JP2010142777A - 混合ガスの供給方法及び混合ガスの供給装置 - Google Patents
混合ガスの供給方法及び混合ガスの供給装置 Download PDFInfo
- Publication number
- JP2010142777A JP2010142777A JP2008325417A JP2008325417A JP2010142777A JP 2010142777 A JP2010142777 A JP 2010142777A JP 2008325417 A JP2008325417 A JP 2008325417A JP 2008325417 A JP2008325417 A JP 2008325417A JP 2010142777 A JP2010142777 A JP 2010142777A
- Authority
- JP
- Japan
- Prior art keywords
- gas
- mixed gas
- gas supply
- supply line
- mixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 24
- 239000007789 gas Substances 0.000 claims abstract description 316
- 239000002245 particle Substances 0.000 claims description 5
- 238000012545 processing Methods 0.000 description 22
- 230000006641 stabilisation Effects 0.000 description 8
- 238000011105 stabilization Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000003111 delayed effect Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D11/00—Control of flow ratio
- G05D11/02—Controlling ratio of two or more flows of fluid or fluent material
- G05D11/13—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
- G05D11/131—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components
- G05D11/132—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by measuring the values related to the quantity of the individual components by controlling the flow of the individual components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
- B01F35/71—Feed mechanisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
- B01F23/00—Mixing according to the phases to be mixed, e.g. dispersing or emulsifying
- B01F23/10—Mixing gases with gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17D—PIPE-LINE SYSTEMS; PIPE-LINES
- F17D1/00—Pipe-line systems
- F17D1/02—Pipe-line systems for gases or vapours
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D7/00—Control of flow
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/0318—Processes
- Y10T137/0324—With control of flow by a condition or characteristic of a fluid
- Y10T137/0363—For producing proportionate flow
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/794—With means for separating solid material from the fluid
- Y10T137/8122—Planar strainer normal to flow path
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T137/00—Fluid handling
- Y10T137/8593—Systems
- Y10T137/87571—Multiple inlet with single outlet
- Y10T137/87676—With flow control
- Y10T137/87684—Valve in each inlet
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Metallurgy (AREA)
- General Chemical & Material Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Feeding, Discharge, Calcimining, Fusing, And Gas-Generation Devices (AREA)
- Chemical Vapour Deposition (AREA)
- Pipeline Systems (AREA)
Abstract
【解決手段】共通配管10に接続された複数の個別ガス供給ライン1A〜1Pを通して複数種のガスを供給し、当該複数種のガスの混合ガスを、前記共通配管10のガスアウト部11を通じて混合ガス供給ラインにより処理チャンバー30に供給する混合ガスの供給方法であって、流量の異なる2種類以上のガスを同時に供給する際に、流量の少ないガスを、流量の多いガスよりガスアウト部11に近い位置に設けた個別ガス供給ライン1A〜1Pから供給する。
【選択図】図1
Description
Claims (8)
- 共通配管に接続された複数の個別ガス供給ラインを通して複数種のガスを供給し、当該複数種のガスの混合ガスを、前記共通配管のガスアウト部を通じて混合ガス供給ラインによりガス使用対象に供給する混合ガスの供給方法であって、
流量の異なる2種類以上のガスを同時に供給する際に、流量の少ないガスを、流量の多いガスより前記ガスアウト部に近い位置に設けた前記個別ガス供給ラインから供給する
ことを特徴とする混合ガスの供給方法。 - 請求項1記載の混合ガスの供給方法であって、
前記複数種のガスのうち、最少流量のガスを、前記ガスアウト部に最も近い位置に設けた前記個別ガス供給ラインから供給し、かつ、前記複数種のガスのうち、最大流量のガスを、前記ガスアウト部から最も遠い位置に設けた前記個別ガス供給ラインから供給する
ことを特徴とする混合ガスの供給方法。 - 請求項1又は2記載の混合ガスの供給方法であって、
前記共通配管の内径を、前記混合ガス供給ラインの内径より小さくし、前記混合ガス供給ラインより内径の小さな前記共通配管から、より内径の大きな前記混合ガス供給ラインに混合ガスを流すことを特徴とする混合ガスの供給方法。 - 請求項1乃至3いずれか1項記載の混合ガスの供給方法であって、
前記混合ガス供給ラインに、フィルタを設け、混合ガス中のパーティクルを除去することを特徴とする混合ガスの供給方法。 - 共通配管に接続された複数の個別ガス供給ラインを通して複数種のガスを供給し、当該複数種のガスの混合ガスを、前記共通配管のガスアウト部を通じて混合ガス供給ラインによりガス使用対象に供給する混合ガスの供給装置であって、
流量の異なる2種類以上のガスを同時に供給する際に、流量の少ないガスを、流量の多いガスより前記ガスアウト部に近い位置に設けた前記個別ガス供給ラインから供給するよう構成された
ことを特徴とする混合ガスの供給装置。 - 請求項5記載の混合ガスの供給装置であって、
前記複数種のガスのうち、最少流量のガスを、前記ガスアウト部に最も近い位置に設けた前記個別ガス供給ラインから供給し、かつ、前記複数種のガスのうち、最大流量のガスを、前記ガスアウト部から最も遠い位置に設けた前記個別ガス供給ラインから供給するよう構成された
ことを特徴とする混合ガスの供給装置。 - 請求項5又は6記載の混合ガスの供給装置であって、
前記共通配管の内径を、前記混合ガス供給ラインの内径より小さくしたことを特徴とする混合ガスの供給装置。 - 請求項5乃至7いずれか1項記載の混合ガスの供給装置であって、
前記混合ガス供給ラインに、混合ガス中のパーティクルを除去するためのフィルタを設けたことを特徴とする混合ガスの供給装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008325417A JP5457021B2 (ja) | 2008-12-22 | 2008-12-22 | 混合ガスの供給方法及び混合ガスの供給装置 |
KR1020090128448A KR101669277B1 (ko) | 2008-12-22 | 2009-12-21 | 혼합 가스 공급 방법 |
TW098144120A TWI492295B (zh) | 2008-12-22 | 2009-12-21 | A supply method of a mixed gas, and a supply means for a mixed gas |
CN200910261101.3A CN101761779B (zh) | 2008-12-22 | 2009-12-22 | 混合气体的供给方法和混合气体的供给装置 |
US12/644,745 US8770214B2 (en) | 2008-12-22 | 2009-12-22 | Gas mixture supplying method and apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008325417A JP5457021B2 (ja) | 2008-12-22 | 2008-12-22 | 混合ガスの供給方法及び混合ガスの供給装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010142777A true JP2010142777A (ja) | 2010-07-01 |
JP5457021B2 JP5457021B2 (ja) | 2014-04-02 |
Family
ID=42264321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008325417A Active JP5457021B2 (ja) | 2008-12-22 | 2008-12-22 | 混合ガスの供給方法及び混合ガスの供給装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8770214B2 (ja) |
JP (1) | JP5457021B2 (ja) |
KR (1) | KR101669277B1 (ja) |
CN (1) | CN101761779B (ja) |
TW (1) | TWI492295B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI629429B (zh) * | 2013-09-12 | 2018-07-11 | 蘭姆研究公司 | 群集質量流裝置及將其併入之複式線路質量流裝置 |
CN115155417A (zh) * | 2022-07-01 | 2022-10-11 | 北京北方华创微电子装备有限公司 | 半导体工艺设备的气体混合装置及半导体工艺设备 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5274557B2 (ja) * | 2008-07-04 | 2013-08-28 | シャープ株式会社 | 真空処理装置及びガス供給方法 |
EP2458377B1 (en) | 2010-11-29 | 2019-07-31 | Air Products And Chemicals, Inc. | Method of, and apparatus for, measuring the molecular weight of a gas |
EP2458348B1 (en) | 2010-11-29 | 2013-08-14 | Air Products And Chemicals, Inc. | Method of, and apparatus for, measuring the mass flow rate of a gas |
US8931512B2 (en) * | 2011-03-07 | 2015-01-13 | Applied Materials, Inc. | Gas delivery system and method of use thereof |
WO2013002885A1 (en) * | 2011-06-30 | 2013-01-03 | Applied Materials, Inc. | Method and apparatus for fast gas exchange, fast gas switching and programmable gas delivery |
JP5803552B2 (ja) * | 2011-10-14 | 2015-11-04 | 東京エレクトロン株式会社 | 処理装置 |
US20130152857A1 (en) * | 2011-12-15 | 2013-06-20 | Intermolecular, Inc. | Substrate Processing Fluid Delivery System and Method |
PL2667159T3 (pl) | 2012-05-24 | 2022-05-02 | Air Products And Chemicals, Inc. | Sposób oraz urządzenie dla mierzenia masowego natężenia przepływu gazu |
EP2667160B1 (en) | 2012-05-24 | 2020-11-18 | Air Products And Chemicals, Inc. | Method of, and Apparatus for, Regulating the Mass Flow Rate of a Gas |
PL2667162T3 (pl) | 2012-05-24 | 2016-03-31 | Air Prod & Chem | Sposób oraz urządzenie do mierzenia właściwości fizycznych płynów dwufazowych |
EP2667276B1 (en) * | 2012-05-24 | 2017-11-08 | Air Products And Chemicals, Inc. | Method of, and apparatus for, providing a gas mixture |
PL2667277T3 (pl) | 2012-05-24 | 2018-05-30 | Air Products And Chemicals, Inc. | Sposób i urządzenia do dostarczania mieszaniny gazu |
PL2667176T3 (pl) | 2012-05-24 | 2015-07-31 | Air Prod & Chem | Urządzenie do mierzenia rzeczywistej zawartości butli z gazem pod ciśnieniem |
JP5616416B2 (ja) * | 2012-11-02 | 2014-10-29 | 株式会社フジキン | 集積型ガス供給装置 |
CN106935494B (zh) * | 2015-12-31 | 2019-08-20 | 中微半导体设备(上海)股份有限公司 | 一种博世工艺刻蚀硅基片的方法 |
AT521586B1 (de) * | 2018-08-28 | 2020-12-15 | Avl List Gmbh | Gasmischvorrichtung zur Linearisierung oder Kalibrierung von Gasanalysatoren |
WO2021098982A1 (en) * | 2019-11-19 | 2021-05-27 | Linde Gmbh | Smart gas mixer |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09283504A (ja) * | 1996-02-15 | 1997-10-31 | Fujikin:Kk | 混合ガスの供給方法及び混合ガス供給装置並びにこれらを備えた半導体製造装置 |
JP2001040481A (ja) * | 1999-07-27 | 2001-02-13 | Tokyo Electron Ltd | ガス処理装置 |
JP2004363522A (ja) * | 2003-06-09 | 2004-12-24 | Renesas Technology Corp | 半導体製造装置および半導体装置の製造方法 |
JP2007200918A (ja) * | 2006-01-23 | 2007-08-09 | Sharp Corp | プラズマ処理装置および同装置により製造された半導体素子 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4033287A (en) * | 1976-01-22 | 1977-07-05 | Bell Telephone Laboratories, Incorporated | Radial flow reactor including glow discharge limiting shield |
JPH0711706B2 (ja) * | 1984-07-14 | 1995-02-08 | ミノルタ株式会社 | 電子写真感光体 |
US4846199A (en) * | 1986-03-17 | 1989-07-11 | The Regents Of The University Of California | Smoking of regenerated tobacco smoke |
US5531183A (en) * | 1994-07-13 | 1996-07-02 | Applied Materials, Inc. | Vaporization sequence for multiple liquid precursors used in semiconductor thin film applications |
JPH08172084A (ja) | 1994-12-19 | 1996-07-02 | Kokusai Electric Co Ltd | 半導体成膜方法及びその装置 |
JP3341619B2 (ja) * | 1997-03-04 | 2002-11-05 | 東京エレクトロン株式会社 | 成膜装置 |
DE19808819A1 (de) * | 1998-03-03 | 1999-09-09 | Utec Luftreinigung & Waermerue | Verbrennungsofen für Abgase |
US6418954B1 (en) * | 2001-04-17 | 2002-07-16 | Mks Instruments, Inc. | System and method for dividing flow |
US7204886B2 (en) * | 2002-11-14 | 2007-04-17 | Applied Materials, Inc. | Apparatus and method for hybrid chemical processing |
JP4365785B2 (ja) * | 2002-07-10 | 2009-11-18 | 東京エレクトロン株式会社 | 成膜装置 |
WO2005064234A1 (en) * | 2003-12-29 | 2005-07-14 | Lg Electronics Inc. | Apparatus for supply mixed gas for gas burners of radiant heating type |
US7198063B2 (en) * | 2004-06-14 | 2007-04-03 | Surpass Industry Co., Ltd. | Multi-path joint and manufacturing method thereof |
US7174263B2 (en) * | 2005-03-25 | 2007-02-06 | Mks Instruments, Inc. | External volume insensitive flow verification |
US20060243207A1 (en) * | 2005-04-20 | 2006-11-02 | Jursich Gregory M | Fluid mixing and delivery system |
GB0512998D0 (en) * | 2005-06-27 | 2005-08-03 | Inbulk Technologies Ltd | Pneumatic conveying velocity control device |
JP4877747B2 (ja) * | 2006-03-23 | 2012-02-15 | 東京エレクトロン株式会社 | プラズマエッチング方法 |
US7794617B2 (en) * | 2006-03-23 | 2010-09-14 | Tokyo Electron Limited | Plasma etching method, plasma processing apparatus, control program and computer readable storage medium |
US20090033140A1 (en) * | 2007-07-31 | 2009-02-05 | Pile James D | Use Of Foam To Increase Resistance To Gas Flow In Mine Applications And Apparatus For Delivering Same |
CN111919327B (zh) * | 2018-03-27 | 2023-10-17 | 日本碍子株式会社 | 锂二次电池 |
-
2008
- 2008-12-22 JP JP2008325417A patent/JP5457021B2/ja active Active
-
2009
- 2009-12-21 KR KR1020090128448A patent/KR101669277B1/ko active IP Right Grant
- 2009-12-21 TW TW098144120A patent/TWI492295B/zh active
- 2009-12-22 US US12/644,745 patent/US8770214B2/en active Active
- 2009-12-22 CN CN200910261101.3A patent/CN101761779B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09283504A (ja) * | 1996-02-15 | 1997-10-31 | Fujikin:Kk | 混合ガスの供給方法及び混合ガス供給装置並びにこれらを備えた半導体製造装置 |
JP2001040481A (ja) * | 1999-07-27 | 2001-02-13 | Tokyo Electron Ltd | ガス処理装置 |
JP2004363522A (ja) * | 2003-06-09 | 2004-12-24 | Renesas Technology Corp | 半導体製造装置および半導体装置の製造方法 |
JP2007200918A (ja) * | 2006-01-23 | 2007-08-09 | Sharp Corp | プラズマ処理装置および同装置により製造された半導体素子 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI629429B (zh) * | 2013-09-12 | 2018-07-11 | 蘭姆研究公司 | 群集質量流裝置及將其併入之複式線路質量流裝置 |
CN115155417A (zh) * | 2022-07-01 | 2022-10-11 | 北京北方华创微电子装备有限公司 | 半导体工艺设备的气体混合装置及半导体工艺设备 |
CN115155417B (zh) * | 2022-07-01 | 2023-08-18 | 北京北方华创微电子装备有限公司 | 半导体工艺设备的气体混合装置及半导体工艺设备 |
Also Published As
Publication number | Publication date |
---|---|
JP5457021B2 (ja) | 2014-04-02 |
CN101761779B (zh) | 2015-08-12 |
TW201030840A (en) | 2010-08-16 |
US8770214B2 (en) | 2014-07-08 |
TWI492295B (zh) | 2015-07-11 |
US20100154908A1 (en) | 2010-06-24 |
CN101761779A (zh) | 2010-06-30 |
KR101669277B1 (ko) | 2016-10-25 |
KR20100074040A (ko) | 2010-07-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5457021B2 (ja) | 混合ガスの供給方法及び混合ガスの供給装置 | |
KR102323167B1 (ko) | 프로세싱 챔버 내에서의 퍼징 및 플라스마 억제를 위한 방법 및 장치 | |
JP2022130614A (ja) | 基板処理システム及び基板処理システムを動作させるための方法 | |
US9219006B2 (en) | Flowable carbon film by FCVD hardware using remote plasma PECVD | |
TW200802554A (en) | A method of manufacturing a semiconductor device and device of processing substrate | |
WO2007016592A3 (en) | Gas manifold valve cluster | |
EP1944796A3 (en) | Oxide etch with NH3-NF3 chemistry | |
WO2010022215A3 (en) | Process gas delivery for semiconductor process chamber | |
WO2007102925A3 (en) | Methods and arrangement for a highly efficient gas distribution arrangement | |
WO2007087067A3 (en) | Remote plasma pre-clean with low hydrogen pressure | |
SG11202108187YA (en) | A device and a membrane process for separating gas components from a gas stream having varying composition or flow rate | |
ATE383543T1 (de) | Verstärkter spüleffekt in gasleitungen | |
JP2016192483A5 (ja) | ||
US10607819B2 (en) | Cleaning method and processing apparatus | |
WO2009041499A1 (ja) | プラズマ処理装置及びそのガス排気方法 | |
JP2022500561A (ja) | ガス吸気システム、原子層堆積装置および方法 | |
JP2017036493A5 (ja) | ||
EP3827110A4 (en) | AXISYMMETRICAL MATERIAL DEPOSITION FROM ORIENTED GAS FLOW-ASSISTED PLASMA | |
WO2010007356A3 (en) | Ald gas delivery device | |
AU2017260663A1 (en) | Cyclone and dip tube for separating a gas | |
EP2055397A3 (en) | In-situ chamber cleaning method | |
JP2007142018A (ja) | 成膜装置のクリーニング方法及び半導体装置の製造方法 | |
KR102219697B1 (ko) | 증착-후 가스 라인들 내측의 잔류 전구체를 제거하기 위한 장치 및 방법들 | |
WO2012114611A1 (ja) | クリーニングガス及びそれを用いたリモートプラズマクリーニング方法 | |
CN107251194B (zh) | 外延硅晶片的制造方法及气相沉积装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20111121 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20121210 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130122 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130314 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20131224 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140109 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5457021 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |