JP2010151699A - Inflow preventing device of impurities - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inflow preventing device of impurities for preventing the impurities generated when solder melts by heat in a vacuum heater from entering a vacuum measurement device, preventing the impurities from accumulating in the vacuum measurement device, and also accurately measuring the degree of vacuum in the vacuum heater. <P>SOLUTION: The inflow prevention device of impurities couples the vacuum heater for heating a metal box and a lid under vacuum and welding them with solder with the vacuum measurement device for measuring the degree of vacuum in the vacuum heater. A cylindrical metallic connecting pipe 3 is protrusively provided at right angles on a cylindrical metallic supporting pipe 2, having both ends opened and capable of connection. An inflow preventive tool 3, having a plurality of inflow preventing plates 7 fixed at predetermined intervals to a tip of a support rod 6 protrusively provided at the center of a fixed plate 5, is inserted from one of openings 11 in the support pipe 2 and mounted. A plurality of connecting holes 8 are formed on each inflow preventing plate 7, and in addition, the inflow preventing plate 7 is provided so that the connection holes 8 have a shape with the adjacent inflow preventing plates 7 intersecting with one another. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an impurity inflow prevention device, and in particular, when a metal box is processed with solder in a vacuum heating device, impurities, oxides, etc. (hereinafter simply referred to as impurities) that have evaporated and scattered from the solder by heating are scattered. The present invention relates to a device for preventing inflow into a device for measuring a degree of vacuum.

  Conventionally, as shown in FIG. 6, a metal box A having an upper surface opened and containing a metal box a and a lid b for housing components, and a paste-like solder c attached to the back surface of the lid b is provided. A vacuum heating device used to seal the box A by covering the box b with the box body a and welding the box body a and the cover body b by heating under vacuum to melt the solder c A vacuum degree measuring device for measuring the degree of vacuum in the vacuum heating device is provided.

  The box body a contains parts such as electronic parts that can be used for various products of various manufacturers in a wide range of industrial fields, and the entire sealed metal box A is a finished part. Used in products and equipment.

  A storage shelf having a plurality of upper and lower shelves is installed in the vacuum heating apparatus, and a plurality of metal box bodies a covered with a lid body b before soldering are arranged and mounted on each shelf. Can be placed. And the heating apparatus like a conventionally well-known heater for heating the box body a and the cover body b is attached to the storage shelf.

  Covering the lid b with the parts housed in the box a and placing them on the shelves and heating them under vacuum, the box a and the lid b are heated together with the housing shelves, and at the same time the solder c Is heated by the heat transferred to a molten state, and the solder c adheres to the four upper edges of the box body a, so the box body a and the cover body b are fixed together, and the box body a is sealed by the cover body b. Is done.

  In a conventional vacuum heating apparatus, a vacuum degree measuring apparatus incorporating a sensor is connected via a cylindrical connecting pipe. The gas in the vacuum heating device is sucked through the connecting pipe constantly or regularly or as necessary, and the degree of vacuum in the vacuum heating device is monitored to determine whether it is an appropriate value.

As a result of the measurement, when the inside of the vacuum heating device does not have a set degree of vacuum, an external control device (not shown) is operated to maintain a proper degree of vacuum by pressurization or decompression. . The reason why the vacuum heating apparatus is evacuated is to prevent oxidation, remove solvent bubbles, remove impurities, and the like.
JP-A-7-79071

In the conventional vacuum heating apparatus described above, when the solder c is melted by heat, impurities generated from the solder c are evaporated and scattered in the vacuum heating apparatus. When the vacuum measuring device sucks the gas in the vacuum heating device in order to measure the vacuum, the impurities together with the gas flow into the vacuum measuring device through the connecting pipe, so that they adhere to the sensor and cause an error in the measuring degree. And the inside of the vacuum measuring device is contaminated.

  Furthermore, if impurities enter and adhere to the vacuum measuring device, an impurity layer is formed, so that it cannot be used for a long time, and the contaminated vacuum measuring device needs to be replaced with a new vacuum measuring device. In addition, there is a burden of frequent maintenance and inspection.

  Japanese Patent Application Laid-Open No. 7-79071 shown as Patent Document 1 discloses a technique in which solder is heated and melted in a vacuum heating device 22 to solder an electronic component. However, impurities and oxidation generated when the solder is melted are disclosed. There is no disclosure or suggestion regarding the removal of objects and the like, and the degree of vacuum measurement device and the connecting pipe. Further, there is no known document related to the present invention “impurity inflow prevention device”.

  In view of the problems of the prior art described above, the present invention prevents impurities generated when solder is melted by heat in the vacuum heating device from flowing into the vacuum measuring device, and the impurities accumulate in the vacuum measuring device. In addition, the present invention provides an impurity inflow prevention device aimed at enabling accurate measurement of the degree of vacuum in a vacuum heating device.

  A device that connects a vacuum heating device that heats a metal box and lid under vacuum and welds them with solder, and a vacuum measuring device that measures the vacuum of the vacuum heating device, with a metal that is open at both ends A metal cylindrical continuous pipe 3 is provided on the cylindrical support pipe 2 so as to project at right angles so as to be able to circulate, and is provided in the support pipe 2 so as to protrude from the opening 11 on one side to the center of the fixed plate 5. An inflow prevention tool 3 having a plurality of inflow prevention plates 7 fixed at a predetermined interval is inserted into and attached to the tip of the support bar 6, and a plurality of flow holes 8 are formed in each inflow prevention plate 7 and adjacent inflow prevention plates 7 is provided with an inflow prevention plate 7 so as to be crossed. There are two or three inflow prevention plates 7.

  The impurity inflow prevention device of the present invention can prevent impurities evaporated from the solder in the vacuum heating device 19 from flowing into the vacuum degree measuring device 22. In particular, a vacuum heating device 19 and a vacuum are formed by a metal cylindrical support tube 2 having both ends opened to form a T-shaped cylindrical body and a metal cylindrical continuous tube 3 projecting perpendicularly to the support tube 2. Since the inflow prevention plate 7 is provided in the middle of the flow into the vacuum degree measurement device 22 because the degree measurement device 22 is connected, the gas can flow but the impurities are captured by the inflow prevention plate 7.

  Therefore, no impurities adhere to the sensor in the vacuum measuring device 22 or the inside of the vacuum measuring device 22 is contaminated. Therefore, the degree of vacuum in the vacuum heating device 19 is accurately measured and the set degree of vacuum is Can keep.

  In the support tube 2, an inflow prevention device 4 in which a plurality of inflow prevention plates 7 are fixed at predetermined intervals from the opening 11 on one side to the tip of a support bar 6 protruding from the center of the fixing plate 5 is mounted. By forming the plurality of flow holes 8 in each inflow prevention plate 7 and arranging the inflow prevention plate 7 on the support rod 6 so that the flow holes 8 of the adjacent inflow prevention plates 7 intersect each other, impurities are prevented from entering each other. It can contact with and adhere to the flat portion of the plate 7 to prevent the inflow of impurities.

  The impurity inflow prevention device 1 can be attached to and detached from the vacuum heating device 19 and the vacuum degree measurement device 22, and the inflow prevention device 4 can be attached and detached. Since it is possible and maintenance and inspection are easy, the vacuum measuring device 22 can be used for a long time.

Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.
FIG. 1 relates to an impurity inflow prevention device according to the present invention. This device 1 is a cylindrical continuous tube having a tip opened substantially at the center of a cylindrical support tube 2 having both ends opened, as shown in FIGS. An inflow preventive tool 4 is mounted in the support tube 2 as a T-shaped tube body in which the installation tube 3 protrudes integrally and can be circulated inside.

  As shown in FIGS. 2 and 3, the inflow prevention device 4 has a support bar 6 that protrudes horizontally at the center of a circular fixing plate 5 and a disc at the tip of the support bar 6 in which a thread groove is formed. The plate-shaped inflow prevention plate 7 is fixed in a state orthogonal to the support rod 6. In addition, although the thread groove is formed in the full length of the support bar 6, you may provide in the range which fixes the inflow prevention board 7. FIG.

  A hole through which the support rod 6 passes is formed in the center of the two or more inflow prevention plates 7, and a plurality of holes, usually in the plane circumferential direction of each inflow prevention plate 7, centered on this hole. 3 to 4 flow holes 8 penetrate and are equally arranged. The inflow prevention plate 7 is used in the current inflow prevention device 1 because it has a diameter of about 15 mm and a thickness of about 1 mm. Depending on the size of the flow holes 8, the number of the flow holes 8 is 3 to 3. Four is appropriate.

  A plurality of inflow prevention plates 7 are installed at the front end of the support rod 6. Between the inflow prevention plates 7, nuts or rings 9 screwed into the support rods 6 are interposed between the inflow prevention plates 7. The inflow prevention plate 7 is regulated at a predetermined interval (about 3 mm to 5 mm interval), and the inflow prevention plate 7 positioned at both ends is tightened from the outside so that the inflow prevention plate 7 is stable without causing a positional shift.

  When a plurality of inflow prevention plates 7 are fixed to the support rod 6, as shown in FIG. 4, the circulation holes 8 formed in the circumferential direction of the inflow prevention plates 7 intersect with the adjacent inflow prevention plates 7. Each inflow prevention plate 7 is arranged on the support bar 6 so as to shift the position.

  In the drawing, the case where two inflow prevention plates 7 are fixed to the support rod 6 is shown, but a plurality of three or more may be used. If the number is three, the flow holes 8 of the inflow prevention plates 7 on both sides at the position intersecting the flow holes 8 of the central inflow prevention plate 7 are symmetrically located at the same position.

  The inflow prevention tool 4 described above is inserted through the opening 11 on one side of the support tube 2 with the inflow prevention plate 7 side first, but the plurality of inflow prevention plates 7 pass through the position where the continuous tube 3 protrudes. Until it is located between the opening 12 on the opposite side.

  And the fixing plate 4 of the inflow prevention tool 3 and the flange 13 of the support tube 2 use the clamp 14, and are closely connected through an O-ring. Since the T-shaped tube body composed of the support tube 2 and the continuous tube 3 is symmetrical, the inflow prevention device 4 may be inserted through any opening of the support tube 2.

  For the clamp 14, a conventionally known one in which one end portions of a pair of semicircular clamping members 15 are axially connected to be openable and the other free end can be fixed by tightening a screw 16 with a nut 17 is used. Can do. Then, the outer peripheral surface of the inflow prevention plate 7 after the insertion is fitted so as not to create a gap in the inner peripheral surface of the support tube 2. The support tube 2, the connecting tube 3, the inflow prevention device 4 and the like described above are made of metal, but the metal material to be used is not particularly limited as long as it is not corroded by solder impurities.

The inflow prevention device 1 of the present invention has the above-described configuration, and next, a use state will be described.
As shown in FIG. 5, after mounting the inflow preventing device 4 in the support tube 2, the flange 18 on the side of the opening 12 opposite to the opening 11 through which the inflow preventing device 4 is inserted, and the conventional structure described above. The flange 20 protruding from the same vacuum heating device 19 is closely connected by the same clamp 14 as the clamp 14.

  Further, the flange 21 of the distal end opening of the continuous tube 3 and the flange 23 of the same vacuum degree measuring device 22 incorporating the sensor are closely connected by the same clamp 14 (not shown). In the drawing, the continuous tube 3 is directed downward, but it may be directed upward or laterally at the installation position of the vacuum measuring device 22.

  After the vacuum heating device 19 and the degree-of-vacuum measurement device 22 are connected through the inflow prevention device 1 in this way, a metal box with a plurality of shelves in the vacuum heating device 19 covered with a lid (see FIG. 5). Is heated in a vacuum state to melt the solder on the back surface of the lid and weld the lid to a metal box.

  When the solder melts and evaporates with heat and the scattered impurities flow in the direction of the vacuum measuring device 22 through the support tube 2 and the connecting tube 3 together with the gas, the impurities are prevented from flowing into the inflow prevention plate 7 located at the tip of the inflow prevention device 4. Only the gas passes through the flow hole 8. At this time, the impurities are blocked from flowing by the inflow prevention plate 7 and are filled in the support tube 2, and therefore adhere to the inner surface of the support tube 2.

  Not all impurities adhere to the first inflow prevention plate 7, and some of the impurities pass through the flow holes 8 of the first inflow prevention plate 7 together with the gas, but the next inflow prevention that faces this flow hole 8. It collides with and adheres to the plane of the plate 7 and is prevented from flowing in.

  As described above, impurities can be prevented from reaching the vacuum measuring device 22 in advance. Therefore, the flow holes 8 of the adjacent inflow prevention plates 7 are provided at positions intersecting with each other so that the flow of gas and impurities from the vacuum heating device 19 to the vacuum degree measuring device 2 does not become a linear flow.

  If four or five inflow prevention plates 7 are installed, impurities can be efficiently prevented from reaching the vacuum measuring device 2, but if there are many inflow prevention plates 7, the inflow speed of the vacuum gas is increased. In addition, it is difficult to install a plurality of sheets due to the structure, and it is desirable to install two to three inflow prevention plates 7. However, if the vacuum heating device 19 increases in size, the inflow prevention device 1 also increases in size, and the size and number of the inflow prevention plates 7 change accordingly.

  In the above description, the number of the flow holes 8 provided in the inflow prevention plate 7 has been described. However, since impurities adhere to the plane portion other than the holes formed in the flow holes 8, the amount of attached impurities is taken into consideration as much as possible. Thus, the size and number of the flow holes 8 are determined. Of course, if the whole vacuum heating device 19 becomes large, the number and size of the flow holes 8 are set.

  When impurities adhere to the inflow prevention plate 7 and are contaminated, only the inflow prevention device 3 is removed and the inflow prevention plate 7 may be replaced with a new one. The contaminated inflow prevention plate 7 may be washed and stored for the next use. Alternatively, the entire inflow prevention device 4 may be replaced and the washed inflow prevention device 3 may be stored for the next use. Alternatively, the entire device 1 can be replaced because it is easy to attach and detach with the clamp 14.

  Since the box and the lid are heated under vacuum and impurities generated during welding with the solder are trapped in the middle to prevent inflow into the vacuum measuring device 22, the vacuum measuring device 22 can be stabilized. Can be used.

It is a perspective view of the inflow prevention device of the present invention impurity. It is a perspective view of the state which decomposed | disassembled the inflow prevention apparatus of this invention impurity. It is a perspective view which expands and shows an inflow prevention tool. It is the front view which looked at the inflow prevention tool from the inflow prevention board side. It is the side view which made a part the section which shows use condition. It is a perspective view of a metal box.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Inflow prevention apparatus 2 Support pipe 3 Connecting pipe 4 Inflow prevention tool 5 Fixing plate 6 Support rod 7 Inflow prevention plate 8 Flow hole 9 Ring 10 Nut 11 Opening part 12 Opening part 13 Flange 14 Clamp 15 Clamping member 16 Screw 17 Nut 18 Flange 19 Vacuum heating device 20 Flange 21 Flange 22 Vacuum degree measuring device 23 Flange

Claims (3)

A device that connects a vacuum heating device that heats a metal box and lid under vacuum and welds them with solder, and a vacuum measuring device that measures the vacuum of the vacuum heating device, with a metal that is open at both ends A metal cylindrical continuous pipe 3 is provided on the cylindrical support pipe 2 so as to project at right angles so as to be able to circulate, and is provided in the support pipe 2 so as to protrude from the opening 11 on one side to the center of the fixed plate 5. An inflow prevention tool 3 having a plurality of inflow prevention plates 7 fixed at a predetermined interval is inserted into and attached to the tip of the support bar 6, and a plurality of flow holes 8 are formed in each inflow prevention plate 7 and adjacent inflow prevention plates 7. An inflow prevention device for impurities, wherein an inflow prevention plate 7 is arranged so that the flow holes 8 of FIG. The impurity inflow prevention device according to claim 1, wherein the inflow prevention plates are two. The impurity inflow prevention device according to claim 1, wherein the inflow prevention plate has three sheets.

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