JP2010141643A - Stacked electronic component - Google Patents

Stacked electronic component Download PDF

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JP2010141643A
JP2010141643A JP2008316569A JP2008316569A JP2010141643A JP 2010141643 A JP2010141643 A JP 2010141643A JP 2008316569 A JP2008316569 A JP 2008316569A JP 2008316569 A JP2008316569 A JP 2008316569A JP 2010141643 A JP2010141643 A JP 2010141643A
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coil
electrode
conductor pattern
insulator layer
coil conductor
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Masahide Takashima
政秀 高嶋
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Toko Inc
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Toko Inc
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Abstract

<P>PROBLEM TO BE SOLVED: To control a magnetic coupling coefficient between coils coupled magnetically negatively with each other to an appropriate magnitude, and to rdownsize a shape. <P>SOLUTION: In the stacked electronic component, a first coil part, a second coil part and a slit S are formed. Inside the first coil part, insulator layers 11A-11N and coil conductor patterns 12A-12D, 13A-13D are stacked and a coil is formed from the coil conductor patterns. Inside the second coil part, insulator layers and coil conductor patterns are stacked and a coil is formed from the coil conductor patterns. Inside the slit S, a laminate is formed by stacking electrodes each including a magnetic coupling window H disposed between the first coil part and the second coil part and an electrode disposed between the first coil part and the second coil part is continued to the magnetic coupling window H. The coil in the first coil part and the coil in the second coil part are coupled magnetically negatively. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、絶縁体層とコイル用導体パターンを積層し、コイル用導体パターンによって内部にコイルが形成された複数のコイル部と、複数のコイル部間に配置された磁気結合用窓を有する電極を積み重ねて積層体が形成され、複数のコイル部のコイルを磁気的に結合させた積層型電子部品に関するものである。   The present invention provides an electrode having a plurality of coil portions in which an insulator layer and a coil conductor pattern are laminated, and a coil is formed inside by the coil conductor pattern, and a magnetic coupling window disposed between the plurality of coil portions. Are stacked, and a laminated body is formed, and a multilayer electronic component in which coils of a plurality of coil portions are magnetically coupled.

従来の積層型電子部品に、絶縁体層と導体パターンを積層して積層体内に、互いに磁気的に負に結合する複数のコイルを備えたＬＣフィルタが形成されたものがある（例えば、特許文献１を参照。）。
近年、通信分野で使用されるこの種の積層型電子部品は、小型化、低背化が望まれている。小型化、低背化するために、図７に示す様に、絶縁体層７１とコイル用導体パターン７２、７３を積層して内部に複数のコイルが形成されたコイル部と、絶縁体層７１とコンデンサ用導体パターン７４を積層して内部に複数のコンデンサが形成されたコンデンサ部が積み重ねられて、積層体内にＬＣフィルタを形成したり、図８に示す様に、絶縁体層８１とコイル用導体パターン８２を積層してコイルが形成されたコイル部と、絶縁体層８１とコイル用導体パターン８３を積層してコイルが形成されたコイル部との間に、絶縁体層８１とコンデンサ用導体８４を積層して内部に複数のコンデンサが形成されたコンデンサ部が積み重ねられて、積層体内にＬＣフィルタを形成したりすることが行われている。
しかしながら、図７の様な従来の積層型電子部品は、２つのコイルが近接しているために、２つのコイル間の磁気的な結合係数が負の方向に大きくなりすぎ、ノイズを減衰するために設けられる２つの減衰極の周波数が大きく離れ、ノイズを充分に減衰できないという問題があった。また、図８の様な従来の積層型電子部品は、コイルとコイルの間にコンデンサ用導体パターンが配置されているため、コイル中心部の磁束がコンデンサ用導体パターンによって遮られ、２つのコイル間の結合係数を大きくすることができなかった。
これらの問題を解決するために、図９に示す様に、絶縁体層９１とコイル用導体パターン９２を積層してコイルが形成されたコイル部と、絶縁体層９１とコイル用導体パターン９３を積層してコイルが形成されたコイル部との間に、絶縁体層９１と結合窓Ｈを設けたコンデンサ用導体９４を積層して内部に複数のコンデンサが形成されたコンデンサ部が積み重ねられ、積層体内にＬＣフィルタを形成することが検討された。 2. Description of the Related Art Conventional multilayer electronic components include an LC filter having a plurality of coils that are magnetically negatively coupled to each other in a multilayer body by laminating an insulator layer and a conductor pattern (for example, Patent Documents). 1).
In recent years, this type of multilayer electronic component used in the communication field is desired to be reduced in size and height. In order to reduce the size and height, as shown in FIG. 7, a coil portion in which an insulating layer 71 and coil conductor patterns 72 and 73 are laminated to form a plurality of coils, and the insulating layer 71 And capacitor conductor patterns 74 are stacked and the capacitor portions in which a plurality of capacitors are formed are stacked to form an LC filter in the stacked body, or as shown in FIG. Between the coil portion in which the coil is formed by laminating the conductor pattern 82, and the coil portion in which the coil is formed by laminating the insulator layer 81 and the coil conductor pattern 83, the conductor for capacitor A capacitor portion in which a plurality of capacitors are formed inside by stacking 84 is stacked to form an LC filter in the stacked body.
However, in the conventional multilayer electronic component as shown in FIG. 7, since the two coils are close to each other, the magnetic coupling coefficient between the two coils becomes too large in the negative direction to attenuate noise. There is a problem in that the frequencies of the two attenuation poles provided in the circuit are greatly separated and the noise cannot be sufficiently attenuated. Further, in the conventional multilayer electronic component as shown in FIG. 8, since the conductor pattern for the capacitor is arranged between the coils, the magnetic flux at the center of the coil is blocked by the conductor pattern for the capacitor. The coupling coefficient of could not be increased.
In order to solve these problems, as shown in FIG. 9, a coil portion in which an insulator layer 91 and a coil conductor pattern 92 are laminated to form a coil, and an insulator layer 91 and a coil conductor pattern 93 are provided. A capacitor portion 94 in which a plurality of capacitors are formed by stacking a capacitor conductor 94 provided with an insulating layer 91 and a coupling window H is stacked between the coil portions formed by laminating the coils. It was considered to form an LC filter in the body.

特開2003-87074号公報JP 2003-87074 A

しかしながら、この様な従来の積層型電子部品は、２つのコイル間の結合係数が図７に示す従来の積層型電子部品のものとほぼ同じとなり、２つのコイル間の結合係数を大きくすることができず、ノイズを充分に減衰することができなかった。   However, in such a conventional multilayer electronic component, the coupling coefficient between the two coils is almost the same as that of the conventional multilayer electronic component shown in FIG. 7, and the coupling coefficient between the two coils can be increased. It was not possible to attenuate the noise sufficiently.

本発明は、互いに磁気的に負に結合するコイル間の磁気的な結合係数を適切な大きさにすることができると共に、形状を小型化することができる積層型電子部品を提供することを目的とする。   SUMMARY OF THE INVENTION An object of the present invention is to provide a multilayer electronic component in which the magnetic coupling coefficient between coils that are magnetically negatively coupled to each other can be appropriately set and the shape can be reduced. And

本発明は、絶縁体層とコイル用導体パターンを積層し、コイル用導体パターンによって内部にコイルが形成された第１のコイル部、絶縁体層とコイル用導体パターンを積層し、コイル用導体パターンによって内部にコイルが形成された第２のコイル部及び、第１のコイル部と第２のコイル部間に配置された磁気結合用窓を有する電極を積み重ねて積層体が形成され、第１のコイル部のコイルと第２のコイル部のコイルを磁気的に結合させた積層型電子部品において、第１のコイル部と第２のコイル部間に配置された電極は磁気的結合用窓に連なるスリットが形成され、第１のコイル部のコイルと第２のコイル部のコイルを磁気的に負に結合させる。また、電極を絶縁体層を介して複数積層し、複数の電極によってコンデンサが形成される。   The present invention includes a first coil portion in which an insulator layer and a coil conductor pattern are laminated, a coil formed inside the coil conductor pattern, a laminate of the insulator layer and the coil conductor pattern, and a coil conductor pattern A stack is formed by stacking a second coil part having a coil formed therein and an electrode having a magnetic coupling window disposed between the first coil part and the second coil part, In the laminated electronic component in which the coil of the coil unit and the coil of the second coil unit are magnetically coupled, the electrode disposed between the first coil unit and the second coil unit is connected to the magnetic coupling window. A slit is formed to magnetically couple the coil of the first coil part and the coil of the second coil part negatively. In addition, a plurality of electrodes are stacked via an insulator layer, and a capacitor is formed by the plurality of electrodes.

本発明の積層型電子部品は、第１のコイル部と第２のコイル部間に配置された電極は磁気的結合用窓に連なるスリットが形成され、第１のコイル部のコイルと第２のコイル部のコイルを磁気的に負に結合させるので、互いに磁気的に負に結合するコイル間の磁気的な結合係数を適切な大きさにすることができると共に、形状を小型化することができる。   In the multilayer electronic component of the present invention, the electrode disposed between the first coil portion and the second coil portion is formed with a slit connected to the magnetic coupling window, and the coil of the first coil portion and the second coil portion are arranged. Since the coils of the coil section are magnetically negatively coupled, the magnetic coupling coefficient between the coils that are magnetically negatively coupled to each other can be appropriately sized, and the shape can be reduced in size. .

本発明の積層型電子部品は、絶縁体層とコイル用導体パターンを積層し、コイル用導体パターンによって内部にコイルが形成された第１のコイル部、絶縁体層とコイル用導体パターンを積層し、コイル用導体パターンによって内部にコイルが形成された第２のコイル部及び、第１のコイル部と第２のコイル部間に配置された磁気結合用窓を有する電極を積み重ねて積層体が形成される。この第１のコイル部と第２のコイル部間に配置された電極は、磁気的結合用の窓が形成されると共に、この磁気的結合用窓に連なるスリットが形成される。そして、第１のコイル部のコイルと第２のコイル部のコイルを磁気的に負に結合させる。
従って、本発明の積層型電子部品は、磁気的結合用窓に連なるスリットによって、コイルの中心部における磁束の遮られる面積を小さくすることができる。 The multilayer electronic component according to the present invention includes an insulator layer and a coil conductor pattern, and a first coil portion having a coil formed therein by the coil conductor pattern, the insulator layer and the coil conductor pattern. A laminate is formed by stacking a second coil part having a coil formed therein by a coil conductor pattern and an electrode having a magnetic coupling window disposed between the first coil part and the second coil part. Is done. The electrode disposed between the first coil portion and the second coil portion is formed with a magnetic coupling window and a slit connected to the magnetic coupling window. Then, the coil of the first coil part and the coil of the second coil part are magnetically coupled negatively.
Therefore, in the multilayer electronic component of the present invention, the area where the magnetic flux is blocked in the central portion of the coil can be reduced by the slit connected to the magnetic coupling window.

以下、本発明の積層型電子部品の実施例を図１乃至図６を参照して説明する。
図１は本発明の積層型電子部品の第１の実施例を示す分解斜視図、図２は本発明の積層型電子部品の実施例の斜視図である。
図１において、１１Ａ〜１１Ｎは絶縁体層、１２Ａ〜１２Ｄ、１３Ａ〜１３Ｄはコイル用導体パターン、１４Ａ〜１４Ｇは電極である。
絶縁体層１１Ａ〜１１Ｎは、磁性体、非磁性体、誘電体等絶縁性を有する材料を用いて形成される。
絶縁体層１１Ａの表面には、コイル用導体パターン１２Ａが形成される。このコイル用導体パターン１２Ａは１ターン未満分が形成される。コイル用導体パターン１２Ａの一端は絶縁体層１１Ａの側面まで引き出される。
絶縁体層１１Ｂの表面には、コイル用導体パターン１２Ｂが形成される。このコイル用導体パターン１２Ｂは１ターン未満分が形成される。コイル用導体パターン１２Ｂの一端は絶縁体層１１Ｂのスルーホール内の導体を介してコイル用導体パターン１２Ａの他端に接続される。
絶縁体層１１Ｃの表面には、コイル用導体パターン１２Ｃが形成される。このコイル用導体パターン１２Ｃは、１ターン未満分が形成され、一端が絶縁体層１１Ｃのスルーホール内の導体を介してコイル用導体パターン１２Ｂの他端に接続される。
絶縁体層１１Ｄの表面には、コイル用導体パターン１２Ｄが形成される。このコイル用導体パターン１２Ｄは、１ターン未満分が形成され、一端が絶縁体層１１Ｄのスルーホール内の導体を介してコイル用導体パターン１２Ｃの他端に接続され、他端が絶縁体層１１Ｄの側面まで引き出される。この様にコイル用導体パターン１２Ａ、コイル用導体パターン１２Ｂ、コイル用導体パターン１２Ｃ、コイル用導体パターン１２Ｄを螺旋状に接続することによりコイルが形成される。
絶縁体層１１Ｅの表面には、電極１４Ａと電極１４Ｂが形成される。電極１４Ａと電極１４Ｂは、互いに接触しない様に離間して形成され、それぞれ絶縁体層１１Ｅの側面まで引き出される。
絶縁体層１１Ｆの表面には、電極１４Ｃが形成される。電極１４Ｃは、コイルの中心部に対応する中央部分に磁気的結合用窓Ｈが設けられると共に、この磁気的結合用窓Ｈに連なり電極１４Ｃの一辺に達するスリットＳが設けられる。この電極１４Ｃは、絶縁体層１１Ｆの表面の電極１４Ａと電極１４Ｂに対向する位置に形成され、絶縁体層１１Ｆの側面まで引き出される。
絶縁体層１１Ｇの表面には、電極１４Ｄが形成される。電極１４Ｄは、コイルの中心部に対応する中央部分に磁気的結合用窓Ｈが設けられると共に、この磁気的結合用窓Ｈに連なり電極１４Ｄの一辺に達するスリットＳが設けられる。この電極１４Ｄは、絶縁体層１１Ｇの表面の電極１４Ｃに対向する位置に形成され、絶縁体層１１Ｇの側面まで引き出される。この時、電極１４Ｄの磁気的結合用窓Ｈは、電極１４Ｃの磁気的結合用窓Ｈの位置と一致する様に形成される。
絶縁体層１１Ｈの表面には、電極１４Ｅと電極１４Ｆが形成される。電極１４Ｅと電極１４Ｆは、互いに接触しない様に離間して絶縁体層１１Ｈの表面の電極１４Ｄと対向する位置に形成される。この電極１４Ｅと電極１４Ｆは、それぞれ絶縁体層１１Ｈの側面まで引き出される。
絶縁体層１１Ｉの表面には、電極１４Ｇが形成される。電極１４Ｇは、コイルの中心部に対応する中央部分に磁気的結合用窓Ｈが設けられると共に、この磁気的結合用窓Ｈに連なり電極１４Ｇの一辺に達するスリットＳが設けられる。この電極１４Ｇは、絶縁体層１１Ｉの表面の電極１４Ｅと電極１４Ｆに対向する位置に形成され、絶縁体層１１Ｉの側面まで引き出される。
絶縁体層１１Ｊの表面には、コイル用導体パターン１３Ａが形成される。このコイル用導体パターン１３Ａは１ターン未満分が形成される。コイル用導体パターン１３Ａの一端は絶縁体層１１Ｊの側面まで引き出される。
絶縁体層１１Ｋの表面には、コイル用導体パターン１３Ｂが形成される。このコイル用導体パターン１３Ｂは１ターン未満分が形成される。コイル用導体パターン１３Ｂの一端は絶縁体層１１Ｋのスルーホール内の導体を介してコイル用導体パターン１３Ａの他端に接続される。
絶縁体層１１Ｌの表面には、コイル用導体パターン１３Ｃが形成される。このコイル用導体パターン１３Ｃは、１ターン未満分が形成され、一端が絶縁体層１１Ｌのスルーホール内の導体を介してコイル用導体パターン１３Ｂの他端に接続される。
絶縁体層１１Ｍの表面には、コイル用導体パターン１３Ｄが形成される。このコイル用導体パターン１３Ｄは、１ターン未満分が形成され、一端が絶縁体層１１Ｍのスルーホール内の導体を介してコイル用導体パターン１３Ｃの他端に接続され、他端が絶縁体層１１Ｍの側面まで引き出される。この様にコイル用導体パターン１３Ａ、コイル用導体パターン１３Ｂ、コイル用導体パターン１３Ｃ、コイル用導体パターン１３Ｄを螺旋状に接続することによりコイルが形成される。
この絶縁体層１１Ｍの上には、絶縁体層１１Ｎが積層される。
この様に積層された積層体は、絶縁体層１１Ａ〜１１Ｄとこれらの絶縁体層に形成されたコイル用導体パターン１２Ａ〜１２Ｄによって第１のコイル部が、絶縁体層１１Ｊ〜１１Ｍとこれらの絶縁体層に形成されたコイル用導体パターン１３Ａ〜１３Ｄによって第２のコイル部が構成され、第１のコイル部と第２のコイル間に、磁気的結合用窓とスリットを有する電極が配置される。なお、図１では、この第１のコイル部と第２のコイル間に絶縁体層を介して積層された電極１４Ａ、１４Ｂ、１４Ｅ、１４Ｆ及び、磁気的結合用窓とスリットを有する電極１４Ｃ、１４Ｄ、１４Ｇとでコンデンサが形成される。第１のコイル部のコイルと第２のコイル部のコイルは、磁気的に負に結合する様に配置される。
この様な積層体には、図２に示す様に、積層体の側面に入力端子２１、出力端子２２、アース端子２３、２４が形成される。そして、コイル用導体パターン１３Ａ、電極１４Ａ、１４Ｅが入力端子２１に、コイル用導体パターン１２Ｄ、電極１４Ｂ、１４Ｆが出力端子に、コイル用導体パターン１２Ａ、１３Ｄ、電極１４Ｄ、１４Ｇがアース端子２３に、電極１４Ｃがアース端子２４に接続される。 Hereinafter, embodiments of the multilayer electronic component of the present invention will be described with reference to FIGS.
FIG. 1 is an exploded perspective view showing a first embodiment of the multilayer electronic component of the present invention, and FIG. 2 is a perspective view of the embodiment of the multilayer electronic component of the present invention.
In FIG. 1, 11A to 11N are insulator layers, 12A to 12D and 13A to 13D are conductor patterns for coils, and 14A to 14G are electrodes.
The insulator layers 11A to 11N are formed using an insulating material such as a magnetic material, a nonmagnetic material, and a dielectric material.
A coil conductor pattern 12A is formed on the surface of the insulator layer 11A. The coil conductor pattern 12A is formed for less than one turn. One end of the coil conductor pattern 12A is drawn to the side surface of the insulator layer 11A.
A coil conductor pattern 12B is formed on the surface of the insulator layer 11B. The coil conductor pattern 12B is formed for less than one turn. One end of the coil conductor pattern 12B is connected to the other end of the coil conductor pattern 12A via a conductor in the through hole of the insulator layer 11B.
A coil conductor pattern 12C is formed on the surface of the insulator layer 11C. The coil conductor pattern 12C is formed with less than one turn, and one end is connected to the other end of the coil conductor pattern 12B via a conductor in the through hole of the insulator layer 11C.
A coil conductor pattern 12D is formed on the surface of the insulator layer 11D. This coil conductor pattern 12D is formed with less than one turn, one end is connected to the other end of the coil conductor pattern 12C via a conductor in the through hole of the insulator layer 11D, and the other end is the insulator layer 11D. It is pulled out to the side. In this manner, the coil conductor pattern 12A, the coil conductor pattern 12B, the coil conductor pattern 12C, and the coil conductor pattern 12D are spirally connected to form a coil.
An electrode 14A and an electrode 14B are formed on the surface of the insulator layer 11E. The electrode 14A and the electrode 14B are formed apart from each other so as not to contact each other, and are each drawn out to the side surface of the insulator layer 11E.
An electrode 14C is formed on the surface of the insulator layer 11F. The electrode 14C is provided with a magnetic coupling window H at a central portion corresponding to the central portion of the coil, and a slit S that continues to the magnetic coupling window H and reaches one side of the electrode 14C. The electrode 14C is formed at a position facing the electrodes 14A and 14B on the surface of the insulator layer 11F, and is drawn to the side surface of the insulator layer 11F.
An electrode 14D is formed on the surface of the insulator layer 11G. The electrode 14D is provided with a magnetic coupling window H at a central portion corresponding to the central portion of the coil, and a slit S that is connected to the magnetic coupling window H and reaches one side of the electrode 14D. The electrode 14D is formed at a position facing the electrode 14C on the surface of the insulator layer 11G, and is drawn to the side surface of the insulator layer 11G. At this time, the magnetic coupling window H of the electrode 14D is formed to coincide with the position of the magnetic coupling window H of the electrode 14C.
Electrodes 14E and 14F are formed on the surface of the insulator layer 11H. The electrode 14E and the electrode 14F are formed at positions facing the electrode 14D on the surface of the insulator layer 11H so as not to contact each other. The electrode 14E and the electrode 14F are each drawn to the side surface of the insulator layer 11H.
An electrode 14G is formed on the surface of the insulator layer 11I. The electrode 14G is provided with a magnetic coupling window H at a central portion corresponding to the central portion of the coil, and a slit S that is connected to the magnetic coupling window H and reaches one side of the electrode 14G. The electrode 14G is formed on the surface of the insulator layer 11I at a position facing the electrodes 14E and 14F, and is drawn to the side surface of the insulator layer 11I.
A coil conductor pattern 13A is formed on the surface of the insulator layer 11J. The coil conductor pattern 13A is formed for less than one turn. One end of the coil conductor pattern 13A is drawn to the side surface of the insulator layer 11J.
A coil conductor pattern 13B is formed on the surface of the insulator layer 11K. The coil conductor pattern 13B is formed for less than one turn. One end of the coil conductor pattern 13B is connected to the other end of the coil conductor pattern 13A via a conductor in the through hole of the insulator layer 11K.
A coil conductor pattern 13C is formed on the surface of the insulating layer 11L. The coil conductor pattern 13C is formed with less than one turn, and one end is connected to the other end of the coil conductor pattern 13B through a conductor in the through hole of the insulator layer 11L.
A coil conductor pattern 13D is formed on the surface of the insulator layer 11M. The coil conductor pattern 13D is formed with less than one turn, one end is connected to the other end of the coil conductor pattern 13C via a conductor in the through hole of the insulator layer 11M, and the other end is insulated layer 11M. It is pulled out to the side. In this way, the coil conductor pattern 13A, the coil conductor pattern 13B, the coil conductor pattern 13C, and the coil conductor pattern 13D are spirally connected to form a coil.
An insulator layer 11N is laminated on the insulator layer 11M.
The laminated body laminated in this way is composed of the insulating layers 11A to 11D and the coil conductor patterns 12A to 12D formed on these insulating layers. A second coil portion is constituted by the coil conductor patterns 13A to 13D formed in the insulator layer, and an electrode having a magnetic coupling window and a slit is disposed between the first coil portion and the second coil. The In FIG. 1, the electrodes 14A, 14B, 14E, and 14F stacked between the first coil portion and the second coil via an insulator layer, and the electrode 14C having a magnetic coupling window and a slit, A capacitor is formed by 14D and 14G. The coil of the first coil portion and the coil of the second coil portion are arranged so as to be magnetically coupled negatively.
In such a laminate, as shown in FIG. 2, an input terminal 21, an output terminal 22, and ground terminals 23 and 24 are formed on the side surface of the laminate. The coil conductor pattern 13A and the electrodes 14A and 14E are the input terminal 21, the coil conductor pattern 12D and the electrodes 14B and 14F are the output terminal, and the coil conductor patterns 12A and 13D and the electrodes 14D and 14G are the ground terminal 23. The electrode 14C is connected to the ground terminal 24.

この様に形成された積層型電子部品は、コイル用導体パターン１３Ａ〜１３ＤによってコイルＬ１が、コイル用導体パターン１２Ａ〜１２ＤによってコイルＬ２が、電極１４Ｅと電極１４Ｇ間の容量と電極１４Ｅと電極１４Ｄ間の容量によってコンデンサＣ１が、電極１４Ｆと電極１４Ｇ間の容量と電極１４Ｆと電極１４Ｄ間の容量によってコンデンサＣ２が、電極１４Ａと電極１４Ｃ間の容量によってコンデンサＣ３が、電極１４Ｂと電極１４Ｃ間の容量によってコンデンサＣ４が、電極１４Ｃと電極１４Ｄ間の容量によってコンデンサＣ５がそれぞれ形成されることにより、積層体内に、図３に示す様な、入出力端子間にコイルＬ１とコイルＬ２が直列に接続され、コイルＬ１にコンデンサＣ１が並列に接続され、コイルＬ２にコンデンサＣ２が並列に接続され、コイルＬ１の入力側とアース間にコンデンサＣ３が、コイルＬ２の出力側とアース間にコンデンサＣ４が、コイルＬ１とコイルＬ２の接続点とアース間にコンデンサＣ５がそれぞれ接続されたローパスフィルタが形成される。このコイルＬ１とコイルＬ２は、互いに磁気的に負に結合する。   In the multilayer electronic component thus formed, the coil L1 is formed by the coil conductor patterns 13A to 13D, the coil L2 is formed by the coil conductor patterns 12A to 12D, the capacitance between the electrode 14E and the electrode 14G, the electrode 14E and the electrode 14D. Capacitor C1 is determined by the capacitance between the electrodes 14F and 14G, and capacitor C2 is determined by the capacitance between the electrodes 14F and 14D. Capacitor C3 is determined by the capacitance between the electrodes 14A and 14C, and between the electrodes 14B and 14C. A capacitor C4 is formed by the capacitance, and a capacitor C5 is formed by the capacitance between the electrodes 14C and 14D, so that the coil L1 and the coil L2 are connected in series between the input and output terminals as shown in FIG. The capacitor C1 is connected in parallel to the coil L1, and the capacitor is connected to the coil L2. C2 is connected in parallel, the capacitor C3 is connected between the input side of the coil L1 and the ground, the capacitor C4 is connected between the output side of the coil L2 and the ground, and the capacitor C5 is connected between the connection point of the coil L1 and the coil L2 and the ground. A low-pass filter is formed. The coil L1 and the coil L2 are magnetically coupled to each other negatively.

この様な積層型電子部品は、電極の磁気的結合用窓の大きさを１５０μｍ×１５０μｍ、スリットの幅を１００μｍ、コイル用導体パターン１２Ｄと電極１４Ａ、１４Ｂ間の距離を４６μｍ、コイル用導体パターン１３Ａと電極１４Ｇ間の距離を２３μｍとしたところ、コイルＬ１とコイルＬ２間の結合係数ｋは−０．０９５となり、その時のそれぞれのコイルのインダクタンス値とＱ値は図４（Ａ）に示す様になった。また、コイルＬ１とコイルＬ２間の結合係数ｋは、電極の磁気的結合用窓の大きさや、コイルの位置（コイル用導体パターンと電極間の距離）によって調整することができた。本発明の積層型電子部品は、比較１に示す図８の従来の積層型電子部品や比較２に示す図９の従来の積層型電子部品よりも、コイル間の結合係数を大きくできると共に、それぞれのコイルのインダクタンス値とＱ値も大きくすることができた。これは、積層型電子部品のコイルを図４（Ｂ）のコイルＬ、電極を図４（Ｂ）のコイルＬ’に当てはめて考えると、比較１、２の従来の積層型電子部品はコイルＬ’の端子Ｔ３と端子Ｔ４間が短絡された状態と考えることができ、Ｌのインダクタンス値はＬ（１−ｋ２）、ＬのＱ値はＱ（１−ｋ２）となり、コイルと電極が近づくほど結合係数ｋが大きくなってコイルＬのインダクタンス値やＱ値が小さくなるのに対し、本発明の積層型電子部品は電極に磁気的結合用窓に連なるスリットが設けられているので、コイルＬ’の端子Ｔ３と端子Ｔ４間が開放された状態と考えることができ、コイルＬのインダクタンス値とＱ値はコイルＬそのもののインダクタンス値とＱ値になり、従来のものよりもそれぞれのコイルのインダクタンス値とＱ値が大きくなったと推測される。 In such a laminated electronic component, the size of the electrode magnetic coupling window is 150 μm × 150 μm, the slit width is 100 μm, the distance between the coil conductor pattern 12D and the electrodes 14A and 14B is 46 μm, and the coil conductor pattern. When the distance between 13A and the electrode 14G is 23 μm, the coupling coefficient k between the coil L1 and the coil L2 is −0.095, and the inductance value and Q value of each coil at that time are as shown in FIG. Became. Further, the coupling coefficient k between the coils L1 and L2 could be adjusted by the size of the electrode magnetic coupling window and the position of the coil (distance between the coil conductor pattern and the electrode). The multilayer electronic component of the present invention can increase the coupling coefficient between the coils compared to the conventional multilayer electronic component of FIG. 8 shown in Comparative Example 1 and the conventional multilayer electronic component of FIG. The inductance value and the Q value of the coil were also increased. Considering that the coil of the multilayer electronic component is applied to the coil L of FIG. 4B and the electrode is applied to the coil L ′ of FIG. 4B, the conventional multilayer electronic component of comparisons 1 and 2 is the coil L. It can be considered that the terminal T3 and the terminal T4 are short-circuited, the inductance value of L is L (1-k 2 ), the Q value of L is Q (1-k 2 ), and the coil and electrode are The closer the distance is, the larger the coupling coefficient k becomes and the smaller the inductance value and Q value of the coil L. On the other hand, the laminated electronic component of the present invention is provided with a slit connected to the magnetic coupling window on the electrode. It can be considered that the terminal T3 and the terminal T4 of L ′ are open, and the inductance value and the Q value of the coil L become the inductance value and the Q value of the coil L itself, and each coil has an inductance value and a Q value. Inductance value and Q value are Presumed to have grown.

図５は本発明の積層型電子部品の第２の実施例を示す分解斜視図である。
絶縁体層５１Ａの表面には、コイル用導体パターン５２Ａが形成される。このコイル用導体パターン１２Ａは、１ターン未満分が形成され、一端が絶縁体層５１Ａの側面まで引き出される。
絶縁体層５１Ｂの表面には、コイル用導体パターン５２Ｂが形成される。このコイル用導体パターン５２Ｂは、１ターン未満分が形成され、一端がコイル用導体パターン５２Ａの他端に接続される。
絶縁体層５１Ｃの表面には、コイル用導体パターン５２Ｃが形成される。このコイル用導体パターン５２Ｃは、１ターン未満分が形成され、一端がコイル用導体パターン１２Ｂの他端に接続される。
絶縁体層５１Ｄの表面には、コイル用導体パターン５２Ｄが形成される。このコイル用導体パターン５２Ｄは、１ターン未満分が形成され、一端がコイル用導体パターン５２Ｃの他端に接続され、他端が絶縁体層５１Ｄの側面まで引き出される。この様にコイル用導体パターン５２Ａ、コイル用導体パターン５２Ｂ、コイル用導体パターン５２Ｃ、コイル用導体パターン５２Ｄを螺旋状に接続することによりコイルが形成される。
絶縁体層５１Ｅの表面には、電極５４Ａと電極５４Ｂが形成される。電極５４Ａと電極５４Ｂは、互いに接触しない様に離間して形成され、それぞれ絶縁体層５１Ｅの側面まで引き出される。また、電極５４Ａと電極５４Ｂは、後述の磁気的結合用窓とスリットを有する電極の磁気的結合用窓とスリットに対向する部分に位置しない様に、その形状や絶縁体層５１Ｅの表面における位置が決められる。
絶縁体層５１Ｆの表面には、電極５４Ｃが形成される。電極５４Ｃは、コイルの中心部に対応する中央部に磁気的結合用窓Ｈが設けられると共に、この磁気的結合用窓Ｈに連なり電極５４Ｃの長手方向の一辺に達するスリットＳが設けられる。この電極５４Ｃは、絶縁体層５１Ｆの表面の電極５４Ａ、５４Ｂに対向する位置に形成され、絶縁体層５１Ｆの側面まで引き出される。
絶縁体層５１Ｇの表面には、電極５４Ｄが形成される。電極５４Ｄは、コイルの中心部に対応する中央部に磁気的結合用窓Ｈが設けられると共に、磁気的結合用窓Ｈに連なり電極５４Ｄの長手方向に延在するスリットＳ１と、磁気的結合用窓Ｈに連なり電極５４Ｄの幅方向の一辺に達するスリットＳ２が設けられる。この電極５４Ｄは、絶縁体層５１Ｇの表面の電極５４Ｃに対向する位置に形成され、絶縁体層５１Ｇの側面まで引き出される。この時、電極５４Ｄの磁気的結合用窓Ｈは、電極５４Ｃの磁気的結合用窓Ｈの位置と一致する様に形成される。
絶縁体層５１Ｈの表面には、電極５４Ｅと電極５４Ｆが形成される。電極５４Ｅと電極５４Ｆは、互いに接触しない様に離間して絶縁体層５１Ｈの表面の電極５４Ｄと対向する位置に形成され、それぞれ絶縁体層５１Ｈの側面まで引き出される。また、電極５４Ｅと電極５４Ｆは、電極５４Ｄの磁気的結合用窓ＨとスリットＳ１に対向する部分に位置しない様に、その形状や絶縁体層５１Ｈの表面における位置が決められる。
絶縁体層５１Ｉの表面には、電極５４Ｇが形成される。電極５４Ｇは、コイルの中心部に対応する中央部に磁気的結合用窓Ｈが設けられると共に、磁気的結合用窓Ｈに連なり電極５４Ｇの長手方向に延在するスリットＳ１と、磁気的結合用窓Ｈに連なり電極５４Ｇの幅方向の一辺に達するスリットＳ２が設けられる。この電極５４Ｇは、絶縁体層５１Ｉの表面の電極５４Ｅ、５４Ｆに対向する位置に形成され、絶縁体層５１Ｉの側面まで引き出される。
絶縁体層５１Ｊの表面には、コイル用導体パターン５３Ａが形成される。このコイル用導体パターン５３Ａは、１ターン未満分が形成され、一端が絶縁体層５１Ｊの側面まで引き出される。
絶縁体層５１Ｋの表面には、コイル用導体パターン５３Ｂが形成される。このコイル用導体パターン５３Ｂは、１ターン未満分が形成され、一端がコイル用導体パターン５３Ａの他端に接続される。
絶縁体層５１Ｌの表面には、コイル用導体パターン５３Ｃが形成される。このコイル用導体パターン５３Ｃは、１ターン未満分が形成され、一端がコイル用導体パターン５３Ｂの他端に接続される。
絶縁体層５１Ｍの表面には、コイル用導体パターン５３Ｄが形成される。このコイル用導体パターン５３Ｄは、１ターン未満分が形成され、一端がコイル用導体パターン５３Ｃの他端に接続され、他端が絶縁体層５１Ｍの側面まで引き出される。この様にコイル用導体パターン５３Ａ、コイル用導体パターン５３Ｂ、コイル用導体パターン５３Ｃ、コイル用導体パターン５３Ｄを螺旋状に接続することによりコイルが形成される。
この絶縁体層５１Ｍの上には、絶縁体層５１Ｎが積層される。
この様に積層された積層体は、絶縁体層５１Ａ〜５１Ｄとコイル用導体パターン５２Ａ〜５２Ｄによって第１のコイル部が、絶縁体層５１Ｊ〜５１Ｍとコイル用導体パターン５３Ａ〜５３Ｄによって第２のコイル部が構成され、第１のコイル部と第２のコイル間に、絶縁体層５１Ｅ〜５１Ｉ、電極５４Ａ、５４Ｂ、５４Ｅ、５４Ｆ及び、磁気的結合用窓とスリットを有する電極５４Ｃ、５４Ｄ、５４Ｇが積層されてコンデンサが形成される。第１のコイル部のコイルと第２のコイル部のコイルは、磁気的に負に結合する様に配置される。
この様な積層体には、図２に示す様に、積層体の側面に入力端子２１、出力端子２２、アース端子２３、２４が形成される。そして、コイル用導体パターン５３Ａ、電極５４Ａ、５４Ｅが入力端子２１に、コイル用導体パターン５２Ｄ、電極５４Ｂ、５４Ｆが出力端子に、コイル用導体パターン５２Ａ、５３Ｄ、電極５４Ｄ、５４Ｇがアース端子２３に、電極５４Ｃがアース端子２４に接続される。 FIG. 5 is an exploded perspective view showing a second embodiment of the multilayer electronic component of the present invention.
A coil conductor pattern 52A is formed on the surface of the insulating layer 51A. The coil conductor pattern 12A is formed with less than one turn, and one end is drawn to the side surface of the insulator layer 51A.
A coil conductor pattern 52B is formed on the surface of the insulating layer 51B. The coil conductor pattern 52B is formed for less than one turn, and one end is connected to the other end of the coil conductor pattern 52A.
A coil conductor pattern 52C is formed on the surface of the insulator layer 51C. The coil conductor pattern 52C is formed for less than one turn, and one end is connected to the other end of the coil conductor pattern 12B.
A coil conductor pattern 52D is formed on the surface of the insulating layer 51D. The coil conductor pattern 52D is formed for less than one turn, one end is connected to the other end of the coil conductor pattern 52C, and the other end is drawn to the side surface of the insulator layer 51D. In this way, the coil conductor pattern 52A, the coil conductor pattern 52B, the coil conductor pattern 52C, and the coil conductor pattern 52D are spirally connected to form a coil.
An electrode 54A and an electrode 54B are formed on the surface of the insulator layer 51E. The electrode 54A and the electrode 54B are formed apart from each other so as not to contact each other, and are led out to the side surface of the insulator layer 51E. Further, the electrode 54A and the electrode 54B have shapes and positions on the surface of the insulator layer 51E so as not to be positioned at portions facing the magnetic coupling window and the slit of the electrode having a magnetic coupling window and a slit, which will be described later. Is decided.
An electrode 54C is formed on the surface of the insulator layer 51F. The electrode 54C is provided with a magnetic coupling window H at a central portion corresponding to the central portion of the coil, and a slit S that is connected to the magnetic coupling window H and reaches one side in the longitudinal direction of the electrode 54C. The electrode 54C is formed at a position facing the electrodes 54A and 54B on the surface of the insulating layer 51F, and is drawn out to the side surface of the insulating layer 51F.
An electrode 54D is formed on the surface of the insulator layer 51G. The electrode 54D is provided with a magnetic coupling window H at a central portion corresponding to the central portion of the coil, a slit S1 connected to the magnetic coupling window H and extending in the longitudinal direction of the electrode 54D, and a magnetic coupling window. A slit S2 that extends to the window H and reaches one side in the width direction of the electrode 54D is provided. The electrode 54D is formed at a position facing the electrode 54C on the surface of the insulator layer 51G, and is drawn out to the side surface of the insulator layer 51G. At this time, the magnetic coupling window H of the electrode 54D is formed to coincide with the position of the magnetic coupling window H of the electrode 54C.
Electrodes 54E and 54F are formed on the surface of the insulator layer 51H. The electrode 54E and the electrode 54F are formed at positions facing the electrode 54D on the surface of the insulating layer 51H so as not to contact each other, and are respectively drawn out to the side surface of the insulating layer 51H. Further, the shape of the electrode 54E and the electrode 54F and the position on the surface of the insulator layer 51H are determined so as not to be positioned in a portion facing the magnetic coupling window H and the slit S1 of the electrode 54D.
An electrode 54G is formed on the surface of the insulator layer 51I. The electrode 54G is provided with a magnetic coupling window H at a central portion corresponding to the central portion of the coil, a slit S1 connected to the magnetic coupling window H and extending in the longitudinal direction of the electrode 54G, and a magnetic coupling window. A slit S2 that extends to the window H and reaches one side in the width direction of the electrode 54G is provided. The electrode 54G is formed at a position facing the electrodes 54E and 54F on the surface of the insulator layer 51I, and is drawn out to the side surface of the insulator layer 51I.
A coil conductor pattern 53A is formed on the surface of the insulating layer 51J. The coil conductor pattern 53A is formed for less than one turn, and one end is drawn to the side surface of the insulator layer 51J.
A coil conductor pattern 53B is formed on the surface of the insulator layer 51K. The coil conductor pattern 53B is formed for less than one turn, and one end is connected to the other end of the coil conductor pattern 53A.
A coil conductor pattern 53C is formed on the surface of the insulating layer 51L. The coil conductor pattern 53C is formed with less than one turn, and one end is connected to the other end of the coil conductor pattern 53B.
A coil conductor pattern 53D is formed on the surface of the insulator layer 51M. The coil conductor pattern 53D is formed for less than one turn, one end is connected to the other end of the coil conductor pattern 53C, and the other end is drawn to the side surface of the insulator layer 51M. In this manner, the coil conductor pattern 53A, the coil conductor pattern 53B, the coil conductor pattern 53C, and the coil conductor pattern 53D are spirally connected to form a coil.
An insulator layer 51N is stacked on the insulator layer 51M.
In the laminated body thus laminated, the first coil portion is formed by the insulator layers 51A to 51D and the coil conductor patterns 52A to 52D, and the second coil portion is formed by the insulator layers 51J to 51M and the coil conductor patterns 53A to 53D. A coil portion is configured, and between the first coil portion and the second coil, insulator layers 51E to 51I, electrodes 54A, 54B, 54E, 54F, and electrodes 54C, 54D having magnetic coupling windows and slits, 54G is laminated to form a capacitor. The coil of the first coil portion and the coil of the second coil portion are arranged so as to be magnetically coupled negatively.
In such a laminated body, as shown in FIG. 2, an input terminal 21, an output terminal 22, and ground terminals 23 and 24 are formed on the side surface of the laminated body. The coil conductor pattern 53A and the electrodes 54A and 54E serve as the input terminal 21, the coil conductor pattern 52D and the electrodes 54B and 54F serve as the output terminal, and the coil conductor patterns 52A and 53D and the electrodes 54D and 54G serve as the ground terminal 23. The electrode 54C is connected to the ground terminal 24.

この様に形成された積層型電子部品は、コイル用導体パターン５３Ａ〜５３ＤによってコイルＬ１が、コイル用導体パターン５２Ａ〜５２ＤによってコイルＬ２が、電極５４Ｅと電極５４Ｇ間の容量と電極５４Ｅと電極５４Ｄ間の容量によってコンデンサＣ１が、電極５４Ｆと電極５４Ｇ間の容量と電極５４Ｆと電極５４Ｄ間の容量によってコンデンサＣ２が、電極５４Ａと電極５４Ｃ間の容量によってコンデンサＣ３が、電極５４Ｂと電極５４Ｃ間の容量によってコンデンサＣ４が、電極５４Ｃと電極５４Ｄ間の容量によってコンデンサＣ５がそれぞれ形成されることにより、積層体内に、図３に示す様な、入出力端子間にコイルＬ１とコイルＬ２が直列に接続され、コイルＬ１にコンデンサＣ１が並列に接続され、コイルＬ２にコンデンサＣ２が並列に接続され、コイルＬ１の入力側とアース間にコンデンサＣ３が、コイルＬ２の出力側とアース間にコンデンサＣ４が、コイルＬ１とコイルＬ２の接続点とアース間にコンデンサＣ５がそれぞれ接続されたローパスフィルタが形成される。このコイルＬ１とコイルＬ２は、互いに磁気的に負に結合する。   In the multilayer electronic component thus formed, the coil L1 is formed by the coil conductor patterns 53A to 53D, the coil L2 is formed by the coil conductor patterns 52A to 52D, the capacitance between the electrode 54E and the electrode 54G, the electrode 54E and the electrode 54D. The capacitance between the electrodes 54F and 54G, the capacitance between the electrodes 54F and 54D, the capacitor C2 due to the capacitance between the electrodes 54A and 54C, the capacitor C3 due to the capacitance between the electrodes 54A and 54C, and the capacitance between the electrodes 54B and 54C. A capacitor C4 is formed by the capacitance, and a capacitor C5 is formed by the capacitance between the electrode 54C and the electrode 54D, so that the coil L1 and the coil L2 are connected in series between the input and output terminals as shown in FIG. The capacitor C1 is connected in parallel to the coil L1, and the capacitor is connected to the coil L2. C2 is connected in parallel, the capacitor C3 is connected between the input side of the coil L1 and the ground, the capacitor C4 is connected between the output side of the coil L2 and the ground, and the capacitor C5 is connected between the connection point of the coil L1 and the coil L2 and the ground. A low-pass filter is formed. The coil L1 and the coil L2 are magnetically coupled to each other negatively.

この様な積層型電子部品は、絶縁体層の誘電率を２１、コイル用導体パターンの線幅を７５μｍ、電極の磁気的結合用窓の大きさを１５０μｍ×１５０μｍ、スリットＳ、Ｓ１の幅を１００μｍ、コイル用導体パターン５２Ｄと電極５４Ａ、５４Ｂ間の距離を４６μｍ、コイル用導体パターン５３Ａと電極５４Ｇ間の距離を２３μｍ、素子全体の形状を１ｍｍ×０．５ｍｍ×０．５ｍｍとしたところ、図６に示す様に、通過帯域が４７０〜７１０ＭＨｚ、通過帯域における挿入損失が１．９４ｄＢ、通過帯域における反射損失が１８．２ｄＢ、阻止帯域の８９５〜９２５ＭＨｚの減衰量が２８．１ｄＢ、阻止帯域の１５００〜２５００ＭＨｚの減衰量が１６．２ｄＢとなった。なお、図６において、横軸は周波数、縦軸は減衰量をそれぞれ示し、６１が伝送特性、６２が反射特性を示している。   In such a multilayer electronic component, the dielectric constant of the insulator layer is 21, the line width of the coil conductor pattern is 75 μm, the size of the electrode magnetic coupling window is 150 μm × 150 μm, and the widths of the slits S and S1 are 100 μm, the distance between the coil conductor pattern 52D and the electrodes 54A, 54B is 46 μm, the distance between the coil conductor pattern 53A and the electrode 54G is 23 μm, and the overall shape of the element is 1 mm × 0.5 mm × 0.5 mm. As shown in FIG. 6, the pass band is 470 to 710 MHz, the insertion loss in the pass band is 1.94 dB, the reflection loss in the pass band is 18.2 dB, the attenuation of 895 to 925 MHz in the stop band is 28.1 dB, and the stop band. The attenuation amount of 1500 to 2500 MHz was 16.2 dB. In FIG. 6, the horizontal axis represents frequency, the vertical axis represents attenuation, 61 represents transmission characteristics, and 62 represents reflection characteristics.

以上、本発明の積層型電子部品の実施例を述べたが、本発明はこの実施例に限られるものではない。例えば、実施例では、２つのコイル部間に、磁気的結合用窓とスリットを備えた電極と磁気的結合用窓とスリットを備えない電極を絶縁体層を介して積層してコンデンサが形成されたものを説明したが、磁気的結合用窓とスリットを備えた複数の電極を絶縁体層を介して積層してコンデンサを形成してもよい。また、２つのコイル部間に、磁気的結合用窓とスリットを備えた電極を配置してトランスやコモンモードチョークコイルとしても良い。さらに、２つのコイル部間に配置される電極にスリットを複数形成しても良い。   The embodiment of the multilayer electronic component of the present invention has been described above, but the present invention is not limited to this embodiment. For example, in the embodiment, a capacitor is formed by laminating an electrode having a magnetic coupling window and a slit and an electrode having no magnetic coupling window and an electrode without a slit between two coil portions via an insulator layer. However, a capacitor may be formed by laminating a plurality of electrodes provided with a magnetic coupling window and a slit through an insulator layer. Further, an electrode having a magnetic coupling window and a slit may be disposed between the two coil portions to form a transformer or a common mode choke coil. Further, a plurality of slits may be formed in the electrode disposed between the two coil portions.

本発明の積層型電子部品の第１の実施例を示す分解斜視図である。1 is an exploded perspective view showing a first embodiment of a multilayer electronic component of the present invention. 本発明の積層型電子部品の実施例の斜視図である。It is a perspective view of the Example of the multilayer electronic component of this invention. 本発明の積層型電子部品の回路の一例を示す回路図である。It is a circuit diagram which shows an example of the circuit of the multilayer electronic component of this invention. 本発明の積層型電子部品の第１の実施例の特性の説明図である。It is explanatory drawing of the characteristic of the 1st Example of the multilayer electronic component of this invention. 本発明の積層型電子部品の第２の実施例を示す分解斜視図である。It is a disassembled perspective view which shows the 2nd Example of the multilayer electronic component of this invention. 本発明の積層型電子部品の第２の実施例の特性を示す特性図である。It is a characteristic view which shows the characteristic of the 2nd Example of the multilayer electronic component of this invention. 従来の積層型電子部品の分解斜視図である。It is a disassembled perspective view of the conventional multilayer electronic component. 従来の別の積層型電子部品の分解斜視図である。It is a disassembled perspective view of another conventional multilayer electronic component. 従来のさらに別の積層型電子部品の分解斜視図である。It is a disassembled perspective view of another conventional multilayer electronic component.

符号の説明Explanation of symbols

１１Ａ〜１１Ｎ 絶縁体層
１２Ａ〜１２Ｄ、１３Ａ〜１３Ｄ コイル用導体パターン
１４Ａ〜１４Ｇ 電極 11A to 11N Insulator layers 12A to 12D, 13A to 13D Coil conductor patterns 14A to 14G Electrodes

Claims (3)

絶縁体層とコイル用導体パターンを積層し、該コイル用導体パターンによって内部にコイルが形成された第１のコイル部、絶縁体層とコイル用導体パターンを積層し、該コイル用導体パターンによって内部にコイルが形成された第２のコイル部及び、該第１のコイル部と第２のコイル部間に配置された磁気結合用窓を有する電極を積み重ねて積層体が形成され、該第１のコイル部のコイルと第２のコイル部のコイルを磁気的に結合させた積層型電子部品において、
該第１のコイル部と第２のコイル部間に配置された該電極は該磁気的結合用窓に連なるスリットが形成され、該第１のコイル部のコイルと該第２のコイル部のコイルを磁気的に負に結合させたことを特徴とする積層型電子部品。 The insulator layer and the coil conductor pattern are laminated, and the first coil portion in which the coil is formed by the coil conductor pattern, the insulator layer and the coil conductor pattern are laminated, and the coil conductor pattern A stack is formed by stacking a second coil portion having a coil formed thereon and an electrode having a magnetic coupling window disposed between the first coil portion and the second coil portion, In the multilayer electronic component in which the coil of the coil part and the coil of the second coil part are magnetically coupled,
The electrode disposed between the first coil part and the second coil part is formed with a slit connected to the magnetic coupling window, and the coil of the first coil part and the coil of the second coil part A laminated electronic component characterized in that is magnetically coupled negatively. 前記電極を絶縁体層を介して複数積層し、該複数の電極によってコンデンサが形成された請求項１に記載の積層型電子部品。   The multilayer electronic component according to claim 1, wherein a plurality of the electrodes are stacked via an insulator layer, and a capacitor is formed by the plurality of electrodes. 前記磁気的結合用窓とスリットを有する電極に第２の電極を積層してコンデンサが形成され、該第２の電極が該磁気的結合用窓及びスリットと重ならない様に形成された請求項１又は請求項２に記載の積層型電子部品。   2. A capacitor is formed by laminating a second electrode on the magnetic coupling window and an electrode having a slit, and the second electrode is formed so as not to overlap the magnetic coupling window and the slit. Alternatively, the multilayer electronic component according to claim 2.
JP2008316569A 2008-12-12 2008-12-12 Stacked electronic component Pending JP2010141643A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017043321A1 (en) * 2015-09-10 2017-03-16 株式会社村田製作所 Multilayer lc filter
JPWO2017086283A1 (en) * 2015-11-19 2018-08-23 株式会社村田製作所 LC composite device
CN113690031A (en) * 2020-05-18 2021-11-23 瑞昱半导体股份有限公司 Stacked inductor device

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JPH04119701A (en) * 1990-09-10 1992-04-21 Matsushita Electric Ind Co Ltd High frequency filter
JP2005268935A (en) * 2004-03-16 2005-09-29 Murata Mfg Co Ltd Lc resonator

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04119701A (en) * 1990-09-10 1992-04-21 Matsushita Electric Ind Co Ltd High frequency filter
JP2005268935A (en) * 2004-03-16 2005-09-29 Murata Mfg Co Ltd Lc resonator

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017043321A1 (en) * 2015-09-10 2017-03-16 株式会社村田製作所 Multilayer lc filter
JPWO2017086283A1 (en) * 2015-11-19 2018-08-23 株式会社村田製作所 LC composite device
CN113690031A (en) * 2020-05-18 2021-11-23 瑞昱半导体股份有限公司 Stacked inductor device
CN113690031B (en) * 2020-05-18 2023-11-21 瑞昱半导体股份有限公司 stacked inductor device

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