JP4077501B2 - Cooker - Google Patents

Description

  The present invention relates to a cooking device having an induction heating (hereinafter referred to as IH) type, a halogen heater or the like as a heat source.

  Conventionally, as this type of cooking device, one using a temperature sensor such as a thermistor for detecting the temperature of a pan is known (for example, see Patent Document 1). This temperature sensor is arranged in the center of the bottom surface of the top plate on which the pan is placed, detects the center temperature of the bottom surface of the pan by heat conduction through the top plate, and based on this detection result, the pan is set to a desired temperature. Temperature control.

Japanese Examined Patent Publication No. 6-75425

  FIG. 8 is a cross-sectional view showing the structure of this cooking device. In FIG. 8, 101 is a top plate for placing the pan 102 or the like, and is attached to the main body 103 by adhesion or the like. A coil 104 that is a heating means for generating high-frequency magnetic lines of force and a control circuit 105 that controls the coil 104 are built in the main body 103, and a temperature sensitive element 106 is pressure-bonded to the lower surface of the top plate 101. Then, a signal from the temperature sensing element 106 is input to the control circuit 105, and the control circuit determines the boiling of water based on the temperature rise gradient of the pot 102 on the top plate 101 and the elapsed time since the energization. Then, the energization of the coil 104 is cut off.

  However, in the heating cooker of the temperature sensor type as described above, there is a high possibility of giving a large error to the temperature measurement of the pan depending on the properties (material, shape, etc.) of the pan. That is, the temperature rise gradient varies depending on the difference in thermal conductivity depending on the material and thickness of the pan, and the heating time by the time measuring means also varies. Therefore, it is difficult to realize boiling detection with little error. In addition, the bottom shape of the pan is not flat but concave (hereinafter referred to as a warped pan). In this case, the center of the pan bottom does not contact the top plate, so a large error occurs in the temperature measurement of the pan. To do. Furthermore, in the case of such a warp pan, the temperature rise gradient is delayed as compared with a pan having a flat bottom shape, and it is difficult to detect an accurate temperature gradient of the pan.

  This invention is made | formed in order to solve this subject, and it aims at obtaining the heating cooker which enables highly accurate temperature detection, without being influenced by the material and shape of a pan.

The heating cooker of the present invention is provided on the top plate and transmits a first measurement area that transmits infrared rays radiated from the bottom surface of the heating container to the bottom surface of the top plate, and is radiated from the bottom surface of the heating container. A second measurement area that blocks infrared rays that are emitted and emits infrared rays caused by the temperature of the top plate, and is disposed below the top plate, and the amount of infrared rays from the first measurement area and the second measurement area An infrared amount detection unit that detects the amount of infrared rays, and a calculation unit that calculates the temperature of the heating container based on the infrared amounts of the first measurement area and the second measurement area detected by the infrared amount detection unit , The infrared ray amount detection unit has a single infrared sensor in which a plurality of light receiving elements are arranged in a line or an array, and a part of these light receiving elements is an infrared ray from the first measurement area. The other part of these light receiving elements detects the amount of infrared rays from the second measurement area, and is disposed around the infrared sensor, and generates a magnetic field around the energizing coil that heats the object to be heated. It is characterized by including a shielding member for blocking the above.

Since the heating cooker according to the present invention is configured as described above, the following effects can be obtained.
That is, since the bottom surface temperature of the heating container is calculated based on the amount of infrared rays radiated from the bottom surface of the heating container, there is a gap between the bottom surface of the heating container and the top plate like a warp pan. However, temperature detection can be performed accurately.
The amount of infrared rays from the first measurement area is a value obtained by adding the amount of infrared rays transmitted from the bottom surface of the heating container to the top plate and the amount of infrared rays generated from the top plate. The amount of infrared rays from the measurement area 2 is only the amount of infrared rays generated by the top plate. Therefore, the true value of the bottom temperature of the heating container can be accurately calculated by calculating the difference between the amount of infrared rays from the first measurement area and the amount of infrared rays from the second measurement area by the calculation unit. can Ru.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of a heating cooker according to the invention will be described with reference to the accompanying drawings.
Embodiment 1 FIG.
1 is a cross-sectional view showing a state where a warp pan is placed on a heating cooker according to Embodiment 1. FIG. Moreover, FIG. 2 is sectional drawing which shows the state which mounted the pan with a flat bottom in the heating cooker which concerns on Embodiment 1. FIG.

  1 and 2, the heating cooker according to the first embodiment is housed in a box-shaped housing 2 and wound in a spiral on one plane, and above the current-carrying coil 1. The flat top plate 3 that is disposed in the vicinity of the casing 2 and that constitutes the upper surface of the casing 2; the ability control means 4 that increases or decreases the amount of high-frequency alternating current flowing through the energizing coil 1; And an operation panel 5 for inputting a signal such as a heating / stop signal for the capacity control unit 4 and a temperature setting of the object to be heated.

  Here, a permeable heat-resistant insulating material such as crystallized glass is used for the top plate 3, but other transmissive materials may be used. In addition, a pan (heating container) 6 in which an object to be heated is accommodated can be placed on the top surface of the top plate 3 at a position facing the energizing coil 1. The pan 6 is generally made of a metal material such as iron, and is placed in an alternating magnetic field formed around the coil as the energizing coil 1 is energized. As a result, due to the action of eddy current flowing inside the pan 6, the entire pan 6 serves as a heating source, and the object to be heated accommodated in the pan 6 is heated. In FIG. 1, a warped pan having a concave bottom surface is used, and in FIG. 2, a pan having a flat bottom surface is used.

  Moreover, the heating cooker of Embodiment 1 is arrange | positioned under the top plate 3 in the approximate center part of the mounting position of the pan 6, and the infrared rays from the 1st measurement area 7a and the 2nd measurement area 7b which adjoin each other. An array infrared sensor (infrared sensor) 7 for detecting the amount, a black body paint layer 8 having an infrared emissivity close to 1 applied to the second measurement area 7b on the lower surface of the top plate 3, and an array infrared sensor 7. Based on the detected amount of infrared rays, the calculation unit 9 that calculates the bottom temperature of the pan 6 and the temperature information calculated by the calculation unit 9 and the heating / heating set by the operation panel 5 are arranged on the front surface of the casing 2. And a display panel 10 for displaying information on the stop state and temperature setting.

  Next, detailed configurations of the array infrared sensor 7 and the calculation unit 9 will be described with reference to the block diagram of FIG. In FIG. 3, the array infrared sensor 7 is disposed in front of the pair of light receiving elements 11a and 11b arranged in a line and these light receiving elements 11a and 11b, and receives the infrared light from the first measurement area 7a. A condensing lens 12 is provided for condensing the light from the second measurement area 7b and condensing the infrared light from the second measurement area 7b onto the light receiving element 11b. Here, the condenser lens 12 is made of a material having substantially the same infrared transmission wavelength as that of the first measurement area 7 a of the top plate 3. That is, the crystallized glass used as a general plate material has a characteristic of transmitting about 90% of a wavelength of about 0.5 μm to about 2.5 μm. It is made of a material that transmits a wavelength of 5 μm to about 2.5 μm.

  As described above, the condensing lens 12 is made of a material having substantially the same infrared transmission wavelength as that of the first measurement area 7a of the top plate 3, so that most infrared light transmitted through the first measurement area 7a is collected. It reaches the array infrared sensor 7 without being reflected by the optical lens 12. As a result, the infrared rays from the first measurement area 7a can be detected by the array infrared sensor 7 without being lost along the optical path, and the detection accuracy of the array infrared sensor 7 is improved.

  The array infrared sensor 7 includes a scanning unit 13 that selects output signals from the light receiving elements 11a and 11b by an address signal (described later), and an amplification unit that amplifies the output signal selected by the scanning unit 13 to a predetermined level. 14, a contact type reference temperature element 15 made of a thermistor or the like disposed in the vicinity of the cold junction of the light receiving elements 11 a and 11 b, and an amplifying unit 16 that amplifies an output signal from the reference temperature element 15 to a predetermined level, A differential amplifying unit 17 that receives and amplifies the signal amplified by the amplifying unit 14 and the output signal amplified by the amplifying unit 16 is provided.

  The array infrared sensor 13 includes the light receiving elements 11a and 11b, the scanning unit 13, the amplification units 14 and 16, the reference temperature element 15 and the differential amplification unit 17 in a can package or the like, and a condensing lens on the surface of the package. 12 may be arranged. By comprising in this way, a low-cost apparatus with a small space can be provided.

  Next, a microcomputer (hereinafter referred to as a microcomputer) 18 constituting the calculation unit 9 will be described. The microcomputer 18 receives the output signal from the signal output unit 19 for selectively outputting the address signals of the light receiving elements 11a and 11b to the scanning unit 13 at a predetermined timing and the output signal from the differential amplifying unit 17 of the array infrared sensor 13, and receives the light receiving element 11a. , 11b, and an A / D converter 21 for converting the voltage output from the multiplexer 20 into a digital signal. Moreover, the microcomputer 18 receives the output signal from the memory | storage part 22 which memorize | stores the digital signal output of the A / D conversion part 21, and the signal output part 19 and the memory | storage part 22, and performs the arithmetic processing according to the objective. The temperature calculation part 23 and the capability control determination part 24 which receives the output signal from the pan bottom temperature calculation part 23, and determines the control amount to the capability control means 4 are provided.

  The storage unit 22 has storage buffers corresponding to the two light receiving elements 11a and 11b. Moreover, in the pan temperature calculation part 23, 2 of the infrared rays amount from the 1st measurement area 7a condensed on the light receiving element 11a and the infrared rays amount from the 2nd measurement area 7b condensed on the light receiving element 11b. The bottom surface temperature of the pan 6 is calculated from the two outputs. Furthermore, the energization amount control of the energization coil 1 can be performed via the capability control means 4 based on the output result of the capability control determination unit 24 and the operating conditions input to the operation panel 5. In addition, the output of the bottom temperature of the pan 6 calculated by the pan temperature calculation unit 23 is transmitted to the display panel 9 and displayed on the display panel 9 as the current detected temperature.

  Next, the operation of the heating cooker according to the first embodiment will be described. First, when the pan 6 in which the object to be heated is accommodated is placed on the top plate 3 and cooking selection such as target temperature setting is performed from the operation panel 5, cooking of the object to be heated starts. In response to this start signal, the capability control means 4 and the array infrared sensor 7 start to operate. The capacity control means 4 energizes the energizing coil 1 with a current amount that matches the high-frequency alternating current with the temperature setting. The entire pan 6 is heated as a heating source by the action of the eddy current flowing inside the energizing coil 1, and the object to be heated in the pan 6 is heated.

  When the object to be heated in the pan 6 is heated, the pan 6 is warmed and infrared rays are emitted from the bottom surface of the pan 6. The emitted infrared light passes through the first measurement area 7 a of the top plate 3 and is condensed on the light receiving element 11 a by the condenser lens 12. When the pan 6 is warmed, the top plate 3 on which the pan 6 is placed is also warmed, and infrared rays are generated in the first measurement area 7 a of the top plate 3. The infrared rays generated in the first measurement area 7 a of the top plate 3 are condensed on the light receiving element 11 a by the condenser lens 12.

  On the other hand, since the black body paint layer 8 is applied to the second measurement area 7 b of the top plate 3, the infrared rays emitted from the bottom surface of the pan 6 are blocked by the black body paint layer 8 and transmitted through the top plate 3. Never do. For this reason, only the infrared rays generated in the top plate 3 are emitted from the second measurement area 7 b and are collected on the light receiving element 11 b by the condenser lens 12. The temperature of the light receiving elements 11a and 11b changes due to the collection of infrared rays, and the temperature difference generated between the hot junction and the cold junction of the thermocouple is converted into a voltage and output. At this time, the scan unit 13 selects an output voltage from one of the light receiving elements 11, for example, the light receiving element 11 a based on the address signal output from the signal output unit 19, and outputs the voltage to the amplifying unit 14.

  Further, the reference temperature element 15 disposed near the cold junction of the light receiving element 11 detects the ambient temperature and outputs a voltage to the amplifying unit 16. Since the output voltages amplified by these amplifying units 14 and 16 are compared and amplified by the differential amplifying unit 17, even if the ambient temperature changes, the bottom and the first plate 2 of the top plate 3 and the bottom surface of the pan 6 are used. The temperature of the measurement areas 7a and 7b can be accurately detected as a voltage value.

  The voltage compared and amplified by the differential amplifier 17 is input to the A / D converter 21 built in the microcomputer 18 via the multiplexer 20 to be a digital signal, and this digital signal is stored in the storage unit 22. The By sequentially performing such an operation, the infrared amount data detected by all the light receiving elements 11a and 11b can be stored in the storage unit 22. In addition, by providing a plurality of storage units 22, it is possible to store the infrared amount data of the light receiving elements 11a and 11b for each time series.

  The infrared amount data stored in the storage unit 22 and the address signal data from the signal output unit 19 are input to the pan temperature calculation unit 23, and the pan temperature calculation unit 23 receives the infrared amount data detected by the light receiving element 11a and the light reception. The temperature of the bottom surface of the pan 6 is calculated from the infrared amount data detected by the element 11b. As described above, since the infrared ray radiated from the bottom surface of the pan 6 and the infrared ray generated by the top plate 3 are collected on the light receiving element 11a, the infrared amount data detected by the light receiving element 11a is The total amount of infrared rays is the amount of infrared rays. On the other hand, since only the infrared rays generated by the top plate 3 are collected on the light receiving element 11b, the infrared amount data detected by the light receiving element 11b is the infrared amount of only the infrared rays generated by the top plate 3. is there.

  Accordingly, by subtracting the infrared amount data detected by the light receiving element 11b from the infrared amount data detected by the light receiving element 11a, only the infrared amount emitted from the bottom surface of the pan 6 can be extracted. In addition, since the emissivity of infrared rays is different between the first measurement area 7a and the second measurement area 7b, the above subtraction uses the emissivity ratio as a parameter to match the infrared amount of the top plate 3. To do. By the above calculation, the infrared rays generated by the temperature rise of the top plate 3 can be canceled reliably, and the bottom surface temperature of the pan 6 can be detected very accurately.

  The temperature data calculated by the pan temperature calculating means 23 is input to the ability control determining unit 24, and an alternating current amount corresponding to the temperature setting from the operation panel 5 is generated. Therefore, the object to be heated is cooked at the target temperature. Is done. Further, the temperature data calculated by the pan temperature calculating means 23 is also input to the display panel 9, and the current temperature of the pot 6 being heated is displayed on the LCD screen or the like so that the user can be informed.

  Further, when the pan 6 is removed from the top plate 3 after cooking, the output of the light receiving element 11a becomes smaller than the output of the light receiving element 11b (the second measurement area 7b is more in comparison with the first measurement area 7a). Because of the high emissivity), even when there is no pan 6, the high temperature of the top plate 3 is displayed and a warning is displayed to the user, or the top plate 3 is continuously cooked when the top plate 3 is hot Even at times, accurate temperature detection and control, display / warning, and the like are possible based on temperature changes and differences of the light receiving elements 11a and 11b.

  As described above, the bottom surface temperature of the pan 6 is calculated based on the amount of infrared rays radiated from the bottom surface of the pan 6, so that the bottom surface of the pan 6 and the top plate 3 are like a warp pan. Even when there is a gap, the temperature can be accurately detected.

  The amount of infrared rays from the first measurement area 7a is a value obtained by adding the amount of infrared rays transmitted from the bottom surface of the pan 6 through the top plate 3 and the amount of infrared rays generated by the top plate 3. In addition, the amount of infrared rays from the second measurement area 7 b is only the amount of infrared rays generated by the top plate 3. Therefore, by calculating the difference between the amount of infrared rays from the first measurement area 7a and the amount of infrared rays from the second measurement area 7b by the pan temperature calculation unit 23, the true value of the bottom temperature of the pan 6 is accurately determined. Can be calculated.

  Further, since the first measurement area 7a and the second measurement area 7b are arranged close to each other, infrared rays generated in the first measurement area 7a and infrared rays generated in the second measurement area 7b The amount of infrared rays is almost the same. Therefore, the pan temperature calculation unit 23 can easily cancel the amount of infrared rays corresponding to the temperature rise of the top plate 3, and can accurately calculate the true value of the bottom surface temperature of the pan 6.

  In the present embodiment, an example in which the array infrared sensor 7 is used to form a plurality of condensing areas with one sensor has been described. However, a plurality of infrared sensors may be arranged in close proximity and measured. Moreover, although IH cooker was demonstrated as an example, it cannot be overemphasized that it can apply also to the heating cooker which used the halogen heater and the sheathed heater as a heating source. Further, the black body paint layer 8 may be on the top surface of the top plate 3, and when the top plate 3 is composed of two plates, they may be sandwiched between these plates.

  Furthermore, in the pan temperature calculation unit 23, when the amount of infrared rays from the first measurement area 7a is less than a predetermined amount, the pan temperature is calculated based on the amount of infrared rays from the first measurement area 7a detected by the array infrared sensor 7. 6 is inferred, and when the amount of infrared rays from the first measurement area 7a is greater than or equal to a predetermined amount, the amount of infrared rays from the first measurement area 7a detected by the array infrared sensor 7 and the second measurement area 7b The temperature of the pan 6 may be inferred based on a difference value from the amount of infrared rays from the pan. By controlling in this way, during the low temperature where the amount of infrared rays of the top plate 3 itself is small, the pan temperature calculation unit 23 performs calculation processing using only the infrared amount of the first measurement area 7a, so the pan temperature calculation The processing of the unit 23 can be simplified.

Embodiment 2. FIG.
Next, a heating cooker according to Embodiment 2 will be described. FIG. 4 is a block diagram illustrating the heating cooker according to the second embodiment. The second embodiment is different from the first embodiment shown in FIG. 1 in that a pan bottom black body paint layer 26 is provided on the bottom surface of the pan 6 from the center to a predetermined region. Other configurations are the same as or equivalent to those of the first embodiment. In addition, the same code | symbol is attached | subjected about the component which is the same as that of Embodiment 1, or equivalent, and the description is abbreviate | omitted.

  The pan bottom blackbody paint layer 26 is formed by applying or pasting a blackbody material having an infrared emissivity of approximately 1. The formation position of the pan bottom black body paint layer 26 is adjusted so as to face the first measurement area 7 a when the pan 6 is placed at a predetermined position of the top plate 3.

  Next, the operation of the heating cooker according to the second embodiment will be described. The configuration other than the pan-bottom black body paint layer 26, which is a feature of the present embodiment, is the same as that of the first embodiment. To do.

  In the infrared sensor system as described in the first embodiment, the difference in emissivity depending on the nature (material / surface state) of the pan 6 as a heating container has a considerable influence on the measurement. In general, the energy incident on the infrared sensor from the object to be measured is expressed as emissivity (object itself) + reflectance (incident and reflected from the surroundings) + transmittance (transmitting the object) = 1. For example, when the emissivity ε = 1 of the black body is used as a reference, the glass is 0.90 to 0.95, the 18-8 stainless steel is 0.16, the aluminum gloss is 0.095, and the aluminum oxide is 0.76. With different emissivity. In the case of the metal pan 6, the transmittance can be ignored. For example, when the stainless pan 6 is taken as an example, the reflectance is as high as 0.84. For this reason, the disturbance temperature incident on the object from the surroundings may also be measured by the array infrared sensor 7, and it is necessary to cope with the case where the bottom surface temperature of the pan 6 is to be detected with higher accuracy.

  In the present embodiment, since the pan bottom black body paint layer 26 simulating a black body is formed on the bottom surface of the pan 6, an emissivity ε≈1 on the bottom surface of the pan 6 can be realized. The reflectance at the bottom is almost 0 (since emissivity + reflectivity + transmittance = 1). As a result, the disturbance temperature due to the reflected light from the bottom surface of the pan 6 is hardly measured by the array infrared sensor 7, and a stable temperature can be measured.

  As described above, in the present embodiment, the light reflected from the bottom surface of the pan 6 can be eliminated by applying or sticking a material having an emissivity of approximately 1 to the bottom outer bottom surface of the pan 6. The bottom surface temperature of the pan 6 can be accurately detected without being affected by the material and surface state of the pan 6.

Embodiment 3 FIG.
Next, a heating cooker according to Embodiment 3 will be described. FIG. 5A is a block diagram showing a heating cooker according to the third embodiment. Moreover, FIG.5 (b) is a figure which shows arrangement | positioning of the energizing coil and array infrared sensor with which the heating cooker of Embodiment 3 is provided. The third embodiment differs from the first embodiment shown in FIG. 1 in that a two-divided energizing coil 27 is provided instead of the energizing coil 1 and two sets of array infrared sensors 7 and 28 are provided. With a point. Other configurations are the same as or equivalent to those of the first embodiment. In addition, the same code | symbol is attached | subjected about the component which is the same as that of Embodiment 1, or equivalent, and the description is abbreviate | omitted.

  As shown in FIGS. 5A and 5B, the two-divided energizing coil 27 is divided into an inner bundle and an outer bundle in the radial direction, and a space is provided between these bundles. The array infrared sensor 28 is provided in this space portion, and detects the amount of infrared rays from the first measurement area 28 a and the second measurement area 28 b provided on the top plate 3.

  Next, the operation of the heating cooker according to the third embodiment will be described. Since the configuration other than the two-divided energizing coil 27 and the two sets of array infrared sensors 7 and 28, which are the features of the present embodiment, is the same as that of the first embodiment, the description of the basic operation is omitted. The array infrared sensor 7 disposed in the center of the two-part energizing coil 27 and the array infrared sensor 28 disposed in the radial space portion are the amount of infrared rays at the center of the pan 6 placed on the top plate 3. It detects the amount of infrared rays at the periphery. As shown in FIG. 5 (a), when a warp pan is placed, the center portion detects a region that does not contact the pan 6 and the top plate 3, and the radial portion detects a region that contacts the top plate 3. As a matter of course, the array infrared sensor 28 detecting the pan 6 in contact with the top plate 3 has a larger amount of infrared rays.

  In such a case, the pan temperature calculating means 9 compares the output results of the array infrared sensor 7 and the array infrared sensor 28. Specifically, the difference between the amount of infrared rays from the first measurement area 7a and the amount of infrared rays from the second measurement area 7b, and the amount of infrared rays from the first measurement area 28a and the second measurement area 28b. The difference value with the amount of infrared rays is calculated by the calculation unit 9 and the obtained difference values are compared. This comparison process basically calculates the temperature of the pan 6 by selecting the higher difference value, but the bottom temperature of the pan 6 asymptotically approaches a constant temperature as the heating time becomes longer. The temperature of the pan 6 may be determined by calculating an average value of the difference values. Even when the pan 6 to be placed has a small diameter and is not placed at the center of the energizing coil 27, the temperature of the pan 6 can be detected by one of the two array infrared sensors 7 and 28.

  As described above, in the present embodiment, the bottom surface temperature of the pan 6 can be detected more accurately by arranging two array infrared sensors in the center of the two-divided energizing coil 27 and the space in the radial direction. it can. Moreover, the exact bottom face temperature of the pan 6 can be detected without being influenced by the shape, size, and placement location of the pan.

Reference Example for Explaining the Invention Next, a cooking device according to a reference example will be described. FIG. 6 is a block diagram illustrating a cooking device according to a reference example. This reference example is different from the first embodiment shown in FIG. 1 in that a monocular infrared sensor 30 and a contact temperature sensor 31 are provided instead of the array infrared sensor 7. Other configurations are the same as or equivalent to those of the first embodiment. In addition, the same code | symbol is attached | subjected about the component which is the same as that of Embodiment 1, or equivalent, and the description is abbreviate | omitted.

  As shown in FIG. 6, the monocular infrared sensor 30 is disposed below the top plate 3 at a substantially central portion of the mounting position of the pan 6, and is emitted from the bottom surface 30 a of the pan 6 and passes through the top plate 3. Detect the amount of infrared rays. The condensing lens of the monocular infrared sensor 30 has a wavelength of at least about 0.5 μm to about 2.5 μm, which is equivalent to the transmission area of the top plate 3 (the area where the infrared light incident on the condensing lens is transmitted through the top plate 3) It is composed of a material to be transmitted. The contact-type temperature sensor 31 is provided in the immediate vicinity of the transmission area and in pressure contact with the lower surface of the top plate 3. The contact-type temperature sensor 31 can directly measure the lower surface temperature of the top plate 3. it can.

  Next, the operation of the cooking device according to the reference example will be described. In addition, since structures other than the monocular infrared sensor 30 and the contact-type temperature sensor 31 which are the characteristics of this reference example are the same as Embodiment 1, description of basic operation | movement is abbreviate | omitted. First, when the object to be heated in the pan 6 is heated, the pan 6 is warmed and infrared rays are emitted from the bottom surface 30 a of the pan 6. The emitted infrared light passes through the top plate 3 and enters the monocular infrared sensor 30. When the pan 6 is warmed, the top plate 3 on which the pan 6 is placed is also warmed, and infrared rays are generated on the top plate 3. Infrared rays generated by the top plate 3 are also incident on the monocular infrared sensor 30.

  On the other hand, the contact temperature sensor 31 measures the temperature of the top plate 3 close to the transmission area. The outputs of the monocular infrared sensor 30 and the contact temperature sensor 31 are output to the calculation unit 9. The computing unit 9 calculates the temperature of the bottom surface of the pan 6 from the infrared amount data detected by the monocular infrared sensor 30 and the temperature data detected by the contact temperature sensor 31. As described above, since the infrared ray radiated from the bottom surface of the pan 6 and the infrared ray generated by the top plate 3 are incident on the monocular infrared sensor 30, the infrared amount data detected by the monocular infrared sensor 30 is: The total amount of these infrared rays is the amount of infrared rays.

  Therefore, the temperature of the top plate 3 measured by the contact temperature sensor 31 is used as a reference, and the difference between the output of the monocular infrared sensor 30 and the output of the contact temperature sensor 31 is calculated by the calculation unit 9, thereby Infrared rays generated by the temperature rise can be canceled reliably. As a result, the bottom temperature of the pan 6 can be detected very accurately.

  As described above, in the reference example, the infrared sensor 30 and the contact-type temperature sensor 31 that are close to each other measure the amount of infrared that passes through the top plate 3 and the temperature of the top plate 3, and calculate the difference between the two outputs. By doing, the bottom face temperature of the pan 6 can be detected correctly. Moreover, since the contact-type temperature sensor 31 can generally be configured more simply and at a lower cost than the infrared sensor 30, a simple and inexpensive cooking device can be provided.

  Furthermore, since the contact-type temperature sensor 31 measures the temperature of the top plate 3 close to the infrared transmission area incident on the monocular infrared sensor 30, the temperature obtained from the amount of infrared rays generated in the transmission area and the contact-type temperature are measured. The temperature measured by the sensor 31 is almost the same. Therefore, the pan temperature calculation unit 23 can easily cancel the amount of infrared rays corresponding to the temperature rise of the top plate 3, and can accurately calculate the true value of the bottom surface temperature of the pan 6.

Embodiment 4
Next, a heating cooker according to Embodiment 4 will be described. FIG. 7 is a block diagram illustrating a heating cooker according to the fourth embodiment. The fourth embodiment is different from the first embodiment shown in FIG. 1 in that a cylindrical guide 32 surrounding the array infrared sensor 7 is provided. Other configurations are the same as or equivalent to those of the first embodiment. In addition, the same code | symbol is attached | subjected about the component which is the same as that of Embodiment 1, or equivalent, and the description is abbreviate | omitted.

  As shown in FIG. 7, the cylindrical guide 32 surrounds the array infrared sensor 7 and has an upper end surface attached in close contact with the top plate 3. As described above, since the upper end surface of the cylindrical guide 32 is in close contact with the top plate 3, it is possible to obtain a configuration in which an infrared shielding object such as dust does not adhere to the array infrared sensor 7, particularly the condenser lens 12.

  In the present embodiment, the array infrared sensor 7 is enclosed. However, as shown in the reference example, the monocular infrared sensor 30 and the contact-type temperature sensor 31 may be enclosed, as shown in the third embodiment. A plurality of such infrared sensors 7, 28 may be enclosed. Further, it is desirable that a black matte material or the like is applied to the inner surface of the cylindrical guide 32, and a ferrite material which is a black ferromagnetic material is preferable as a member constituting the cylindrical guide 32.

  Next, the operation of the heating cooker according to the fourth embodiment will be described. In addition, since structures other than the cylindrical guide 32 which are the characteristics of this Embodiment are the same as that of Embodiment 1, description of basic operation | movement is abbreviate | omitted. The cylindrical guide 32 is configured such that dust generated in the housing 2, particularly dust generated when sucking outside air by a cooling fan such as the energizing coil 1, does not adhere to the condenser lens 12 of the array infrared sensor 7. Obtainable. Moreover, disturbance reflection of the amount of infrared rays collected by the array infrared sensor 7 can be suppressed by making the inner surface of the cylinder black. Further, since the cylindrical guide 32 is made of a ferromagnetic ferrite material, the magnetic field generated around the current-carrying coil 1 is absorbed by the cylindrical guide 32, so that the detection signal of the array infrared sensor 7 is generated by the magnetic field. It can be effectively prevented from disturbance noise.

  As described above, in the present embodiment, the array infrared sensor 7 is collected by providing the cylindrical guide 32 that surrounds the array infrared sensor 7 and has an upper end surface that is in close contact with the top plate 3. A configuration in which dust or the like is not attached to the optical lens 12 can be obtained. For this reason, the fall of the detection accuracy of the amount of infrared rays by the array infrared sensor 7 can be suppressed.

  In addition, by making the inner surface of the cylindrical guide 32 black, it is possible to effectively suppress disturbance reflection of the amount of infrared rays collected on the array infrared sensor 7. Further, the cylindrical guide 32 is made of a ferrite material which is a ferromagnetic material, and the magnetic field generated around the energizing coil 1 is absorbed by the cylindrical guide 32, whereby the detection signal of the array infrared sensor 7 is disturbed by the magnetic field. It can be effectively prevented from noise. As a result, the bottom surface temperature of the pan 6 can be detected with high accuracy.

Instead of the cylindrical guide 32, a shielding member that is disposed around the array infrared sensor 7 and that blocks a magnetic field generated around the energizing coil 1 may be used. The shape of the shielding member may be any shape that can block a magnetic field, such as a flat plate shape, a circular arc plate shape, or a cylindrical shape. By arranging the shielding member, the magnetic field generated around the energizing coil 1 is absorbed by the shielding member, so that the detection signal of the array infrared sensor 7 can be effectively prevented from disturbance noise due to the magnetic field.
Further, the shielding member may be arranged around the monocular infrared sensor 30 and the contact temperature sensor 31 shown in the reference example, and the shielding member is arranged around the plurality of infrared sensors 7 and 28 shown in the third embodiment. May be arranged. Also in these cases, since the magnetic field generated around the energizing coil 1 is absorbed by the shielding member, the detection signal of the array infrared sensor 7 can be effectively prevented from disturbance noise due to the magnetic field.

It is sectional drawing which shows the state which mounted the curvature pan in the heating cooker which concerns on Embodiment 1. FIG. It is sectional drawing which shows the state which mounted the pan with a flat bottom in the heating cooker which concerns on Embodiment 1. FIG. It is a block diagram which shows the detailed structure of an array infrared sensor and a calculating part. It is a block diagram which shows the state which mounted the curvature pan in the heating cooker of Embodiment 2. FIG. (A) is a block diagram which shows the state which mounted the curvature pan in the heating cooker of Embodiment 3. FIG. (B) is a figure which shows arrangement | positioning of the energization coil and array infrared sensor with which the heating cooker of Embodiment 3 is provided. It is a block diagram which shows the state which mounted the curvature pan in the heating cooker of a reference example. It is a block diagram which shows the state which mounted the curvature pan in the heating cooker of Embodiment 4. FIG. It is sectional drawing which shows the structure of the conventional heating cooker.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Current coil, 3 ... Top plate, 4 ... Capacity control means, 6 ... Pan, 7 ... Array infrared sensor, 7a, 28a ... 1st measurement area, 7b, 28b ... 2nd measurement area, 8 ... Black body Paint layer, 9 ... arithmetic unit, 10 ... display panel, 11a, 11b ... light receiving element, 12 ... condensing lens, 13 ... scanning unit, 14 ... amplifying unit, 15 ... reference temperature element, 18 ... microcomputer, 22 ... memory , 23 ... Pan temperature calculation unit, 24 ... Capability control determination unit, 26 ... Pan bottom black body paint layer, 27 ... Split energizing coil, 28 ... Array infrared sensor, 29 ... Black body paint layer, 30 ... Monocular infrared sensor, 31 ... contact temperature sensor, 32 ... cylindrical guide.

Claims (6)

In the heating cooker for placing the heating container on the upper surface of the top plate and cooking the object to be heated in the heating container,
A first measurement area that is provided on the top plate and transmits infrared rays radiated from the bottom surface of the heating container to the bottom surface of the top plate;
A second measurement area that is provided on the top plate, blocks infrared rays emitted from the bottom surface of the heating container, and emits infrared rays caused by the temperature of the top plate;
An infrared amount detector that is disposed below the top plate and detects the amount of infrared rays from the first measurement area and the amount of infrared rays from the second measurement area;
A calculation unit that calculates the temperature of the heating container based on the infrared amount of the first measurement area and the second measurement area detected by the infrared amount detection unit;
The infrared light amount detection unit has a single infrared sensor in which a plurality of light receiving elements are arranged in a line or array, and a part of the light receiving elements detects the amount of infrared light from the first measurement area. And the other part of these light receiving elements detects the amount of infrared rays from the second measurement area ,
A cooking device comprising a shielding member that is arranged around the infrared sensor and blocks a magnetic field generated around an energizing coil that heats the object to be heated . In the heating cooker for placing the heating container on the upper surface of the top plate and cooking the object to be heated in the heating container,
A first measurement area that is provided on the top plate and transmits infrared rays radiated from the bottom surface of the heating container to the bottom surface of the top plate;
A second measurement area that is provided on the top plate, blocks infrared rays emitted from the bottom surface of the heating container, and emits infrared rays caused by the temperature of the top plate;
An infrared amount detector that is disposed below the top plate and detects the amount of infrared rays from the first measurement area and the amount of infrared rays from the second measurement area;
A calculation unit that calculates the temperature of the heating container based on the infrared amount of the first measurement area and the second measurement area detected by the infrared amount detection unit;
The infrared amount detection unit includes a pair of infrared sensors, and one of these infrared sensors detects the amount of infrared from the first measurement area, and the other of these infrared sensors is the second measurement area. While detecting the amount of infrared rays from
A cooking device comprising a shielding member that is arranged around the infrared sensor and blocks a magnetic field generated around an energizing coil that heats the object to be heated. The cooking device according to claim 1 or 2 , wherein the shielding member is made of a ferromagnetic material. A top plate on which the heating container is placed;
A heating coil disposed under the top plate for inductively heating the heating vessel;
A first measurement area that is provided on the top plate and transmits infrared rays radiated from the bottom surface of the heating container to the bottom surface of the top plate;
A second measurement area provided on the top plate and coated with a black body paint layer on the top plate;
An infrared amount detection unit that is disposed at a substantially central portion of the heating coil below the top plate and detects the amount of infrared rays from the first measurement area and the second measurement area;
A calculation unit that calculates the temperature of the heating container based on the infrared amount of the first measurement area and the second measurement area detected by the infrared amount detection unit;
The infrared light amount detection unit has a single infrared sensor in which a plurality of light receiving elements are arranged in a line or array, and a part of the light receiving elements detects the amount of infrared light from the first measurement area. And the other part of these light receiving elements detects the amount of infrared rays from the second measurement area ,
A cooking device comprising a shielding member that is arranged around the infrared sensor and blocks a magnetic field generated around an energizing coil that heats the object to be heated . A top plate on which the heating container is placed;
A heating coil disposed under the top plate for inductively heating the heating vessel;
A first measurement area that is provided on the top plate and transmits infrared rays radiated from the bottom surface of the heating container to the bottom surface of the top plate;
A second measurement area provided on the top plate and coated with a black body paint layer on the top plate;
An infrared amount detection unit that is disposed at a substantially central portion of the heating coil below the top plate and detects the amount of infrared rays from the first measurement area and the second measurement area;
A calculation unit that calculates the temperature of the heating container based on the infrared amount of the first measurement area and the second measurement area detected by the infrared amount detection unit;
The infrared amount detection unit includes a pair of infrared sensors, and one of these infrared sensors detects the amount of infrared from the first measurement area, and the other of these infrared sensors is the second measurement area. While detecting the amount of infrared rays from
A cooking device comprising a shielding member that is arranged around the infrared sensor and blocks a magnetic field generated around an energizing coil that heats the object to be heated. The cooking device according to claim 4 or 5 , wherein the shielding member is made of a ferromagnetic material.

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