JP2010188370A - レーザ加工装置及びレーザ加工方法 - Google Patents

レーザ加工装置及びレーザ加工方法 Download PDF

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Publication number
JP2010188370A
JP2010188370A JP2009034144A JP2009034144A JP2010188370A JP 2010188370 A JP2010188370 A JP 2010188370A JP 2009034144 A JP2009034144 A JP 2009034144A JP 2009034144 A JP2009034144 A JP 2009034144A JP 2010188370 A JP2010188370 A JP 2010188370A
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JP
Japan
Prior art keywords
diffraction
laser
laser light
optical element
condensing
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Pending
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JP2009034144A
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English (en)
Japanese (ja)
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JP2010188370A5 (enrdf_load_stackoverflow
Inventor
Takafumi Atsumi
貴文 渥美
Yuji Ikeda
優二 池田
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Aisin Corp
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Aisin Seiki Co Ltd
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Application filed by Aisin Seiki Co Ltd filed Critical Aisin Seiki Co Ltd
Priority to JP2009034144A priority Critical patent/JP2010188370A/ja
Publication of JP2010188370A publication Critical patent/JP2010188370A/ja
Publication of JP2010188370A5 publication Critical patent/JP2010188370A5/ja
Pending legal-status Critical Current

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JP2009034144A 2009-02-17 2009-02-17 レーザ加工装置及びレーザ加工方法 Pending JP2010188370A (ja)

Priority Applications (1)

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JP2009034144A JP2010188370A (ja) 2009-02-17 2009-02-17 レーザ加工装置及びレーザ加工方法

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JP2009034144A JP2010188370A (ja) 2009-02-17 2009-02-17 レーザ加工装置及びレーザ加工方法

Publications (2)

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JP2010188370A true JP2010188370A (ja) 2010-09-02
JP2010188370A5 JP2010188370A5 (enrdf_load_stackoverflow) 2012-06-07

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JP2009034144A Pending JP2010188370A (ja) 2009-02-17 2009-02-17 レーザ加工装置及びレーザ加工方法

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016058429A (ja) * 2014-09-05 2016-04-21 株式会社ディスコ ウエーハの加工方法
CN110366472A (zh) * 2019-01-30 2019-10-22 大族激光科技产业集团股份有限公司 用于切割硬脆性产品的激光切割头以及激光切割装置
CN115722793A (zh) * 2022-11-21 2023-03-03 之江实验室 一种飞秒激光直写高透视光子光路的方法及装置
CN119857947A (zh) * 2025-03-25 2025-04-22 广东建邦兴业集团有限公司 一种拼接建筑钢板的激光切割方法及切割产线结构

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6163391U (enrdf_load_stackoverflow) * 1985-07-26 1986-04-30
JP2005288503A (ja) * 2004-03-31 2005-10-20 Laser System:Kk レーザ加工方法
JP2006114786A (ja) * 2004-10-15 2006-04-27 Laser System:Kk レーザ加工方法
JP2006122927A (ja) * 2004-10-27 2006-05-18 Hitachi Zosen Corp レーザ加工方法およびレーザ加工装置
JP2008100257A (ja) * 2006-10-19 2008-05-01 Seiko Epson Corp スクライブ装置、基板の分断方法及び、電気光学装置の製造方法
JP2008126283A (ja) * 2006-11-21 2008-06-05 Seiko Epson Corp 微細構造体の製造方法、露光方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6163391U (enrdf_load_stackoverflow) * 1985-07-26 1986-04-30
JP2005288503A (ja) * 2004-03-31 2005-10-20 Laser System:Kk レーザ加工方法
JP2006114786A (ja) * 2004-10-15 2006-04-27 Laser System:Kk レーザ加工方法
JP2006122927A (ja) * 2004-10-27 2006-05-18 Hitachi Zosen Corp レーザ加工方法およびレーザ加工装置
JP2008100257A (ja) * 2006-10-19 2008-05-01 Seiko Epson Corp スクライブ装置、基板の分断方法及び、電気光学装置の製造方法
JP2008126283A (ja) * 2006-11-21 2008-06-05 Seiko Epson Corp 微細構造体の製造方法、露光方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016058429A (ja) * 2014-09-05 2016-04-21 株式会社ディスコ ウエーハの加工方法
CN110366472A (zh) * 2019-01-30 2019-10-22 大族激光科技产业集团股份有限公司 用于切割硬脆性产品的激光切割头以及激光切割装置
US20200238442A1 (en) * 2019-01-30 2020-07-30 Han's Laser Technology Industry Group Co., Ltd Laser cutting head for cutting hard, brittle products and laser cutting device thereof
WO2020154985A1 (zh) * 2019-01-30 2020-08-06 大族激光科技产业集团股份有限公司 用于切割硬脆性产品的激光切割头以及激光切割装置
CN115722793A (zh) * 2022-11-21 2023-03-03 之江实验室 一种飞秒激光直写高透视光子光路的方法及装置
CN119857947A (zh) * 2025-03-25 2025-04-22 广东建邦兴业集团有限公司 一种拼接建筑钢板的激光切割方法及切割产线结构

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