JP2010160756A - Ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain an IC card in which breakage of an IC chip due to mechanical stress from the outside hardly occurs. <P>SOLUTION: A reinforcing plate is provided on the IC chip, wherein the reinforcing plate has a reinforcing plate made of resin, and a reinforcing plate made of metal from the side of the IC chip. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a non-contact IC card that uses electromagnetic energy to communicate with a reader / writer in a non-contact manner.

  Non-contact IC cards have built-in antennas and IC chips necessary for communication, and can communicate with readers / writers in a non-contact manner. In recent years, non-contact IC cards have been used for railway commuter passes and personal authentication cards. ing. However, if the non-contact IC card is subjected to mechanical stress such as external point pressure, impact or bending, the IC chip inside the card may be damaged, and the resistance of the non-contact IC card to mechanical stress is an issue. It has become.

  Conventionally, as a measure for improving mechanical stress such as impact load, a technique of providing a high-rigidity reinforcing plate such as stainless steel on an IC chip (for example, see Patent Document 1), a reinforcing plate for surrounding an outer peripheral edge (for example, a patent) Reference 2), a hat-shaped reinforcing material (for example, see Patent Document 3) is disclosed.

The reinforcing plate generally uses a highly rigid metal such as stainless steel, and the IC chip and the metal reinforcing plate are usually integrated with an adhesive having a high adhesive strength. Further, the bonding between the metal reinforcing plate and the IC chip requires an instantaneous curing in order to suppress the manufacturing cost, and is generally bonded and cured at a high temperature of 100 ° C. or higher. However, the metal plate and IC chip that are bonded and integrated at a high temperature have different shrinkage rates due to the difference in thermal expansion coefficient between the two during cooling, so that the IC chip always retains internal stress, and external stress In particular, it was easily broken by impact stress. On the other hand, there is an improvement that regulates the elasticity of the adhesive between the IC chip and the reinforcing material (see, for example, Patent Document 4), but there is a drawback that the curing time of the adhesive is long and the manufacturing cost increases. Moreover, although there exists an improvement proposal which adhere | attaches between an IC chip and a reinforcing material with an adhesive (for example, refer patent document 5), since the adhesive force was weak, there existed a possibility that a reinforcement board might peel off in a manufacturing process.
JP 2000-182016 A JP-A-8-282167 JP 2001-34727 A JP 2000-137781 A JP 2007-128269 A

  The present invention has been made in view of the above circumstances, and an object thereof is to obtain an IC card in which an IC chip is not easily damaged by an external mechanical stress.

  The IC card of the present invention includes a card substrate, an antenna pattern provided on the card substrate, an IC chip electrically connected to the antenna pattern, a resin reinforcing plate provided on the IC chip, and A metal reinforcing plate provided on the resin reinforcing plate is provided.

  According to the present invention, internal stress held by an IC chip can be reduced, and cracking due to external stress, particularly impact stress, can be prevented.

  The IC card of the present invention is a card substrate, an antenna pattern provided on the card substrate, an IC chip electrically connected to the antenna pattern, an IC card comprising a reinforcing plate provided on the IC chip, The reinforcing plate includes a resin reinforcing plate provided on the IC chip and a metal reinforcing plate provided on the resin reinforcing plate.

  Hereinafter, the present invention will be described in more detail with reference to the drawings.

  FIG. 1 is a front view showing an example of an IC card of the present invention.

  FIG. 2 is an enlarged view of the X-X ′ cross section of FIG. 1.

  An antenna substrate 204 used for an IC card is provided with an aluminum pattern 222 having a thickness of 5 to 50 μm constituting an antenna on a plastic card substrate such as PET. An IC chip 209 is placed on an aluminum pattern 222 on the antenna substrate 204 via a bump 221 made of metal such as gold (thickness 5 to 40 μm), and the IC chip pattern surface side is bumped by a mounting adhesive 220. Opposed and bonded. Further, a reinforcing member made of a laminate of the plastic film 232 and the metal plate 231 is adhered to the non-pattern surface side of the IC chip 209 by the mounting adhesive 208 with the plastic film 232 facing the IC chip side. .

  Although not shown, it is also possible to reinforce both surfaces of the IC card by bonding a reinforcing plate to a position corresponding to the IC chip on the IC chip non-mounting surface of the antenna substrate.

  In general, the mounting adhesives 208 and 220 are preferably adhesives that can be instantly cured in order to shorten the process time, and are preferably adhesively cured at a high temperature.

  As used herein, “instantaneous” means, for example, a time of 0.1 to 60 seconds, and “high temperature” means a temperature of 70 to 200 ° C.

  When the curing time of the adhesive exceeds 60 seconds, productivity tends to decrease.

  Further, when the curing temperature of the adhesive is lower than 70 ° C., curing tends to be insufficient, and when it exceeds 200 ° C., the antenna substrate tends to be deformed.

  If the IC plate and the metal plate that are bonded and integrated at high temperature are in direct contact with each other, the shrinkage rate differs during the subsequent cooling due to the difference in thermal expansion coefficient between the two, causing internal stress and distortion. In the invention, the presence of the plastic film 232 on the IC chip side reduces internal stress generated due to the difference in thermal expansion coefficient between the IC chip and the reinforcing plate metal part during cooling after mounting adhesive heat curing, and distortion caused thereby is reduced. can do.

  As a metal plate that can be used for the reinforcing member, for example, stainless steel, iron, nickel, tungsten, molybdenum, and tungsten carbide can be used.

  The metal plate is preferably highly rigid and preferably has a Young's modulus of 100 GPa or more, desirably 150 GPa or more.

  The plastic film material used for the reinforcing member includes polyvinyl chloride resin, polyolefin resin such as polypropylene and polyethylene, polyester resin, fluororesin resin such as PTFE, acrylic resin, nylon resin, non-woven fabric, Various elastomers can be used.

  The plastic film and the metal plate are bonded by melting the plastic film or using an adhesive such as acrylic, polyester, urethane, vinyl acetate, vinyl chloride vinyl acetate copolymer, polyvinyl alcohol, or epoxy. A combined two-layer structure can be obtained. Alternatively, the metal plate can be coated with a resin to form a two-layer structure of a plastic film and a metal plate.

  The thickness of the film is preferably 5 to 200 μm in order to relieve the thermal stress generated by the difference in coefficient of thermal expansion between the metal and the IC chip.

  The plastic film has good adhesion to metal and silicon, preferably has low rigidity, and preferably has a low Young's modulus, for example, 5 GPa or less, desirably 0.5 GPa or less.

  When using a plastic film having a Young's modulus of 0.5 GPa to 5 GPa, in order to alleviate the internal stress of the IC chip generated due to the difference in thermal expansion coefficient between the metal plate and the IC chip when cooled after high-temperature bonding, The thickness of the resin reinforcing member is desirably 30 to 150 μm.

  An adhesive selected from the group consisting of an epoxy thermosetting adhesive, an ultraviolet curable adhesive, and an electron beam curable adhesive can be used for adhesion between the IC chip and the plastic film side of the reinforcing plate. . According to the present invention, due to the presence of the plastic film, even when the adhesive between the IC and the reinforcing member is instantly cured at a high temperature, there is no distortion during cooling, and the process time is short and low cost. Can be manufactured.

  In the IC card 200, the surface base materials 201A and 201B can be provided on the intermediate base materials 203A and 203B, respectively, and further on the intermediate base materials 203A and 203B, respectively, on the IC chip 209 and the antenna substrate 204. .

  As the surface base materials 201A and 201B, cellulose materials such as paper, nonwoven fabric and the like can be used in addition to PET, polyvinyl chloride, polyolefin materials and the like.

  The surface base materials 201A and 201B preferably have a thickness of 20 to 250 μm.

  As the intermediate base materials 203A and 203B, various thermoplastic resins including a hot melt adhesive, a thermosetting adhesive, and the like can be used.

  The intermediate base materials 203A and 203B preferably have a thickness of 0 to 300 μm.

  Further, a mounting portion peripheral intermediate base material 205 is provided between the intermediate base material 203A and the antenna substrate 204, and around the laminate of the mounting adhesive 220, the bump 221, the IC chip 209, the plastic film 232, and the metal plate 231. Can be provided. The mounting portion surrounding intermediate base material 205 preferably has a thickness of 100 to 500 μm.

  The antenna substrate 204 preferably has a thickness of 20 to 100 μm.

  Hereinafter, the present invention will be specifically described with reference to examples.

Example 1
On the antenna substrate, an antenna pattern was formed by etching from aluminum laminated PET in which aluminum foils of 30 μm and 20 μm were laminated on both sides of PET: 38 μm. The LSI was 4 mm × 4 mm with a bump thickness of 120 μm, and ACP (XAP0044A07 manufactured by Kyocera Chemical Co., Ltd.) was used for the antenna substrate, which was adhesively cured at 150 ° C. for 12 seconds. On top of this, as a reinforcing plate, a resin film laminated steel plate (Mitsubishi Resin: Hishimetal) composed of a PET film of 50 μm thickness and SUS301-200 μm thickness is cut to a size of 5 mm × 5 mm and subjected to the same conditions by ACP (same as above) Bonding was performed at 150 ° C. for 12 seconds. General heat-resistant PET-G (Mitsubishi, 50 μm, 50 μm, and 440 μm thickness, respectively, as a surface substrate, a 100 μm-thick PET as a back substrate, a front-side intermediate substrate, a back-side intermediate substrate, and a mounting portion surrounding intermediate substrate The resin DIAFIX was used, and was integrally molded by a press machine, which was cut into a card shape and made into a card.

  In the card manufacturing process, after the mounting bonding process of the IC and the reinforcing member, it was temporarily stopped, and the warpage of the reinforcing member surface was measured with a three-dimensional measuring instrument.

  Furthermore, it progressed to the last process, it was made into the card state, the impact was given to the front and back, and the impact resistance test was done.

  In the impact resistance test, a weight of 50 g was dropped onto the center of the front and back IC chip on the card, and then communication OK / NG was determined. The drop height started from 20 cm and increased by 5 cm, and the maximum allowable drop height was measured.

  The results of warpage evaluation and impact resistance test are shown in Table 1 below.

Example 2
Using a reinforcing plate composed of a PET film 50 μm thick and SUS 301-150 μm, except that the front side intermediate base material and the back side intermediate base material are 70 μm thick, the mounting portion surrounding intermediate base material 400 μm thick, and the antenna substrate 50 μm thick In the same manner as in Example 1.

  In the same manner as in Example 1, warpage evaluation and impact resistance test were performed.

  The results are shown in Table 1 below.

Example 3
Other than providing SUS301-50μm bonded to the IC non-mounting surface side of the antenna substrate, the surface side intermediate base material and the back side intermediate base material being 30 μm thick, and the mounting portion surrounding intermediate base material being 440 μm thick Was the same as in Example 1.

  In the same manner as in Example 1, warpage evaluation and impact resistance test were performed.

  The results are shown in Table 1 below.

Example 4
In Example 1, the same result was obtained even when a low-elasticity silicone-based elastic adhesive was used as the LSI and SUS adhesive. However, it took 20 minutes for the adhesive to cure, and it took 100 times longer to bond than Example 1, indicating that the productivity tends to decrease.

Comparative Example 1
In Example 1, SUS301-200 μm was used as it was instead of the resin film laminated steel sheet.

  In the same manner as in Example 1, warpage evaluation and impact resistance test were performed.

The results are shown in Table 1 below.

  As described above, according to the present invention, even if a high-temperature instantaneous curing adhesive is used for the IC and the reinforcing member, no thermal stress remains on the IC, and damage to the LSI can be prevented from impact from the IC chip. it can.

Front view of an IC card according to the present invention The figure which expanded the X-X 'cross section of FIG.

  DESCRIPTION OF SYMBOLS 200 ... IC card, 201 ... Surface base material, 203 ... Intermediate base material, 204 ... Antenna substrate, 209 ... IC chip, 231 ... Plastic film, 232 ... Metal plate

Claims (2)

  A card substrate, an antenna pattern provided on the card substrate, an IC chip electrically connected to the antenna pattern, a resin reinforcing plate provided on the IC chip, and the resin reinforcing plate; An IC card comprising a provided metal reinforcing plate.   An adhesive layer using an adhesive selected from the group consisting of an epoxy thermosetting adhesive, an ultraviolet curable adhesive, and an electron beam curable adhesive is further provided between the IC chip and the resin reinforcing plate. The IC card according to claim 1, wherein the IC card is provided.

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