JP2010177409A - Wiring board with lead - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring board with leads, which has a plurality of leads extended from four sides thereof and has connecting members joined between tie bars of four sides linking front end sides of the leads, and allows junction between the tie bars and the connecting members to be firmly maintained even during transportation on a tray, or the like. <P>SOLUTION: A wiring board 1a with leads includes: a wiring board 2 which is made of ceramics (insulating material) and has a front surface 3 and a rear surface 4 which are rectangular in plan view, and side surfaces 5 of four sides located between them; a plurality of leads 14 each of which has one end bonded to each side surface 5 and has the other end linked to one of four tie bars 16 parallel to one set of the side surfaces 5; four connecting members 20 joined between tie bars 16 and 16. The connecting members 20 are located nearer to the wiring board 2 than extensions Y1 and Y2 of outer sides 18 of two adjacent tie bars 16 and nearer to the wiring board 2 than an intersection Z between the pair of extensions Y1 and Y2. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  In the present invention, a plurality of leads extend from the side surfaces of the four sides of the wiring board having a rectangular plan view, and a connecting material is joined between the four tie bars connecting the leading end sides of the leads. The present invention relates to a wiring board.

For example, the four sides of a plurality of leads (lead group) are joined to the four side surfaces of an insulating substrate made of ceramic and rectangular in plan view by soldering or the like, and the other ends of the plurality of leads are connected. A connecting member having two outer sides that are aligned with the outer sides of each pair of adjacent lead frames is joined by spot welding or the like between the lead frames (tie bars). An integrated circuit package having a square shape has been proposed (see, for example, Patent Document 1).
According to the integrated circuit package, the lead group having one end bonded to each of the four side surfaces of the insulating substrate is connected to one of the four side lead frames. Therefore, even if an external force is applied to a part of the lead group, it is also distributed to other lead groups to which the external force is not directly applied, and there is an advantage that deformation of the lead can be suppressed.

JP-A-4-352351 (Pages 1-5, FIGS. 1-4)

Furthermore, according to the integrated circuit package of Patent Document 1, the lead frames on the four sides are also electrically connected by the connecting member, and the lead group for each of the four sides on the side surface of the insulating substrate is set to the same potential. When an IC chip is mounted on an insulating substrate, it is possible to maintain good floating capacitance without grounding.
However, in the integrated circuit package disclosed in Patent Document 1, a connecting member having an outer side aligned with the four side lead frames is joined to each corner by spot welding or the like. Therefore, when the package is put in the tray and conveyed, the inner wall surface of the tray and the outer side of the connecting member for each corner may contact or collide. Since the impact generated at this time tends to concentrate on the welded portion of each connecting member, the welded portion is damaged, and any of the lead frames and the connecting member may be detached.

  The present invention solves the problems described in the background art, and a plurality of leads extend from the side surfaces of the four sides of the wiring board that is rectangular in plan view, and between the four tie bars connecting the leading end sides of the leads. It is an object of the present invention to provide a leaded wiring board that is formed by bonding a connecting material to each other, and that can firmly maintain the bonding between the tie bar and the connecting member at the time of conveyance by a tray.

Means for Solving the Problems and Effects of the Invention

In order to solve the above-mentioned problem, the present invention is conceived to join the connecting member at a position closer to the wiring board (inner side) than the extended line of the outer side of each of two adjacent tie bars orthogonal to each other. It was made.
That is, the leaded wiring board of the present invention (Claim 1) is made of an insulating material, and has a rectangular front surface, a back surface, and a four-sided side surface located between them, and the wiring board. A plurality of leads each having one end bonded to each side surface or the front or back surface adjacent to each side surface and the other end connected to one of four tie bars parallel to each side surface of the wiring board; 4 connecting members joined between the tie bars, wherein the connecting member is connected to the wiring board more than the extension lines on the outer sides of the two adjacent tie bars. The wiring board is located on the side of the wiring board from the intersection of the pair of extension lines.

  According to this, four connecting members are provided for each of the four side (four) tie bars (intervals) connected to the other end side of the plurality of leads extending outward from the side surfaces of the four sides of the wiring board. Are located on the wiring board side (inside) from the extension line of the outer side of two adjacent tie bars, and are individually connected to the wiring board side (inside) from the intersection of the two extension lines. . Therefore, even if the leaded wiring board is placed in the tray and transported, the inner wall surface of the tray and the outer side of the connecting member for each corner are less likely to come into contact. No longer acts on the outer edge of the. Therefore, it is possible to stably provide a wiring substrate with leads in which four tie bars surrounding the wiring substrate and four connecting members bonded to both ends thereof are firmly bonded.

The insulating material includes a ceramic and a resin. The ceramic includes a high-temperature fired ceramic such as alumina, or a low-temperature fired ceramic such as glass-ceramic. Examples of the resin include an epoxy resin. included.
Moreover, the rectangle regarding the said wiring board contains a square and a rectangle.
Furthermore, the wiring board has a configuration in which a wiring layer or the like that can be electrically connected to the lead is built in the substrate body made of the insulating material, or an electronic component such as an IC chip is mounted on at least one of the front and back surfaces. Includes a form having a cavity.
The plurality of leads are formed of a thin metal plate that is press-molded integrally with a tie bar that is connected to the other end side and has a substantially rectangular shape in plan view. The plurality of leads are parallel to each other and perpendicular to the side surface of the wiring board and the longitudinal direction of the tie bar, and near the center of each side surface of the wiring board, are orthogonal to the longitudinal direction of the side surface and the tie bar. There is also a form in which the other end sides near the tie bars are separated from each other as they are located on both end sides. Incidentally, the metal thin plate is made of 42 alloy (Fe-42 wt% Ni), Kovar (Fe-29 wt% Ni-17 wt% Co), or the like.
Further, the connecting member is formed by press-molding a thin metal plate having the same thermal expansion coefficient as that of the thin metal plate constituting the lead and the tie bar.
In addition, the joining includes spot welding, laser welding, or soldering (brazing).

The present invention also includes a leaded wiring board (Claim 2) in which the width of the connecting member is smaller than the width of two adjacent tie bars.
According to this, the planar view is substantially rectangular, and between two adjacent tie bars, the width is smaller than the width of these tie bars, and the extension line of the outer side of each tie bar and the wiring board side from these intersections The connecting member is joined so as to be located at the position. Therefore, the inner wall surface of the tray and the outer side of the connecting member for each corner are not easily in contact with each other. Therefore, the four tie bars surrounding the wiring board and the four connecting members joined to each of both ends are provided. Is a wiring substrate with leads firmly bonded.
In addition, the width | variety of a tie bar and a connection member points out the dimension along the direction orthogonal to the side surface of the said wiring board. Moreover, the width | variety of the said tie bar points out the width | variety of the edge part side joined with a connection member at least, and the width | variety of a connection member points out the width | variety of the linear part mentioned later at least.

Furthermore, in the present invention, the connecting member is substantially L-shaped in a plan view including a pair of straight portions joined to the ends of the two adjacent tie bars, and the inner side of the straight portion is Also included is a leaded wiring board that is aligned with the inner side of the tie bar.
According to this, the connecting member having a substantially L shape in plan view is closer to the wiring board than the extension line of the outer side of two adjacent tie bars, and closer to the wiring board side than the intersection of the two extension lines. While being positioned, the inner sides of the pair of straight portions located at both ends of the connecting member and the inner sides of the two adjacent tie bars are aligned. Therefore, it is possible to easily align each tie bar with the connecting material by aligning both inner sides with a positioning jig or the like, and to connect each tie bar to each of both ends. Is a wiring substrate with leads firmly bonded.
The term “aligned” means that the two inner sides overlap in plan view. However, in addition to this form, a form in which the inner side of the connecting member is located closer to the wiring board (inner side) than the inner side of each tie bar is also included in the present invention.

In addition, according to the present invention, one end side of the lead is bent at a right angle with respect to other parts including the other end side so as to be parallel to the side surface of the wiring board. Also included is a leaded wiring board (Claim 4) in which the external terminals formed on the side surfaces are joined via solder.
According to this, for example, a plurality of leads parallel to each other extend from the inner sides of two tie bars that are orthogonally adjacent to each other to the wiring board side (inner side), and from the end portions of the inner sides of both tie bars, Even if one end or a plurality of leads extending perpendicularly intersect each other, the one end is bent at a right angle so that the one end is parallel to the side surface of the wiring board. Interference such as crossing can be prevented. Therefore, even if it has a plurality of leads having relatively long dimensions, it is a wiring substrate with a strong lead in which each tie bar and the connecting member are joined.

In the present invention, in addition to the above embodiment, one end side of the plurality of leads is bonded to an external terminal formed on the front surface or the back surface adjacent to each side surface of the wiring board via solder. A leaded wiring board is also included.
Also, in a form in which a plurality of leads having different lengths extend from the inner side of the same tie bar, one end of the longer lead is joined to an external terminal formed for each side surface of the wiring board, and one end of the shorter lead The side may be joined to an external terminal formed on the front surface or the back surface adjacent to each side surface.

The top view which shows one form of the wiring board with a lead by this invention. FIG. 2 is a vertical sectional view taken along line XX in FIG. 1. The enlarged view which shows the wiring board vicinity in FIG. The top view which shows the wiring board with a lead of a different form. Furthermore, the partial top view which shows the wiring board with a lead of another form.

Hereinafter, modes for carrying out the present invention will be described.
1 is a plan view showing a wiring board 1a with a lead according to an embodiment of the present invention, FIG. 2 is a vertical sectional view taken along the line XX in FIG. 1, and FIG. 3 is an enlarged view showing the vicinity of a wiring board 2; FIG.
As shown in FIGS. 1 to 3, the leaded wiring board 1 a is soldered (joined) at one end to the wiring board 2 and the side surfaces 5 of the four sides of the wiring board 2, and the other side is each side of the wiring board 2. 5, a plurality of leads 14 connected to any one of four tie bars 16 parallel in the longitudinal direction, and four connecting members 20 joined between two tie bars 16, 16 adjacent to each other orthogonally. It has.

The wiring board 2 is made of a ceramic (insulating material) substrate body such as alumina, and has a square (rectangular) surface 3 in plan view, a similar back surface 4, four side surfaces 5 located between them, and an opening on the surface 3. And a plurality of external terminals 12 formed on each side surface 5. The cavity 6 has a square bottom surface 7 in plan view, upper and lower two side walls 8a and 8b, and a step portion 9 having a square frame shape in plan view. Pads 10 for mounting electronic components are formed, and a plurality of terminals 11 are formed on each side of the stepped portion 9. The plurality of terminals 11 are individually subjected to wire bonding with Au thin wires between external terminals (none of which are shown) of electronic components such as IC chips mounted on the pads 10 later.
The pad 10, the terminal 11 and the external terminal 12 are made of W or Mo, and the surfaces thereof are covered with Ni and Au plating layers having a required thickness. The terminal 11 and the external terminal 12 can be electrically connected to each other through an internal wiring layer.

As shown in FIGS. 1 to 3, the plurality of external terminals 12 formed for each side surface 5 of the wiring board 2 are perpendicular to each other portion (perpendicular) for each of the plurality of leads 14 having a linear shape. The one end side 15 bent to 1 is joined via the solder 13. The plurality of leads 14 are connected to the inner side 17 of any one of the four tie bars 16 parallel to each other and at the other end side in parallel with the side surfaces 5 of the wiring board 2 in the longitudinal direction. Are connected to each other. Each tie bar 16 has a rectangular shape in plan view, and a plurality of leads 14 extend at right angles from the inner side 17 to the wiring board 2 side (inner side).
The plurality of leads 14 and tie bars 16, which are integral parts, are formed by punching a metal thin plate made of, for example, Kovar or 42 alloy, and Ni and Au plating layers having a required thickness are formed on these surfaces. It is covered.

  In this wiring board 1a, one end side of each one or a plurality of leads 14 extending orthogonally from the end side 19 side (most end side) of the inner side 17 of the two adjacent tie bars 16 is provided. Originally, the dimensions intersect with each other, but since one end side 15 of each lead 14 is bent at a right angle, the external terminals 12 for each side surface 5 of the wiring board 2 can be soldered. In other words, since the length of the lead 14 is the above-mentioned size, four tie bars in which a general plan view has a rectangular frame shape and does not use an integrated lead frame, and a plurality of leads 14 are connected at the other end side. 16 is used. However, this form can be applied to, for example, a lead frame having a long side dimension or a long dimension of a plurality of leads.

As shown in FIGS. 1 and 2, a connecting member 20 having a substantially L shape in plan view is joined between end sides 19 and 19 of two tie bars 16 orthogonally adjacent to each other. The connecting member 20 is also formed by press-molding the metal thin plate such as Kovar, and includes a central arc portion 21 and a pair of straight portions 22 extending at right angles from both sides thereof. The inner side 23 or the outer side 24 composed of a pair of straight sides is continuous. The pair of linear portions 22 of the connecting member 20 are disposed so as to overlap with the ends of the two tie bars 16 adjacent to the connecting member 20 on the end side 19 side, for example, a concave joint formed by spot welding. Joined by the portion 25.
As shown in FIG. 1, the width w <b> 2 of the connecting member 20 is smaller than the width w <b> 1 of the tie bar 16. Moreover, the connecting member 20 is located on the wiring board 2 side (inner side) with respect to the extension lines Y1 and Y2 of each outer side 18 of each tie bar 16 to which the outer side 24 is adjacent, and the intersection of the pair of extension lines Y1 and Y2. It is joined to each tie bar 16 so as to be located on the wiring board 2 side (inside) from Z.

The wiring substrate 1a with leads 14 was manufactured through the following steps.
First, a plurality of green sheets each having an unfired wiring layer formed between the layers are laminated, and a green sheet laminate having a cavity 6 on the surface 3 and a plurality of external terminals 12 for each of the four side surfaces 5 is formed. The wiring board 2 was formed by degreasing and firing at a predetermined temperature.
Next, for each of the external terminals 12 on each side surface 5 of the wiring board 2, the bent portions 15 on one end side of the plurality of leads 14 extending inward from the four tie bars 16 are soldered via solder 13 (soldering). Attached) and joined. As a result, four tie bars 16 were connected to and parallel to each side surface 5 of the wiring substrate 2 via a plurality of leads 14 bonded to each side surface 5 of the wiring substrate 2.
Next, the connecting member 20 was disposed between the end sides 19 of the two adjacent tie bars 16, and the straight portion 21 of the connecting member 20 and the end of each tie bar 16 were spot welded (25). As a result, the four tie bars 16 were connected via the four connecting members 20 for each corner so as to form a substantially square shape in plan view.

At this time, the outer side 24 of each connecting member 20 is closer to the wiring board 2 side (inner side) than the extension lines Y1 and Y2 of the outer side 18 of the two adjacent tie bars 16, and the two extension lines Y1 and Y2. It is located on the wiring board 2 side (inner side) from the intersection Z. At the same time, among the inner sides 23 of each connecting member 20, the straight portions at both ends are aligned with the inner sides 17 of the two adjacent tie bars 16.
Further, the wiring board 2, the four sets of plural leads 14, the four tie bars 16 integrated therewith, and the four connecting members 20 joined between the tie bars 16, 16 are connected to an Ni plating tank and an Au plating tank. Then, the substrate was dipped sequentially into electrolytic Ni plating and electrolytic Au plating. As a result, the pads 14, the terminals 11, the external terminals 12, the leads 14, the tie bars 16, and the connection members 20 are attached to the front and back surfaces of the leads 14 with Ni and Au plating layers having a required thickness. The wiring board 1a could be manufactured.
The wiring board 1a is inspected for electrical characteristics, dimensions, etc., and then individually housed in a concave portion of a tray having inner walls on four sides, and is transported or shipped to the next process or the like.

According to the wiring board 1a with leads 14 as described above, the distance (interval) between the four tie bars 16 connected to the other ends of the plurality of leads 14 extending outward from the side surfaces 5 of the wiring board 2. In addition, the four connecting members 20 are closer to the wiring board 2 (inner side) than the extension lines Y1 and Y2 of the outer side 18 of the two adjacent tie bars 16, and the intersection Z of the two extension lines Y1 and Y2 It is located on the wiring board 2 side (inner side) rather than being individually joined. Therefore, when the wiring board 1a with leads 14 is placed in a tray (not shown) and transported, the inner wall surface of the tray and the outer side 24 of the connecting member 20 for each corner are less likely to come into contact with each other. As a result, the impact caused by the collision does not act on the outer side 24 of the connecting member 20. Therefore, it is possible to stably provide the leaded wiring board 1a in which the four tie bars 16 surrounding the wiring board 2 and the four connecting members 20 joined between the end sides 19 and 19 are firmly joined. It becomes.
In addition, in the wiring substrate 1a with leads, a plurality of leads 14 are cut in the middle, and the other end side of the cut leads 14 is connected to an external terminal on the mother board side (not shown). ) And soldered separately.

FIG. 4 is a plan view similar to the above, showing a different type of wiring substrate 1b with leads.
As shown in FIG. 4, the leaded wiring board 1 b includes the same wiring board 2 and four tie bars 16 that connect a plurality of leads 14 extending from the side surfaces 5 of the board 2. . The wiring board 1b is different from the wiring board 1a in that the ends 19 and 19 of two tie bars 16 that are orthogonally adjacent to each other are connected by a connecting member 30 that is substantially L-shaped in plan view. It is that you are.
The connecting member 30 is formed by press-molding the same metal thin plate as described above. As shown in FIG. 4, the connecting member 30 includes a central inclined portion 31 and a pair of linear portions 32 extending perpendicularly from both sides thereof. . The inclined portion 31 has an inner side 33 that connects the inner sides 17 and 17 on the side of the end side 19 of each adjacent tie bar 16 with an oblique straight line and an outer side 34 that is parallel to the inner side 33, and the end side 19 of each tie bar 16. , 19 are connected diagonally. Each of the inner side 33 and the outer side 34 includes a central inclined side and a pair of straight sides.
On the other hand, the straight line portion 32 having a rectangular shape in plan view has a width w2 smaller than the width w1 of the tie bar 16 and a position where the inner side 33 is aligned with the inner side 17 of each tie bar 16. It is joined to the tie bars 16 and 16 by the joint 25 by spot welding.

As shown in FIG. 4, the four connecting members 30 are closer to the wiring board 2 (inner side) than the extension lines Y1 and Y2 of the outer side 18 of the two adjacent tie bars 16, and the two extension lines Y1. , Y2 are located on the wiring board 2 side (inside) from the intersection Z of Y2, and are individually joined. Further, the inner side 33 of each connecting member 30 is aligned with the inner side 17 of the two adjacent tie bars 16. Therefore, when the wiring board 1b with leads 14 is placed in a tray (not shown) and conveyed, the inner wall surface of the tray and the outer side 34 of the connecting member 30 for each corner are less likely to come into contact with each other. As a result, the impact associated with the collision does not act on the outer side 34 of the connecting member 30.
Therefore, the wiring board 1b with the leads 14 is formed by firmly joining the four tie bars 16 surrounding the wiring board 2 and the four connecting members 30 joined between the end sides 19 and 19. The wiring board 1b can also be manufactured by the same method as the wiring board 1a.

FIG. 5 is a partial plan view showing a wiring board 1c with leads in a further different form.
The leaded wiring board 1c also includes the same wiring board 2 (not shown) and four tie bars 16 connected to a plurality of leads 14. The wiring board 1c is different from the wiring board 1a in that the two adjacent tie bars 16 are connected between the side edges 19 by a connecting member 40 having a substantially L shape in plan view. is there.
The connecting member 40 is formed by press-molding the same thin metal plate as described above. As shown in FIG. 5, the connecting member 40 includes a central arc portion 41 and a pair of linear portions 42 extending perpendicularly to both sides thereof. The inner side 43 and the outer side 44 are continuous. The pair of straight portions 42 of the connecting member 40 has a width w2 slightly smaller than the width w1 of the tie bar 16 and overlaps with the end portions on the end side 19 side of the two tie bars 16 adjacent to the connecting member 40. .
At this time, the alignment of the connecting member 40 and the tie bar 16 is performed in advance so that the inner side 43 of each straight line portion 42 is located slightly closer to the wiring board 2 side (inner side) than the inner side 17 of the tie bar 16. Holes sh are respectively drilled.

Moreover, as illustrated in FIG. 5, the outer side 44 of each connecting member 40 is closer to the wiring board 2 (inner side) than the extension lines Y1 and Y2 of the outer side 18 of the two adjacent tie bars 16, and It is located on the wiring board 2 side (inside) from the intersection Z of the two extension lines Y1 and Y2, and is individually joined. Therefore, even if the wiring board 1c with leads 14 is transported by the tray, the inner wall surface of the tray and the outer side 44 of the connecting member 40 for each corner are difficult to come into contact with each other, and an impact caused by a collision with the inner wall surface is connected. It does not act on the outer side 44 of the member 40. Therefore, the wiring board 1c with the leads 14 is obtained by firmly joining the four tie bars 16 surrounding the wiring board 2 and the four connecting members 40 joined between the end sides 19 and 19.
In the wiring board 1c, each straight side of the inner side 43 of the straight portion 42 of the connecting member 40 is disposed at a position closer to the wiring board 2 (inner side) than the inner side 17 of the tie bar 16. Even if the width w2 of the portion 42 and the width w1 of the tie bar 16 are the same, it is possible to achieve the same effect as described above.

The present invention is not limited to the embodiments described above.
For example, the wiring board 2 may be made of, for example, a low-temperature fired ceramic (insulating material) such as glass-ceramic or an epoxy-based resin (insulating material). In these cases, the pad 10 and the terminal 11 are used. , 12 are made of Cu or Ag.
The wiring board 2 may have a form in which the front surface and the back surface have a rectangular shape in a plan view, or a form having a flat surface without the cavity 6.
Further, the plurality of leads 14 extending from the tie bar 16 have a plurality of external terminals formed on the front surface 3 or the back surface 4 adjacent to the respective side surfaces 5 of the wiring board 2 without being bent at one end thereof, and the one end. It is good also as a wiring board with a lead of the form which soldered the side separately.
The shape of the tie bar is not limited to a rectangular shape in plan view, and can be any shape as long as the width w1 of both ends joined to the connecting member is larger than the width w2 of the connecting member.
In addition, the connecting member is wired on the wiring board 2 side (inner side) with respect to the extension lines Y1 and Y2 of the outer side of each tie bar whose outer side is adjacent, and from the intersection Z of the extension lines Y1 and Y2. As long as it is located on the substrate 2 side (inside), the shape is not limited to the above.

  The wiring board with leads of the present invention has a tie bar having four sides that is parallel to each side surface of the wiring board and connects a plurality of leads, and connects and connects adjacent tie bars via a connecting member. Can be applied to.

1a to 1c ……………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………………… ……… Back 5 ……………………………… Side 12 ………………………… External terminal 13 ………………………… Solder 14 ………………… ……… Lead 15 ………………………… Bend (one end side)
16 ………………………… Tie bar 17, 23, 33, 43… Inner side 18, 24, 34, 44… Outer side 20, 30, 40 ………… Connecting member Z ……………… …………… Intersection w1, w2 ………………… Width

Claims (4)

A wiring board made of an insulating material and having a rectangular front surface, a back surface, and four side surfaces located between these, and
A plurality of leads each having one end joined to each side surface of the wiring board, or a front or back surface adjacent to each side face, and the other end connected to one of four tie bars parallel to each side of the wiring board; ,
A wiring board with leads comprising four connecting members joined between the four tie bars,
The connecting member is located on the wiring board side with respect to each extension line of the outer sides of two adjacent tie bars, and on the wiring board side with respect to an intersection of the pair of extension lines,
A wiring board with leads. The width of the connecting member is smaller than the width of two adjacent tie bars,
The leaded wiring board according to claim 1. The connecting member is substantially L-shaped in a plan view including a pair of straight portions joined to the ends of two adjacent tie bars, and the inner side of the straight portion is aligned with the inner side of the tie bar. ing,
The leaded wiring board according to claim 1 or 2. One end side of the lead is bent at a right angle with respect to other parts including the other end side so as to be parallel to the side surface of the wiring board, and external terminals formed on the one end side and the side surface of the wiring board. And are joined via solder,
The leaded wiring board according to any one of claims 1 to 3.

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