JP2010147256A - Substrate conveyer and film-forming apparatus including the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate conveyer that prevents abnormal discharge, and to provide a film-forming apparatus that uses the same. <P>SOLUTION: The substrate conveyer 2 includes a shaft 20 connected to a driving device, and a roller 21 fixed to the shaft via a fixing member 22, in which the shaft is rotated by the driving device to rotate the roller, thereby conveying a substrate S placed on the roller; the shaft is made of a conductive material, and the roller is made of an insulating material; the roller includes a roller part 23, which abuts against the substrate to convey the substrate, and also has a projection portion 25, fixed to the fixing member and projected from the roller; the fixing part has a cover 26 covering the projection portion; and there is an interval between the roller and the shaft and between the roller and the cover. A film-forming apparatus is provided with the substrate conveyer. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate transfer apparatus and a film forming apparatus using the same.

Conventionally, in an in-line type film forming apparatus, a substrate is transported by placing the substrate on a carrier and transporting the carrier. However, in this film forming apparatus, it is necessary to clean and remove film forming particles adhering to the carrier in the film forming process, but the carrier cleaning leads to an increase in cost. In order to prevent this increase in cost, a film forming apparatus capable of transporting a substrate without using a carrier is known. For example, in patent document 1, it is comprised so that a board | substrate can be directly hold | maintained and conveyed directly on the roller provided in the film-forming apparatus.
JP 2006-257546 A (FIG. 2 etc.)

  However, in a film forming apparatus that does not use a carrier, film forming particles often wrap around the roller from the gap between the substrate and deposit on the roller during continuous film formation. In this case, if the film contains metal, the substrate on the roller is electrically connected to the chamber through the film and locally short-circuited. As a result, the charges charged on the substrate are all at once. There is a problem that abnormal electric discharge easily occurs.

  Accordingly, an object of the present invention is to solve the above-described problems of the prior art, and is a substrate transfer apparatus that does not use a carrier, and can be used for a film formation apparatus, and can prevent abnormal discharge when used in a film formation apparatus, In addition, an object of the present invention is to provide a film forming apparatus that can prevent abnormal discharge using the same.

  The substrate transport apparatus of the present invention includes a shaft that is rotationally driven by a driving device, and a roller that is fixed to the shaft via a fixing member. The shaft is rotated by the driving device to rotate the roller. The substrate transport device transports a substrate placed on the roller, wherein the shaft is made of a conductive material, the roller is made of an insulating material, and the roller is in contact with the substrate to be in contact with the substrate. And a protrusion that protrudes from the roller and is fixed to the fixing member, and the fixing member has a cover that covers at least a part of the protrusion, and the roller and the A gap is provided between the shaft and between the roller and the cover portion.

  Conventionally, when film formation particles adhere to and deposit on a substrate transport device used in a film formation apparatus to form a conductive film, a substrate placed on a roller and a shaft made of a conductive member via this film, The fixing member may be electrically connected to cause a short circuit, which causes abnormal discharge. In the present invention, it is difficult to form a film that electrically connects the roller and the shaft by providing a gap between the roller and the shaft and between the roller and the cover portion. . As a result, it is possible to suppress the electrical connection between the substrate placed on the roller, the shaft, and the fixing member, and maintain the floating potential of the substrate, thereby suppressing abnormal discharge.

  Furthermore, it is preferable that the board | substrate conveyance apparatus provided the other cover part which covers at least one part of the said cover part in the said roller. By providing this other cover part, it is possible to further suppress the formation of a film that electrically connects the film formation particles to the shaft made of metal and the fixing member.

  The substrate transport device includes a guide roller made of an insulator that rotates about a rotation shaft made of a conductive material as an axis and contacts a side surface of the substrate to guide the transport of the substrate. It is preferable that a groove is provided between the roller and the rotating shaft. Since the guide roller is further provided in this way, the substrate can be transported more stably even when the substrate transport device including the roller and the shaft is used without using the carrier. In this case, since the groove | channel is also provided between the guide roller and the rotating shaft, the film | membrane which electrically connects a guide roller and a rotating shaft is not formed, Therefore Abnormal discharge can be prevented.

  In this case, it is preferable that an adhesion preventing plate is provided on the rotating shaft so as to sandwich the guide roller, and a gap is provided between an end surface of the guide roller and the adhesion preventing plate. The adhesion preventing plate further prevents the film-forming particles from coming to the guide roller side, and as a result, the film-forming particles can be prevented from adhering. In this case, since the gap is further provided, a film that electrically connects the guide roller and the other conductive member is not formed, so that abnormal discharge can be prevented.

  It is preferable that the deposition preventing plate is configured to cover a portion of the guide roller that does not contact the substrate. By being comprised in this way, adhesion of the film-forming particle | grain to a guide roller can be suppressed more, and abnormal discharge can be prevented.

  The film forming apparatus of the present invention includes the above-described substrate transfer device, and also includes a film forming unit, and performs film formation on the substrate transferred by the substrate transfer device. By providing the above-described substrate transfer device, abnormal discharge can be prevented.

  The film forming means is provided at a position facing the substrate transferred by the substrate transfer apparatus, and includes a sputtering target containing metal and a sputtering gas introduction means, and forms a film on the transferred substrate by a sputtering method. It is preferable to do. Also in such a film forming apparatus, by using the above-described substrate transfer apparatus, it is difficult to form a film that electrically connects the roller and the shaft, so that abnormal discharge can be prevented.

  As a preferred embodiment of the film forming apparatus of the present invention, the sputtering target is provided on a ceiling portion of the film forming apparatus. In such a so-called deposition down type sputtering apparatus, film forming particles are particularly likely to adhere to the substrate transport apparatus, but in the film forming apparatus of the present invention, since the above-described gap is provided, the roller and the shaft Are not easily formed. For this reason, even if it is a deposition down type sputtering device and a device which conveys a substrate directly, abnormal discharge can be prevented.

  According to the substrate transfer apparatus and the film forming apparatus using the same of the present invention, an excellent effect that abnormal discharge can be prevented can be obtained.

  The film forming apparatus of the present invention will be described with reference to FIGS. 1 is a schematic perspective view of the sputtering apparatus, FIG. 2 is a schematic front view of the sputtering apparatus, and FIG. 3 is a schematic cross-sectional view of the sputtering apparatus. In the drawings, the same components are denoted by the same reference numerals.

  As shown in FIG. 1, the sputtering apparatus 1 functions as a film formation chamber that constitutes a part of an in-line type film formation apparatus. The sputtering apparatus 1 is connected to a heating chamber (not shown) on the upstream side and a film forming apparatus for performing another film forming process on the downstream side. The sputtering apparatus 1 includes a chamber 11. In the chamber 11, as shown in FIG. 3, a shaft 20 made of metal and a roller 21 made of an insulator that rotates integrally with the shaft 20 are provided. The substrate S is placed on the roller 21. In this case, since the roller 21 is made of an insulator, the substrate S has a floating potential while being placed on the roller 21. The substrate S placed on the roller 21 was transported into the chamber 11 from a processing apparatus (not shown) on the upstream side as the roller 21 was rotated, and was continuously formed while being transported and moved in the chamber 11. Thereafter, the film is transferred to another film forming apparatus (not shown) on the downstream side.

  The sputtering apparatus 1 will be described in detail below. A vacuum pump (not shown) is provided on the bottom surface of the front and rear of the chamber 11 so that the inside of the chamber 11 can be in a desired vacuum state. Further, a cathode chamber 12 is provided on the ceiling surface of the chamber 11, and a sputtering target 13 containing a metal (for example, Ag or the like) is installed on the ceiling surface of the cathode chamber 12 as shown in FIG. Has been. A magnet assembly (not shown) is provided behind the sputtering target 13, and a magnetic flux is formed in front of the target. Plasma formed by applying a voltage to the sputtering target 13 is supplemented by a magnetic flux formed in front of the target, and high-speed sputtering can be performed. That is, the sputtering apparatus 1 can form a metal-containing film on the substrate S by a so-called deposition method by sputtering in a desired vacuum state.

  Outside the chamber 11, as shown in FIGS. 1 and 2, a driving device 3 for the substrate transfer device 2 of the present invention is provided. The drive device 3 includes a drive roller 31 connected to a drive source (not shown). The drive roller 31 is rotationally driven by a drive source to drive a drive belt (toothed belt) 32 that is applied to the drive roller 31. The drive belt 32 is hung on a plurality of belt rollers 33 (eight in the drawing as an example), a plurality of tension rollers 34 (three in the drawing as an example), and a plurality of auxiliary rollers 35 for stable driving. ing. The belt roller 33 and the tension roller 34 are configured to be fitted with the teeth of the drive belt 32. When the driving belt 32 is driven by the driving roller 31, each belt roller 33 rotates in accordance with this driving.

  Further, when the chamber 11 is in a vacuum state, the drive device 3 is provided with a pair of belt side rollers 36 to prevent the drive belt 32 from meandering due to the depression of the chamber 11 inside. The pair of belt side rollers 36 are installed so as to sandwich both ends of the drive belt 32 (that is, the rotation axis of the belt side roller 36 is perpendicular to the belt traveling direction), and the drive belt 32 is disposed on the side surface. The drive belt 32 is prevented from meandering. The belt side roller 36 is preferably provided at a position where the tension of the drive belt 32 is high. In the figure, it is installed in the vicinity of the drive roller 31 as an example. Further, the pair of belt side rollers 36 is configured such that, for example, the attachment portion 37 of the belt side roller 36 to the side wall of the chamber 11 can be displaced on the screw mechanism so that the position can be adjusted. Also good.

  Each belt roller 33 described above is connected to one end of the shaft 20 constituting the substrate transport apparatus 2, and the belt roller 33 is rotated by the drive belt 32, so that the shaft 20 rotates integrally with the belt roller 33. It is configured to be able to.

  Hereinafter, the substrate transfer apparatus 2 will be described in detail with reference to FIG. FIG. 4 is a partially enlarged perspective view of the substrate transfer apparatus.

  As described above, a plurality of rollers 21 (two as an example in the figure) are fixed to the shaft 20 connected to each belt roller 33 shown in FIG. 4 via a fixing member 22 made of a conductive member. Each roller 21 is configured to rotate integrally with the shaft 20. A substrate S is placed on these rollers 21. That is, when the driving roller 31 is driven by the driving source and each belt roller 33 (see FIG. 2) rotates, the shaft 20 rotates in accordance with this rotation. As the shaft 20 rotates, the roller 21 fixed to the shaft 20 via the fixing member 22 rotates. Therefore, the substrate S placed on the roller 21 moves in the chamber 11 in the rotation direction. Each shaft 20 is rotatably held by holding means (not shown) provided on the bottom surface of the chamber 11.

  The configuration of the roller 21 and the shaft 20 will be described in detail with reference to FIG. FIG. 5 is a partially enlarged cross-sectional view of the substrate transfer apparatus.

  On the outer periphery of the shaft 20 made of a conductive member (for example, SUS, Al, Ti, and Fe. Alternatively, an alloy containing at least one selected from Al, Ti, and Fe) may be provided on the outer periphery of the shaft 20. A fixing member 22 made of a conductive member having a shape is fixed by a screw 24. The roller 21 is made of an insulator. Examples of the insulator include a resin. For example, a polyimide resin can be used. Alternatively, a metal may be coated with an insulator by, for example, thermal spraying. The roller 21 includes a cylindrical roller portion 23 and a protruding portion 25 protruding in the longitudinal direction of the shaft from one of the end surfaces intersecting the shaft 20 of the roller portion 23 (the left end surface in the figure). Yes. The protruding portion 25 is also cylindrical, and its radius is smaller than the radius of the roller portion 23. In addition, in this embodiment, although the protrusion part 25 is provided integrally with the roller part 23, you may provide as a different body. A protruding portion 25 protruding from the roller portion 23 is fixed to the fixing member 22 by another screw 24. That is, the roller 21 is fixed to the shaft 20 via the fixing member 22. Further, the fixing member 22 includes a cover portion 26 that covers the protruding portion 25. In addition, although the fixing member 22 and the protrusion part 25 are cylindrical shapes in the drawing, any shape may be used as long as the roller 21 can be fixed to the shaft 20.

  Here, in this embodiment, each member is installed so that the gap | intervals 27 and 28 may be provided between this cover part 26 and the roller 21, and between the shaft 20 and the roller 21, respectively. Thus, by providing the gaps 28 and 27 between the roller 21 and the shaft 20 and the fixing member 22, the floating potential of the substrate S can be maintained.

  That is, conventionally, sputtering particles (film formation particles) adhere to the substrate transport apparatus 2, that is, the shaft 20, the roller 21, and the fixing member 22 during film formation. Then, when the sputtered particles adhere and deposit to form a conductive film that connects the metal shaft 20, the fixing member 22 and the roller 21, the substrate S placed on the roller 21 is locally short-circuited. This causes abnormal discharge. However, in the present embodiment, gaps 28 and 27 are provided between the roller 21 and the shaft 20 and the cover portion 26 as shown in FIG. No film is formed. For example, since the gap 28 is provided between the roller 21 and the shaft 20, a conductive film that connects the two is not formed. Thus, in this embodiment, it is possible to hold the floating potential of the substrate S, thereby preventing abnormal discharge.

  In this case, the gap 27 is further bent in a cross-sectional view as shown in the figure, so that the sputtered particles do not enter (does not reach the inside and form a film that electrically connects the roller 21 and the shaft 20). It is configured. Thus, by providing the gap 27 so as to have a so-called labyrinth structure, it is difficult to form a metal film that connects the two more, and as a result, abnormal discharge can be further prevented.

  In the present embodiment, the widths of the gaps 27 and 28 that function in this way are both 1 mm, but are preferably 0.5 to 1.5 mm, and more preferably 0.5 to 1 mm. By being in this range, it is possible to suppress the formation of a metal-containing film that connects the metal shaft 20, the fixing member 22, and the roller 21, and the substrate can be held at a floating potential. Discharge can be suppressed. On the other hand, when the width is larger than 1.5 mm, the gap is too wide and the sputtered particles easily go around. When the width is smaller than 0.5 mm, the sputtered particles easily accumulate inside, and the manufacturing accuracy of the roller 21 and the fixing member 22 is improved. Because it also affects.

  As shown in FIGS. 4 and 5, the substrate transport apparatus 2 of the present embodiment may be provided with a guide roller 41 for assisting the transport of the substrate S. The guide roller 41 is provided in the chamber 11 and functions as a guide when contacting the side surface of the substrate S and transporting the substrate S in the transport direction.

  The guide roller 41 is fitted to the outer periphery of the rotation shaft 42, and the rotation shaft 42 is provided on a holding member 43 provided on the inner surface of the chamber 11. Further, an adhesion preventing plate 44 is provided on the upper side and the lower side of the guide roller 41 of the rotating shaft 42. In this case, a gap 45 is provided between the guide roller 41 and the deposition preventing plate 44, and a groove having a predetermined depth is also formed between the upper surface side and the lower surface side of the guide roller 41 and the rotating shaft 42. A (gap) 46 is provided. The gap 45 and the inside of the groove 46 form one continuous space. This space is bent in a cross-sectional view, and is configured so that the sputtered particles do not reach the inside. That is, the guide roller 41 also has a labyrinth structure, and is configured such that the substrate S has a floating potential even when the sputtered particles are attached. In this case, the deposition preventing plate 44 may be configured to cover at least a part of the side surface of the guide roller 41. By providing an adhesion-preventing plate so as to cover at least a part of the side surface of the guide roller 41, that is, at least a part other than the part in contact with the substrate, it is possible to further suppress the wraparound of the sputtered particles. Can be prevented.

  In this case, the widths of the gap 45 and the groove 46 are both 1 mm in this embodiment, but are preferably 0.5 to 1.5 mm, more preferably 0.5 to 1 mm. By being in this range, it is possible to more effectively prevent the sputtered particles from forming a film that electrically connects the guide roller 41 and the rotating shaft 42, so that the substrate can be held at a floating potential, and abnormal discharge is caused. Can prevent abnormal discharge.

  As described above, in the present embodiment, the roller 21 and the guide roller 41 are provided with a predetermined gap so that the substrate S maintains a floating potential and does not short-circuit even if sputtered particles adhere to the roller 21. As a result, abnormal discharge can be prevented. In this case, since the shaft 20 can be made of metal without constituting the shaft 20 with an insulating member, the strength can be maintained. At the same time, the roller 21 and the guide roller 41 may have a labyrinth structure, so that it can be applied to an existing apparatus and the cost can be reduced.

  The structure of the gap (or groove) in the roller 21 and the guide roller 41 in the above embodiment is not limited to the above form. For example, a configuration as shown in FIG. Hereinafter, another configuration of the gap (or groove) in the roller 21 and the guide roller 41 will be described with reference to FIG. 6 (1) to 6 (4) are cross-sectional views of main parts of the shaft 20, the roller 21, and the fixing member 22, respectively.

  The configuration shown in FIG. 6A is different from the configuration shown in FIG. 5 in that the protruding portion 25 has a stepped portion 61, and a gap is formed between the stepped portion 61 and the protruding portion 25 and the cover portion 26. 62 is provided, and an extending portion 63 is provided so as to widen the connection surface of the fixing member 22 with the shaft 20, and the gap 64 between the shaft 20 and the roller 21 is a gap 28 (see FIG. 5)) is shorter. Even in this configuration, the gap 62 is provided between the fixing member 22 and the roller 21, and the gap 64 is also provided between the roller 21 and the shaft 20. The formation of a conductive film that connects the fixing member 22 and the shaft 20 to each other can be suppressed, and the substrate can be held at a floating potential, so that abnormal discharge can be suppressed.

  The configuration shown in FIG. 6 (2) is different from the configuration shown in FIG. 6 (1) in that the protruding portion 25 has another stepped portion 65 and the gap 66 is bent three times in a sectional view. The difference is that the length of the gap 66 between the roller 21 and the fixing member 22 is longer than the length of the gap 62. Therefore, since the film formation particles are less likely to go around, it is possible to suppress the formation of a conductive film that connects the roller 21 to the fixing member 22 and the shaft 20, and the substrate can be held at a floating potential. Abnormal discharge can be suppressed.

  The configuration shown in FIG. 6 (3) is different from the configuration shown in FIG. 5 in that the roller portion 23 is provided with another cover member 67 so as to cover the cover portion 26, and between the roller 21 and the fixing member 22. The difference is that the gap 68 is bent three times in a sectional view, and the length of the gap 68 is longer than the length of the gap 27 (see FIG. 5). Furthermore, the bending direction of the gap is different from the configuration shown in FIG. Since the gap 68 is configured in this way, the film formation particles are less likely to go around, so that it is possible to suppress the formation of a conductive film that connects the roller 21 to the fixing member 22 and the shaft 20. Since the substrate can be held at a floating potential, abnormal discharge can be suppressed.

  6 (4) is different from FIG. 6 (1) in that a recess 69 is provided on the surface of the roller 21 on the shaft 20 side, and the gap 70 between the roller 21 and the shaft 20 is bent in a sectional view. It is provided to do. As described above, since the gap 70 between the roller 21 and the shaft 20 is also bent so as to be bent in a cross-sectional view, the film formation particles are less likely to go around, so the roller 21 is connected to the fixing member 22 and the shaft 20. The formation of such a conductive film can be suppressed, and the substrate can be held at a floating potential, so that abnormal discharge can be suppressed.

  Further, in the present embodiment, the substrate transfer apparatus 2 of the present invention is used in the sputtering apparatus 1 that performs deposition-down type sputtering film formation. However, in the so-called side deposition type film formation apparatus in the depot up type or vertical type substrate transfer apparatus. Also, the substrate transfer device 2 of the present invention can be used. Further, the film forming method is not limited to the sputtering method. For example, it can be used in a film forming apparatus that performs chemical vapor deposition.

  The substrate transfer apparatus and the film forming apparatus of the present invention can be used, for example, for manufacturing a solar cell or the like. Therefore, it can be used in the field of semiconductor device manufacturing.

It is a typical perspective view of a sputtering device. It is a typical front view of a sputtering device. It is typical sectional drawing of a sputtering device. It is a partial enlarged view perspective view of a substrate transfer device. It is a partial expanded sectional view of a board | substrate conveyance apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Sputtering apparatus 2 Substrate conveyance apparatus 3 Drive apparatus 11 Chamber 12 Cathode chamber 13 Sputtering target 20 Shaft 21 Roller 22 Fixing member 23 Roller part 24 Screw 25 Projection part 26 Cover part 27 Gap 28 Gap 31 Drive roller 32 Drive belt 33 Belt roller 34 Tension roller 35 Auxiliary roller 36 Belt side roller 37 Mounting portion 41 Guide roller 42 Rotating shaft 43 Holding member 44 Adhering plate 45 Gap 46 Groove 61 Step portion 62 Gap 63 Extension portion 64 Gap 65 Step portion 66 Gap 67 Cover member 68 Gap 69 Recess 70 Gap S Substrate

Claims (8)

A shaft that is rotationally driven by a driving device; and a roller that is fixed to the shaft via a fixing member. The shaft is driven to rotate by the driving device, and the roller is rotated to be placed on the roller. A substrate transfer device for transferring a substrate,
The shaft is made of a conductive material, and the roller is made of an insulating material;
The roller comprises a roller part that contacts the substrate and conveys the substrate, and a protruding part that protrudes from the roller part and is fixed to the fixing member.
The fixing member has a cover portion that covers at least a part of the protruding portion,
A substrate transfer apparatus, wherein a gap is provided between the roller and the shaft and between the roller and the cover portion.   The substrate transport apparatus according to claim 1, wherein the roller is further provided with another cover portion that covers at least a part of the cover portion. The substrate transport device includes a guide roller made of an insulator for rotating around a rotation shaft made of a conductive material as an axis, and contacting a side surface of the substrate to guide the transport of the substrate.
The substrate transfer apparatus according to claim 1, wherein a groove is provided between the guide roller and the rotation shaft. An adhesion preventing plate is provided so as to sandwich the guide roller of the rotating shaft,
The substrate transfer apparatus according to claim 1, wherein a gap is provided between an end face of the guide roller and the deposition preventing plate. The substrate transport apparatus according to claim 4, wherein the deposition preventing plate is configured to cover a portion of the guide roller that does not contact the substrate. A substrate transport apparatus according to any one of claims 1 to 5, and a film forming unit.
A film forming apparatus for forming a film on a substrate transported by a substrate transport apparatus. The film forming means is provided at a position facing the substrate transferred by the substrate transfer device, and includes a sputtering target containing metal and a sputtering gas introducing means,
The film forming apparatus according to claim 6, wherein a film is formed on the transported substrate by a sputtering method. The film forming apparatus according to claim 7, wherein the sputtering target is provided on a ceiling portion of the film forming apparatus.

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