where is located is rotated 180 degrees around the z axis. Therefore, these regions have substantially the same structure.

  A mother laminated body is formed by the above process. The mother laminate is subjected to main pressure bonding by a hydrostatic pressure press or the like.

  Next, the mother laminate is cut into a laminate 12a having a predetermined dimension (1.6 mm × 0.8 mm × 0.6 mm) with a cutting blade. At this time, the position of the dotted line in FIG. Thereby, the unsintered laminated body 12a is obtained. This unfired laminate 12a is subjected to binder removal processing and firing. The binder removal treatment is performed, for example, in a low oxygen atmosphere at 500 ° C. for 2 hours. Firing is performed, for example, at 800 ° C. to 900 ° C. for 2.5 hours.

  The fired laminated body 12a is obtained through the above steps. The laminated body 12a is barrel-processed and chamfered. Thereafter, an electrode paste whose main component is silver is applied and baked on the surface of the laminate 12a by, for example, a dipping method or the like, thereby forming silver electrodes to be the external electrodes 14a and 14b. The silver electrode is baked at 800 ° C. for 60 minutes.

  Finally, the external electrodes 14a and 14b are formed by performing Ni plating / Sn plating on the surface of the silver electrode. Through the above steps, an electronic component 10a as shown in FIG. 1 is completed.

(effect)
According to the electronic component 10a, it can suppress that a cutting blade and a dicer hurt at the time of cutting of a mother laminated body so that it may demonstrate below. More specifically, in the insulator layer 210 of FIG. 7A, both the lead conductors 216a and 216b are in contact with both long sides. Therefore, when the mother laminate obtained by stacking two insulating layers 210 is cut only once along the long side, it is necessary to cut the two lead conductors 216a and 216b, respectively. That is, it is necessary to cut the four lead conductors 216a and 216b in one cut.

  On the other hand, in the electronic component 10a, as shown in FIG. 2, the lead conductor 22a that is in contact with the long side A2 and is not in contact with the long side A3, and the lead out that is in contact with the long side A3 and is not in contact with the long side A2 A conductor 24a is provided along the short side A1. Similarly, the lead conductor 26a that is in contact with the long side A3 and not in contact with the long side A2 and the lead conductor 28a that is in contact with the long side A2 and is not in contact with the long side A3 are along the short side A4. Is provided. Therefore, when the mother laminated body is cut only once along the long side, it is sufficient to cut two lead conductors (for example, the lead conductors 22a and 28a or the lead conductors 24a and 26a). Therefore, in the electronic component 10a, it is possible to suppress the cut blade or the dicer from being damaged by cutting the lead conductors 22a, 24a, 26a, and 28a.

  In the electronic component 10a, the DC resistance value can be reduced as described below. More specifically, in the insulator layer 310 shown in FIG. 7B, the lead conductors 316a and 316b are provided only on a part of the short side without contacting the long side. Therefore, the contact area between the lead conductors 316a and 316b and the external electrode is relatively small.

  On the other hand, in the electronic component 10a, the lead conductors 22a, 24a, 26a, and 28a are in contact with either one of the long sides A2 and A3. Therefore, the lead conductors 22a, 24a, 26a, and 28a are longer than the lead conductors 316a and 316b in the y-axis direction. Therefore, the contact area between the lead conductors 22a, 24a, 26a, and 28a and the external electrodes 14a and 14b is larger than the contact area between the lead conductors 316a and 316b and the external electrode. As a result, the DC resistance value in the electronic component 10a is reduced. Further, for example, the lead conductor 22a is in contact with the external electrode 14a even at the corner where the short side A1 and the long side A2 intersect. Therefore, the connection reliability between the lead conductors 22a, 24a, 26a, 28a and the external electrodes 14a, 14b is improved.

  Moreover, according to the electronic component 10a, it is possible to suppress occurrence of distorted deformation in the laminated body 12a when the laminated body 12a is cut, as will be described below. More specifically, as shown in FIG. 2, the lead conductor 22a that is in contact with the long side A2 and is not in contact with the long side A3, and the lead conductor 24a that is in contact with the long side A3 and is not in contact with the long side A2 Are provided along the short side A1. Similarly, the lead conductor 26a that is in contact with the long side A3 and not in contact with the long side A2 and the lead conductor 28a that is in contact with the long side A2 and is not in contact with the long side A3 are along the short side A4. Is provided. Therefore, when the mother laminated body is cut along the long side of the magnetic layer 16, the lead conductors 22a and 28a are cut at both ends of the long side A2, and the lead conductor is formed at both ends of the long side A3. 24a and 26a are cut. Therefore, when cutting, the magnitude of the force applied to the four corners of the stacked body 12a approaches evenly when viewed in plan from the z-axis direction. As a result, it is possible to suppress the occurrence of distorted deformation in the laminate 12a when the laminate 12a is cut.

  In particular, in the electronic component 10a, the number of lead conductors 22a in contact with the long side A2 is the same as the number of lead conductors 24a in contact with the long side A3. Similarly, the number of lead conductors 26a in contact with the long side A3 and the number of lead conductors 28a in contact with the long side A2 are the same. Therefore, when viewed in plan from the z-axis direction, the same number (one) of lead conductors 22a, 24a, 26a, and 28a are provided at the four corners of the multilayer body 12a. As a result, the magnitude of the force applied to the four corners of the laminate 12a approaches more evenly. Therefore, it is possible to more effectively suppress the occurrence of distorted deformation in the laminate 12a when the laminate 12a is cut.

  The inventor of the present application conducted an experiment described below in order to clarify the effect of the electronic component 10a. Specifically, ten electronic components 10a were produced as sample S1. At this time, L1, L2, W1, W2, and L shown in FIG. 1 were set as follows.

L1 = 1.6mm
L2 = 0.4mm
W1 = W2 = 0.8mm
H = 0.6mm

  In addition, as a comparative example, ten electronic components were produced as sample S2 in which the magnetic layers 16d and 16e were replaced with the insulator layer 210 of FIG. And the difference of W2 and W1 of sample S1, S2 was measured. FIG. 4 is a graph showing the experimental results and shows the values of W2−W1 of the samples S1 and S2.

  According to the graph of FIG. 4, it can be seen that the value of W2-W1 is smaller in the sample S1 than in the sample S2. Thereby, it turns out that the electronic component 10a can reduce the deformation | transformation of the laminated body 12a in the case of cutting of a mother laminated body.

(Modification)
The electronic component according to the present invention configured as described above is not limited to the electronic component 10a shown in the embodiment, and can be changed within the scope of the gist thereof. Hereinafter, an electronic component 10b according to a first modification will be described with reference to the drawings. FIG. 5 is an exploded perspective view of the multilayer body 12b of the electronic component 10b according to the first modification.

  The difference between the electronic component 10a and the electronic component 10b is the presence or absence of the magnetic layer 16i. In the electronic component 10b, a magnetic layer 16i provided with a coil conductor 20c and lead conductors 22b and 26b is added between the magnetic layers 16e and 16f. As described above, three or more magnetic layers 16 provided with the coil conductor and the lead conductor may be provided. Since the coil conductor 20c and the lead conductors 22b and 26b have the same structure as the coil conductor 20a and the lead conductors 22a and 26a, further description is omitted.

  In the electronic components 10a and 10b, the coil conductor 20 extends in the x-axis direction. However, the coil conductor 20 may extend in an oblique direction with respect to the x-axis direction.

  Next, an electronic component 10c according to a second modification will be described with reference to the drawings. FIG. 6 is an exploded perspective view of the multilayer body 12c of the electronic component 10c according to the second modification.

  The difference between the electronic component 10a and the electronic component 10c is the shape of the coil L. More specifically, in the electronic component 10a, the coil L has a linear shape, whereas in the electronic component 10c, the coil L has a spiral shape. Specifically, the coil L includes coil conductors 50a to 50f and via hole conductors b1 to b6. The coil conductors 50a to 50d are linear conductors having a length of 3/4 turns. The coil conductors 50e and 50f are linear conductors having a length of ¼ turn. A further coil conductor 50 (not shown) is provided between the coil conductors 50d and 50e.

  Furthermore, the coil conductors 50a and 50b have the same shape. The coil conductors 50a and 50b are connected in parallel by the lead conductors 26a and 28a, the external electrode 14b, and the via-hole conductor b1. The coil conductors 50c and 50d have the same shape. The coil conductors 50c and 50d are connected in parallel by via-hole conductors b3 and b4. The coil conductors 50e and 50f have the same shape. The coil conductors 50e and 50f are connected in parallel by the lead conductors 22a and 24a, the external electrode 14a, and the via-hole conductor b6. The via-hole conductor b2 connects the coil conductors 50b and 50c. The via-hole conductor b5 connects the coil conductor 50d and a coil conductor 50 (not shown). Thereby, the helical coil L is comprised.

  Note that the lead conductors 22a, 24a, 26a, and 28a in the electronic component 10c have the same configuration as the lead conductors 22a, 24a, 26a, and 28a in the electronic component 10a, and thus description thereof is omitted. As described above, like the electronic component 10c, the coil L may have a spiral shape. In addition, the DC resistance value of the electronic component 10c is reduced by connecting two coil conductors 50 having the same shape in parallel.

  In the electronic component according to the present invention, the circuit element may be an element other than the coil L. Therefore, the circuit element may be a capacitor or a filter including a coil and a capacitor.

  The present invention is useful for electronic components, and in particular, it is possible to suppress the cutting blade and dicer from being damaged when cutting a mother laminate, to reduce the DC resistance value, and to cause an irregular deformation in the laminate. It is excellent in that it can be suppressed.

A1, A4 Short side A2, A3 Long side L Coil 10a-10c Electronic component 12a-12c Laminated body 14a, 14b External electrode 16a-16l Magnetic body layer 20a-20c, 50a-50f Coil conductor 22a, 22b, 24a, 26a, 26b, 28a Lead conductor

Claims (4)

A laminate configured by laminating rectangular insulator layers; and
A circuit element incorporated in the laminate;
A first lead conductor connected to the circuit element and extending along the first side while being in contact with the first side on the insulator layer; A first lead conductor in contact with a second side adjacent to the side and not in contact with a third side adjacent to the first side;
A second lead conductor connected to the circuit element, wherein the second lead conductor is in contact with the first side on the insulator layer different from the insulator layer provided with the first lead conductor. A second lead conductor extending along the first side and in contact with the third side and not in contact with the second side;
A first external electrode connected to the first lead conductor and the second lead conductor and provided on the surface of the multilayer body;
Having
Electronic parts characterized by The insulator layer provided with the first lead conductor and the insulator layer provided with the second lead conductor are laminated in the same number;
The electronic component according to claim 1. A third lead conductor connected to the circuit element and extending along the fourth side on the insulator layer while in contact with a fourth side parallel to the first side; A third lead conductor in contact with the third side and not in contact with the second side;
A fourth lead conductor connected to the circuit element, wherein the fourth lead conductor is in contact with the fourth side on the insulator layer different from the insulator layer provided with the third lead conductor. A fourth lead conductor extending along the fourth side and in contact with the second side and not in contact with the third side;
A second external electrode connected to the third lead conductor and the fourth lead conductor and provided on the surface of the multilayer body;
Further comprising
The electronic component according to claim 1, wherein: The circuit element is composed of a plurality of element conductors provided in the plurality of insulator layers,
The first lead conductor, the third lead conductor, and the element conductor are provided on the same insulator layer, and have a line-symmetric shape with respect to an intersection of diagonal lines of the insulator layer. ,
The second lead conductor, the fourth lead conductor, and the element conductor are provided on the same insulator layer, and have a line-symmetric shape with respect to an intersection of diagonal lines of the insulator layer. That
The electronic component according to claim 3.

Images