JP2010147425A - Box-type electronic module - Google Patents

Box-type electronic module Download PDF

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JP2010147425A
JP2010147425A JP2008326179A JP2008326179A JP2010147425A JP 2010147425 A JP2010147425 A JP 2010147425A JP 2008326179 A JP2008326179 A JP 2008326179A JP 2008326179 A JP2008326179 A JP 2008326179A JP 2010147425 A JP2010147425 A JP 2010147425A
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adhesive
box
metal base
electronic module
circuit board
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JP5042207B2 (en
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Koji Sato
弘二 佐藤
Hiroyuki Abe
博幸 阿部
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a box-type electronic module such as an engine control unit for a vehicle that can improve durability and waterproof property even when employing moisture curing type adhesive and being inexpensive and having high reliability. <P>SOLUTION: Around the outer circumference of a metal base 15, moisture curing type adhesive 20 is arranged in a rectangular annular shape. At the inner periphery side of the adhesive 20, a mounting seat 27 is installed where a screw 19 for clamping and fixing for a cover 11 is screwed. Around the mounting seat 27, an O-ring 23 is arranged. The cover 11 is clamped and fixed onto the metal base 15 with the screw 19 and the O-ring 23 is compressed by the metal base 15 and the cover 11. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、電子部品が実装された回路基板と、該回路基板と外部とを電気的に接続するためのコネクタと、前記回路基板が搭載されるとともに、前記コネクタが接着材を介して接合される金属ベースと、前記回路基板及び前記金属ベースを覆うべく該金属ベースに接着材を介して接合される密封用のカバーと、が一体的に組み付けられてなる箱形電子モジュールに係り、特に、前記接着材として、湿気硬化型接着材が用いられている箱形電子モジュールに関する。   The present invention provides a circuit board on which electronic components are mounted, a connector for electrically connecting the circuit board and the outside, the circuit board is mounted, and the connector is joined via an adhesive. A box-type electronic module in which a metal base and a sealing cover joined to the metal base via an adhesive to cover the circuit board and the metal base are integrally assembled. The present invention relates to a box-type electronic module in which a moisture curable adhesive is used as the adhesive.

自動車の各種コントロールユニットやセンサーモジュールは、電子回路を搭載したセラミック製あるいは樹脂製の電子回路基板、入出力コネクタ部を有する金属又はプラスチック製のケース、及び/又はキャップからなる構造を有する。これらの構造の中には、半導体チップの放熱性を向上させるために、放熱用金属ベース上に前記回路基板を搭載する構造も含まれる。   Various control units and sensor modules of automobiles have a structure including a ceramic or resin-made electronic circuit board on which an electronic circuit is mounted, a metal or plastic case having an input / output connector portion, and / or a cap. These structures include a structure in which the circuit board is mounted on a heat radiating metal base in order to improve the heat dissipation of the semiconductor chip.

図8は、自動車又は民生用で採用されている箱形電子モジュールの一例を示す。図示例の箱形電子モジュール50は、上面と前面が開口され、かつ左右に取り付け部を有するプラスチックケース58、電子部品61を搭載した樹脂プリント電子回路基板54、所要本数の外部接続端子53bを有するコネクタ53を備え、このコネクタ53は、前記ケース58の一端部に取り付けられる。この箱形電子モジュール50では、電子部品61が実装された回路基板54を外部の湿気から保護し、かつ振動に対する固定のため、保護樹脂(封止樹脂)層66が形成されている。この箱形電子モジュール50を製作するにあたっては、電子部品61が実装された回路基板54にコネクタ53の前記端子53bをはんだ付けなどにより接続し、前記回路基板54を前記ケース58に位置決めして取り付け、その後、ケース58内に液状樹脂を注入充填、加熱硬化して前記保護樹脂層66を形成する。   FIG. 8 shows an example of a box-type electronic module that is adopted for automobiles or consumer use. The box-shaped electronic module 50 in the illustrated example has a plastic case 58 having an upper surface and a front surface that are open on the left and right, a resin printed electronic circuit board 54 on which electronic components 61 are mounted, and a required number of external connection terminals 53b. A connector 53 is provided, and the connector 53 is attached to one end of the case 58. In the box-type electronic module 50, a protective resin (sealing resin) layer 66 is formed to protect the circuit board 54 on which the electronic component 61 is mounted from external moisture and to fix against vibration. In manufacturing the box-shaped electronic module 50, the terminal 53b of the connector 53 is connected to the circuit board 54 on which the electronic component 61 is mounted by soldering or the like, and the circuit board 54 is positioned and attached to the case 58. Thereafter, the protective resin layer 66 is formed by injecting and filling a liquid resin into the case 58 and heating and curing.

このような箱形電子モジュールの代表例としては、下記特許文献1に所載の自動車用エンジンコントロールユニットが挙げられる。   A typical example of such a box-type electronic module is an automobile engine control unit described in Patent Document 1 below.

ところで、一般に、室外で使う電気器具の電源配線や信号配線の接続用基板の収納箱は、雨水の浸入を防ぐ為に、上面が開口した箱に、接続用基板を収納し、開口部の蓋との間に環状のゴム製パッキングを嵌め込むことで、箱と蓋との隙間を塞ぎ、防水性を得ている。   By the way, in general, a storage box for a connection board for power supply wiring and signal wiring of electric appliances used outdoors is used to store the connection board in a box having an upper surface opened to prevent rainwater from entering, and to cover the opening. By inserting an annular rubber packing between the two, the gap between the box and the lid is closed to obtain waterproofness.

また、他方では環状のゴム製パッキングに代え、箱に蓋を、環状に配在した接着材を介して接合することにより、箱と蓋との間に形成される隙間を接着材で塞ぎ、これによって防水性を得ている例がある。接着材に代えた場合、箱と蓋が複雑な形状でも確実に密封できる利点がある。   On the other hand, instead of an annular rubber packing, a lid is joined to the box via an annular adhesive, thereby closing the gap formed between the box and the lid with an adhesive. There is an example of obtaining waterproofness. When the adhesive is replaced, there is an advantage that the box and the lid can be reliably sealed even in a complicated shape.

特開2003−258451号公報JP 2003-258451 A

また、接着材として湿気硬化型のものを用いると、加熱硬化炉を用いずに接着材を硬化できるので、設備投資等が軽減され、安価に箱型電子モジュールを提供できる。   Further, when a moisture-curing type adhesive is used as the adhesive, the adhesive can be cured without using a heat curing furnace, so that equipment investment and the like can be reduced, and a box-type electronic module can be provided at low cost.

ただし、湿気硬化型であるため、湿気を持った空気が接着材に触れないと硬化しないという性質がある。そのため、環状に配在された接着材より外周側(空気に触れる側)で箱と蓋をねじ止めした場合、箱と蓋で空気が遮断されて、接着材に外部空気が接触しなくなるため、接着材が硬化しなくなる。あるいは、外部空気に触れて硬化した接着材からの水の拡散により水が供給されて、遅れて硬化することになる(特に、ねじ止めしている部分(四隅)の硬化が遅くなる)。接着材が硬化しないか、遅れて硬化することにより、硬化するまでは防水性が発揮されず、防水信頼性に劣るという欠点があった。   However, since it is a moisture-curing type, it has the property that it does not cure unless moisture with air touches the adhesive. Therefore, when the box and lid are screwed to the outer peripheral side (the side that comes into contact with air) from the annularly arranged adhesive, air is blocked by the box and lid, and external air does not contact the adhesive, The adhesive will not cure. Alternatively, water is supplied by the diffusion of the water from the adhesive that has been cured by touching the external air, so that the material is cured with a delay (particularly, the portions (four corners) that are screwed are cured slowly). When the adhesive is not cured or is cured with a delay, the waterproof property is not exhibited until the adhesive is cured, and the waterproof reliability is poor.

本発明は、上記事情に鑑みてなされたもので、その目的とするところは、湿気硬化型の接着材を用いた場合でも、耐久性や防水性を向上させることができ、安価で信頼性の高い自動車用エンジンコントロールユニット等の箱型電子モジュールを提供することにある。   The present invention has been made in view of the above circumstances. The object of the present invention is to improve durability and waterproofness even when a moisture-curing adhesive is used, and is inexpensive and reliable. It is to provide a box-type electronic module such as a high engine control unit for automobiles.

上記目的を達成すべく、本発明に係る箱形電子モジュールの一つは、電子部品が実装された回路基板と、該回路基板と外部とを電気的に接続するためのコネクタと、前記回路基板が搭載されるとともに、前記コネクタが接着材を介して接合される金属ベースと、前記回路基板及び前記金属ベースを覆うべく該金属ベースに接着材を介して接合される密封用のカバーと、が一体的に組み付けられてなり、前記金属ベースの外周に前記接着材が環状に配在され、該接着材より内周側に、前記カバーの締付固定用螺子がねじ込まれる取付座が設けられるとともに、該取付座の周囲にOリング等のシール材が配在され、前記螺子で前記カバーが前記金属ベースに締め付け固定されるとともに、前記Oリング等のシール材が前記金属ベースと前記カバーで挟圧されていることを特徴としている。   To achieve the above object, one of the box-shaped electronic modules according to the present invention includes a circuit board on which electronic components are mounted, a connector for electrically connecting the circuit board and the outside, and the circuit board. A metal base to which the connector is bonded via an adhesive, and a sealing cover that is bonded to the metal base via an adhesive so as to cover the circuit board and the metal base. The adhesive is annularly arranged on the outer periphery of the metal base, and a mounting seat is provided on the inner peripheral side of the adhesive to which the screw for fixing the fastening of the cover is screwed. A sealing material such as an O-ring is disposed around the mounting seat, and the cover is fastened and fixed to the metal base with the screw, and the sealing material such as the O-ring is connected to the metal base and the cover. It is characterized by being pinched.

本発明に係る箱形電子モジュールの他の一つは、電子部品が実装された回路基板と、該回路基板と外部とを電気的に接続するためのコネクタと、前記回路基板が搭載されるとともに、前記コネクタが接着材を介して接合される金属ベースと、前記回路基板及び前記金属ベースを覆うべく該金属ベースに接着材を介して接合される密封用のカバーと、が一体的に組み付けられてなり、前記金属ベースの外周に前記接着材が環状に配在され、該接着材より若干離れた外周側に、前記カバーの締付固定用螺子がねじ込まれる取付座が設けられていることを特徴としている。   Another one of the box-shaped electronic modules according to the present invention includes a circuit board on which electronic components are mounted, a connector for electrically connecting the circuit board and the outside, and the circuit board. A metal base to which the connector is bonded via an adhesive, and a sealing cover to be bonded to the metal base via an adhesive so as to cover the circuit board and the metal base. The adhesive material is annularly arranged on the outer periphery of the metal base, and a mounting seat is provided on the outer peripheral side slightly apart from the adhesive material, into which the fastening screw for the cover is screwed. It is a feature.

好ましい態様では、前記コネクタは、所要本数の金属端子と、樹脂製のハウジングとからなり、該ハウジングは、外部ハーネスのプラグが差し込まれる、前記回路基板と略平行なソケット部、前記金属端子を保持する、前記ソケット部に略垂直の鍔状部を有する端子保持壁部、及び、前記端子保持壁部から内方に前記ソケット部と略平行に突出する内方突出部を有し、該内方突出部が前記金属ベースに前記接着材を介して接合される。   In a preferred embodiment, the connector comprises a required number of metal terminals and a resin housing, and the housing holds a socket portion into which an external harness plug is inserted and substantially parallel to the circuit board, and the metal terminals. A terminal holding wall portion having a hook-like portion substantially perpendicular to the socket portion, and an inward protruding portion that protrudes inward from the terminal holding wall portion substantially parallel to the socket portion. A protrusion is joined to the metal base via the adhesive.

好ましい態様では、前記接着材として、湿気硬化型接着材が用いられる。   In a preferred embodiment, a moisture curable adhesive is used as the adhesive.

前記コネクタのハウジングは、好ましくは、ポリブチレンテレフタレート、ナイロン等の熱可塑性樹脂製とされる。   The housing of the connector is preferably made of a thermoplastic resin such as polybutylene terephthalate or nylon.

前記カバーは、好ましくは、鋼板を素材としたプレス成形品とされる。   The cover is preferably a press-formed product made of a steel plate.

前記金属ベースは、好ましくは、アルミダイカスト製とされる。   The metal base is preferably made of aluminum die casting.

本発明に係る箱形電子モジュールの好ましい態様では、金属ベースの外周に接着材が環状に配在され、該接着材より内周側に、カバーの締付固定用螺子がねじ込まれる取付座が設けられているので、接着材の外周部を全周にわたって外部空気に触れさせることができる、そのため、接着材として湿気硬化型のものが用いられた場合に、それを速やかに硬化させることができ、短時間で接着材による防水効果が得られることになる。   In a preferred aspect of the box-type electronic module according to the present invention, an adhesive is annularly arranged on the outer periphery of the metal base, and a mounting seat into which a screw for fastening the cover is screwed is provided on the inner peripheral side of the adhesive. Since the outer peripheral portion of the adhesive can be exposed to the outside air over the entire circumference, when a moisture curing type is used as the adhesive, it can be quickly cured, The waterproof effect by the adhesive can be obtained in a short time.

また、取付座の周囲にOリング等のシール材を配在し、このシール材を金属ベースとカバーで挟圧することにより、接着材より内周側に位置するカバー締付固定用螺子部分の防水性を確保することができる。   In addition, a seal material such as an O-ring is arranged around the mounting seat, and the seal material is clamped between the metal base and the cover, thereby waterproofing the screw portion for fastening the cover located on the inner peripheral side of the adhesive material. Sex can be secured.

したがって、本発明によれば、箱形電子モジュールにおいて、加熱硬化炉等の設備投資を必要とすることなく、低コストで防水信頼性、耐久性等を効果的に高めることができる。   Therefore, according to the present invention, in the box-type electronic module, waterproof reliability, durability, and the like can be effectively enhanced at low cost without requiring capital investment such as a heat curing furnace.

また、既存の箱形電子モジュールにおいて、カバー締付固定用螺子のねじ込み位置を変更して、Oリング等のシール材を追加するだけでよいので、費用対効果に優れるといった利点も得られる。   In addition, in the existing box-type electronic module, it is only necessary to change the screwing position of the cover fastening fixing screw and add a sealing material such as an O-ring.

以下、本発明の箱形電子モジュールの実施の形態を図面を参照しながら説明する。
図1は、本発明に係る箱形電子モジュールの一実施形態を示す縦断面図、図2は、図1に示される箱形電子モジュールの平面図、図3は、図1に示される箱形電子モジュールの前面図、図4は、図1に示される箱形電子モジュールの分解図、図5は、図1に示される箱形電子モジュールからカバーを取り去った状態の平面図である。
Hereinafter, embodiments of the box-shaped electronic module of the present invention will be described with reference to the drawings.
1 is a longitudinal sectional view showing an embodiment of a box-shaped electronic module according to the present invention, FIG. 2 is a plan view of the box-shaped electronic module shown in FIG. 1, and FIG. 3 is a box-like shape shown in FIG. 4 is a front view of the electronic module, FIG. 4 is an exploded view of the box-shaped electronic module shown in FIG. 1, and FIG. 5 is a plan view of the box-shaped electronic module shown in FIG.

図示実施形態の箱形電子モジュール10は、自動車用エンジンコントロールユニットとして用いられるもので、基本的には、所要の電子部品21が実装された回路基板14と、この回路基板14と外部とを電気的に接続するためのコネクタ13と、回路基板14が搭載されるとともに、コネクタ13が取付保持される放熱用金属ベース15と、前記回路基板14、金属ベース15、及びコネクタ13の一部を覆う密封用の金属製カバー11と、が一体的に組み付けられて構成される。   The box-shaped electronic module 10 of the illustrated embodiment is used as an automobile engine control unit. Basically, a circuit board 14 on which required electronic components 21 are mounted, and the circuit board 14 and the outside are electrically connected. Connector 13 and circuit board 14 are mounted, and heat dissipation metal base 15 to which connector 13 is attached and held, and circuit board 14, metal base 15, and part of connector 13 are covered. A metal cover 11 for sealing is integrally assembled.

ここで、密封用のカバー11は、金属ベース15に湿気硬化型の接着材20を介して接合されている。すなわち、金属ベース15の外周に前記接着材20が矩形環状(コ字状部分+コネクタ部分)に配在され、前記金属ベース15における前記接着材20より内周側に、前記カバー11の締付固定用螺子19がねじ込まれるねじ穴(雌ねじ)28が形成された短円筒状の取付座27が設けられ、また、前記カバー11における前記接着材20より内周側に、底部に通し穴26が形成されたねじ止め用凹部25が設けられ、前記取付座27の周囲にシール材としてのOリング23が配在され、図6に示される如くに、前記螺子19で前記カバー11が前記金属ベース15に締め付け固定されるとともに、前記Oリング23が前記金属ベース15と前記カバー11で挟圧されている(後で詳述)。   Here, the sealing cover 11 is joined to the metal base 15 via a moisture-curing adhesive 20. That is, the adhesive material 20 is arranged in a rectangular ring shape (a U-shaped portion + connector portion) on the outer periphery of the metal base 15, and the cover 11 is tightened on the inner peripheral side of the metal base 15 from the adhesive material 20. A short cylindrical mounting seat 27 having a screw hole (female screw) 28 into which the fixing screw 19 is screwed is provided, and a through-hole 26 is formed at the bottom of the cover 11 on the inner peripheral side of the adhesive 20. A formed screwing recess 25 is provided, and an O-ring 23 serving as a sealing material is disposed around the mounting seat 27. As shown in FIG. The O-ring 23 is clamped between the metal base 15 and the cover 11 (details will be described later).

前記コネクタ13は、所要本数の金属端子13Bと、樹脂製のハウジング13Aとからなり、ハウジング13Aは、外部ハーネスのプラグが差し込まれる、回路基板14と略平行なソケット部13c、金属端子13Bを保持する、ソケット部13cに略垂直の鍔状部13eを有する端子保持壁部13d、及び、金属ベース15に接着材20を介して接合される、端子保持壁部13dから内方にソケット部13cと略平行に突出する内方突出部13fを有する。   The connector 13 includes a required number of metal terminals 13B and a resin housing 13A. The housing 13A holds a socket portion 13c and a metal terminal 13B, which are substantially parallel to the circuit board 14, into which a plug of an external harness is inserted. A terminal holding wall portion 13d having a hook-like portion 13e substantially perpendicular to the socket portion 13c, and a socket portion 13c that is joined to the metal base 15 via an adhesive 20 inward from the terminal holding wall portion 13d. An inward projecting portion 13f projecting substantially in parallel is provided.

そして、前記コネクタ13の内方突出部13fが金属ベース15に前記接着材20を介して接合されるとともに、金属製カバー11が金属ベース15及びコネクタ13の内方突出部13fに前記接着材20を介して接合されている。   The inward protruding portion 13 f of the connector 13 is joined to the metal base 15 via the adhesive 20, and the metal cover 11 is connected to the metal base 15 and the inward protruding portion 13 f of the connector 13. It is joined via.

次に、上記構成の箱形電子モジュール10の製作手順並びに各部の詳細を説明する。
前記回路基板14は、長方形(160mm×154mm)の樹脂プリント電子回路基板であり、表面に共晶はんだペーストをスクリーン印刷機で印刷したものである。この回路基板14にチップ抵抗体、セラミックコンデンサ、アルミコンデンサなどの電子部品21を自動搭載機にて搭載後、リフロー炉内を通過してはんだ接合を行なう。
Next, the manufacturing procedure of the box-shaped electronic module 10 having the above configuration and details of each part will be described.
The circuit board 14 is a rectangular (160 mm × 154 mm) resin-printed electronic circuit board, and a eutectic solder paste is printed on the surface thereof by a screen printing machine. An electronic component 21 such as a chip resistor, a ceramic capacitor, or an aluminum capacitor is mounted on the circuit board 14 by an automatic mounting machine, and then soldered through the reflow furnace.

前記コネクタ13のハウジング13Aは、概略直方体に熱可塑性樹脂で成形されたものである。   The housing 13A of the connector 13 is formed in a substantially rectangular parallelepiped with a thermoplastic resin.

前記金属端子13Bは、厚さ0.5mmの銅板を幅0.5mmに打ち抜きプレス成形され、さらにL字状にプレス成形されたもので、回路基板14との接続部分13sには錫めっきが施されている。金属端子13Bは、例えば、入力用80本と出力用40本に仕切られて前記端子保持壁部13d(に形成された透孔)に差し込まれて保持固定されている。   The metal terminal 13B is formed by stamping a 0.5 mm thick copper plate to a width of 0.5 mm, and press-molding it into an L-shape. The connection portion 13s with the circuit board 14 is tin-plated. Has been. For example, the metal terminal 13B is partitioned into 80 for input and 40 for output, and is inserted into the terminal holding wall portion 13d (through hole formed therein) and held and fixed.

前記コネクタ13は、回路基板14に固定用の爪で固定される。コネクタ13の金属端子13Bの接続部分13sは、回路基板14のはんだ接続用ランド14sの貫通孔14hから貫通して約1ミリ出るように固定される。   The connector 13 is fixed to the circuit board 14 with fixing claws. The connection portion 13s of the metal terminal 13B of the connector 13 is fixed so as to pass through the through hole 14h of the solder connection land 14s of the circuit board 14 and protrude about 1 mm.

ここでは、前記回路基板14のはんだ接続用ランド14sの貫通孔14hから出した金属端子13Bの接続部分13sと、回路基板14のはんだ接続用ランド14sとはんだ接続用ランド14sの貫通孔14hに、フラックスをスプレーフラクサー装置で塗付し、さらに、金属端子13Bの接続部分13sと回路基板14のはんだ接続用ランド14sとはんだ接続用ランド14sの貫通孔14hを約150℃に加熱後、金属端子13Bの接続部分13sと回路基板14のはんだ接続用ランド14sとはんだ接続用ランド14sの貫通孔14hに鋼板の枠を合わせて、溶融はんだを噴流で吹き上げて金属端子13Bの接続部分13sと回路基板14のはんだ接続用ランド14sと貫通孔部分14hをはんだ接合する(スポットフロー・ソルダリング)。   Here, the connection portion 13 s of the metal terminal 13 </ b> B extending from the through hole 14 h of the solder connection land 14 s of the circuit board 14, and the through hole 14 h of the solder connection land 14 s and the solder connection land 14 s of the circuit board 14, The flux is applied by a spray fluxer device, and the connection portion 13s of the metal terminal 13B, the solder connection land 14s of the circuit board 14, and the through hole 14h of the solder connection land 14s are heated to about 150 ° C. The steel plate frame is aligned with the connection portion 13s of 13B, the solder connection land 14s of the circuit board 14, and the through hole 14h of the solder connection land 14s, and the molten solder is blown up by jetting to connect the connection portion 13s of the metal terminal 13B and the circuit board. 14 solder connection lands 14s and through hole portions 14h are joined by soldering (spot flow soldering) Grayed).

一方、放熱用金属ベース15はアルミダイカスト製であり、平面視長方形で厚さが8.5mmあり、回路基板14を搭載する主面側には、回路基板14の裏面に接触する(回路基板14を底面から浮かせて支持する)ように凹凸部15dが突設されるとともに、裏面側には放熱用のフィン15bが成形されている。   On the other hand, the heat radiating metal base 15 is made of aluminum die casting, has a rectangular shape in plan view, and has a thickness of 8.5 mm. The main surface on which the circuit board 14 is mounted is in contact with the back surface of the circuit board 14 (circuit board 14 The protrusions and recesses 15d are projected so as to be supported from the bottom surface), and fins 15b for heat dissipation are formed on the back surface side.

また、この金属ベース15のカバー11との接着位置より内側(前記矩形環状に配在された接着材20の内周側)の4隅には、カバー11の締付固定用螺子19がねじ込まれるねじ穴(M4サイズの雌ねじ)28が形成された短円筒状の取付座27が設けられている。また、ベース15のコネクタ13が搭載される辺a側ではない2辺q、rから延長された部分に自動車への取り付け孔が穿設されている。   Further, the fastening fixing screws 19 of the cover 11 are screwed into the four corners on the inner side (the inner peripheral side of the adhesive material 20 arranged in the rectangular ring shape) from the bonding position of the metal base 15 to the cover 11. A short cylindrical mounting seat 27 in which a screw hole (M4 size female screw) 28 is formed is provided. A mounting hole for an automobile is formed in a portion extended from two sides q and r that are not on the side a where the connector 13 of the base 15 is mounted.

ここでは、金属ベース15に設けられた前記取付座27の外周にOリング23を嵌め込んだ後、前記金属ベース15における前端部a(コネクタ13の取付部分)と、ベース15の中央部分に、シリコーン系で湿気硬化型(例えば、脱アセトン型又は脱アルコール型)の接着材20をエア圧力制御方式の自動塗布機、又はタンクに入れた接着材20にエア圧力をかけ開閉バルブ制御して塗布する方式の自動塗布機を用いて塗付後、コネクタ13をはんだ接合した回路基板14を自動搭載機で搭載する。ここで、中央部分の接着は、回路基板14の浮き上がり防止が目的である。   Here, after fitting the O-ring 23 to the outer periphery of the mounting seat 27 provided on the metal base 15, the front end portion a (attachment portion of the connector 13) in the metal base 15 and the central portion of the base 15 are A silicone-based, moisture-curing (for example, acetone-free or alcohol-free) adhesive 20 is applied by applying an air pressure to the air pressure control type automatic applicator or the adhesive 20 in a tank and controlling the opening / closing valve. After the application using the automatic coating machine of the method, the circuit board 14 to which the connector 13 is soldered is mounted by the automatic mounting machine. Here, the adhesion of the central portion is intended to prevent the circuit board 14 from being lifted.

次に、図5に示される如くに、金属ベース15における辺a以外の3辺s、q、rと、主面3mと対向する主面3nと、コネクタ13の主面3nとベース15の辺q、rとの間の斜辺nq、斜辺nrに、それぞれ前記接着材20を自動塗付機を用いて塗布する。ここで、接着剤20の厚みは、取付座27の高さより若干厚く、かつ、自然状態におけるOリング23の厚み(断面の直径)より若干薄くする。   Next, as shown in FIG. 5, three sides s, q, r other than side a in metal base 15, main surface 3 n facing main surface 3 m, main surface 3 n of connector 13, and sides of base 15 The adhesive 20 is applied to the hypotenuses nq and hypotenuses nr between q and r using an automatic coating machine. Here, the thickness of the adhesive 20 is slightly thicker than the height of the mounting seat 27 and slightly smaller than the thickness (cross-sectional diameter) of the O-ring 23 in the natural state.

前記金属製カバー11は、厚さ0.5mmの鋼板をトレー状にプレス成形したもので、平面視矩形とされ、回路基板14を覆う部分11Aが深さ19mm程度、また、コネクタ13に載せる部分11Bが深さ30mm程度となっている。また、カバー11の中央部分には防水フィルタ22取り付け用の孔が形成されている。さらに、カバー11における前記接着材20より内周側に、底部に通し穴26が形成されたねじ止め用凹部25が設けられている。なお、カバー11は、全面に亜鉛めっきが施されている。   The metal cover 11 is formed by pressing a steel plate having a thickness of 0.5 mm into a tray shape, is rectangular in plan view, a portion 11A covering the circuit board 14 has a depth of about 19 mm, and a portion placed on the connector 13 11B has a depth of about 30 mm. Further, a hole for attaching the waterproof filter 22 is formed in the central portion of the cover 11. Further, on the inner peripheral side of the adhesive 11 in the cover 11, there is provided a screwing recess 25 having a through hole 26 formed in the bottom. The cover 11 is galvanized over the entire surface.

前記接着材20が塗付されたコネクタ13の金属端子13Bをはんだ接合した回路基板14が搭載された金属ベース15上にカバー11を自動搭載機で搭載し、次いで、回路基板14とカバー11を搭載しねじ止めしたベース15を温度60℃、湿度60%RHの恒温高湿槽に3時間入れ、接着材20の表面を硬化する。   The cover 11 is mounted on the metal base 15 on which the circuit board 14 on which the metal terminal 13B of the connector 13 coated with the adhesive 20 is soldered is mounted by an automatic mounting machine, and then the circuit board 14 and the cover 11 are mounted. The mounted and screwed base 15 is placed in a constant temperature and high humidity bath having a temperature of 60 ° C. and a humidity of 60% RH for 3 hours to cure the surface of the adhesive 20.

次に、カバー11の防水フィルタ取り付け用の孔から圧縮空気を入れた後、圧力を確認し、圧力変化が無いことで接着材20により接着接合されているか否かを検査する。さらに、カバー11の防水フィルタ取り付け用の孔に防水フィルタ22をはめ込んで当該箱形電子モジュール10の組立が完了する。   Next, after introducing compressed air from the hole for attaching the waterproof filter of the cover 11, the pressure is confirmed, and it is inspected whether or not the adhesive material 20 is bonded and bonded because there is no pressure change. Further, the waterproof filter 22 is fitted into the waterproof filter mounting hole of the cover 11 to complete the assembly of the box-shaped electronic module 10.

最後に、箱形電子モジュール10にプログラムを書き込み、電気導通検査を経て、完成品が得られる。   Finally, a program is written in the box-shaped electronic module 10, and a finished product is obtained through an electrical continuity test.

以上の説明から理解されるように、本実施形態の箱形電子モジュール10では、金属ベース15の外周に湿気硬化型の接着材20が環状に塗布され、該接着材20より内周側に、カバー11の締付固定用螺子19がねじ込まれる取付座27が設けられているので、接着材20の外周部を全周にわたって外部空気に触れさせることができる、そのため、湿気硬化型の接着材20を速やかに硬化させることができ、短時間で接着材による防水効果が得られることになる。   As can be understood from the above description, in the box-shaped electronic module 10 of the present embodiment, the moisture-curing adhesive 20 is annularly applied to the outer periphery of the metal base 15, and the inner periphery side of the adhesive 20 is Since the mounting seat 27 into which the tightening fixing screw 19 of the cover 11 is screwed is provided, the outer peripheral portion of the adhesive material 20 can be exposed to the external air over the entire periphery. Therefore, the moisture-curing adhesive material 20 Can be cured quickly, and the waterproofing effect of the adhesive can be obtained in a short time.

また、取付座27の周囲にOリング23を配在し、このOリング23を金属ベース15とカバー11で挟圧しているので、接着材20より内周側に位置するカバー締付固定用螺子19部分の防水性を確保することができる。   Further, since the O-ring 23 is arranged around the mounting seat 27 and the O-ring 23 is clamped between the metal base 15 and the cover 11, a cover fastening fixing screw located on the inner peripheral side from the adhesive 20. The waterproofness of 19 portions can be ensured.

したがって、本実施形態の箱形電子モジュール10では、加熱硬化炉等の設備投資を必要とすることなく、低コストで防水信頼性、耐久性等を効果的に高めることができる。   Therefore, in the box-shaped electronic module 10 of the present embodiment, waterproof reliability, durability, and the like can be effectively enhanced at low cost without requiring capital investment such as a heat curing furnace.

また、既存の箱形電子モジュールにおいて、カバー締付固定用螺子のねじ込み位置を変更して、Oリング等のシール材を追加するだけでよいので、費用対効果に優れるといった利点も得られる。   In addition, in the existing box-type electronic module, it is only necessary to change the screwing position of the cover fastening fixing screw and add a sealing material such as an O-ring.

なお、上記実施形態では、カバー11と金属ベース15における接着材20より内周側を4本の螺子19で締付固定するようにしているが、この他、図7に他の実施形態の箱形電子モジュール10’が示される如くに、矩形環状の接着材20部分の4隅を1/4円弧状に凹ませ、該接着材20(の4隅凹み部分)から若干離れた外周側に、前記ねじ止め用凹部25や前記取付座27を設けるようにしてもよい。このようにしても、接着材20の外周部を全周にわたって外部空気に触れさせることができるので、前記実施形態と同様な効果が得られる。なお、この場合は、螺子19が接着材20より外周側にねじ込まれるので、Oリング23は必ずしも必要ではない。   In the above-described embodiment, the inner peripheral side of the cover 11 and the metal base 15 with respect to the adhesive 20 is fastened and fixed by the four screws 19. In addition to this, FIG. As shown in the shape of the electronic module 10 ′, the four corners of the rectangular annular adhesive member 20 are recessed in a quarter arc shape, and the outer peripheral side slightly apart from the adhesive member 20 (the four corner recessed portions) The screwing recess 25 and the mounting seat 27 may be provided. Even if it does in this way, since the outer peripheral part of the adhesive material 20 can be made to touch external air over the perimeter, the effect similar to the said embodiment is acquired. In this case, since the screw 19 is screwed to the outer peripheral side from the adhesive 20, the O-ring 23 is not necessarily required.

本発明に係る箱形電子モジュールの一実施形態を示す縦断面図。The longitudinal cross-sectional view which shows one Embodiment of the box-shaped electronic module which concerns on this invention. 図1に示される箱形電子モジュールの平面図。The top view of the box-shaped electronic module shown by FIG. 図1に示される箱形電子モジュールの前面図。The front view of the box-shaped electronic module shown by FIG. 図1に示される箱形電子モジュールの分解図。FIG. 2 is an exploded view of the box-type electronic module shown in FIG. 1. 図1に示される箱形電子モジュールからカバーを取り去った状態の平面図。The top view of the state which removed the cover from the box-shaped electronic module shown by FIG. 図1に示される箱形電子モジュールのカバー締付固定用螺子、ねじ止め用凹部、取付座、Oリング等の説明に供される図であり、(A)は取付座とOリングの分解斜視図、(B)はそれらの組付状態を示す断面図。It is a figure with which it uses for description of the cover fastening fixing screw of the box-shaped electronic module shown in FIG. 1, the recessed part for screwing, a mounting seat, an O-ring, etc., (A) is an exploded perspective view of a mounting seat and an O-ring. FIG. 4B is a cross-sectional view showing the assembled state. 本発明に係る箱形電子モジュールの他の実施形態を示す平面図。The top view which shows other embodiment of the box-shaped electronic module which concerns on this invention. 従来の箱形電子モジュールの一例を示す縦断面図。The longitudinal cross-sectional view which shows an example of the conventional box-shaped electronic module.

符号の説明Explanation of symbols

10 箱形電子モジュール
11 金属製カバー
13 コネクタ
13A ハウジング
13B 金属端子
14 回路基板
15 金属ベース
19 締付固定用螺子
20 湿気硬化型の接着材
21 電子部品
23 Oリング
25 ねじ止め用凹部
27 取付座
DESCRIPTION OF SYMBOLS 10 Box-shaped electronic module 11 Metal cover 13 Connector 13A Housing 13B Metal terminal 14 Circuit board 15 Metal base 19 Tightening fixing screw 20 Moisture hardening type adhesive material 21 Electronic component 23 O-ring 25 Screw fixing recess 27 Mounting seat

Claims (7)

電子部品が実装された回路基板と、該回路基板と外部とを電気的に接続するためのコネクタと、前記回路基板が搭載されるとともに、前記コネクタが接着材を介して接合される金属ベースと、前記回路基板及び前記金属ベースを覆うべく該金属ベースに接着材を介して接合される密封用のカバーと、が一体的に組み付けられてなる箱形電子モジュールであって、
前記金属ベースの外周に前記接着材が環状に配在され、該接着材より内周側に、前記カバーの締付固定用螺子がねじ込まれる取付座が設けられるとともに、該取付座の周囲にOリング等のシール材が配在され、前記螺子で前記カバーが前記金属ベースに締め付け固定されるとともに、前記Oリング等のシール材が前記金属ベースと前記カバーで挟圧されていることを特徴とする箱形電子モジュール。
A circuit board on which electronic components are mounted, a connector for electrically connecting the circuit board and the outside, a metal base on which the circuit board is mounted and the connector is bonded via an adhesive; A box-shaped electronic module in which a sealing cover joined to the metal base via an adhesive to cover the circuit board and the metal base is integrally assembled,
The adhesive material is annularly arranged on the outer periphery of the metal base, and a mounting seat into which a screw for fixing the fastening of the cover is screwed is provided on the inner peripheral side of the adhesive material, and O around the mounting seat. A seal material such as a ring is disposed, the cover is fastened and fixed to the metal base by the screw, and the seal material such as the O-ring is sandwiched between the metal base and the cover. Box-shaped electronic module to do.
電子部品が実装された回路基板と、該回路基板と外部とを電気的に接続するためのコネクタと、前記回路基板が搭載されるとともに、前記コネクタが接着材を介して接合される金属ベースと、前記回路基板及び前記金属ベースを覆うべく該金属ベースに接着材を介して接合される密封用のカバーと、が一体的に組み付けられてなる箱形電子モジュールであって、
前記金属ベースの外周に前記接着材が環状に配在され、該接着材より若干離れた外周側に、前記カバーの締付固定用螺子がねじ込まれる取付座が設けられていることを特徴とする箱形電子モジュール。
A circuit board on which electronic components are mounted, a connector for electrically connecting the circuit board and the outside, a metal base on which the circuit board is mounted and the connector is bonded via an adhesive; A box-shaped electronic module in which a sealing cover joined to the metal base via an adhesive to cover the circuit board and the metal base is integrally assembled,
The adhesive is annularly arranged on the outer periphery of the metal base, and a mounting seat into which a screw for fastening and fixing the cover is screwed is provided on the outer peripheral side slightly apart from the adhesive. Box-type electronic module.
前記コネクタは、所要本数の金属端子と、樹脂製のハウジングとからなり、該ハウジングは、外部ハーネスのプラグが差し込まれる、前記回路基板と略平行なソケット部、前記金属端子を保持する、前記ソケット部に略垂直の鍔状部を有する端子保持壁部、及び、前記端子保持壁部から内方に前記ソケット部と略平行に突出する内方突出部を有し、該内方突出部が前記金属ベースに前記接着材を介して接合されていることを特徴とする請求項1又は2に記載の箱形電子モジュール。   The connector includes a required number of metal terminals and a resin housing, and the housing holds a socket portion that is substantially parallel to the circuit board into which a plug of an external harness is inserted, and holds the metal terminals. A terminal holding wall portion having a substantially vertical hook-shaped portion at the portion, and an inward protruding portion that protrudes inward from the terminal holding wall portion substantially in parallel with the socket portion, and the inward protruding portion is The box-shaped electronic module according to claim 1, wherein the box-shaped electronic module is bonded to a metal base via the adhesive. 前記接着材として、湿気硬化型接着材が用いられていることを特徴とする請求項1から3のいずれか一項に記載の箱型電子モジュール。   The box-type electronic module according to any one of claims 1 to 3, wherein a moisture-curing adhesive is used as the adhesive. 前記コネクタのハウジングは、ポリブチレンテレフタレート、ナイロン等の熱可塑性樹脂製であることを特徴とする請求項1から4のいずれか一項に記載の箱形電子モジュール。   The box-shaped electronic module according to claim 1, wherein the housing of the connector is made of a thermoplastic resin such as polybutylene terephthalate or nylon. 前記カバーは、鋼板を素材としたプレス成形品であることを特徴とする請求項1から5のいずれか一項に記載の箱形電子モジュール。   The box-shaped electronic module according to any one of claims 1 to 5, wherein the cover is a press-formed product made of a steel plate. 前記金属ベースは、アルミダイカスト製であることを特徴とする請求項1から6のいずれか一項に記載の箱形電子モジュール。   The box-type electronic module according to any one of claims 1 to 6, wherein the metal base is made of aluminum die casting.
JP2008326179A 2008-12-22 2008-12-22 Box-type electronic module Expired - Fee Related JP5042207B2 (en)

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JP2018137260A (en) * 2017-02-20 2018-08-30 株式会社デンソー Electronic device

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CN112201989B (en) * 2020-10-09 2022-04-12 东风汽车股份有限公司 Waterproof front wall wiring system

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JP2001085858A (en) * 1999-09-17 2001-03-30 Denso Corp Case for electronic control device
JP2008008210A (en) * 2006-06-29 2008-01-17 Hitachi Ltd Engine control device

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Publication number Priority date Publication date Assignee Title
JP2001085858A (en) * 1999-09-17 2001-03-30 Denso Corp Case for electronic control device
JP2008008210A (en) * 2006-06-29 2008-01-17 Hitachi Ltd Engine control device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018137260A (en) * 2017-02-20 2018-08-30 株式会社デンソー Electronic device

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