JP2010157735A - 半導体発光素子 - Google Patents
半導体発光素子 Download PDFInfo
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- JP2010157735A JP2010157735A JP2009297727A JP2009297727A JP2010157735A JP 2010157735 A JP2010157735 A JP 2010157735A JP 2009297727 A JP2009297727 A JP 2009297727A JP 2009297727 A JP2009297727 A JP 2009297727A JP 2010157735 A JP2010157735 A JP 2010157735A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 71
- 238000005253 cladding Methods 0.000 claims abstract description 77
- 230000004888 barrier function Effects 0.000 claims abstract description 76
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000012535 impurity Substances 0.000 claims description 50
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 238000009792 diffusion process Methods 0.000 claims description 9
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 claims description 8
- 239000000969 carrier Substances 0.000 claims description 8
- 239000011777 magnesium Substances 0.000 claims description 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical group [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 4
- 229910052749 magnesium Inorganic materials 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 3
- 229910052790 beryllium Inorganic materials 0.000 claims description 3
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 230000007480 spreading Effects 0.000 claims description 3
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 claims description 2
- 239000000654 additive Substances 0.000 claims 1
- 230000000996 additive effect Effects 0.000 claims 1
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 10
- 230000008878 coupling Effects 0.000 description 9
- 238000010168 coupling process Methods 0.000 description 8
- 238000005859 coupling reaction Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000012360 testing method Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 239000002243 precursor Substances 0.000 description 2
- 230000002285 radioactive effect Effects 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/343—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y20/00—Nanooptics, e.g. quantum optics or photonic crystals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/04—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction
- H01L33/06—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a quantum effect structure or superlattice, e.g. tunnel junction within the light emitting region, e.g. quantum confinement structure or tunnel barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of group III and group V of the periodic system
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/0215—Bonding to the substrate
- H01S5/0216—Bonding to the substrate using an intermediate compound, e.g. a glue or solder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/0206—Substrates, e.g. growth, shape, material, removal or bonding
- H01S5/0217—Removal of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/305—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure
- H01S5/3086—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure doping of the active layer
- H01S5/309—Structure or shape of the active region; Materials used for the active region characterised by the doping materials used in the laser structure doping of the active layer doping of barrier layers that confine charge carriers in the laser structure, e.g. the barriers in a quantum well structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/34—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers
- H01S5/3407—Structure or shape of the active region; Materials used for the active region comprising quantum well or superlattice structures, e.g. single quantum well [SQW] lasers, multiple quantum well [MQW] lasers or graded index separate confinement heterostructure [GRINSCH] lasers characterised by special barrier layers
Abstract
【解決手段】本発明の半導体素子は、基板と、当該基板の上に形成される第一クラッド層と、当該第一クラッド層の上に形成される活性領域と、当該活性領域の上に形成される第二クラッド層と、を含み、前記活性領域は、不純物が添加されている第一型の障壁層、及び、不純物が添加されていない第二型の障壁層を含み、且つ、前記第一型の障壁層は、前記第二型の障壁層よりも前記第一クラッド層に接近する。
【選択図】図1
Description
102 基板
104 緩衝層
106 第一クラッド層
108 多重量子井戸活性領域
108−2 障壁層
108−2a 不純物添加障壁層
108−2b 不純物未添加障壁層
108−4 量子井戸層
110 第二クラッド層
112 転換層
114 電流拡散層
400 半導体発光素子
402 エッチング停止層
404 接合層
406 永久基板
Claims (16)
- 半導体素子であって、
基板と、
前記基板の上に位置する第一クラッド層と、
前記第一クラッド層の上に位置する活性領域と、
前記活性領域の上に位置する第二クラッド層と、
を含み、
前記活性領域は、不純物が添加されている第一型の障壁層と、不純物が添加されていない第二型の障壁層と、を含み、且つ、前記第一型の障壁層は、前記第二型の障壁層よりも前記第一クラッド層に接近する、半導体素子。 - 前記活性領域は、多重量子井戸構造を有し、前記多重量子井戸構造は、複数対の量子井戸層/障壁層を含み、且つ、前記各々の対の量子井戸層/障壁層のうち量子井戸層は、活性層とされ、当該活性層にはキャリアが結合し光子を生成する、
請求項1に記載の半導体素子。 - 前記各々の対の量子井戸層/障壁層のうち障壁層は、前記第一型の障壁層又は前記第二型の障壁層であり、且つ、前記第一型の障壁層の数は、前記第一型の障壁層の数と前記第二型の障壁層の数との総数の二分の一以下である、
請求項2に記載の半導体素子。 - 前記各々の対の量子井戸層/障壁層のうち、前記第一クラッド層に接近する障壁層は、前記第一型の障壁層であり、前記第二クラッド層に接近する障壁層は、前記第二型の障壁層である、
請求項2に記載の半導体素子。 - 前記活性領域は、(AlxGa1−x)yIn1−yP(0≦x≦1、0≦y≦1)、AlGaAs又はInGaPのうち一つからなる、
請求項2に記載の半導体素子。 - 前記基板は、n型GaAs基板であり、
前記第一クラッド層は、n型AlInP、AlGaInP又はAlGaAsクラッド層であり、
前記第二クラッド層は、p型AlInP、AlGaInP又はAlGaAsクラッド層であり、
前記第一型の障壁層は、p型不純物添加層である、
請求項1に記載の半導体素子。 - 前記n型クラッド層の厚みは、1μmより大きい、
請求項6に記載の半導体素子。 - 前記第一型の障壁層及び前記第二クラッド層に添加されているp型不純物は、マグネシウム(Mg)、亜鉛(Zn)、ベリリウム(Be)又は炭素(C)からなるグループより選出された一つ又は一つ以上の、正孔を提供できるp型不純物である、
請求項6に記載の半導体素子。 - 前記第一型の障壁層及び前記第二クラッド層にそれぞれ添加されている不純物は、異なる元素である、
請求項8に記載の半導体素子。 - 前記第一型の障壁層に添加されている不純物の添加濃度は、1×1016cm−3乃至1×1020cm−3である
請求項6に記載の半導体素子。 - さらに、前記p型クラッド層の上に位置する転換層と、当該転換層の上に位置する電流拡散層と、を含む、
請求項6に記載の半導体素子。 - 前記転換層は、p型InGaP層であり、前記電流拡散層は、p型GaP層である、
請求項11に記載の半導体素子。 - 半導体素子であって、
永久基板と、
前記永久基板の上に位置する接合層と、
前記接合層の上に位置する第二クラッド層と、
前記第二クラッド層の上の位置する活性領域と、
前記活性領域の上に位置する第一クラッド層と、
を含み、
前記活性領域は、不純物が添加されている第一型の障壁層と、不純物が添加されていない第二型の障壁層と、を含み、且つ、前記第一型の障壁層は、前記第二型の障壁層よりも前記第一クラッド層に接近する、半導体素子。 - 前記第一クラッド層は、n型AlInP、AlGaInP又はAlGaAsクラッド層であり、
前記第二クラッド層は、p型AlInP、AlGaInP又はAlGaAsクラッド層であり、
前記第一型の障壁層は、p型不純物添加層である、
請求項13に記載の半導体素子。 - さらに、前記接合層の上に位置する電流拡散層と、当該電流拡散層と前記第二クラッド層との間に位置する転換層と、を含む、
請求項14に記載の半導体素子。 - 前記電流拡散層は、p型GaP層であり、前記転換層は、p型InGaP層である、
請求項15に記載の半導体素子。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US12/347,392 | 2008-12-31 | ||
US12/347,392 US7953134B2 (en) | 2008-12-31 | 2008-12-31 | Semiconductor light-emitting device |
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JP2010157735A true JP2010157735A (ja) | 2010-07-15 |
JP2010157735A5 JP2010157735A5 (ja) | 2012-12-27 |
JP5912217B2 JP5912217B2 (ja) | 2016-04-27 |
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US (1) | US7953134B2 (ja) |
JP (1) | JP5912217B2 (ja) |
CN (1) | CN101771120B (ja) |
TW (1) | TWI403002B (ja) |
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CN102157647A (zh) * | 2011-05-03 | 2011-08-17 | 映瑞光电科技(上海)有限公司 | 一种氮化物led结构及其制备方法 |
US8941215B2 (en) | 2012-09-24 | 2015-01-27 | LuxVue Technology Corporation | Micro device stabilization post |
US8835940B2 (en) | 2012-09-24 | 2014-09-16 | LuxVue Technology Corporation | Micro device stabilization post |
ES2952036T3 (es) | 2013-06-12 | 2023-10-26 | Rohinni Inc | Teclado de retroiluminación con fuentes generadoras de luz depositadas |
US9035279B2 (en) | 2013-07-08 | 2015-05-19 | LuxVue Technology Corporation | Micro device with stabilization post |
US9087764B2 (en) | 2013-07-26 | 2015-07-21 | LuxVue Technology Corporation | Adhesive wafer bonding with controlled thickness variation |
US9153548B2 (en) | 2013-09-16 | 2015-10-06 | Lux Vue Technology Corporation | Adhesive wafer bonding with sacrificial spacers for controlled thickness variation |
US9450147B2 (en) | 2013-12-27 | 2016-09-20 | Apple Inc. | LED with internally confined current injection area |
US9583466B2 (en) | 2013-12-27 | 2017-02-28 | Apple Inc. | Etch removal of current distribution layer for LED current confinement |
DE102015109793A1 (de) * | 2015-06-18 | 2016-12-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauteil |
WO2017124109A1 (en) | 2016-01-15 | 2017-07-20 | Rohinni, LLC | Apparatus and method of backlighting through a cover on the apparatus |
US10693038B2 (en) * | 2017-11-22 | 2020-06-23 | Epistar Corporation | Semiconductor device |
US11158995B2 (en) | 2018-06-01 | 2021-10-26 | Visual Photonics Epitaxy Co., Ltd. | Laser diode with defect blocking layer |
DE102021132164A1 (de) | 2021-12-07 | 2023-06-07 | Osram Opto Semiconductors Gmbh | Laserdiodenbauelement und verfahren zur herstellung zumindest eines laserdiodenbauelements |
Citations (5)
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JPH0621583A (ja) * | 1992-06-29 | 1994-01-28 | Kokusai Denshin Denwa Co Ltd <Kdd> | 多重量子井戸構造および多重量子井戸構造を用いた半導体素子 |
JPH11186665A (ja) * | 1997-12-25 | 1999-07-09 | Sony Corp | 半導体発光素子 |
JP2002314126A (ja) * | 2001-04-10 | 2002-10-25 | Toshiba Corp | InGaAlP系光半導体素子及びその製造方法 |
JP2003332694A (ja) * | 2002-05-17 | 2003-11-21 | Mitsubishi Electric Corp | 半導体レーザ |
JP2007042751A (ja) * | 2005-08-01 | 2007-02-15 | Hitachi Cable Ltd | 半導体発光素子 |
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- 2008-12-31 US US12/347,392 patent/US7953134B2/en active Active
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- 2009-12-22 TW TW098144417A patent/TWI403002B/zh active
- 2009-12-28 JP JP2009297727A patent/JP5912217B2/ja active Active
- 2009-12-31 CN CN2009102661008A patent/CN101771120B/zh active Active
Patent Citations (5)
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JPH0621583A (ja) * | 1992-06-29 | 1994-01-28 | Kokusai Denshin Denwa Co Ltd <Kdd> | 多重量子井戸構造および多重量子井戸構造を用いた半導体素子 |
JPH11186665A (ja) * | 1997-12-25 | 1999-07-09 | Sony Corp | 半導体発光素子 |
JP2002314126A (ja) * | 2001-04-10 | 2002-10-25 | Toshiba Corp | InGaAlP系光半導体素子及びその製造方法 |
JP2003332694A (ja) * | 2002-05-17 | 2003-11-21 | Mitsubishi Electric Corp | 半導体レーザ |
JP2007042751A (ja) * | 2005-08-01 | 2007-02-15 | Hitachi Cable Ltd | 半導体発光素子 |
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CN101771120A (zh) | 2010-07-07 |
US20100166033A1 (en) | 2010-07-01 |
US7953134B2 (en) | 2011-05-31 |
TWI403002B (zh) | 2013-07-21 |
TW201029236A (en) | 2010-08-01 |
CN101771120B (zh) | 2012-07-25 |
JP5912217B2 (ja) | 2016-04-27 |
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