JP2010182967A - Method of manufacturing electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component in which conductive paste is easily charged in a through-hole bored in a bottom surface of a hollow, the reverse surface is easily flattened, and the electronic element is easily mounted. <P>SOLUTION: The method of manufacturing the electronic component includes the steps of: forming a substrate 70 having the hollow 3 and the through-hole 4 penetrating the bottom surface of the hollow 3; arranging an elastic member 74 with elasticity where the through-hole 4 is closed from a hollow surface side where the hollow 3 is formed; charging the conductive paste 12 in the through-hole 4 from the opposite plane side from the side of the hollow 3; removing the elastic member 74 from a hollow-3 side surface where the hollow 3 is formed; and mounting the electronic element 77 so that the electronic element may be electrically connected to the conductive paste 12. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an electronic component having a package and an electronic element mounted on the package.

  In the field of electronic devices in which RF devices, optical devices, circuit boards on which semiconductor elements are mounted, and the like are used, penetrating electrodes that penetrate from the front surface to the back surface of the substrate are formed. Particularly, in RF devices and optical devices, miniaturization, low resistance, and improvement in thermal conductivity are required.

  FIG. 15 shows a cross-sectional structure of a capacitive pressure sensor using a substrate on which a through electrode is formed (Patent Document 1). This pressure sensor has a structure in which a semiconductor substrate 51 in which a recess is formed on a glass substrate 55 is anodically bonded with the recess side on the glass substrate side. The concave portion of the semiconductor substrate 51 is a sealed space, and a laminated electrode composed of the metallized layer 63 and the fixed electrode 54 is formed on the glass substrate 55 side of the sealed space. A displacement electrode 53 is formed in a recessed portion on the semiconductor substrate 51 side of the sealed space. A metal wire 60 is embedded in the glass substrate 55 to form a through electrode, and conduction between the laminated electrode and the bump 64 formed on the back surface is established. Similarly, aluminum wiring 62 is formed on the upper surface of the semiconductor substrate 51, and the aluminum wiring 62 extends through the semiconductor substrate 51 and is electrically connected to the displacement electrode 53. Thus, by forming a through electrode that penetrates the substrate, a device with a small mounting area and high reliability can be provided.

  A method of embedding the metal wire 60 in the glass substrate 55 is as follows. The glass material is heated to about 1500-1600 ° C. and melted. Next, a high melting point metal of 2600 ° C. or higher, for example, molybdenum or tungsten, is embedded in the molten glass to be cooled. This is sliced and cut out, and the cut out plate is polished to obtain a glass substrate with a through electrode.

  In addition to the above, as a method of forming the through electrode on the substrate, a method of forming a through hole in the substrate and plating the side wall of the through hole to deposit a metal film such as Cu or Ni, or A method is known in which a conductive paste kneaded with a conductive filler and a resin binder is filled in a through-hole and fired at a relatively low temperature to form a through-electrode.

JP 2001-201418 A

  However, in the through electrode forming method described in Patent Document 1, the glass substrate on which the through hole is formed has a flat surface on the front surface and the back surface on which the through hole is formed. Therefore, it is easy to fill the through hole with the conductive paste, and thereafter, by performing a flattening process such as a polishing step, it is easy to remove the conductive paste at unnecessary portions and form a flat surface. However, if the depression is formed in the glass substrate 55 in which the through hole is formed, it is not easy to form the through electrode.

  For example, when filling the through hole with the conductive paste by screen printing or the like, if the printing is performed from the side where the depression is formed, the conductive paste is also printed on the inner wall and bottom surface of the depression other than the through hole. Furthermore, it is difficult to remove the conductive paste printed on the inner wall and bottom surface. In addition, when printing from the side where the depression is not formed, the surface of the depression side of the conductive paste filled in the through hole does not reach the bottom surface of the depression, or protrudes from the bottom surface of the depression, so that the surface of the conductive paste is It is difficult to match the bottom of the dent. Moreover, when a through hole is filled with a conductive paste using a dispenser, the conductive paste has a tail due to its thixotropy, and angular projections remain on the surface. This protrusion applied local stress to the electronic component mounted thereon, causing the electronic component to break during mounting. Further, if a protrusion remains on the bottom surface of the recess, it is not easy to flatten the protrusion.

  In the present invention, in order to solve the above problems, the following configuration is adopted.

  (1) In a method for manufacturing an electronic component comprising a substrate and an electronic element mounted on the substrate, a step of forming a substrate having a recess and a through-hole penetrating the bottom surface of the recess, and the recess is formed. A step of disposing an elastic member having elasticity at a position closing the through hole from the recessed surface side, a step of filling the through hole with a conductive paste from a plane side opposite to the recessed side, and forming the recess An electronic component manufacturing method including a step of removing the elastic member from the recessed surface side and a step of mounting the electronic element so as to be electrically connected to the conductive paste.

  (2) In the method of manufacturing an electronic component according to (1), in the step of forming the substrate, a taper is formed in the recess.

  (3) In the method of manufacturing an electronic component according to any one of (1) and (2), in the step of forming the substrate, a taper is formed in the through hole.

  (4) In the electronic component manufacturing method according to any one of (1) to (3), the step of filling the conductive paste is performed by a screen printing method.

  (5) In the method for manufacturing an electronic component according to any one of (1) to (3), the step of filling the conductive paste is performed by a dispenser method.

  (6) In the method of manufacturing an electronic component according to any one of (1) to (5), the step of forming the substrate includes forming the plurality of depressions and the plurality of through holes in the substrate, The plurality of elastic members corresponding to each of the recesses and disposed at positions where the plurality of through holes are closed are formed integrally.

  According to the present invention, a recess is formed in the substrate, and a through hole is formed in the bottom surface of the recess, and the elastic member is disposed at a position where the through hole is blocked from the surface side where the recess is formed. A through electrode was formed by filling the conductive paste. Thereby, the through-hole formed in the bottom face of the dent can be easily filled with the conductive paste, and further, it can be easily flattened by polishing the back face. In addition, since the bottom surface of the recess and the surface of the through electrode exposed at the bottom surface can be planarized in substantially the same plane, mounting of electronic components is facilitated.

It is a schematic diagram for demonstrating the manufacturing method of the electronic component which concerns on the Example of this invention. It is a cross-sectional schematic diagram which shows the manufacturing method of the electronic component which concerns on the Example of this invention. It is a cross-sectional schematic diagram which shows the manufacturing method of the electronic component which concerns on the Example of this invention. It is a cross-sectional schematic diagram which shows the manufacturing method of the electronic component which concerns on the Example of this invention. It is a cross-sectional schematic diagram which shows the manufacturing method of the electronic component which concerns on the Example of this invention. It is a cross-sectional schematic diagram which shows the manufacturing method of the electronic component which concerns on the Example of this invention. It is a cross-sectional schematic diagram which shows the manufacturing method of the electronic component which concerns on the Example of this invention. It is a cross-sectional schematic diagram which shows the manufacturing method of the electronic component which concerns on the Example of this invention. It is a cross-sectional schematic diagram which shows the manufacturing method of the electronic component which concerns on the Example of this invention. It is a cross-sectional schematic diagram which shows the manufacturing method of the electronic component which concerns on the Example of this invention. It is a schematic diagram which shows the manufacturing method of the electronic component which concerns on the Example of this invention. It is a cross-sectional schematic diagram which shows the manufacturing method of the electronic component which concerns on the Example of this invention. It is a cross-sectional schematic diagram which shows the manufacturing method of the electronic component which concerns on the Example of this invention. It is a schematic diagram which shows the manufacturing method of the electronic component which concerns on the Example of this invention. It is a cross-sectional schematic diagram of a conventionally well-known light-emitting device.

  Hereinafter, the manufacturing method of the electronic component of this invention is demonstrated in detail using drawing.

  FIG. 1 is a view for explaining basic steps of a method for manufacturing an electronic component according to the present invention. FIG. 1A is a schematic cross-sectional view of the substrate 70 in which the recess 3 and the through hole 4 are formed, and FIG. 1B is a schematic cross-sectional view in a state where the elastic member 74 is in contact with the bottom surface 71 of the recess 3. (C) is a schematic cross-sectional view of a state in which the through-hole 4 is filled with the conductive paste 12, and (d) is a schematic cross-sectional view of the substrate 70 in which the elastic member 74 is removed from the bottom surface 71 of the recess 3. FIG. 4E is a schematic cross-sectional view of a substrate 70 in which an electronic element 77 is mounted on the bottom surface 71 of the recess 3.

  First, as shown to Fig.1 (a), the board | substrate 70 which has the through-hole 4 penetrated from the bottom 3 of the hollow 3 and the hollow 3 to the back surface 72 is prepared. As the substrate 70, a glass substrate, a ceramic substrate, or a plastic substrate can be used. The depression 3 and the through hole 4 can be formed by a molding press method for the substrate 70. In addition, the substrate 70 can be formed by bonding a substrate in which the depressions 3 are formed in advance and a substrate in which the through holes 4 are formed. Moreover, you may form the hollow 3 and the through-hole 4 by sandblasting or an etching. The number of through holes 4 may be one or two, or may be three or more.

  The inner wall of the recess 3 has a taper from the bottom surface 71 toward the surface 73. When an LED element is used as the electronic element 77 to be mounted, the light emitted from the LED element can be efficiently emitted upward by forming a reflective surface on the tapered inner wall. In addition, by forming a taper in the depression 3, when the depression 3 is formed by a molding method using a mold, the mold releasability can be improved. Further, as shown in FIG. 1A, the longitudinal section of the through hole 4 was formed in a divergent shape from the back surface 72 to the bottom surface 71. Thereby, when forming the through-hole 4 by the shaping | molding method using a type | mold, the mold release property of the type | mold from the board | substrate 70 can be improved. Further, it is possible to prevent the through electrode 6 filling the through hole 4 later from coming off to the back surface side. The through-hole 4 is not limited to being formed in a divergent shape from the bottom surface 71 to the back surface 72, and may be formed in a divergent shape from the reverse surface 72 to the bottom surface 71, or in the center in the thickness direction. It is good also as a shape which narrowed down the opening diameter, ie, the shape which becomes a divergent shape in both directions toward the bottom face 71 and the back surface 72 from the center part of the through-hole 4. FIG. If the through-hole 4 is formed in a divergent shape in both directions, the through-electrode 6 to be filled later can be made difficult to come off both on the back surface 72 side of the substrate 70 and on the bottom surface 71 side of the recess 3.

  Next, as shown in FIG. 1B, the substrate 70 is turned upside down, and an elastic member 74 having elasticity is installed at a position where the through hole 4 is closed from the surface 73 side where the recess 3 is formed. The upper surface 75 of the elastic member 74 is in contact with the bottom surface 71 of the recess 3 and closes the opening of the through hole 4. Silicon rubber can be used as the elastic member 74. Further, instead of silicon rubber, other rubbers, polyethylene films, and other elastic materials can be used. When the through-hole 4 is filled with the conductive paste, the upper surface 75 and the bottom surface 71 are brought into close contact with each other so that no leakage occurs between the upper surface 75 of the elastic member 74 and the bottom surface 71 of the recess 3.

  Next, as shown in FIG. 1C, the conductive paste 12 is filled into the through hole 4 from the back surface 72 side of the substrate 70 by the dispenser 46. The conductive paste 12 can be filled by a printing method instead of the dispenser method. As the conductive paste 12, a material obtained by kneading a conductive filler and a resin binder can be used. As the conductive filler, Au, Ag or Cu, or Cu coated with Ag can be used. The conductive paste 12 can be filled in a vacuum. When the airtightness between the bottom surface 71 of the substrate 70 and the upper surface 75 of the elastic member 74 is high, bubbles remain on the elastic member 74 side of the through hole 4 and the conductive paste 12 is filled to the upper surface 75 of the elastic member 74. There is a risk that it will not be possible. In this case, if the conductive paste 12 is filled in a vacuum atmosphere, air is not sealed inside, so that the conductive paste 12 can be easily filled to reach the upper surface 75 of the elastic member 74. Moreover, since the bubbles mixed in the conductive paste 12 can be removed, the reliability of the through electrode 6 can be improved.

  Next, the elastic member 74 is removed from the recess 3 as shown in FIG. Since the upper surface 75 of the elastic member 74 is in contact with the bottom surface 71 of the recess 3, the surface exposed to the recess 3 side of the through electrode 6 constitutes substantially the same plane as the bottom surface 71 of the recess 3. Further, the surface exposed to the back surface 72 side of the through electrode 6 also constitutes substantially the same plane as the back surface 72. In particular, since the surface of the through electrode 6 on the recess 3 side is substantially the same plane as the bottom surface 71, the electronic device mounted thereon may be cracked or subjected to uneven stress over the long term. Absent. Therefore, the reliability of the mounted electronic element can be ensured. Further, even when the through electrode 6 protrudes from the back surface 72 of the substrate 70, the back surface 72 is originally a flat surface, so that the polishing process can be performed and the surface can be easily flattened.

  Next, as shown in FIG. 1 (e), the upper part of the through electrode 6 exposed on the bottom surface 71 of the depression 3 is fixed by being electrically connected to an electrode (not shown) of the electronic element 77 through the die bonding material 24. To do. In addition, an electrode (not shown) formed on the upper surface of the electronic element 77 and another through electrode 6 are electrically connected by a wire 25. Furthermore, a back electrode can be formed on the back surface 72 of the substrate 70 by applying a sealing material that seals the electronic elements 77 and the wires 25 as necessary.

  2-11 is a schematic diagram showing the manufacturing method of the electronic component based on the Example of this invention. Hereinafter, a manufacturing method using the light emitting device 1 as an electronic component will be described in detail.

  FIG. 2 is a schematic cross-sectional view showing a state in which the glass material 33 is inserted between the surface plate 31 and the mold 32. FIG. 3 is a schematic cross-sectional view of the package substrate 2 after molding. First, the glass material 33 is installed as a package material on the surface plate 31 and heated to a temperature of 300 ° C. to 800 ° C. at which the glass material 33 is softened. A convex portion 34, a taper 35, and the like are formed on the surface of the mold 32. The convex portion 34 is a portion for forming the through hole 4, and the taper 35 is a portion for forming a taper on the inner wall surface of the recess 3. The mold 32 is also heated to a temperature of 300 ° C. to 800 ° C. and pressed against the lower glass material 33 to form the package substrate 2 having the recesses 3 and the through holes 4 as shown in FIG.

  In addition, the hollow 3 has a mortar shape with a circular planar shape, and the through hole 4 is formed so that its diameter expands in a divergent shape from the back surface to the surface. That is, when the package substrate 2 is formed, the recess 3 and the through hole 4 are tapered. This is because mold release after the mold 32 is pressed onto the package substrate 2 is facilitated, and further, the separation of the through electrode 6 toward the back surface side is suppressed. As an example of specific dimensions, the through-hole 4 has a substantially inverted truncated cone shape with a diameter of 400 μm on the front surface side and a diameter of 200 μm on the back surface side. Further, the planar shape of the through-hole 4 may be any shape such as a circle, an ellipse, a polygon, and a rectangle. Further, although the package substrate 2 having the five through holes 4 is formed, the number thereof is not limited.

  Further, the through-hole 4 can be formed by a sandblasting method or an etching method instead of such a hot pressing method. However, in the sandblast method, holes must be individually formed, and in the etching method, the number of steps such as formation of a photomask is increased. A ceramic substrate can be used as the package substrate 2 instead of the glass substrate. In that case, a hole is formed in the green sheet before sintering by a press method, and sintered to attach the through-hole 4. A ceramic plate can be obtained.

  FIG. 4 is a schematic cross-sectional view showing a state in which the silicon rubber 9 is installed in the lower part of the recess 3. FIG. 5 is a schematic cross-sectional view showing a state in which the upper surface of the protrusion 9 a is in contact with the bottom surface of the recess 3. As shown in FIG. 4, the package substrate 2 is turned upside down, the back surface is directed upward, the front surface is directed downward, and the upper surface of the protrusion 9 a formed on the silicon rubber 9 is brought into contact with the bottom surface of the recess 3. The protrusions 9 a formed on the silicon rubber 9 have a shape that closes all the openings of the plurality of through holes 4. As specific dimensions, the package substrate 2 has a depth A of the recess 3 of 500 μm, a depth B from the bottom surface to the back surface of 400 μm, and a diameter of the bottom surface of the recess 3 of φ2.5 mm. 9 has a diameter of φ2.5 mm or less, a size that covers all the openings of the through hole 4, and a height of 1 mm.

  The silicon rubber 9 is made of a synthetic resin containing Si as a main component and has elasticity. The hardness of the silicon rubber 9 is preferably such that when the package substrate 2 is arranged from the upper side, the adhesion to the package substrate 2 is increased by its weight. Specifically, the hardness is 45-13Hs (JIS K 6301 spring type). A type) is preferred.

  Then, by placing the package substrate 2 on such a silicon rubber 9, as shown in FIG. 5, the projection 9a of the silicon rubber 9 is pressed and deformed by the package substrate 2, and the projection of the silicon rubber 9 is deformed. 9a adheres to the bottom surface of the recess 3 of the package substrate 2 and closes the through hole 4 from the surface side.

  6 and 8 are schematic views showing a state in which the conductive paste 12 is filled in the through holes 4 by the printing method and the filled state, and FIG. 9 is a schematic view showing a state in which the silicon rubber 9 is removed from the through holes. FIG. Next, as shown in FIG. 6, a conductive paste 12 is attached to the back surface of the package substrate 2, and the through hole 4 is filled with a conductive material. The conductive material is filled by screen printing. The squeegee 13 is moved to fill the through hole 4 with the conductive paste 12. The conductive paste 12 contains a conductive filler and a resin binder. Moreover, you may contain the low melting glass powder with favorable adhesiveness with respect to ceramics or glass. As the conductive filler, Au, Ag or Cu, or Cu coated with Ag is used. Further, as shown in FIGS. 6 and 7, the squeegee 13 is tilted at an angle of 17 to 20 degrees in the traveling direction with respect to the back surface of the package substrate 2 and reciprocates. By repeatedly reciprocating this and moving the squeegee 13, the through-hole 4 is filled with the electrically conductive paste 12 as shown in FIG. Next, temporary drying is performed at a temperature of about 80 ° C., the conductive paste 12 is temporarily cured, and the silicon rubber 9 is detached from the recess 3. Then, as shown in FIG. 9, the silicon rubber 9 is baked at a temperature of about 200 ° C. to about 500 ° C. according to the paste material in a state where the silicon rubber 9 is detached from the recess 3 to solidify as the through electrodes 6a and 6b. The through electrode 6a and the through electrode 6b are electrically separated.

  FIG. 10 is a schematic cross-sectional view of the package substrate 2 on which the back electrode 27 and the reflective film 26 are formed. FIG. 11A is a schematic cross-sectional view of the light-emitting device 1 in which the LED element 23 is mounted and sealed. And (b) is a top view thereof. Next, as shown in FIG. 10, back surface electrodes 27 a and 27 b are formed on the back surface of the package substrate 2. Ink mixed with a conductive material such as Ag is printed on the back surface of the package substrate 2 by a screen printing method. Next, it heat-fires and solidifies. Since the back electrodes 27a and 27b are formed by printing, the photolithography process and the etching process are not required, and the manufacturing cost can be reduced.

  Further, instead of the screen printing method, the back electrodes 27a and 27b may be formed by depositing a metal film by another method such as sputtering, vapor deposition, or plating. When the back electrode 27 is formed by metal vapor deposition, sputtering, or plating, a Ti layer, a barrier layer thereon, a Pt layer, a Ni layer, and surface oxidation are further applied to improve adhesion. An Au layer can be formed to prevent this. Further, the back electrodes 27a and 27b can be formed by a lift-off method in which a resist film is patterned first, a metal film is deposited thereon, and then the resist film is removed.

  A reflective film 26 is formed on the taper of the recess 3. The reflective film 26 can be formed by metallization of a conductive paste, sputtering or vapor deposition of a metal material. The reflective film 26 may also be formed on the bottom surface of the recess 3.

  Next, as shown in FIGS. 11A and 11B, the LED element 23 is mounted in the recess 3 of the package substrate 2. The LED element 23 is placed on the exposed surface of the through electrode 6a with the die bonding material 24 interposed therebetween, and is pressed and bonded while being heated. The die bonding material 24 is conductive, and an electrode (not shown) is formed on the back surface of the LED element 23, and mechanically and electrically connects the through electrode 6 a and the LED element 23. As the die bonding material 24, solder bumps or gold bumps can be used. Moreover, a conductive adhesive can be used as the die bonding material 24.

  Further, the LED element 23 and the through electrode 6 b are connected by a wire 25. An electrode (not shown) is formed on the upper surface of the LED element 23. A fine gold wire can be used as the wire 25. Instead of connecting using the wire 25, the LED element 23 is extended to the through electrode 6b, and the back surface of the LED element 23 is made to correspond to the through electrodes 6a and 6b to form two electrodes. May be connected together electrically and mechanically.

  Then, the LED element 23 is sealed by filling the recess 3 with the sealing material 28. As the sealing material 28, an insulating transparent resin material can be used. Moreover, the silicon oxide which superposed | polymerized and hardened the polymetalloxane formed from the metal alkoxide or metal alkoxide can be formed. In particular, when a metal oxide made from a metal alkoxide or polymetalloxane is used as the sealing material 28, the package substrate 2 made of glass is also a silicon oxide. And sealing property can be obtained.

  Thus, since the through electrode 6a is provided under the LED element 23 and the back electrode 27a is connected to the through electrode 6a, the heat generated by the light emission of the LED element 23 is caused by the through electrode 6a and the back electrode 27a. The heat can be efficiently radiated to the outside through the. Therefore, even when a plurality of LED elements 23 are provided in one recess 3 to improve the light emission luminance, it is possible to prevent the light emission efficiency from being lowered by heating. Moreover, since the cavities 3 have a shape in which the diameter of the dent 3 expands from the bottom to the top, the directivity can be imparted to the light emitted from the LED element 23.

  As described above, according to the method for manufacturing a light-emitting device of the present invention, even if the recess 3 is formed on the package substrate 2, the through-hole 4 formed on the bottom surface of the recess 3 is recessed. Silicon rubber 9 was placed so as to close from the front surface side where 3 was formed, and the conductive paste 12 was filled from the back surface side where the recess 3 was not formed. Thereby, the conductive paste 12 can be easily filled into the through-hole 4 formed in the bottom surface of the recess 3, and further, the flattening thereof can be easily performed by polishing the back surface. In addition, since the bottom surface of the recess 3 and the surface of the through electrodes 6a and 6b exposed on the bottom surface can be flattened in substantially the same plane, the LED element 23 can be easily mounted. Reliability can also be ensured.

  In the above-described embodiment, the example in which the package substrate 2 is molded by the molding method has been described. However, the present invention is not limited to this. For example, a structure in which a plate-like body in which the through electrode 6 is formed on the package substrate 2 and a frame for forming the recess 3 are bonded to the plate-like body can be used. Further, the recess 3 of the package substrate 2 may be formed by a sandblasting method or an etching method.

  In the above-described embodiments, (1) glass material molding → (2) formation of through electrode → (3) formation of back electrode → (4) mounting of light emitting element → (5) formation of sealing material Although it is in order, it is not limited to this process order. For example, (2) after forming the through electrode, (4) mounting of the light emitting element → (5) formation of the sealing material → (3) formation of the back electrode may be performed.

  Moreover, in the said Example, although the electrically conductive paste 12 was filled with the screen printing system, it is not limited to this. FIG. 12 is a schematic diagram showing a state where the through-hole is filled with the conductive paste by the dispenser. As shown in FIG. 12, the conductive paste may be filled by a dispenser method (specifically, an air method or a jet method). In this case, as in the above-described embodiment, the conductive paste is emitted from the nozzle 47 of the dispenser 46 in a state where the through hole 4 is closed with the silicon rubber 9 from the surface side where the recess 3 is formed, Fill with conductive paste. Further, the square projections formed on the surface of the conductive paste may be flattened by polishing the back surface of the package substrate 2.

  Moreover, in the said Example, although the diameter of the hollow 3 and the through-hole 4 is formed so that it may expand in a divergent shape toward the surface from a back surface, it is not limited to this shape. FIG. 13 is a schematic cross-sectional view of an electronic component in which the through hole 4 has another cross-sectional shape. As shown in FIG. 13, the diameter of the recess 3 expands in a divergent shape from the bottom surface to the surface of the recess. The diameter of the through hole 4 is narrowed at an intermediate portion between the bottom surface and the back surface of the recess 3. The through-hole 4 can be formed by molding in two steps from the front side and the back side. The through electrode 6 filled in the through hole 4 does not fall out of the through hole 4.

  In the embodiment described above, one recess 3 is formed for one light emitting device 1, a plurality of through holes 4 are formed for one recess 3, and one LED element 23 is formed. However, the present invention is not limited to this. For example, a plurality of LED elements 23 may be disposed in one recess 3. For example, the structure which the one through-hole 4 forms with respect to the one hollow 3 may be sufficient. For example, the structure which forms the hollow 3 of multiple places with respect to the one light emitting device 1 may be sufficient.

  It is also possible to take a large number of light emitting devices 1. FIGS. 14A and 14B are diagrams for explaining the multi-cavity of the light emitting device 1, where FIG. 14A is a schematic rear view of the wafer 40, and FIG. 14B is a schematic enlarged view of one light emitting device 1. FIG. In the manufacturing method shown in FIG. 14, 86 light emitting devices 1 are manufactured simultaneously from one wafer 40. As shown in FIG. 14, the pattern of the back surface electrodes 27a and 27b formed on the back surface of the package substrate 2 is arranged.

  Further, as shown in FIG. 14B, four through electrodes 6 a are formed in the region of the LED element 23, and one through electrode 6 b is formed outside the LED element 23. By forming the four through electrodes 6a in the region of the LED element 23, the heat generated in the LED element 23 can be effectively dissipated. The back electrode 27 is electrically separated into back electrodes 27a and 27b with the electrode separation region 43 as a boundary.

  One package substrate 2 is partitioned by a vertical cutting line 41 and a horizontal cutting line 42, and is separated into individual light emitting devices 1 along the vertical cutting line 41 and the horizontal cutting line 42. Separation can be performed by dicing or scribing. Note that the number of picks is not limited to 86. Further, the number and diameter of the through electrodes 6a and 6b may be set as appropriate depending on the number of LED elements 23, the current to be supplied, the amount of heat dissipation, and the like.

  Thus, a plurality of depressions 3 are formed in the wafer 40 (package substrate 2), and the through holes 4 are formed in each of the plurality of depressions 3. Then, the silicon rubber 9 corresponding to each of the plurality of depressions 3 is manufactured using the silicon rubber 9 integrally formed with a plurality of protrusions 9a at positions where the plurality of through holes 4 are closed. Therefore, the plurality of through-holes 4 in the plurality of depressions 3 can be closed with the silicon rubber 9 from the surface side, and many light emitting devices 1 can be easily formed. In addition, since the silicon rubber 9 has a plurality of protrusions 9a formed integrally, many through holes 4 can be closed with easy handling.

  In the above embodiment, the silicon rubber 9 is disposed from the front surface side of the package substrate 2, the through holes 4 are closed, and the conductive paste 12 is filled from the back surface side of the package substrate 2. However, the present invention is not limited to this. For example, a plastic film made of an elastic polyethylene film or the like is applied from the front surface side of the package substrate 2 by pressing and heating, and the through-hole 4 is closed, and the conductive paste 12 is filled from the back surface side of the package substrate 2. Good.

  Further, when filling the through hole 4 with the conductive paste, the through hole 4 is brought into a vacuum state, and the conductive paste is injected into the through hole 4. For example, the conductive paste is filled into the through holes 4 in a vacuum chamber. Thereby, bubbles can be prevented from occurring in the conductive paste due to breakage and the like.

  Moreover, in the said Example, although the package substrate 2 was created from the normal glass material, it is not limited to this, For example, you may create from resin, a ceramic, etc. Moreover, in the said Example, although the light-emitting device was employ | adopted as an electronic component, it is not limited to this, You may employ | adopt another electronic component.

DESCRIPTION OF SYMBOLS 1 Light emitting device 2 Package board 3 Indentation 4 Through-hole 6 Through-electrode 9 Silicon rubber 9a Protrusion part 12 Conductive paste 13 Squeegee 23 LED element 70 Board | substrate 74 Elastic member 77 Electronic element

Claims (6)

In a method for manufacturing an electronic component comprising a substrate and an electronic element mounted on the substrate,
Forming a substrate having a recess and a through-hole penetrating the bottom surface of the recess;
A step of disposing an elastic member having elasticity at a position where the through hole is closed from the hollow surface side where the hollow is formed;
Filling the through hole with a conductive paste from a plane side opposite to the hollow side;
Removing the elastic member from the hollow surface side where the hollow is formed;
Mounting the electronic element so as to be electrically connected to the conductive paste.   The method of manufacturing an electronic component according to claim 1, wherein the step of forming the substrate forms a taper in the recess.   The method of manufacturing an electronic component according to claim 1, wherein the step of forming the substrate forms a taper in the through hole.   4. The method of manufacturing an electronic component according to claim 1, wherein the step of filling the conductive paste is performed by a screen printing method.   4. The method of manufacturing an electronic component according to claim 1, wherein the step of filling the conductive paste is performed by a dispenser method. The step of forming the substrate includes forming the plurality of depressions and the plurality of through holes in the substrate,
6. The elastic member according to claim 1, wherein the plurality of elastic members corresponding to each of the plurality of depressions and disposed at positions where the plurality of through-holes are closed are integrally formed. Manufacturing method for electronic parts.

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