JP2010177347A - Ball loading mask, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a ball loading mask which is made so as to improve insertability and a loading rate of conductive balls by forming a ball guide portion to which R-shape working is performed by a side-spread phenomenon of plating, in a peripheral edge of a ball loading-side opening of a ball insertion hole. <P>SOLUTION: The ball loading mask incldudes: a first mask layer 13 manufactured by plating so as to have many ball insertion holes 4 having prescribed opening dimensions slightly larger than a diameter of conductive balls 8 to be loaded; and a second mask layer 15 wherein ball guide portions 9 which are rounded by a side-spread phenomenon of plating and have a diameter larger than that of the ball insertion holes are formed in peripheral edges of ball mounting-side openings of the ball insertion holes. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a ball mounting mask having a ball guide portion using an R shape due to a side-spread phenomenon of plating at the periphery of a ball mounting side opening of a ball insertion hole, and a method for manufacturing the same.

  Conventionally, in a ball mounting mask in which conductive balls are distributed and arranged at predetermined positions on a base such as a semiconductor wafer, the ball mounting side opening peripheral edge (edge) of the ball insertion hole is angular, and the conductive balls are easily damaged. In addition, the conductive ball is not mounted (see, for example, Patent Document 1).

JP 2008-263053 A

In recent years, there are products having a predetermined opening size tolerance of the ball insertion hole of the ball mounting mask of ± 2 μm or 1 μm, and it has become difficult to ensure accuracy with the conventional ball mounting mask.
Further, when the ball insertion hole is formed by free growth of plating, a difference appears in the growth rate (film thickness and R shape) due to the change in current density (current efficiency) due to the density of the pattern. There is a problem that the difference affects the accuracy of the predetermined opening size of the ball insertion hole.

  The present invention has been made to solve the above-described problems. By forming a ball guide portion using an R shape due to a side spread phenomenon of plating at the periphery of the ball mounting side opening of the ball insertion hole, It is intended to provide a ball mounting mask and a method for manufacturing the same, which improve the insertion property and mounting rate of the functional ball.

  In the ball mounting mask according to the present invention, a large number of ball insertion holes having a predetermined opening dimension slightly larger than the diameter of the conductive ball to be mounted are formed, and the ball mounting mask has a diameter larger than that of the conductive ball to be mounted. A first mask layer formed by plating so that a large number of ball insertion holes having a slightly larger predetermined opening size are formed, and R-shaped processing by the side spread phenomenon of plating on the periphery of the ball mounting side opening of the ball insertion hole And a second mask layer formed with a ball guiding portion having a diameter larger than that of the ball insertion hole to which is applied.

  In addition, a plurality of ball insertion holes having a predetermined opening size slightly larger than the diameter of the conductive ball to be mounted are plated on the periphery of the ball mounting side opening of the ball insertion hole and the first mask layer formed by laser processing. And a second mask layer formed with a ball guide portion having a diameter larger than that of the ball insertion hole subjected to the R-shaped processing by the side spread phenomenon.

  In addition, a space portion is formed between the ball insertion hole and the ball guide portion, which is a trace obtained by removing the resist used when forming the ball guide portion.

  In the ball mounting mask manufacturing method according to the present invention, a resist is formed on the conductive base material, and a plurality of ball insertion holes having a predetermined opening dimension slightly larger than the diameter of the conductive ball to be mounted are formed. A first mask layer forming step of forming the first mask layer to be formed by plating, and a resist is formed only on the periphery of the ball mounting side opening of the ball insertion hole of the first mask layer, and R-shaped processing by the side spread phenomenon of plating A second mask layer forming step for forming a second mask layer having a ball guide portion having a diameter larger than that of the ball insertion hole provided with the resist, a resist removing step for removing the resist, and the first mask layer from the conductive base material. And a peeling step of peeling off the second mask layer.

  Also, a SUS base material is prepared, and a first mask layer is formed by drilling a large number of ball insertion holes having a predetermined opening size slightly larger than the diameter of the conductive ball mounted on the SUS base material by laser processing. The first mask layer forming step, and a resist is formed only at the periphery of the ball mounting side opening of the ball insertion hole of the first mask layer, and the diameter is larger than that of the ball insertion hole subjected to R-shaped processing by the side spread phenomenon of plating. The second mask layer forming step for forming the second mask layer having the ball guiding portion and the resist removing step for removing the resist.

  According to the present invention, by forming the ball guide portion subjected to the R shape processing by the side spread phenomenon of plating on the periphery of the ball mounting side opening of the ball insertion hole, the insertion property and mounting rate of the conductive balls are improved. effective.

It is a perspective view which shows the ball mounting mask in Example 1 of this invention. It is a perspective view which shows the state which uses the ball mounting mask in Example 1 of this invention for bases, such as a semiconductor wafer. It is a longitudinal cross-sectional view which shows the principal part of the ball mounting mask in Example 1 of this invention. It is a longitudinal cross-sectional view which shows the main processes of the manufacturing method of the ball mounting mask in Example 1 of this invention. It is a longitudinal cross-sectional view which shows the principal part of the ball mounting mask in Example 2 of this invention. It is a longitudinal cross-sectional view which shows the main processes of the manufacturing method of the ball mounting mask in Example 3 of this invention. It is a longitudinal cross-sectional view which shows the main processes of the manufacturing method of the ball mounting mask in Example 4 of this invention. It is a longitudinal cross-sectional view which shows the principal part of the ball mounting mask in Example 4 of this invention. It is a longitudinal cross-sectional view which shows the main processes of the manufacturing method of the ball mounting mask in Example 5 of this invention. It is a longitudinal cross-sectional view which shows the principal part of the ball mounting mask in Example 5 of this invention. It is a longitudinal cross-sectional view which shows the principal part of the ball mounting mask in Example 6 of this invention. It is a longitudinal cross-sectional view which shows the principal part of the ball mounting mask in Example 7 of this invention. It is a longitudinal cross-sectional view which shows the principal part of the ball mounting mask in Example 8 of this invention.

Example 1.
1 is a perspective view showing a ball mounting mask according to Embodiment 1 of the present invention. FIG. 2 is a perspective view showing a state in which the ball mounting mask according to Embodiment 1 of the present invention is used as a base of a semiconductor wafer or the like. FIG. 4 is a longitudinal sectional view showing the main part of the ball mounting mask in Embodiment 1 of the present invention, and FIG. 4 is a longitudinal sectional view showing the main steps of the method for manufacturing the ball mounting mask in Embodiment 1 of the present invention.

  1 and 2, reference numeral 1 denotes a plate frame made of an aluminum material or the like in the shape of a square frame, 2 denotes a screen made of a mesh stretched inside the plate frame 1, and 3 denotes the center of the screen 2 It is a ball mounting mask that is adhesively fixed to the opening. The ball mounting mask 3 has a flat plate shape made of metal, and the peripheral edge thereof is bonded to the screen 2 with an adhesive. The ball mounting mask 3 is formed with a plurality of ball insertion hole assemblies 5 in which a large number of ball insertion holes 4 are formed. Here, an example of four ball insertion hole assemblies 5 is shown. The ball mounting mask 3 is used for a base 6 such as a semiconductor wafer, and a plurality of electrodes 7 are provided on the base 6, and each ball insertion hole 4 of the ball mounting mask 3 corresponds to each electrode 7 of the base 6. It corresponds to.

  The ball mounting mask 3 according to the present invention has a structure as shown in FIG. That is, the ball insertion hole 4 of the ball mounting mask 3 that is arranged in a predetermined position on the base 6 such as a semiconductor wafer has a predetermined opening dimension D designated by the customer, The diameter of the ball 8 is slightly larger. In recent years, dimensional tolerance management of a predetermined opening dimension D specified has become very strict. Electrodes 7 are correspondingly arranged on the base 6 immediately below the ball insertion hole 4. Then, an R-shaped process is performed on the periphery of the opening on the ball mounting side of the ball insertion hole 4 having a predetermined opening dimension D by plating side spread phenomenon (the plating grows vertically and horizontally while overhanging on the resist periphery). An applied ball guide portion 9 is formed, and the diameter of the lowermost end of the ball guide portion 9 is formed to be a large diameter slightly larger than the diameter of the ball insertion hole 4. The conductive ball 8 mounted on the ball mounting mask 3 has a structure in which the conductive ball 8 can easily enter by being guided by the ball guide portion 9 subjected to the R-shaped processing. Further, by setting the difference between the diameter of the lowermost end of the ball guide portion 9 and the diameter D of the ball insertion hole 4 to be ½ or less of the diameter of the conductive ball 8, the conductive ball 8 remains in the middle. There is nothing. A space portion 10 is formed between the ball insertion hole 4 and the ball guide portion 9. This space portion 10 is a trace after the resist used for forming the ball guide portion 9 subjected to the R-shape processing by the side spread phenomenon of plating is removed. Reference numeral 11 denotes a spacer or a protrusion arranged between the ball mounting mask 3 and the base 6 for releasing the electrode 7.

Next, a ball mounting mask manufacturing method according to Embodiment 1 of the present invention will be described with reference to FIG. This manufacturing method is a lamination process by plating.
First, the first mask layer 13 for forming the ball insertion hole 4 is formed in the conductive base material 12 by plating (see FIG. 4a). Here, as in the case of manufacturing a normal metal mask by plating, a resist is applied to the conductive base material 2, and it is formed through the steps of exposure, development, and plating, so detailed description is omitted, but the ball is inserted. Since the resist having the same dimension as the predetermined opening of the hole 4 can be formed to ensure the accuracy of the predetermined opening dimension D, the dimensional tolerance management of the predetermined opening dimension D in recent years can sufficiently cope with a very severe situation. Is possible. Next, a resist 14 for forming the ball guide portion 9 is formed only on the periphery of the ball mounting side opening of the ball insertion hole 4 of the first mask layer 13 by coating, exposure, and development (see FIG. 4B). Then, after the nickel strike plating is performed on the surface of the first mask layer 13 as occasion demands, an R due to plating side spread phenomenon (the plating grows vertically and horizontally while overhanging on the periphery of the resist). A second mask layer 15 having a ball guide portion 9 subjected to shape processing is formed (see FIG. 4c). Next, the resist 14 is removed and peeled off from the conductive base material 12 to obtain the ball mounting mask 3 according to the present invention (see FIG. 4d). At this time, a space 10 which is a trace after removing the resist 14 is formed between the ball insertion hole 4 and the ball guide portion 9. Here, as an example, the height of the space portion 10 is about 10 μm, the height of the R-shaped processed portion and its protruding length are both about 25 μm, and the total height of the ball mounting mask 3 is about 70 μm. is there.
In addition, one ball guide portion 9 subjected to the R-shaped processing is provided for each ball insertion hole 4, but one ball guide portion 9 may be provided for each of the plurality of ball insertion holes 4.

  According to the present invention, by forming the ball guide portion subjected to the R shape processing by the side spread phenomenon of plating on the periphery of the ball mounting side opening of the ball insertion hole, the insertion property and mounting rate of the conductive balls are improved. be able to.

Example 2
FIG. 5 is a longitudinal sectional view showing an essential part of a ball mounting mask in Embodiment 2 of the present invention. In the first embodiment, the spacer 7 or the protrusion 11 is disposed between the ball mounting mask 3 and the base 6 so that the electrode 7 is released, but in this second embodiment, as shown in FIG. An electrode escape portion 17 is provided at the lower peripheral edge of the ball insertion hole 4 by forming a protrusion 16 made of a plating layer on the lower surface of the ball mounting mask 3 on the base 6 side of a semiconductor wafer or the like. A resist is formed in a portion corresponding to the electrode escape portion 17 of the base material 12, and the protruding portion 16 is formed by plating.
In addition, one ball guide portion 9 subjected to the R-shaped processing is provided for each ball insertion hole 4, but one ball guide portion 9 may be provided for each of the plurality of ball insertion holes 4.

Example 3 FIG.
FIG. 6 is a longitudinal sectional view showing the main steps of the ball mounting mask manufacturing method according to Embodiment 3 of the present invention. In this manufacturing method, the first mask layer 13a for forming the ball insertion hole 4a is a SUS plate and includes an opening processing step by laser processing.
First, a SUS plate is prepared, and a first mask layer 13a in which the ball insertion hole 4a is drilled by laser processing is formed (see FIG. 6a). Here, the precision of the predetermined opening dimension D of the ball insertion hole 4a can be ensured by laser processing, and it is possible to sufficiently cope with the recent severe dimensional tolerance management of the predetermined opening dimension D. Next, a resist 14a for forming the ball guiding portion 9a is formed only on the periphery of the ball mounting side opening of the ball insertion hole 4a of the first mask layer 13a by coating, exposing and developing (see FIG. 6b). In some cases, nickel strike plating is performed on the surface of the first mask layer 13a. Nickel strike plating is necessary to prevent the SUS base material and the nickel plating film from peeling off. After this nickel strike plating is performed, a second mask layer 15a having a ball guide portion 9a that has been subjected to an R-shaped process by plating side spread phenomenon is formed thereon (see FIG. 6c). Next, the ball mounting mask 3a according to the present invention is obtained by removing the resist 14a (see FIG. 6d). At this time, a space portion 10a which is a trace after removing the resist 14a is formed between the ball insertion hole 4a and the ball guide portion 9a.
Note that one ball guide portion 9a subjected to R-shaped processing is provided for each ball insertion hole 4a, but one ball guide portion 9a may be provided for each of the plurality of ball insertion holes 4a.

Example 4
FIG. 7 is a longitudinal sectional view showing the main steps of the ball mounting mask manufacturing method according to Embodiment 4 of the present invention, and FIG. 8 is a longitudinal sectional view showing the main part of the ball mounting mask according to Embodiment 4 of the present invention.

A ball mounting mask manufacturing method according to Embodiment 4 of the present invention will be described with reference to FIG. This manufacturing method is a lamination process by plating.
First, the resist 18 of the electrode escape portion 17 is formed on the conductive base material 12b (see FIG. 7a). Next, a projection 16 for forming the electrode escape portion 17 is formed by plating, and further, a series of first mask layers 13b having a ball insertion hole 4b subjected to R-shape processing by the side spread phenomenon of plating are formed thereon. (See FIG. 7b). Next, a resist 14b for forming the ball guiding portion 9b is formed on the periphery of the ball mounting side opening of the ball insertion hole 4b of the first mask layer 13b by coating, exposing and developing (see FIG. 7c). Then, after nickel strike plating is optionally performed on the surface of the first mask layer 13b, a second mask layer 15b having a ball guide portion 9b having a right upper peripheral edge is formed by plating (see FIG. 7d). . Next, the resists 18 and 14b are removed (see FIG. 7e). Then, by peeling from the conductive base material 12b, the ball mounting mask 3b according to the present invention is obtained (see FIG. 7f).

In the first embodiment, the ball guide portion 9 is formed on the periphery of the ball mounting side opening portion of the ball insertion hole 4 having a predetermined opening dimension D, which has been subjected to R-shaped processing by the side spread phenomenon of plating. In FIG. 8, as shown in FIG. 8, the conductive ball 8 is further guided, for example, to a depth of about 70 .mu.m in the upper layer of the ball insertion hole 4b subjected to the R-shape processing by the side spread phenomenon of plating. A ball guide portion 9b that is recessed is formed. Reference numeral 17 denotes an electrode escape portion provided at the lower peripheral edge of the ball insertion hole 4b. The height from the bottom surface of the recessed ball guide recess 9b to the electrode escape portion 17 is, for example, about 200 μm.
In addition, although the ball | bowl guide part 9b is substantially right-angled in the upper periphery, you may give it an inclination. Further, one piece is provided for each ball insertion hole 4b, but one piece may be provided for each of the plurality of ball insertion holes 4b.

Embodiment 5 FIG.
FIG. 9 is a longitudinal sectional view showing the main steps of the ball mounting mask manufacturing method according to Embodiment 5 of the present invention, and FIG. 10 is a longitudinal sectional view showing the main part of the ball mounting mask according to Embodiment 5 of the present invention. In this manufacturing method, the entire opening of the ball insertion hole is formed of a resist in order to improve the accuracy of the opening diameter.

  First, a first resist is applied to the conductive base material 12c, and the first resist portion that becomes the electrode escape portion 17 is exposed. After the exposure, a second resist is applied to expose the second resist portion that becomes the opening of the ball insertion hole 4c. After the exposure, the first resist and the second resist are developed to form the first resist portion 18a and the second resist portion 19 simultaneously (see FIG. 9a). Next, the first mask layer 13c in which the electrode escape portion 17 and the ball insertion hole 4c are formed by the first resist portion 18a and the second resist portion 19 is formed on the conductive base material 12c by plating (see FIG. 9b). Here, in the lower layer portion where the ball insertion hole 4c of the first mask layer 13c is formed, a resist having the same size as the predetermined opening of the ball insertion hole 4c is formed in the same manner as in the case of manufacturing an ordinary metal mask by plating. Since the accuracy of the predetermined opening dimension D can be ensured, in recent years, the ball insertion hole 4c may be not only straight but also reversely tapered. In addition, in the upper layer portion where the ball insertion hole 4c of the first mask layer 13c is formed, the ball inlet portion 20 subjected to the R-shaped processing by the side spread phenomenon of plating is formed at the periphery of the opening portion on the ball mounting side at the same time. it can. Next, the protruding resist 19 is polished (see FIG. 9c). Subsequent steps are the same as the manufacturing steps shown in FIGS. Needless to say, if the process is stopped in FIG. 9b without proceeding to FIG. 9c, a ball mounting mask having a shape without the ball guiding portion 9c can be obtained.

As shown in FIG. 10, the ball mounting mask 3c obtained according to the fifth embodiment has a ball insertion hole 4c formed in the lower layer of the ball inlet portion 20 utilizing the R shape by the side spread phenomenon of plating. The resist having the same dimension can be formed to ensure the accuracy of the predetermined opening dimension D.
In addition, although the ball | bowl guide part 9c has a substantially right-angled upper periphery, you may give it an inclination. One piece is provided for each ball insertion hole 4c, but one piece may be provided for each of the plurality of ball insertion holes 4c.

Example 6
FIG. 11 is a longitudinal sectional view showing an essential part of a ball mounting mask according to Embodiment 6 of the present invention.
In the fifth embodiment, the ball guide portion 9c has an upper peripheral edge having a right-angle shape. However, as shown in FIG. 11, in the ball mounting mask 3d obtained in the sixth embodiment, the ball guide portion 9d has an R-shaped upper peripheral edge. It has been processed.

Example 7
FIG. 12 is a longitudinal sectional view showing an essential part of the ball mounting mask according to Embodiment 7 of the present invention.
In the fifth embodiment, the ball insertion hole 4c is a straight hole. However, as shown in FIG. 12, the ball mounting mask 3e obtained by the seventh embodiment has a reverse insertion taper hole. It has been applied. In addition, the ball guide portion 9e has an upper peripheral edge that is R-shaped.

Example 8 FIG.
FIG. 13 is a longitudinal sectional view showing an essential part of a ball mounting mask according to Embodiment 8 of the present invention.
As shown in FIG. 13, in the ball mounting mask 3f obtained in the eighth embodiment, the ball insertion hole 4f is provided with a reverse tapered hole, but the ball guide portion 9f has a substantially right-angled shape at the upper periphery. It is what.

DESCRIPTION OF SYMBOLS 1 Plate frame 2 Screen 3, 3a-3f Ball mounting mask 4, 4a-4f Ball insertion hole 5 Ball insertion hole assembly 6 Base 7 Electrode 8 Conductive ball 9, 9a-9f Ball guide part 10 Space part 11 Spacer 12, 12a, 12b Conductive base material 13, 13a-13c First mask layer 14, 14a Resist 15, 15a-15c Second mask layer 16 Protrusion 17 Electrode escape portion 18a First resist portion 19 Second resist portion 20 Ball entrance portion

Claims (12)

A ball mounting mask in which a large number of ball insertion holes having a predetermined opening dimension slightly larger than the diameter of a conductive ball to be mounted are formed,
A first mask layer manufactured by plating so that a large number of ball insertion holes having a predetermined opening size slightly larger than the diameter of the conductive ball to be mounted are formed, and a ball mounting side opening of the ball insertion hole A ball mounting mask comprising: a second mask layer having a ball guide portion having a diameter larger than that of the ball insertion hole, the periphery of which is subjected to an R-shape process by plating side spread phenomenon. A ball mounting mask in which a large number of ball insertion holes having a predetermined opening dimension slightly larger than the diameter of a conductive ball to be mounted are formed,
A first mask layer in which a plurality of ball insertion holes having a predetermined opening size slightly larger than the diameter of the conductive ball to be mounted is formed by laser processing, and the periphery of the ball mounting side opening of the ball insertion hole is plated. And a second mask layer formed with a ball guide portion having a diameter larger than that of the ball insertion hole subjected to the R-shaped processing by the side spread phenomenon.   The space part which is the trace which removed the resist used when forming the said ball guide part is formed between the ball insertion hole and the ball guide part, The claim 1 or Claim 2 characterized by the above-mentioned. Ball mounting mask as described. A ball mounting mask in which a large number of ball insertion holes having a predetermined opening dimension slightly larger than the diameter of a conductive ball to be mounted are formed,
A first mask layer having a predetermined opening size slightly larger than a diameter of the conductive ball to be mounted and having a plurality of ball insertion holes subjected to R-shaped processing by plating side spread phenomenon; A ball mounting mask comprising: a second mask layer formed by plating a ball guide portion having a right-angle shape larger in diameter than the ball insertion hole on the periphery of the opening portion on the ball mounting side of the insertion hole. A ball mounting mask in which a large number of ball insertion holes having a predetermined opening dimension slightly larger than the diameter of a conductive ball to be mounted are formed,
A first mask layer having a predetermined opening size slightly larger than a diameter of the conductive ball to be mounted and having a plurality of ball insertion holes subjected to R-shaped processing by plating side spread phenomenon; And a second mask layer in which a ball guide portion having a larger diameter than the ball insertion hole is formed on the periphery of the opening portion of the ball mounting side of the insertion hole, which is subjected to R-shaped processing by a side spread phenomenon of plating. Ball mounted mask. A ball mounting mask in which a large number of ball insertion holes having a predetermined opening dimension slightly larger than the diameter of a conductive ball to be mounted are formed,
A first mask lower layer portion formed by plating so that a large number of ball insertion holes having a predetermined opening size slightly larger than the diameter of the conductive ball to be mounted are formed, and a ball mounting side opening of the ball insertion hole A first mask upper layer portion having a ball inlet portion having a diameter larger than that of the ball insertion hole subjected to R-shaped processing by plating side spread phenomenon on the periphery of the portion, and more than the ball inlet portion on the periphery of the ball inlet portion A ball mounting mask comprising: a second mask layer in which a large-diameter right-angled ball guiding portion is formed by plating. A ball mounting mask in which a large number of ball insertion holes having a predetermined opening dimension slightly larger than the diameter of a conductive ball to be mounted are formed,
A first mask lower layer portion formed by plating so that a large number of ball insertion holes having a predetermined opening size slightly larger than the diameter of the conductive ball to be mounted are formed, and a ball mounting side opening of the ball insertion hole A first mask upper layer portion formed with a ball inlet portion having a diameter larger than the ball insertion hole, which has been subjected to R-shaped processing by plating side spread phenomenon on the periphery of the portion, and plating side spread phenomenon on the periphery of the ball inlet portion A ball mounting mask comprising: a second mask layer formed with a ball guide portion having a diameter larger than that of the ball inlet portion subjected to R-shape processing.   The ball insertion hole, which is manufactured by plating on the lower layer portion of the first mask and has a predetermined opening size slightly larger than the diameter of the conductive ball, is a reverse-H-shaped tapered hole. Item 8. The ball mounting mask according to Item 7. A method for manufacturing a ball mounting mask in which a large number of ball insertion holes having a predetermined opening size slightly larger than the diameter of a conductive ball to be mounted are formed,
A first mask in which a resist is formed on a conductive base material, and a first mask layer for forming a plurality of ball insertion holes having a predetermined opening size slightly larger than the diameter of the mounted conductive ball is formed by plating. A layer forming step, a resist is formed only at the periphery of the ball mounting side opening of the ball insertion hole of the first mask layer, and the diameter of the ball insertion hole is larger than that of the ball insertion hole subjected to R-shaped processing by the side spread phenomenon of plating. A second mask layer forming step for forming a second mask layer having a ball guiding portion; a resist removing step for removing the resist; and a peeling step for peeling the first mask layer and the second mask layer from the conductive base material. A method for manufacturing a ball-mounted mask, comprising: A method for manufacturing a ball mounting mask in which a large number of ball insertion holes having a predetermined opening size slightly larger than the diameter of a conductive ball to be mounted are formed,
First, a SUS substrate is prepared, and a first mask layer is formed in which a number of ball insertion holes having a predetermined opening size slightly larger than the diameter of the conductive ball mounted on the SUS substrate are formed by laser processing. 1 mask layer forming step, and a resist is formed only on the periphery of the ball mounting side opening of the ball insertion hole of the first mask layer, which is larger than the ball insertion hole subjected to R-shaped processing by the side spread phenomenon of plating. A method for manufacturing a ball mounting mask, comprising: a second mask layer forming step of forming a second mask layer having a ball guide portion having a diameter; and a resist removing step of removing the resist.   11. The nickel mask plating is performed on the first mask layer, and then a second mask layer is formed on the first mask layer. The manufacturing method of the ball mounting mask as described. A method for manufacturing a ball mounting mask in which a large number of ball insertion holes having a predetermined opening size slightly larger than the diameter of a conductive ball to be mounted are formed,
A resist for forming an electrode escape portion and a resist for forming a ball insertion hole are formed on the conductive base material, a protrusion for forming the electrode escape portion is formed by plating, and the conductive material mounted thereon is further formed thereon. A first mask layer having a predetermined opening size slightly larger than the diameter of the conductive ball and forming a first mask layer by plating to form a large number of ball insertion holes subjected to R-shaped processing by plating side-splet phenomenon And a second mask layer forming step of forming, by plating, a second mask layer having a right angle ball guide portion having a diameter larger than that of the ball insertion hole at the periphery of the ball mounting side opening of the ball insertion hole, A method for manufacturing a ball-mounted mask, comprising: a resist removing process for removing the resist; and a peeling process for peeling the first mask layer and the second mask layer from the conductive base material.

Images