JP2010147082A - Resin sealing apparatus and resin sealing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a resin sealing apparatus and a resin sealing method that can reduce foreign matters in dissolved resin, thus improving the yield of a semiconductor device. <P>SOLUTION: A resin sealing apparatus 1 has cavity sections 17 and 18 formed between upper and lower metal molds 2 and 3 vertically making a pair for resin-sealing a semiconductor chip 41, a pot portion 10 formed at either of the upper and lower metal molds 2 and 3 for supplying dissolved resin, a resin flow passage 14 formed between the upper and lower metal molds 2 and 3 for connecting the cavity sections 17 and 18 and the pot portion 10 communicatively, and a filter 20 prepared in mid-course of this resin passage 14 for eliminating foreign matters contained in the dissolved resin that passes the resin passage 14, wherein the filter 20 is made up of a mesh material. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a resin sealing device and a resin sealing method. More specifically, the present invention relates to a resin sealing device and a resin sealing method for sealing a semiconductor chip with resin.

  In order to protect the semiconductor device from the outside world, the semiconductor device is generally manufactured by resin-sealing a semiconductor chip by a transfer molding method. In order to perform resin sealing by this transfer molding method, a resin sealing device having a resin sealing mold is used.

  As shown in FIG. 12, the resin-sealed mold 101 has an upper mold 102 and a lower mold 103 that are paired up and down. The resin-sealed mold 101 has a resin flow path including a cavity portion 117 on which the semiconductor chip 141 is placed, a pot portion 110 that supplies the dissolved resin R, a cull portion 111, a runner portion 112, and a gate portion 113. 114 are formed.

Resin sealing of the semiconductor chip using the resin sealing mold 101 is performed as follows. First, the semiconductor chip 141 assembled on the lead frame 144 is mounted in the cavity portion 117, and the preheated tablet-shaped resin R is put into the pot portion 110. Next, the upper mold 102 is lowered and brought into close contact with the lower mold 103. The resin sealing mold 101 is heated, and the resin R receives heat from the resin sealing mold 101 and melts in the pot portion 110. The dissolved resin R is pushed out from the pot portion 110 by the blanker 119 and filled into the cavity portion 117 through the resin flow path 114. Then, when the dissolved resin R in the cavity 117 is cured, a resin package is formed (see, for example, Patent Document 1).
JP 2000-58573 A

  The resin used for the resin sealing is manufactured by a resin manufacturer and shipped to a manufacturer that performs resin molding after a sufficient quality inspection.

  However, in some cases, the resin manufactured by a resin manufacturer is shipped in a state in which foreign matter is mixed. In that case, the melted resin R and the foreign material 170 are integrally injected into the cavity portion 117 via the resin flow path 114. For this reason, there has been a problem that the foreign matter 170 adheres to a short circuit between the pads of the semiconductor chip 141 or between the terminals of the lead frame.

  In addition, with the progress of the semiconductor chip miniaturization process, the stacked semiconductor chips 141 are connected by the bonding wires 143, and the pitch between the bonding wires 143 and 143 is further narrowed. Therefore, even when the foreign matter has a size that has not been a problem in the past, when the laminated semiconductor chip 141 is sealed with resin, the foreign matter 170 adheres between the bonding wires 143 and 143 having a narrow pitch and is short-circuited. (See FIG. 13).

  As a result, the resin-sealed semiconductor device becomes a defective product, which may reduce the yield.

  Therefore, an object of the present invention is to provide a resin sealing device and a resin sealing method that can reduce the foreign matter in the dissolved resin and improve the yield of the semiconductor device.

  In order to achieve such an object, an invention according to claim 1 is formed between an upper mold and a lower mold which are paired up and down, and a cavity for resin-sealing a semiconductor chip, Formed in one of the mold and the lower mold, formed between a pot portion for supplying a molten resin, and an upper mold and a lower mold, and the cavity portion and the pot portion communicate with each other A resin flow path, and a filter that is provided in the middle of the resin flow path and removes foreign substances contained in the dissolved resin that passes through the resin flow path, and the filter is made of a mesh material A sealing device was obtained.

  According to a second aspect of the present invention, in the resin sealing device according to the first aspect, the resin flow path is a cull portion communicating with the pot portion, and a resin communicated with the cull portion and supplied from the pot portion. The filter is formed in a hat shape and is arranged in the cull portion so as to cover the resin supply port of the pot portion.

  According to a third aspect of the present invention, in the resin sealing device according to the first aspect, the resin flow path communicates with the pot portion and a resin that is communicated with the pot portion and supplied from the pot portion. The filter is arranged in the runner portion so as to be orthogonal to the flow direction of the dissolved resin.

  According to a fourth aspect of the present invention, in the resin sealing device according to any one of the first to third aspects, the mesh material is formed of carbon fiber.

  According to a fifth aspect of the present invention, there is provided a resin loading step of loading a resin into a space of a pot portion formed in a mold body provided with an upper mold and a lower mold that are paired up and down, and formed in the mold body. A semiconductor chip placing step for placing a semiconductor chip in the cavity, and a molten resin is supplied from the pot part to a resin flow path formed in the mold body, and provided in the middle part of the resin flow path The resin sealing method includes a resin injection step of injecting the dissolved resin into the cavity after removing foreign substances contained in the dissolved resin with a filter formed of a mesh material.

  According to the present invention, since the foreign material contained in the molten resin is removed by the filter portion formed of the mesh material, the molten resin is injected into the cavity portion. The yield can be improved.

The best mode for carrying out the invention (hereinafter referred to as “embodiment”) will be described below. The description will be given in the following order.
1. Resin sealing device 2. Resin sealing method Other resin sealing devices and resin sealing methods

[1. Resin sealing device]
FIG. 1 is a cross-sectional view showing a resin sealing device according to this embodiment. FIG. 2 is a perspective view showing a filter provided in the resin sealing device according to the present embodiment.

  As shown in FIG. 1, the resin sealing device 1 according to the present embodiment includes a mold body 4 including an upper mold 2 and a lower mold 3 that are paired up and down.

  The mold body 4 is formed with a pot part 10 provided with a space S1 into which resin can be poured in the lower mold 3 and a cull part 11 communicating with the pot part 10 and provided with a space S2 having a concave shape in cross section. The runner portions 12 and 13 are formed in communication with the cull portion 11 and provided with predetermined spaces S3 and S4.

  Further, the mold body 4 is formed with gate portions 15 and 16 serving as resin injection ports at both end portions 12e and 13e of the runner portions 12 and 13, respectively, and communicates with the gate portions 15 and 16 in a sectional view. Cavity portions 17 and 18 having hexagonal spaces S5 and S6 are formed, respectively.

  The resin flow path 14 formed of the cull part 11 and the runner parts 12 and 13 formed in the mold body 4 serves as a passage for flowing the molten resin from the pot part 10 to the cavity parts 17 and 18. Moreover, the said cull part 11 functions as a branch path which supplies the resin melt | dissolved to both the runner parts 12 and 13 which connected. The runner parts 12 and 13 function as a passage for supplying the melted resin supplied from the cull part 11 to the cavity parts 17 and 18.

  The mold body 4 is provided with a filter 20 that allows the dissolved resin to pass therethrough and removes foreign substances contained in the dissolved resin. The filter 20 is provided in the middle of the resin flow path 14.

  As shown in FIG. 2, the filter 20 is configured in a hat shape with a mesh-like mesh material, and has an upper portion 21 whose upper surface is formed in a flat circular shape, and a cross-sectional view from the upper portion 21 toward the lower portion 22. It has the peripheral part 23 formed in the taper shape, and the collar part 24 which formed the periphery of the lower part 22 in the collar shape.

  The filter 20 is made of a non-conductive material, such as a material used for an interposer base material such as carbon fiber.

  The mesh intervals X1 and Y1 of the mesh material are desirably larger than the resin filler diameter and smaller than the interval between the bonding wires 43 and 43 so that the resin can pass through, for example, preferably 20 μm.

  As shown in FIG. 1, the filter 20 is mounted so as to cover the resin supply port 10 a of the pot portion 10 of the lower mold 3 in the space S <b> 2 of the cull portion 11. At this time, the peripheral edge 21a of the circular upper portion 21 abuts on a tapered surface 31 in a sectional view of the cull recess 30 on the upper mold 2 side in the cull portion 11, and the flange portion 24 is in the runner portions 12 and 13. It contacts the inner bottom surfaces 32a, 33a of the runner recesses 32, 33 on the lower mold 3 side. The peripheral portion 23 is formed at an inclination angle that does not contact the cull convex portion 34 on the lower mold 3 side.

  That is, in the resin sealing device 1, since the filter 20 is provided so as to cover the resin supply port 10 a of the pot portion 10, when the dissolved resin flows into the cavity portions 17 and 18 through the resin flow path 14, It becomes possible to catch the conductive foreign substance contained in the resin with the mesh material which is the filter 20.

  Then, the dissolved resin from which the foreign matter has been removed is passed through the mesh material as the filter 20 and supplied to the cull part 11 and the runner parts 12 and 13 and injected into the cavity parts 17 and 18 through the gate parts 15 and 16. Is possible.

  As described above, according to the resin sealing device 1 according to this embodiment, the conductive foreign matter contained in the dissolved resin can be removed by the filter 20 and injected into the cavities 17 and 18.

[2. Resin sealing method]
Next, the resin sealing method according to this embodiment using the resin sealing device 1 will be described in detail with reference to FIGS. 3 to 6 are manufacturing process diagrams illustrating the resin sealing method according to the present embodiment. FIG. 7 is a manufacturing process diagram showing the state of the resin flowing through the resin flow path.

  In the resin loading step, as shown in FIG. 3, the tablet-shaped resin R is loaded into the space S <b> 1 of the pot portion 10 of the lower mold 3. Next, the hat-shaped filter 20 is attached so as to cover the resin supply port 10a of the pot portion 10 from above.

  Next, in the semiconductor chip mounting step, the semiconductor chip 41 having the bonding wire 43 formed thereon and the lead frame 44 attached thereto is mounted on the left and right cavities 17 and 18 of the lower mold 3.

  Then, the mold body 4 is heated to melt the resin R, and the upper mold 2 is lowered toward the lower mold 3 positioned below.

  Next, as shown in FIG. 4, the lead frame 44 is sandwiched and fixed between the upper mold 2 and the lower mold 3. At this time, the peripheral edge 21a of the circular upper portion 21 of the filter 20 is in contact with the tapered surface 31 in a sectional view of the cull recess 30 on the upper mold 2 side.

  Next, in the resin injection step, the plunger 19 in the pot portion 10 is pushed upward to inject the dissolved resin R into the cull portion 11.

  At this time, the dissolved resin R supplied from the pot portion 10 is filled in the space S2 in the cull portion 11 and passes through the filter 20 in the cull portion 11. Since the filter 20 is formed of a mesh material, the dissolved resin R itself supplied from the pot portion 10 is supplied to the runner portions 12 and 13, while the conductive foreign matter contained in the dissolved resin R is removed. Is done. Thereafter, the melted resin R divided by the cull portion 11 is injected into the left and right runner portions 12 and 13 (see FIG. 7).

  At this time, resin pressure is applied via the plunger 19, but the peripheral edge 21 a of the circular upper portion 21 of the filter 20 is in contact with the tapered surface 31 in sectional view of the upper mold 2, so that the lower portion 22 of the filter 20. It is possible to prevent the collar portion 24 from being lifted.

  Next, after the molten resin R that has passed through the filter 20 is filled in the spaces S3 and S4 in the runner portions 12 and 13, the spaces S5 and S5 in the cavity portions 17 and 18 are further passed through the gate portions 15 and 16. Injected into S6.

  And as shown in FIG. 5, each space S2, S3, S4, S5, and S6 in the cull part 11, the runner parts 12 and 13, and the cavity parts 17 and 18 will be in the state with which the melted resin R was filled.

  At this time, the semiconductor chip 41 to which the lead frame 44 is attached is in a state surrounded by the molten resin R and is formed into a desired shape. When a predetermined time elapses, the dissolved resin R filled in the spaces S2, S3, S4, S5, and S6 is polymerized and cured.

  As shown in FIG. 6, the upper die 2 is raised upward, and the extruded portion 9 of the lower die 3 is protruded upward, and the semiconductor device 40 integrated with the molded resin R is taken out.

  Thereafter, unnecessary resin cured at the runner portions 12 and 13 and the cull portion 11 is removed, and then cured to stabilize the resin.

  The filter 20 after being used for resin sealing can be reused after being removed from the mold body 4 and the resin adhered to the mesh material of the filter 20 and cured by using a chemical.

  According to the resin sealing method of the present embodiment, a mesh material as the filter 20 is provided on the cull portion 11 so as to cover the pot portion 10. At this time, since the melted resin from which the foreign matters are removed is injected into the cavities 17 and 18, the occurrence of a short circuit due to the foreign matters is suppressed, and the yield of the semiconductor device 40 can be improved.

[3. Other resin sealing device and resin sealing method]
Other forms of the above-described resin sealing device 1 will be described below. FIG. 8 is a sectional view showing another resin sealing device 71 according to this embodiment. FIG. 9 is a front view showing a filter 50 of another resin sealing device 71 according to this embodiment.

[Other resin sealing devices]
As shown in FIG. 8, the resin sealing device 71 according to the present embodiment is configured by a mold body 4 including an upper mold 2 and a lower mold 3 that are paired up and down.

  The mold body 4 is formed with a pot part 10 provided with a space S1 into which resin can be poured in the lower mold 3 and a cull part 11 communicating with the pot part 10 and provided with a space S2 having a concave shape in cross section. The runner portions 12 and 13 are formed in communication with the cull portion 11 and provided with predetermined spaces S3 and S4.

  Further, the mold body 4 is formed with gate portions 15 and 16 serving as resin injection ports at the end portions 12e and 13e of the runner portions 12 and 13, respectively, and communicates with the gate portions 15 and 16 in a hexagonal view in cross section. Cavity portions 17 and 18 provided with shaped spaces S5 and S6 are formed, respectively.

  The resin flow path 14 formed of the cull portion 11 and the runner portions 12 and 13 formed in the mold body 4 serves as a passage for flowing the molten resin from the pot portion 10 to the cavity portions 17 and 18.

  Further, the mold body 4 is provided with a rectangular filter 50 that allows the dissolved resin to pass therethrough and removes foreign substances contained in the dissolved resin. The filter 50 is configured by stretching a mesh-like mesh material 51 on a rectangular frame portion 52, and the flow direction of the dissolved resin is in the middle of the runner portions 12 and 13 of the resin flow channel 14. Are formed to be orthogonal to each other.

  Specifically, the frame portion 52 of the filter 50 is attached to the concave portions 35 s and 36 s on the start end side of the runner convex portions 35 and 36 of the upper mold 2.

  The filter 50 is made of a non-conductive material such as a material used for an interposer base material such as carbon fiber.

  The mesh intervals X1 and Y1 of the mesh material are desirably larger than the resin filler diameter and smaller than the interval between the bonding wires 43 and 43 so that the resin can pass through, for example, preferably 20 μm.

  As described above, in the resin sealing device 71, the filter 50 is provided in the runner portions 12 and 13, so that the melted resin passes through the resin flow path 14 including the cull portion 11 and the runner portions 12 and 13, and the cavity portions 17 and 18 occur. It is possible to catch the conductive foreign substance contained in the molten resin with the mesh material 51 which is the filters 50 and 50 when flowing into the filter.

  Then, the dissolved resin from which the foreign matters have been removed is supplied to the cull portion 11 and the runner portions 12 and 13 through the mesh material 51 as the filter 50 and is injected into the cavity portions 17 and 18 through the gate portions 15 and 16. It becomes possible.

  According to the resin sealing device 71 according to the present embodiment, the conductive foreign matter contained in the dissolved resin can be removed by both the filters 50 and 50 and injected into the cavity portions 17 and 18.

  Although the filter 50 of the resin sealing device 71 according to the present embodiment is provided on the start end side of the runner portions 12 and 13, the intermediate portion and the end of the runner portions 12 and 13 are not contacted with the lead frame 44. It may be provided on the side.

  The filter 50 is disposed in the concave portions 35s and 36s of the runner convex portions 35 and 36, but a detachable mechanism may be provided.

[Other resin sealing methods]
Next, another resin sealing method according to the embodiment using the resin sealing device 71 will be described in detail with reference to FIGS. 10 to 11 are manufacturing process diagrams illustrating another resin sealing method according to the present embodiment.

  In the resin loading step, the tablet-shaped resin R is loaded into the space S1 of the pot portion 10 of the lower mold 3. At this time, rectangular filters 50, 50 are attached to the runner portions 12, 13 of the upper mold 2 so as to be orthogonal to the flow direction of the dissolved resin.

  Next, in the semiconductor chip mounting step, the semiconductor chip 41 on which the bonding wire is formed and the lead frame 44 is attached is placed in the left and right cavities 17 and 18 of the lower mold 3.

  Then, the mold body 4 is heated to melt the resin R, and the upper mold 2 is lowered toward the lower mold 3 positioned below.

  Next, both ends of the lead frame 44 are sandwiched and fixed between the upper mold 2 and the lower mold 3. At this time, the lower portions of the filters 50 and 50 are in a state of being engaged with both the concave portions 32 s and 33 s of the runner concave portions 32 and 33 of the lower mold 3.

  Next, in the resin injection step, the plunger 19 in the pot portion 10 is pushed upward to inject the dissolved resin R into the cull portion 11. The molten resin R is filled in the space S2 in the cull part 11 and is injected into both the runner parts 12 and 13 through the filters 50 and 50. The mesh material of the filters 50 and 50 allows the molten resin R to pass through both the runner portions 12 and 13, while removing conductive foreign substances contained in the molten resin R.

  Next, after the molten resin R that has passed through the filters 50 and 50 is filled into the spaces S3 and S4 in the runner portions 12 and 13, the spaces in the cavity portions 17 and 18 are further passed through the gate portions 15 and 16. Injected into S5 and S6.

  As shown in FIG. 10, the spaces in the pot part 10, the cull part 11, the runner parts 12 and 13, and the cavity parts 17 and 18 are filled with the dissolved resin R. At this time, the semiconductor chip 41 to which the lead frame 44 is attached is in a state surrounded by the molten resin R and is formed into a desired shape.

  When a predetermined time elapses, the dissolved resin R filled in the spaces S2, S3, S4, S5, and S6 is polymerized and cured.

  As shown in FIG. 11, the upper die 2 is raised upward, and the extruded portion 9 of the lower die 3 is protruded upward, and the semiconductor device 40 integrated with the molded resin R is taken out.

  Thereafter, unnecessary resin cured at the runner portions 12 and 13 and the cull portion 11 is removed, and then cured to stabilize the resin.

  According to the resin sealing method of this embodiment, the mesh members 51 that are the filters 50 and 50 are provided on the runner portions 12 and 13, respectively. At this time, since only the melted resin from which the foreign matters have been removed is injected into the cavity portions 17 and 18, the occurrence of a short circuit due to the foreign matters is suppressed, and the yield of the semiconductor device 40 can be improved.

  In addition, in the resin sealing apparatus of this embodiment, although the filter was formed in the cull part and the runner part, you may make it provide in a pot part.

  The resin sealing device of the present embodiment has a structure in which a plunger is provided in a lower mold, but can also be applied to a resin sealing device having a structure in which a plunger is provided in an upper mold.

  Although one embodiment according to the present invention has been specifically described, the present invention is not limited to the above-described embodiment, and various modifications based on the technical idea of the present invention are possible.

It is sectional drawing which shows the resin sealing apparatus which concerns on this embodiment. It is a perspective view which shows the filter with which the resin sealing apparatus which concerns on this embodiment is equipped. It is a manufacturing process figure which shows the resin sealing method which concerns on this embodiment. It is a manufacturing process figure which shows the resin sealing method which concerns on this embodiment. It is a manufacturing process figure which shows the resin sealing method which concerns on this embodiment. It is a manufacturing process figure which shows the resin sealing method which concerns on this embodiment. It is a manufacturing process figure which shows the state of resin which flows through a resin flow path. It is sectional drawing which shows the resin sealing apparatus which concerns on this embodiment. It is a front view which shows the filter of the resin sealing apparatus which concerns on this embodiment. It is a manufacturing process figure which shows the resin sealing method which concerns on this embodiment. It is a manufacturing process figure which shows the resin sealing method which concerns on this embodiment. It is sectional drawing which shows the conventional resin sealing metal mold | die. It is a perspective view which shows the state which connected the conventional bonding wire.

Explanation of symbols

71 Resin sealing device 2 Upper mold 3 Lower mold 4 Mold body 10 Pot part 11 Cull part 12, 13 Runner part 14 Resin flow path 15, 16 Gate part 17, 18 Cavity part 19 Plunger 20, 50 Filter 21 Upper part 22 Lower part 23 Peripheral part 24 Gutter part 40 Semiconductor device 41 Semiconductor chip 43 Bonding wire 44 Lead frame

Claims (5)

A cavity portion formed between an upper mold and a lower mold, which are paired up and down, for sealing a semiconductor chip with a resin;
A pot portion that is formed in any one of the upper mold and the lower mold, and supplies a dissolved resin;
A resin flow path formed between the upper mold and the lower mold and communicating the cavity portion and the pot portion;
A filter that is provided in the middle of the resin flow path and removes foreign substances contained in the dissolved resin that passes through the resin flow path,
A resin sealing device in which the filter is made of a mesh material. The resin flow path includes a cull part communicating with the pot part, and a runner part communicating with the cull part and supplying resin supplied from the pot part to the cavity part,
2. The resin sealing device according to claim 1, wherein the filter is formed in a hat shape and is disposed in the cull portion so as to cover a resin supply port of the pot portion. The resin flow path includes a cull part communicating with the pot part, and a runner part communicating with the cull part and supplying resin supplied from the pot part to the cavity part,
The resin sealing device according to claim 1, wherein the filter is disposed in the runner portion so as to be orthogonal to a flow direction of the dissolved resin.   The resin sealing device according to claim 1, wherein the mesh material is formed of carbon fiber. A resin loading step of loading a resin into a space of a pot portion formed in a mold body including an upper mold and a lower mold that are paired vertically;
A semiconductor chip mounting step of mounting a semiconductor chip in the cavity formed in the mold body;
The molten resin is supplied from the pot portion to the resin flow path formed in the mold body, and the foreign matter contained in the molten resin is removed by a filter formed of a mesh material provided in the middle of the resin flow path. And a resin injection step of injecting the dissolved resin into the cavity.

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