JP2010141267A - Apparatus for dividing rectangular substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for dividing a rectangular substrate for effectively eliminating static from a device after peeling a protective tape. <P>SOLUTION: This apparatus for dividing a rectangular substrate includes: a holding table having a protective tape stuck to the back face thereof for holding a rectangular substrate with a plurality of devices formed in a lattice-like form on the front surface; a cutting means to divide the held rectangular substrate into individual devices; a tape peeling mechanism 51 for peeling the protective tape from the rectangular substrate divided into the divided devices; and a pickup means 80 for housing the individual devices in device cases 104a, 104b. The apparatus further includes: a static elimination table 84 for mounting the plurality devices thereon; a transport means 76 to transport the devices with the protective tape peeled by the tape peeling mechanism to the static elimination table; and a static elimination means to eliminate static from the devices mounted on the static elimination table. The static elimination table includes a plurality of suction parts each used for sucking and holding a part of the back face of the device, and a plurality of suction passages for transmitting suction force from a suction source to the suction parts. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a rectangular substrate dividing apparatus that divides various rectangular substrates formed in a rectangular shape into individual devices.

  A rectangular substrate such as a CSP (Chip Size Package) in which a plurality of integrated circuits such as IC and LSI are formed and packaged by a resin is divided into individual devices by a cutting device such as a dicing device and accommodated in a device case. In this state, it is transported to the electronic device assembly process. Each transferred device is mounted on various electronic devices in an assembly process.

Generally, a dedicated device housing apparatus is used for housing a device in a device case. However, in Japanese Patent Laid-Open No. 2000-208445 or Japanese Patent Laid-Open No. 2006-156777, a rectangular shape in which a cutting apparatus and a device housing apparatus are integrated. A substrate dividing apparatus has been proposed.
JP 2000-208445 A JP 2006-156777 A

  In recent years, integrated circuits such as ICs and LSIs have a tendency to be highly integrated and miniaturized. For this reason, static electricity resistance tends to be lowered. Therefore, ESD (Electrostatic Discharge) countermeasures have become important.

  In particular, when the protective tape for protecting the back surface of the rectangular substrate is peeled off from the substrate during cutting, static electricity is generated and the substrate is charged. Therefore, it is necessary to remove static electricity to prevent device destruction due to electrostatic discharge.

  For static elimination, it is sufficient to supply positive ions and negative ions to the device using a static eliminator when peeling the protective tape. However, there is a problem that the static electricity is difficult to remove when the device is held on the peeling table or the mounting table. .

  On the other hand, generally, bump electrodes called bumps for electrical connection are formed on the surface of these devices. Normally, the device is mounted with the bumps facing down, and therefore it is desirable that the divided devices be accommodated in the device case with the bump surfaces facing downward.

  However, if the rectangular substrate is cut with the bumps facing down to accommodate them in the device case with the bumps facing down, the bump surface (uneven surface) will be sucked and held during the cutting, and the machining quality will deteriorate due to insufficient holding power. Problem arises.

  Therefore, a first object of the present invention is to provide a rectangular substrate dividing apparatus that can effectively neutralize a device after peeling off a protective tape.

  The second object is to provide a rectangular substrate dividing device which can be accommodated in a device case with the bump surface facing downward after cutting the bump surface upward.

  According to the present invention, a holding table that holds a rectangular substrate formed by attaching a protective tape to the back surface and a plurality of devices partitioned by a grid-like dividing line on the front surface, and the rectangular substrate held by the holding table Cutting means for cutting along the predetermined dividing line into individual devices, a tape peeling mechanism for peeling the protective tape from the rectangular substrate that has been cut and divided into individual devices, and the individual devices A rectangular substrate splitting device including a pickup unit that is accommodated in a device case, and a static elimination table on which a plurality of devices can be placed, and a device from which the protective tape has been peeled off by the tape peeling mechanism Transporting means for transporting, and neutralizing means for neutralizing a device placed on the static elimination table, the static elimination table comprising a device A plurality of suction portion for holding the suction part of the rear surface, dividing apparatus of a rectangular substrate and having a plurality of suction paths for transmission to the adsorption unit is provided with suction force from the suction source.

  Preferably, the rectangular substrate dividing apparatus further includes a reversing unit that reverses the front and back surfaces of the device by reversing the device mounted on the neutralization table and neutralized by the neutralizing unit after being sucked and held from the upper surface. The pick-up means picks up the device reversed by the reversing means from the reversing means and accommodates it in the device case.

  According to the first aspect of the present invention, since the device from which the protective tape has been peeled is held by suction only on a part of its back surface on the static elimination table, effective static elimination is possible. In addition, since a plurality of devices can be continuously discharged, work efficiency is improved.

  According to the second aspect of the invention, by providing the reversing means, it is possible to reverse the front and back of the device after static elimination, and it can be accommodated in the device case with the bumps facing downward. A suitable posture can be obtained.

  Referring to FIG. 1, there is shown a perspective view of a rectangular substrate dividing apparatus 2 that cuts the dividing lines 6 formed in a lattice shape on a rectangular substrate 4 as shown in FIG. Yes. The rectangular substrate 4 shown in FIG. 2 is partitioned by the planned dividing lines 6 to form a plurality of devices.

  In the example shown in the figure, the device is constituted by a first device row D1 to an eighth device row D8, and each device row is constituted by three devices and two end members 8 at both ends. An unnecessary end (end material) 10 is formed on the outer peripheral side of the first device row D1 and the eighth device row D8. The end material 8 and the unnecessary end portion 10 are finally discarded.

  A protective tape T for device protection is attached to the back surface of the rectangular substrate 4. The rectangular substrate 4 can be divided into individual devices by cutting the division line 6 using the dividing apparatus 2 shown in FIG. Examples of the rectangular substrate 4 include a CSP and a glass substrate.

  Referring again to FIG. 1, the dividing apparatus 2 cuts the rectangular substrate 4 with the protective tape T attached to the back surface in a vertical and horizontal manner and divides the rectangular substrate 4 into individual devices, and the protective tape T from the rectangular substrate 4. It consists of a tape stripping area 14 to be stripped and a device housing section 16 for housing individual devices in a device case.

  In the cutting charge area 12, a cassette table 18 on which a cassette containing a plurality of rectangular substrates is placed, unloading means 20 for unloading the rectangular substrates from the cassette table 18, and fixed on the upper surface of the rotary base 21 are unloaded. A chuck table (holding table) 22 that holds and rotates a rectangular substrate, and a cutting blade 24 that cuts the rectangular substrate held on the chuck table 22 along the planned division line 6 and divides the rectangular substrate into individual devices. Means 26 and cleaning means 28 for cleaning the cut rectangular substrate are provided. In the cutting charge area 12, dicing by cutting the rectangular substrate and cleaning of the rectangular substrate after cutting are performed.

  The unloading means 20 is movable in the Y-axis direction, and unloads the rectangular substrate from the cassette C1 or C2 placed on the cassette table 18. The cassette table 18 can be moved up and down in the Z-axis direction together with a cassette positioning means 30 described later, and two cassettes C1 and C2 are detachably mounted thereon.

  Below the cassette table 18, cassette positioning means 30 capable of selectively positioning a rectangular substrate accommodated in any of the cassettes at a position where it can be unloaded by the unloading means 20, is provided. It is also configured to be movable in the direction. Thereby, the rectangular substrates stored in the respective cassettes C1 and C2 can be efficiently carried out one after another.

  As shown in FIG. 3, between the cassette table 18 and the unloading means 20 above the chuck table 22, a pair of opening / closing members 32 that are long in the Y-axis direction and have an L-shaped cross section face each other. Constituting posture correcting means 34 is provided.

  Each of the pair of opening / closing members 32 includes a bottom portion 32a and a side portion 32b, moves in a direction toward or away from each other, forms a closed state in the approached state, and forms a first open state in the separated state. A second open state is formed.

  When the rectangular substrate is unloaded from the cassette C1 or the cassette C2, the posture correcting means 34 is in the first open state, and the unloaded rectangular substrate is placed on the two bottom portions 32a. That is, the first open state is a state where the rectangular substrate is opened to such an extent that the rectangular substrate can be carried out, and is open to the extent that the rectangular substrate does not fall downward.

  On the other hand, the second open state is a state in which the rectangular substrate is opened to the extent that it can move between the pair of opening and closing members 32 in the vertical direction. When the pair of opening / closing members 32 approach each other and are in the closed state, the posture of the rectangular substrate is corrected, is aligned at a certain position, and faces a predetermined direction.

  When the cassette table 18 is positioned at a predetermined height, the carry-out means 20 moves in the + Y-axis direction, and the holding unit 36 holds the rectangular substrate accommodated in the cassette C1 or the cassette C2.

  Then, when the unloading means 20 moves in the −Y-axis direction in a state where the opening / closing member 32 is in the first open state, the bottom 32a of the opening / closing member 32 is together with the protective tape T attached to the back surface of the rectangular substrate 4. Slide up.

  When the rectangular substrate 4 is moved to a position just above the chuck table 22, the movement of the unloading means 20 is stopped and the gripping state by the gripping portion 36 is released, and the rectangular substrate 4 is placed on the two bottom portions 32a. To do. In this state, the pair of opening / closing members 32 approach each other to be in a closed state, and the posture of the rectangular substrate 4 is corrected.

  A first transport unit 38 is disposed directly above the chuck table 22. The first transport unit 38 includes a holding unit 40 in which a plurality of suction pads 40 a communicating with a suction source are fixed to the lower part, and when the rectangular substrate 4 is placed on the bottom 32 a of the opening / closing member 32, The holding part 40 descends and the surface of the rectangular substrate 4 is sucked by the suction pad 40a.

  Then, after the pair of opening / closing members 32 is in the first open state, the holding unit 40 is raised while the rectangular substrate 4 is attracted to lift the rectangular substrate 4, and then the pair of opening / closing members 32 is moved to the second state. When the rectangular substrate 4 is placed on the chuck table 22 by lowering the holding unit 40 in the open state and the suction by the suction pad 40 a is released, the protective tape T adhered to the back surface of the rectangular substrate 4 is sucked to the chuck table 22. The rectangular substrate 4 is also held by the chuck table 22.

  The chuck table 22 is configured to be rotatable and movable in the X-axis direction, and a division planned line 6 (see FIG. 2) formed on the rectangular substrate is detected above the movement path of the chuck table 22. An alignment means 42 is disposed.

  When the rectangular substrate 4 is held on the chuck table 22, the chuck table 22 moves in the + X axis direction, and the rectangular substrate 4 is positioned immediately below the alignment means 42. The alignment unit 42 includes an imaging unit 44, and the alignment unit 42 detects the scheduled division line 6 by pattern matching or the like between an image acquired while the imaging unit 44 moves in the Y-axis direction and an image stored in advance. .

  Referring to FIG. 1 again, on the + X axis direction side with respect to the alignment means 42, a cutting blade 26 that includes a cutting blade 24 that rotates at high speed and is movable in the Y axis direction and the Z axis direction is disposed.

  The cutting means 26 is configured integrally with the imaging unit 44, and the cutting blade 24 is positioned on the extended line of the imaging unit 44 in the + X axis direction. When the planned dividing line 6 is detected by the alignment means 42, the alignment of the planned dividing line 6 and the cutting blade 24 in the Y-axis direction is automatically achieved.

  In this way, when the Y axis direction alignment between the division line 6 to be cut and the cutting blade 24 is performed, the rectangular substrate 4 held by the chuck table 22 moves in the + X axis direction. At the same time, the cutting means 26 descends while the cutting blade 24 rotates at a high speed, and the cutting blade 24 that rotates at a high speed cuts into the detected division line 6, and the division division line 6 is cut.

  When the planned dividing lines 6 are sequentially cut while indexing and feeding the cutting blade 24 in the Y-axis direction by the pitch of the planned dividing lines, all the planned dividing lines 6 in the same direction are cut. Further, when the same cutting is performed after the chuck table 22 is rotated 90 degrees and the rectangular substrate 4 is rotated 90 degrees, all the division lines 6 are cut and divided into individual devices.

  The rectangular substrate 4 that has been divided is transported to the cleaning means 28 by the second transport means 46, where it is cleaned and spin-dried. For the detailed configuration of the cleaning means 28, the content disclosed in Patent Document 2 is incorporated as a reference in this specification, so refer to Patent Document 2.

  The rectangular substrate 4 that has been cleaned and spin-dried by the cleaning means 28 is transported to the tape peeling mechanism 51 disposed in the tape peeling responsible area 14 by the third transport means 48.

  As shown in FIG. 4, the tape peeling mechanism 51 is a temporary placement table 52 on which a rectangular substrate 4 that has been cleaned and dried after being divided into individual devices is temporarily placed, and a table on which the devices are placed and picked up. Device pick-up table 54 and device transfer means 56 for transferring a device from temporary placement table 52 to pick-up table 54 while peeling off protective tape T attached to the back surface of rectangular substrate 4 are provided.

  Above the temporary placement table 52, a pusher 58 for moving the cut rectangular substrate 4 with the protective tape T attached thereto in the + Y-axis direction is disposed. On the + Y-axis direction side of the pusher 58, a pressing roller 60 is provided that presses the rectangular substrate 4 placed on the temporary placement table 52 from above and sandwiches it with the temporary placement table 52.

  The pickup table 54 includes a first table 54a and a second table 54b. The first table 54a is disposed so as to be movable in the Y-axis direction in the area between the temporary placement table 52 and the second table 54b, and approaches the temporary placement table 52 or approaches the second table 54b. be able to.

  Above the pickup table 54, a device moving means 62 for moving a device placed on the first table 54a to the second table 54b is disposed. Further, below the second table 54b on the + Y-axis direction side, an end material storage portion 64 that stores the end materials 8 and 10 (see FIG. 2) on the outer periphery of the diced rectangular substrate 4 is disposed. ing. Further, below the temporary table 52, a protective tape housing portion 66 for housing the protective tape T to be discarded is disposed.

  The device moving unit 62 includes a horizontal moving unit 68 that horizontally moves in the Y-axis direction, a lifting unit 70 that is supported by the horizontal moving unit 68 so as to be able to move up and down in the Z-axis direction, and a first fixed unit that is fixed to the tip of the lifting unit 70. It is comprised from the extrusion part 72 which slides a device and an end material on the table 54a or the 2nd table 54b, and extrudes to + Y-axis direction.

  The extruding unit 72 includes a device extruding unit 72a that extrudes a device placed on the first table 54a in the + Y-axis direction and moves the device to the second table 54b, and an end material remaining on the second table 54b. The end material extruding portion 72b is disposed in the end material accommodating portion 64.

  In the tape peeling mechanism 51 configured as described above, the rectangular substrate 4 placed on the temporary placement table 52 is pushed in the + Y-axis direction by the pusher 58 of the device transfer means 56 while holding the rectangular substrate 4 at a gripping portion (not shown). By gripping the defective end portion 10 together with the protective tape T and pulling it downward, the protective tape T is peeled off from the rectangular substrate 4, and the first device row D1 is first placed on the first table 54a.

  Note that details of the tape peeling operation of the tape peeling mechanism 51 are described in detail in the above-mentioned Patent Document 2, and therefore, in order to address the contents as a reference in this specification, refer to Patent Document 2. I want.

  The first device row D1 on the first table 54a is pushed in the + Y-axis direction by the device pushing portion 72a of the pushing portion 72, and transferred from the first table 54a to the second table 54b as shown in FIG. The

  Referring to FIG. 5, the tape peeling mechanism 51 includes a support member 74 that is fixedly disposed above the pickup table 54. The support member 74 picks up the device D placed on the second table 54b and picks up the device D on the reversing means 94 and picks up the device D on the reversing means 94. A pickup unit (pickup / conveying unit) 80 that conveys the device case 104a or 104b is supported.

  An image pickup means 78 composed of a CCD camera or the like is attached to the transport means 76, and an image pickup means 82 composed of a CCD camera or the like is attached to the pickup means 80. Both the transport unit 76 and the pickup unit 80 are movable in the X-axis direction and the Z-axis direction.

  As best shown in FIG. 6, the static elimination table 84 is arranged to rotate about 270 degrees by a motor 86, and four suction pads 88 are attached on the static elimination table 84. Each suction pad 88 is connected to a vacuum suction source 92 via a suction path 90. The reason why the static elimination table 84 does not rotate 360 degrees is to prevent the suction path 90 from becoming entangled.

  A neutralizing means 100 is disposed so as to face the neutralizing table 84. Reference numeral 94 denotes reversing means for reversing the front and back of the device D. A side surface of one end portion 94a is fixed to the rotary air cylinder 96, and a suction pad 98 is disposed on the multi-end portion 94b. In FIG. 5, the static elimination table 84, the rotary air cylinder 96, and the support mechanism that supports the static elimination means 100 are omitted.

  Referring to FIG. 5 again, reference numeral 104a denotes a non-defective device case having a plurality of device accommodating portions for accommodating non-defective devices D, and is accommodated in a non-defective device case frame 102 movable in the Y-axis direction.

  Reference numeral 104b denotes a defective device case having a plurality of device accommodating portions for accommodating the defective device D, and is accommodated in a defective device case frame 106 movable in the Y-axis direction. The non-defective device case housing frame 102 and the defective device case housing frame 106 are arranged so that the heights in the Z-axis direction are different.

  In the present embodiment, the static elimination table 84 and the static elimination means 100 are provided to neutralize the device D because static electricity is generated when the protective tape T is peeled from the rectangular substrate 4 and the device D is charged. This is to prevent device destruction due to electrostatic discharge.

  Hereinafter, the operation of discharging the device D and reversing the front and back of the device according to the embodiment of the present invention will be described. Each device D constituting the first device row D1 placed on the second table 54b is imaged by the imaging means 78, and the appearance of presence or absence of chipping or the like is determined. At the time of this imaging, although not particularly shown, it is preferable to take an image while illuminating the device D with red illumination.

  Next, the device D on the second table 54 b is picked up by the transport means (pickup and transport means) 76, transported to the suction pad 88 at the position A of the static elimination table 84, and sucked and held by the suction pad 88.

  At the B position where the static elimination table 84 is rotated 90 degrees counterclockwise, the image is picked up again by the image pickup means 82 to determine the state of the bump and the presence or absence of a bad bark (defective product mark). Here, the upper surface of the static elimination table 84 is colored black in order to prevent halation when observing the bump state.

  In the state where the device D sucked by the suction pad 88 is positioned at the B position, the static electricity of the device D is discharged by the discharging means 100. At this time, part of the device D is adsorbed by the adsorbing pad 88 and the other surface is exposed, so that the charge can be removed efficiently.

  When the static elimination table 84 further rotates 180 degrees in the counterclockwise direction and the device D attracted to the suction pad 88 reaches the D position, the suction pad 98 of the reversing means 94 as shown in FIG. When the device D is attracted and the reversing means 94 is rotated 180 degrees in the counterclockwise direction indicated by the arrow B, the reversing means 94 is in the state shown in FIG. 6A and the front and back of the device D are reversed.

  The suction pad 98 of the reversing means 94 in FIG. 6A shows a state in which the device D is not sucked in order to clearly show the suction pad 98, but in fact, it is shown in FIG. 6B. When the reversing means 94 is rotated 180 degrees counterclockwise from the state, the back surface of the device D faces upward and is attracted to the suction pad 98.

  In FIG. 6 (A), when the rotary air cylinder 96 is rotated 180 degrees in the direction of arrow A, ie, clockwise, the reversing means 94 is in the state shown in FIG. 6 (B), and conversely in FIG. When the rotary air cylinder 96 is rotated 180 degrees in the direction, that is, counterclockwise, the reversing means 94 is in the state shown in FIG.

  The device D sucked by the suction pad 98 of the reversing means 94 is imaged by the imaging means 82 on the reversing means 94 and its position is detected. During this imaging, it is preferable to take an image while illuminating with blue illumination (not shown).

  The pick-up means 80 picks up the device D according to the detected position of the device D, and if it is a non-defective device, it transports it to the non-defective device case 104a and stores it in the accommodating portion of the non-defective device case 104a.

  If it is determined as a defective device, the defective device is picked up by the pickup means 80 and then transported to the defective product storage case 104b to be stored in the storage part of the defective product storage case 104b.

  According to the rectangular substrate dividing apparatus 2 of the above-described embodiment, the device D from which the protective tape T has been peeled is discharged on the charge removal table 84. Since only a part of the device D is sucked and held by the suction pad 88 on the charge removal table 84, effective charge removal is possible. Since a plurality of devices can be neutralized while rotating the neutralization table 84, work efficiency is improved.

  Further, since the reversing means 94 is provided to reverse the front and back of the device D after static elimination and can be housed in the device housing case with the back surface facing upward, there is an advantage that work in the subsequent mounting process is easy.

1 is an external perspective view of a rectangular substrate dividing device according to an embodiment of the present invention. It is a perspective view which shows an example of a rectangular substrate. It is a perspective view which shows a part of cutting charge area | region. It is a perspective view which shows a tape peeling charge area | region. It is a perspective view which shows a mode that a device is accommodated in a non-defective device case and a defective device case after neutralizing a device. It is a perspective view which shows a static elimination table and a reversing means.

Explanation of symbols

2 Dividing device 4 Rectangular substrate 6 Divided line 8 End material 10 Unnecessary end 12 Cutting area 14 Tape peeling area 16 Device accommodation area 22 Chuck table 24 Cutting blade 26 Cutting means 28 Cleaning means 42 Alignment means 51 Tape peeling mechanism 52 Temporary placement table 54 Pickup table 54a First table 54b Second table 76 Transport means 78, 82 Imaging means 80 Pickup means 84 Static elimination tables 88, 98 Suction pad 92 Vacuum suction source 94 Reversing means 96 Rotary air cylinder 104a Non-defective device Case 104b Defective device case

Claims (2)

A holding table for holding a rectangular substrate formed by attaching a protective tape on the back surface and a plurality of devices partitioned by a grid-like dividing line on the front surface, and the rectangular substrate held on the holding table on the dividing line Cutting means for cutting along and cutting into individual devices, a tape peeling mechanism for peeling off the protective tape from a rectangular substrate that has been cut and divided into individual devices, and each device is accommodated in a device case A rectangular substrate splitting device comprising pick-up means,
A static elimination table on which a plurality of devices can be placed; and
Transport means for transporting the device from which the protective tape has been peeled off by the tape peeling mechanism to the static elimination table;
Further comprising a static elimination means for neutralizing a device placed on the static elimination table,
The neutralization table has a plurality of suction portions that suck and hold a part of the back surface of the device, and a plurality of suction paths that transmit suction force from a suction source to the suction portion. apparatus. The device mounted on the static elimination table and further neutralized by the static elimination means is further provided with a reversing means for reversing the surface of the device by reversing it after being sucked and held from the upper surface,
2. The rectangular substrate dividing apparatus according to claim 1, wherein the pickup unit picks up the device inverted by the inversion unit from the inversion unit and accommodates the device in the device case.

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