JP2011022039A - Temperature measuring device and temperature measuring method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To measure highly accurately a bonding part temperature between a circuit board and a mounted component without impeding heating efficiency of a bonding member between the circuit board and the mounted component. <P>SOLUTION: This temperature measuring device 1 includes: a contact type temperature measuring part 2 for measuring through a thermocouple 2a, a temperature of a temperature-measuring position on the circuit board 10 excluding a bonding part between the mounted component 11 and the circuit board 10; a radiation temperature measuring part 3 for measuring in the noncontact state, a temperature distribution on a board domain including at least the bonding part and the temperature-measuring position on the circuit board 10; a temperature calculation part 7a for calculating a temperature of the bonding part between the mounted component 11 and the circuit board 10; and a display part 5 for displaying the temperature of the bonding part. The temperature calculation part 7a calculates a temperature difference between a heated bonding part of the mounted component 11 and the temperature-measuring position on the circuit board 10 based on the temperature distribution on the board domain, and calculates the temperature of the bonding part between the mounted component 11 and the circuit board 10 based on the calculated temperature difference and on the measured temperature at the temperature-measuring position. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a temperature measuring apparatus and a temperature measuring method for measuring a joint temperature between a circuit board and a mounted component when the mounted component is heat bonded to a circuit board.

  Conventionally, when mounting a mounting component such as an electronic component on a circuit board, generally, a bonding member such as solder is interposed at a bonding portion between the circuit board and the mounting component, and the bonding member is heated to treat the circuit board. Mounting parts are heat bonded. In order to reliably heat-bond the mounting component to the circuit board in the heat-bonding process of the mounting component, the bonding temperature between the circuit board and the mounting component is accurately measured, and the bonding between the circuit board and the mounting component is performed. It is necessary to appropriately heat-treat the joining member interposed in the portion.

  As a temperature measurement device for measuring the temperature of a temperature measurement object such as a circuit board, for example, there is a contact-type temperature measurement device that measures the temperature by bringing a thermocouple into contact with the temperature measurement object. There is also a non-contact temperature measuring device such as an infrared radiation thermometer that detects infrared rays emitted from the infrared ray and measures the temperature (see Patent Document 1).

JP-A-4-363026

  However, the conventional contact-type temperature measuring device, when measuring the junction temperature between the circuit board and the mounting component, must bring a thermocouple into contact with the junction between the circuit board and the mounting component. There is a possibility that the temperature of the joint portion between the circuit board and the mounted component is lowered due to the heat capacity. For this reason, it is necessary to heat-treat the joining member interposed in the joining portion between the circuit board and the mounting component to a higher temperature. As a result, the heating efficiency of the joining member between the circuit board and the mounting component is hindered. There was a problem.

  On the other hand, since the conventional non-contact temperature measuring device does not require the thermocouple to contact the temperature measurement object, the above-described problems of the conventional contact temperature measuring device can be solved. However, the conventional non-contact temperature measuring device only measures the temperature distribution on the surface of the circuit board on which the mounting component is heated and bonded, and the temperature at a specific location on the circuit board, such as a bonding portion between the circuit board and the mounting component. Is difficult to measure with high accuracy.

  This invention is made in view of the said situation, Comprising: The junction temperature of a circuit board and a mounting component is measured with high precision, without inhibiting the heating efficiency of the joining member of a circuit board and a mounting component. An object of the present invention is to provide a temperature measuring apparatus and a temperature measuring method that can be used.

  In order to solve the above-described problems and achieve the object, a temperature measurement device according to the present invention is a position on a circuit board where a mounting component is heated and bonded, and excludes a bonding portion between the mounting component and the circuit board. A contact-type temperature measurement unit that measures the temperature at a temperature measurement position via a thermocouple, and a non-contact measurement that measures a temperature distribution in a substrate region that includes at least the junction portion of the circuit board and the temperature measurement position. Based on the temperature distribution measured by the contact-type temperature measurement unit and the non-contact-type temperature measurement unit, a temperature difference between the joint portion and the temperature measurement position is calculated and measured by the contact-type temperature measurement unit. Further, based on the temperature at the temperature measurement position and the temperature difference, a temperature calculation unit that calculates a junction temperature between the mounted component and the circuit board, and the junction temperature calculated by the temperature calculation unit A display unit for displaying It is characterized in.

  Further, the temperature measuring device according to the present invention is the temperature measuring device according to the above invention, wherein the contact-type temperature measuring unit includes a temperature-measuring unit having a surface material the same as that of the joining portion at a tip of the thermocouple. The temperature-measuring position is measured by bringing the temperature-measured part into contact with the position.

  In the temperature measurement device according to the present invention, in the above invention, the circuit board includes a temperature-measured portion having the same surface material as the joint portion at the temperature measurement position, and the contact-type temperature measurement portion is The temperature of the temperature measurement position is measured by bringing the thermocouple into contact with the temperature measurement part on the circuit board.

  In the temperature measurement device according to the present invention, in the above invention, the non-contact temperature measurement unit is detected by an infrared detection unit that detects infrared energy radiated from the substrate region, and the infrared detection unit. An image processing unit that converts the infrared energy into a temperature of the substrate region and generates a temperature image indicating the temperature distribution, the temperature calculation unit based on the temperature image, The temperature difference from the temperature measuring position is calculated.

  In the temperature measurement device according to the present invention as set forth in the invention described above, the non-contact temperature measurement unit includes an imaging unit that captures a visible light image of the substrate region, and the display unit captures an image by the imaging unit. The visible light image thus displayed is displayed.

  The temperature measurement device according to the present invention further includes an input unit that inputs designation information of the joint portion included in the visible light image displayed by the display unit in the invention described above, and the temperature calculation unit includes: A temperature difference between the joint portion designated by the designation information and the temperature measurement position is calculated, and based on the calculated temperature difference and the temperature measurement temperature, the mounted component, the circuit board, The junction temperature is calculated.

  Moreover, in the temperature measurement device according to the present invention, in the above invention, the input unit inputs designation information of the temperature measurement position included in the visible light image displayed by the display unit, and the temperature calculation unit Calculates a temperature difference between the temperature measurement position designated by the designation information and the joint portion, and based on the calculated temperature difference and the temperature at the temperature measurement position, the mounted component and the circuit The junction temperature with the substrate is calculated.

  Further, the temperature measuring method according to the present invention measures the temperature at the temperature measurement position excluding the joint portion between the mounting component and the circuit board, which is a position on the circuit board where the mounting component is heat-bonded, through a thermocouple. In addition, a temperature measuring step for measuring, in a non-contact manner, a temperature distribution of at least the junction portion of the circuit board and a substrate region including the temperature measurement position, and the junction portion and the temperature measurement based on the temperature distribution. A temperature calculation step of calculating a temperature difference with respect to a position, and calculating a junction temperature between the mounted component and the circuit board based on the calculated temperature difference and the temperature at the temperature measurement position; and And a display step of displaying the junction temperature calculated in the calculation step on a display unit.

  In the temperature measurement method according to the present invention, in the above invention, in the temperature measurement step, a temperature measurement part fixed to a tip of the thermocouple is brought into contact with the temperature measurement position, and the same surface material as that of the joint portion is used. The temperature at the temperature measurement position is measured through the temperature-measured part having the following.

  The temperature measurement method according to the present invention is the temperature measurement method according to the above invention, wherein the temperature measurement step is provided at the temperature measurement position on the circuit board, and the temperature measurement part having the same surface material as the joint portion The temperature at the temperature measuring position is measured by bringing a thermocouple into contact therewith.

  In the temperature measuring method according to the present invention, in the above invention, the temperature measuring step detects infrared energy radiated from the substrate region, and converts the detected infrared energy into a temperature of the substrate region. Then, a temperature image indicating the temperature distribution is generated, and the temperature calculating step calculates a temperature difference between the joint portion and the temperature measuring position based on the temperature image.

  The temperature measurement method according to the present invention further includes an imaging step of capturing a visible light image of the substrate region in the above invention, wherein the temperature measurement step includes the temperature measurement position included in the visible light image. Temperature and temperature distribution of the substrate region are measured, and the display step displays the visible light image and the junction temperature on the display unit.

  In the temperature measuring apparatus according to the present invention, the contact-type temperature measuring unit is a position on the circuit board where the mounting component is heated and bonded, and the temperature at the temperature measuring position excluding the bonding portion between the mounting component and the circuit board is measured by thermoelectricity. A non-contact temperature measurement unit measures the temperature distribution of the substrate region including at least the joint portion and the temperature measurement position of the circuit board in a non-contact manner, and the temperature calculation unit Based on the temperature distribution measured by the non-contact temperature measuring unit, a temperature difference between the joint portion and the temperature measuring position is calculated, and the temperature at the temperature measuring position measured by the contact temperature measuring unit. And the temperature difference, the junction temperature between the mounted component and the circuit board is calculated, and the display unit displays the junction temperature calculated by the temperature calculation unit. For this reason, there exists an effect that the junction temperature of a circuit board and a mounting component can be measured with high precision, without inhibiting the heating efficiency of the joining member of a circuit board and a mounting component.

  Further, in the temperature measurement method according to the present invention, the temperature at the temperature measurement position excluding the bonding portion between the mounting component and the circuit board is measured via a thermocouple. And a temperature measuring step of measuring the temperature distribution of at least the junction portion of the circuit board and the substrate region including the temperature measurement position in a non-contact manner, and the junction portion and the A temperature calculation step of calculating a temperature difference from the temperature measurement position and calculating a junction temperature between the mounted component and the circuit board based on the calculated temperature difference and the temperature at the temperature measurement position is executed. And the display step which displays the said junction temperature calculated by the said temperature calculation step on a display part is performed. For this reason, there exists an effect that the junction temperature of a circuit board and a mounting component can be measured with high precision, without inhibiting the heating efficiency of the joining member of a circuit board and a mounting component.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of a temperature measuring device and a temperature measuring method according to the present invention will be described in detail with reference to the drawings. Note that the present invention is not limited to the embodiments.

(Embodiment)
FIG. 1 is a block diagram schematically showing a configuration example of a temperature measuring device according to an embodiment of the present invention. FIG. 2 is a schematic diagram illustrating a temperature measurement object viewed from the measurement visual field side of the radiation temperature measurement unit. As shown in FIG. 1, the temperature measuring apparatus 1 according to this embodiment includes a contact-type temperature measuring unit 2 that measures the temperature of a circuit board 10 that heat-joins a mounting component 11, and the temperature distribution of the circuit board 10. And a radiation temperature measurement unit 3 for non-contact measurement. In addition, the temperature measuring device 1 includes an input unit 4 for inputting various information, a display unit 5 for displaying various information such as a junction temperature between the circuit board 10 and the mounting component 11, and a storage unit for storing various information. 6 and a control unit 7 that controls each component of the temperature measuring device 1.

  The contact-type temperature measuring unit 2 is a position on the circuit board 10 where the mounting component 11 is heated and bonded, and the temperature at a temperature measuring position 13 (see FIG. 2) excluding the bonding portion 12 between the mounting component 11 and the circuit board 10. Measure via temperature sensor. Specifically, the contact-type temperature measuring unit 2 includes a thermocouple 2a that is a temperature sensor, and a temperature-measured unit 2b that is interposed between the circuit board 10 and the thermocouple 2a. The thermocouple 2a is a thermocouple having a structure in which one end of two metal wires (alloy wires) is connected, as exemplified by a K-type thermocouple using an alloy wire mainly composed of chromium or the like and a nickel wire. It is. The temperature-measured portion 2b is a member having the same surface material as the joint portion 12 between the mounting component 11 and the circuit board 10, and is fixed to the tip of the thermocouple 2a. The surface material of the temperature-measured part 2b is the same material as the bonding member (for example, solder) between the mounting component 11 and the circuit board 10. The contact-type temperature measuring unit 2 provided with the thermocouple 2a and the temperature-measuring unit 2b brings the temperature-measuring unit 2b into surface contact with the temperature-measuring position 13 of the circuit board 10 and measures the temperature at the temperature-measuring position 13. Then, the obtained temperature measurement result at the temperature measurement position 13 is transmitted to the control unit 7. In the contact-type temperature measuring unit 2, the temperature-measured unit 2 b is interposed between the thermocouple 2 a and the circuit board 10 in a form in surface contact with the temperature measurement position 13 of the circuit board 10. The thermocouple 2a detects the temperature at the temperature measurement position 13 via the temperature-measured part 2b in such a surface contact state.

  The thermocouple 2a of the contact-type temperature measuring unit 2 is not limited to a structure in which one end of two metal wires is connected as described above, but an alloy thin film mainly composed of chromium or the like and a nickel thin film. As exemplified by the used K-type thin film thermocouple, etc., it may be a thin film thermocouple having a structure in which one end of two metal thin films (alloy thin films) are connected.

  The radiation temperature measuring unit 3 is configured to reduce the temperature distribution of the substrate region 14 (see FIG. 2) including at least the joint portion 12 between the mounting component 11 and the circuit substrate 10 and the temperature measurement position 13 of the circuit substrate 10. It functions as a non-contact temperature measurement unit that measures in contact. Specifically, the radiation temperature measurement unit 3 includes an infrared detection unit 3 a that detects infrared energy emitted from the substrate region 14, and an image processing unit 3 b that generates a temperature image indicating the temperature distribution of the substrate region 14. , And an imaging unit 3 c that captures a visible light image of the substrate region 14. The radiation temperature measurement unit 3 transmits temperature image data indicating the temperature distribution of the substrate region 14 to the control unit 7 as the temperature distribution measurement result of the substrate region 14. Further, the radiation temperature measurement unit 3 transmits the visible light image data of the substrate region 14 to the control unit 7.

  The infrared detection unit 3a is realized by using an infrared detection element such as a bolometer and an optical system such as a condenser lens. The infrared detector 3a has a measurement visual field 3d that captures the substrate region 14 of the circuit board 10 shown in FIG. 2, and detects infrared energy in the measurement visual field 3d. Here, the substrate region 14 is a partial region of the circuit board 10 including at least the joint portion 12 between the mounting component 11 and the circuit board 10 and the temperature measurement position 13 of the circuit board 10. In the board region 14, as shown in FIG. 2, the electrode pads 10 a and 10 b of the circuit board 10, the mounting component 11 that is heat-bonded to the electrode pads 10 a and 10 b, and the temperature measurement position 13 of the circuit board 10. There is a temperature-measured portion 2b that is in surface contact. The infrared detecting unit 3a receives infrared rays emitted from the board region 14 including the mounting component 11 on the circuit board 10 and the temperature-measured part 2b, and detects infrared energy from the board region 14.

  The image processing unit 3b converts the infrared energy detected by the infrared detection unit 3a into the surface temperature of the substrate region 14, and based on the obtained temperature data, temperature image data indicating the temperature distribution of the substrate region 14 is obtained. Generate. The temperature image data generated by the image processing unit 3 b is transmitted to the control unit 7 as a temperature distribution measurement result of the board region 14 of the circuit board 10.

  The imaging unit 3c is realized using an illumination unit such as an LED, a solid-state imaging device such as a CCD or CMOS, and an optical system such as a condenser lens. The imaging unit 3c has an imaging field similar to the measurement field 3d of the infrared detection unit 3a described above, and captures a visible light image of a subject in the imaging field. Specifically, the imaging unit 3c receives reflected light from the substrate region 14 of the circuit board 10 existing in the imaging field of view, and performs photoelectric conversion processing on the received reflected light to display a visible light image of the substrate region 14. Image. The visible light image data obtained by the imaging unit 3 c is image data including a temperature measurement object such as the mounted part 11 on the circuit board 10 and the temperature measurement part 2 b at the temperature measurement position 13 as a subject, and is transmitted to the control unit 7. Is done.

  The input unit 4 is realized by using an input device such as a keyboard and a mouse, and inputs various information to the control unit 7 in response to an input operation by the user. As various information input to the control unit 7 by the input unit 4, for example, instruction information instructed to the control unit 7, temperature measurement target positions such as the joint portion 12 between the mounting component 11 and the circuit board 10, and the like. Specific information to be specified is included.

  The display unit 5 is realized by using a display capable of displaying an image such as a CRT display or a liquid crystal display, and displays various information instructed to be displayed by the control unit 7. Examples of the various information displayed by the display unit 5 include, for example, the temperature of the junction between the mounting component 11 and the circuit board 10, the temperature image indicating the temperature distribution of the board area 14 of the circuit board 10, and the board area 14 of the circuit board 10. Visible light image, input information by the input unit 4, and the like.

  The storage unit 6 is realized using a rewritable nonvolatile storage medium such as an EEPROM or a hard disk. The storage unit 6 stores various data instructed to be written by the control unit 7, and transmits the stored data instructed to be read by the control unit 7 to the control unit 7. Specifically, based on the control of the control unit 7, the storage unit 6 is a substrate region 14 that is temperature measurement data of the temperature measurement position 13 by the contact temperature measurement unit 2 and temperature distribution measurement data by the radiation temperature measurement unit 3. Temperature image data, visible light image data from the imaging unit 3c, input data from the input unit 4, and the like are stored.

  The control unit 7 is realized by using a storage unit that stores a program or the like for realizing the function of the temperature measuring device 1 and a CPU or the like that executes a program in the storage unit. The control unit 7 controls each component of the temperature measurement device 1, that is, each operation of the contact temperature measurement unit 2, the radiation temperature measurement unit 3, the input unit 4, the display unit 5, and the storage unit 6, and The input / output of signals between the components is controlled. Specifically, the control unit 7 controls the imaging unit 3 c of the radiation temperature measurement unit 3 to capture a visible light image of the board region 14 of the circuit board 10 based on the instruction information input by the input unit 4. Then, the display unit 5 is controlled to display the visible light image captured by the imaging unit 3c. In addition, the control unit 7 controls the contact temperature measurement unit 2 to measure the temperature at the temperature measurement position 13 of the circuit board 10 and measures the radiation temperature so as to measure the temperature distribution of the board region 14 of the circuit board 10. Control part 3. As a result, the control unit 7 acquires temperature measurement data at the temperature measurement position 13 from the contact-type temperature measurement unit 2, and acquires temperature image data that is a temperature distribution measurement result of the substrate region 14 from the radiation temperature measurement unit 3. To do. The visible light image data of the substrate region 14, the temperature measurement data of the temperature measurement position 13, and the temperature image data of the substrate region 14 are stored in the storage unit 6 based on the control of the control unit 7.

  In addition, the control unit 7 includes a temperature calculation unit 7 a that calculates the temperature of the temperature measurement target portion of the circuit board 10. Based on the temperature distribution corresponding to the temperature image data of the substrate region 14 acquired from the radiation temperature measurement unit 3, that is, the temperature distribution of the substrate region 14 measured by the radiation temperature measurement unit 3, the temperature calculation unit 7 a The temperature difference between the temperature of the joint portion 12 between 11 and the circuit board 10 and the temperature of the temperature measurement position 13 of the circuit board 10 is calculated. The temperature calculation unit 7 a calculates the junction temperature between the mounting component 11 and the circuit board 10 based on the calculated temperature difference and the temperature at the temperature measurement position 13 measured by the contact temperature measurement unit 2. As a result, the temperature calculation unit 7 a can correct the actually measured temperature at the temperature measurement position 13 to the junction temperature between the mounting component 11 and the circuit board 10. The junction temperature calculated by the temperature calculation unit 7 a is the temperature of the temperature measurement target portion of the circuit board 10, and is displayed on the display unit 5 and stored in the storage unit 6 based on the control of the control unit 7. . The temperature measurement target portion of the circuit board 10 is designated by designation information that the input unit 4 inputs to the control unit 7.

  In addition, the circuit board 10 measured by the temperature measuring device 1 may be a rigid circuit board or a flexible circuit board that can be easily bent. The mounting component 11 is an electronic component connected to the electrode pads 10a and 10b of the circuit board 10, and the circuit board 10 is connected to a metal bonding member such as solder provided in advance on the electrode pads 10a and 10b. Heat bonded to the top. The heat bonding process between the circuit board 10 and the mounting component 11 is performed using a heater or a laser heating device (both not shown) that heat-processes the circuit board 10. The mounting component 11 that is heat bonded to the circuit board 10 is not limited to an electronic component, and may be a component that is mounted on the circuit board 10 by heat bonding such as a heat sink. In this case, the joining member between the circuit board 10 and the mounting component 11 may be made of metal such as solder, or may be thermosetting resin such as silicone resin.

  Next, a temperature measurement method according to the embodiment of the present invention will be described. FIG. 3 is a flowchart showing an example of the temperature measuring method according to the embodiment of the present invention. FIG. 4 is a schematic diagram showing a specific example of the temperature distribution of the circuit board by the radiation temperature measurement unit. FIG. 5 is a schematic diagram showing a specific example of a display mode of the temperature measuring device according to the embodiment of the present invention.

  In the circuit board 10 that is a temperature measurement target of the temperature measurement device 1 according to the embodiment of the present invention, a metal bonding member such as solder is provided in advance on the electrode pads 10a and 10b. The mounting component 11 is disposed on the electrode pads 10a and 10b of the circuit board 10 through the joining member. Further, the temperature measuring part 2 b of the contact-type temperature measuring unit 2 is in surface contact with the temperature measuring position 13 on the circuit board 10. The circuit board 10 is arranged so that the board region 14 including the mounting component 11 and the temperature-measured part 2b is within the measurement visual field 3d of the radiation temperature measurement part 3, and is heated by a heater or a laser heating device. The temperature measuring apparatus 1 sequentially performs the processing procedure shown in FIG. 3 and measures the junction temperature between the mounted component 11 and the circuit board 10.

  Specifically, as shown in FIG. 3, the temperature measurement device 1 first captures a visible light image including a temperature measurement target portion on the circuit board 10 (step S <b> 101). In step S <b> 101, the control unit 7 controls the radiation temperature measurement unit 3 so as to capture a visible light image of the board region 14 of the circuit board 10. The imaging unit 3 c of the radiation temperature measurement unit 3 captures a visible light image including the substrate region 14 in the measurement visual field 3 d as a subject based on the control of the control unit 7. As shown in FIG. 2, the board region 14 includes electrode pads 10 a and 10 b of the circuit board 10, a mounted component 11 on the electrode pads 10 a and 10 b, and a temperature measurement position 13 of the circuit board 10. There is a temperature-measured portion 2b in surface contact with the surface. The control unit 7 acquires visible light image data of the substrate region 14 from the radiation temperature measurement unit 3.

  Subsequently, the temperature measuring device 1 displays a visible light image of the board region 14 of the circuit board 10 (step S102). In this case, the control unit 7 controls the display unit 5 to display the visible light image data acquired from the imaging unit 3c in step 101 described above. The display unit 5 displays a visible light image of the substrate region 14 corresponding to the visible light image data based on the control of the control unit 7.

  Next, the temperature measurement device 1 determines whether or not there is a temperature measurement instruction (step S103). In step 103, the control unit 7 determines whether or not there is a temperature measurement instruction based on the input information of the input unit 4. Specifically, when the designation information of the temperature measurement target portion is input by the input unit 4, the control unit 7 determines that there is a temperature measurement instruction for the temperature measurement target portion designated by the designation information. On the other hand, when the designation information is not input, the control unit 7 determines that there is no temperature measurement instruction for the temperature measurement target portion. The input unit 4 inputs, for example, designation information for designating the joint portion 12 between the mounted component 11 and the circuit board 10 to the control unit 7 as the designation information of the temperature measurement target portion.

  When it is determined in step S103 that there is a temperature measurement instruction (Yes in step S103), the temperature measurement device 1 measures the temperature distribution and the specific position temperature of the circuit board 10 (step S104). In step S <b> 104, the control unit 7 controls the contact temperature measurement unit 2 to measure the temperature of the temperature measurement position 13 which is a specific position defined on the circuit board 10, and the circuit board 10 The radiation temperature measuring unit 3 is controlled so as to measure the temperature distribution of the substrate region 14.

  The contact-type temperature measuring unit 2 measures the temperature at the temperature measurement position 13 via the temperature measurement part 2 b in a surface contact state with the temperature measurement position 13 of the circuit board 10 based on the control of the control unit 7. In this case, the thermocouple 2 a detects the temperature of the temperature measuring part 2 b in the surface contact state as the temperature of the temperature measuring position 13. On the other hand, the radiation temperature measurement unit 3 measures the temperature distribution of the substrate region 14 (see FIG. 2) of the circuit board 10 based on the control of the control unit 7. In this case, the infrared detection unit 3a detects infrared energy radiated from the substrate region 14 in the measurement visual field 3d of the circuit board 10. The image processing unit 3b converts the infrared energy detected by the infrared detection unit 3a into the surface temperature of the substrate region 14, and based on the obtained temperature data, temperature image data indicating the temperature distribution of the substrate region 14 is obtained. Generate. The control unit 7 acquires the temperature measurement data at the temperature measurement position 13 from the contact temperature measurement unit 2, and the temperature distribution measurement result of the substrate region 14 from the radiation temperature measurement unit 3, that is, the temperature image data of the substrate region 14. get.

  Next, the temperature measuring apparatus 1 calculates the junction temperature between the mounting component 11 and the circuit board 10 instructed for measurement in step S103 described above (step S105). Specifically, the control unit 7 determines the temperature of the temperature measurement target portion specified by the specification information input from the input unit 4 in step S103 described above, that is, the temperature of the joint portion 12 between the mounting component 11 and the circuit board 10. Is calculated. In this case, the temperature calculation unit 7a is based on the temperature distribution (see FIG. 4) indicated by the temperature image data of the substrate region 14 acquired from the radiation temperature measurement unit 3, and the joint portion between the mounting component 11 and the circuit board 10 A temperature difference ΔT between the temperature of 12 and the temperature of the temperature measurement position 13 in the substrate region 14 is calculated. On the other hand, the temperature calculation unit 7a acquires the actual temperature T1 of the temperature measurement position 13 measured by the contact-type temperature measurement unit 2. The temperature calculation unit 7a adds the measured temperature T1 at the temperature measurement position 13 and the temperature difference ΔT, thereby calculating the temperature of the joint portion 12 between the mounting component 11 and the circuit board 10 (joint temperature T2). calculate.

  Here, the temperature measurement position 13 is a specific position defined in advance on a portion of the circuit board 10 excluding the joint portion 12 between the mounting component 11 and the circuit board 10. The position information of the temperature measurement position 13 is input in advance to the control unit 7 by the input unit 4. That is, the temperature calculation unit 7a has acquired the temperature measurement position 13 in the substrate region 14 as known information. On the other hand, the position of the joint portion 12 between the mounting component 11 and the circuit board 10 is designated by designation information input to the control unit 7 by the input unit 4. Based on the position information of the temperature measurement position 13 and the bonding portion 12, the temperature calculation unit 7 a selects the bonding portion 12 and the temperature measurement position 13 from the temperature distribution of the substrate region 14 (that is, the temperature image of the substrate region 14). These temperatures can be extracted, and the difference between these extracted temperatures, that is, the temperature difference ΔT between the joint portion 12 and the temperature measurement position 13 can be calculated.

  Further, as described above, the surface material of the temperature-measured portion 2b disposed at the temperature measurement position 13 is the surface material of the joint portion 12 (specifically, the joining member of the mounting component 11 and the circuit board 10). Material). Thereby, the correlation between the temperature and infrared energy at the temperature measurement position 13 and the correlation between the temperature and infrared energy at the joint portion 12 can be matched. For this reason, the radiation temperature measuring unit 3 includes the joint 12, the temperature measurement position 13, and the like without performing the correction process of the emissivity of the infrared energy corresponding to each material of the joint 12 and the temperature measurement position 13. The temperature distribution of the substrate region 14 can be measured with high accuracy. As a result, the temperature calculation unit 7a can calculate the temperature difference ΔT between the bonding portion 12 and the temperature measurement position 13 with high accuracy based on the temperature distribution of the substrate region 14 by the radiation temperature measurement unit 3. .

  The temperature measurement position 13 described above is preferably defined in the vicinity of the joint portion 12 of the circuit board 10. That is, it is desirable that the temperature-measured portion 2 b of the contact-type temperature measuring unit 2 is disposed in the vicinity of the joint portion 12 on the circuit board 10. This is because, in the temperature distribution of the substrate region 14, the temperature change between the joint portion 12 and the temperature measurement position 13 is such that the temperature measurement position 13 is closer to the joint portion, in other words, the junction portion 12 and the temperature measurement position. This is because the smaller the temperature difference from 13, the more linear. When the temperature change between the joint portion 12 and the temperature measurement position 13 in the temperature distribution of the substrate region 14 is linear, the temperature calculation unit 7 a measures the joint portion 12 and the temperature measurement based on the temperature distribution of the substrate region 14. The temperature difference ΔT from the temperature position 13 can be easily calculated.

  After the above-described step S105 is completed, the temperature measuring device 1 displays the junction temperature T2 between the mounting component 11 and the circuit board 10 that are the temperature measurement target portions (step S106). In this case, the control unit 7 controls the display unit 5 to display the junction temperature T2 calculated in step S105 described above. Based on the control of the control unit 7, the display unit 5 displays temperature information 16 indicating the junction temperature T2, as shown in FIG. In addition, the display part 5 has already displayed the visible light image P1 of the board | substrate area | region 14 in step S102 mentioned above. The display unit 5 displays the temperature information 16 in the vicinity of the joint portion 12 of the mounting component 11 on the electrode pads 10a and 10b included in the visible light image P1. In this case, the display unit 5 displays the junction temperature T2 in a balloon-like display area that points to the junction portion 12 corresponding to the screen position indicated by the mouse cursor 15.

  In addition to the visible light image P1 and the temperature information 16, the display unit 5 includes a temperature image P2 indicating the temperature distribution of the substrate region 14 measured by the radiation temperature measurement unit 3 in step S104 described above, and the temperature distribution within this temperature distribution. And a color scale 17 indicating the temperature of the color by color. In this case, as shown in FIG. 5, the display unit 5 displays the visible light image P1 and the temperature image P2 of the substrate region 14 side by side and displays the color scale 17 on the side portion of the temperature image P2. The temperature image P2 shows the temperature distribution of each surface of the electrode pads 10a and 10b, the mounting component 11, the thermocouple 2a, the temperature-measured portion 2b, and the like included in the visible light image P1. The display unit 5 can display the above-described temperature distribution on the surface of the substrate region 14 by displaying the temperature image P2.

  In addition, the designation information of the temperature measurement target portion described above is input to the control unit 7 by a click operation of the input unit 4 performed by placing the mouse cursor 15 on the temperature measurement target portion included in the visible light image P1. For example, in response to a click operation in a state where the mouse cursor 15 is placed on the joint portion 12 of the mounting component 11 included in the visible light image P1, the input unit 4 sends the instruction information of the joint portion 12 to the control unit 7. input.

  After step S106 described above is completed, the temperature measuring device 1 determines whether or not to end this process (step S107). In this step S107, when the instruction information for instructing the end of the process is input by the input unit 4, the control unit 7 determines that the process is ended based on this instruction information (Yes in step S107), and ends the present process. . On the other hand, the control unit 7 determines that the process is not completed when the process termination instruction information is not input (No in step S107), returns to the above-described step S103, and repeats the processing procedure after step S103. . In addition, when it is judged that there is no temperature measurement instruction | indication in step S103 mentioned above (No in step S103), the control part 7 repeats the process sequence of this step S103.

  As described above, in the embodiment of the present invention, the temperature at the temperature measurement position excluding the joint portion between the circuit board and the mounted component is measured via the thermocouple in the position on the circuit board. The temperature distribution of the circuit board area including at least the junction and the temperature measurement position of the circuit board is measured in a non-contact manner, and the temperature difference between the junction and the temperature measurement position is calculated based on the measured temperature distribution. Based on the calculated temperature difference and the actually measured temperature at the temperature measurement position, the junction temperature between the mounted component and the circuit board is calculated, and the calculated junction temperature is displayed. For this reason, even if a temperature measuring member such as a thermocouple is not brought into contact with the heat-bonded portion of the mounted component on the circuit board, the temperature difference between the heat-bonded portion of the mounted component and the temperature-measured position within the temperature distribution of this board region is obtained. By using this, the measured temperature at this temperature measurement position can be corrected with high accuracy to the temperature of the heat-bonded portion of this mounted component. As a result, it is possible to prevent a temperature drop in the heat-bonded part of the mounting component due to the heat capacity of the temperature measuring member such as a thermocouple, and to prevent the heating efficiency of the bonding member between the circuit board and the mounting component from being disturbed. A temperature measuring device and a temperature measuring method capable of measuring the temperature of a joint with a component with high accuracy can be realized.

  Further, in the embodiment of the present invention, the heat-joined part (specifically, the mounting part) between the mounting component and the circuit board is attached to the tip of the thermocouple of the contact-type temperature measuring unit that measures the temperature at the temperature measurement position on the circuit board. Attach a temperature-measured part that has the same surface material as the component and the circuit board), and measure the temperature at the temperature-measured position by bringing the temperature-measured part into surface contact with the temperature-measured position on the circuit board. Configured. For this reason, the correlation between the temperature and infrared energy at the temperature measurement position can be matched with the correlation between the temperature and infrared energy at the heat-joined part of the mounting component, and thereby the infrared energy emissivity according to the surface material. Even without performing this correction process, the temperature distribution in the substrate region including the heat-bonded portion and the temperature measurement position can be measured with high accuracy. As a result, the temperature difference between the heating junction and the temperature measurement position can be calculated with high accuracy, and the junction temperature between the mounted component and the circuit board can be calculated with higher accuracy using the temperature difference and the measured temperature at the temperature measurement location. Can be calculated.

  Furthermore, in the embodiment of the present invention, a temperature image indicating a temperature distribution in a substrate region including at least a heat-joined portion of a mounting component and a temperature measurement position in a circuit board, and a visible light image of the substrate region are displayed. Therefore, it is possible to easily visually recognize the temperature distribution of the substrate region while referring to the state of the substrate region shown in the visible light image. Further, it is possible to easily input the designation information of the temperature measurement target portion (specifically, the heat-bonded portion between the mounted component and the circuit board) included in the visible light image.

  In the above-described embodiment, the temperature measurement part 2 b is fixed in advance to the tip of the thermocouple 2 a of the non-contact temperature measurement unit 2, and the temperature measurement part 2 b is placed at the temperature measurement position 13 on the circuit board 10. However, the present invention is not limited to this, and the temperature measurement part 2b is provided in advance at the temperature measurement position 13 on the circuit board 10, and the thermocouple 2a is brought into contact with the temperature measurement part 2b of the circuit board 10 for measurement. The temperature at the warm position 13 may be measured. FIG. 6 is a schematic diagram showing a state in which the thermocouple of the contact-type temperature measuring unit is brought into contact with the temperature-measured unit on the circuit board.

  As shown in FIG. 6, the temperature-measured portion 2 b is provided in advance at a position on the circuit board 10 excluding the heat-bonded portion of the mounted component 11 (that is, the temperature measurement position 13 described above). In this case, the temperature-measured part 2b is a dummy pad having the same structure as the electrode pads 10a and 10b for heat-bonding the mounting component 11. The dummy pad-shaped temperature-measured part 2b is insulative with respect to the circuit in the circuit board 10. Further, the surface material of the temperature-measured part 2b is the same material as the bonding member (for example, a metal member such as solder) between the mounting component 11 and the circuit board 10. As shown in FIG. 6, the contact-type temperature measuring unit 2 described above brings the thermocouple 2 a into contact with the temperature-measured portion 2 b of the circuit board 10, and the temperature-measured portion 2 b of the temperature-measured portion 2 b is contacted via the thermocouple 2 a. You may measure temperature, ie, the temperature of the temperature measurement position 13 of the circuit board 10. FIG. Also in this case, the same effects as those of the above-described embodiment are enjoyed.

  In the above-described embodiment, the temperature measurement position 13 on the circuit board 10 is defined in advance. However, the temperature measurement position 13 is not limited to this, and any position of the circuit board 10 excluding the joint portion 12 is defined as the temperature measurement position 13. The position information of the arbitrary temperature measurement position 13 may be input to the control unit 7 by the input unit 4. In this case, the input unit 4 performs the arbitrary temperature measurement position 13 in response to a click operation in a state where the mouse cursor 15 is placed on the temperature measurement unit 2b included in the visible light image P1 displayed on the display unit 5. Is input to the control unit 7. The temperature calculation unit 7a can specify the temperature measurement position 13 in the temperature distribution of the substrate region 14 (that is, in the temperature image P2) based on the input position information.

  Further, the temperature measurement position 13 in the visible light image P1 may be specified by image recognition. In this case, the temperature-measured portion 2 b is formed in a specific outer shape that is easy to recognize an image, such as a cross, and is disposed at the temperature measurement position 13 of the circuit board 10. The control unit 7 performs image recognition processing on the visible light image P1 captured by the imaging unit 3c, and recognizes the position of the temperature measurement unit 2b in the visible light image P1. The temperature calculation unit 7a may specify the recognized position of the temperature measuring part 2b as the temperature measuring position 13 of the circuit board 10.

  In the embodiment described above, the designation information of the joint portion 12 between the mounting component 11 and the circuit board 10 is input by the input unit 4. However, the present invention is not limited to this, and within the measurement visual field 3 d of the radiation temperature measurement unit 3. The circuit board 10 is arranged so that the bonding portion 12 is located at a specific position (for example, the center of the substrate region 14) defined in advance, and a specific portion (for example, the central portion) in the temperature distribution measured by the radiation temperature measuring unit 3 is defined. You may always make it the temperature distribution of the junction part 12. FIG. In this case, the temperature calculation unit 7a extracts the temperature of the specific portion (for example, the central portion of the temperature image) in the temperature distribution acquired from the radiation temperature measurement unit 3 as the temperature of the joint portion 12 in the temperature distribution, and has been described above. What is necessary is just to calculate temperature difference (DELTA) T of the junction part 12 and the temperature measurement position 13. FIG.

  Furthermore, in the above-described embodiment, the visible light image P1 and the temperature image P2 of the substrate region 14 are displayed on the display unit 5. However, the display unit 5 is not limited to this, and other than the temperature information 16 described above. The visible light image P1 only needs to be displayed, and the temperature image P2 need not be displayed. Further, when displaying the visible light image P1 and the temperature image P2 together, the display unit 5 may display the visible light image P1 and the temperature image P2 side by side vertically, horizontally, or diagonally, or may display the visible light image P1. And the temperature image P2 may be superimposed and displayed.

It is a block diagram showing typically an example of 1 composition of a temperature measuring device concerning an embodiment of the invention. It is a schematic diagram which shows the temperature measurement object seen from the measurement visual field side of the radiation temperature measurement part. It is a flowchart which shows an example of the temperature measurement method concerning embodiment of this invention. It is a schematic diagram which shows a specific example of the temperature distribution of the circuit board by a radiation temperature measurement part. It is a schematic diagram which shows one specific example of the display mode of the temperature measuring device concerning embodiment of this invention. It is a schematic diagram which shows the state which makes the thermocouple of a contact-type temperature measurement part contact the to-be-measured part on a circuit board.

DESCRIPTION OF SYMBOLS 1 Temperature measuring device 2 Contact-type temperature measurement part 2a Thermocouple 2b Temperature measurement part 3 Radiation temperature measurement part 3a Infrared detection part 3b Image processing part 3c Imaging part 3d Measurement visual field 4 Input part 5 Display part 6 Storage part 7 Control part 7a Temperature calculation part 10 Circuit board 10a, 10b Electrode pad 11 Mounting component 12 Joint part 13 Temperature measurement position 14 Board | substrate area | region 15 Mouse cursor 16 Temperature information 17 Color scale P1 Visible light image P2 Temperature image

Claims (12)

A contact-type temperature measurement unit that measures the temperature at a temperature measurement position excluding a joint portion between the mounting component and the circuit board on a circuit board where the mounting component is heat-bonded, and a thermocouple;
A non-contact type temperature measuring unit for measuring a temperature distribution of a substrate region including at least the joining portion and the temperature measuring position of the circuit board in a non-contact manner;
Based on the temperature distribution measured by the non-contact temperature measuring unit, a temperature difference between the joint portion and the temperature measuring position is calculated, and the temperature at the temperature measuring position measured by the contact temperature measuring unit. And a temperature calculation unit for calculating a junction temperature between the mounted component and the circuit board based on the temperature difference;
A display unit for displaying the junction temperature calculated by the temperature calculation unit;
A temperature measuring device comprising:   The contact-type temperature measurement unit includes a temperature measurement unit having the same surface material as that of the joint portion at the tip of the thermocouple, and the temperature measurement unit is brought into contact with the temperature measurement position to thereby measure the temperature measurement position. The temperature measuring apparatus according to claim 1, wherein the temperature is measured. The circuit board includes a temperature-measured portion having the same surface material as the joint portion at the temperature measurement position,
The temperature measuring device according to claim 1, wherein the contact temperature measuring unit measures the temperature at the temperature measuring position by bringing the thermocouple into contact with the temperature measuring unit on the circuit board. The non-contact temperature measuring unit is
An infrared detector for detecting infrared energy emitted from the substrate region;
An image processing unit that converts the infrared energy detected by the infrared detection unit into a temperature of the substrate region and generates a temperature image indicating the temperature distribution;
With
The said temperature calculation part calculates the temperature difference of the said junction part and the said temperature measurement position based on the said temperature image, The temperature measuring apparatus as described in any one of Claims 1-3 characterized by the above-mentioned. The non-contact temperature measuring unit includes an imaging unit that captures a visible light image of the substrate region,
The temperature measurement apparatus according to claim 1, wherein the display unit displays the visible light image captured by the imaging unit. An input unit for inputting designation information of the joint portion included in the visible light image displayed by the display unit;
The temperature calculation unit calculates a temperature difference between the joint portion specified by the specification information and the temperature measurement position, and based on the calculated temperature difference and the temperature of the temperature measurement position, the mounting The temperature measuring device according to claim 5, wherein a temperature at a joint between the component and the circuit board is calculated. The input unit inputs designation information of the temperature measurement position included in the visible light image displayed by the display unit,
The temperature calculation unit calculates a temperature difference between the temperature measurement position designated by the designation information and the joint portion, and based on the calculated temperature difference and the temperature of the temperature measurement position, the mounting The temperature measuring device according to claim 5 or 6, wherein a temperature at a junction between a component and the circuit board is calculated. The temperature on the circuit board where the mounting component is heated and bonded, and the temperature of the temperature measurement position excluding the bonding portion between the mounting component and the circuit board is measured via a thermocouple, and at least the circuit board A temperature measurement step for measuring the temperature distribution of the substrate region including the bonding portion and the temperature measurement position in a non-contact manner;
Based on the temperature distribution, a temperature difference between the joint portion and the temperature measurement position is calculated, and based on the calculated temperature difference and the temperature measurement temperature, the mounted component, the circuit board, A temperature calculating step for calculating the junction temperature of
A display step for displaying the junction temperature calculated in the temperature calculation step on a display unit;
A temperature measuring method comprising:   In the temperature measurement step, the temperature measurement part fixed to the tip of the thermocouple is brought into contact with the temperature measurement position, and the temperature of the temperature measurement position is measured via the temperature measurement part having the same surface material as the joint portion. The temperature measuring method according to claim 8, wherein the temperature is measured.   In the temperature measurement step, the temperature of the temperature measurement position is measured by bringing the thermocouple into contact with a temperature measurement part that is provided at the temperature measurement position on the circuit board and has the same surface material as the joint portion. The temperature measuring method according to claim 8. The temperature measuring step detects infrared energy emitted from the substrate region, converts the detected infrared energy into a temperature of the substrate region, and generates a temperature image indicating the temperature distribution,
The temperature measurement method according to claim 8, wherein the temperature calculation step calculates a temperature difference between the joint portion and the temperature measurement position based on the temperature image. An imaging step of imaging a visible light image of the substrate region;
The temperature measurement step measures the temperature at the temperature measurement position and the temperature distribution in the substrate region included in the visible light image,
The temperature measurement method according to any one of claims 8 to 11, wherein the display step displays the visible light image and the junction temperature on the display unit.

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