JP2010149520A - Release film and method for manufacturing flexible printed-wiring board employing the same - Google Patents

Release film and method for manufacturing flexible printed-wiring board employing the same Download PDF

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Publication number
JP2010149520A
JP2010149520A JP2010007897A JP2010007897A JP2010149520A JP 2010149520 A JP2010149520 A JP 2010149520A JP 2010007897 A JP2010007897 A JP 2010007897A JP 2010007897 A JP2010007897 A JP 2010007897A JP 2010149520 A JP2010149520 A JP 2010149520A
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Prior art keywords
release film
release
wiring board
flexible printed
fpc
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JP2010007897A
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Japanese (ja)
Inventor
Yasunori Takahashi
靖典 高橋
Masataka Maeda
真孝 前田
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Sumitomo Bakelite Co Ltd
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Sumitomo Bakelite Co Ltd
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Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP2010007897A priority Critical patent/JP2010149520A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds

Abstract

<P>PROBLEM TO BE SOLVED: To improve releasability and moldability at pressing, which are not satisfied by the conventional release film, under the condition that characteristics excellent in to-shape followability, uniform moldability, platability and wrinkles on a finishing outer appearance of FPC at the bonding of a cover layer to a flexible circuit member in the manufacturing of a rigid flexible or a flexible printed wiring board (FPC). <P>SOLUTION: The provided release film has a release layer containing polybutyleneterephthalate, the modulus of viscoelasticity of which at 180°C is 50-250 MPa, or a copolymer of polybutyleneterephthalate and polytetramethyleneglycol. The release layer is preferably embossed with a specified roughness. Further, the method for manufacturing the flexible and rigid flexible printed-wiring board employing the release film is provided. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明はフレキシブルプリント配線板又はリジッドフレキシブルプリント配線板の製造工程において用いられる離型フィルムに関する。また、本発明は、この離型フィルムを用いたフレキシブル又はリジッドフレキシブルプリント配線板の製造法に関する。   The present invention relates to a release film used in a manufacturing process of a flexible printed wiring board or a rigid flexible printed wiring board. Moreover, this invention relates to the manufacturing method of the flexible or rigid flexible printed wiring board using this release film.

フレキシブルプリント配線板(以下、ＦＰＣということがある)は、ポリイミドフィルムなど絶縁基材の表面に所定の回路を設けたフレキシブル回路部材より構成されている。このようなＦＰＣは、通常、フレキシブル回路部材を、接着剤付きの耐熱樹脂フィルムであるカバーレイで被覆して絶縁及び回路保護を行い、離型フィルムを介在させてプレス機を用いプレスラミネートして製造される。   A flexible printed wiring board (hereinafter sometimes referred to as FPC) is composed of a flexible circuit member having a predetermined circuit provided on the surface of an insulating substrate such as a polyimide film. In such FPC, usually, a flexible circuit member is covered with a cover lay, which is a heat-resistant resin film with an adhesive, to insulate and protect the circuit, and press laminate using a press machine with a release film interposed. Manufactured.

このような製造工程においては、ＦＰＣとプレス機の当板との間に良好な離型性のあること、カバーレイがフレキシブル回路部材の凹凸に充分に追従し接着していること、ＦＰＣへの圧力が全体に均一化されることなどが要求される。即ち離型性、対形状追従性、ＦＰＣ全体への均一な圧力による脱ボイド性を包含したＦＰＣ製造における良好な「成形性」が求められる。
離型フィルムに必要な他の特性としては、仕上がりＦＰＣの外観シワが少ないこと、カバーレイの接着剤のフロー量が少ないこと、プレス時のカバーレイ端面からの接着剤の滲み出し量が少ないこと、導体部の汚染がなく後工程において回路へのメッキ付がよいこと、使用後の離型フィルムに破れのないことなどが挙げられる。これら特性評価の基準については、日本国内においてＪＰＣＡ規格が存在する。 In such a manufacturing process, there is good releasability between the FPC and the pressing plate of the press machine, the cover lay sufficiently follows and adheres to the unevenness of the flexible circuit member, The pressure is required to be uniform throughout. That is, good “moldability” in FPC production including mold release, anti-shape following property, and void removal due to uniform pressure on the entire FPC is required.
Other properties required for the release film are that the finished FPC has less appearance wrinkles, the flow rate of the coverlay adhesive is small, and the amount of adhesive oozing out from the coverlay edge during pressing is small. In addition, there is no contamination of the conductor part, and it is preferable that the circuit is plated in a later process, and that the release film after use is not torn. There are JPCA standards for these characteristics evaluation standards in Japan.

本発明の目的は、ＦＰＣ製造時に用いられる公知の離型フィルムと同等の特性を有しつつ、これらでは充分でなかった離型性と対形状追従性を改善した離型フィルムを提供することにある。また、本発明はこの離型フィルムを用いたＦＰＣの製造法を提供するものである。この離型フィルムは公知の離型フィルムに比較して、引裂き強度、伸び、引張強度、コストにも優れる。   An object of the present invention is to provide a release film having the same properties as those of known release films used at the time of FPC production but having improved release properties and anti-shape following properties that were not sufficient with these. is there. Moreover, this invention provides the manufacturing method of FPC using this release film. This release film is superior in tear strength, elongation, tensile strength, and cost as compared with known release films.

本発明は、１８０℃における粘弾性率が５０〜２５０ＭＰａであるポリブチレンテレフタレート、又はポリブチレンテレフタレートとポリテトラメチレングリコールとの共重合体を含む離型層を有してなる離型フィルムを提供するものである。   The present invention provides a release film having a release layer containing polybutylene terephthalate having a viscoelasticity of 50 to 250 MPa at 180 ° C. or a copolymer of polybutylene terephthalate and polytetramethylene glycol. Is.

本願の他の発明は、フレキシブル又はリジッドフレキシブルプリント配線板の製造にあたり、フレキシブル回路部材、カバーレイ(カバーレイ類似の接着フィルム)及び前記離型フィルムをこの順に重ねてプレスラミネート処理するフレキシブルプリント配線板及びリジッドフレキシブルプリント配線板を含むプリント配線板の製造方法を提供するものである。   Another invention of the present application is a flexible printed wiring board in which a flexible circuit member, a cover lay (an adhesive film similar to a cover lay), and the release film are stacked in this order to produce a flexible or rigid flexible printed wiring board. And the manufacturing method of the printed wiring board containing a rigid flexible printed wiring board is provided.

発明の詳細な記述Detailed description of the invention

つぎに本発明についてさらに詳細に説明する。プリント配線板には、ＦＰＣ(フレキシブルプリント配線板)のほかに、リジッドフレキシブルプリント配線板と言われるものがある。かかるプリント配線板の製造工程においても、ＦＰＣと同様、リジッドフレキシブルプリント回路部材を、カバーレイと類似の接着フィルムで被覆し、これを本発明の離型フィルムを使用してプレスラミネートしプリント配線板を製造することができる。したがって、以下の説明ではＦＰＣについて述べる。
ＦＰＣの製造において、離型フィルムには良好な離型性が必要である。離型性が低いと、プレスラミネート処理後の剥離にあたり、フィルムがＦＰＣに接着して破れたり、逆にＦＰＣの回路が剥がれるなどの問題を生じる。 Next, the present invention will be described in more detail. As the printed wiring board, there is a so-called rigid flexible printed wiring board in addition to the FPC (flexible printed wiring board). Also in the manufacturing process of such a printed wiring board, like FPC, a rigid flexible printed circuit member is covered with an adhesive film similar to a coverlay, and this is press-laminated using the release film of the present invention, and the printed wiring board. Can be manufactured. Therefore, FPC will be described in the following description.
In the production of FPC, a release film needs to have good release properties. If the releasability is low, problems arise such that the film adheres to the FPC and is broken upon peeling after the press laminating process, or the FPC circuit peels off.

(離型層)
フィルムの離型層に用いられる樹脂は、温度１８０℃における粘弾性率(Ｐａ)が５０〜２５０ＭＰａ、好ましくは６０〜２００ＭＰａ、より好ましくは７０〜１５０ＭＰａの熱可塑性樹脂である。粘弾性率がこれより小さいと、必要なプレス温度では離型層樹脂の表面が軟化し流動性が高くなり、ＦＰＣの銅箔部分に融着し離型性に劣る。また、粘弾性率が前記範囲より大きいと、離型性は良好であるがカバーレイに付着している接着剤のフロー量が多くなり対形状追従性が低下する。また、温度１２０℃における粘弾性率(Ｐａ)は１３０〜３００ＭＰａであるのが好ましい。
かかる熱可塑性樹脂としては、具体的にはポリブチレンテレフタレート系樹脂が好ましい。このような樹脂としては、ポリブチレンテレフタレート（以下、ＰＢＴということがある）、又はその共重合体が挙げられる。かかる共重合体としては、ポリブチレンテレフタレートとポリテトラメチレングリコールとの共重合体が好ましい。共重合体の共重合比率については特に限定されない。 (Release layer)
The resin used for the release layer of the film is a thermoplastic resin having a viscoelasticity (Pa) at a temperature of 180 ° C. of 50 to 250 MPa, preferably 60 to 200 MPa, and more preferably 70 to 150 MPa. If the viscoelastic modulus is smaller than this, the surface of the release layer resin is softened at the required pressing temperature and the fluidity is increased, and it is fused to the copper foil portion of the FPC, resulting in poor release properties. On the other hand, when the viscoelastic modulus is larger than the above range, the mold release property is good, but the flow amount of the adhesive adhering to the cover lay increases and the anti-shape following property decreases. The viscoelastic modulus (Pa) at a temperature of 120 ° C. is preferably 130 to 300 MPa.
Specifically, such a thermoplastic resin is preferably a polybutylene terephthalate resin. Examples of such a resin include polybutylene terephthalate (hereinafter sometimes referred to as PBT) or a copolymer thereof. As such a copolymer, a copolymer of polybutylene terephthalate and polytetramethylene glycol is preferable. The copolymerization ratio of the copolymer is not particularly limited.

この離型層の片側にはクッション層が設けられてよい。また、クッション層の離型層側とは反対面に、さらに副離型層を設けるのが好ましい。かかる２つの離型層は同一の樹脂を用いてもよく、異なっていてもよい。
離型層の厚みは、１０〜１００μｍ、好ましくは１５〜５０μｍである。離型層がこれより薄いとプレスラミネート後、離型層が破れ、ＦＰＣと離型フィルムの分離の際に、ＦＰＣ側に離型層樹脂が残る。一方、前記の範囲より厚いと対形状追従性に劣りカバーレイに付着している接着剤のフロー量が多くなる。 A cushion layer may be provided on one side of the release layer. Moreover, it is preferable to provide a sub release layer on the opposite side of the cushion layer from the release layer side. The two release layers may use the same resin or may be different.
The thickness of the release layer is 10 to 100 μm, preferably 15 to 50 μm. If the release layer is thinner than this, the release layer is broken after press lamination, and the release layer resin remains on the FPC side when the FPC and release film are separated. On the other hand, if it is thicker than the above range, the conformal followability is inferior and the amount of the adhesive that adheres to the coverlay increases.

前記離型層は、表面１０点平均粗さ(Ｒｚ)が１０〜４５μmであるのが好ましい。このような離型層の表面粗さはエンボス処理など公知の表面処理法により得られる。エンボス処理による場合、高温、高圧にて、マットロールにフィルムを通すことによって行う方法、或いはダイスから出てきたフィルムにタッチロールでエンボス冷却ロールに押し当てる方法などが採用できる。このようなエンボス処理において温度は１２０〜２２０℃、好ましくは離型層樹脂の軟化温度１４０〜１９０℃が好ましい。エンボス処理時の圧力は、５０〜２００ｋｇｆ／ｍｍ２（ゲージ圧）、好ましくは６０〜１２０ｋｇf／ｍｍ２である。エンボス用のマットロールの粗さは、１０点平均粗さ（Ｒｚ）０.０５μｍ〜１ｍｍである。離型層の表面粗さは、Ｒｚ＝１０〜４５μｍ、好ましくは１５〜４３μｍである。表面粗さが前記の範囲より小さいと離型層破れが発生することがある。一方、前記の範囲を超えると、エンボス柄がＦＰＣに転写される。 The release layer preferably has a surface 10-point average roughness (Rz) of 10 to 45 μm. Such a surface roughness of the release layer can be obtained by a known surface treatment method such as an emboss treatment. In the case of the embossing treatment, a method of passing the film through the mat roll at high temperature and high pressure, or a method of pressing the film coming out of the die against the embossing cooling roll with a touch roll can be adopted. In such embossing treatment, the temperature is preferably 120 to 220 ° C, and preferably the softening temperature 140 to 190 ° C of the release layer resin. The pressure during embossing is 50 to 200 kgf / mm 2 (gauge pressure), preferably 60 to 120 kgf / mm 2 . The roughness of the embossing mat roll is 10-point average roughness (Rz) of 0.05 μm to 1 mm. The surface roughness of the release layer is Rz = 10 to 45 μm, preferably 15 to 43 μm. If the surface roughness is smaller than the above range, the release layer may be broken. On the other hand, if the above range is exceeded, the embossed pattern is transferred to the FPC.

(クッション層)
離型フィルムのクッション層は離型層とは異なる熱可塑性樹脂であるのが好ましい。樹脂としては、軟化温度(ビカット軟化温度)５０〜１６０℃であるのが好ましい。樹脂の軟化温度が５０℃未満であるとプレス時に離型フィルムの端面より樹脂が滲み出してきて、プレス熱盤等に付着し、次工程における二次汚染の懸念がある。一方、１６０℃を超えると成形性が低下し、ＦＰＣ細部にボイドが発生する。クッション層の厚みは特に限定されない。
このような樹脂として、具体的にはポリエチレン系樹脂、ポリプロピレン系樹脂、エチレン−メチルメタクリレート(以下、ＥＭＭＡという)系樹脂などが挙げられる。離型層とクッション層との間には、接着樹脂を介在させてもよいが、ない方がフィルム端面の滲みだしが少なく好ましい。 (Cushion layer)
The cushion layer of the release film is preferably a thermoplastic resin different from the release layer. The resin preferably has a softening temperature (Vicat softening temperature) of 50 to 160 ° C. When the softening temperature of the resin is less than 50 ° C., the resin oozes out from the end face of the release film during pressing, adheres to the press hot platen, and there is a concern of secondary contamination in the next process. On the other hand, if it exceeds 160 ° C., the moldability is lowered and voids are generated in the FPC details. The thickness of the cushion layer is not particularly limited.
Specific examples of such resins include polyethylene resins, polypropylene resins, and ethylene-methyl methacrylate (hereinafter referred to as EMMA) resins. An adhesive resin may be interposed between the release layer and the cushion layer. However, it is preferable that the adhesive resin is not present because there is less bleeding of the film end face.

(離型フィルムの製造法)
本発明の離型フィルムにおいて、多層のフィルムを製造するには、共押出ラミネート法、押出ラミネート法、ドライラミネート法など、従来公知のラミネート法がいずれも用いられてよい。 (Manufacturing method of release film)
In the release film of the present invention, any conventionally known laminating method such as a coextrusion laminating method, an extrusion laminating method, or a dry laminating method may be used for producing a multilayer film.

本発明のフィルムは、ＦＰＣの製造工程において、公知の離型フィルムと同様にして、カバーレイのプレスラミネート時の離型フィルムとして用いられる。このプレスラミネートにあたっては、例えば、熱盤の間にＳＵＳ板、紙、離型フィルム、カバーレイ(接着フィルム)、フレキシブル回路部材(片面)、ＳＵＳ板の順に重ねた構成物を置き、所定条件にて加熱加圧後、後硬化を行う。一般的には、離型フィルム、カバーレイ、フレキシブル回路部材をくり返し積層することもできる。本発明の離型フィルムは、短時間成形方法（一般的にはＨｏｔ−Ｈｏｔ用プレスと称されるプレス方法）とＣｏｌｄ-Ｈｏｔ用プレスと称されるプレス方法のいずれにも使用できる。   The film of the present invention is used as a release film at the time of press lamination of a coverlay in the same manner as a known release film in the FPC manufacturing process. In this press lamination, for example, a SUS board, paper, a release film, a coverlay (adhesive film), a flexible circuit member (one side), and a SUS board are stacked in that order on a heating plate, and predetermined conditions are set. After heating and pressing, post-curing is performed. In general, a release film, a coverlay, and a flexible circuit member can be repeatedly laminated. The release film of the present invention can be used for either a short-time molding method (generally called a press method for hot-hot) or a press method called a cold-hot press.

以下に本発明を実施例及び比較例によって、更に詳細に説明する。本発明はこれらの実施例によって限定されるものではない。実施例及び比較例において使用した原材料を以下に示す。   Hereinafter, the present invention will be described in more detail with reference to examples and comparative examples. The present invention is not limited by these examples. The raw materials used in Examples and Comparative Examples are shown below.

離型層樹脂
・ ポリブチレンテレフタレートとポリテトラメチレングリコールとの共重合体
(ＰＢＴ系樹脂)：品番５５０５S（三菱エンジニアリングプラスチックス(株)製）
粘弾性率 １００ＭＰａ
・ ポリブチレンテレフタレートとポリテトラメチレングリコールとの共重合体
(ＰＢＴ系樹脂）：品番５５１０S(三菱エンジニアリングプラスチックス(株)製）
粘弾性率 ７０ＭＰａ
・ ポリブチレンテレフタレート
(ＰＢＴ系樹脂):品番５０２０F(三菱エンジニアリングプラスチックス(株)製)
粘弾性率 １１０ＭＰａ
・ ポリブチレンテレフタレートとドデカン二酸との共重合体
(ＰＢＴ系樹脂）：品番１２００Ｄ（東レ(株)製） 粘弾性率 ３０ＭＰａ
・ ポリブチレンテレフタレート（ＰＢＴ）：品番１２００Ｓ（東レ(株)製）
粘弾性率 １１０ＭＰａ
・ ポリブチレンテレフタレートとフィラー添加(シリカ）（ＰＢＴ系樹脂）：
５０２０ＳＣＡＭＤ２４(三菱エンジニアリングプラスチックス(株)製）
粘弾性率 ３００ＭＰａ Release layer resin・ Copolymer of polybutylene terephthalate and polytetramethylene glycol
(PBT resin): Product No. 5505S (Mitsubishi Engineering Plastics)
Viscoelasticity 100MPa
・ Copolymer of polybutylene terephthalate and polytetramethylene glycol
(PBT resin): Product No. 5510S (Mitsubishi Engineering Plastics Co., Ltd.)
Viscoelasticity 70MPa
・ Polybutylene terephthalate
(PBT resin): Part No. 5020F (Mitsubishi Engineering Plastics)
Viscoelasticity 110MPa
・ Copolymer of polybutylene terephthalate and dodecanedioic acid
(PBT resin): Part number 1200D (manufactured by Toray Industries, Inc.) Viscoelasticity 30 MPa
・ Polybutylene terephthalate (PBT): Part number 1200S (manufactured by Toray Industries, Inc.)
Viscoelasticity 110MPa
・ Polybutylene terephthalate and filler added (silica) (PBT resin):
5020SCAMD24 (Mitsubishi Engineering Plastics)
Viscoelasticity 300MPa

クッション層樹脂
・ エチレン−メチルメタクリレート共重合体（ＥＭＭＡ）：品番アクリフトＷＨ１０２
（住友化学工業(株)製） 軟化温度 ７３℃
・ ポリエチレン（ＬＤＰＥ）：品番スミカセンＬ２１１（住友化学工業(株)製）
軟化温度１００℃
・ ポリプロピレン：ノーブレンＦＳ２０１１ＤＧ２（住友化学工業(株)製）
軟化温度１５４℃
・ エチレン-酢酸ビニル共重合体（ＥＶＡ）：
品番エバテートＫ５０１０（住友化学工業（株）製）軟化温度 ４１℃
なお、軟化温度はビカット軟化温度(ＪＩＳ Ｋ６７３０−１９８１)を示す。 Cushion layer resin / Ethylene-methyl methacrylate copolymer (EMMA): Part No. ACLIFT WH102
(Sumitomo Chemical Co., Ltd.) Softening temperature 73 ℃
・ Polyethylene (LDPE): Part number Sumikasen L211 (manufactured by Sumitomo Chemical Co., Ltd.)
Softening temperature 100 ° C
・ Polypropylene: Nobrene FS2011DG2 (manufactured by Sumitomo Chemical Co., Ltd.)
Softening temperature 154 ° C
-Ethylene-vinyl acetate copolymer (EVA):
Product No. Evertate K5010 (manufactured by Sumitomo Chemical Co., Ltd.) Softening temperature 41 ° C
The softening temperature indicates the Vicat softening temperature (JIS K6730-1981).

＜実施例１〜６＞
２台の押出機の各々に表１に示す離型層樹脂及びクッション層樹脂を供給し、二層ダイスにより共押出して離型多層フィルムを作成した（実施例１〜４）。
また、３台の押出機にそれぞれに表１に示す離型層樹脂、クッション層樹脂、副離型層樹脂を供給し、三層ダイスより共押出して離型多層フィルムを作成した(実施例５、６)。
得られた離型多層フィルムとフレキシブルプリント配線板(ＦＰＣ)とを１段型プレス機を用いて、１８５℃、５ＭＰａにて２分間、加熱・加圧した。次にこれを取り出し、後記の項目について評価した。結果を表１に示す。
＜比較例１〜２＞
１台の押出機に表２に示す樹脂を供給し単層ダイスより押出して離型単層フィルムを作成した。得られた離型単層フィルムとフレキシブルプリント配線板(ＦＰＣ)とを多段型プレス機を用いて、１７５℃、４ＭＰａにて６０分間、加熱・加圧した。次にこれを取り出し、前記と同様に評価した結果を表２に示す。 <Examples 1-6>
A release layer resin and a cushion layer resin shown in Table 1 were supplied to each of the two extruders, and co-extruded with a two-layer die to produce release multilayer films (Examples 1 to 4).
In addition, a release layer resin, a cushion layer resin, and a secondary release layer resin shown in Table 1 were supplied to three extruders, respectively, and a release multilayer film was prepared by co-extrusion from a three-layer die (Example 5). 6).
The obtained release multilayer film and flexible printed wiring board (FPC) were heated and pressurized at 185 ° C. and 5 MPa for 2 minutes using a one-stage press. Next, this was taken out and evaluated for the items described below. The results are shown in Table 1.
<Comparative Examples 1-2>
The resin shown in Table 2 was supplied to one extruder and extruded from a single-layer die to prepare a release single-layer film. The obtained release single-layer film and flexible printed wiring board (FPC) were heated and pressurized at 175 ° C. and 4 MPa for 60 minutes using a multistage press. Next, this was taken out and the result evaluated in the same manner as described above is shown in Table 2.

＜実施例７〜１１＞
表３に示す樹脂を用い、実施例１と同様に二層ダイスで共押出し離型フィルムを作成した。オフラインでエンボス処理（温度１７０℃、圧力１００ｋｇｆ／ｍｍ２（ゲージ圧）)を施した。
得られた離型フィルムとＦＰＣとを多段型プレス機を用いて、１７５℃、５ＭＰａ、真空状態で６０分加熱・加圧した。前記と同様に評価した結果を表３に示す。
＜実施例１５〜１７＞
表３に示す樹脂を用いて実施例１と同様にして離型フィルムを作成した。このうち実施例１６以外にエンボス処理を実施した。前記と同様に評価した結果を表３に示す。 <Examples 7 to 11>
Using the resins shown in Table 3, a co-extrusion release film was prepared with a two-layer die in the same manner as in Example 1. Embossing (temperature 170 ° C., pressure 100 kgf / mm 2 (gauge pressure)) was performed off-line.
The obtained release film and FPC were heated and pressurized in a vacuum state at 175 ° C. and 5 MPa for 60 minutes using a multistage press. The results evaluated in the same manner as described above are shown in Table 3.
<Examples 15 to 17>
A release film was prepared in the same manner as in Example 1 using the resins shown in Table 3. Of these, embossing treatment was performed in addition to Example 16. The results evaluated in the same manner as described above are shown in Table 3.

＜実施例１２〜１４、比較例６〜８＞
表４に示す樹脂を実施例１と同様に二層ダイスで共押出し離型フィルムを作成した。得られた離型フィルムを前記と同様に処理し評価した。結果を表４に示す。離型フィルムの離型層の粘弾性率は、「セイコー電子(株)製ＤＭＳ−２１０型」粘弾性測定装置を用いて測定した。
なお、評価はＪＰＣＡ規格（デザインガイドマニュアル・片面及び両面フレキシブルプリント配線板・ＪＰＣＡ―ＤＧ０２）に準拠し、以下のような項目と基準で行った。離型フィルムの離型層の表面粗さは、ハンディサーフ グラフＥ−３０Ａ（東京精密社製）にて測定した。 <Examples 12-14, Comparative Examples 6-8>
A resin shown in Table 4 was coextruded with a two-layer die in the same manner as in Example 1 to prepare a release film. The obtained release film was processed and evaluated in the same manner as described above. The results are shown in Table 4. The viscoelasticity of the release layer of the release film was measured using a “DMS-210 type manufactured by Seiko Electronics Co., Ltd.” viscoelasticity measuring device.
The evaluation was made according to the JPCA standard (design guide manual, single-sided and double-sided flexible printed wiring board, JPCA-DG02) and the following items and standards. The surface roughness of the release layer of the release film was measured by Handy Surf Graph E-30A (manufactured by Tokyo Seimitsu Co., Ltd.).

（評価項目）
・成形性（７．５．３．３項の気泡による）
○：ボイド発生率 ２．０％未満
×：ボイド発生率 ２．０％以上
・ＣＬ(カバーレイ)接着剤のフロー量（７．５．３．６項のカバーレイの接着剤の流れ
及びカバーコートのにじみによる）
○：フロー量 １５０μｍ未満
×：フロー量 １５０μｍ以上 (Evaluation item)
・ Moldability (due to air bubbles in Section 7.5.3.3)
○: Void incidence less than 2.0%
×: Void generation rate 2.0% or more • Flow amount of CL (coverlay) adhesive (due to coverlay adhesive flow and cover coat bleeding in 7.5.3.6)
○: Flow amount less than 150 μm ×: Flow amount 150 μm or more

・離型フィルム端面シミ出し長さ（フィルム４方向端面からの樹脂がシミ出した長さを
測定）
○：１.２ｍｍ未満
×：１．２ｍｍ以上
・仕上がり外観シワ（７．５．７．２項しわによる）
○：シワ発生率 ２．０％未満
×：シワ発生率 ２．０％以上
・離型性（離型フィルムの破れ）（７．５．７．１項表面の付着物による）
○：破れ発生率 ２．０％未満
×：破れ発生率 ２．０％以上
・メッキ付き性（必要メッキ面積の９０％以上にメッキが付いているものを良品：
７．５．４項めっきの外観による）
○：良品が９８％以上
×：良品が９８％未満 ・ Left end length of release film (measures the length of resin exudation from the end face of film 4 direction)
○: Less than 1.2 mm ×: 1.2 mm or more • Finished appearance wrinkles (by 7.5.7.2 wrinkles)
○: Wrinkle generation rate less than 2.0% ×: Wrinkle generation rate 2.0% or more ・ Releasability (breakage of release film) (depending on the deposit on the surface of 7.5.7.1)
○: Breakage rate less than 2.0% ×: Breakage rate 2.0% or more ・ Plating property (those with 90% or more of the required plating area are plated:
(Depends on the appearance of 7.5.4 plating)
○: Good product is 98% or more ×: Good product is less than 98%

Figure 2010149520
Figure 2010149520

Figure 2010149520
Figure 2010149520

Figure 2010149520
Figure 2010149520

Figure 2010149520
Figure 2010149520

本発明の離型フィルム(単層又は多層)を用いてＦＰＣを製造すると、離型性、対形状追従性、均一な成形性、メッキ付き性、ＦＰＣ仕上がり外観シワに優れた特性を維持しながら、従来の離型単層フィルムでは得られない優れたプレスラミネート時の離型性と成形性が得られる。また、離型層表面をエンボス処理することによりプレス時の離型性が向上する。また、本発明の離型フィルムは、引裂き強度、伸び、引張強度、さらにはコストおいても公知の離型フィルムに優れる。また、リジッドフレキシブルプリント配線板の製造においても離型フィルムとして同様に好ましく使用できる。   When FPC is manufactured using the release film (single layer or multilayer) of the present invention, while maintaining excellent properties in releasability, anti-trackability, uniform moldability, plating property, and FPC finished appearance wrinkles. The mold release property and moldability at the time of excellent press lamination which cannot be obtained by the conventional mold release single layer film can be obtained. Moreover, the release property at the time of a press improves by embossing the release layer surface. The release film of the present invention is superior to the known release film in terms of tear strength, elongation, tensile strength, and cost. Moreover, it can use preferably similarly as a release film also in manufacture of a rigid flexible printed wiring board.

Claims (5)

温度１８０℃における粘弾性率が５０〜２５０ＭＰａであるポリブチレンテレフタレート、又はポリブチレンテレフタレートとポリテトラメチレングリコールとの共重合体を含む離型層を有してなる離型フィルム。 A release film having a release layer containing polybutylene terephthalate having a viscoelasticity of 50 to 250 MPa at a temperature of 180 ° C. or a copolymer of polybutylene terephthalate and polytetramethylene glycol. 離型層の表面１０点平均粗さ（Ｒｚ）が１０〜４５μｍである請求項１の離型フィルム。 The release film according to claim 1, wherein the surface layer has a 10-point average roughness (Rz) of 10 to 45 μm. フレキシブル又はリジッドフレキシブルプリント配線板製造時のプレスラミネート工程用離型フィルムである請求項１の離型フィルム。 The release film according to claim 1, which is a release film for a press laminating process at the time of producing a flexible or rigid flexible printed wiring board. フレキシブルプリント配線板の製造にあたり、フレキシブル回路部材、カバーレイ及び請求項１又は２の離型フィルムをこの順に重ねてプレスラミネート処理することを特徴とするフレキシブルプリント配線板の製造法。 In manufacturing a flexible printed wiring board, a flexible circuit board, a cover lay, and a release film according to claim 1 or 2 are stacked in this order and subjected to a press lamination process. リジッドフレキシブルプリント配線板の製造にあたり、リジッドフレキシブル回路部材、接着フィルム及び請求項１又は２の離型フィルムをこの順に重ねてプレスラミネート処理することを特徴とするリジッドフレキシブルプリント配線板の製造法。 In manufacturing a rigid flexible printed wiring board, a rigid flexible printed wiring board is manufactured by laminating a rigid flexible circuit member, an adhesive film, and the release film of claim 1 or 2 in this order and press laminating.
JP2010007897A 2003-07-01 2010-01-18 Release film and method for manufacturing flexible printed-wiring board employing the same Pending JP2010149520A (en)

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JP2004002789A (en) * 2002-04-03 2004-01-08 Sekisui Chem Co Ltd Mold release sheet, laminated mold release film and method for producing board

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CN101961937B (en) 2015-09-16
WO2005002850A1 (en) 2005-01-13
JPWO2005002850A1 (en) 2006-08-10
MY158267A (en) 2016-09-30
JP5424159B2 (en) 2014-02-26
JP2009073195A (en) 2009-04-09
TW200503892A (en) 2005-02-01
KR101256662B1 (en) 2013-04-19
TWI476103B (en) 2015-03-11
JP2014210434A (en) 2014-11-13
CN101961937A (en) 2011-02-02

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