JP2010157764A - Device and method for mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and method for mounting an electronic component capable of mounting a high-end electronic component having small-pitch bumps. <P>SOLUTION: After detecting contact between each solder bump 1b of an electronic component 1 sucked and held by a suction nozzle 11 of a head tool 3 and each solder part 2 of a circuit board 4, each solder bump 1b and each solder part 2 are melted by heating, and, for the timing for terminating the sucking and holding to the electronic component 1 by the suction nozzle 11 of the head tool 3, the termination is carried out after the solder is melted, thereafter cooled and solidified instead of terminating the sucking and holding while melting the solder. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method and an apparatus for mounting an electronic component on a circuit board, and more particularly to an electronic component that enables an electronic component such as an IC chip having a narrow pitch bump to be mounted on a circuit board by a flip chip bonding method. The present invention relates to a mounting method and a mounting apparatus.

  Conventionally, various kinds of electronic component mounting methods are known. As an example of a conventional flip-chip bonding method for mounting electronic components, a method of temporarily bonding a plurality of electronic components on a circuit board and then reflowing solder together to mount electronic components (hereinafter, batch reflow mounting) The method is described in FIG.

  As shown in FIG. 22A, cream solder is supplied by printing or the like onto the pads 84a which are a plurality of electrodes on the upper surface of the plate-like circuit board 84, and solder portions 82 are provided on the pads 84a of the circuit board 84. Form.

  Next, in FIG. 22B, the electronic component 81 in which the solder bump 81b is bonded to the plurality of electrodes 81a on the bonding surface is sucked and held by the tool 83 on the back surface that does not have each electrode 81a. After aligning the solder bumps 81b of the electronic component 81 so that they can be joined to the solder portions 82 on the circuit board 84, the solder bumps 81b of the electronic component 81 are pressed against the solder portions 82 of the circuit board 84. Temporary joining is performed. When mounting a plurality of electronic components 81 on the circuit board 84, these operations are repeated, and each electronic component 81 is mounted on the circuit board 84. Here, the term “temporary bonding” refers to releasing the bonding between the electronic component 81 and the circuit board 84 without damaging the electronic component 81 and the circuit board 84 by applying an external force to the electronic component 81 or the circuit board 84. Shows possible joints.

  Thereafter, the circuit board 84 on which the electronic components 81 are temporarily bonded is conveyed to the solder reflow working unit. As shown in FIG. 22C, in the solder reflow working section, each electronic component 81 and circuit board 84 are heated by a heat source, and each solder section 82 and each solder bump 81b are melted. When a plurality of electronic components 81 are temporarily joined on the circuit board 84, the solder reflow working unit melts the solder all at once.

  After that, as shown in FIG. 22D, the circuit board 84 taken out from the solder reflow working unit is cooled and solidified by the melted solder, so that each electrode 81a of each electronic component 81 is connected to the circuit board 84. Each of the electronic components 81 is collectively mounted on the circuit board 84 by being joined to each pad 84a via solder. Here, the main bonding refers to bonding performed by applying heat to the electronic component 81 and the circuit board 84 in the temporary bonding state and melting the solder and then solidifying the electronic component 81 or the circuit board 84. By applying an external force, the bonding state is difficult to release easily.

  In such a batch reflow mounting method, after a large number of electronic components 81 are temporarily joined, the solder can be melted at once and each electronic component 81 can be finally joined to the circuit board 84 and mounted. Thus, the mounting cost of each electronic component 81 on the circuit board 84 can be suppressed.

  However, in such a method, after each electronic component 81 is temporarily joined to the circuit board 84, the solder is melted to perform the main joining, so that the circuit board 84 to which each electronic component 81 is temporarily joined is solder reflowed. It is necessary to transport the electronic component 81 to a part of the circuit board 84. When the solder is reflowed as it is, the circuit board 84 of the electronic component 81 is reflowed. There was a case where it becomes a bonding failure to. In electronic parts that do not require high joint position accuracy, such as general-purpose electronic parts, the joint position deviation that occurs in the batch reflow mounting method has not been a problem, but particularly high joint position precision is required. In electronic parts such as an IC chip, there has been a problem.

  As an example of a method for mounting electronic components by a conventional flip chip bonding method that solves such problems in the batch reflow mounting method, the solder is individually reflowed by applying pressure while heating the electronic components on a circuit board. FIG. 23 shows a method for mounting electronic components (hereinafter referred to as a conventional local reflow mounting method).

  As shown in FIG. 23A, cream solder is supplied by printing or the like onto the pads 94a which are a plurality of electrodes on the upper surface of the plate-like circuit board 94, and solder portions 92 are provided on the pads 94a of the circuit board 94. Form.

  Next, as shown in FIG. 23B, the electronic component 91 in which the solder bumps 91 b are bonded to the plurality of electrodes 91 a on the bonding surface is adsorbed by a tool 93 on the back surface that does not have the electrodes 91 a. After being held and aligned so that each solder bump 91 b of the electronic component 91 can be joined to each solder portion 92 on the circuit board 94, each solder bump 91 b of the electronic component 91 is placed on each solder portion 92 of the circuit board 94. Each solder part 92 and each solder bump 91b are melted by applying pressure while heating.

  Next, as shown in FIG. 23C, while the solder is in a molten state, the suction holding of the electronic component 91 by the tool 93 is released. Thereby, the self-alignment effect by the surface tension of molten solder will be acquired.

  Thereafter, as shown in FIG. 23D, the melted solder is solidified, whereby each electrode 91a of the electronic component 91 is joined to each pad 94a of the circuit board 94 via the solder, and the electronic component 91 is connected to the circuit. It is mounted on the substrate 94 individually. When a plurality of electronic components 91 are mounted on the circuit board 94, these operations are repeated, and each electronic component 91 is individually mounted on the circuit board 94.

  In such a local reflow mounting method, the electronic component 91 is sucked and held by the tool 93, and each solder bump 91b of the electronic component 91 is pressed by the tool 93 while being heated to each solder portion 92 of the circuit board 94. Since the holding of the electronic component 91 by the tool 93 is released during the molten state of the solder, a self-alignment effect due to the surface tension of the molten solder can be obtained, and even if the joining position accuracy of the electronic component 91 by the tool 93 is somewhat deteriorated. Due to the self-alignment effect, it is possible to obtain a bonding position accuracy that does not result in poor bonding.

  However, in an electronic component such as an IC chip, in a high-end electronic component in which the bump pitch is narrowed, the bump pitch becomes a narrow pitch of, for example, 150 μm or less. In an electronic component having such a narrow pitch bump, More than the self-alignment effect in the above-mentioned local reflow mounting method, the amount of displacement of the bonding position of the electronic component due to the vacuum break blow that occurs when releasing the suction holding to the electronic component during melting of the solder becomes a problem. A high bonding position accuracy, for example, a bonding position accuracy of ± 5 μm or less is required. Therefore, in the mounting method of the electronic component by the above local reflow mounting method that releases the adsorption holding to the electronic component by the tool during the molten state of the solder, it has such a narrow pitch bump and has a high bonding position. There was a problem that it could not cope with the mounting of high-end electronic components that required accuracy.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to solve the above-described problems, and provide an electronic component mounting method and mounting apparatus capable of mounting a high-end electronic component having a narrow pitch bump, and a general-purpose electronic component and a high-end electronic device. In the electronic component mounting method and mounting device on the circuit board on which the components are mixedly mounted, the mounting method of each electronic component is properly used according to the bonding position accuracy required for each electronic component, and both productivity and quality are achieved. An object is to provide a mounting method and a mounting apparatus for electronic components.

  In order to achieve the above object, the present invention is configured as follows.

According to the first aspect of the present invention, the electronic component having a plurality of electrodes is sucked and held by the component holding member,
Positioning the electrodes of the electronic component and the plurality of electrodes of the circuit board so that they can be bonded with a bonding material interposed therebetween,
Lowering the component holding member while adsorbing and holding the electronic component,
Detecting contact between each electrode of the electronic component and each electrode of the circuit board with a bonding material interposed therebetween;
After detecting the contact, the bonding material is heated and melted,
An electronic component mounting method characterized by cooling and solidifying.

  According to the second aspect of the present invention, the detection of the contact is a load actually generated at the time of contact between the electrodes of the electronic component and the electrodes of the circuit board through the bonding material. However, the electronic component mounting method according to the first aspect is detected by exceeding a contact load that is predicted to occur at the time of contact.

  According to the third aspect of the present invention, the detection of the contact is a load actually generated at the time of contact between the electrodes of the electronic component and the electrodes of the circuit board with the bonding material interposed therebetween. Accordingly, the component holding member is controlled to be slightly lowered, and the load actually generated at the time of the contact is controlled so as to exceed the contact load predicted to be generated at the time of the contact. The electronic component mounting method according to the first aspect or the second aspect is detected.

  According to a fourth aspect of the present invention, there is provided the electronic component according to any one of the first to third aspects, wherein after the bonding material is solidified, the suction holding to the electronic component by the component holding member is released. Provide an implementation method.

  According to a fifth aspect of the present invention, the bonding material is supplied in advance to at least one of the electrodes of the electronic component or at least one of the electrodes of the circuit board. An electronic component mounting method according to any one of the aspects is provided.

  According to a sixth aspect of the present invention, there is provided the electronic component mounting method according to any one of the first to fifth aspects, wherein the bonding material is solder.

  According to the seventh aspect of the present invention, any one of the first to sixth aspects, wherein flux is supplied in advance on each electrode of the electronic component, on each electrode of the circuit board, or on the bonding material. An electronic component mounting method according to any one of the above is provided.

  According to the eighth aspect of the present invention, the bonding material is a solder bump formed on each electrode of the electronic component, or a solder bump formed on each electrode of the electronic component and each of the circuit boards. An electronic component mounting method according to any one of the first to fourth aspects or the seventh aspect, which is a solder portion formed on an electrode, is provided.

According to the ninth aspect of the present invention, the contact between the electrodes of the electronic component and the electrodes of the circuit board through the bonding material is detected,
Judge whether to carry out correction of the amount of elongation of the component holding member due to the heating,
When correcting the elongation amount of the component holding member, the electrodes of the electronic component and the circuit board are raised while raising the component holding member based on the elongation change data of the component holding member due to the heating. In the case where the bonding material between the electrodes is melted by the heating and the amount of elongation of the component holding member is not corrected, the electrodes of the electronic component and the electrodes of the circuit board The bonding material between is melted by heating,
After the cooling start of the molten bonding material,
Judgment whether or not to perform the correction of the shrinkage amount of the component holding member by the cooling,
When the shrinkage amount of the component holding member is corrected, the electrodes of the electronic component and the circuit board are lowered while the component holding member is lowered based on the shrinkage amount change data of the component holding member due to the cooling. In the case where the bonding materials between the electrodes are solidified by the cooling, and the correction of the shrinkage amount of the component holding member is not performed, the electrodes of the electronic components and the electrodes of the circuit board An electronic component mounting method according to any one of the first to eighth aspects is provided, in which the bonding material between the two is solidified by cooling.

According to the tenth aspect of the present invention, the contact between the electrodes of the electronic component and the electrodes of the circuit board through the bonding material is detected,
Based on the change in elongation of the component holding member due to the heating, the bonding material between the electrodes of the electronic component and the electrodes of the circuit board is melted by the heating while the component holding member is raised. The electronic component mounting method according to any one of the first to eighth aspects is provided.

According to the eleventh aspect of the present invention, after the start of cooling of the molten bonding material,
Based on the shrinkage amount change data of the component holding member due to the cooling, the bonding material between the electrodes of the electronic component and the electrodes of the circuit board is solidified by the cooling while the component holding member is lowered. The electronic component mounting method according to any one of the first to eighth aspects is provided.

According to the twelfth aspect of the present invention, after detection of contact between the electrodes of the electronic component and the electrodes of the circuit board through the bonding material,
The load actually generated between the electrodes by the contact is maintained substantially constant,
After the start of melting of the bonding material by heating,
The electronic component according to any one of the first to eleventh aspects, wherein the maintenance of the load that is actually generated is released, and the contact height position of the electronic component to the circuit board is maintained substantially constant. Provide an implementation method.

  According to a thirteenth aspect of the present invention, there is provided mounting of the electronic component according to the twelfth aspect, wherein when the decrease in the load generated between the electrodes due to the contact is detected, the joining material starts to melt. Provide a method.

According to the fourteenth aspect of the present invention, after the electronic component is sucked and held by the component holding member,
After uniformizing the supply height of the bonding material supplied in advance on each electrode of the electronic component,
The electronic component according to any one of the first to thirteenth aspects, wherein the electronic component and the circuit board are aligned so that the electrodes of the electronic component and the electrode of the circuit board can be joined. Provide an implementation method.

According to a fifteenth aspect of the present invention, in the electronic component mounting method for mounting two types of electronic components, the first electronic component and the second electronic component, on the circuit board, the second electronic component is the first electronic component. When it is required to be mounted on the circuit board with higher bonding position accuracy,
The first electronic component is sucked and held by a component holding member,
The plurality of electrodes of the first electronic component and the plurality of electrodes of the circuit board are aligned so as to be bonded with a bonding material interposed therebetween,
The component holding member is lowered while the first electronic component is sucked and held, and the electrodes of the first electronic component and the electrodes of the circuit board are pressurized with the bonding material interposed therebetween to perform temporary bonding. After going
The bonding material between the electrodes of the first electronic components temporarily bonded and the electrodes of the circuit board is heated to melt, cooled, and solidified to perform the main bonding. The electrodes of the first electronic component and the electrodes of the circuit board are mounted with the bonding material interposed therebetween,
Thereafter, the second electronic component is the electronic component according to the first aspect, and has a plurality of electrodes that can be joined to the electrodes of the second electronic component, and the first electronic component is mounted on the second electronic component. An electronic component mounting method according to any one of the first aspect to the fourteenth aspect for mounting on a circuit board is provided.

According to the sixteenth aspect of the present invention, the electronic component is sucked and held by the component holding member, the plurality of electrodes of the electronic component and the plurality of electrodes of the circuit board are brought into contact with each other with the bonding material interposed therebetween, and the bonding material is In an electronic component mounting apparatus for heating and melting, and bonding the electrodes of the electronic component and the electrodes of the circuit board with the bonding material interposed therebetween,
An adsorption holding mechanism for adsorbing and holding the electronic component on the component holding member;
An elevating mechanism for lowering or raising the component holding member;
The component holding member that sucks and holds the electronic component by the suction holding mechanism is lowered by the lifting mechanism, and the electrodes of the electronic component and the bonding material of the electrodes on the circuit board are interposed. A load detector for detecting a contact load generated between the electrodes of the electronic component and the electrodes of the circuit board at the time of contact;
A heating mechanism for heating the bonding material;
A cooling mechanism for cooling the bonding material heated by the heating mechanism;
A controller for controlling the suction holding mechanism, the elevating mechanism, the load detecting unit, the heating mechanism, and the cooling mechanism;
The control unit is configured to melt the bonding material by heating by the heating mechanism after the detection of the contact load by the load detection unit, then cool and solidify the bonding material by the cooling mechanism, and Depending on the contact load detected by the load detection unit from the contact between the electrodes of the electronic component and the electrodes of the circuit board through the bonding material until the bonding material melts An electronic component mounting apparatus is provided that is configured to control the lifting and lowering operation of the component holding member by the lifting mechanism.

  According to the seventeenth aspect of the present invention, the contact load is detected by interposing the bonding material between the electrodes of the electronic component and the electrodes of the circuit board detected by the load detector. The electronic component mounting apparatus according to the sixteenth aspect is detected by the control unit when a load actually generated at the time of contact exceeds a contact load predicted to be generated at the time of contact.

  According to an eighteenth aspect of the present invention, the contact load is detected by interposing the bonding material between the electrodes of the electronic component and the electrodes of the circuit board detected by the load detector. The component holding member is slightly lowered by the lifting mechanism according to the load actually generated at the time of contact, and the load that is actually generated at the time of contact is predicted to be generated at the time of contact The electronic component mounting apparatus according to the sixteenth aspect or the seventeenth aspect detected by the control unit is provided.

  According to a nineteenth aspect of the present invention, the control unit maintains the electronic component adsorbing and holding the component holding member by the adsorbing and holding mechanism even during the melting of the bonding material by the heating mechanism, and the cooling mechanism. The control according to any one of the sixteenth aspect to the eighteenth aspect, wherein the electronic component is controlled to be released from being sucked and held on the component holding member by the suction holding mechanism after being solidified by cooling to the bonding material. An electronic component mounting apparatus is provided.

According to a twentieth aspect of the present invention, after the alignment of the electrodes of the electronic component and the electrodes of the circuit board through the bonding material, the electronic component is sucked and held. In the period until the component holding member descends,
The control unit provides the electronic component mounting apparatus according to any one of the sixteenth aspect to the nineteenth aspect, in which the load detected by the load detection unit is set as a load zero point in the load detection unit. .

According to the twenty-first aspect of the present invention, the electronic component is sucked and held by the component holding member, the plurality of electrodes of the electronic component and the plurality of electrodes of the circuit board are brought into contact with each other with the bonding material interposed therebetween, and the bonding material is In an electronic component mounting apparatus for heating and melting, and bonding the electrodes of the electronic component and the electrodes of the circuit board with the bonding material interposed therebetween,
An adsorption holding mechanism for adsorbing and holding the electronic component on the component holding member;
An elevating mechanism for lowering or raising the component holding member;
The component holding member that sucks and holds the electronic component by the suction holding mechanism is lowered by the lifting mechanism, and the electrodes of the electronic component and the bonding material of the electrodes on the circuit board are interposed. A load detector for detecting a contact load generated between the electrodes of the electronic component and the electrodes of the circuit board at the time of contact;
A heating mechanism for heating the bonding material;
A cooling mechanism for cooling the bonding material heated by the heating mechanism;
In the component holding member,
The component holding member includes a component holding member tip and a component holding member main body,
The tip part of the component holding member includes the suction holding mechanism, the heating mechanism, the cooling mechanism, and the shaft part.
The component holding member main body includes a support unit that supports the tip of the component holding member, and the load detection unit that is attached to the support unit.
The centers of the suction holding mechanism, the heating mechanism, the shaft portion, and the load detection portion are arranged coaxially, and the coaxial is arranged in parallel with the lifting operation axis of the component holding member by the lifting mechanism,
In the load detection unit, the end of the shaft portion at the tip of the component holding member is pressed against the load detection surface of the load detection unit by an elastic body attached to the support portion and supporting the shaft portion. Thus, it is possible to provide an electronic component mounting apparatus in which the load acting on the tip of the component holding member in the coaxial direction can be detected by the load detection unit.

According to a twenty-second aspect of the present invention, the component holding member further includes a pressurizing mechanism that pressurizes the electronic component against the circuit board,
The pressure mechanism includes two pneumatic cylinders having different inner diameters,
Of the pneumatic cylinders, one pneumatic cylinder is provided in the component holding member main body, and another pneumatic cylinder is provided in the tip of the component holding member.
By selecting and operating a pneumatic cylinder having an inner diameter suitable for the contact load from the pneumatic cylinders, the tip of the component holding member is lowered on the same axis, and is sucked and held by the suction holding mechanism. The component holding member is configured to have a pressurizing function for pressurizing the electrodes of the electronic component with the bonding material interposed between the electrodes of the circuit board,
Further, at least one of the pneumatic cylinders includes a limiting mechanism that mechanically limits the operation of the one pneumatic cylinder,
The limiting mechanism includes an empty cylinder provided with the limiting mechanism in a state where the pneumatic cylinder including the limiting mechanism presses the pneumatic cylinder not including the limiting mechanism to limit the operation of the pneumatic cylinder not including the limiting mechanism. The electronic component mounting apparatus according to the twenty-first aspect, in which the operation of each pneumatic cylinder is restricted by restricting the operation of the pressure cylinder, and the pressurizing function of the component holding member is restricted. To do.

According to the twenty-third aspect of the present invention, the limiting mechanism provided in the pneumatic cylinder including a cylindrical guide and a columnar rod disposed inside the guide includes:
A groove-like recess formed on the outer periphery of the cylindrical side surface of the rod;
A hole formed in a cylindrical side surface of the guide at a position that can match the concave portion of the rod;
A rod that passes through the hole of the guide and can be fitted inside the recess of the rod;
In the limiting mechanism, the rod body is allowed to pass through the hole of the guide from the outside of the guide, and the rod body is fitted inside the recess of the rod, thereby restricting the operation to the pneumatic cylinder. An electronic component mounting apparatus according to the twenty-second aspect is provided.

According to the twenty-fourth aspect of the present invention, of the two pneumatic cylinders having different inner diameters in the pressurizing mechanism, a large cylinder having a large inner diameter is provided in the component holding member main body, and the inner diameter is small. A small cylinder is provided at the tip of the component holding member,
The centers of the large cylinder and the small cylinder are arranged on the same axis,
The large cylinder includes the limiting mechanism;
In the component holding member main body, the guide of the large cylinder is attached to the end of the support part, and the rod of the large cylinder is attached to the load detection part,
A guide of the small cylinder is attached to the end of the shaft at the tip of the component holding member, and a rod of the small cylinder can come into contact with the load detection surface of the load detection unit. An electronic component mounting apparatus according to an aspect or a twenty-third aspect is provided.

  According to the first to third aspects of the present invention, each electrode of the electronic component sucked and held by the component holding member is brought into contact with each electrode of the circuit board with the bonding material interposed therebetween, and the bonding material is heated. When melting by the method, as in the conventional local reflow mounting method, the electrodes of the electronic component and the electrodes of the circuit board are simply pressed through the bonding material to melt the bonding material. Or the electrodes of the electronic component and the circuit instead of pressing the electrodes of the electronic component and the electrodes of the circuit board through the bonding material after melting by heating the bonding material. Since the bonding material is melted by heating after the contact of each electrode of the substrate with the bonding material interposed, the bonding material is still in a molten state at the time of the contact. Because of the above electronic components The load actually generated between each electrode and each electrode of the circuit board can be detected. Further, in the contact, the actually generated load detected can be detected at the time of the contact. It is possible to control so as to exceed the contact load predicted to be generated. Therefore, when multiple electronic components are repeatedly mounted on a circuit board, the load that is actually generated is controlled accurately so that it always exceeds the contact load that is expected to occur at the time of contact. The contact position of each electronic component when contacting the circuit board can be made more uniform, the distance between the electrodes of the electronic component is narrowed, and the accuracy of the bonding position to the circuit board is high. For an electronic component such as a high-end electronic component required to be mounted on the circuit board, the bonding position to the circuit board can be further stabilized.

  According to the fourth aspect of the present invention, after the contact between the electrodes of the electronic component attracted and held by the component holding member and the electrodes of the circuit board is detected, the contact state is detected. In the above, the bonding materials between the electrodes are melted by heating, and the timing of releasing the adsorption and holding to the electronic component by the component holding member is set during the melting of the bonding material as in the conventional local reflow mounting method. Rather than releasing, the above-mentioned bonding material is released after being melted and cooled and solidified. In other words, the electronic component is not mounted by obtaining the self-alignment effect due to the surface tension of the molten bonding material as in the conventional local reflow mounting method, but the electronic component is positioned at the contact position positioned by the component holding member. The component is mounted on the circuit board. Thereby, the joining position shift of the electronic component can be eliminated by the vacuum break blow generated when the electronic component is released from the suction holding to the electronic component. Therefore, an electronic device in which the pitch between the electrodes of the electronic component is narrowed so that the displacement of the bonding position of the electronic component due to the vacuum break blow in the component holding member becomes a problem rather than obtaining the self-alignment effect. The component can be mounted on the circuit board.

  According to the fifth to eighth aspects of the present invention, the bonding material supply method, the bonding material constituting material, or the flux supply method used in the conventional electronic component mounting method can be applied. It is possible to provide a versatile electronic component mounting method.

  According to the ninth aspect of the present invention, in addition to the effects of the above aspects, the detection of the abutment through the bonding material between the electrodes of the electronic component and the electrodes of the circuit board. Thereafter, it is determined whether to correct the amount of elongation of the component holding member due to the heating, and after the start of cooling of each of the melted bonding materials, the amount of contraction of the component holding member due to the cooling is corrected. Judgment of implementation is performed, and both the amount of extension and shrinkage of the component holding member are corrected according to the number of the electrodes of the electronic component and the joining accuracy required for the electronic component, or the amount of elongation is determined. Alternatively, it is possible to obtain the required joining quality of the electronic component by performing only one of the correction of the shrinkage amount or not performing the correction of the elongation amount and the shrinkage amount.

  According to the tenth aspect or the eleventh aspect of the present invention, by performing only one of the correction of the extension amount and the shrinkage amount, the required joining of electronic components is achieved in the same manner as the effect of the ninth aspect. Quality can be obtained.

  According to the twelfth aspect or the thirteenth aspect of the present invention, after detection of contact between the electrodes of the electronic component and the electrodes of the circuit board through the bonding material, the contact is performed. From the control method that maintains the load that is actually generated between the electrodes substantially constant, and then determines when the decrease in the load is detected as the start of melting of the bonding material, and maintains the load substantially constant. By switching to a control method in which the contact height position of the electronic component to the circuit board is maintained substantially constant, the contact height position of the electronic component is substantially constant even when the bonding material is melted. Can be maintained. Accordingly, when the bonding material is melted, the contact height position of the electronic component is lowered, so that the bonding material in the molten state can be prevented from being crushed. Even during melting, the contact height position of the electronic component can be reliably managed.

  Further, in the control system for maintaining the load substantially constant, the load is set to be equal to or higher than the contact load at the time of contact detection, and the load is applied to the electronic component and the circuit board while maintaining the load substantially constant. Thus, when contact between the electrodes of the electronic component and the electrodes of the circuit board through the bonding material is detected, due to variations in the formation height of the bonding material, Even when the contact between the electrodes is not partially performed by interposing the bonding material, the load is maintained between the electrodes and the bonding material by applying the load substantially constant. The contact property can be improved, and the reliability of joining the electronic component and the circuit board can be improved.

  According to the fourteenth aspect of the present invention, before the electronic component is brought into contact with the circuit board, the supply height of the bonding materials supplied in advance on the electrodes of the electronic component is made uniform. By performing the leveling operation to be performed, even when there is a variation in the supply height of each bonding material on each electrode of the electronic component, this variation is eliminated and the supply height of each bonding material is uniform. Can be done. Thereby, at the time of contact between the electrodes of the electronic component and the electrodes of the circuit board with the bonding material interposed, the contact load control due to the variation in the supply height of the bonding materials is achieved. The influence can be eliminated, the controllability of the contact load can be improved, and the contact load can be more evenly applied to each of the bonding materials. Therefore, each electrode of the electronic component and each electrode of the circuit board can be reliably brought into contact with a more uniform contact load by interposing a bonding material, and the bonding quality between the electronic component and the circuit board is stabilized. It becomes possible.

  According to the fifteenth aspect of the present invention, in the electronic component mounting method for mounting two types of electronic components, the first electronic component and the second electronic component, on the circuit board, the second electronic component is the first electronic component. In the case where it is required to be mounted on the circuit board with higher bonding position accuracy than the parts, the first electronic component is temporarily bonded to the circuit board by the conventional batch reflow mounting method. The circuit board on which the first electronic component is mounted after the bonded first electronic component and the circuit board are heated and mounted, and then the second electronic component is mounted by the electronic component mounting method of each aspect. Will be implemented on top.

  Accordingly, the first electronic component is individually temporarily bonded onto the circuit board, and then heated to melt the bonding material, and the first electronic component is finally bonded to the circuit board and mounted. Since the mounting operation can be performed efficiently, the mounting cost of the first electronic component on the circuit board can be suppressed.

  At the same time, the second electronic component, from the contact between the electrodes of the second electronic component and the electrodes of the circuit board through the bonding material, until solidification after melting of the bonding material, By adsorbing and holding the second electronic component by the component holding member, a displacement of the bonding position between the second electronic component and the circuit board does not occur, and the second electronic component is attached to the circuit board with high bonding position accuracy. Can be implemented.

  Accordingly, in the electronic component mounting method in the case where a plurality of electronic components having different joining position accuracy such as the first electronic component and the second electronic component are mixedly mounted on the circuit board, each required electron By properly using the mounting method of each electronic component according to the bonding position accuracy of the component, it becomes possible to achieve both productivity and bonding quality.

  According to the sixteenth to eighteenth aspects of the present invention, it is possible to provide an electronic component mounting apparatus that can obtain the effects of the first to third aspects.

  According to the nineteenth aspect of the present invention, it is possible to provide an electronic component mounting apparatus capable of obtaining the effects of the fourth aspect.

  According to the twentieth aspect of the present invention, after aligning the electrodes of the electronic component sucked and held by the sucking and holding mechanism of the component holding member so that they can be joined to the electrodes of the circuit board, The load detecting unit detects a pressing load that presses the shaft portion of the tip of the component holding member against the load detection surface of the load detecting unit by the elastic body, and the control unit controls the detected pressing load. And the control unit sets the pressure load as a load zero point in the load detection unit, so that the elastic body is affected by heat or the like, and its elasticity characteristic changes, and the load detection unit In this case, even when the pressing load due to the tip of the component holding member changes, the electrodes of the electronic component and the electrodes of the circuit board are brought into contact with each other through the bonding materials. Kicking actual contact load, there is no difference between the contact load detection value detected in the load detecting unit, it is possible to control the actual contact load in advance contact load as expected that was set. Therefore, when repeatedly mounting a plurality of electronic components on a circuit board, each electronic component can always be brought into contact with the circuit board with a preset contact load, and the electronic components can be joined to the circuit board. It becomes possible to stabilize the quality.

  According to the twenty-first aspect of the present invention, the centers of the suction holding mechanism, the shaft portion, and the load detection portion in the component holding member are arranged on the same axis, and the coaxial is the lifting operation shaft of the component holding member by the lifting mechanism. The suction holding mechanism, the shaft portion, and the load detection portion are moved up and down on the same axis, and further, in the component holding member, the shaft portion at the tip of the component holding member Is pressed against the load detection surface of the load detection section by an elastic body that is attached to the support section and supports the shaft section. The load acting in the direction can be detected, and each electrode of the electronic component sucked and held by the suction holding mechanism of the component holding member is in contact with each electrode of the circuit board via each bonding material. Due to the contact load generated between them, the end of the shaft portion of the tip of the component holding member is pressed against the load detection surface of the load detection unit, and the contact load is detected as the load detection. It becomes possible to detect reliably in the part.

  Therefore, by detecting the contact load in the load detection unit, it is possible to detect contact between the electrodes of the electronic component and the electrodes of the circuit board through the bonding materials. The actual abutment load can be more accurately controlled so that the component holding member is slightly lowered by the elevating mechanism and becomes a preset abutment load. Therefore, when repeatedly mounting a plurality of electronic components on a circuit board, the actual contact load can be accurately controlled so that the contact load is always set in advance. The contact position at the time of contact with the substrate can be made more uniform, the pitch between the electrodes of the electronic component is narrowed, and high-end electronic components that require high accuracy of the bonding position to the circuit board Such electronic components can be mounted on a circuit board by further stabilizing the bonding position to the circuit board.

  According to the twenty-second aspect of the present invention, the component holding member further includes a pressurizing mechanism including two pneumatic cylinders having different inner diameters. For example, the electronic component does not require high joining accuracy. For general-purpose electronic components, when mounting the general-purpose electronic components on a circuit board, select a pneumatic cylinder with an inner diameter suitable for the load to be used from the pneumatic cylinders, and supply compressed air to the pneumatic cylinders. By operating the pneumatic cylinder using the pressure of the compressed air that has been supplied by supplying air, the tip of the component holding member is lowered, and the general purpose is held by suction by the suction holding mechanism Each electrode of the electronic component can be pressurized with a bonding material interposed between each electrode of the circuit board. Therefore, the pneumatic cylinder is operated by the pressure of the compressed air, and general electronic components can be mounted at a high mounting speed by the conventional local reflow mounting method.

  At the same time, at least one pneumatic cylinder of the two pneumatic cylinders having different inner diameters is provided with a limiting mechanism that restricts the operation of the one cylinder, so that, for example, high joining accuracy is required for electronic components. When the high-end electronic component is mounted on the circuit board, compressed air is supplied to the pneumatic cylinder provided with the restriction mechanism in each pneumatic cylinder, and the pneumatic cylinder is By operating another pneumatic cylinder, the operation of the other pneumatic cylinder is restricted, and further, in this state, the operation of the pneumatic cylinder including the restriction mechanism is restricted by the restriction mechanism. The operations of the two pneumatic cylinders are restricted, and the component holding member tip and the component holding member are Each of the above component holding member body can be the state of integrated structure. As a result, the component holding member can be in the same structural state as the component holding member in the twenty-first aspect, and the contact load detection in the load detection unit is the same as the effect in the twenty-first aspect. Accordingly, it is possible to detect contact between the electrodes of the high-end electronic component and the electrodes of the circuit board through the bonding materials, and the component holding member is slightly lowered by the lifting mechanism. Thus, the actual contact load can be controlled more accurately so as to be a preset contact load. Therefore, when repeatedly mounting the plurality of high-end electronic components on the circuit board, the actual contact load can be accurately controlled so that the contact load is always set in advance. The contact position when the electronic component is in contact with the circuit board can be made more uniform, the interval pitch between the electrodes of the electronic component is narrowed, and high bonding position accuracy to the circuit board is required. It is possible to mount the electronic component such as a high-end electronic component on the circuit board by further stabilizing the bonding position to the circuit board.

  According to the twenty-third aspect of the present invention, the limiting mechanism includes a concave portion of a rod of a pneumatic cylinder provided with the limiting mechanism, a guide hole, and a rod body that can be fitted into the concave portion through the hole. By inserting the rod into the recess through the hole, it is possible to mechanically limit the operation of the pneumatic cylinder including the limiting mechanism with a simpler mechanism. Become.

  According to the twenty-fourth aspect of the present invention, the component holding member main body is provided with a large cylinder and the component holding member tip is provided with a small cylinder, thereby supporting the component holding member main body via the elastic body. The increase in weight due to the installation of the pneumatic cylinder at the front end of the component holding member can be suppressed, whereby a smaller contact load can be detected, and the actual contact load is set in advance. It is possible to perform control with high controllability so as to obtain a contact load.

1 is an overall perspective view of an electronic component mounting apparatus according to a first embodiment of the present invention. It is a figure which shows the mounting method of the electronic component concerning the said 1st Embodiment, (a) is sectional drawing of a circuit board, (b) is a cross section of an electronic component and a circuit board in the state which aligned the electronic component with the circuit board. FIG. 4C is a cross-sectional view of the electronic component and the circuit board in a contact state between the electronic component and the circuit board. FIG. 4D is a state in which each solder bump of the electronic component and each solder portion of the circuit board are heated and melted. Sectional view of electronic component and circuit board, (e) is a sectional view of the electronic component and the circuit board in a state where the molten solder is cooled, and (f) is a sectional view of the circuit board in a state where the electronic component is mounted. It is. It is sectional drawing of the head tool which showed typically the structure of the head tool in the electronic component mounting apparatus concerning the said 1st Embodiment. It is the flowchart which showed the mounting procedure in the mounting method of the electronic component concerning the said 1st Embodiment. It is the flowchart which showed the procedure in the case of performing the correction | amendment of the expansion amount and shrinkage | contraction amount of a head tool in the mounting method of the electronic component concerning the said 1st Embodiment. It is the flowchart which showed the procedure in the case of performing the load constant control of a head tool, and the front-end | tip position control of a suction nozzle in the mounting method of the electronic component concerning the said 1st Embodiment. It is the flowchart which showed the procedure of the contact load control operation | movement by the head tool in the mounting method of the electronic component concerning the said 1st Embodiment. It is the flowchart which showed the procedure of the contact load control operation | movement by the head tool in the mounting method of the electronic component concerning the said 1st Embodiment. It is a vibration operation | movement pattern figure of shaping operation by the head tool in the mounting method of the electronic component concerning the said 1st Embodiment. It is a time chart which shows each operation | movement of the head tool in the mounting method of the electronic component concerning the said 1st Embodiment, (a) is the control height of a head tool, (b) is the tip height of a suction nozzle, (c). These are time charts showing changes in the temperature of the suction nozzle over time. It is a control system diagram in the electronic component mounting apparatus concerning the said 1st Embodiment. It is the figure which showed the mounting method of the electronic component concerning 2nd Embodiment of this invention, (a) is sectional drawing of the circuit board in the state which forms the flux part in a circuit board, (b) is a general purpose electronic component A cross-sectional view of the circuit board in a state where the general-purpose electronic components are temporarily joined, (c) is a cross-sectional view of the circuit board in a state where general-purpose electronic components temporarily joined to the circuit board are reflowed, and (d) It is sectional drawing of the circuit board in the mounted state. It is the figure which showed the mounting method of the electronic component concerning the said 2nd Embodiment, (e) is sectional drawing of a circuit board in the state which forms the flux part in a circuit board, (f) is a circuit of a high-end electronic component. (G) is a cross-sectional view of the circuit board in a state where the high-end electronic component and the circuit board are brought into contact with the circuit board and the solder is heated and melted. h) is a cross-sectional view of a circuit board in a state where general-purpose electronic components and high-end electronic components are mounted. It is sectional drawing of the head tool which showed typically the structure of the head tool in the electronic component mounting apparatus concerning 3rd Embodiment of this invention. It is sectional drawing of the head tool which showed typically the structure of the head tool in the electronic component mounting apparatus concerning the said 3rd Embodiment. It is a whole perspective view of the electronic component mounting apparatus of the dual stage specification which is an electronic component mounting apparatus concerning 4th Embodiment of this invention. It is a whole perspective view of the electronic component mounting apparatus concerning 5th Embodiment of this invention. It is the figure which showed the mounting method of the electronic component of 1st Example in the mounting method of the electronic component concerning 5th Embodiment of this invention. It is the figure which showed the mounting method of the electronic component of the said 1st Example in the mounting method of the electronic component concerning the said 5th Embodiment. It is the figure which showed the mounting method of the electronic component of 3rd Example in the mounting method of the electronic component concerning 5th Embodiment of this invention. It is the figure which showed the mounting method of the electronic component of the said 3rd Example in the mounting method of the electronic component concerning the said 5th Embodiment. It is the figure which showed the mounting method of the electronic component by the conventional batch reflow mounting method. It is the figure which showed the mounting method of the electronic component by the conventional local reflow mounting method.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

  In the electronic component mounting method and mounting device according to the present invention, a plurality of electrodes of an electronic component are brought into contact with a plurality of electrodes of a circuit board with a bonding material interposed therebetween, and each bonding material is melted and solidified, The present invention relates to an electronic component mounting method and mounting apparatus for bonding an electronic component to a circuit board with a bonding material interposed therebetween. The electronic component mounting method and mounting apparatus according to the first embodiment of the present invention are described in detail with reference to the drawings. Explained.

  As shown in FIG. 1, in an electronic component mounting apparatus 201, a head tool 3 that is an example of a component holding member that mounts an electronic component is fixed to a nut portion of an X-direction moving mechanism 22, and the X-direction moving mechanism 22 rotates the ball screw shaft by a motor to move the head tool 3 fixed to the nut portion screwed to the ball screw shaft in the X1 direction to the right in the X direction in the drawing or the X2 direction to the left. As shown in FIG. 3, which is a schematic cross-sectional view of the head tool 3, the electronic component mounting apparatus 201 includes an elevating unit 21 that is an example of an elevating mechanism that lowers or raises the head tool 3. Further, the head tool 3 heats the suction nozzle 11 which is an example of a suction holding mechanism that sucks and holds the electronic component at the tip thereof, and the electronic component sucked and held by the suction nozzle 11 by heating the suction nozzle 11. A ceramic heater 12 as an example of a heating mechanism and a cooling blow nozzle 19 as an example of a cooling mechanism for cooling an electronic component heated by the ceramic heater 12 are provided. Here, as an example, the heating mechanism is the ceramic heater 12 provided in the head tool 3, but instead of the ceramic heater 12, a heating unit provided in a gantry unit on which a circuit board is arranged, or an electronic device The electronic component mounting apparatus may include a heating unit that heats the component and the circuit board by blowing hot air. A detailed description of the structure of the head tool 3 will be given later.

  In FIG. 1, the slide base 6 is fixed to the nut portion of the Y-direction moving mechanism 23, and the Y-direction moving mechanism 23 is fixed to the nut portion screwed to the ball screw shaft by rotating the ball screw shaft by a motor. The slide base 6 thus moved is moved in the Y1 direction facing right in the Y direction in the figure or the Y2 direction facing left. A plurality of electronic components 1 are supplied to a parts tray 5 fixed on the slide base 6, and the circuit board 4 is positioned and fixed on a stage 7 which is an example of a gantry unit fixed on the slide base 6. ing. Note that the X direction and the Y direction in FIG. 1 are orthogonal to each other.

  Furthermore, the electronic component mounting apparatus 201 includes a control unit 9 that is a control unit that controls each component in the electronic component mounting apparatus 201, and includes a moving operation of the elevating unit 21, a moving operation of the X-direction moving mechanism 22, The controller 9 controls the movement of the Y-direction moving mechanism 23, the suction holding operation of the suction nozzle 11 of the head tool 3, and the heating operation of the ceramic heater 12 of the head tool 3.

  FIG. 2 is a cross-sectional view of the electronic component 1 and the circuit board 4 schematically showing the electronic component mounting method according to the first embodiment. As shown in FIG. 2 (b), the rectangular plate-shaped electronic component 1 has a large number of electrodes 1a on the bonding surface, and solder bumps 1b, which are bonding materials, are formed in advance on each electrode 1a. . Further, as shown in FIG. 2A, the rectangular plate-like circuit board 4 has a plurality of pads 4a as electrodes on its upper surface, and solder as a bonding material is printed on each pad 4a by printing or the like. Solder portion 2 is formed in advance. Moreover, each pad 4a of the circuit board 4 is arrange | positioned in the position corresponding to each electrode 1a of the electronic component 1 so that each electrode 1a of the electronic component 1 and each pad 4a of the circuit board 4 can be joined. Here, the electronic component 1 is required to have high bonding position accuracy like a high-end IC chip in which the bump pitch, which is the interval pitch of the solder bumps 1b formed on each electrode 1a, is 150 μm or less. Such high-end electronic components.

  Next, a method for mounting the electronic component 1 on the circuit board 4 using the electronic component mounting apparatus 201 will be described.

  First, in FIG. 1, the slide base 6 to which the parts tray 5 on which the plurality of electronic components 1 are supplied and arranged is fixed is moved in the Y1 or Y2 direction by the Y direction moving mechanism 23, and the X direction moving mechanism. 22, the head tool 3 is moved in the X1 or X2 direction so that one electronic component 1 arranged in the parts tray 5 can be sucked by the suction nozzle 11 at the tip of the head tool 3. The tool 3 is aligned with the electronic component 1. Thereafter, the head tool 3 is lowered by the elevating unit 21, the back surface, which is a surface not having the electrodes 1 a of the electronic component 1, is sucked and held by the suction nozzle 11 of the head tool 3, and the head tool 3 is lifted by the lifting unit 21. The electronic component 1 is taken out from the parts tray 5. Here, the case where the electronic component 1 is arranged on the parts tray 5 with the back side up has been described. However, even if the electronic component 1 is arranged with the back side down, the head of the electronic component 1 is arranged. By providing a reversing mechanism for reversing the electronic component 1 before sucking and holding the tool 3 to the suction nozzle 11, the suction nozzle 11 can suck and hold the back surface of the electronic component 1. In addition, it may replace with supply of each electronic component 1 from the parts tray 5, and the case where each electronic component 1 is supplied from a wafer by providing a wafer supply part may be sufficient.

  Next, in FIG. 1, the slide base 6 that fixes the stage 7 to which the circuit board 4 is fixed is moved in the Y1 or Y2 direction by the Y-direction moving mechanism 23, and the electronic component 1 is sucked and held. The head tool 3 is moved in the X1 or X2 direction by the X-direction moving mechanism 22 so that the solder bumps 1b formed on the electrodes 1a of the electronic component 1 are formed on the circuit board 4 as shown in FIG. The electronic component 1 and the circuit board 4 are aligned so that they can be joined to the solder portions 2 on the pads 4a.

  After that, as shown in FIG. 2C, the head tool 3 is lowered by the elevating unit 21, and each solder bump 1 b of the electronic component 1 sucked and held by the suction nozzle 11 is fixed to the stage 7. It abuts on each solder part 2 of the substrate 4.

  After this contact, as shown in FIG. 2 (d), the suction nozzle 11 is heated by the ceramic heater 12 of the head tool 3, and each solder bump of the electronic component 1 held by the suction nozzle 11 is held. 1b and each solder portion 2 of the circuit board 4 in contact with each solder bump are heated. Further, the heating temperature of the suction nozzle 11 by the ceramic heater 12 is raised to a temperature not lower than the melting point of the solder forming each solder bump 1b and not lower than the melting point of the solder forming each solder portion 2, The solder bump 1b and each solder part 2 are melted.

  Thereafter, as shown in FIG. 2 (e), after the heating by the ceramic heater 12 is stopped, the molten solder is cooled by blowing from the cooling blow nozzle 19, whereby the solder is solidified and the electronic component 1 is Each electrode 1a and each pad 4a of circuit board 4 are joined together with solder interposed therebetween. Instead of forced cooling by the cooling blow nozzle 19 to the molten solder, the solder may be solidified by naturally cooling the molten solder.

  After that, as shown in FIG. 2 (f), the suction holding of the electronic tool 1 by the suction nozzle 11 at the tip of the head tool 3 is released, and the head tool 3 is raised by the elevating part 21. When mounting a plurality of electronic components 1 on the circuit board 4, these operations are repeated for each electronic component 1, and each electronic component 1 is mounted on the circuit board 4 individually.

  In the above description, the case where the bonding material is each solder bump 1b formed in advance on each electrode 1a of the electronic component 1 and each solder portion 2 formed in advance on each pad 4a of the circuit board 4 has been described. However, the bonding material may be only each solder bump 1b formed in advance on each electrode 1a of the electronic component 1.

  Further, the oxide film on the surface of each joint portion is removed and melted on each electrode 1a of the electronic component 1, or each pad 4a of the circuit board 4, or each solder bump 1b or each solder portion 2 as a joining material. A flux capable of improving the solder wettability may be supplied in advance by coating. Depending on the type of flux supplied and supplied, the electronic component 1 may be mounted on the circuit board 4 and then the supplied and supplied flux may be removed by washing.

  Next, the structure of the head tool 3 in the electronic component mounting apparatus 201 will be described in detail with reference to FIG. 3 which is a cross-sectional view schematically showing the structure of the head tool 3.

  In FIG. 3, the head tool 3 includes a head tool tip 3 a that performs operations such as suction holding and heating to the electronic component 1, and a head that supports the head tool tip 3 a and is moved up and down with respect to the head tool 3. It is comprised by the tool main-body part 3b.

  From the tip side, the head tool tip portion 3 a is provided with a suction nozzle 11 capable of sucking and holding the electronic component 1, a ceramic heater 12 for heating the electronic component 1 sucked and held by the suction nozzle 11, and the ceramic heater 12. The water jacket 13 is a cooling unit that cuts off heat so that the heat is not transmitted to the head tool body 3b, and the shaft 17 is an example of a shaft portion attached to the upper portion of the water jacket 13. A cooling blow nozzle 19 for cooling the electronic component 1 heated by the ceramic heater 12 by blowing is attached around the lower portion of the shaft 17.

  The head tool main body 3b includes a frame 16 that is an example of a support that supports the head tool tip 3a, and a load cell 14 that is an example of a load detection unit attached to the frame 16.

  The frame 16 has a substantially U-shape formed by a rigid body, and an upper frame 16a that supports the load cell 14 and a shaft 17 of the head tool tip 3a are arranged on a side of the shaft 17. A lower frame 16b that supports a self-weight canceling spring 15 as an example of an elastic body attached to the lower portion of the projecting spring receiving portion 18 so as to wind the outer periphery of the shaft 17 and guides the vertical movement of the shaft 17; It is constituted by a cylindrical intermediate frame 16c that supports the upper frame 16a and the lower frame 16b.

  The shaft 17 has a step portion 17c near the middle in the axial direction, and the shaft lower portion 17b of the shaft 17 has a smaller diameter than the shaft upper portion 17a with the step portion 17c as a boundary. Further, the shaft lower portion 17b passes through a hole 16d formed in the lower frame 16b that supports the shaft 17 via a self-weight canceling spring 15, and the hole 16d of the lower frame 16b moves up and down the shaft 17. Is formed so as to be smaller than the diameter of the shaft upper portion 17a of the shaft 17. Thus, the shaft 17 can be moved up and down while being supported by the lower frame 16b via the self-weight canceling spring 15 and guided by the hole 16d of the lower frame 16b. Even when it becomes impossible to support 17, the periphery of the hole 16 d of the lower frame 16 b can support the shaft 17 by the stepped portion 17 c of the shaft 17, and the shaft 17 does not fall. .

  Further, the shaft lower portion 17b includes a ball spline outer ring and a shaft, the lower frame 16b includes a bearing inside the hole 16d, and the ball spline outer ring is attached to the inside of the bearing, whereby the shaft 17 While being supported by 16b, it is possible to rotate about the axis and to move up and down in the axial direction.

  Moreover, the both ends of the cylindrical shape of the intermediate frame 16c are fixed to the nut part 21b of the elevating part 21, and the ball screw shaft 21a screwed to the nut part 21b in the elevating part 21 is rotated by the motor 21m. The intermediate frame 16c is moved up and down, whereby the frame 16 is moved up and down, and the entire head tool 3 is moved up and down.

  The centers of the suction nozzle 11, the ceramic heater 12, the water jacket 13, the shaft 17, and the load cell 14 are arranged on the same axis, and this shaft is arranged to be parallel to the lifting operation axis of the lifting unit 21. Therefore, the suction nozzle 11, the ceramic heater 12, the water jacket 13, the shaft 17, and the load cell 14 can be moved up and down on the same axis by the lifting operation by the lifting unit 21.

  Further, on the lower surface which is the load detection surface of the load cell 14, the upper end of the shaft 17 at the head tool tip 3 a is attached to the lower frame 16 b by the self-weight canceling spring 15 supporting the shaft 17 via the spring receiving portion 18. The load that is pressed and in contact with the load cell 14 can detect a load that acts upward on the shaft 17 of the head tool tip 3a.

  Moreover, the cooling blow nozzle 19 attached to the periphery of the lower shaft portion 17b that is the lower periphery of the shaft 17 is formed so as to go around both sides of the water jacket 13 and the ceramic heater 12 positioned under the shaft 17, The tip of the cooling blow nozzle 19 is directed to the electronic component suction holding surface which is the lower surface of the suction nozzle 11, and the electronic component 1 sucked and held by the suction nozzle 11 can be cooled by the blow from the cooling blow nozzle 19. Yes.

  The control unit 9 controls the suction operation of the suction nozzle 11, the heating operation of the ceramic heater 12, and the movement operation of the elevating unit 21 so that the load detected by the load cell 14 is output to the control unit 9. It is configured.

  Here, a control system diagram in the electronic component mounting apparatus 201 is shown in FIG. In the electronic component mounting apparatus 201, the control unit 9 performs an elevating operation by the motor 21 m of the elevating unit 21 that is an operation of each component of the electronic component mounting apparatus 201, a heating operation of the ceramic heater 12, a cooling operation of the cooling blow nozzle 19, The suction operation of the suction nozzle 11, the movement operation by the motor of the X-direction movement mechanism 22, and the movement operation by the motor of the Y-direction movement mechanism 23 are controlled, and the load detected by the load cell 14 is output to the control unit 9. The As a result, the above-described components, which are controlled parts of the control unit 9, are controlled while being associated with each other by the control unit 9, whereby the electronic component mounting apparatus 201 mounts the electronic component 1 on the circuit board 4. Is given.

  Next, a method for detecting a contact load generated when the electronic component 1 and the circuit board 4 are in contact with the load cell 14 in the head tool 3 will be described.

  After alignment of the electronic component 1 and the circuit board 4, the head tool 3 is lowered by the elevating unit 21 while the electronic component 1 is held by suction by the suction nozzle 11, and each solder bump 1 b of the electronic component 1 is moved to each circuit board 4. It contacts the solder part 2. At this time, a contact load is generated between each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4, and this contact load is in contact with the load detection surface of the load cell 14 of the head tool 3. The upper end of the shaft 17 of the head tool tip 3 a located above pushes up the load detection surface of the load cell 14, and this contact load is detected by the load cell 14.

  By detecting the contact load in the load cell 14 in this way, it is detected that each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 are in contact, and the contact detected by the load cell 14 is detected. The contact load is output to the control unit 9, and the lifting unit 21 is controlled by the control unit 9 so that the contact load set in advance by the control unit 9 is lowered, and the head tool 3 is lowered by a minute amount by the lifting unit 21. The elevating unit 21 is controlled so that the contact load detected by the load cell 14 becomes a preset contact load.

  The electronic component mounting method according to the first embodiment configured and implemented by the mounting procedure as described above (hereinafter, since each electronic component is individually melted or reflowed, this is referred to as the first embodiment. The implementation procedure is summarized in the flowchart shown in FIG. The operation instruction in each step is performed by the control unit 9.

  In step SP1 in FIG. 4, the electronic component 1 is sucked and held by the head tool 3, and in step SP2, it is formed on each solder bump 1b formed on each electrode 1a of the electronic component 1 and each pad 4a on the circuit board 4. The electronic component 1 and the circuit board 4 are aligned so that each solder part 2 can be joined. Thereafter, in step SP3, the head tool 3 is lowered while the electronic component 1 is sucked and held. In step SP4, the contact of each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 is determined. The load cell 14 detects this. Further, in step SP5, the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are melted by heating the electronic component 1 by the ceramic heater 12 of the head tool 3. Thereafter, in step SP6, the melted solder starts to be cooled by blowing the cooling blow nozzle 19, and in step SP7, the melted solder is solidified, and each electrode 1a of the electronic component 1 is replaced with each pad 4b of the circuit board 4. Are joined with solder. Thereafter, in step SP8, the suction holding to the electronic component 1 by the head tool 3 is released. When mounting a plurality of electronic components 1 on the circuit board 4, the steps SP <b> 1 to SP <b> 8 are repeated for each electronic component 1 to mount each electronic component 1. The melted solder may be cooled in step SP6 by natural cooling instead of cooling by the cooling blow nozzle 19.

  Next, the correction operation in the case where the amount of expansion / contraction due to heat of the head tool 3 is corrected will be described.

  After the solder bumps 1b of the electronic component 1 and the solder parts 2 of the circuit board 4 are brought into contact with each other, the suction nozzle 11 is heated by the ceramic heater 12 of the head tool 3 to melt the solder bumps 1b and the solder parts 2. In this case, in the head tool 3, at least the head tool tip 3a is affected by the heat from the ceramic heater 12 and extends in the up-down direction. The portion 3a is shrunk in the vertical direction. Due to the vertical expansion and contraction of the head tool tip 3a, each electrode of the circuit board 4 is brought into contact between the solder bumps 1b of the electronic component 1 and the solder parts 2 of the circuit board 4 until the bonding. It is difficult to keep the height of the back surface of the electronic component 1 in contact with each electrode 1a by interposing each solder portion 2 and each solder bump 1b in 4a. Depending on the required joining accuracy, it may be difficult to stabilize the joining quality of the electronic component.

  For the purpose of reliably managing the height of the back surface of the electronic component 1 in this way, data on changes in the amount of expansion and contraction due to the heat of the head tool tip 3a is set in the memory in the control unit 9 in advance. The ceramic heater 12, the elevating unit 21, and the cooling blow nozzle 19 are controlled by the unit 9. During the heating by the ceramic heater 12, the elevating unit 21 performs the heating based on the change data of the head tool tip 3 a due to the heating. The head tool 3 is gradually raised, and after the heating by the ceramic heater 12 is stopped, during the cooling by the cooling blow nozzle 19, the head tool 3 is moved by the elevating unit 21 based on the change data of the shrinkage amount of the head tool tip 3 a due to the cooling. Is gradually lowered to correct the amount of expansion and contraction of the head tool tip 3a due to heat. As a result, the height of the back surface of the electronic component 1 sucked and held by the suction nozzle 11 of the head tool 3 between the contact between the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 is obtained. Can be kept constant. The correction of the amount of extension or the amount of contraction due to the heat of the head tool 3 is performed for the required joining accuracy of the electronic component 1 to the circuit board 4 and each solder bump 1b formed on each electrode 1a of the electronic component 1. It may be a case where it is determined whether or not to carry out according to the number of and only either the correction of the expansion amount or the correction of the shrinkage amount is performed.

  The procedure of the correction operation of the extension amount and the shrinkage amount of the head tool 3 by the heat configured as described above is summarized as shown in FIG. FIG. 5 is a flowchart showing the mounting procedure of the electronic component mounting method according to the embodiment shown in FIG. 4, and steps related to the correction operation of the amount of expansion and contraction of the head tool 3 due to heat between steps SP4 and SP7. It is a flowchart which shows the procedure of the correction | amendment operation | movement which added. The operation instruction and determination in each step are performed by the control unit 9.

  In step SP4 in FIG. 5, after the contact between each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 is detected, the temperature of the suction nozzle 11 is increased by heating the ceramic heater 12 in step SP10. Is started. Next, in step SP11, it is determined whether or not to correct the extension amount of the head tool 3 by heat. When performing extension amount correction, it is determined in step SP12 whether or not to wait for the extension amount correction start of the head tool 3, and when waiting for extension amount correction start, in step SP13, the head tool 3 is set for the set time. If the extension correction start is set to the standby state and the extension correction start wait is not performed, step SP13 is not performed. Next, in step SP14, the head is changed based on the expansion change data of the head tool 3 due to heat. In step SP5, the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are melted by heating the ceramic heater 12 while the tool 3 is gradually raised. Note that the standby operation for starting the extension amount correction of the head tool 3 in step SP13 is replaced with the case where the head tool 3 waits for the set time as described above, and the temperature of the suction nozzle 11 heated by the ceramic heater 12 exceeds the set temperature. It may be a case of making it wait.

  On the other hand, if the elongation amount correction is not performed in step SP11, step SP5 is performed without performing steps from step SP12 to SP14.

  Thereafter, in step SP6, cooling of the melted solder is started. Next, in step SP15, it is determined whether or not to perform the shrinkage correction of the head tool 3 by cooling. When performing the shrinkage correction, it is determined in step SP16 whether or not to wait for the shrinkage correction start of the head tool 3, and when waiting for the shrinkage correction start, in step SP17, the head tool 3 is set for the set time. When the shrinkage amount correction start is set to the standby state and the shrinkage amount correction start wait is not performed, step SP17 is not performed. Next, in step SP18, the head tool is based on the shrinkage amount change data of the head tool 3 due to cooling. In step SP7, the solder melted by cooling is solidified while gradually lowering 3. Note that the standby operation for starting the correction of the shrinkage amount of the head tool 3 in step SP17 is performed instead of the standby operation for the set time as described above, and the temperature of the suction nozzle 11 heated by the ceramic heater 12 falls below the set temperature. It may be a case of making it wait.

  On the other hand, when the contraction amount correction is not performed in step SP15, step SP7 is performed without performing the steps from step SP16 to SP18.

  Next, after contact detection between each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4, constant control of the contact load by the head tool 3 is performed, and each solder bump 1b and each solder portion 2 is controlled. A case where the tip position of the suction nozzle 11 is controlled after melting will be described.

  After detecting contact between each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4, the elevating unit 21 is set so that the contact load detected by the load cell 14 becomes a preset contact load. Controlled by the control unit 9, a constant load is applied to the electronic component 1 and the circuit board 4 by the head tool 3, and a state of constant load control by the head tool 3 is brought about. However, when the suction nozzle 11 is heated by the ceramic heater 12 and the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are melted, the head tool 3 is in a state of constant load control as described above. If it remains as it is, the tip position of the suction nozzle 11 is lowered, and there is a problem that each solder bump 1b and each solder part 2 in a molten state are excessively crushed.

  In order to solve such a problem, the purpose is to surely manage the height of the back surface of the electronic component 1 after melting of each solder, that is, the position of the contact height of the electronic component 1 on the circuit board 4. Then, after the temperature of the suction nozzle 11 starts to rise by being heated by the ceramic heater 12, the load is controlled by the load cell 14 and the load is detected by the head tool 3, and the decrease of the detected load is detected. By determining that each solder starts melting and switching from the above constant load control of the head tool 3 to a position control in which the tip height position of the suction nozzle 11 is made constant, the suction nozzle 11 is also melted when each solder is melted. Therefore, the height of the back surface of the electronic component 1 can be reliably managed.

  The procedure of the constant load control of the head tool 3 configured as described above and the tip height position control of the suction nozzle 11 are summarized as shown in FIG. FIG. 6 is a flowchart showing the mounting procedure of the electronic component mounting method according to the embodiment shown in FIG. 4. During steps SP4 to SP6, constant load control of the head tool 3 and the tip height position of the suction nozzle 11 are shown. It is a flowchart which shows the procedure of the operation | movement of control. The operation instruction and determination in each step are performed by the control unit 9.

  First, in step SP4 in FIG. 6, contact between each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 is detected, and then in step SP10, the suction nozzle 11 is heated by heating the ceramic heater 12. Temperature rise starts. Next, in step SP5a, the descent operation of the elevator unit 21 is finely controlled, so that the constant load control of the head tool 3 is performed, and the constant load is applied to the electronic component 1 and the circuit board 4 by the head tool 3. Will be applied. During this constant load control, the load actually generated in the load cell 14 is detected. In step SP5b, a decrease in the detected load is detected due to a decrease in the load detected in the load cell 14. In step SP5c, the control method is switched from the constant load control of the head tool 3 to the constant control of the tip height position of the suction nozzle 11 in step SP5c. In step S5e, the height of the back surface of the electronic component 1 held by suction by the suction nozzle 11 whose tip height is constant is constant. Until the temperature rise of the suction nozzle 11 due to the heating stop is completed, Constant control of the position is performed. When the temperature increase of the suction nozzle 11 is completed in step SP5e, cooling of each molten solder is started in step SP6.

  If no decrease in the load detected in the load cell 14 is detected in step SP5b, it is determined that melting of each solder has not yet started, and in step SP5f, the suction nozzle 11 due to the heating stop of the ceramic heater 12 is determined. It is determined whether or not the temperature increase has been completed. If it has not been completed, the process returns to step SP5a again, and the constant load control of the head tool 3 is continued. In step SP5f, when the temperature rise of the suction nozzle 11 due to the heating stop of the ceramic heater 12 is completed, the constant load control of the head tool 3 is changed to the constant control of the tip height position of the suction nozzle 11 in step SP5g. The control method is switched, and in step SP5h, the height of the back surface of the electronic component 1 held by suction by the suction nozzle 11 whose tip height position is constant is constant, and in step SP6, the molten solder is cooled. Is started.

  In step SP4, when contact between each solder bump 1b of the electronic component 1 and each solder portion of the circuit board 4 is detected, each of the solder bumps 1b and each solder portion 2 has a variation in formation height. In some cases, the solder bump 1b and each solder 2 are not partially contacted. For example, the electronic component 1 has a large number of bumps of 1000 bumps or more. In such a case, when the electronic component 1 is heated as it is, the solder portions 2 that are not in contact with each other are not thermally conducted from the solder bumps 1b, so that there is a problem that they are not melted.

  For such a problem, in the constant load control of the head tool 3 in step SP5a, this constant load is set as a load equal to or higher than the contact load at the time of contact detection, and this load is controlled to be constant. When the contact between the solder bumps 1b of the electronic component 1 and the solder parts of the circuit board 4 is detected by applying the solder bumps 1 and the circuit board 4 as described above, the solder bumps 1b and the solder parts 2 are detected. Even if there is a case where some of the solder bumps 1b and each of the solders 2 are not partially contacted due to the variation in the formation height of each solder, the solder is applied by applying the constant load. The contact between the bump 1b and each solder part 2 can be improved, and all the solder can be reliably melted.

  Next, the case where the load zero point of the load cell 14 of the head tool 3 is set will be described.

  The heat of the ceramic heater 12 of the head tool 3 is transferred from each component of the head tool 3 or through the ambient air of the head tool 3, so that the spring receiving portion 18 of the shaft 17 at the head tool tip 3 a. The self-weight canceling spring 15 attached to the body is affected by heat and its spring characteristics change. As a result, the pressing load on the load cell 14 that is generated when the self-weight canceling spring 15 whose spring characteristics have changed presses the shaft 17 against the load detection surface of the load cell 14 changes. Further, the pressing load by the self-weight canceling spring 15 in the load cell 14 also changes as the spring characteristic of the self-weight canceling spring 15 changes with time depending on the usage period of the head tool 3. Due to the change in the pressing load on the load cell 14 due to the change in the spring characteristics of the self-weight canceling spring 15, the actual contact load at the time of contact between each solder bump 1 b of the electronic component 1 and each solder part 2 of the circuit board 4, There is a problem that a difference occurs between the contact load detection values detected by 14 and the actual contact load cannot be controlled in accordance with a preset contact load.

  In such a case, after the electronic component 1 attracted and held by the head tool 3 is aligned so as to be bonded to the circuit board 4, the head tool tip 3 a is in a non-contact state between the electronic component 1 and the circuit board 4. Is detected by the load cell 14, and the detected pressure load is output to the control unit 9, and the control unit 9 applies this pressing force to the load 17. The load is set as the load zero point in the load cell 14. Thereafter, the head tool 3 is lowered to mount the electronic component 1 on the circuit board 4, and all these operations are controlled by the control unit 9.

  Thus, even when the self-weight canceling spring 15 changes its spring characteristics due to the influence of heat or aging, even if the pressing load by the shaft 17 at the head tool tip 3a changes in the load cell 14, the electronic component 1 Each time the positioning of the circuit board 4 and the circuit board 4 is performed, the pressing load detected by the control unit 9 is set as a load zero point in the load cell 14, whereby each solder bump 1 b of the electronic component 1 and each solder of the circuit board 4 are set. The difference between the actual contact load at the time of contact of the portion 2 and the contact load detection value detected by the load cell 14 is eliminated, and the actual contact load is controlled according to the preset contact load. Can do.

  Next, the head tool 3 is moved up and down by detecting the contact load at the time of contact between each solder bump 1b of the electronic component 1 and each solder part 2 of the circuit board 4 by the head tool 3 by the load cell 14 of the head tool 3. A method of controlling the operation and controlling the contact load to be set in advance will be described based on the contact load control operation flowchart shown in FIGS. The operation instruction and determination in each step are performed by the control unit 9.

  After the alignment between the electronic component 1 and the circuit board 4 is performed, the head tool 3 holding the electronic component 1 by suction is started to descend by the elevating unit 21 in step SP3. While the head tool 3 is descending, it is determined in step SP21 whether or not the preset contact load exceeds 450 g. If it exceeds 450 g, the initial detection load due to contact is set to 200 g in step SP22. If it is 450 g or less, the initial detected load due to contact is set to 100 g in step SP23. Next, in step SP24, when the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 come into contact with each other and the set initial detection load is detected by the load cell 14, the descending operation is performed in step SP25. The head tool 3 that has been stopped is stopped, the head tool 3 is put into an operation standby state for 200 ms, and a minute overshoot after the stop operation of the head tool 3, that is, an instruction to stop the descent operation to the head tool 3 by the control unit 9 Thereafter, the head tool 3 is brought into a static state in order to eliminate the influence on the detected load of the load cell 14 due to the descent speed being lowered by a small amount before the descent speed is decelerated and stopped.

  Next, in step SP26, it is determined whether or not the current load detected by the load cell 14 exceeds a preset contact load −100 g, and how close the current load is to the preset contact load. Is determined.

  In step SP26, if the current load exceeds a preset contact load of −100 g, after the head tool 3 has settled for 200 ms in step SP27, the current load is further increased in step SP28. Is determined to be greater than or equal to a preset contact load −50 g, and if the current load is less than the preset contact load −50 g, the head tool 3 is moved by the elevating unit 21 in step 29. After lowering by 1 μm, after passing through the static state of the head tool 3 for 200 ms in step SP27, it is determined again in step SP28 whether the current load is a preset contact load of −50 g or more. This operation loop is repeated until the current load becomes a preset contact load of −50 g or more.

  In step SP28, if the current load is equal to or greater than a preset contact load of −50 g, in step SP30, the static state of the head tool 3 is maintained for a preset time, and the electronic component 1 is Control of the contact load between each solder bump 1b and each solder portion 2 of the circuit board 4 to a preset contact load is completed, and in step SP4, each solder bump 1b of the electronic component 1 and the circuit board 4 are completed. That is, contact with each solder part 2 is detected. Here, it is predicted that a preset contact load of −50 g, which is a determination criterion in step SP28, is generated at the time of contact between each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4. The present load, which is a contact load that is actually generated at the time of contact, is equal to or greater than the contact load that is predicted to be generated at the time of contact, so that substantially all of the electronic component 1 is The solder bumps 1b and almost all the solder portions 2 of the circuit board 4 are brought into contact with each other, and the contact is detected.

  In step SP26, if the current load is equal to or less than the preset contact load −100 g, whether or not the current load exceeds the preset contact load −500 g in step SP31. If it is determined that it does not exceed, it is further determined in step SP32 whether or not the current load exceeds a preset contact load of −1000 g. In step SP32, if the current load is equal to or less than a preset contact load of −1000 g, the difference in load between the current load and the preset contact load is determined as the movement of the head tool 3 in step SP33. Converted to distance. If the current load satisfies the condition in step SP31, the moving distance of the head tool 3 is 1 μm in step SP34, and if the current load satisfies the condition in step SP32, the head tool 3 is determined in step SP35. Is set to 2 μm. Thereafter, in step SP36, the head tool 3 is lowered by the lifting / lowering unit 21 by the moving distance of the head tool 3 in each of the above cases, and in step SP37, the head tool 3 is stopped, and the static state for 50 ms is maintained. Kept. Thereafter, in step SP26 again, it is determined whether or not the current load exceeds a preset contact load −100 g, and these operation loops are repeated until the condition of step SP26 is satisfied.

  In the contact load control method implemented by each operation as described above, the head tool 3 is controlled to perform a minute descent operation. Each movement distance of the head tool 3 under each operation condition is determined by the head tool 3. 3 is set based on the relationship between the minimum movable distance in the vertical direction by the three lifting parts 21 and the load per head tool unit movement that can be generated by this minimum movable distance. In the case of the above embodiment, the minimum movable distance is 1 μm, and the load per unit movement of the head tool is 100 g / μm. Therefore, for example, 100 g, which is the difference between the preset contact load and the current load, which is the condition in step SP26, is set from the load per head tool unit movement. In step SP29, step SP34, and step SP35, 1 μm and 2 μm, which are the movement distances of the head tool 3, are set from the minimum movable distance, respectively.

  The numerical values such as the load, time, and distance in the above are numerical values as examples in the present embodiment, and the present embodiment is not limited to these numerical values.

  Next, the case where the shaping operation of each solder bump 1b of the electronic component 1 by the head tool 3 is performed will be described.

  After the solder bumps 1b of the electronic component 1 and the solder parts 2 of the circuit board 4 are brought into contact with each other, the suction nozzle 11 is heated by the ceramic heater 12 of the head tool 3 to melt the solder bumps 1b and the solder parts 2. When this is done, the melted solder bumps 1b and the solder portions 2 are soldered to each other by causing the head tool 3 holding the electronic component 1 by suction to vibrate slightly in the vertical or horizontal direction. This improves the wettability of the electronic component 1 and improves the bonding quality between the electronic component 1 and the circuit board 4. As shown in FIG. 9, the vibration operation pattern of the shaping operation by the head tool 3 includes patterns such as a cross shape, an O shape, and an 8-character shape used in a conventional electronic component mounting method. . Further, as parameters of each vibration operation in the shaping operation by the head tool 3, as an example, the number of up and down operations of the shaping operation for moving the head tool 3 up and down by the shaping operation is 0 to 20 times as an example. The operation speed is 0.1 to 9.9 sec as an example, the operation amount that is the movement amount for moving the head tool 3 up and down by the shaping operation is -99 to 99 μm as an example, and the shaping vibration that vibrates the head tool 3 in the XY direction by the shaping operation As an example, the number of operations is 0 to 200 times.

  Next, when the operations of the head tool 3 described above are combined and electronic components are mounted on a circuit board, FIG. 10A shows the control height of the head tool 3, and FIG. FIG. 10C shows a time chart showing a change state of the tip height of the suction nozzle 11 of the head tool 3 and the temperature of the suction nozzle 11 of the head tool 3 with time. Here, the control height of the head tool 3 is a relative elevation control height position of the head tool 3 by the elevation unit 21, and the tip height of the suction nozzle 11 of the head tool 3 is relative to the suction nozzle 11. The tip height position is shown. In addition, the time axes that are the horizontal axes in FIGS. 10A to 10C are the same time axes so that the change states can be compared.

First, from the time starting point t0 to t1 in FIGS. 10A to 10C, the control height of the head tool 3 and the tip height of the suction nozzle 11 are the same as the head tool 3 is lowered by the elevating unit 21. It descends in a change state. At this time, since the heating by the ceramic heater 12 has not been started yet, the temperature of the suction nozzle 11 is kept constant.

  Next, from time t1 to t2, the electronic component 1 and the circuit board 4 come into contact with each other at time t1, and the heating of the suction nozzle 11 is started by the ceramic heater 12, and the temperature of the suction nozzle 11 is raised. Since the extension operation of the head tool 3 is corrected by this temperature rise, the control height of the head tool 3 is raised as set in advance, and the head tool 3 subjected to the extension correction operation is moved to the suction nozzle 11. The tip height is constant. The melting of the solder is started in the section from this time t1 to t2.

  Next, from time t2 to t4, the temperature of the suction nozzle 11 is controlled by heating of the ceramic heater 12, and is kept at a constant temperature. Further, the control height of the head tool 3 and the tip height of the suction nozzle 11 are both kept constant. However, since the solder bumps 1b of the electronic component 1 are shaped by the head tool 3 from the time t2 to the time t3, the head tool 3 performs a minute vibration operation, the control height of the head tool 3, and the head tool. The tip heights of the three suction nozzles 11 are slightly raised and lowered.

  Next, from time t4 to t5, cooling of the molten solder is started, and the temperature of the suction nozzle 11 is lowered. Since the shrinkage correction operation of the head tool 3 by this cooling is performed, the control height of the head tool 3 is lowered as set in advance, and the head tool 3 subjected to the shrinkage correction operation is moved to the suction nozzle 11. The tip height is constant. The molten solder is solidified during the period from time t4 to t5.

  Finally, at time t5, the suction holding of the head tool 3 to the electronic component 1 by the suction nozzle 11 is released, and then the head tool 3 is raised by the elevating unit 21, so that the control height of the head tool 3 and The tip height of the suction nozzle 11 rises in a similar change state.

  Next, a case where a leveling operation for aligning the heights of the solder bumps 1b of the electronic component 1 before the electronic component 1 is brought into contact with the circuit board 4 will be described.

  If there is variation in the height of each solder bump 1b joined to each electrode 1a of the electronic component 1, each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 are brought into contact with each other. Due to the variation in the height of 1b, the contact load control is affected and the head tool 3 cannot be sucked and held at the height of the back surface of the electronic component 1 determined in advance, and the solder is melted as it is. When the electronic component 1 is bonded to the circuit board 4, there is a problem in that the back height of each electronic component 1 of each circuit board 4 cannot be made constant.

  In order to cope with such a problem, a leveling operation for aligning the heights of the respective solder bumps 1b of the electronic component 1 is performed before the mounting operation of the electronic component 1 on the circuit board 4 by the head tool 3, and then, The electronic component 1 is mounted on the circuit board 4.

  In the electronic component mounting apparatus 201 in FIG. 1, a leveling stage 8 is fixed to a slide base 6 that can be moved in the Y1 or Y2 direction by a Y-direction moving mechanism 23. After the electronic component 1 is sucked and held by the suction nozzle 11 of the head tool 3, before the solder bumps 1 b of the electronic component 1 are aligned with each solder part 2 of the circuit board 4, the leveling stage 8 is The fixed slide base 6 is moved in the Y1 or Y2 direction by the Y-direction moving mechanism 23, and the head tool 3 is moved in the X1 or X2 direction by the X-direction moving mechanism 22, and is sucked by the suction nozzle 11 of the head tool 3. The held electronic component 1 is aligned with the upper surface of the leveling stage 8. Thereafter, the head tool 3 is lowered by the elevating unit 21, and each solder bump 1 b of the electronic component 1 sucked and held by the suction nozzle 11 of the head tool 3 is brought into contact with the upper surface of the leveling stage 8. The upper surface of the leveling stage 8 is composed of a glass plate having a smooth plane. At this time, the contact load generated by the contact is detected by the load cell 14 of the head tool 3, and the lifting unit 21 is controlled by the detected contact load, and the head tool 3 is slightly lowered by the lifting unit 21. The contact load is controlled so as to be a preset contact load. The solder bumps 1b of the electronic component 1 are pressed against the upper surface of the leveling stage 8 with this controlled contact load, so that the height of each solder bump 1b is constant. Thereafter, the head tool 3 is raised by the elevating unit 21 so that the solder bumps 1b of the electronic component 1 sucked and held by the suction nozzle 11 of the head tool 3 can be joined to the solder parts 2 of the circuit board 4 so as to be bonded. The component 1 and the circuit board 4 are aligned, and the electronic component 1 is mounted on the circuit board 4.

  According to the first embodiment, the following various effects can be obtained.

  First, according to the first embodiment, after each solder bump 1b of the electronic component 1 is brought into contact with each solder portion 2 of the circuit board 4, each solder bump 1b and Each solder part 2 is melted by heating, and then solidified by cooling, so that each electrode 1a of the electronic component 1 and each pad 4a of the circuit board 4 are joined with solder interposed therebetween. In other words, the work from the contact to bonding of each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4 is performed at the same place, and the circuit board is mounted as in the conventional batch reflow mounting method. Temporary bonding of electronic components, which is a process performed between temporarily bonding electronic components, melting each solder bump and each solder part at once, and finally bonding the electronic components to the circuit board In this state, the transfer process to the solder reflow working part of the circuit board can be made unnecessary. Therefore, it is possible to eliminate the occurrence of the displacement of the bonding position of the electronic component to the circuit board that has occurred during the conveyance, and it is possible to improve the bonding quality of the electronic component to the circuit board.

  Further, after each solder bump 1b of the electronic component 1 held by suction by the suction nozzle 11 of the head tool 3 is brought into contact with each solder portion 2 of the circuit board 4, each solder bump 1b and each solder portion 2 are heated. The melting and releasing timing of the suction holding to the electronic component 1 by the suction nozzle 11 of the head tool 3 is not canceled during the melting of the solder as in the conventional local reflow mounting method, but is cooled after the solder is melted. Release after solidified. That is, instead of mounting the electronic component by obtaining the self-alignment effect due to the surface tension of the molten solder as in the conventional local reflow mounting method, the circuit board of the electronic component 1 at the contact position positioned by the head tool 3 is used. 4 implementation. Thereby, the joining position shift of the electronic component 1 can be eliminated by the vacuum break blow generated in the suction nozzle 11 when the suction holding of the electronic tool 1 by the suction nozzle 11 of the head tool 3 is released. Therefore, an electronic component such as a high-end IC chip in which the bump pitch is narrowed to 150 μm or less, for example, where the displacement of the bonding position of the electronic component due to vacuum break blow at the suction nozzle becomes a problem rather than obtaining a self-alignment effect. Can be mounted on a circuit board.

  In the head tool 3, the upper end of the shaft 17 at the head tool tip 3 a is attached to the lower frame 16 b and the spring receiving portion 18 of the shaft 17 to support the shaft 17 on the lower surface, which is the load detection surface of the load cell 14. The load acting on the head tool tip 3 a in the load cell 14 can be detected by being pressed and in contact with the self-weight canceling spring 15.

  Thereby, when each solder bump 1b of the electronic component 1 adsorbed and held by the head tool 3 and each solder part 2 of the circuit board 4 come into contact with each other, a head load tip 3a is generated due to a contact load generated between them. Since the upper end of the shaft 17 pushes up the load detection surface of the load cell 14, this load can be reliably detected by the load cell 14.

  Therefore, by detecting the contact load, the control unit 9 can detect that each solder bump 1b of the electronic component 1 and each solder unit 2 of the circuit board 4 are in contact with each other, and can detect the detected contact. The lifting / lowering unit 21 is controlled by the load, and the head tool 3 is slightly lowered by the lifting / lowering unit 21, so that the actual contact load can be more accurately controlled to be a preset contact load. Therefore, when repeatedly mounting a plurality of electronic components on a circuit board, each electronic component can always be brought into contact with the circuit board with a preset contact load, and the electronic components can be joined to the circuit board. It becomes possible to stabilize the quality.

  Further, when correcting both the amount of expansion and contraction of the head tool 3 here, when correcting only one of the amount of expansion and contraction, further correcting both the amount of expansion and contraction. The effect based on the embodiment in the case of not performing will be described.

  After each solder bump 1b of the electronic component 1 and each solder part 2 of the circuit board 4 are brought into contact with each other, the head tool tip 3a is affected by heat from the ceramic heater 12 and extended in the vertical direction. The contact load generated between the component 1 and the circuit board 4 is affected. The influence load on the contact load due to the extension of the head tool tip 3a is about 3 kg. Based on this influential load, the effects of the various combinations described above for correcting the expansion and contraction amounts of the head tool tip 3a will be described below.

  First, when the electronic component 1 is an IC chip having 1000 bumps or more of each electrode 1a and the head tool 3 is not subjected to the extension amount correction and the shrinkage amount correction, for example, the electronic component 1 has 2000 bump electrodes 1a. In the case of an IC chip, the influence load of about 3 kg due to the elongation of the head tool tip 3a is about 1.5 g per bump. After the contact between each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4, the influence load due to the extension of the head tool tip 3a is determined as the contact load by using the extension amount of the head tool tip 3a. By doing so, an appropriate contact load of about 1.5 g per bump can be generated, and variations in the melt height of each solder bump 1b and each solder portion 2 can be reduced.

  Next, the electronic component 1 is an IC chip in which the gap width between adjacent solder bumps 1b formed on each electrode 1a is as narrow as 50 μm or less, and only the amount of extension of the head tool tip 3a is corrected and contracted. When the amount correction is not performed, the extension amount of the head tool tip 3a is corrected, and the solder bumps 1b of the electronic component 1 that are in contact with each other in a state of being pressed with an appropriate contact load set in advance. After the solder portions 2 of the circuit board 4 are melted, the melted solder is solidified while the head tool 3 is contracted by cooling. That is, the melted solder is stretched and solidified by the amount of shrinkage of the head tool tip 3a due to cooling. For this reason, each solder bump 1b and each solder part 2 after being melted and solidified can be formed into a drum shape, thereby preventing contact between adjacent solder bumps.

  Next, in the case where the electronic component 1 is an IC chip having each electrode 1a having 1000 bumps or more and the head tool tip 3a is not corrected for the amount of expansion, but only the amount of shrinkage is corrected, for example, the electronic component 1 has 2000 In the case of an IC chip having bump electrodes 1a, the influence load of about 3 kg due to the extension of the head tool tip 3a is about 1.5 g per bump, and each solder bump 1b of the electronic component 1 and each solder portion of the circuit board 4 2 after contact, using the amount of extension of the head tool tip 3a as an impact load due to the extension of the head tool tip 3a, an appropriate contact of about 1.5g per bump A load can be generated. The IC chip is pushed in by a predetermined amount by this contact load, and further, the amount of shrinkage of the head tool 3 is corrected to solidify the solder of the IC chip with the tip position of the suction nozzle 11 of the head tool 3 kept constant. Therefore, it is possible to improve the management accuracy of the final IC chip back surface height after the cooling of the solder.

  Furthermore, when the electronic component 1 is an IC chip having each electrode 1a having less than 1000 bumps, and the correction of the extension amount and the shrinkage amount of the head tool tip 3a is performed, for example, the electronic component 1 has an electrode 1a having 100 bumps. In the case of an IC chip, the influence load of about 3 kg due to the elongation of the head tool tip 3a is about 30 g per bump, and if the elongation amount is not corrected, an excessive load is applied to each solder bump 1b and the bump collapse occurs. Therefore, the amount of expansion and contraction of the head tool tip 3a is corrected to enable bonding without bump collapse.

  Accordingly, from these cases, the head tool tip 3a extends according to the number of solder bumps 1b formed on each electrode 1a of the electronic component 1 to be mounted and the bonding accuracy required for the electronic component 1. Electronic components required depending on whether the correction of the amount and the shrinkage amount is performed together, only the correction of the extension amount or the shrinkage amount is performed, or the correction of the extension amount and the shrinkage amount is not performed. It is possible to obtain a bonding quality of.

In addition, from the start of the temperature rise of the suction nozzle 11 in step SP10 to the start of the elongation correction operation of the head tool 3 in step SP14,
By performing the standby operation for starting the elongation correction operation, the elongation amount of the head tool 3 is affected by, for example, uneven heat transfer or thermal disturbance at the initial stage of heating to the suction nozzle 11. Even in this case, the standby operation eliminates the influence at the beginning of heating, and thereafter, it is possible to perform the operation of correcting the extension amount of the head tool 3. It should be noted that the same effect as described above can be obtained for the shrinkage amount correction of the head tool 3.

  In addition, the numerical value of each load in the above is a numerical value as an example in this embodiment, and this embodiment is not limited to each of these numerical values.

  In addition, after the temperature of the suction nozzle 11 starts to rise by being heated by the ceramic heater 12, the load is detected by the load cell 14 as a state of constant load control by the head tool 3, and the decrease in the detected load is detected. By determining that each solder starts melting and switching from the above constant load control of the head tool 3 to a position control in which the tip height position of the suction nozzle 11 is made constant, the suction nozzle 11 is also melted when each solder is melted. The tip height position can be made constant. Thereby, when each solder bump 1b of the electronic component 1 and each solder part 2 of the circuit board 4 are melted, the tip position of the suction nozzle 11 is lowered, so that each solder bump 1b and each solder part 2 in the molten state is melted. Can be prevented, and the height of the back surface of the electronic component can be reliably controlled even during melting of each solder.

  Further, when the constant load control of the head tool 3 described above is performed, the constant load is set as a load equal to or greater than the contact load at the time of contact detection, and this load is controlled to be applied to the electronic component 1 and the circuit board 4. Thus, when contact between each solder bump 1b of the electronic component 1 and each solder portion of the circuit board 4 is detected, each solder bump 1b is caused by a variation in the formation height of each solder bump 1b and each solder portion 2. Even in the case where some of the solders 2 are not in contact with each other, the contact between the solder bumps 1b and the solder parts 2 is improved by applying the constant load. Therefore, all the solder can be reliably melted, and the reliability of joining the electronic component and the circuit board can be improved.

  Further, after positioning the electronic component 1 sucked and held by the suction nozzle 11 of the head tool 3 so that it can be joined to the circuit board 4, the load 17 of the load cell 14 is loaded on the shaft 17 of the head tool tip 3 a by its own weight canceling spring 15. By detecting the pressing load being pressed against the detection surface in the load cell 14, outputting the detected pressing load to the control unit 9, and setting the pressing load as the load zero point in the load cell 14 in the control unit 9. Even when the self-weight canceling spring 15 is affected by heat or the like, and its spring characteristics change, and the pressing load by the head tool tip 3a in the load cell 14 changes, each solder bump 1b of the electronic component 1 and the circuit board 4 between the actual contact load at the time of contact of each solder part 2 and the contact load detection value detected by the load cell 14. The difference is eliminated, it is possible to control the actual contact load to the contact load as expected previously set. Therefore, when repeatedly mounting a plurality of electronic components on a circuit board, each electronic component can always be brought into contact with the circuit board with a preset contact load, and the electronic components can be joined to the circuit board. It becomes possible to stabilize the quality.

  Further, after the solder bumps 1b of the electronic component 1 and the solder portions 2 of the circuit board 4 are brought into contact, the head tool 3 is in contact with the solder bumps 1b of the electronic component 1 while the solder bumps 1b and the solder portions 2 are melted. By performing this shaping operation, the wettability of each solder bump 1b of the electronic component 1 in the molten state and each solder portion 2 of the circuit board 4 can be improved. Therefore, it is possible to improve the adhesiveness of the solder on each electrode 1a of the electronic component 1 and each pad 4a of the circuit board 4 and to improve the reliability of bonding between the electronic component and the circuit board. It becomes.

  Further, before the electronic component 1 is brought into contact with the circuit board 4, the leveling operation for aligning the heights of the solder bumps 1 b of the electronic component 1 is performed, thereby varying the formation height of the solder bumps 1 b of the electronic component 1. Even if there is, this variation can be eliminated and the height of each solder bump 1b can be made uniform. Thereby, at the time of contact of each solder bump 1b of the electronic component 1 and each solder portion 2 of the circuit board 4, it is possible to eliminate the influence on the contact load control due to the variation in the formation height of each solder bump 1b. The controllability of the contact load can be improved, and the contact load can be applied more evenly to each solder bump 1b. Therefore, each electrode 1a of the electronic component 1 and each pad 4a of the circuit board 4 can be reliably bonded with a more uniform contact load by interposing solder, and the bonding quality of the electronic component and the circuit board is stabilized. It becomes possible to make it.

  Further, in a case where the height accuracy of the back surface of the electronic component 1 after the electronic component 1 is bonded to the circuit board 4 is required, a leveling operation is performed so that the formation height of each solder bump 1b of the electronic component 1 is uniform. As a result, the height of the back surface of the electronic component 1 after being mounted on the circuit board 4 can be stabilized. Note that this leveling operation is more effective, for example, by stabilizing the bonding quality by applying the soldering bump 1b to the electronic component 1 having 1000 or more bumps.

  In addition, this invention is not limited to the said embodiment, It can implement with another various aspect. For example, an electronic component mounting method according to the second embodiment of the present invention is an electronic component mounting method in which a plurality of types of electronic components are mixedly mounted on a circuit board by different methods.

  The first electronic component, which is one type of electronic components among the plurality of types of electronic components, is used when the circuit board on which the electronic components are temporarily joined is transported to the solder reflow working unit in the conventional batch reflow mounting method. Even when the displacement of the bonding position of the electronic component to the circuit board occurs, each solder bump formed on each electrode of the electronic component has a large bump pitch. A general-purpose electronic component that is unlikely to be poorly bonded to the circuit board. For example, the general-purpose electronic component 31 has a bump pitch of more than 150 μm formed on each electrode of the general-purpose electronic component. Furthermore, the second electronic component, which is another type of electronic component, requires a high bonding position accuracy such that the above-described misalignment of the bonding position results in a defective bonding of the electronic component to the circuit board in the conventional batch reflow mounting method. For example, a high-end electronic component 41 such as a high-end IC chip having a bump pitch of 150 μm or less that requires a bonding position accuracy of ± 5 μm or less is required. For each of these electronic components, a plurality of general-purpose electronic components 31 are mounted on a circuit board by a conventional collective reflow mounting method, and then the high-end electronic components 41 are mounted by the local reflow mounting method of the first embodiment. Mount on circuit board.

  Below, the mounting method of the electronic component concerning the 2nd Embodiment of this invention is demonstrated in detail using FIG.12 and FIG.13.

  As shown in FIG. 12A, the rectangular plate-shaped circuit board 34 has pads 34a and 34b as a plurality of electrodes on the upper surface, and each pad 34a can be bonded to each general-purpose electronic component 31. Each pad 34 b can be joined to the high-end electronic component 41. A flux is supplied from a supply nozzle 35 onto each pad 34a of the circuit board 34 that can be bonded to each general-purpose electronic component 31, and a flux portion 32 is formed on each pad 34a.

  Next, in FIG. 12B, solder bumps 31b, which are bonding materials, are formed on the plurality of electrodes 31a of the rectangular plate-shaped general-purpose electronic component 31, and each surface of the general-purpose electronic component 31 does not have each electrode. The solder bumps 31b of the general-purpose electronic component 31 can be bonded to the flux portions 32 formed on the pads 34a of the circuit board 34 by attracting and holding the rear surface of the general electronic component 31 with a tool 33 which is an example of a component holding member. In addition, the general-purpose electronic component 31 is aligned with the circuit board 34. Thereafter, the tool 33 holding the general-purpose electronic component 31 is lowered, and the solder bumps 31b of the general-purpose electronic component 31 are pressed against the pads 34a of the circuit board 34 via the flux portions 32 to be temporarily joined. These general operations are repeated for each general-purpose electronic component 31 to temporarily bond each general-purpose electronic component 31 to the circuit board 34.

  Next, the circuit board 34 to which each general-purpose electronic component 31 is temporarily bonded is transported to the solder reflow working unit, and as shown in FIG. 12C, each general-purpose electronic component 31 and the circuit board 34 in the solder reflow working unit. Is heated by a heat source, and each solder bump 31b of each general-purpose electronic component 31 is melted.

  Thereafter, as shown in FIG. 12D, the heated general-purpose electronic components 31 and the circuit board 34 are cooled, and the solder bumps 31 b of the melted general-purpose electronic components 31 are solidified. The electrodes 31a are finally joined to the pads 34a of the circuit board 34 with the solder bumps 31b interposed, and the general-purpose electronic components 31 are collectively mounted on the circuit board 34.

  Next, as shown in FIG. 13E, flux is supplied from a supply nozzle 45 onto each pad 34b that can be joined to the high-end electronic component 41 on the circuit board 34 on which each general-purpose electronic component 31 is mounted. A portion 42 is formed on each pad 34b.

  Next, in FIG. 13F, the solder bumps 41b are formed on the plurality of electrodes 41a of the rectangular plate-shaped high-end electronic component 41, and the back surface is a surface that does not have the electrodes 41a of the high-end electronic component 41. Are attracted and held by the suction nozzle 11 of the head tool 3 so that the solder bumps 41b of the high-end electronic component 41 can be joined to the pads 34b of the circuit board 34 via the flux portions 42, respectively. Is aligned with the circuit board 34.

  Thereafter, as shown in FIG. 13G, each solder bump 41b of the high-end electronic component 41 is moved to each pad of the circuit board 34 while lowering the suction nozzle 11 of the head tool 3 holding the high-end electronic component 41 by suction. It abuts on 34b via each flux part 42. FIG. After this contact, the solder bumps 41b of the high-end electronic component 41 in contact with the flux portions 42 of the circuit board 34 are heated and melted by the ceramic heater 12 of the head tool 3. Thereafter, after the heating by the ceramic heater 12 is stopped, the melted solder bumps 41b are solidified by cooling the molten solder by blowing from the cooling blow nozzle 19, and each electrode 41a of the high-end electronic component 41 is solidified. The pads 34b of the circuit board 34 are bonded to the solder bumps 41b. Instead of forced cooling by the cooling blow nozzle 19 to the molten solder, the solder may be solidified by naturally cooling the molten solder.

  Thereafter, as shown in FIG. 13H, the suction holding of the high-end electronic component 41 by the suction nozzle 11 of the head tool 3 is released, and the head tool 3 is raised.

  With the electronic component mounting method described above, each general-purpose electronic component 31 and the high-end electronic component 41 are mixedly mounted on the circuit board 34.

  In the above description, a case where the bonding material is each solder bump 31b formed in advance on each electrode 31a of the general-purpose electronic component 31 and each solder bump 41b formed in advance on each electrode 41a of the high-end electronic component 41 will be described. However, the bonding material is formed on the solder bumps formed on the electrodes 31 a of the general-purpose electronic component 31 and the solder bumps formed on the electrodes 41 a of the high-end electronic component 41 and the pads 34 a and 34 b of the circuit board 34. Each solder part may be formed in advance.

  Further, the supply location of the flux is on each electrode 31a of the general-purpose electronic component 31, on each electrode 41a of the high-end electronic component 41, on each pad 34a and 34b of the circuit board 34, or each solder bump or each solder part which is a bonding material. Either of these cases may be sufficient, and the case where a flux is not supplied may be sufficient. Depending on the type of flux supplied and supplied, the general-purpose electronic component 31 and the high-end electronic component 41 may be mounted on the circuit board 34 and then the supplied and supplied flux may be removed by washing.

  According to the second embodiment, the general-purpose electronic component 31 in which the bump pitch of the bump formed on each electrode of the electronic component is larger than 150 μm, and the high-end electronic chip such as a high-end IC chip in which the bump pitch is 150 μm or less. In the case where components 41 are mixedly mounted and mounted on circuit board 34, each general-purpose electronic component 31 that does not require high bonding position accuracy is mounted on circuit board 34 by the conventional batch reflow mounting method, and then high bonding position accuracy is achieved. Is mounted on the circuit board 34 on which the general-purpose electronic component 31 is mounted by the local reflow mounting method of the first embodiment.

  In the mounting method of each general-purpose electronic component 31 on the circuit board 34, when the circuit board 34 on which each general-purpose electronic component 31 is temporarily bonded is transported to the solder reflow working unit, the bonding position of each general-purpose electronic component 31 with respect to the circuit board 34 Even when a deviation occurs, each solder bump 31b formed on each electrode 31a of the general-purpose electronic component 31 has a bump pitch larger than 150 μm. It is difficult to cause a bonding failure to the circuit board 34, and the mounting method of each general-purpose electronic component 31 to the circuit board 34 is required not to increase the bonding position accuracy but to suppress the mounting cost.

  Therefore, each general-purpose electronic component 31 can be temporarily bonded to the circuit board 34 and then melted in a batch so that each general-purpose electronic component 31 is finally bonded to the circuit board 34 and mounted. Since the mounting operation can be performed efficiently, the mounting cost of each general-purpose electronic component 31 on the circuit board 34 can be suppressed.

  On the other hand, the high-end electronic component 41 moves the high-end electronic component 41 from the contact between the solder bumps 41b of the high-end electronic component 41 and the flux portions 42 of the circuit board 34 to solidification after melting of the solder. By adsorbing and holding, the high-end electronic component 41 can be mounted on the circuit board 34 with high bonding position accuracy without causing any bonding position shift.

  Accordingly, in the electronic component mounting method when the general-purpose electronic component 31 and the high-end electronic component 41 are mixedly mounted and mounted on the circuit board 34, the mounting method of each electronic component according to the required bonding position accuracy of each electronic component. It is possible to achieve both productivity and bonding quality by using different types.

  Furthermore, the mounting apparatus used in the electronic component mounting method according to the third embodiment of the present invention further includes a pressure mechanism for pressing the electronic component against the circuit board, and the head tool is an example of the pressure mechanism. Using a head tool that can also be used in a local reflow mounting apparatus in which the head tool has two large and small pneumatic cylinders, and using the electronic component mounting apparatus having the head tool, the local reflow mounting method of the first embodiment described above The electronic component mounting apparatus is capable of mounting electronic components by the above-described method and is compatible with a local reflow mounting method.

  The structure of this head tool will be described in detail. In FIG. 14, the head tool 50 supports a head tool tip 50a that performs operations such as suction holding and heating to the electronic component 1, and a head tool tip 50a. The head tool main body 50b is moved up and down with respect to the head tool 50. The head tool tip 50a has a small cylinder 58 and the head tool main body 50b has a large cylinder 61 on the same axis.

  In FIG. 14, the head tool tip 50 a is composed of a suction nozzle 51 capable of sucking and holding the electronic component 1 from the tip side, a ceramic heater 52 for heating the electronic component 1 sucked and held by the suction nozzle 51, and this ceramic. A water jacket 53 that cuts off heat so that heat from the heater 52 is not transmitted to the head tool main body 50 b, a shaft 57 attached to the upper end of the water jacket 53, and a small cylinder 58 provided on the top of the shaft 57. Further, a cooling blow nozzle 70 that cools the electronic component 1 heated by the ceramic heater 52 by blowing is attached around the lower portion of the shaft 57.

  In FIG. 14, the head tool main body 50 b includes a frame 56 that supports the head tool tip 50 a, a large cylinder 61 provided on the upper part of the frame 56, and a load cell 54 attached to the lower part of the large cylinder 61. It is configured.

  The frame 56 has a substantially U-shape formed by a rigid body, and an upper frame 56 a provided with a large cylinder 61 and a shaft 57 of the head tool tip 50 a are provided on the side of the shaft 57. A lower frame 56b for supporting the vertical movement of the shaft 57, and supporting the weight 57 by a self-weight canceling spring 55, which is an elastic body attached to the lower portion of the spring-shaped spring receiving portion 68. The cylindrical intermediate frame 56c supports the upper frame 56a and the lower frame 56b.

  The shaft 57 has a step portion 57c in the vicinity of the middle in the axial direction, and the shaft lower portion 57b of the shaft 57 has a smaller diameter than the shaft upper portion 57a with the step portion 57c as a boundary. Further, the shaft lower portion 57 b passes through a hole 56 d formed in the lower frame 56 b that supports the shaft 57 via a self-weight canceling spring 55, and the hole 56 d of the lower frame 56 b is moved up and down by the shaft 57. Is formed so as to be smaller than the diameter of the shaft upper portion 57a of the shaft 57. Thus, the shaft 57 can be moved up and down by being guided by the hole 56d of the lower frame 56b via the self-weight canceling spring 55, and the self-weight canceling spring 55 cannot support the shaft 57 due to damage or the like. Even in such a case, the peripheral portion of the hole 56d of the lower frame 56b can support the shaft 57 by the stepped portion 57c of the shaft 57, so that the shaft 57 does not fall.

  Further, the shaft lower portion 57b includes an outer ring and a shaft of a ball spline, the lower frame 56b includes a bearing inside the hole 56d, and the outer ring of the ball spline is attached to the inner side of the bearing. It can be rotated about the axis while being supported by the lower frame 56b, and can be moved up and down in the axial direction.

  Moreover, the both ends of the cylindrical shape of the intermediate frame 56c are fixed to the nut part 21b of the elevating part 21, and the ball screw shaft 21a screwed to the nut part 21b in the elevating part 21 is rotated by the motor 21m. The intermediate frame 56c is moved up and down, whereby the frame 56 is moved up and down, and the entire head tool 50 is moved up and down.

  The small cylinder 58 includes a cylindrical guide 60 of the small cylinder 58 formed on the shaft upper portion 57 a of the shaft 57, and is arranged inside the guide 60 and guided inside the guide 60. A cylindrical rod 59 that moves up and down is provided, and compressed air can be supplied to and exhausted from a pressurized air supply chamber 65 surrounded by the inner surface of the guide 60 and the lower surface of the rod 59.

  The large cylinder 61 includes a cylindrical guide 63 of the large cylinder 61 formed at the end of the upper frame 56 a, and is disposed inside the guide 63 and guided inside the guide 63. A cylindrical rod 62 that moves up and down is provided. Further, the rod 62 is attached to the upper surface of the load cell 54 at the lower end of the narrow neck portion 62b that is the lower portion thereof. Further, the large cylinder 61 is provided with a pressurized air supply chamber 66 surrounded by the inner surface of the guide 63 and the upper surface of the rod 62. The compressed air can be supplied to and exhausted from the pressurized air supply chamber 66. Yes.

  Further, the suction nozzle 51, the ceramic heater 52, the water jacket 53, the shaft 57, the guide 60 of the small cylinder 58, the rod 59, the load cell 54, the guide 63 of the large cylinder 61, and the rod 62 are arranged coaxially. Since the rod 62 of the large cylinder 61 and the rod 59 of the small cylinder 58 move up and down on the same axis, and this shaft is arranged so as to be parallel to the lift operation axis of the lift unit 21, the lift unit By the raising / lowering operation by 21, the respective parts constituting the head tool 50 arranged on the same axis can be raised / lowered on the same axis.

  Further, in the head tool distal end portion 3 a supported by the lower frame 56 b via the self-weight canceling spring 55, the rod 59 of the small cylinder 58 can come into contact with the lower surface which is the load detection surface of the load cell 54. In addition, when the upper end of the rod 59 of the small cylinder 58 comes into contact with the load cell 54, the load acting on the lower surface, which is the load detection surface of the load cell 54, can be detected in the load cell 54.

  Further, in the large cylinder 61, the rod 62 has a groove-like recess 62a on the outer periphery of the cylindrical side surface which is the central portion in the axial direction, and the guide 63 has a recess of the rod 62 on the cylindrical side surface. A hole 63a is provided at a position that can match 62a. Further, a rod-like stopper 64, which is an example of a rod body that can penetrate the hole 63a of the guide 63, is provided on the outside of the guide 63 by a stopper drive cylinder 67, which is an example of a rod body drive mechanism provided on the outside of the guide 63. Is inserted into the concave portion 62a of the rod 62, and the stopper 64 is inserted into the concave portion 62a of the rod 62 by passing through the hole 63a of the guide 63 by the stopper driving cylinder 67. Thus, the vertical movement of the rod 62 of the large cylinder 61 can be limited, and an example of the limiting mechanism for limiting the operation of the rod 62 of the large cylinder 61 is configured as described above. The axial width inside the recess 62a of the rod 62 is slightly larger than the axial width of the stopper 64, and the stopper 64 is fitted inside the recess 62a, that is, the rod 62 In the state where the vertical movement is restricted, the rod 62 having the concave portion 62a can be moved up and down to a certain extent by the larger inner width of the concave portion 62a.

  The large cylinder 61, the small cylinder 58, and the stopper drive cylinder 67 are connected to compressed air supply / exhaust portions 69A, 69B, and 69C, respectively, which are examples of a compressed air supply / exhaust mechanism. 69B and 69C are an air supply unit that supplies compressed air, an exhaust unit that discharges compressed air, a switching valve that switches between supply from the supply unit and exhaust from the exhaust unit, and It is comprised by the supply / exhaust line of the compressed air connected to each cylinder from the said switching valve.

  The cooling blow nozzle 70 attached around the lower shaft portion 57b, which is the lower periphery of the shaft 57, is formed so as to go around both sides of the water jacket 53 and the ceramic heater 52 located below the shaft 57, and The tip of the cooling blow nozzle 70 is directed to the electronic component suction holding surface which is the lower surface of the suction nozzle 51, and the electronic component 1 sucked and held by the suction nozzle 51 can be cooled by the blow from the cooling blow nozzle 70. Yes.

  Further, the control unit 9 supplies / exhausts the compressed air supply / exhaust units 69A to 69C connected to the adsorption operation of the adsorption nozzle 51, the heating operation of the ceramic heater 52, the large cylinder 61, the small cylinder 58, and the stopper drive cylinder 67. The operation and the moving operation of the elevating unit 21 are controlled, and the load detected by the load cell 54 is output to the control unit 9.

  Next, the operation of the head tool 3 in the third embodiment will be described with reference to FIGS. 14 and 15.

  First, when the head tool 3 is used in the local reflow mounting method in the first embodiment, compressed air is supplied to the pressurized air supply chamber 65 in the small cylinder 58 by the compressed air supply / exhaust unit 69A in FIG. The rod 59 is moved upward along the inner surface of the guide 60 in the guide 60 by the pressure of the supplied compressed air, the upper end of the rod 59 is brought into contact with the lower surface of the load cell 54, and the load cell 54 Then, the rod 62 in the large cylinder 61 is pushed up, and the rod 62 is moved upward along the inner surface of the guide 63 in the guide 63. At this time, the stopper 64 for restricting the vertical movement of the rod 62 of the large cylinder 61 is not fitted inside the recess 62 a of the rod 62, and the stopper 64 is in an off state. The guide 63 can freely move up and down along the inner surface.

  Next, the upper surface of the rod 62 of the large cylinder 61 pushed up and moved upward comes into contact with the inner upper surface of the guide 63, and the rod 62 reaches the upper end of the vertical movement of the rod 62 along the inner surface of the guide 63. Thereafter, as shown in FIG. 15, the stopper 64 for restricting the vertical movement of the rod 62 of the large cylinder 61 in the off state is supplied to the stopper drive cylinder 67 by the compressed air supply / exhaust portion 69C. Then, while passing through the hole 63a of the guide 63, it is fitted inside the recess 62a of the rod 62, and the stopper 64 is turned on.

  Thereafter, the supply of compressed air to the pressurized air supply chamber 65 in the small cylinder 58 by the compressed air supply / exhaust portion 69A is stopped, and the compressed air supply / exhaust portion 69B to the compressed air supply chamber 66 in the large cylinder 61 is compressed. The compressed air is exhausted from the pressurized air supply chamber 65 in the small cylinder 58 by the compressed air supply / exhaust portion 69A, and the large cylinder 61 is supplied by the pressure of the compressed air supplied to the pressurized air supply chamber 66. The rod 62 is pushed down, and the load cell 54 attached to the lower end of the narrow neck portion 62b, which is the lower portion of the rod 62, is moved downward. As a result, the rod 59 of the small cylinder 58 that is in contact with the lower surface of the load cell 54 It is pushed down via the load cell 54 and moved downward.

  Thereafter, the lower end of the rod 59 of the small cylinder 58 comes into contact with the inner lower end of the guide 60, and the rod 59 becomes an integral structure with the shaft 57 forming the guide 60 by this contact. Further, when the rod 59 is pressed downward, the entire head tool tip end portion 50a supported by the lower frame 56b is pushed down via the self-weight canceling spring 55, and the self-weight canceling spring 55 is contracted by the pressed load. It becomes a state. Thereafter, in the large cylinder 61, the inner upper surface of the depressed portion 62a of the pushed-down rod 62 comes into contact with the upper portion of the stopper 64, and the compressed air supplied to the pressurized air supply chamber 66 is brought into contact with the upper surface. Due to the pressure, the rod 62 is pressed downward and fixed. In order to reduce the impact when the rod 62 and the stopper 64 come into contact with each other, the amount of compressed air supplied to the pressurized air supply chamber 66 in the compressed air supply / exhaust portion 69B is reduced by the load detected by the load cell 54. It is controlled in stages.

  Here, the relationship between the axial width inside the recess 62 a of the rod 62 and the axial width of the stopper 64 will be described in more detail. The relationship between the widths of the rod 59 of the small cylinder 58 is as follows. The rod 59 is pushed up and moved upward in the guide 60 along the inner surface of the guide 60, whereby the rod 62 of the large cylinder 61 is pushed up via the load cell 54, and in the guide 63 along the inner surface of the guide 63. When the rod 62 is moved until the upper surface of the rod 62 comes into contact with the inner upper surface of the guide 63, the stopper 64 can be fitted inside the concave portion 62a of the rod 62. After that, the rod 62 of the large cylinder 61 is pushed down and moved downward in the guide 63 along the inner surface of the guide 63. 8 rod 59 is pushed down via the load cell 54 and moved downward in the guide 60 along the inner surface of the guide 60, the lower end of the rod 59 abuts on the inner lower end of the guide 60, and the rod 59 is further pressed. Thus, the self-weight canceling spring 55 can be brought into a contracted state by this pressing force, and in this state, the inner upper surface of the concave portion 62a of the rod 62 is configured to abut on the upper portion of the stopper 64. .

  In the head tool 50 in the state as described above, the electronic component 1 is sucked and held by the suction nozzle 51, and after the electronic component 1 and the circuit board 4 are aligned, the electronic tool 1 is sucked and held by the suction nozzle 51. 50 is lowered by the elevating part 21, and each solder bump 1 b of the electronic component 1 comes into contact with each solder part 2 of the circuit board 4. At this time, due to the generated contact load, the upper end of the rod 59 of the small cylinder 58 integrated with the shaft 57 at the upper part of the head tool tip 50a presses the load detection surface of the load cell 54, whereby the load cell At 54, the contact load can be detected.

  By detecting the contact load in the load cell 54 in this way, it is detected that each solder bump 1b of the electronic component 1 and each solder part 2 of the circuit board 4 are in contact, and the contact detected by the load cell 54 is detected. The elevating unit 21 is controlled by the control unit 9 and the contact load detected by the load cell 54 is set in advance so that the contact load is output to the control unit 9 and becomes a contact load preset in the control unit 9. The elevating unit 21 is controlled so that the contact load is increased.

  Next, when the head tool 50 is used in the conventional local reflow mounting method, the stopper 64 is turned on in the head tool 50 in the state used in the local reflow mounting method in the first embodiment in FIG. The compressed air is supplied to the pressurized air supply chamber 66 in the large cylinder 61 by the compressed air supply / exhaust portion 69B.

  First, the amount of compressed air supplied to the pressurized air supply chamber 66 is gradually reduced by the compressed air supply / exhaust unit 69B to stop the supply of compressed air, and then the pressurized air supply chamber 65 in the small cylinder 58 is stopped. Then, the compressed air supply / exhaust section 69A starts supplying compressed air. As a result, as shown in FIG. 14, the rod 59 of the small cylinder 58 is pushed up, the rod 59 is moved upward along the inner surface of the guide 60 in the guide 60, and the upper end of the rod 59 is brought into contact with the lower surface of the load cell 54. Further, the rod 62 in the large cylinder 61 is pushed up through the load cell 54, and the rod 62 moves upward along the inner surface of the guide 63 in the guide 63.

  Thereafter, the stopper 64 fitted inside the recess 62a of the rod 62 is exhausted from the inside of the recess 62a of the rod 62 by exhausting the compressed air supplied to the stopper drive cylinder 67 by the compressed air supply / exhaust portion 69C. The stopper 64 that has been extracted and turned on is turned off.

  In the head tool 50 in the state as described above, the electronic component 1 is sucked and held by the suction nozzle 51, and after the electronic component 1 and the circuit board 4 are aligned, the electronic tool 1 is sucked and held by the suction nozzle 51. 50 is lowered by the elevating unit 21, and compressed air is supplied to the pressurized air supply chamber 66 of the large cylinder 61 or the pressurized air supply chamber 65 of the small cylinder 58 by the compressed air supply / exhaust unit 69A or 69B. The head tool tip 50 a is pushed down, and each solder bump 1 b of the electronic component 1 is pressed against each solder 2 of the circuit board 4. At this time, the load by which the suction nozzle 51 holding the electronic component 1 by suction presses the circuit board 4 is compressed air in the pressurization air supply chamber 66 in the large cylinder 61 or the pressurization air supply chamber 65 in the small cylinder 58. A pressure load detected by the load cell 54 via the rod 62 or the rod 59 is transmitted to the suction nozzle 51 via the shaft 57 due to the pressure of the compressed air supplied by the air supply / exhaust unit 69A or 69B. . In this case, the product of the pressure of the compressed air and the area of the upper surface of the rod 62 or the rod 59 is the pressing load. The large cylinder 61 is used when a large pressing load is required, and the small cylinder 58 is used when a small pressing load is required.

  In the above description, the head tool 50 has two large and small cylinders. However, when the required pressing load is limited to a certain range, the head tool having only one cylinder can be used in the same manner as described above. Electronic components can be mounted.

  According to the third embodiment, the head tool 3 having a pneumatic cylinder of the type used in the local reflow mounting apparatus is provided with means for fixing the pneumatic cylinder, for example, the large cylinder 61 as described above. The rod 62 has a recess 62a and a stopper 64, and the electronic component mounting apparatus includes such a head tool 3, so that the conventional local reflow mounting method and the local reflow mounting method of the first embodiment can be realized. With both mounting methods, the electronic component 1 can be mounted on the circuit board 4.

  Thereby, for example, the electronic component 1 is a general-purpose electronic component that does not require high joining accuracy, and when the general-purpose electronic component is mounted on the circuit board 4, the stopper 64 is turned off on the rod 62 of the large cylinder 61, The rod 62 is allowed to move freely up and down within the guide 63. Thereafter, by supplying compressed air to the pressurized air supply chamber 66 of the large cylinder 61 or the pressurized air supply chamber 65 of the small cylinder 58, the rod 62, Alternatively, the pressing load detected by the load cell 54 via the rod 59 is transmitted to the suction nozzle 51 via the shaft 57, and the suction nozzle 51 is pushed down, so that the conventional local reflow mounting method can be used at a high mounting speed. Components can be mounted.

  At the same time, for example, the electronic component 1 is a high-end electronic component that requires high bonding accuracy. When the high-end electronic component is mounted on the circuit board 4, the electronic component 1 is placed inside the recess 62 a of the rod 62 in the large cylinder 61. By turning on the stopper 64 and supplying compressed air to the pressurized air supply chamber 66 of the large cylinder 61, the rod 62 is pushed down, and the inner upper surface of the depressed portion 62a of the pushed-down rod 62 is placed above the stopper 64. By bringing them into contact with each other, the load cell 54, the rod 62, the guide 63, and the upper frame 56a are made into an integral structure, and the rod 59 of the small cylinder 58 is pushed down by the rod 62 of the large cylinder 61 through the load cell 54. Thus, the lower end of the rod 59 is brought into contact with the inner lower end of the guide 60, and the head When the entire tool tip 50a is in an integrated structure and is further pushed down, the entire head tool tip 50a is pushed down via the self-weight canceling spring 55, whereby the head tool 50 is moved to the first position. The head tool having the same structure as the head tool 3 in the first embodiment can be obtained. In the head tool 50 in such a state, the contact between the electronic component and the circuit board is detected by the load cell 54 by the lowering operation of the head tool 50 by the elevating unit 21, and the detected contact load is set in advance. By controlling the elevating unit 21 by the control unit 9 so as to be a contact load, it becomes possible to mount an electronic component with high bonding accuracy by the local reflow mounting method of the first embodiment. . Therefore, the mounting method can be properly used according to the bonding accuracy required for the electronic component to the circuit board, and both the productivity and the bonding quality can be achieved.

  Further, in the head tool 50 in which the stopper 64 is turned on so that the head tool 50 can be adapted to the local reflow mounting method of the first embodiment, the contraction height of the self-weight canceling spring 55 is managed to be a constant height. By doing so, the height of the tip of the suction nozzle 51 can be kept constant, so that when the electronic component 1 is brought into contact with the circuit board 4, the contact load control can be stably performed. It becomes possible to stabilize the joining quality.

  For this reason, in the third embodiment, in the head tool 50, in addition to the dimensional accuracy of each component constituting the large cylinder 61, the recess 62a provided on the rod 62 of the large cylinder 61 and the stopper 64 are provided. The height of the self-weight spring 55 is kept constant by increasing the dimensional accuracy and making it possible to adjust the insertion position of the stopper 62 inside the recess 62a of the rod 62 outside the guide 63 of the large cylinder 61. It is possible to manage to the height of.

  Furthermore, the mounting apparatus used in the electronic component mounting method according to the fourth embodiment of the present invention is the same as the third embodiment in which the electronic component is sucked and held on the circuit board as shown in FIG. This is a dual-stage electronic component mounting apparatus 202 including the head tool 50 and two stages 7 for fixing the circuit board on which the electronic component is mounted in the electronic component mounting apparatus 201 of the first embodiment.

  As shown in FIG. 16, in the electronic component mounting apparatus 202, a plurality of IC chips 73 formed in a lattice pattern on the wafer are provided in the IC chip supply unit 73, a plurality of high-end electronic components 71 are provided in the parts tray 5A, and a plurality of general-purpose components. Electronic components 72 are respectively supplied and arranged on the parts tray 5B. The parts tray 5A and parts tray 5B are fixed on slide bases 6A and 6B to which the stage 7A and stage 7B are fixed. The high-end electronic component 71 and the general-purpose electronic component 72 are the same as the high-end electronic component 41 and the general-purpose electronic component 31 in the second embodiment, and the IC chip 73 has the same high bonding position accuracy as the high-end electronic component 71. This is an example of an electronic component that is required.

  In addition, a plurality of circuit boards 4A on which the IC chip 73, the high-end electronic component 71, and the general-purpose electronic component 72 are mounted are supplied to the circuit board supply unit 76, and the loader performs a moving operation by suction holding of the circuit board 4A. 77, the circuit board 4A can be taken out from the circuit board supply unit 76, and the circuit board 4A can be supplied to the stages 7A and 7B. Further, each circuit board 4A on which each electronic component is mounted is provided. Extraction from the stages 7A and 7B and discharge of the circuit board 4A to the circuit board discharge unit 78 are also possible.

  Similarly to the electronic component mounting apparatus 201 in the first embodiment, the head tool 50 is moved by the X-direction moving mechanism 22 and the elevating unit 21, and the slide bases 6A and 6B are moved by the Y-direction moving mechanisms 23, respectively. Operation is possible.

  Further, the IC chip 73 supplied to the IC chip supply unit 74 has a surface having each electrode arranged on the upper surface, and the surface having each electrode is sucked and held by a suction reversing unit 75 which is an example of a reversing mechanism. The suction reversing unit 75 is rotated while the IC chip 73 is held by suction, and the back surface of the IC chip 73 that does not have each electrode is used as the top surface, so that the back surface of the IC chip 73 is the head tool. 50 makes it possible to hold by suction.

  Next, the case where the IC chip 73, the high-end electronic component 71, and the general-purpose electronic component 72 are mounted on the circuit board 4A in the electronic component mounting apparatus 202 having such a configuration will be described.

  First, the circuit board 4A is sucked and held by the loader 77 from the circuit board supply unit 76, and the circuit boards 4A are supplied to the stages 7A and 7B and fixed. Next, the suction reversing unit 75 is moved so that the one IC chip 73 disposed in the IC chip supply unit 74 can be sucked and held by the suction reversing unit 75. 73, the suction reversing unit 75 is lowered, the IC chip 73 is sucked and held, lifted, and the IC chip 73 is taken out from the IC chip supply unit 74. At the same time, the high-end electronic component 71 is sucked and held by the parts tray 5A by the head tool 50, and the high-end electronic component 71 is mounted on the circuit board 4A fixed to the stage 7A. At this time, the stopper 64 is turned on inside the concave portion 62a of the rod 62 in the large cylinder 61 of the head tool 50, and the head tool main pair portion 50b and the head tool tip portion 50a are in an integrated structure, The head tool 50 is in a state compatible with the local reflow mounting method of the first embodiment in the third embodiment.

  Thereafter, the IC chip 73 held by the suction reversing unit 75 is rotated so that the back surface of the IC chip 73 is the upper surface. At the same time, the high-end electronic component 71 is mounted on the circuit board 4A fixed to the stage 7B by sucking and holding the high-end electronic component 71 on the parts tray 5A by the head tool 50. Thereafter, the head tool 50 is moved above the suction reversing unit 75, the back surface of the IC chip 73 sucked and held by the suction reversing unit 75 is sucked and held by the head tool 50, and the IC chip 73 by the suction reversing unit 75 is moved to the IC chip 73. Is released from the suction inversion unit 75 of the IC chip 73 to the head tool 50. Thereafter, an IC chip is mounted on the circuit board 4A fixed to the stage 7A by the head tool 50.

  Further, after that, the general electronic component 72 is sucked and held by the parts tray 5B by the head tool 50, and the general electronic component 72 is mounted on the circuit board 4A fixed to the stage 7A. At the same time, the IC chip 73 is sucked and held by the suction reversing unit 75 from the IC chip supply unit 73. At this time, the stopper 64 is in an off state inside the concave portion 62a of the rod 62 in the large cylinder 61 of the head tool 50, and the head tool 50 corresponds to the conventional local reflow mounting method in the third embodiment. It is possible.

  Thereafter, the general electronic component 72 is picked up and held on the parts tray 5B by the head tool 50, and the general electronic component 72 is mounted on the circuit board 4A fixed to the stage 7B. At the same time, the IC chip 73 sucked and held by the suction reversing unit 75 is rotated so that the back surface of the IC chip 73 is the upper surface. Thereafter, in the same manner as described above, the head tool 50 is moved above the suction reversing unit 75, and the back surface of the IC chip 73 sucked and held by the suction reversing unit 75 is sucked and held by the head tool 50. Is released from the suction inversion unit 75 of the IC chip 73 to the head tool 50. Thereafter, an IC chip is mounted on the circuit board 4A fixed to the stage 7B by the head tool 50. When the IC chip 73 is mounted on the circuit board 4A by the head tool 50, the stopper 64 is turned on again inside the concave portion 62a of the rod 62 in the large cylinder 61 of the head tool 50, and the head tool 50 is in the state described above. In this embodiment, the local reflow mounting method of the first embodiment can be supported.

  Further, thereafter, each circuit board 4A on which each IC chip 73, each high-end electronic component 71, and each general-purpose electronic component 72 is mounted is taken out from each stage 7A and 7B by a loader 77 and discharged to a circuit board discharge unit 78. To do.

  The above operations are repeated for each circuit board 4A, and the IC chip 73, the high-end electronic component 71, and the general-purpose electronic component 72 are mounted on each circuit board 4A. .

  According to the fourth embodiment, even when the electronic components mounted on the circuit board 4A are various electronic components such as the IC chip 73, the high-end electronic component 71, and the general-purpose electronic component 72, for example. Since the electronic component mounting apparatus 202 includes the head tool 50 of the third embodiment, the conventional local reflow mounting method and the local reflow of the first embodiment can be performed only by the electronic component mounting apparatus 202. Since both mounting methods can be supported, the high-end electronic component 71 and the IC chip 73 that require high bonding accuracy have high bonding accuracy by the local reflow mounting method of the first embodiment. For general-purpose electronic components 72 that do not require high bonding accuracy, high mounting speed is achieved by the conventional local reflow mounting method. With, the respective electronic components can be mounted on a circuit board 4A. Therefore, according to the required joining accuracy of each electronic component, it is possible to provide an electronic component mounting apparatus that can achieve both productivity and joining quality by properly using the mounting method of each electronic component.

  Further, the electronic component mounting apparatus 202 includes a plurality of stages for fixing each circuit board 4A, for example, two stages 7A and 7B, so that each circuit board 4A is provided for each electronic component that requires the same mounting method. Since each electronic component can be mounted on each circuit board 4A with respect to each other electronic component for which another mounting method is required after mounting each electronic component above, The number of operations of turning on and off the stopper 64 to the recess 62a of the rod 62 of the head tool 50, which is an operation necessary for switching the mounting method required for the component, can be reduced. It is possible to reduce the time loss for the mounting operation of the electronic component due to the above operation, and it is possible to shorten the time required for the mounting operation of the electronic component.

  Next, according to the fifth embodiment of the present invention, the local reflow mounting method according to the first embodiment and the ultrasonic mounting method which is a conventional electronic component mounting method are mixed in various orders, so that A type of electronic component is mounted. Here, the ultrasonic mounting method is to apply ultrasonic vibration to the surface of the bonding base material, that is, each surface of each electrode of the electronic component, each electrode of the circuit board, etc. This is a method of mounting an electronic component in which friction is caused on a contact surface with each electrode and bonding is performed by the frictional heat. The fifth embodiment of the present invention will be described based on the following examples.

  First, in the first example of the fifth embodiment of the present invention, after the high-end electronic component is mounted on the circuit board by the local reflow mounting method of the first embodiment, the high-end electronic component is mounted. The electronic component is mounted on the above-described circuit board by an ultrasonic mounting method.

  First, the electronic component mounting apparatus 203 that performs the electronic component mounting method in the first embodiment will be described.

  As shown in FIG. 17, the electronic component mounting apparatus 203 includes a head tool 3 in the first embodiment for sucking and holding high-end electronic components and mounting them on a circuit board, and an ultrasonic wave for mounting electronic components by an ultrasonic mounting method. A tool 113 is provided, and the circuit board 104 is fixed to a stage 7 fixed on the slide base 6. In addition, a plurality of IC chips 101 formed in a lattice pattern on a wafer, which is an example of a high-end electronic component, is supplied to an IC chip supply unit 73, and a plurality of electronic components mounted on the circuit board 104 by an ultrasonic mounting method. 111 is supplied to the parts tray 5 and arranged.

  Further, a plurality of circuit boards 104 on which the IC chip 101 and the electronic component 111 are mounted are supplied to the circuit board supply unit 76, and the circuit board is supplied by a loader 77 that performs a moving operation by holding the circuit board 104 by suction. The circuit board 104 can be taken out from the unit 76 and the circuit board 104 can be supplied to the stage 7. Further, the circuit board 104 on which each electronic component is mounted is taken out from the stage 7 and the circuit board discharging unit 78. It is also possible to discharge the circuit board 104.

  Similarly to the electronic component mounting apparatus 201 in the first embodiment, the head tool 3 is driven by the X-direction moving mechanism 22 and the lifting unit 21, and the ultrasonic tool 113 is also moved by the X-direction moving mechanism 22 and the lifting unit 21A. Further, each slide base 6 can be moved by the Y-direction moving mechanism 23.

  The IC chip 101 supplied to the IC chip supply unit 74 has a surface having each electrode arranged on the upper surface, and the surface having each electrode is adsorbed and held by the adsorption inversion unit 75 to adsorb the IC chip 101. The suction reversing unit 75 is rotated while being held, and the back surface of the IC chip 101 that does not have each electrode is set as the upper surface, so that the back surface of the IC chip 101 can be sucked and held by the head tool 3. Become.

  Next, the electronic component mounting method of the first embodiment when the IC chip 101 and the electronic component 111 are mounted on the circuit board 104 in the electronic component mounting apparatus 203 having such a configuration will be described in detail.

  As shown in FIG. 18A, the rectangular plate-like circuit board 104 has pads 104a and 104b which are a plurality of electrodes on the upper surface, and each pad 104a can be bonded to the plurality of electrodes 101a of the IC chip 101. Each pad 104b can be bonded to a plurality of electrodes 111a of the electronic component 111.

  In FIG. 17, the circuit board 104 is taken out by suction load from a circuit board supply unit 76 to which a plurality of such circuit boards 104 are supplied, and is supplied to the stage 7 and fixed.

  Next, in FIG. 17, the suction reversing unit 75 is moved so that one IC chip 101 in the shape of a square plate arranged in the IC chip supply unit 74 can be sucked and held by the suction reversing unit 75. The suction reversing unit 75 is aligned with the IC chip 73, the suction reversing unit 75 is lowered, the IC chip 101 is sucked and held, and then lifted, and the IC chip 101 is taken out from the IC chip supply unit. Thereafter, the IC chip 101 held by the suction reversing unit 75 is rotated by rotating the suction reversing unit 75 so that the back surface of the IC chip 101 is the upper surface and the head tool 3 is moved above the suction reversing unit 75. Then, the back surface of the IC chip 101 sucked and held by the suction reversing unit 75 is sucked and held by the suction nozzle 11 of the head tool 3, and the suction holding to the IC chip 101 by the suction reversing unit 75 is released, and the IC chip 101 Transfer from the suction reversal unit 75 to the head tool 3 is performed.

  Next, in FIG. 18B, solder bumps 101 b are formed on the respective electrodes 101 a of the IC chip 101 that is sucked and held by the suction nozzle 11 of the head tool 3. The IC chip 101 is aligned with the circuit board 104 so that it can be bonded to each pad 104a of the circuit board 104.

  Thereafter, as shown in FIG. 18C, the solder bumps 101b of the IC chip 101 are applied to the pads 104a of the circuit board 104 while the suction nozzle 11 of the head tool 3 holding the IC chip 101 is lowered. Make contact. After the contact, the solder bumps 101b of the IC chip 101 contacting the pads 104a of the circuit board 104 are heated and melted by the ceramic heater 12 of the head tool 3. Thereafter, the heating by the ceramic heater 12 is stopped, and the melted solder bumps 101b are solidified by cooling the melted solder by blowing from the cooling blow nozzle 19, and the respective electrodes 101a and circuits of the IC chip 101 are solidified. The pads 104a of the substrate 104 are joined with the solder bumps 101b interposed. Instead of forced cooling by the cooling blow nozzle 19 to the molten solder, the solder may be solidified by naturally cooling the molten solder.

  Thereafter, as shown in FIG. 18D, the suction holding of the head tool 3 to the IC chip 101 by the suction nozzle 11 is released, the head tool 3 is raised, and the IC chip 101 is mounted on the circuit board 104.

  Here, for example, when flux is supplied to the surface of each solder bump 101b of the IC chip 101 or each pad 104a of the circuit board 104, flux cleaning is performed to remove the flux. This flux cleaning may not be necessary depending on the type of supplied flux.

  Next, in FIG. 17, the ultrasonic tool 113 is moved so that one ultrasonic plate-shaped electronic component 111 arranged in the parts tray 5 can be sucked and held by the ultrasonic tool 113. The tool 113 is aligned with the electronic component 111, the ultrasonic tool 113 is lowered, the electronic component 111 is sucked and held, and then lifted, and the electronic component 111 is taken out from the parts tray 5.

  Next, as shown in FIG. 19 (e), solder bumps 111 b are formed on the respective electrodes 111 a of the electronic component 111 sucked and held by the ultrasonic tool 113. The electronic component 111 is aligned with the circuit board 104 so as to be bonded to each pad 104b of the circuit board 104 on which the IC chip 101 is mounted.

  Thereafter, as shown in FIG. 19 (f), while lowering the ultrasonic tool 113 holding the electronic component 111, the solder bumps 111b of the electronic component 111 are pressed against the pads 104b of the circuit board 104. The ultrasonic tool 113 applies ultrasonic vibrations to the surfaces of the solder bumps 111b of the electronic component 111 and the surfaces of the pads 104b of the circuit board 104, which are in contact with each other. Causes friction. The solder bumps 111b of the electronic component 111 and the pads 104b of the circuit board 104 are joined by frictional heat generated by this friction.

  Thereafter, as shown in FIG. 19G, the suction holding of the electronic tool 111 by the ultrasonic tool 113 is released, the ultrasonic tool 113 is raised, and the electronic component 111 is mounted on the circuit board 104.

  With the electronic component mounting method as described above, the IC chip 101 and the electronic component 111 are mounted on the circuit board 104.

  Further, the circuit board 104 on which the IC chip 101 and the electronic component 111 are mounted is sucked and held by the loader 77, thereby taking out the circuit board 104 from the stage 7 and discharging it to the circuit board discharge unit 78.

  The above operations are repeated for each circuit board 104 for a plurality of circuit boards 104, and the IC chip 101 and the electronic component 111 are mounted on each circuit board 104.

  According to the first example of the fifth embodiment, the electronic component mounting apparatus 203 can perform the head tool 3 capable of performing the local reflow mounting method of the first embodiment and the ultrasonic mounting method. Since the ultrasonic tool 113 is provided, the IC chip 101 is mounted on the circuit board 104 by the local reflow mounting method of the first embodiment, and then the electronic component 111 is mounted by the ultrasonic mounting method. Therefore, for example, when the electronic component 111 is an electronic component that is required to be prevented from being affected by heat, the influence of solder melting and heating when the IC chip 101 is mounted on the electronic component 111. Therefore, the electronic component 111 can be mounted on the circuit board 104 without being affected by heat. Further, for example, when flux is supplied to each solder bump 101b of the IC chip 101 or each pad 104a of the circuit board 104, and when the flux needs to be removed after mounting the IC chip 101, After the IC chip 101 is mounted on the circuit board 104 by the local reflow mounting method of the first embodiment, the flux supplied by flux cleaning is removed, and then the electronic component 111 is mounted by the ultrasonic mounting method. Therefore, at the time of flux cleaning, due to the influence of the flux cleaning liquid on the electronic component 111 mounted by the ultrasonic mounting method, or due to reattachment to the electronic component 111 such as fine debris washed away at the time of flux cleaning The need to consider the effects can be eliminated. Therefore, the electronic component 111 that needs to consider the influence as described above, for example, an electronic component that requires a heat-proof environment or a waterproof environment at the time of mounting, requires high bonding position accuracy by the ultrasonic mounting method. Along with high-end electronic components such as an IC chip, it can be mounted on a circuit board in a mixed manner.

  Next, in the second example of the fifth embodiment of the present invention, the electronic component 111 is first mounted on the circuit substrate 104 by the ultrasonic mounting method, and then the circuit substrate 104 on which the electronic component 111 is mounted. In addition, the IC chip 101 which is an example of the high-end electronic component is mounted by the local reflow mounting method of the first embodiment. That is, the order of the ultrasonic mounting method and the local reflow mounting method of the first embodiment is reversed from the first example of the fifth embodiment.

  According to the second example of the fifth embodiment, after the electronic component 111 is mounted on the circuit board 104 by the ultrasonic mounting method, the first circuit board is mounted on the circuit board 104 on which the electronic component 111 is mounted. Since the IC chip 101 is mounted by the local reflow mounting method of the embodiment, it is possible to eliminate the need to consider the influence on the IC chip 101 due to the ultrasonic vibration generated during the ultrasonic mounting. Therefore, when a high-end electronic component such as an IC chip that requires high bonding position accuracy is an electronic component that needs to consider the influence on vibration, together with the electronic component mounted by the ultrasonic mounting method It becomes possible to mount the circuit board in a mixed manner.

  Further, in the third example of the fifth embodiment of the present invention, first, on the circuit board, a sealing material for sealing a joint portion between the electronic component and the circuit board is formed by an ultrasonic mounting method. After the electronic components are mounted on the circuit board, a general-purpose electronic component is temporarily joined to the circuit board on which the electronic components are mounted by a batch reflow mounting method, and then the electronic components and the general-purpose electronic devices are mounted. By applying heat collectively to the component and the circuit board, the joint part of the electronic component and the circuit board is sealed with the sealing material, and the general purpose is temporarily bonded via the solder The main joining is performed by melting the solder of the electronic component. Thereafter, high-end electronic components are mounted on the circuit board on which the electronic components and the general-purpose electronic components are mounted by the local reflow mounting method of the first embodiment. Hereinafter, the electronic component mounting method of the third embodiment will be described in detail.

  As shown in FIG. 20A, a rectangular plate-like circuit board 124 has pads 124a, 124b, and 124c, which are a plurality of electrodes, on the upper surface. Each pad 124a is formed on the circuit board 124 by an ultrasonic mounting method. The pads 124b can be bonded to the plurality of electrodes 131a of the general-purpose electronic component 131, and the pads 124c can be bonded to the plurality of electrodes 141a of the high-end electronic component 141. Can be joined. A sealing material 122, which is a non-conductive resin material, is supplied to a portion where the rectangular plate-shaped electronic component 121 on the circuit board 124 is mounted, including on and near each pad 124a of the circuit board 124. In addition, Au bumps 121 b are formed on the respective electrodes 121 a of the electronic component 121. First, the back surface of the electronic component 121 that does not have the electrodes 121a is sucked and held by the ultrasonic tool 123 so that the Au bumps 121b of the electronic component 121 can be bonded to the pads 124a of the circuit board 124. The electronic component 121 is aligned with the circuit board 124.

  After that, as shown in FIG. 20B, the Au bumps 121b of the electronic component 121 are applied to the pads 124a of the circuit board 124 while the ultrasonic tool 123 holding the electronic component 121 is lowered. Press through 122. Thereby, the sealing material 122 between each Au bump 121b of the electronic component 121 and each pad 124a of the circuit board 124 is pushed away, and each Au bump 121b of the electronic component 121 is brought into contact with each pad 124a of the circuit board 124. The ultrasonic tool 123 applies ultrasonic vibrations to the surfaces of the Au bumps 121b of the electronic components 121 and the surfaces of the pads 124a of the circuit board 124 that are pressed against each other. Cause friction on the contact surface. By the frictional heat generated by this friction, each Au bump 121b of the electronic component 121 and each pad 124a of the circuit board 124 are bonded, and these bonded portions are sealed supplied between the electronic component 121 and the circuit board 124. The state is covered with the material 122.

  Thereafter, the suction holding of the electronic component 121 by the ultrasonic tool 123 is released, the ultrasonic tool 123 is raised, and the electronic component 121 is mounted on the circuit board 124.

  Next, as shown in FIG. 20C, solder bumps 131 b are formed on the electrodes 131 a of the rectangular plate-shaped general-purpose electronic component 131, and the general-purpose electronic component 131 does not have the electrodes 131 a. The general electronic component 131 is aligned with the circuit board 124 so that a certain back surface is sucked and held by the tool 133 and each solder bump 131b of the general electronic component 131 can be joined to each pad 124b of the circuit board 124.

  Thereafter, as shown in FIG. 20D, the tool 133 holding the general-purpose electronic component 131 is lowered, and the solder bumps 131b of the general-purpose electronic component 131 are pressed against the pads 124b of the circuit board 124 to temporarily Join. When mounting a plurality of general-purpose electronic components 131 on the circuit board 124, the above-described operation is repeated for each general-purpose electronic component 131 for each general-purpose electronic component 131, and each general-purpose electronic component 131 is mounted on the circuit board 124. Temporary joining.

  Next, as shown in FIG. 21 (e), the circuit board 124 on which the electronic component 121 is mounted and the general-purpose electronic component 131 is temporarily bonded in a state where the bonding portion is covered with the sealing material 122 is solder reflowed. The electronic component 121, the general-purpose electronic component 131, and the circuit board 124 are heated by the heat source in the solder reflow working unit, and the solder bumps 131b of the general-purpose electronic component 131 are melted and the electronic component 121 is sealed. The stop material 122 is also heated. Thereafter, the heated electronic component 121, the general-purpose electronic component 131, and the circuit board 124 are cooled, the solder bumps 131b of the melted general-purpose electronic component 131 are solidified, and the electrodes 131a of the general-purpose electronic component 131 are connected to the circuit board 124. Each of the pads 124b is joined and mounted via the solder bumps 131b, and the encapsulant 122 of the heated electronic component 121 is solidified, so that the electronic component 121 which is a joint portion between the electronic component 121 and the circuit board 124 is solidified. Each Au bump 121 b and each pad 124 a of the circuit board 124 are sealed with a sealing material 122.

  Next, in FIG. 21F, a solder bump 141b is formed on each electrode 141a of the rectangular plate-shaped high-end electronic component 141, and the back surface, which is a surface that does not have each electrode 141a of the high-end electronic component 141, is shown. The solder bump 141b of the high-end electronic component 141 is sucked and held by the suction nozzle 11 of the head tool 3 so that the solder bump 141b of the high-end electronic component 141 can be joined to each pad 124c of the circuit board 124 on which the electronic component 121 and the general-purpose electronic component 131 are mounted. The high-end electronic component 141 is aligned with the circuit board 124.

  Thereafter, as shown in FIG. 21G, the solder bumps 141b of the high-end electronic component 141 are moved to the pads of the circuit board 124 while the suction nozzle 11 of the head tool 3 holding the high-end electronic component 141 is lowered. 124c. After this contact, the solder bumps 141b of the high-end electronic component 141 in contact with the pads 124c of the circuit board 124 are heated and melted by the ceramic heater 12 of the head tool 3. Thereafter, after the heating by the ceramic heater 12 is stopped, the melted solder bumps 141b are cooled by blow from the cooling blow nozzle 19, whereby the melted solder bumps 141b are solidified, and the high-end electronic component 141 is Each electrode 141a and each pad 124c of the circuit board 124 are joined with each solder bump 141b interposed. Instead of forced cooling by the cooling blow nozzle 19 to each molten solder bump 141b, the molten solder bump 141b may be solidified by natural cooling.

  Thereafter, as shown in FIG. 21H, the suction holding of the high-end electronic component 141 by the suction nozzle 11 of the head tool 3 is released, the head tool 3 is raised, and the high-end electronic component 141 is mounted on the circuit board 124. The

  The electronic component 121, the general-purpose electronic component 131, and the high-end electronic component 141 are mounted on the circuit board 124 by the electronic component mounting method described above.

  According to the third example of the fifth embodiment, in addition to the effects of the second example, the sealing of the electronic component 121 bonded to the circuit board 124 by the ultrasonic mounting method is further performed. Sealing with the fixing material 122 and main joining by batch reflow of the general-purpose electronic components 131 temporarily joined to the circuit board 124 are performed simultaneously by heating each electronic component and the circuit board together with a heat source. Therefore, each electronic component mixedly mounted on a circuit board is a general-purpose electronic component, an electronic component that is mounted by an ultrasonic mounting method and requires a sealing of a bonding portion, and a high-end electronic component that requires high bonding position accuracy. In this case, it is possible to shorten the mounting time of each electronic component on the circuit board.

  It is to be noted that, by appropriately combining arbitrary embodiments of the various embodiments described above, the effects possessed by them can be produced.

  DESCRIPTION OF SYMBOLS 1 ... Electronic component, 1a ... Electrode, 1b ... Solder bump, 2 ... Solder part, 3 ... Head tool, 3a ... Head tool front-end | tip part, 3b ... Head tool main-body part, 4 ... Circuit board, 4A ... Circuit board, 4a ... Pad, 5 ... Parts tray, 5A ... Parts tray, 5B ... Parts tray, 6 ... Slide base, 6A ... Slide base, 6B ... Slide base, 7 ... Stage, 7A ... Stage, 7B ... Stage, 8 ... Leveling stage, 9 Control unit, 11 ... Adsorption nozzle, 12 ... Ceramic heater, 13 ... Water jacket, 14 ... Load cell, 15 ... Self-weight canceling spring, 16 ... Frame, 16a ... Upper frame, 16b ... Lower frame, 16c ... Intermediate frame, 16d ... Hole, 17 ... shaft, 17a ... shaft upper portion, 17b ... shaft lower portion, 17c ... stepped portion, 18 ... spring receiving portion, 19 ... Rejection blow nozzle, 21 ... Lifting part, 21A ... Lifting part, 21a ... Ball screw shaft, 21b ... Nut part, 21m ... Motor, 22 ... X direction moving mechanism, 23 ... Y direction moving mechanism, 31 ... General-purpose electronic component, 31a ... Electrode, 31b ... Solder bump, 32 ... Flux part, 33 ... Tool, 34 ... Circuit board, 34a ... Pad, 34b ... Pad, 35 ... Supply nozzle, 41 ... High-end electronic component, 41a ... Electrode, 41b ... Solder bump, 42 ... Flux part, 45 ... Supply nozzle, 51 ... Suction nozzle, 52 ... Ceramic heater, 53 ... Water jacket, 54 ... Load cell, 55 ... Self-weight canceling spring, 56 ... Frame, 56a ... Upper frame, 56b ... Lower frame, 56c ... intermediate frame, 56d ... hole, 57 ... shaft, 57a ... upper shaft, 57b ... lower shaft, 57c ... step, 5 ... Small cylinder, 59 ... Rod, 60 ... Guide, 61 ... Large cylinder, 62 ... Rod, 62a ... Recess, 62b ... Narrow neck, 63 ... Guide, 63a ... Hole, 64 ... Stopper, 65 ... Pressurized air supply chamber, 66 ... Pressurized air supply chamber, 67 ... Stopper drive cylinder, 68 ... Spring receiving part, 69A-C ... Compressed air supply / exhaust part, 70 ... Cooling blow nozzle, 71 ... High-end electronic component, 72 ... General-purpose electronic component, 73 ... IC chip 74... IC chip supply unit 75. Adsorption reversal unit 76. Circuit board supply unit 77. Loader 78. Circuit board discharge unit 81. Electronic component 81 a. Electrode 81 b Solder bump 82. Solder part, 83 ... head tool, 84 ... circuit board, 84a ... pad, 91 ... electronic component, 91a ... electrode, 91b ... solder bump, 92 ... solder part, 93 ... tool, 94 times Road board, 94a ... pad, 101 ... IC chip, 101a ... electrode, 101b ... solder bump, 104 ... circuit board, 104a ... pad, 104b ... pad, 111 ... electronic component, 111a ... electrode, 111b ... solder bump, 113 ... Ultrasonic tool, 121 ... electronic component, 121a ... electrode, 121b ... Au bump, 122 ... sealing material, 123 ... ultrasonic tool, 124 ... circuit board, 124a ... pad, 124b ... pad, 124c ... pad, 131 ... general purpose Electronic components 131a ... electrodes 131b ... solder bumps 133 ... tools 141 ... high-end electronic components 141a ... electrodes 141b ... solder bumps 201 ... electronic component mounting devices 202 ... electronic component mounting devices 203 ... electronic component mountings apparatus.

Claims (3)

A process of holding an electronic component having a plurality of protruding electrodes by suction with a component holding member and holding a substrate having a plurality of substrate electrodes on a mounting stage, and aligning the protruding electrode and the substrate electrode by moving the component holding member After the process, the component holding member is lowered to bring the protruding electrode into contact with the substrate electrode, the electronic component is heated to melt the protruding electrode, and the protruding electrode is melted and cooled to cool both electrodes. In an electronic component mounting method having a step of bonding,
After the bump electrode is brought into contact with the substrate electrode, the thermal expansion amount of the component holding member is corrected in the heating and melting process of the bump electrode based on preset change data of the elongation amount of the component holding member due to heat. In addition, the height of the component holding member is controlled, and the amount of thermal contraction of the component holding member is corrected based on preset change data of the amount of shrinkage due to the heat of the component holding member in the cooling process after stopping heating. In this way, the position of the height of the component holding member is controlled, and in the heating and melting process of the protruding electrode, the melting start of the protruding electrode is detected as a decrease in the contact load, and then the electronic component is sucked and held An electronic component mounting method, wherein the holding member is vibrated minutely.   The electronic component mounting method according to claim 1, wherein both the protruding electrode and the substrate electrode are formed of solder. An electronic component having a plurality of protruding electrodes is sucked and held by a component holding member, a substrate having a plurality of substrate electrodes is held on a mounting stage, and the component holding member is moved to align the protruding electrodes and the substrate electrodes. After that, in the electronic component mounting apparatus in which the component holding member is moved down to bring the protruding electrode into contact with the substrate electrode, the electronic component is heated to melt the protruding electrode, and then cooled to join both electrodes.
A height position adjusting means for adjusting the height position by moving the component holding member up and down;
Load detecting means for detecting a contact load between the protruding electrode and the substrate electrode;
A vibration operation applying means for minutely vibrating the component holding member holding the electronic component in the vertical direction or the horizontal direction;
A control means for operating the vibration action applying means after detecting a decrease in the contact load due to melting after heating by the load detection means ,
The control means retains the change data of the extension amount and the shrinkage change data due to the heat of the component holding member set in advance, and the projection electrode and the substrate electrode are detected by detecting the predetermined contact load by the load detection means. After detecting the contact state and detecting the contact state between the protruding electrode and the substrate electrode, when performing heating and melting of the protruding electrode, based on the change data of the amount of elongation due to the heat of the preset component holding member, In order to correct the amount of thermal expansion of the component holding member, the height position of the component holding member is controlled by the height position adjusting means, and a preset component holding member is used when cooling after stopping the heating. based on the change data of the contraction amount due to the heat, so as to correct the amount of thermal contraction of the component holding member, an electronic characterized that you position control the height position of the component holding member at a height position adjusting means Component mounting equipment.

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