JP2010188370A5 - - Google Patents

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Publication number
JP2010188370A5
JP2010188370A5 JP2009034144A JP2009034144A JP2010188370A5 JP 2010188370 A5 JP2010188370 A5 JP 2010188370A5 JP 2009034144 A JP2009034144 A JP 2009034144A JP 2009034144 A JP2009034144 A JP 2009034144A JP 2010188370 A5 JP2010188370 A5 JP 2010188370A5
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JP
Japan
Prior art keywords
laser
diffraction
laser light
line
condensing
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Pending
Application number
JP2009034144A
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English (en)
Japanese (ja)
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JP2010188370A (ja
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Priority to JP2009034144A priority Critical patent/JP2010188370A/ja
Priority claimed from JP2009034144A external-priority patent/JP2010188370A/ja
Publication of JP2010188370A publication Critical patent/JP2010188370A/ja
Publication of JP2010188370A5 publication Critical patent/JP2010188370A5/ja
Pending legal-status Critical Current

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JP2009034144A 2009-02-17 2009-02-17 レーザ加工装置及びレーザ加工方法 Pending JP2010188370A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009034144A JP2010188370A (ja) 2009-02-17 2009-02-17 レーザ加工装置及びレーザ加工方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009034144A JP2010188370A (ja) 2009-02-17 2009-02-17 レーザ加工装置及びレーザ加工方法

Publications (2)

Publication Number Publication Date
JP2010188370A JP2010188370A (ja) 2010-09-02
JP2010188370A5 true JP2010188370A5 (enExample) 2012-06-07

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ID=42815000

Family Applications (1)

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JP2009034144A Pending JP2010188370A (ja) 2009-02-17 2009-02-17 レーザ加工装置及びレーザ加工方法

Country Status (1)

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JP (1) JP2010188370A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016058429A (ja) * 2014-09-05 2016-04-21 株式会社ディスコ ウエーハの加工方法
WO2020154985A1 (zh) * 2019-01-30 2020-08-06 大族激光科技产业集团股份有限公司 用于切割硬脆性产品的激光切割头以及激光切割装置
CN115722793B (zh) * 2022-11-21 2024-12-17 之江实验室 一种飞秒激光直写高透视光子光路的方法及装置
CN119857947B (zh) * 2025-03-25 2025-07-08 广东建邦兴业集团有限公司 一种拼接建筑钢板的激光切割方法及切割产线结构

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0231278Y2 (enExample) * 1985-07-26 1990-08-23
JP4418282B2 (ja) * 2004-03-31 2010-02-17 株式会社レーザーシステム レーザ加工方法
JP4607537B2 (ja) * 2004-10-15 2011-01-05 株式会社レーザーシステム レーザ加工方法
JP4698200B2 (ja) * 2004-10-27 2011-06-08 日立造船株式会社 レーザ加工方法およびレーザ加工装置
JP2008100257A (ja) * 2006-10-19 2008-05-01 Seiko Epson Corp スクライブ装置、基板の分断方法及び、電気光学装置の製造方法
JP2008126283A (ja) * 2006-11-21 2008-06-05 Seiko Epson Corp 微細構造体の製造方法、露光方法

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