JP2010182913A - Substrate processing system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To increase throughput of substrate processing by efficiently carrying substrates. <P>SOLUTION: An application development processing system 1 includes a first buffer device 40 and a second buffer device 41. Each of the first and second buffer devices 40, 41 has a buffer part for vertically holding a plurality of wafers in multiple stages to temporarily store the wafers, and a buffer portion moving mechanism for vertically moving and rotating the buffer portion. A first processor group G1 and a third processor group G3 are disposed around the first buffer device 40 and a second processor group G2, a fourth processor group G4 and a fifth processor group G5 are disposed around the second buffer device 41. Each processor in the first to fifth processor groups G1-G5 includes a wafer carrying mechanism for carrying the wafer between the processor and the first buffer device 40 or the second buffer device 41. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a processing system for a substrate such as a semiconductor wafer.

  For example, in a photolithography process in a semiconductor device manufacturing process, for example, a resist coating process for applying a resist solution on a semiconductor wafer (hereinafter referred to as “wafer”) to form a resist film, and exposure for exposing a predetermined pattern on the resist film Various kinds of processing such as processing and development processing for developing the exposed resist film are performed.

  A series of these processes is usually performed using a coating and developing processing system. For example, the coating and developing processing system includes a cassette station for loading and unloading wafers in units of cassettes, a processing station in which a plurality of processing apparatuses for performing various processes are arranged, and a wafer between an adjacent exposure apparatus and processing station. It has an interface station for delivery.

  The processing station includes a transport device that transports the substrate and a processing device group that is provided around the transport device and in which a plurality of processing devices are arranged in multiple stages in the vertical direction. The transfer apparatus is provided with one wafer transfer body that holds and transfers the wafer, and the wafer transfer body is configured to be movable in the vertical direction and the horizontal direction and to be rotatable. And the wafer conveyance body can convey a wafer to each processing apparatus (patent document 1).

JP 2001-189368 A

  Incidentally, when a series of processing is performed on a wafer using this coating and developing processing system, it is required to efficiently transport the wafer to each processing apparatus in order to improve the throughput of the wafer processing.

  However, when a transfer apparatus having only one wafer transfer body is used as in the prior art, the transfer efficiency of wafers to each processing apparatus may be poor. For example, when processing of a wafer is simultaneously completed by a plurality of processing apparatuses, the processing apparatus must wait for the wafer to be carried out by the transfer apparatus. Further, for example, while the transfer device is transferring a wafer to one processing device, the other processing device must wait for the wafer to be loaded even if the other processing device is ready to process the wafer. In addition, there is a technical limit to speeding up the operation of the wafer carrier. Therefore, the throughput of wafer processing has not been improved.

  SUMMARY An advantage of some aspects of the invention is that it efficiently transports a substrate and improves the throughput of substrate processing.

  In order to achieve the above object, the present invention is a substrate processing system, a buffer unit for placing a plurality of substrates in multiple stages in the vertical direction, a buffer unit moving mechanism for moving the buffer unit in the vertical direction, And a plurality of processing devices arranged in multiple stages in the vertical direction. The processing devices are arranged in the vicinity of the buffer unit, and the processing devices It has a conveyance mechanism which conveys a board | substrate between an apparatus and the said buffer part.

  According to the present invention, since each processing apparatus has a transport mechanism for transporting a substrate, the substrate can be carried into and out of the processing apparatus at a timing required in each processing apparatus. That is, when the substrate can be processed by the processing apparatus, the substrate can be quickly carried into the apparatus by the transport mechanism of the processing apparatus. Further, when the processing of the substrate is completed in the processing apparatus, the substrate can be quickly unloaded from the apparatus by the transport mechanism of the processing apparatus. As a result, the substrate transfer waiting in the processing apparatus does not occur as in the conventional case, and the substrate transfer efficiency can be significantly improved. Therefore, the throughput of substrate processing can be improved.

  Further, since the buffer unit can be moved in the vertical direction by the buffer unit moving mechanism, the transfer mechanism of each processing apparatus can access the substrate at a predetermined position of the buffer unit. As a result, the transport mechanism can transport the predetermined substrate to the processing apparatus regardless of the position of the substrate in the buffer unit.

  The buffer unit moving mechanism may rotate the buffer unit around a central axis in the vertical direction of the buffer unit.

  The buffer unit may be provided at a plurality of locations, and a transfer device for transferring the substrate between the buffer units may be disposed between the buffer units.

  The transport device may be configured to hold a plurality of substrates.

  The substrate processing system includes: a cassette mounting unit that mounts a cassette containing a plurality of substrates when the cassette is carried in and out of the substrate processing system; and the cassette mounting unit between the cassette mounting unit and the buffer unit. You may have the other conveying apparatus which conveys a board | substrate.

  The other transfer device may be configured to hold a plurality of substrates.

  The plurality of processing apparatus groups include a liquid processing apparatus group in which liquid processing apparatuses that perform processing by supplying a predetermined liquid to a substrate are arranged in multiple stages, and a heat processing apparatus that performs heat processing on the substrate at a predetermined temperature. A heat treatment apparatus group arranged in multiple stages in the vertical direction.

  The plurality of processing apparatus groups include a processing apparatus group in which a liquid processing apparatus that supplies a predetermined liquid to a substrate and performs processing and a heat processing apparatus that performs heat processing on the substrate at a predetermined temperature are arranged in multiple stages in the vertical direction. You may have.

  In one processing apparatus group, processing apparatus layers including the liquid processing apparatus and the heat treatment apparatus may be arranged in multiple stages in the vertical direction.

  The buffer unit may include a frame for storing the substrate therein, and a plurality of holding members that are provided at predetermined intervals in the vertical direction in the frame and hold the substrate.

  The buffer unit includes a frame for storing a substrate therein, a plurality of flat members provided at predetermined intervals in the vertical direction in the frame, and a plurality of flat members that divide the inside of the frame into a plurality of members, and an upper surface of the flat member. And a holding member that holds the substrate.

  The frame may have a cylindrical shape with open side surfaces, or may have a rectangular parallelepiped shape with open side surfaces.

  The buffer unit may include a support member extending in a vertical direction and a holding member that is provided at a predetermined interval in the vertical direction in the support member and holds a substrate.

  The transfer mechanism adjusts the distance between the pair of arm portions, a transfer arm provided on the arm portions and a holding portion that holds the substrate, and the pair of arm portions, and moves the transfer arms in the horizontal direction. And an arm moving mechanism for moving the arm.

  The transfer mechanism includes a transfer arm including an arm portion having a shape that fits an outer periphery of the substrate, a holding portion that is provided in the arm portion and holds the substrate, and an arm that moves the transfer arm in a horizontal direction. And a moving mechanism.

  The arm moving mechanism may move the transfer arm in a vertical direction.

  The transport mechanism includes a transport arm that holds and transports the substrate, and the transport arm is provided in a plurality of arm portions that are flexibly connected to each other, and a holding portion that is provided in the arm portion at the tip and holds the substrate. And may have.

  The transport mechanism may include an arm moving mechanism that moves the transport arm in a vertical direction.

  The transport mechanism may include a plurality of the transport arms.

  According to the present invention, it is possible to efficiently transport a substrate and improve the throughput of substrate processing.

It is a top view which shows the outline of the internal structure of the coating and developing treatment system concerning this Embodiment. It is a side view which shows the outline of the internal structure of the coating and developing treatment system concerning this Embodiment. It is a side view which shows the outline of the internal structure of the coating and developing treatment system concerning this Embodiment. It is a side view which shows the outline of a structure of a wafer conveyance apparatus. It is a top view which shows the outline of a structure of a wafer conveyance apparatus. It is a side view which shows the outline of a structure of a 1st buffer apparatus. It is a cross-sectional view which shows the outline of a structure of a 1st buffer apparatus. It is explanatory drawing which shows arrangement | positioning of a 1st buffer apparatus, a 1st processing apparatus group, and a 3rd processing apparatus group. It is a cross-sectional view which shows the outline of a structure of a resist coating apparatus. It is a longitudinal cross-sectional view which shows the outline of a structure of a resist coating device. It is explanatory drawing which shows a mode that the wafer conveyance mechanism of a resist coating apparatus conveys a wafer. It is a cross-sectional view which shows the outline of a structure of the heat processing apparatus. It is a longitudinal cross-sectional view which shows the outline of a structure of the heat processing apparatus. It is explanatory drawing which shows arrangement | positioning of the heat processing apparatus of a 5th processing apparatus group. It is explanatory drawing which shows arrangement | positioning of the heat processing apparatus of a 5th processing apparatus group. It is the flowchart which showed each process of wafer processing. It is a side view which shows the outline of the internal structure of the coating and developing treatment system concerning other embodiment. It is a side view which shows the outline of the internal structure of the coating and developing treatment system concerning other embodiment. It is explanatory drawing which shows arrangement | positioning of the processing apparatus of the 1st processing apparatus group concerning other embodiment. It is a top view which shows the outline of the internal structure of the coating and developing treatment system concerning other embodiment. It is a side view which shows the outline of a structure of the 1st buffer apparatus concerning other embodiment. It is a cross-sectional view which shows the outline of a structure of the 1st buffer apparatus concerning other embodiment. It is a cross-sectional view which shows the outline of a structure of the 1st buffer apparatus concerning other embodiment. It is a side view which shows the outline of a structure of the 1st buffer apparatus concerning other embodiment. It is a cross-sectional view which shows the outline of a structure of the 1st buffer apparatus concerning other embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the heat processing apparatus concerning other embodiment. It is a cross-sectional view which shows the outline of a structure of the resist coating apparatus concerning other embodiment. It is a longitudinal cross-sectional view which shows the outline of a structure of the resist coating apparatus concerning other embodiment.

  Hereinafter, embodiments of the present invention will be described. FIG. 1 is a plan view showing an outline of the internal configuration of a coating and developing treatment system 1 as a substrate processing system according to the present embodiment. 2 and 3 are side views showing an outline of the internal configuration of the coating and developing treatment system 1. FIG.

  As shown in FIG. 1, the coating and developing treatment system 1 includes, for example, a cassette station 10 in which a cassette C is carried into and out of the outside, and a plurality of various processing apparatuses that perform predetermined processing in a single wafer type during photolithography processing. And an interface station 13 for transferring the wafer W between the exposure station 12 adjacent to the processing station 11 and the processing station 11 are integrally connected.

  The cassette station 10 is provided with a cassette mounting table 20 as a cassette mounting unit. A plurality of, for example, five cassette mounting plates 21 are provided on the cassette mounting table 20. The cassette mounting plates 21 are arranged in a line in the horizontal X direction (vertical direction in FIG. 1). The cassette C can be placed on these cassette placement plates 21 when the cassette is carried in and out of the coating and developing treatment system 1.

  The cassette station 10 is provided with a wafer transfer device 31 as another transfer device that can move on a transfer path 30 extending in the X direction. The wafer transfer device 31 is also movable in the vertical direction, the horizontal direction, and the vertical axis, and between the cassette C on each cassette mounting plate 21 and a first buffer device 40 of the processing station 11 described later. The wafer W can be transferred.

  In the processing station 11, for example, two buffer devices 40 and 41 for temporarily storing the wafer W are provided. The first buffer device 40 and the second buffer device 41 are arranged in order from the cassette station 10 side in the horizontal Y direction (left-right direction in FIG. 1).

  A wafer transfer device 42 as a transfer device is provided between the first buffer device 40 and the second buffer device 41. The wafer transfer device 42 is movable in the vertical direction, the horizontal direction, and the vertical axis, and can transfer the wafer W between the first buffer device 40 and the second buffer device 41.

  The processing station 11 is further provided with a plurality of, for example, five processing device groups G1 to G5 provided with various processing devices. On the front side of the processing station 11 (X direction negative direction side in FIG. 1), the first processing device group G1 and the second processing device group G2 are sequentially arranged from the cassette station 10 side. A third processing unit group G3 and a fourth processing unit group G4 are provided from the cassette station 10 side on the back side of the processing station 11 (X direction positive direction side in FIG. 1). Further, a fifth processing unit group G5 is provided on the interface station 13 side of the processing station 11 (the Y direction positive direction side in FIG. 1).

  The first processing device group G1 and the third processing device group G3 are arranged to face each other with the first buffer device 40 interposed therebetween. As will be described later, the first processing device group G1 and the third processing device group G3 allow the wafer transfer mechanisms 150 and 190 of each processing device to transfer the wafer W to and from the first buffer device 40. Has been placed. In addition, the second processing device group G2 and the fourth processing device group G4 are arranged to face each other with the second buffer device 41 interposed therebetween, and the fifth processing device group G5 is the second buffer device 41. It is arranged on the interface station 13 side. As will be described later, the second processing device group G2, the fourth processing device group G4, and the fifth processing device group G5 are configured so that the wafer transfer mechanisms 150 and 190 of each processing device are connected to the second buffer device 41. The wafers W are arranged so as to be transported.

  In the first processing unit group G1, as shown in FIG. 2, a liquid processing apparatus for supplying a predetermined liquid to the wafer W to perform processing, for example, a resist coating for applying a resist solution to the wafer W to form a resist film Lower antireflection film forming apparatuses 55 to 58 for forming an antireflection film (hereinafter referred to as “lower antireflection film”) below the resist films of the wafers 50 to 54 and the resist film of the wafer W are arranged in nine layers in order from the bottom. ing. A chemical chamber 59 for supplying various processing liquids to the liquid processing apparatuses 50 to 58 described above is provided at the lowermost stage of the first processing apparatus group G1.

  The second processing unit group G2 includes a liquid processing unit, for example, development processing units 60 to 64 for supplying a developing solution to the wafer W for development processing, an antireflection film (hereinafter referred to as “upper part” on the resist film of the wafer W) Upper anti-reflection film forming apparatuses 65 to 68 for forming an “anti-reflection film” are arranged in nine stages in order from the bottom. A chemical chamber 69 for supplying various processing liquids to the liquid processing apparatuses 60 to 68 described above is provided at the lowermost stage of the second processing apparatus group G2.

  In the third processing unit group G3, as shown in FIG. 3, adhesion devices 70 to 72 for hydrophobizing the wafer W, and heat processing units 73 to 78 for performing heat treatment of the wafer W are arranged in nine stages in order from the bottom. Has been.

  In the fourth processing apparatus group G4, heat treatment apparatuses 80 to 88 for performing heat treatment of the wafer W are arranged in nine stages in order from the bottom.

  In the fifth processing unit group G5, thermal processing apparatuses 90 to 98 for performing thermal processing of the wafer W are arranged in nine stages in order from the bottom.

  The interface station 13 is provided with a wafer transfer apparatus 100, a delivery apparatus 101, and a peripheral exposure apparatus 102 that exposes the outer periphery of the wafer W. The wafer transfer apparatus 100 has a transfer arm that can move around the vertical direction, the horizontal direction, and the vertical axis. The wafer transfer apparatus 100 supports, for example, the wafer W on the transfer arm, and the wafer W between the exposure apparatus 12 adjacent to the interface station 13, the transfer apparatus 101, the peripheral exposure apparatus 102, and the fifth processing apparatus group G5. Can be transported.

  Next, the configuration of the wafer transfer device 31 of the cassette station 10 and the wafer transfer device 42 of the processing station 10 will be described. FIG. 4 is a side view showing the outline of the configuration of the wafer transfer apparatus 31, and FIG. 5 is a plan view showing the outline of the configuration of the wafer transfer apparatus 31.

  As shown in FIG. 4, the wafer transfer device 31 has a plurality of, for example, six arm bodies 110 that hold and transfer the wafer W. As shown in FIG. 5, the arm body 110 has its distal end branched into two distal end portions 110 a and 110 a. Each tip 110a is provided with a suction pad 111 for sucking and holding the back surface of the wafer W horizontally. With such a configuration, the wafer transfer device 31 can transfer a plurality of wafers W at a time. The number of arm bodies 110 is not limited to the number of the present embodiment, and can be arbitrarily selected.

  The arm body 110 is supported by a support member 112 as shown in FIG. On the lower surface of the support member 112, for example, a drive mechanism 114 incorporating a motor (not shown) or the like is provided via a shaft 113. By this drive mechanism 114, the arm body 110 can move in the vertical direction and the horizontal direction, and can rotate. The drive mechanism 114 is attached to the transfer path 30 shown in FIG. 1, and the wafer transfer apparatus 31 is movable on the transfer path 30.

  Note that the configuration of the wafer transfer device 42 of the processing station 10 is the same as the configuration of the wafer transfer device 31 described above, and thus the description thereof is omitted. Also in such a wafer transfer device 42, the number of arm bodies 110 can be arbitrarily selected, and an arbitrary number of wafers W can be transferred.

  Next, the configuration of the first buffer device 40 and the second buffer device 41 described above will be described. FIG. 6 is a side view showing an outline of the configuration of the first buffer device 40, and FIG. 7 is a cross-sectional view showing an outline of the configuration of the first buffer device 40.

  As shown in FIG. 6, the first buffer device 40 includes a buffer unit 120 that holds and stores a plurality of wafers W in multiple stages in the vertical direction. The buffer unit 120 has a cylindrical frame 121 whose side surface is open. The frame 121 includes a disk-shaped top plate 121a, a disk-shaped bottom plate 121b, and a frame member 121c provided between the top plate 121a and the bottom plate 121b and extending in the vertical direction. For example, as shown in FIG. 7, three frame members 121c are provided at equal intervals on a concentric circle with the top plate 121a and the bottom plate 121b. Each frame member 121c is provided with a plurality of holding members 122 for holding the wafer W at predetermined intervals in the vertical direction. With such a configuration, the buffer unit 120 can carry the wafer W in and out of the opening portion on the side surface of the frame 121 and store it.

  A buffer unit moving mechanism 123 is provided below the buffer unit 120 as shown in FIG. The buffer unit moving mechanism 123 is provided with a drive mechanism 125 incorporating a motor (not shown), for example, via a shaft 124 provided on the lower surface of the bottom plate 121b. The buffer unit moving mechanism 123 allows the buffer unit 120 to move in the vertical direction and to rotate about the central axis in the vertical direction. And since the buffer unit 120 is configured to be movable in this way, as shown in FIG. 8, the wafer transfer mechanism of each processing apparatus described later in the first processing apparatus group G1 and the third processing apparatus group G3. 150 and 190 are accessible to all the wafers W in the buffer unit 120.

  Note that the wafer transfer mechanism 150, 190 of each processing apparatus moves the wafer W in the buffer unit 120 to a predetermined position by the wafer transfer unit 42 so that the wafer W in the buffer unit 120 can access the predetermined wafer W. You may let them.

  The configuration of the second buffer device 41 is the same as the configuration of the first buffer device 40 described above, and a description thereof will be omitted.

  Next, the structure of the resist coating apparatuses 50 to 54 described above will be described. FIG. 9 is a cross-sectional view showing an outline of the configuration of the resist coating apparatus 50, and FIG. 10 is a vertical cross-sectional view showing an outline of the configuration of the resist coating apparatus 50.

  As shown in FIG. 9, the resist coating apparatus 50 has a processing container 130 that can be closed. A loading / unloading port 131 for the wafer W is formed on the side surface of the processing container 130 facing the first buffer device 40.

  A spin chuck 132 for holding and rotating the wafer W is provided at the center of the processing container 130 as shown in FIG. The spin chuck 132 has a horizontal upper surface, and a suction port (not shown) for sucking, for example, the wafer W is provided on the upper surface. By suction from the suction port, the wafer W can be sucked and held on the spin chuck 132.

  The spin chuck 132 has a drive mechanism 133 with a built-in motor (not shown), for example, and can be rotated at a predetermined speed by the drive mechanism 133. Further, the drive mechanism 133 is provided with an elevating drive source such as a cylinder, and the spin chuck 132 can move up and down.

  Around the spin chuck 132, there is provided a cup 134 that receives and collects the liquid scattered or dropped from the wafer W. A lower surface of the cup 132 is connected to a discharge pipe 135 that discharges the collected liquid and an exhaust pipe 136 that exhausts the atmosphere in the cup 132.

  As shown in FIG. 9, a rail 140 extending along the Y direction (left and right direction in FIG. 9) is formed on the X direction negative direction (downward direction in FIG. 9) side of the cup 134. The rail 140 is formed, for example, from the outside of the cup 134 in the Y direction negative direction (left direction in FIG. 9) to the outside in the Y direction positive direction (right direction in FIG. 9). An arm 141 is attached to the rail 140.

  A coating nozzle 142 that discharges a resist solution is supported on the arm 141. The arm 141 is movable on the rail 140 by the nozzle driving unit 143. The arm 141 can be moved up and down by a nozzle driving unit 143, and the height of the application nozzle 142 can be adjusted.

  A wafer transfer mechanism 150 is provided above the spin chuck 132 in the processing container 130 as shown in FIG. The wafer transfer mechanism 150 has a transfer arm 151 that holds and transfers the wafer W. As shown in FIG. 9, the transfer arm 151 supports a pair of arm portions 152, 152 extending in the transfer direction D (X direction in FIG. 9) of the wafer W and each arm portion 152. And a support portion 153 extending in the direction perpendicular to D (the Y direction in FIG. 9). On the upper surface of each arm portion 152, a suction pad 154 is provided as a holding portion that sucks and horizontally holds the back surface of the wafer W.

  As shown in FIG. 10, the transfer arm 151 is provided with an arm moving mechanism 155 incorporating a motor (not shown), for example. The arm moving mechanism 155 can adjust the distance between the pair of arm portions 152 and 152 by moving the support portion 153 in a direction perpendicular to the transfer direction D of the wafer W. The arm moving mechanism 155 can also move the transfer arm 151 in the vertical direction. As the transfer arm 151 moves up and down in this way, the transfer arm 151 can deliver the wafer W to the spin chuck 132 and receive the wafer W from the spin chuck 132.

  A pair of rails 156 and 156 extending in the transfer direction D of the wafer W are provided on the inner surface of the processing container 130 as shown in FIG. As shown in FIG. 10, the arm moving mechanism 155 is attached to the rail 156 and can move along the rail 156. The arm moving mechanism 155 allows the transfer arm 151 to transfer the wafer W between the first buffer device 40 and the resist coating device 50 while holding the wafer W as shown in FIG. .

  In addition, about the structure of the resist coating apparatuses 51-54, since it is the same as that of the resist coating apparatus 50 mentioned above, description is abbreviate | omitted.

  Also, the lower antireflection film forming apparatuses 55 to 58, the developing processing apparatuses 60 to 64, and the upper antireflection film forming apparatuses 65 to 68 have the same configuration as the resist coating apparatuses 50 to 54 described above, and the wafer transfer mechanism 150. It has. Further, the adhesion devices 70 to 72 are also provided with a wafer transfer mechanism 150.

  Next, the structure of the heat processing apparatus 73-78, 80-88, 90-98 mentioned above is demonstrated. FIG. 12 is a cross-sectional view schematically showing the configuration of the heat treatment apparatus 73, and FIG. 13 is a vertical cross-sectional view showing the outline of the configuration of the heat treatment apparatus 73.

  As shown in FIG. 12, the heat treatment apparatus 73 has a processing container 160 whose inside can be closed. A loading / unloading port 161 for the wafer W is formed on the side surface of the processing container 130 facing the first buffer device 40. As shown in FIG. 13, the heat treatment apparatus 73 includes a heating unit 162 that heat-processes the wafer W and a cooling unit 163 that cools the wafer W in the processing container 160.

  The heating unit 162 is provided with a hot plate 170 for placing and heating the wafer W. The hot plate 170 has a substantially disk shape with a large thickness. The heat plate 170 has a horizontal upper surface, and a suction port (not shown) for sucking the wafer W, for example, is provided on the upper surface. By suction from the suction port, the wafer W can be sucked and held on the hot plate 170.

  Inside the hot plate 170, a heater 171 that generates heat by power feeding is attached. The heat plate 170 can be adjusted to a predetermined set temperature by the heat generated by the heater 171.

  A plurality of through holes 172 penetrating in the vertical direction are formed in the hot plate 170. A lift pin 173 is provided in the through hole 172. The lift pins 173 can be moved up and down by a lift drive mechanism 174 such as a cylinder. The elevating pins 173 are inserted through the through holes 172 and protrude from the upper surface of the hot plate 170 so that the elevating pins 173 can move up and down while supporting the wafer W.

  The heating plate 170 is provided with an annular holding member 175 that holds the outer peripheral portion of the heating plate 170. The holding member 175 is provided with a cylindrical support ring 176 that surrounds the outer periphery of the holding member 175 and accommodates the lifting pins 173.

  The cooling unit 163 adjacent to the heating unit 162 is provided with a cooling plate 180 for mounting and cooling the wafer W. The cooling plate 180 has a thick substantially disk shape. The cooling plate 180 has a horizontal upper surface, and a suction port (not shown) for sucking the wafer W, for example, is provided on the upper surface. The wafer W can be sucked and held on the cooling plate 180 by suction from the suction port.

  A cooling member (not shown) such as a Peltier element is built in the cooling plate 180, and the cooling plate 180 can be adjusted to a predetermined set temperature.

  Other configurations of the cooling unit 163 have the same configuration as the heating unit 162. That is, the cooling plate 180 is formed with a plurality of through holes 181 penetrating in the vertical direction. A lift pin 182 is provided in the through hole 181. The lift pins 182 can be moved up and down by a lift drive mechanism 183 such as a cylinder. The elevating pins 182 are inserted through the through holes 181 and protrude from the upper surface of the cooling plate 180, and can move up and down while supporting the wafer W.

  The cooling plate 180 is provided with an annular holding member 184 that holds the outer periphery of the cooling plate 180. The holding member 184 is provided with a cylindrical support ring 185 that surrounds the outer periphery of the holding member 184 and accommodates the lifting pins 182.

  A wafer transfer mechanism 190 is provided above the hot plate 170 and the cooling plate 180. The wafer transfer mechanism 190 has a transfer arm 191 that holds and transfers the outer periphery of the wafer W as shown in FIG. The transfer arm 191 has a shape that fits the outer periphery of the wafer W, for example, an arm portion 192 that is formed in an approximately 3/4 annular shape, and a support that is formed integrally with the arm portion 192 and supports the arm portion 192. Part 193. In the arm part 192, for example, three holding parts 194 that directly support the outer peripheral part of the wafer W are provided. The holding portions 194 are provided at equal intervals on the inner circumference of the arm portion 192, and project inside the arm portion 192.

  As shown in FIG. 13, the transfer arm 191 is provided with an arm moving mechanism 195 containing a motor (not shown), for example. The arm moving mechanism 195 supports the transfer arm 191 and supports the vertical moving unit 196 extending in the vertical direction and the vertical moving unit 196 in the direction perpendicular to the transfer direction D of the wafer W (Y direction in FIG. 12). And a horizontally moving portion 197 that extends. The vertical movement unit 196 allows the transfer arm 191 to move in the vertical direction. As the transfer arm 191 moves up and down in this way, the transfer arm 191 can deliver the wafer W to the lift pins 173 and 182 and receive the wafer W from the lift pins 173 and 182.

  As shown in FIG. 12, a pair of rails 198 and 198 extending in the transfer direction D (X direction in FIG. 12) of the wafer W are provided on the inner surface of the processing container 160. The horizontal moving unit 197 of the arm moving mechanism 195 is attached to the rail 198 and can move along the rail 198. By this arm moving mechanism 195, the transfer arm 191 can transfer the wafer W between the heating unit 162 and the cooling unit 163. In addition, the transfer arm 191 can transfer the wafer W between the first buffer device 40 and the heat treatment device 73 while holding the wafer W.

  In addition, about the structure of the heat processing apparatuses 74-78 and 80-88, since it is the same as that of the heat processing apparatus 73 mentioned above, description is abbreviate | omitted.

  In addition to the configuration of the heat treatment apparatus 73 described above, the heat treatment apparatuses 90 to 98 have a wafer W loading / unloading port 199 formed on the side surface facing the loading / unloading hole 161 of the processing container 160 as shown in FIGS. 14 and 15. Has been.

  For example, the heat treatment apparatus 90 performs a heat treatment on the wafer W transferred from the second buffer apparatus 41 side to the wafer transfer apparatus 100 side as shown in FIG. In such a case, the heating unit 162 of the heat treatment apparatus 90 is disposed on the wafer transfer apparatus 100 side, and the cooling unit 163 is disposed on the second buffer apparatus 41 side. The heat treatment apparatuses 91 to 94 are also arranged in the same manner as the heat treatment apparatus 90.

  Further, for example, the heat treatment apparatus 95 performs a heat treatment on the wafer W transferred from the wafer transfer apparatus 100 side to the second buffer apparatus 41 side as shown in FIG. In such a case, the heating unit 162 of the heat treatment apparatus 95 is disposed on the second buffer apparatus 41 side, and the cooling unit 163 is disposed on the wafer transfer apparatus 100 side. The heat treatment apparatuses 96 to 98 are also arranged in the same manner as the heat treatment apparatus 95.

  Therefore, in the heat treatment apparatuses 90 to 98, the temperature of the wafer W transferred into the processing container 160 is first adjusted in the cooling unit 163 and then heated in the heating unit 162.

  The coating and developing treatment system 1 according to the present embodiment is configured as described above. Next, processing of the wafer W performed in the coating processing system 1 will be described. FIG. 16 is a flowchart showing the main steps of such wafer processing.

  First, a cassette C containing a plurality of wafers W in one lot is placed on a predetermined cassette placement plate 21 of the cassette station 10. Thereafter, the wafer W in the cassette C is taken out by the wafer transfer device 31 and transferred to the first buffer device 40 of the processing station 11. Then, the plurality of wafers W are temporarily stored in the first buffer device 40.

  Next, the wafer W stored in the first buffer device 40 is transferred to the heat treatment device 78 by the wafer transfer mechanism 190 of the heat treatment device 78, and the temperature is adjusted (step S1 in FIG. 16). After the temperature adjustment, the wafer W is returned to the first buffer device 40 by the wafer transfer mechanism 190.

  Thereafter, the wafer W is transferred to the lower antireflection film forming apparatus 58 by the wafer transfer mechanism 150 of the lower antireflection film forming apparatus 58, and a lower antireflection film is formed on the wafer W (step S2 in FIG. 16). . After forming the lower antireflection film, the wafer W is returned to the first buffer device 40 by the wafer transfer mechanism 150.

  Thereafter, the wafer W is transferred to the heat treatment apparatus 77 by the wafer transfer mechanism 190 of the heat treatment apparatus 77, and the temperature is adjusted. After the temperature adjustment, the wafer W is returned to the first buffer device 40 by the wafer transfer mechanism 190.

  Thereafter, the wafer W is transferred to the adhesion device 72 by the wafer transfer mechanism 150 of the adhesion device 72 and subjected to a hydrophobic treatment (step S3 in FIG. 16). After the hydrophobic treatment, the wafer W is returned to the first buffer device 40 by the wafer transfer mechanism 150.

  Thereafter, the wafer W is transported to the resist coating apparatus 54 by the wafer transport mechanism 150 of the resist coating apparatus 54, and a resist film is formed on the wafer W (step S4 in FIG. 16). After forming the resist film, the wafer W is returned to the first buffer device 40 by the wafer transfer mechanism 150.

  Thereafter, the wafer W is transferred to the heat treatment apparatus 76 by the transfer mechanism 190 of the heat treatment apparatus 76, and is pre-baked (step S5 in FIG. 16). After the pre-baking process, the wafer W is returned to the first buffer device 40 by the wafer transfer mechanism 190.

  Next, the wafer W is transferred from the first buffer device 40 to the second buffer device 41 by the wafer transfer device 42 and temporarily stored in the second buffer device 41.

  Thereafter, the wafer W stored in the second buffer device 41 is transferred to the upper antireflection film forming device 68 by the wafer transfer mechanism 150 of the upper antireflection film forming device 68, and the upper antireflection film is formed on the wafer W. It is formed (step S6 in FIG. 16). After the upper antireflection film, the wafer W is returned to the second buffer device 41 by the wafer transfer mechanism 150.

  Thereafter, the wafer W is transferred to the heat treatment apparatus 90 by the wafer transfer mechanism 190 of the heat treatment apparatus 90, and the temperature is adjusted. After the temperature adjustment, the wafer is transferred from the heat treatment apparatus 90 to the peripheral exposure apparatus 102 by the wafer transfer apparatus 100 and subjected to peripheral exposure processing (step S7 in FIG. 16).

  Thereafter, the wafer W is transferred to the exposure apparatus 12 by the wafer transfer apparatus 100 and subjected to an exposure process (step S8 in FIG. 16).

  Thereafter, the wafer W is transferred from the exposure apparatus 12 to the heat treatment apparatus 95 by the wafer transfer apparatus 100 and subjected to post-exposure baking (step S9 in FIG. 16). The post-exposure bake process and the wafer W are transferred to the second buffer device 41 by the wafer transfer mechanism 190 of the heat treatment apparatus 95.

  Thereafter, the wafer W is transferred to the development processing device 64 by the wafer transfer mechanism 150 of the development processing device 64 and developed (step S10 in FIG. 16). After the development processing, the wafer W is returned to the second buffer device 41 by the wafer transfer mechanism 150.

  Thereafter, the wafer W is transferred to the heat treatment apparatus 84 by the transfer mechanism 190 of the heat treatment apparatus 84 and subjected to post-bake processing (step S11 in FIG. 16). After the post-baking process, the wafer W is returned to the second buffer device 41 by the wafer transfer mechanism 190.

  Next, the wafer W is transferred from the second buffer device 41 to the first buffer device 40 by the wafer transfer device 42. Thereafter, the wafer W is transferred to the cassette C of the predetermined cassette mounting plate 21 by the wafer transfer device 31. Thus, a series of photolithography steps is completed.

  According to the above embodiment, since each processing apparatus of the first to fifth processing apparatus groups G1 to G5 has the transport mechanisms 150 and 190 for transporting the wafer W, it is required in each processing apparatus. At the timing, the wafer W can be carried in and out of the processing apparatus. That is, when the wafer W can be processed by the processing apparatus, the wafer W can be quickly loaded into the apparatus by the transfer mechanisms 150 and 190 of the processing apparatus. Further, when the processing of the wafer W is completed in the processing apparatus, the wafer W can be quickly unloaded from the apparatus by the transfer mechanisms 150 and 190 of the processing apparatus. As a result, the wafer transfer waiting in the processing apparatus does not occur as in the conventional case, and the transfer efficiency of the wafer W can be remarkably improved. Therefore, the throughput of wafer processing can be improved.

  Further, since the buffer units 120 of the first buffer device 40 and the second buffer device 41 can be moved in the vertical direction by the buffer unit moving mechanism 123, the transport mechanisms 150 and 190 of each processing device are arranged at predetermined positions of the buffer unit 120. The wafer W can be accessed. Accordingly, the transfer mechanisms 150 and 190 can transfer a predetermined wafer W to the processing apparatus regardless of the position in the buffer unit 120 where the wafer W is stored.

  Further, since the buffer unit 120 can be rotated by the buffer unit moving mechanism 123, when the transfer mechanisms 150 and 190 and the wafer transfer devices 31 and 42 of each processing apparatus access the buffer unit 120, the frame member of the buffer unit 120 is used. The wafer W can be smoothly transferred while avoiding interference with the 121c.

  The wafer transfer devices 31 and 42 can hold a plurality of wafers W and can transfer a plurality of wafers W at a time. Thereby, the transfer efficiency of the wafer W can be further improved, and the throughput of the wafer processing can be further improved.

  In the above embodiment, the first processing device group G1 and the second processing device group G2 are provided with liquid processing devices, and the third processing device group G3 to the fifth processing device group G5 have heat treatment devices. However, the arrangement of the processing devices can be arbitrarily selected.

  For example, as shown in FIGS. 17 and 18, a liquid processing apparatus and a heat treatment apparatus may be mixed and disposed in one processing apparatus group. In this case, for example, in the first processing apparatus group G1, resist coating apparatuses 50 to 53, lower antireflection film forming apparatuses 55 to 57, and heat treatment apparatuses 73 and 74 are arranged in nine stages in order from the bottom. In the second processing device group G2, development processing devices 60 to 62, upper antireflection film forming devices 65 and 66, and heat treatment devices 80 to 83 are arranged in nine layers in order from the bottom. In the third processing device group G3, adhesion devices 70 to 72, a resist coating device 54, a lower antireflection film forming device 58, and heat treatment devices 75 to 78 are arranged in nine stages in order from the bottom. In the fourth processing unit group G4, development processing units 63 and 64, upper antireflection film forming units 67 and 68, and heat treatment units 84 to 88 are arranged in nine stages in order from the bottom. In addition, chemical chambers 79 and 89 for supplying various processing liquids to the respective liquid processing apparatuses are provided at the lowermost stage of the third processing apparatus group G3 and the fourth processing apparatus group G4.

  Moreover, the processing apparatus layer provided with the liquid processing apparatus and the heat processing apparatus may be arrange | positioned at one stage at multiple stages in one processing apparatus group. For example, as shown in FIG. 19, in the first processing unit group G1, processing unit layers L1 to L3 are arranged in three stages in order from the top. In the processing apparatus layer L1, a heat treatment apparatus 73, a lower antireflection film forming apparatus 55, and a resist coating apparatus 50 are sequentially arranged from the top. In the processing apparatus layer L2, a heat treatment apparatus 74, a lower antireflection film forming apparatus 56, and a resist coating apparatus 51 are sequentially arranged from the top. In the processing apparatus layer L3, a heat treatment apparatus 75, a lower antireflection film forming apparatus 57, and a resist coating apparatus 52 are sequentially arranged from the top. In such a case, the process of forming the lower antireflection film and the resist film on the wafer W is performed by moving the buffer unit 120 of the first buffer device 40 in the vertical direction by the height of the processing device layers L1 to L3. It can be carried out. Thereby, since the vertical movement distance of the buffer unit 120 can be shortened, the transfer efficiency of the wafer W can be further improved, and the throughput of the wafer processing can be further improved. Similarly, for the other processing apparatus groups G2 to G5, processing apparatus layers including liquid processing apparatuses and heat treatment apparatuses may be arranged in multiple stages in the vertical direction.

  In the above embodiment, the two buffer devices 40 and 41 are arranged in the processing station 11, but the number of processing devices can be arbitrarily selected.

  For example, one buffer device 200 may be arranged in the processing station 11 as shown in FIG. Around the buffer device 200, the first to fifth processing device groups G <b> 1 to G <b> 5 and the wafer transfer device 31 are arranged at equal intervals on the circumference centering on the buffer device 200. Further, between the first to fifth processing apparatus groups G1 to G5, chemical chambers 201 to 204 for supplying various processing liquids to the respective liquid processing apparatuses may be arranged, respectively. The configuration of the buffer device 200 is the same as the configuration of the first buffer device 40 described above, and a description thereof will be omitted. In such a case, the transfer time of the wafer W can be shortened, and the wafer processing throughput can be further improved. In addition, the area occupied by the entire coating and developing treatment system 1 can be reduced.

  Further, for example, three or more buffer devices may be arranged in the processing station 11. Thus, a larger number of wafers W can be processed in the coating and developing processing system 1.

  The first buffer device 40 of the above embodiment may include a buffer unit 210 having another configuration as shown in FIGS. 21 and 22. The buffer unit 210 includes a frame 211 having a cylindrical shape with an open side surface. The frame 211 includes a disk-shaped top plate 211a, a disk-shaped bottom plate 211b, and a frame member 211c provided between the top plate 211a and the bottom plate 211b and extending in the vertical direction. ing. For example, three frame members 211c are provided at equal intervals on a concentric circle with the top plate 211a and the bottom plate 211b. The frame member 211c is provided with a plurality of flat plate-like members 212 that divide the inside of the frame 211 into a plurality at predetermined intervals in the vertical direction. For example, three holding pins 213 as holding members for holding the wafer W are provided at the center of the upper surface of the flat plate member 212. With such a configuration, the buffer unit 210 can carry the wafer W in and out of the opening portion on the side surface of the frame 211 and store it. Note that the buffer unit moving mechanism 123 described above is provided below the buffer unit 210.

  In such a case, the buffer unit 210 can hold and store a plurality of wafers W in multiple stages in the vertical direction. Further, the buffer unit 220 is movable in the vertical direction and can rotate around the central axis in the vertical direction.

  Note that the second buffer device 41 and the buffer device 200 may also include the buffer unit 210 described above.

  The frame 121 of the buffer unit 120 of the above embodiment may have a rectangular parallelepiped shape whose side surface is open as shown in FIG. In such a case, the top plate 121a and the bottom plate 121b are formed in a square shape, and the frame member 121c is provided at, for example, the four corners of the top plate 121a and the bottom plate 121b. Each frame member 121c is provided with a plurality of holding members 122 for holding the wafer W at predetermined intervals. With such a configuration, the buffer unit 120 can carry the wafer W in and out of the opening portion on the side surface of the frame 121 and store it. Similarly, the buffer unit 210 may have a rectangular parallelepiped frame 211.

  In addition, the first buffer device 40 of the above embodiment may include a buffer unit 220 having another configuration as shown in FIGS. The buffer unit 220 includes a support member 221 that extends in the vertical direction. The support member 221 is supported by a disk-shaped bottom plate 222, for example. The support member 221 is provided with a plurality of support plates 224 at predetermined intervals in the vertical direction via the member 223. At the center of the upper surface of each support plate 224, for example, three holding pins 225 as holding members for holding the wafer W are provided. Note that the buffer unit moving mechanism 123 described above is provided below the buffer unit 220.

  In such a case, the buffer unit 220 can hold and store a plurality of wafers W in multiple stages in the vertical direction. Further, the buffer unit 220 is movable in the vertical direction and can rotate around the central axis in the vertical direction.

  Note that the second buffer device 41 and the buffer device 200 may also include the buffer unit 220 described above.

  The heat treatment apparatus 73 of the above embodiment has one wafer transfer mechanism 190, but may have a plurality of wafer transfer mechanisms 190. For example, as shown in FIG. 26, two wafer transfer mechanisms 190, 190 are provided side by side in the vertical direction. In this case, for example, after the heat treatment is performed on the wafer W transferred by one transfer mechanism 190, the heat treatment can be performed on the wafer W transferred by another transfer mechanism 190 immediately. Therefore, the throughput of wafer processing can be further improved.

  Similarly, the resist coating apparatus 50 may have a plurality of wafer conveyance mechanisms 150.

  The resist coating apparatus 50 of the above embodiment may have a wafer conveyance mechanism 230 having another configuration as shown in FIGS. The wafer transfer mechanism 230 has, for example, two articulated transfer arms 231 that hold and transfer the wafer W. Each transfer arm 231 has a plurality of, for example, four arm portions 232. The four arm portions 232 are connected to the other arm portion 232 so that the one arm portion 232 can be bent. Power is transmitted between the arm portions 232, and the transfer arm 231 can bend and stretch and turn. The front arm portion 232a is provided with a suction pad 233 as a holding portion for sucking and holding the back surface of the wafer W horizontally.

  An arm moving mechanism 234 is provided on the lower surface of the base arm portion 232b. The arm moving mechanism 234 includes a shaft 235 that supports the arm portion 232b, and a drive mechanism 236 that is provided below the shaft 235 and incorporates, for example, a motor (not shown). By this arm moving mechanism 234, the transfer arm 231 can move in the vertical direction. The transfer arm 231 can transfer the wafer W between the first buffer device 40 and the resist coating device 50 while holding the wafer W.

  The number of transfer arms 231 is not limited to the present embodiment, and can be arbitrarily selected.

  In the above embodiment, the wafer transfer mechanisms 150 and 230 are provided in the liquid processing apparatus such as the resist coating apparatus 50, and the wafer transfer mechanism 190 is provided in the heat treatment apparatus such as the heat treatment apparatus 73. The mechanism 190 may be provided, and the wafer transfer mechanisms 150 and 230 may be provided in the heat treatment apparatus.

  In the above embodiment, only the heat treatment apparatuses 90 to 98 for performing the heat treatment of the wafer W are arranged in the fifth processing apparatus group G5. However, between the second buffer apparatus 41 and the wafer transfer apparatus 100, A delivery device for delivering the wafer W may be provided. In such a case, for example, the heat treatment apparatus 90 is provided in the interface station 13. Then, after the upper antireflection film is formed on the wafer W, the wafer W is transferred to the heat treatment apparatus 90 of the interface station 13 via the delivery apparatus, and the temperature of the wafer W before the peripheral exposure process is adjusted.

  Further, the peripheral exposure apparatus 102 provided in the interface station 13 may be provided in the fifth processing apparatus group G5.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood. The present invention is not limited to this example and can take various forms. The present invention can also be applied to a case where the substrate is another substrate such as an FPD (flat panel display) other than a wafer or a mask reticle for a photomask.

  The present invention is useful for a processing system for a substrate such as a semiconductor wafer.

DESCRIPTION OF SYMBOLS 1 Coating / development processing system 10 Cassette station 11 Processing station 13 Interface station 20 Cassette mounting table 31 Wafer transfer apparatus 40 1st buffer apparatus 41 2nd buffer apparatus 42 Wafer transfer apparatus 50-54 Resist coating apparatus 55-58 Lower reflection prevention Film forming device 60 to 64 Development processing device 65 to 68 Upper antireflection film forming device 70 to 72 Adhesion device 73 to 78, 80 to 88, 90 to 98 Heat treatment device 120 Buffer unit 121 Frame 122 Holding member 123 Buffer unit moving mechanism 150 Wafer transfer mechanism 151 Transfer arm 152 Arm unit 154 Suction pad 155 Arm moving mechanism 190 Wafer transfer mechanism 191 Transfer arm 192 Arm unit 194 Holding unit 195 Arm moving mechanism C Cassette 1~G5 first to fifth processing unit group W wafer

Claims (20)

A substrate processing system,
A buffer unit for placing a plurality of substrates in multiple stages in the vertical direction;
A buffer unit moving mechanism for moving the buffer unit in the vertical direction;
A processing apparatus group in which processing apparatuses for performing predetermined processing on the substrate are arranged in multiple stages in the vertical direction;
A plurality of the processing device groups are arranged in the vicinity of the buffer unit,
The said processing apparatus has a conveyance mechanism which conveys a board | substrate between the said processing apparatus and the said buffer part, The substrate processing system characterized by the above-mentioned. The substrate processing system according to claim 1, wherein the buffer unit moving mechanism rotates the buffer unit around a central axis in a vertical direction of the buffer unit. The buffer unit is provided at a plurality of locations,
The substrate processing system according to claim 1, wherein a transfer device that transfers a substrate between the buffer units is disposed between the buffer units. The substrate processing system according to claim 3, wherein the transfer device is capable of holding a plurality of substrates. A cassette placement unit for placing a cassette containing a plurality of substrates when carrying it in and out of the substrate processing system;
The substrate processing system according to claim 1, further comprising: another transport device that transports the substrate between the cassette placing unit and the buffer unit. The substrate processing system according to claim 5, wherein the other transfer device is capable of holding a plurality of substrates. The plurality of processing apparatus groups include a liquid processing apparatus group in which liquid processing apparatuses that perform processing by supplying a predetermined liquid to a substrate are arranged in multiple stages, and a heat processing apparatus that performs heat processing on the substrate at a predetermined temperature. The substrate processing system according to claim 1, comprising a group of heat treatment apparatuses arranged in multiple stages in the vertical direction. The plurality of processing apparatus groups include a processing apparatus group in which a liquid processing apparatus that supplies a predetermined liquid to a substrate and performs processing and a heat processing apparatus that performs heat processing on the substrate at a predetermined temperature are arranged in multiple stages in the vertical direction. The substrate processing system according to claim 1, wherein the substrate processing system is provided. 9. The substrate processing system according to claim 8, wherein a processing apparatus layer including the liquid processing apparatus and the heat treatment apparatus is arranged in a plurality of stages in the vertical direction in one of the processing apparatus groups. The said buffer part has a frame which stores a board | substrate inside, and the holding member which is provided with two or more by the predetermined | prescribed space | interval in the perpendicular direction in the said frame, and hold | maintains a board | substrate. The substrate processing system according to any one of the above. The buffer unit includes a frame for storing a substrate therein, a plurality of flat members provided at predetermined intervals in the vertical direction in the frame, and a plurality of flat members that divide the inside of the frame into a plurality of members, and an upper surface of the flat member. The substrate processing system according to claim 1, further comprising a holding member that holds the substrate. The substrate processing system according to claim 10, wherein the frame has a cylindrical shape with an open side surface. The substrate processing system according to claim 10, wherein the frame has a rectangular parallelepiped shape with open side surfaces. The said buffer part has the supporting member extended in a perpendicular direction, and the holding member which is provided in the said supporting member at the predetermined | prescribed space | interval in the perpendicular direction, and hold | maintains a board | substrate. The substrate processing system according to any one of the above. The transfer mechanism adjusts the distance between the pair of arm portions, a transfer arm provided on the arm portions and a holding portion that holds the substrate, and the pair of arm portions, and moves the transfer arms in the horizontal direction. The substrate processing system according to claim 1, further comprising: an arm moving mechanism that moves the arm to the substrate. The transfer mechanism includes a transfer arm including an arm portion having a shape that fits an outer periphery of the substrate, a holding portion that is provided in the arm portion and holds the substrate, and an arm that moves the transfer arm in a horizontal direction. The substrate processing system according to claim 1, further comprising a moving mechanism. The substrate processing system according to claim 15, wherein the arm moving mechanism moves the transfer arm in a vertical direction. The transport mechanism includes a transport arm that holds and transports the substrate, and the transport arm is provided in a plurality of arm portions that are flexibly connected to each other, and a holding portion that is provided in the arm portion at the tip and holds the substrate. The substrate processing system according to claim 1, comprising: The substrate processing system according to claim 18, wherein the transport mechanism includes an arm moving mechanism that moves the transport arm in a vertical direction. The substrate processing system according to claim 15, wherein the transport mechanism includes a plurality of the transport arms.

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