JP2010151990A - Method for manufacturing optical transmission device, optical transmission device, and optical waveguide - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide: a method for manufacturing an optical transmission device, which can simplify a step of attaching an optical waveguide; an optical transmission device; and an optical waveguide. <P>SOLUTION: The method for manufacturing an optical transmission device 1 includes: a first step of attaching an optical waveguide 6 including a core 60 transmitting light and a clad 61 covering the core 60, to a substrate 2, so that the core 60 crosses an optical path L1 of light emitted from a light-emitting element 3 on the substrate 2; and a second step of forming an optical path turning part 62 for turning the optical path L1 to a light transmission direction in the core 60, in a position where the core 60 crosses the optical path L1 in the optical waveguide 6. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing an optical transmission device, an optical transmission device, and an optical waveguide.

  2. Description of the Related Art Conventionally, a method for manufacturing an optical connection structure in which an optical wiring layer having a mirror is aligned with an optical component on a substrate and bonded to the substrate is known (see, for example, Patent Document 1).

In this method of manufacturing an optical connection structure, a frame member surrounding an optical component mounted on a substrate is installed, the mirror surface of the optical wiring layer is aligned with the optical component, and the optical wiring layer is bonded to the frame member. To do.
Japanese Patent Laid-Open No. 2005-62645

  An object of the present invention is to provide a method of manufacturing an optical transmission device, an optical transmission device, and an optical waveguide that can simplify the process of attaching the optical waveguide.

  In order to achieve the above object, an embodiment of the present invention provides the following method for manufacturing an optical transmission device, an optical transmission device, and an optical waveguide.

[1] A first optical waveguide having a core for propagating light and a clad covering the core is attached to the substrate so that the core intersects an optical path of light received or emitted by an optical element on the substrate. And a second step of forming a conversion unit that converts the optical path in a direction in which the core propagates light at a position where the core intersects the optical path in the optical waveguide. Method.

[2] The method for manufacturing an optical transmission device according to [1], wherein the optical waveguide includes a member provided on the optical element side.

[3] The optical transmission device according to [1], wherein a shape of a cross section of the core included in the optical waveguide is a rectangle in which a side in a direction intersecting the optical path is longer than a side in a direction parallel to the optical path. Manufacturing method.

[4] A plurality of the optical elements are provided on the substrate, and in the first step, the core is disposed in a plurality of optical paths of light received or emitted by the plurality of optical elements on the substrate. Each of the optical waveguides is attached to the substrate so as to intersect with each other, and the second step is to place the plurality of optical paths in a direction in which the core propagates light at positions where the core intersects the plurality of optical paths. The method for manufacturing an optical transmission device according to [1], wherein a plurality of conversion units to be converted are formed.

[5] An optical waveguide having a core for propagating light and a clad covering the core is provided in a plurality of optical paths of light received or emitted by optical elements respectively provided on a plurality of sub-substrates included in the collective substrate. A plurality of optical paths in a direction in which the core propagates light at a position where the core intersects the optical paths in the optical waveguide; A method for manufacturing an optical transmission device, comprising: a second step of forming a plurality of conversion units for converting the first and second steps; and a third step of separating the collective substrate and the optical waveguide for each of the sub-substrates.

[6] An optical waveguide having a core for propagating light and a clad covering the core, and a light receiving element or a light emitting element provided on each of a plurality of sub-substrates included in the plurality of collective substrates. A first step of attaching to the plurality of collective substrates such that the core intersects with a plurality of optical paths; and the core propagates light at a position of the optical waveguide where the core intersects with the plurality of optical paths. A second step of forming a plurality of conversion units that convert the plurality of optical paths in a direction to perform, the light-emitting element provided on the child substrate included in the collective substrate, and the child included in another collective substrate And a third step of separating the plurality of collective substrates and the optical waveguide for each of the sub-substrates so that light transmission can be performed between the light receiving elements provided on the substrate by the optical waveguide. Manufacturing method of the transmission apparatus.

[7] A substrate on which an optical element is mounted; a first member attached to the optical element side of the substrate; a core that propagates light on the first member; a clad that covers the core; and An optical transmission device comprising: an optical waveguide having a conversion unit that converts an optical path of light received or emitted by an optical element on the substrate into a direction in which the core propagates light.

[8] The optical transmission device according to [7], further including a second member provided between the first member and the optical waveguide.

[9] A core that propagates light and a clad that covers the core, and after being attached to the substrate, at a position where the core intersects an optical path of light received or emitted by the optical element on the substrate, An optical waveguide in which a conversion unit that converts the optical path in a direction in which the core propagates light is formed.

  According to the invention which concerns on Claim 1, 7, 9, compared with the case where it does not have this structure, the attachment process of an optical waveguide can be simplified.

  According to the invention which concerns on Claim 2, 8, when forming a conversion part, an optical element can be protected.

  According to invention of Claim 3, the positioning accuracy in the attachment process of an optical waveguide can be eased compared with the case where it does not have this structure.

  According to the fourth aspect of the present invention, it is possible to reduce the time required for the optical waveguide attachment process as compared with the case where a plurality of optical transmission devices are manufactured by attaching the optical waveguides to the substrate on which the optical element is provided. .

  According to the fifth aspect of the present invention, a plurality of optical transmission devices can be easily manufactured as compared with the case where the present configuration is not provided.

  According to the invention of claim 6, an optical transmission device in which the light emitting element and the light receiving element are connected by the optical waveguide can be easily manufactured as compared with the case where the present configuration is not provided.

  In the method for manufacturing an optical transmission device according to the present embodiment, an optical waveguide having a core that propagates light and a clad that covers the core is disposed on an optical path of light received or emitted by an optical element on a substrate. A first step of attaching to the substrate so as to intersect; and forming a conversion unit that converts the optical path in a direction in which the core propagates light at a position of the optical waveguide where the core intersects the optical path. 2 steps.

  The optical element may be a light emitting element that emits light or a light receiving element that receives light.

  In the method for manufacturing the optical transmission device, after the optical waveguide is attached to the substrate in the first step, the conversion unit is formed in the optical waveguide in the second step. For this reason, in the first step, the positioning of the core of the optical waveguide and the light emitting portion of the light emitting element may be performed in a direction perpendicular to the direction in which the core propagates light and parallel to the substrate. There is no need to consider.

[First Embodiment]
FIG. 1A is a top view of the optical transmission apparatus according to the first embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line AA of FIG. FIG. 2 is a top view of the optical transmission apparatus shown in FIG. 1 before mounting the optical waveguide. 3A is an enlarged plan view of the optical path conversion unit, and FIG. 3B is a cross-sectional view taken along the line BB of FIG. 1B.

(Configuration of optical transmission equipment)
The optical transmission device 1 is mounted at a position adjacent to the light emitting element 3 on the substrate 2 having the upper surface 2a and the lower surface 2b, the light emitting element 3 mounted near the center of the upper surface 2a of the substrate 2, and the upper surface 2a of the substrate 2. The driving IC 4, the supporting member (first member) 5 disposed on the upper surface 2 a of the substrate 2 so as to surround the driving IC 4, the optical waveguide 6 supported by the supporting member 5, and the light emitting element 3. And a plurality of bonding wires 7 that electrically connect the driving IC 4 and the substrate 2 to each other. The optical transmission device 1 may include a light receiving element instead of the light emitting element 3 as an optical element.

(substrate)
The substrate 2 has a flat shape and is made of an insulating material such as glass epoxy resin. As illustrated in FIG. 2, the substrate 2 has a plurality of electrode pads 20 connected to an electronic component such as the drive IC 4 and, for example, the electrode pads 20 connected to the upper surface 2 a to realize a desired electric circuit. Wiring pattern (not shown). The substrate 2 may be a resin package in which the substrate 2 and the support member 5 are integrally formed.

(Light emitting element)
As illustrated in FIG. 1A and FIG. 2, the light emitting element 3 has a light emitting unit 30 that emits light on its upper surface, an electrode pad 31 connected to the driving IC 4 by a bonding wire 7, and a light emitting unit 30. And a pair of alignment marks 32 formed at diagonal positions. As such a light emitting element 3, for example, an optical element such as a surface light emitting diode or a surface laser can be used. In the present embodiment, a VCSEL (surface emitting laser) is used.

  The light emitting unit 30 emits light in a direction perpendicular to the upper surface of the light emitting element 3, and the light enters the optical waveguide 6 through the optical path L1.

(Drive IC)
The driving IC 4 is an electronic component that includes a circuit that drives the light emitting element 3 in accordance with an input electric signal. As illustrated in FIGS. 1A and 2, the driving IC 4 has a plurality of electrode pads 40 connected to the electrode pads 31 of the light emitting element 3 or the electrode pads 20 of the substrate 2 by bonding wires 7 on the upper surface thereof. With.

(Support member)
The support member 5 has a square shape, is disposed between the substrate 2 and the optical waveguide 6, and positions and fixes the optical waveguide 6 with respect to the light emitting element 3 on the substrate 2. The support member 5 is formed of an insulating material such as an epoxy resin substrate or a Si substrate, for example. The support member 5 is bonded to the substrate 2 with an adhesive or the like, but can be fixed by other joint structures such as fitting. The support member 5 may be formed integrally with the substrate 2.

(Optical waveguide)
The optical waveguide 6 has a film shape, a core 60 that propagates light in the right horizontal direction (light propagation direction) in FIG. 1B, a clad 61 that covers the periphery of the core 60, and an optical path conversion unit 62. With.

  The optical waveguide 6 is attached to the support member 5 with an adhesive or the like so that the core 60 intersects the optical path L1 of the light emitted from the light emitting unit 30 of the light emitting element 3. Further, an end portion of the optical waveguide 6 may be connected to another optical transmission device (not shown), an optical fiber, or the like, or an optical connector may be provided.

  The cross-sectional shape of the core 60 is a rectangle having a long side in the direction intersecting the optical path L1, that is, a width W longer than the thickness T, as shown in FIG. The width W of the core 60 is, for example, 100 μm, and the thickness T is, for example, 50 μm. The core 60 is made of, for example, a polymer material such as fluorinated polyimide, silicone, polycarbonate, or PMMA (methacrylic resin).

  The clad 61 has a thickness of 20 μm to 100 μm, for example, on the upper side and the lower side of the core 60. The thickness may be different between the upper side and the lower side. The clad 61 is made of a film material having a refractive index smaller than that of the core 60 and having optical characteristics such as light transmittance, mechanical strength, heat resistance, flexibility, and the like. Examples of the film material include an acrylic resin, a styrene resin, an olefin resin, and a vinyl chloride resin.

  As illustrated in FIG. 1B, the optical path conversion unit 62 has an inclined surface of 45 degrees, and is formed at a position where the optical path L <b> 1 intersects the core 60 in the optical waveguide 6. The optical path conversion unit 62 includes a mirror surface 62a that converts the optical path L1 in the light propagation direction of the core 60 on a 45-degree inclined surface. That is, the optical path L1 of the light emitted by the light emitting unit 30 is converted by the mirror surface 62a into the optical path L2 that is the light propagation direction of the core 60, and the light emitted by the light emitting unit 30 propagates in the core 60. .

  The optical path conversion unit 62 is formed by a processing apparatus such as a laser processing apparatus or a dicing saw after the optical waveguide 6 is attached to the support member 5 in a state where the optical path conversion section 62 is not formed. In this case, the pair of alignment marks 32 of the light emitting element 3 is observed with a camera or the like included in the processing apparatus, and the optical path conversion unit 62 is formed by the processing apparatus based on the observation result. Instead of the alignment mark 32, the outer shape of the light emitting unit 30 may be observed.

(Method for manufacturing optical transmission device)
Next, an example of a method for manufacturing the optical transmission device 1 according to the first embodiment will be described with reference to FIG.

  4A to 4C are diagrams illustrating an example of each step of the method of manufacturing the optical transmission device. First, the substrate 2, the light emitting element 3, the driving IC 4 and the support member 5 are prepared, and the light emitting element 3 and the driving IC 4 are mounted on the upper surface 2a of the substrate 2 as shown in FIG. Next, the electrode pads 31 of the light emitting element 3 and the electrode pads 40 of the driving IC 4 are connected by the bonding wires 7, and the plurality of electrode pads 20 of the substrate 2 and the plurality of electrode pads 40 of the driving IC 4 are connected by the bonding wires 7. Connecting. And the state shown to Fig.4 (a) is obtained by fixing the supporting member 5 to the board | substrate 2 with an adhesive agent.

  Next, the optical waveguide 6 in which the optical path conversion unit 62 is not formed is prepared, and the optical waveguide 6 is disposed on the support member 5 and fixed with an adhesive or the like as shown in FIG. 4B. At that time, the optical waveguide 6 is disposed on the support member 5 so that the core 60 of the optical waveguide 6 intersects the optical path L1 of the light emitted from the light emitting unit 30 of the light emitting element 3.

  Next, in the optical waveguide 6 fixed on the support member 5, as shown in FIG. 4C, the optical path conversion unit 62 is formed by a laser processing apparatus at a position where the core 60 intersects the optical path L1. For example, the position of the light emitting unit 30 is acquired by observing a pair of alignment marks 32 provided on the light emitting element 3 with a camera or the like, and the optical path changing unit 62 is formed by a laser processing apparatus according to the acquired position. To do. As described above, the optical transmission device 1 illustrated in FIGS. 1 to 3 is manufactured.

(Operation of optical transmission equipment)
Next, an example of the operation of the optical transmission device 1 will be described. First, when an electrical signal to be transmitted is input to the drive IC 4 via the electrode pad 20 of the substrate 2, the drive IC 4 sends a drive current for driving the light emitting element 3 to the light emitting element 3 based on the electrical signal. .

  The light emitting element 3 emits light from the light emitting unit 30 by the driving current from the driving IC 4, and the emitted light enters the mirror surface 62 a of the optical waveguide 6 through the optical path L 1.

  The light incident on the mirror surface 62a is converted from the optical path L1 to the optical path L2 by the mirror surface 62a and propagates in the core 60. The light propagated through the core 60 is emitted from the end portion of the optical waveguide 6, and the light emitted from the end portion is transmitted to, for example, another optical transmission device (not shown).

[Second Embodiment]
FIG. 5A is a top view of the optical transmission apparatus according to the second embodiment of the present invention, and FIG. 5B is a cross-sectional view taken along the line CC in FIG.

  The optical transmission device 1 according to the present embodiment includes a protective member (second member) 8 provided on the light emitting element 3 side of the optical waveguide 6, that is, between the support member 5 and the optical waveguide 6. Other configurations are the same as those of the first embodiment.

  The protection member 8 has, for example, a flat shape and is made of a transparent material that transmits light emitted from the light emitting element 3. The protective member 8 is attached to the support member 5 to form a box-shaped space with the substrate 2 and the support member 5, and the light emitting element 3 and the drive IC 4 are sealed in the space. In addition to the case where the protective member 8 is entirely transparent, the transmission part corresponding to the optical path of the light emitting element 3 may be partially transparent, or an opening may be provided in the transmission part. Good.

  As illustrated in FIG. 5A, the optical waveguide 6 is reduced in size along with the short side direction and the long side direction as compared with the first embodiment.

(Method for manufacturing optical transmission device)
Next, an example of a method for manufacturing the optical transmission device 1 according to the second embodiment will be described.

  6A to 6D are diagrams illustrating an example of each step of the method for manufacturing the optical transmission device. First, as in the first embodiment, the substrate 2, the light emitting element 3, the driving IC 4, and the support member 5 are prepared, the light emitting element 3 and the driving IC 4 are mounted on the substrate 2, and the light emitting element 3 and the driving IC 4 The substrate 2 and the driving IC 4 are connected by bonding wires 7 respectively. And the state shown to Fig.6 (a) is obtained by fixing the supporting member 5 to the board | substrate 2. FIG.

  Next, the protective member 8 is prepared, and as shown in FIG. 6B, the protective member 8 is disposed on the support member 5 and fixed to the support member 5 with an adhesive or the like.

  Next, the optical waveguide 6 in which the optical path conversion unit 62 is not formed is prepared, and the optical waveguide 6 is disposed on the protective member 8 as shown in FIG. The optical waveguide 6 is fixed to the protective member 8 so that the core 60 of the optical waveguide 6 intersects the optical path L1 of the emitted light.

  Next, in the optical waveguide 6 fixed on the protection member 8, as shown in FIG. 6D, the optical path conversion unit 62 is formed by a laser processing apparatus at a position where the core 60 intersects the optical path L1. At this time, the protective member 8 serves as a protective layer to prevent the processing waste of the optical waveguide 6 from falling on the substrate 2. Further, since the protective member 8 serves as a support for the optical waveguide 6 and the deflection of the optical waveguide 6 is reduced, the processing stability of the optical waveguide 6 is improved.

  As described above, the optical transmission device 1 illustrated in FIG. 5 is manufactured. Before attaching the protection member 8 to the support member 5, the optical waveguide 6 may be attached to the protection member 8 first, and the protection member 8 to which the optical waveguide 6 is attached may be attached to the support member 5.

  Regarding the operation of the optical transmission device 1, the first embodiment is performed except that the light emitted from the light emitting unit 30 of the light emitting element 3 passes through the protective member 8 and enters the mirror surface 62 a of the optical waveguide 6. Since this is the same as the embodiment, detailed description is omitted.

[Third Embodiment]
FIG. 7A is a top view of an optical transmission apparatus according to the third embodiment of the present invention, and FIG. 7B is a cross-sectional view taken along the line DD in FIG. 7A.

  The light emitting element 3 according to the first embodiment includes the light emitting unit 30 and the electrode pad 31 on the upper surface, and the optical waveguide 6 is provided on the upper surface 2 a of the substrate 2. On the other hand, the light emitting element 3 of the present embodiment has a flip chip structure, includes the light emitting unit 30 and the plurality of bumps 33 on the mounting surface side, and the optical waveguide 6 is provided on the lower surface 2b of the substrate 2. .

  That is, the optical transmission device 1 has a substrate 2 formed with an opening 21 through which light emitted from the light emitting unit 30 is passed in addition to the light emitting element 3 described above, and a flip chip structure similar to the light emitting element 3. The driving IC 4 having a plurality of bumps 41 and the optical waveguide 6 attached to the lower surface 2 b of the substrate 2 are provided.

  The opening 21 of the substrate 2 is formed at a position corresponding to the optical path L1 of the light emitted from the light emitting unit 30. The opening 21 may be filled with a light transmissive resin.

(Method for manufacturing optical transmission device)
Next, an example of a method for manufacturing the optical transmission device 1 according to the third embodiment will be described. First, the substrate 2, the light emitting element 3, and the driving IC 4 are prepared, and the light emitting element 3 and the driving IC 4 are mounted on the upper surface 2a of the substrate 2.

  Next, the optical waveguide 6 in which the optical path changing unit 62 is not formed is prepared, and the optical waveguide 6 is arranged so that the core 60 of the optical waveguide 6 intersects the optical path L1 of the light emitted from the light emitting unit 30 of the light emitting element 3. The substrate 2 is fixed to the lower surface 2b.

  Next, in the optical waveguide 6 fixed to the substrate 2, an optical path conversion unit 62 is formed by a laser processing apparatus at a position where the core 60 intersects the optical path L <b> 1.

  As described above, the optical transmission device 1 illustrated in FIG. 7 is manufactured. The light emitting element 3 and the driving IC 4 may be mounted on the substrate 2 after the optical waveguide 6 is attached to the substrate 2.

  Regarding the operation of the optical transmission device 1, except that the light emitted from the light emitting unit 30 of the light emitting element 3 passes through the opening 21 of the substrate 2 and enters the mirror surface 62 a of the optical waveguide 6. The detailed description is omitted because it is the same as the first embodiment.

[Fourth Embodiment]
FIG. 8A is a top view of an optical transmission device array according to the fourth embodiment of the present invention, and FIG. 8B is a cross-sectional view taken along the line EE of FIG. This optical transmission device array 100 is configured by arranging two optical transmission devices according to the first embodiment in the light propagation direction of the optical waveguide 6.

  That is, the optical transmission device array 100 includes an aggregate substrate 10 composed of two substrates 2A and 2B, two light emitting elements 3A and 3B and two drive ICs 4A and 4B mounted on the two substrates 2A and 2B, and Between the two light emitting elements 3A and 3B and the two driving ICs 4A and 4B, the support member 5 arranged so as to surround the optical waveguide 6 supported by the support member 5, and the light emitting elements on the same substrate and the driving IC. Etc., and a plurality of bonding wires 7 that are electrically connected to each other.

  Further, the optical transmission device array 100 is cut into two optical transmission devices along the separation line 11. The number of optical transmission devices constituting the optical transmission device array 100 is not limited to two, and may be three or more. The functions of each optical transmission device may be different, and for example, a light receiving element may be provided instead of the light emitting element.

(Method for manufacturing optical transmission device)
Next, an example of a method for manufacturing the optical transmission apparatus according to the fourth embodiment will be described.

  First, the collective substrate 10, the two light emitting elements 3A and 3B, the two driving ICs 4A and 4B, and the support member 5 are prepared, and the light emitting element and the driving IC are mounted on each substrate, and between the electrode pads in the substrate. Each is connected by a bonding wire 7. Then, the support member 5 is fixed to the collective substrate 10.

  Next, the optical waveguide 6 in which the optical path conversion unit is not formed is prepared, and the core 60 of the optical waveguide 6 intersects the optical path L1 of the light emitted from the light emitting units 30 of the two light emitting elements 3A and 3B. The optical waveguide 6 is fixed to the support member 5.

  Next, in the optical waveguide 6 fixed on the support member 5, two optical paths are provided at a position where the core 60 intersects the optical path L1 of the light emitting element 3A and a position where the core 60 intersects the optical path L1 of the light emitting element 3B. The converters 62A and 62B are formed, and the optical transmission device array 100 is manufactured.

  Then, by cutting the optical transmission device array 100 along the separation line 11 with a dicing saw, two optical transmission devices are manufactured.

[Fifth Embodiment]
FIG. 9 is a top view of an optical transmission device array according to the fifth embodiment of the present invention. This optical transmission device array 100 is configured by arranging four optical transmission devices according to the first embodiment in a direction perpendicular to the light propagation direction by the core 60.

  That is, the optical transmission device array 100 includes an aggregate substrate 10 composed of four substrates 2A to 2D, four light emitting elements 3A to 3D and four drive ICs 4A to 4D mounted on the substrates 2A to 2D, respectively, A support member 5 disposed so as to surround the light emitting elements 3A to 3D and the four drive ICs 4A to 4D, an optical waveguide 6 supported by the support member 5, and between the light emitting element and the drive IC on the same substrate. And a plurality of bonding wires 7 to be electrically connected.

  The optical transmission device array 100 is cut into four optical transmission devices along the separation lines 11A to 11C. The number of optical transmission devices constituting the optical transmission device array 100 is not limited to four, and may be two or three, or five or more.

  The optical waveguide 6 includes four cores 60A to 60D formed substantially in parallel, and the interval between adjacent cores substantially matches the mounting interval of the light emitting elements 3A to 3D.

(Method for manufacturing optical transmission device)
Next, an example of a method for manufacturing the optical transmission apparatus according to the fifth embodiment will be described.

  First, the collective substrate 10, the four light emitting elements 3 </ b> A to 3 </ b> D, the four driving ICs 4 </ b> A to 4 </ b> D, and the support member 5 are prepared, and the light emitting element and the driving IC are mounted on each substrate. Each is connected by a bonding wire 7. Then, the support member 5 is fixed to the collective substrate 10.

  Next, the optical waveguide 6 in which the optical path conversion unit is not formed is prepared, and the four cores 60A to 60D intersect the optical paths L1 of the light emitted from the light emitting units 30 of the four light emitting elements 3A to 3D, respectively. The optical waveguide 6 is fixed to the support member 5.

  Next, among the optical waveguides 6 fixed on the support member 5, four optical path conversion units 62A are arranged at positions where the four cores 60A to 60D intersect the four optical paths L1 corresponding to the four light emitting elements 3A to 3D, respectively. ˜62D are formed, and the optical transmission device array 100 is manufactured.

  Then, by cutting the optical transmission device array 100 along the separation lines 11A to 11C with a dicing saw, four optical transmission devices are manufactured.

[Sixth Embodiment]
FIG. 10A is a top view of an optical transmission device array according to the sixth embodiment of the present invention, and FIG. 10B is a cross-sectional view taken along line FF in FIG. In this optical transmission device array 100, a plurality of collective substrates composed of two substrates 2A and 2B are arranged in the light propagation direction of the optical waveguide 6. In the present embodiment, description will be made assuming that two aggregate substrates are arranged, but three or more aggregate substrates may be arranged in the horizontal direction of FIG.

  The optical transmission device array 100 is mounted on two aggregate substrates 10A and 10B, the light emitting element 3 and the drive IC 4 mounted on one substrate 2A constituting each of the aggregate substrates 10A and 10B, and the other substrate 2B. The light receiving element 9 and the amplifier circuit 12, the light emitting element 3, the driving IC 4, the support member 5 disposed so as to surround the light receiving element 9 and the amplifier circuit 12, the optical waveguide 6 supported by the support member 5, and the same substrate The upper light emitting element 3 and the driving IC 4, the light receiving element 9, and a plurality of bonding wires (not shown) for electrically connecting the amplifier circuit 12 and the like based on the light received by the light receiving element 9 are provided.

  Further, the optical transmission device array 100 is cut along the separation lines 11A and 11B, whereby an optical transmission device in which the light emitting element 3 and the light receiving element 9 are connected by the optical waveguide 6 is manufactured. The separation lines 11A and 11B are caused by the optical waveguide 6 between the light emitting element 3 provided on the substrate 2A included in the collective substrate 10A and the light receiving element 9 provided on the substrate 2B included in the other collective substrate 10B. The two aggregate substrates 10A and 10B and the optical waveguide 6 are separated from each other with the substrate 2A and the substrate 2B as a boundary so that optical transmission is possible.

  The light receiving element 9 has a light receiving portion 90 that receives light on its upper surface, an electrode pad (not shown) connected to the amplifier circuit 12 by a bonding wire, and a pair (not shown) formed at diagonal positions of the light receiving portion 30. And an alignment mark. As such a light receiving element 9, for example, a planar photodiode or the like can be used. The light receiving unit 90 receives light converted by the light conversion unit 62 provided on the upper surface of the light receiving element 9 from the optical path L2 to the optical path L3 which is a direction perpendicular to the upper surface of the light receiving element 9.

(Method for manufacturing optical transmission device)
Next, an example of a method for manufacturing the optical transmission apparatus according to the sixth embodiment will be described.

  First, two aggregate substrates 10A and 10B and the same number of light emitting elements 3, drive ICs 4, light receiving elements 9, amplifier circuit 12 and support member 5 as the aggregate substrates 10A and 10B are prepared, and light is emitted on the aggregate substrates 10A and 10B. The element 3, the driving IC 4, the light receiving element 9, and the amplifier circuit 12 are mounted, and the electrode pads in the substrate are connected by bonding wires. Then, the support members 5 are fixed to the collective substrates 10A and 10B, respectively.

  Next, an optical waveguide 6 in which an optical path conversion unit is not formed is prepared, and an optical path L1 of light emitted from the light emitting unit 30 of the light emitting element 3 and an optical path L3 of light received by the light receiving unit 90 of the light receiving element 9 The optical waveguide 6 is fixed to the support member 5 so that the cores 60 of the optical waveguide 6 intersect each other.

  Next, among the optical waveguides 6 fixed on the support member 5, the two optical path conversion units 62A and 62A are disposed at positions where the core 60 intersects the optical paths L1 and L3 of the light emitting element 3 and the light receiving element 9 on the collective substrate 10A. 62B is formed, and similarly, two optical path conversion units 62C and 62D are formed at positions where the core 60 intersects the optical paths L1 and L3 of the light emitting element 3 and the light receiving element 9 on the collective substrate 10B. Is manufactured.

  Then, the core 60 of the optical waveguide 6 is formed between the light emitting element 3 on the substrate 2A and the light receiving element 9 on the substrate 2B by cutting the optical transmission device array 100 along the separation lines 11A and 11B with a dicing saw. And an optical transmission device capable of optical transmission through the two optical path conversion units 62A and 62D is manufactured.

[Other embodiments]
In addition, this invention is not limited to said each embodiment, A various deformation | transformation is possible within the range which does not change the summary. For example, in the optical transmission device arrays according to the fourth to sixth embodiments, the optical transmission devices are arranged one-dimensionally in either the light propagation direction or the direction perpendicular to the light propagation direction. The optical transmission device may be arranged two-dimensionally, that is, both the direction and the direction perpendicular to the light propagation direction.

  The present invention is not limited to an optical transmission device, and can be applied to an optical transmission device including an optical waveguide, an optical transmission module having a light emitting element, and an optical reception module having a light receiving element.

  Moreover, the combination of the component between each embodiment can be performed arbitrarily. For example, the protective member according to the second embodiment may be provided in the optical transmission device arrays according to the fourth to sixth embodiments, or the optical element having the flip chip structure according to the third embodiment. May be used.

FIG. 1A is a top view of the optical transmission apparatus according to the first embodiment of the present invention, and FIG. 1B is a cross-sectional view taken along line AA of FIG. FIG. 2 is a top view of the optical transmission apparatus shown in FIG. 1 before mounting the optical waveguide. 3A is an enlarged top view of the optical path conversion unit, and FIG. 3B is a cross-sectional view taken along the line BB of FIG. 1B. 4A to 4C are diagrams illustrating an example of each step of the method of manufacturing the optical transmission device according to the first embodiment of the present invention. FIG. 5A is a top view of the optical transmission apparatus according to the second embodiment of the present invention, and FIG. 5B is a cross-sectional view taken along the line CC of FIG. 6A to 6D are diagrams illustrating an example of each step of the method of manufacturing the optical transmission device according to the second embodiment of the present invention. FIG. 7A is a top view of an optical transmission apparatus according to the third embodiment of the present invention, and FIG. 7B is a cross-sectional view taken along the line DD in FIG. 7A. FIG. 8A is a top view of an optical transmission device array according to the fourth embodiment of the present invention, and FIG. 8B is a cross-sectional view taken along the line EE of FIG. FIG. 9 is a cross-sectional view of an optical transmission device array according to the fifth embodiment of the present invention. FIG. 10A is a top view of an optical transmission device array according to the sixth embodiment of the present invention, and FIG. 10B is a cross-sectional view taken along line FF in FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Optical transmission apparatus, 2, 2A-2D ... Board | substrate, 2a ... Upper surface, 2b ... Lower surface, 3, 3A-3D ... Light emitting element, 4 ... Drive IC, 5 ... Support member, 6 ... Optical waveguide, 7 ... Bonding wire , 8 ... Protective member, 9 ... Light receiving element, 10 ... Collective substrate, 11, 11A to 11C ... Disconnection line, 12 ... Amplifier circuit, 20 ... Electrode pad, 21 ... Opening, 30 ... Light emitting part, 31 ... Electrode pad, 32 ... Alignment mark, 33 ... Bump, 40 ... Electrode pad, 41 ... Bump, 60, 60A-60D ... Core, 61 ... Cladding, 62, 62A-62D ... Optical path conversion unit, 62a ... Mirror surface, 100 ... Optical transmission device array

Claims (9)

A first step of attaching an optical waveguide having a core for propagating light and a clad covering the core to the substrate so that the core intersects an optical path of light received or emitted by an optical element on the substrate;
And a second step of forming a conversion unit that converts the optical path in a direction in which the core propagates light at a position where the core intersects the optical path in the optical waveguide.   The method of manufacturing an optical transmission device according to claim 1, wherein the optical waveguide includes a member provided on the optical element side.   2. The method of manufacturing an optical transmission device according to claim 1, wherein a shape of a cross section of the core of the optical waveguide is a rectangle in which a side in a direction intersecting the optical path is longer than a side in a direction parallel to the optical path. A plurality of the optical elements are provided on the substrate,
In the first step, the optical waveguide is attached to the substrate such that the core intersects a plurality of optical paths of light received or emitted by a plurality of optical elements on the substrate,
The second step forms a plurality of conversion units that convert the plurality of optical paths in a direction in which the core propagates light at positions where the core intersects the plurality of optical paths in the optical waveguide. Item 14. A method for manufacturing an optical transmission device according to Item 1. An optical waveguide having a core for propagating light and a clad covering the core, and the cores respectively in a plurality of optical paths of light received or emitted by optical elements respectively provided on a plurality of sub-substrates included in the collective substrate A first step of attaching to the collective substrate so as to intersect;
A second step of forming a plurality of conversion units that convert the plurality of optical paths in a direction in which the core propagates light at positions where the core intersects the plurality of optical paths, respectively, in the optical waveguide;
And a third step of separating the collective substrate and the optical waveguide for each of the sub-substrates. A plurality of optical paths of light received or emitted by a light receiving element or a light emitting element provided on a plurality of sub-substrates of a plurality of aggregate substrates, each having an optical waveguide having a core for propagating light and a clad covering the core A first step of attaching to the plurality of collective substrates such that the cores cross each other;
A second step of forming a plurality of conversion units that convert the plurality of optical paths in a direction in which the core propagates light at positions where the core intersects the plurality of optical paths, respectively, in the optical waveguide;
Optical transmission can be performed by the optical waveguide between the light emitting element provided on the child substrate included in the collective substrate and the light receiving element provided on the child substrate included in another collective substrate. Thus, the manufacturing method of the optical transmission apparatus including the 3rd process of isolate | separating the said some assembled substrate and the said optical waveguide for every said child substrate. A substrate on which an optical element is mounted;
A first member attached to the optical element side of the substrate;
A core that propagates light on the first member, a clad that covers the core, and a conversion unit that converts an optical path of light received or emitted by an optical element on the substrate into a direction in which the core propagates light An optical transmission device comprising:   The optical transmission device according to claim 7, further comprising a second member provided between the first member and the optical waveguide.   The core has a core for propagating light, and a clad covering the core, and is attached to the substrate, and the core is located at a position where the core intersects an optical path of light received or emitted by the optical element on the substrate. An optical waveguide in which a conversion unit that converts the optical path in a direction of propagating light is formed.

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