JP2010199000A - Induction heating cooker - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an induction heating cooker equipped with a pan temperature detecting means capable of quickly detecting a point in a pan on a top plate near the highest temperature. <P>SOLUTION: Out of the adjacent coil windings of heating coils, an infrared detection element is provided under a point between an inner periphery-side coil and an outer periphery side coil formed by widening intervals between the windings, and a distance of the infrared detection element from the center of the heating coil is to be 45 mm or more and 55 mm or less. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an induction heating cooker having a heating coil in a main body, and more particularly to an induction heating cooker that can quickly detect the vicinity of the maximum temperature of a pan on a top plate.

  The induction heating cooker includes a top plate on which a pan or the like is placed on an upper surface portion of a main body, and an annular heating coil and its drive circuit are configured in the main body. The induction heating cooker is a cooker that performs cooking by causing a high-frequency current to flow through a heating coil, generating an eddy current in the pan by the generated high-frequency magnetic field, and heating the pan itself by Joule heat generated by the eddy current.

  A conventional induction heating cooker detects the temperature at the bottom of the pan with a heat sensitive element such as a thermistor in contact with the lower surface of the top plate on which the pan is placed. However, the top plate is made of crystallized glass with low thermal conductivity, and a time delay occurs until the temperature of the pan bottom reaches the lower surface of the top plate. The thermistor does not directly detect the temperature at the bottom of the pan, but indirectly detects the temperature at the bottom of the pan by detecting the temperature at the bottom surface of the top plate. It was not possible to detect with high response.

  Therefore, what detects the temperature of a pan bottom by detecting the infrared rays radiated | emitted from a pan bottom with an infrared sensor directly through a top plate is proposed (for example, patent document 1, patent document 2).

Japanese Patent Laid-Open No. 2003-347028 JP 2007-115420 A

  In the configuration shown in the patent document, no consideration has been given to uneven heating of the pan. In other words, during actual cooking, heating unevenness occurs in the pan, so the temperature difference between the portion where the pan is difficult to heat and the portion where the pan is easy to heat may be 300 ° C. or more. Therefore, if the temperature of the part where the pan is difficult to be heated is detected, abnormal overheating of the pan due to uneven heating cannot be detected, and appropriate heating control may not be performed.

  An object of the present invention is to provide an induction cooking device provided with a pan temperature detection means that can quickly detect the vicinity of the maximum temperature of a pan on a top plate in order to cope with the above problems.

  The present invention provides an infrared detection element below an inner peripheral coil and an outer peripheral coil formed by widening the interval between windings of windings wound next to each other in a heating coil. And the distance from the center of the heating coil of the infrared detecting element is set to 45 mm or more and 55 mm or less.

  According to the present invention, since the vicinity of the maximum temperature of the pan on the top plate can be quickly detected, the temperature of the pan can be controlled safely.

The external appearance perspective view of the induction heating cooking appliance of Example 1. FIG. The heating coil top view of the induction heating cooking appliance of Example 1. FIG. The heating coil bottom view of the induction heating cooking appliance of Example 1. FIG. Sectional drawing of the induction heating cooking appliance of Example 1. FIG. The functional block diagram of the pot heating control system of the induction heating cooking appliance of Example 1, and sectional drawing of an infrared detection module. The heating coil top view of the conventional induction heating cooking appliance. The pan heating distribution map by the heating coil of the conventional induction heating cooker. The sensor position schematic diagram of the induction heating cooking appliance of Example 1. FIG. The sensor position schematic diagram of the induction heating cooking appliance of Example 1. FIG. The pan heating distribution map by the heating coil of the induction heating cooking appliance of Example 1. FIG. The figure which shows the pan distance at the time of frying pan lifting. The heating coil top view of the induction heating cooking appliance of Example 2. FIG. Sectional drawing of the induction heating cooking appliance of Example 2. FIG. Sectional drawing of the induction heating cooking appliance of Example 3. FIG. The infrared sensor module sectional drawing of the induction heating cooking appliance of Example 2. FIG. Sectional drawing of the other infrared sensor module of the induction heating cooking appliance of Example 2. FIG.

  Embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is an external perspective view of the induction heating cooker according to the first embodiment. In FIG. 1, 101 is a main body of an induction heating cooker, 102 is an operation unit for turning on / off the power, setting heating, etc., 103 is a display unit, 104 is a top plate on which a pan made of heat-resistant glass or the like is placed. And has transparency in the infrared region. 105 and 106 are heating areas in which a heating coil for inductively heating a pan or the like is installed below, 107 is a heating area in which a radiant heater for heating the pot or the like is installed below, and 108 to 110 are infrared rays emitted from the bottom of the pot. An infrared transmission region 111 that passes below the plate 104 is an inlet for cooling air that cools a circuit and the like provided in the main body 101.

  FIG. 2 is a top view of the vicinity of the heating coil 200 below the heating region 106. The heating coil 200 is composed of an inner peripheral coil 201 and an outer peripheral coil 202 provided on the same plane with a concentric gap G interposed therebetween, so that current in the same direction flows through both coils. The outer end of the side coil 201 and the inner end of the outer peripheral side coil 202 are electrically connected. In this embodiment, the inner peripheral coil 201 is provided at a distance of about 30 to 45 mm from the coil center, and the outer peripheral coil 202 is provided at a distance of about 55 to 90 mm from the coil center. . 203 is a coil base for holding the heating coil 200, 204 is a detection area of an infrared sensor module provided at a distance of 45 to 55 mm from the center of the coil, and infrared rays emitted from the bottom of the pan are sent to an infrared sensor module 407 to be described later. This is the guiding area. In this embodiment, the size of the detection area 204 of the infrared sensor module is about 10 mm in diameter. Reference numerals 205 to 208 denote thermistors (contact temperature sensors) for measuring the temperature of the lower surface of the top plate 104.

  FIG. 3 is a bottom view of the coil base 203. In FIG. 3, reference numerals 301 to 312 denote radially provided ferrite cores for efficiently inputting the magnetic fields generated by the inner peripheral coil 201 and the outer peripheral coil 202 to the pan on the top plate 104. The pitch between the ferrite cores 301 and 302 is larger than the pitch of other ferrite cores in order to provide the detection area 204 of the infrared sensor module.

  4 is a cross-sectional view of the main body taken along the plane AA ′ of FIG. In FIG. 4, 401 is a cooling fan, 402 is a motor that drives the cooling fan 401, 403 to 405 are high-frequency current supply circuits that supply predetermined power to the heating coil 200, and 406 is cooling air sucked by the cooling fan 401. An arrow 407 indicating a flow is an infrared sensor module. The coil base 203 is in close contact with the lower surface of the top plate 104 by a spring (not shown).

  FIG. 5 is a functional block diagram showing the pan heating control system. In FIG. 5, reference numeral 501 denotes a pan that is an object to be heated, 502 a temperature calculation circuit that calculates the temperature of the pan 501 based on the outputs of the infrared sensor module 407 and the thermistors 205 to 208, and 503 according to the output of the temperature calculation circuit 502. The control circuit controls the high-frequency current supply circuit 405 and the power supplied to the heating coil 200. Reference numeral 508 denotes a light shielding cylinder that guides the infrared rays emitted from the pan 501 to the lower infrared sensor module 407 and prevents the infrared rays emitted from the heating coil 200 from entering the infrared sensor module 407.

  Next, the configuration of the infrared sensor module 407 will be described. In the cross-sectional view of the infrared sensor module 407, reference numeral 504 denotes a thermopile that is a kind of thermal infrared detection element. Reference numeral 505 denotes a windproof case incorporating a thermopile 504, which is made of a resin having low thermal conductivity in order to prevent a sudden change in the ambient temperature of the thermopile 504. Reference numeral 506 denotes a windproof window provided on the upper surface of the windproof case 505 to make the windproof case 505 an airtight structure, which transmits infrared rays from the pan 501 and radiates the top plate 104 warmed by heat transfer from the pan 501. Cuts infrared rays (5 microns or more) having a high temperature-raising effect and suppresses temperature rise in the windproof case 505.

  Reference numeral 507 denotes an infrared transmitting member, which is obtained by processing the same material as the top plate 104 into a lens shape. That is, since the wavelength transmission characteristics of the infrared transmitting member 507 are the same as those of the top plate 104, infrared rays having a wavelength transmitted through the top plate 104 among infrared rays emitted from the pan 501 are also transmitted through the infrared transmitting member 507. On the other hand, infrared light having a wavelength cut by the top plate 104 is also cut by the infrared transmitting member 507. Infrared rays radiated from the lower surface of the top plate 104 that has become hot due to heat transfer from the pan 501 also reach the infrared transmitting member 507, but most of the infrared rays are infrared rays having a wavelength that is cut by the infrared transmitting member 507. Therefore, most of infrared rays emitted from the top plate 104 are cut by the infrared transmitting member 507. That is, most of the infrared rays reaching the thermopile 504 are infrared rays emitted from the pan 501 and the influence of infrared rays emitted from the top plate 104 is small. it can.

  Next, the operation of this embodiment will be described. When the user places the pan 501 on the top plate 104 and operates the operation unit 102 to start heating, the control circuit 503 controls the high-frequency current supply circuit 405 to supply predetermined power to the heating coil 200. When a high-frequency current is supplied to the heating coil 200, an induction magnetic field is generated from the heating coil 200, and an eddy current is generated in the pan on the top plate to be induction heated. This induction heating raises the temperature of the pan, and the food in the pan is cooked.

  In general, an object itself emits infrared rays according to its temperature. The intensity of the infrared rays increases with the temperature of the object. Therefore, if the amount of infrared rays emitted from the pan is measured using the infrared sensor module, the temperature of the pan can be measured instantaneously.

  The problem here is that when induction heating is performed using a heating coil, the temperature at the bottom of the pan does not become uniform, so even if an infrared sensor module is used, the maximum temperature at the bottom of the pan may not be accurately measured. . The temperature measurement by the infrared sensor in the conventional induction heating cooker is demonstrated using FIG. 6, FIG. FIG. 6 is a top view of the vicinity of a conventional heating coil, in which 601 is an integrated heating coil formed at a distance of about 36 mm to about 88 mm from the coil center, and 602 is provided at a position about 15 mm from the coil center. It is a detection area of an infrared sensor module. FIG. 7 shows that when the heating coil 601 is used to heat a stainless steel pan having a relatively thin bottom with high heating power, the maximum temperature of the pan bottom surface temperature reaches about 360 ° C. (ignition temperature of tempura oil). Was measured at a distance of 10 mm from the coil center. As can be seen from FIG. 7, the minimum temperature at the bottom of the pan is about 30 ° C. near the center, and the maximum temperature at the bottom of the pan is about 350-360 ° C. near a distance of 50 to 70 mm from the coil center. That is, the temperature difference between the lowest temperature and the highest temperature is about 330 degrees. This is because the integrated coil 601 has a donut shape, and on the principle of induction heating, the pot portion on the heating coil has the largest eddy current and the largest temperature rise. This is because the temperature rise is small because the current is small. In the detection area 602 of the conventional infrared sensor module provided at a position about 15 mm from the coil center, only a pot bottom temperature of about 60 ° C. could be observed. That is, the temperature difference between the maximum temperature and the observed temperature reached about 270 ° C.

  In the induction heating cooker of this embodiment, in order to measure the pan bottom temperature at a distance of 50 to 70 mm from the center of the coil where the pan bottom temperature becomes maximum, as shown in FIG. The infrared coil is divided into outer peripheral coils 202, and an infrared sensor module detection area 204 is provided at a distance of 50 mm from the coil center. The detection area 204 provided at a distance of 50 mm from the coil center is a position included in the position of 50 to 70 mm from the coil center where the pan bottom temperature is highest, and at the same time, as shown in FIG. Even when heating a small-diameter pan with the smallest diameter of 120 mm among the high pans, the pan bottom can completely cover the detection area 204 of the infrared sensor module, and the temperature of the pan bottom can be measured. is there.

  FIG. 10 shows a case where a heating pot 200 is used to heat a stainless steel pan having a relatively thin bottom with high heating power, and when the highest point of the pan bottom surface temperature reaches about 360 ° C. (ignition temperature of tempura oil). Was measured at a distance of 10 mm from the coil center. As can be seen from FIG. 10, the minimum temperature at the bottom of the pan is about 50 ° C. near the center, and the maximum temperature at the bottom of the pan is about 360 ° C. near a distance of 70 mm from the center of the coil. The pan bottom temperature observed at a position of about 50 mm from the coil center where the detection area 204 is provided is about 320 ° C. That is, if the configuration of the present embodiment is used, the temperature difference between the maximum temperature and the observed temperature can be only about 40 ° C., and the thermal power control based on the observed temperature can be suitably performed.

  In addition, when the space | interval G of the inner peripheral side coil 20 and the outer peripheral side coil 202 shown in FIG. 2 is wide, since the pan bottom temperature on the detection area 204 falls, the space | interval G is so good that it is narrow, but when the space | interval G is made too narrow. The detection area is also narrowed, and infrared rays emitted from the pan bottom cannot be sufficiently captured. Therefore, it is desirable to set the gap G to a certain extent to about 10 to 20 mm. In this embodiment, the gap G is set to 15 mm.

  Further, as shown in FIG. 3, the thermistor 205 is installed next to the ferrite core 301 next to the detection area 204, and the thermistors 206 and 207 are arranged so as to form a substantially equilateral triangle by the thermistors 205 to 207. The thermistor 208 is arranged at the center of the equilateral triangle. As a result, as shown in Fig. 9, even if the 120mm diameter pan bottom moves within the circle of 200mm diameter, which is the coil heating range, there are always multiple thermistors under the pan bottom, so the temperature at the pan bottom can be detected. It becomes. If there is no infrared sensor module detection area 204 under the pan bottom, high heating power input is not performed and relatively slow heating control is performed.

  In addition, as shown in FIG. 11, when a user cooks using a frying pan or the like, the frying pan 111 may be tilted. In this case, most of the operations are lifting the front side (operation unit side) of the frying pan 111. In this embodiment, since the detection area 204 of the infrared sensor module is located on the opposite side of the operation unit side from the coil center, the distance H between the top plate and the frying pan 111 is shortened, so that the pan bottom temperature is accurately measured even when slightly lifted. it can.

  In the present embodiment, the thermopile has been described as an example of the thermal infrared detection element, but the same effect can be obtained by using other thermal infrared detection elements (for example, pyroelectric element, go-ray cell, bolometer, etc.). . The same effect can be obtained even when a quantum infrared detecting element (for example, a photodiode, a phototransistor, a CdS cell, a phototube) is used.

  As described above, according to the induction heating cooker of the present embodiment, the vicinity of the maximum temperature of the pan on the top plate can be detected quickly, so that the temperature of the pan can be controlled safely.

  Next, a second embodiment of the present invention will be described. Of the configuration of the second embodiment, the description of the same configuration as that of the first embodiment is omitted.

  In the induction heating cooker of Example 2, the temperature of the pan bottom can be observed at a plurality of points by providing detection areas of a plurality of infrared sensor modules. FIG. 12 is a top view of the vicinity of the heating coil 200 below the heating region 106. As shown in FIG. 12, the induction heating cooker of this embodiment includes a detection area 121 and a detection area 122 of the infrared sensor module, and can observe the pan bottom temperature on the detection area 121 and the detection area 122. .

  Here, if two infrared sensor modules 407 are provided immediately below the detection areas 121 and 122, the cooling air passage shown in FIG. 4 is obstructed, and cooling of the coil 200 becomes difficult. As shown in the cross-sectional view, an infrared sensor module 407 that can detect infrared rays in two detection areas 121 and 122 is used. That is, the infrared light that has passed through the detection area 121 of the top plate 104 reaches the infrared sensor module 407 via the light-shielding tube 5081, the reflecting mirrors 131 and 132, and the infrared light that has passed through the detection area 122 of the top plate 104. Then, the light reaches the infrared sensor module 407 via the light shielding tube 5082 and the reflecting mirrors 134 and 133. Thus, by comprising, it realized having observed the pan bottom temperature on the detection area 121 and the detection area 122, avoiding becoming the obstruction of a cooling air path.

  Further, if infrared rays can be detected from the two detection areas 121 and 122 of the infrared sensor module, as shown in FIG. 9, the operation portion is within the range of a circle with a diameter of 200 mm, which is a coil heating range of a pot bottom with a diameter of 120 mm. Even if it moves to the side, the temperature of the pan bottom can be detected by the infrared sensor module. That is, since it is possible to avoid a situation where there is no infrared sensor module detection area 204 under the pan bottom, it is easy to continue the high thermal power input.

  Next, details of the infrared sensor module 407 of the present embodiment will be described with reference to FIGS. 15 and 16.

  FIG. 15 shows a first form of the infrared sensor module 407 in the present embodiment. As shown in FIG. 15, two thermopiles 5041 and 5042 are provided in the infrared sensor module 407. Infrared rays from the region 121 reach the right thermopile 5041, and a voltage value corresponding to the amount of infrared rays is output by the internal thermocouple 151. In addition, infrared rays from the region 122 reach the left thermopile 5042, and a voltage value corresponding to the amount of infrared rays is output by the internal thermocouple 152.

  In this way, by using the infrared sensor module with two thermocouples, the infrared sensor module is prevented from becoming an obstacle to the cooling air path, and the wiring with the infrared sensor module is simplified, and the two areas are used. The corresponding pan bottom temperature can be measured.

  FIG. 16 shows a second form of the infrared sensor module 407 in the present embodiment. As shown in FIG. 16, a thermopile 5043 is provided in the infrared sensor module 407. The thermopile 5043 includes a thermocouple 161 that outputs a voltage value according to the amount of infrared rays that the infrared rays from the region 121 reach, and a thermocouple 162 that outputs a voltage value according to the amount of infrared rays that the infrared rays from the region 122 reach. I have.

  In this way, by using the infrared sensor module with two thermocouples, the infrared sensor module is prevented from becoming an obstacle to the cooling air path, and the wiring with the infrared sensor module is simplified, and the two areas are used. The corresponding pan bottom temperature can be measured.

  Next, a third embodiment of the present invention will be described. Of the configuration of the third embodiment, the description of the same configuration as that of the second embodiment is omitted.

  FIG. 14 is a cross-sectional view of the induction heating cooker according to the third embodiment. As shown in FIG. 14, prisms 141 and 142 are provided below the top plate 104. Infrared light that has passed through the detection area 121 of the top plate 104 reaches the infrared sensor module 407 via the prism 141. Similarly, infrared light that has passed through the detection area 122 of the top plate 104 reaches the infrared sensor module 407 via the prism 142. The configuration of the third embodiment has an advantage that manufacturing is easy in addition to the effect obtained by the configuration of the second embodiment because the number of components constituting the optical path is smaller than that of the second embodiment.

  In addition, also in the induction heating cooking appliance of Example 3, you may use either of the infrared sensor modules shown in FIG. 15, FIG.

104 Top plate 201 Inner peripheral side coil 202 Outer peripheral side coil 203 Coil bases 301 to 312 Ferrite core 407 Infrared sensor module 501 Pan

Claims (8)

A top plate that is transparent in the infrared region;
In an induction heating cooker provided with a heating coil installed below it,
The heating coil is composed of an inner peripheral side coil and an outer peripheral side coil formed by widening the interval between the windings among windings wound adjacent to each other, and the inner peripheral side coil and the outer peripheral side coil are formed. An induction heating cooker characterized in that an infrared detection element is provided below the side coil, and the distance of the infrared detection element from the center of the heating coil is 45 mm or more and 55 mm or less. The induction heating cooker according to claim 1,
An induction heating cooker characterized in that an interval between the inner peripheral coil and the outer peripheral coil is 20 mm or less, and an infrared detection element is provided below the interval. The induction heating cooker according to claim 1,
The induction heating cooker, wherein the infrared detection element is a thermal infrared detection element. The induction heating cooker according to claim 1,
An induction heating cooker, wherein the output of the heating coil is controlled according to the output of the thermal infrared detection element. A top plate for placing an object to be heated;
A heating coil having a concentric gap between the inner peripheral heating coil and the outer peripheral heating coil;
A light-shielding cylinder that is provided in the concentric circular gap and guides the infrared rays emitted from the object to be heated placed on the top plate downward;
An infrared sensor module that outputs a voltage value corresponding to the amount of infrared rays through the light shielding cylinder;
A temperature calculation circuit for calculating the temperature of the object to be heated based on an output voltage value from the infrared module;
The outer circumference of the inner circumference side coil is provided at a distance of about 45 mm from the coil center,
The inner circumference of the outer circumference side coil is provided at a distance of about 55 mm from the coil center,
The induction heating cooker characterized in that the light shielding cylinder is provided at a distance of 45 to 55 mm from the coil center. A top plate for placing an object to be heated;
A heating coil having a concentric gap between the inner peripheral heating coil and the outer peripheral heating coil;
A first light-shielding tube that is provided in the concentric gap and guides the infrared rays emitted from the object to be heated placed on the top plate downward;
A second light-shielding cylinder that is provided in the concentric gap and guides the infrared rays emitted from the heated object placed on the top plate downward;
An infrared sensor module that outputs a voltage value corresponding to the amount of infrared rays through the first and second light shielding cylinders;
A temperature calculation circuit for calculating the temperature of the object to be heated based on an output voltage value from the infrared module;
A first thermocouple and a second thermocouple are provided in the infrared sensor module, and the first thermocouple outputs a voltage value corresponding to infrared rays through the first light shielding tube, and the second thermocouple The induction heating cooker, wherein the thermocouple outputs a voltage value corresponding to infrared rays through the second light shielding cylinder.   The induction heating cooker according to claim 6, wherein a reflecting mirror is provided in an optical path between the light shielding tube and the infrared sensor module.   7. The induction heating cooker according to claim 6, wherein a prism is provided in an optical path between the light shielding tube and the infrared sensor module.

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