JP2010141264A - Vacuum device, light source device, exposure device, and device manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a vacuum device, a light source device, an exposure device, and a device manufacturing method which can suppress the temperature changes in a chamber and reduce the pressure to vacuum atmosphere inside the chamber. <P>SOLUTION: The vacuum device connected the a chamber 15, in which a pressure is reduced to a vacuum atmosphere, includes a vacuum pump 34 that reduces the pressure in the chamber 15 or in a connecting part 36 that communicates with the inside of the chamber 15, and a radiation reducing unit 46 that is disposed on a predetermined surface near the vacuum pump 34 and reduces the thermal radiation from the vacuum pump 34 into the chamber 15, wherein the formation of the radiation reducing unit 46 depends on a first region, having a relatively high thermal radiation and a second region having a relatively low thermal radiation on the predetermined surface. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a vacuum apparatus for reducing the pressure in a chamber to a vacuum atmosphere, a light source apparatus and an exposure apparatus including the vacuum apparatus, an exposure apparatus including the light source apparatus, and a device manufacturing method using the exposure apparatus.

  Generally, in an exposure apparatus that transfers pattern images onto a substrate using EUV (Extreme Ultraviolet) light or EB (Electron Beam) as exposure light, the inside of the chamber is depressurized to a vacuum atmosphere in order to suppress the attenuation of the exposure light. A vacuum pump is provided. In such an exposure apparatus, for example, when a turbo molecular pump is applied as a vacuum pump, the turbo molecular pump generates heat when the moving blade blows gas molecules toward the fixed blade, so that the temperature is higher than the members in the chamber. It becomes. When a temperature difference is generated between the turbo molecular pump and the member in the chamber, the member in the chamber receives the thermal radiation from the turbo molecular pump, so that the deviation occurs from the preset temperature. There was a possibility of adversely affecting the operation. In particular, when a temperature change occurs in the optical element in the chamber, its optical characteristics are adversely affected, and it has been desired to avoid it. Therefore, normally, as described in Patent Document 1, the exposure apparatus is provided with a mechanism for suppressing changes in temperature due to heat radiation from the turbo molecular pump by the members in the chamber. Yes.

That is, in the exposure apparatus of this Patent Document 1, a vent for sucking and discharging air in the chamber by a turbo molecular pump is formed so as to communicate between the inside and outside of the chamber. Then, a shield disposed near the vent in the chamber so as to face the turbo molecular pump, and a radiating member disposed along the edge of the vent so as to surround the shield from the outer periphery. I have. The thermal radiation radiated from the turbo molecular pump into the chamber through the vent is partly reflected to the turbo molecular pump side by the shield with low emissivity, and the other part is on the radiation member side. And is absorbed by the refrigerant circulating in the radiation member. Therefore, the thermal radiation radiated from the turbo molecular pump hardly reaches the members in the chamber, and the temperature change is suppressed in the members in the chamber.
JP 2007-311621 A

 By the way, in the exposure apparatus of Patent Document 1, when the turbo molecular pump is driven, the radially outer region around the rotation axis of the moving blade has a longer rotation distance than the radially inner region, The collision frequency increases. Therefore, a temperature distribution that gradually increases in temperature from the center toward the radially outer side is formed on the rotor blade. As a result, the intensity of the heat radiation received by the radiating member from the rotor blades varies from region to region, and the temperature can be adjusted uniformly so that the entire region has a desired temperature difference with the members in the chamber. It was difficult. Therefore, in the radiation member, the region where the temperature difference with the member in the chamber is large may cause a temperature change in the member in the chamber by radiating strong heat radiation toward the member in the chamber. It was.

  The present invention has been made in view of such circumstances, and an object of the present invention is to suppress a change in temperature in the chamber and to reduce the pressure in the chamber to a vacuum atmosphere, a light source device, An object of the present invention is to provide an exposure apparatus and a device manufacturing method.

In order to solve the above-described problems, the present invention employs the following configurations corresponding to FIGS. 1 to 14 shown in the embodiment.
The vacuum device according to the first embodiment of the present invention is the vacuum device (27, 67) connected to the chamber (15, 28) in which the inside is a vacuum atmosphere. The vacuum pumps (34, 63) for reducing the pressure in the communication portions (36, 66) communicating with the (15, 28), and a predetermined surface near the vacuum pumps (34, 63), and the vacuum pump (34 , 63) and a radiation reduction section (46, 68, 73, 76) for reducing thermal radiation radiated into the chamber (15, 28), and the radiation reduction section (46, 68, 73, 76). ) Is formed in accordance with a first region where the heat radiation on the predetermined surface is relatively high and a second region where the heat radiation is relatively low.

  A light source device according to a second embodiment of the present invention is a light source device (12) that generates plasma and supplies light (EL) emitted from the plasma, and is a vacuum according to the first embodiment. The gist is that the apparatus (27, 67) is provided.

  An exposure apparatus according to a third embodiment of the present invention includes a light source device (12) according to the second embodiment and a first surface (Ra) using the light (EL) output from the light source device (12). ) And an optical projection system (18) capable of projecting an image of a predetermined pattern onto a second surface (Wa) different from the first surface (Ra). This is the summary.

  An exposure apparatus according to a fourth embodiment of the present invention includes an illumination optical system (16) capable of illuminating the first surface (Ra) with light (EL) output from a light source device (12), and a predetermined pattern. The gist of the invention is that it includes a projection optical system (18) capable of projecting an image onto a second surface (Wa) different from the first surface (Ra).

  A device manufacturing method according to a fifth embodiment of the present invention includes a step of exposing a substrate (W) using the exposure apparatus (11) according to the third embodiment or the fourth embodiment, and exposure. And a step of processing the substrate (W).

  In addition, in order to make this invention intelligible, it demonstrated and matched with the code | symbol of drawing shown to embodiment, It cannot be overemphasized that this invention is not limited to embodiment.

  According to the present invention, it is possible to provide a vacuum apparatus, a light source apparatus, an exposure apparatus, and a device manufacturing method capable of suppressing a change in the temperature in the chamber and reducing the pressure in the chamber to a vacuum atmosphere.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.
As shown in FIG. 1, the exposure apparatus 11 of the present embodiment uses extreme ultraviolet light, ie, EUV (Extreme Ultraviolet) light, which is a soft X-ray region having a wavelength of about 100 nm or less emitted from a light source device 12, as exposure light EL. 1 is provided with a chamber 15 installed on a floor 13 via a support 14. The inside of the chamber 15 is set to a vacuum atmosphere, and the degree of vacuum is high enough to perform exposure processing using EUV light in the chamber 15.

  In the chamber 15, a reflective reticle R having a predetermined pattern and a wafer W coated with a photosensitive material such as a resist on the surface are accommodated, and exposure light EL from the light source device 12 enters. It is like that. Thus, the exposure light EL that has entered the chamber 15 illuminates the reticle R held by the reticle stage 17 via the illumination optical system 16 disposed in the chamber 15, and the exposure light reflected by the reticle R. The EL irradiates the wafer W held on the wafer stage 19 via the projection optical system 18 disposed in the chamber 15.

  The illumination optical system 16 includes a housing 20 whose interior is set to a vacuum atmosphere, like the interior of the chamber 15. In the case 20, a plurality of reflection mirrors (not shown) that can reflect the exposure light EL incident from the light source device 12 into the case 20 are provided, and the exposure light reflected in order by each reflection mirror. The EL is incident on a reflecting mirror 22 for folding arranged in a lens barrel 21 described later, and the exposure light EL reflected by the reflecting mirror 22 is guided to a reticle R held on the reticle stage 17. A reflective layer, which is a multilayer film in which molybdenum (Mo) and silicon (Si) are alternately stacked, is formed on the reflective surface of each reflective mirror that constitutes the illumination optical system 16.

  The reticle stage 17 is disposed on the object plane side of the projection optical system 18, and has an electrostatic chuck 23 having an attracting surface 23a for electrostatically attracting the reticle R, and the reticle R in the Y-axis direction (left-right direction in FIG. 1). A reticle stage drive unit (not shown) that is moved by a predetermined stroke and a support stage 24 that supports the electrostatic chuck 23 are provided. The reticle stage drive unit is configured to be able to move the reticle R in the X-axis direction (direction orthogonal to the paper surface in FIG. 1) and the θz direction (rotation direction around the Z-axis). Note that, when the exposure light EL is illuminated onto the pattern surface Ra as the first surface of the reticle R, a rectangular illumination region extending in the X-axis direction is formed on a part of the pattern surface Ra.

  The projection optical system 18 is an optical system that reduces an image of a pattern formed by irradiating the pattern surface Ra of the reticle R with exposure light EL to a predetermined reduction magnification (for example, 1/4 times). Similar to the interior of the lens barrel 21 is provided with a lens barrel 21 whose interior is set to a vacuum atmosphere. A plurality of reflection mirrors 25 (six as an example, only one is shown in FIG. 1) are accommodated in the lens barrel 21. Then, the exposure light EL guided from the reticle R side, which is the object surface side, is sequentially reflected by each mirror 25 and guided to the irradiated surface Wa as the second surface of the wafer W held on the wafer stage 19. A reflective layer, which is a multilayer film in which molybdenum (Mo) and silicon (Si) are alternately stacked, is formed on the reflective surface of each mirror 25 (including the reflection mirror 22 for folding back).

  The wafer stage 19 includes an electrostatic chuck 26 having an attracting surface 26a that electrostatically attracts the wafer W, and a wafer stage driving unit (not shown) that moves the wafer W in a Y-axis direction with a predetermined stroke. The wafer stage driving unit is configured to be able to move the wafer W also in the X-axis direction and the Z-axis direction (vertical direction in FIG. 1). The wafer stage 19 incorporates a wafer holder (not shown) that holds the electrostatic chuck and a Z leveling mechanism (not shown) that adjusts the position of the wafer holder in the Z-axis direction and the tilt angles around the X and Y axes. ing. A vacuum device 27 for reducing the pressure in the chamber 15 to a vacuum atmosphere by sucking gas from the chamber 15 and discharging it to the outside at a position near the lens barrel 21 of the projection optical system 18 in the chamber 15. It is connected.

  When the exposure apparatus 11 of the present embodiment projects a pattern image onto the wafer W, the reticle R moves in the Y-axis direction every predetermined stroke by driving the reticle stage driving unit. Then, the illumination area on the reticle R moves from the −Y axis direction side of the pattern surface Ra of the reticle R along the + Y axis direction side (left side to right side in FIG. 1). That is, the pattern of the reticle R is scanned sequentially from the + Y direction side to the −Y direction side. Further, the wafer W moves in synchronization with the −Y direction at a speed ratio corresponding to the reduction magnification of the projection optical system 18 with respect to the movement of the reticle R in the Y-axis direction by driving the wafer stage driving unit. As a result, a pattern on the reticle R is formed in one shot region of the wafer W in a state where the pattern on the reticle R is reduced by a predetermined reduction magnification with the synchronous movement of the reticle R and the wafer W. When pattern formation on one shot area is completed, pattern formation processing on other shot areas of the wafer W is continuously performed.

Next, the light source device 12 will be described with reference to FIG.
The light source device 12 of the present embodiment is configured by a laser excitation type plasma light source device that emits EUV light having a wavelength of “5 to 50 nm (for example, 13.5 nm)” into the chamber 15 as exposure light EL. Specifically, as shown in FIG. 2, the light source device 12 includes a chamber 28 whose interior is set to a vacuum atmosphere. In the chamber 28, a plasma generation unit 29 that generates plasma PL, and a plasma A cylindrical condensing mirror 30 for condensing the exposure light EL emitted from the PL is accommodated. The plasma generating unit 29 includes a nozzle 31 that ejects a high-density xenon (Xe) gas as an EUV light generating substance (target) at a high speed, and a high-power laser 32 such as a YAG laser or an excimer laser using semiconductor excitation. I have. The laser light emitted from the high-power laser 32 is irradiated with the xenon gas emitted from the nozzle 31 to generate plasma PL, and EUV light is emitted from the plasma PL as exposure light EL. Then, the emitted exposure light EL enters the condensing mirror 30 through an opening on the incident side of the condensing mirror 30 (on the −Y direction side and the left side in FIG. 2). The high output laser 32 may be, for example, a CO ₂ laser.

  The condensing mirror 30 is formed such that the cross-sectional shape of each part in the optical axis direction of the incident exposure light EL forms an annular shape, and the exposure light EL can be reflected on the inner peripheral surface of the condensing mirror 30. A reflective layer is formed. Then, after the exposure light EL from the plasma PL is reflected by the inner peripheral surface of the condenser mirror 30, it is emitted from the exit side opening (+ Y direction side, right side in FIG. 2) of the condenser mirror 30. And output toward the illumination optical system 16.

Next, the vacuum device 27 will be described with reference to FIG.
As shown in FIG. 3, the vacuum apparatus 27 includes a turbo molecular pump 34 as a vacuum pump disposed on a support base 33 adjacent to the + Y direction side (right side in FIG. 3) of the support base 14 that supports the chamber 15. ing. The turbo molecular pump 34 is connected to the chamber 15 via a vibration attenuating portion 35 for attenuating vibrations generated by the turbo molecular pump 34 and a communication portion 36 having a hollow inside. The communication portion 36 extends vertically upward from an end portion on the −Z direction side, which is a connection portion with the vibration damping portion 35, and bends at a substantially right angle toward the −Y direction side that becomes the chamber 15 side at an intermediate position. And is connected to the chamber 15 so as to cover the exhaust port 37 formed in the side wall of the chamber 15 (the right side wall in FIG. 3).

  The turbo molecular pump 34 includes a main body case 38 in which a communication port 38a is formed on the upper wall surface on the + Z direction side, which is a connection portion with the vibration damping portion 35, and a −Z direction side (that is, a support base) in the main body case 38. 33, and the motor 39 has a rotating shaft 40 extending along the Z-axis direction. The turbo molecular pump 34 is provided with a plurality of stationary blades 41 supported by the inner peripheral wall of the main body case 38 and a plurality of blades 42 supported by the rotating shaft 40. When each moving blade 42 rotates around the rotation axis 43 that is the axis center of the rotating shaft 40 based on the drive of the motor 39, each moving blade 42 moves the communication portion 36 and the vibration damping portion 35 from the chamber 15. The gas molecules flowing into the main body case 38 are repelled and applied to the fixed blade 41, and finally the gas molecules are pushed out of the exposure apparatus 11 through an exhaust unit (not shown).

  The vibration damping part 35 includes a stainless steel bellows member 44 having a cylindrical shape, and the bellows member 44 is extendable in the Z-axis direction. The bellows member 44 is fixed so that the end portion on the −Z direction side covers the communication port 38a with respect to the upper wall surface of the main body case 38 in the turbo molecular pump 34, and the end portion on the + Z direction side is fixed. It is fixed to the end of the communication part 36 on the −Z direction side. Further, on the outer peripheral side of the bellows member 44, a rubber protection member 45 that protects the bellows member 44 in a state in which the bellows member 44 can be expanded and contracted in the Z-axis direction is provided. When the turbo molecular pump 34 is driven, the turbo molecular pump 34 supplies the gas from the chamber 15 through the exhaust port 37, the communication portion 36, the bellows member 44 of the vibration damping portion 35, and the communication port 38a. After being sucked in, it is exhausted out of the exposure apparatus 11.

  When the turbo molecular pump 34 is driven, thermal energy is generated in each rotor blade 42, particularly in a radially outer region centered on the rotation axis 43 of each rotor blade 42 due to heat generated when the gas molecules are bounced. Each is stored. If there is a member interposed between a portion of the moving blade 42 where heat energy is stored (particularly, a region outside the moving blade 42 in the radial direction) and a member (for example, a reflection mirror) disposed in the chamber 15. If there is nothing, there is a risk that the temperature of the reflecting mirror will rise due to thermal radiation from the moving blade 42. Therefore, in the present embodiment, the thermal radiation radiated linearly from the turbo molecular pump 34 is absorbed on the straight line connecting the turbo molecular pump 34 and the exhaust port 37 of the chamber 15 in the communication portion 36. A thermal radiation absorbing mechanism 46 is disposed as a radiation reducing unit that suppresses the thermal radiation from reaching the members in the chamber 15 through the exhaust port 37.

  As shown in FIG. 4 to FIG. 6, the heat radiation absorbing mechanism 46 includes a plurality of (four in this embodiment) substantially cylindrical heat radiation absorbing members 47 having different diameters. A multi-layer fin structure that is concentrically arranged so that the interval gradually decreases toward the outer side in the radial direction, with an axis 48 along the direction in which the end portion on the −Z direction side of 36 extends (that is, the Z-axis direction). An annular portion 49 is formed. Further, each heat radiation absorbing member 47 forms a gap 50 between the heat radiation absorbing members 47 adjacent to each other in the radial direction orthogonal to the axis 48 (that is, the X axis direction and the Y axis direction). These gaps 50 direct an air flow (gas flow) (indicated by a dotted line in FIG. 3) that has flowed into the communicating portion 36 from the inside of the chamber 15 as the turbo molecular pump 34 is driven toward the turbo molecular pump 34 side. Function as a fluidized part.

  That is, in the present embodiment, the annular portion 49 of the heat radiation absorbing mechanism 46 has a radially outer region from the turbo molecular pump 34 as a first region in which heat radiation from the turbo molecular pump 34 is relatively large. The area ratio occupied by the gap 50 in the plane orthogonal to the heat propagation direction of the thermal radiation from the turbo molecular pump 34 is larger than the radially inner region as the second region in which the thermal radiation is relatively small. It is configured.

  The heat propagation direction indicates the direction in which the heat radiation radiated from the turbo molecular pump 34 is propagated toward the members in the chamber 15 via the vibration damping unit 35 and the communication unit 36. Further, at the end of the communication part 36 on the −Z direction side, the heat propagation direction is defined as a direction extending linearly upward from the turbo molecular pump 34 along the direction in which the communication part 36 extends.

  Further, a radiation film made of a material having a high radiation rate is formed on the surface of each heat radiation absorbing member 47. Since the heat radiation radiated from the turbo molecular pump 34 is absorbed with high efficiency without being reflected toward the inner wall surface of the communication portion 36, the inner wall surface of the communication portion 36 is heated from the turbo molecular pump 34. Heating by radiation is suppressed. As a result, the heat radiation newly radiated from the communication portion 36 toward the members in the chamber 15 through the exhaust port 37 is extremely small as the temperature rises.

  On the outside of the annular portion 49 in the heat radiation absorbing mechanism 46, a substantially annular cooling portion 51 is disposed around the axis 48 so as to surround the annular portion 49 from the outer periphery. In addition, a pipe 52 (see FIG. 6) through which the refrigerant flows is formed in a hollow shape inside the cooling unit 51. In addition, two flat metal plates 53 extending in the radial direction are installed on the inner peripheral surface of the cooling unit 51 so as to intersect each other at right angles. In other words, each heat radiation absorbing member 47 constituting the annular portion 49 can be inserted through the two metal plates 53 in a state of being arranged along the X-axis direction and the Y-axis direction orthogonal to the axis 48. 54 is formed. Each metal plate 53 is connected to each heat radiation absorbing member 47 of the annular portion 49 by being inserted into each of the insertion holes 54. In addition, at the + Y direction end and the −Y direction end of the cooling unit 51, a refrigerant supply channel 56 extending from the cooling device 55 is piped through a communication hole 57 (see FIG. 6). Each is connected so as to communicate with the passage 52. And when a refrigerant | coolant flows into the pipe line 52 of the cooling part 51 via the refrigerant | coolant supply flow path 56 from the cooling device 55, heat propagates toward the refrigerant | coolant from the cooling part 51 via the inner wall surface of the pipe line 52. As a result, the cooling unit 51 is cooled. Subsequently, the annular portion 49 is cooled by the heat propagated from the annular portion 49 through the metal plates 53 to the cooling portion 51 cooled by the refrigerant.

  The refrigerant flowing from the cooling device 55 into the pipe line 52 of the cooling unit 51 through the refrigerant supply flow path 56 flows through the + X direction side pipe line and the −X direction side pipe line by substantially the same distance. Later, the refrigerant is recovered in the cooling device 55 via the refrigerant supply channel 56. Therefore, the flow path resistance of the pipe line 52 when the refrigerant flows on the + X direction side and the flow path resistance of the pipe line 52 when the refrigerant flows on the −X direction side are substantially uniform. Therefore, the flow resistance at the time of flowing through the one-side pipe 52 is relatively increased, so that the flow rate of the refrigerant is lowered and the cooling efficiency of the refrigerant is lowered. It is suppressed that the cooling efficiency of the part 49 varies for each region.

  Further, as shown in FIGS. 1 and 3, the communicating portion 36 is located at a position facing the turbo molecular pump 34 through the gap 50 between the thermal radiation absorbing members 47 from the turbo molecular pump 34. A heat sink 58 that absorbs heat radiation that has reached the inner wall surface is disposed. In the heat sink 58, a refrigerant channel 61 is formed in which the refrigerant supplied from the cooling device 59 via the refrigerant supply channel 60 flows. The refrigerant flowing in the refrigerant channel 61 causes the refrigerant to flow from the heat sink 58. Thermal energy is absorbed.

  Further, as shown in FIG. 1, the light source device 12 includes a turbo molecular pump 63 as a vacuum pump disposed on a support base 62 and a turbo molecular pump 63, similar to the vacuum device 27 described above. A vacuum device 67 configured by a communication portion 66 connected via the vibration damping portion 64 and connected to the chamber 28 so as to cover the exhaust port 65 is disposed. A thermal radiation absorption mechanism 68 as a radiation reduction unit that absorbs thermal radiation from the turbo molecular pump 63 is disposed in the communication unit 66. Further, a heat sink 69 that absorbs heat radiation from the turbo molecular pump 63 is disposed at a position facing the turbo molecular pump 63 in the communication portion 66. In the heat sink 69, a refrigerant flow path 72 through which the refrigerant supplied from the cooling device 70 via the refrigerant supply flow path 71 flows is formed, and the refrigerant flowing in the refrigerant flow path 72 is heated from the heat sink 69. It is designed to absorb energy.

Next, the operation of the exposure apparatus 11 configured as described above will be described below, particularly focusing on the operation when the inside of the chamber 15 is decompressed.
In the exposure apparatus 11, when the turbo molecular pump 34 is driven, when the moving blade 42 forms a temperature distribution that gradually increases in the radial direction from the center of the rotation axis 43, a thermal radiation absorption mechanism is formed from the moving blade 42. The intensity of the heat radiation radiated toward 46 varies depending on the region of the moving blade 42. At this time, the heat radiation absorbing mechanism 46 causes a temperature difference for each region because the intensity of heat radiation received from the moving blade 42 varies. As a result, intense heat radiation is radiated from the radially outer region where the temperature difference with the members in the chamber 15 is relatively large toward the members in the chamber 15. There was a risk of temperature changes in the member. For this reason, it has been desired that the heat radiation absorbing mechanism 46 be temperature-controlled uniformly throughout the entire region so as to cancel out variations in the intensity of heat radiation received from the moving blade 42.

  In this regard, in the exposure apparatus 11 of the present embodiment, in the communication portion 36, the position facing the region radially outside the moving blade 42 in the heat propagation direction of heat radiation (that is, the Z-axis direction) A radially outer region of the annular portion 49 where the gap 50 between the heat radiation absorbing members 47 is narrow is arranged. Further, in the communication portion 36, a gap 50 between the heat radiation absorbing members 47 is located at a position facing the radially inner region of the rotor blade 42 in the heat propagation direction of heat radiation (that is, the Z-axis direction). A radially inner region of the annular portion 49 that is large is disposed.

  The heat radiation radiated linearly from the region radially outside the rotor blade 42 along the Z-axis direction is densely arranged in a plane perpendicular to the heat propagation direction. Is absorbed with high efficiency. On the other hand, the heat radiation radiated linearly from the radially inner region of the rotor blade 42 along the Z-axis direction is scattered and disposed in a plane orthogonal to the heat propagation direction. Is absorbed with low efficiency.

  That is, the annular portion 49 of the heat radiation absorbing mechanism 46 has a diameter in the radially outer region so that the heat blocking rate against the heat radiation radiated from the moving blade 42 cancels the intensity variation of the heat radiation. It is comprised so that it may become larger than the area | region inside a direction. The heat cutoff rate indicates a ratio at which the thermal radiation absorption mechanism 46 blocks the thermal radiation radiated from the turbo molecular pump 34 from propagating toward the members in the chamber 15.

  Therefore, the heat radiation that has passed through the gap 50 between each heat radiation absorbing member 47 from the rotor blade 42 and reached the inner wall surface of the communication portion 36 has a uniform intensity distribution in a plane orthogonal to the heat propagation direction of the heat radiation. And is uniformly absorbed over the entire inner wall surface of the communication portion 36 cooled by the heat sink 58. Therefore, the heat sink 58 adjusts the temperature of the refrigerant supplied from the cooling device 59 so as to suppress new heat radiation from being emitted toward the members in the chamber 15 through the exhaust port 37. The temperature of the inner wall surface of the communication portion 36 can be uniformly adjusted.

  In addition, the annular portion 49 of the heat radiation absorbing mechanism 46 has a relatively high intensity of heat radiation received from the moving blade 42 in a radially outer region where the intensity of heat radiation received from the moving blade 42 is relatively large. The arrangement density of the heat radiation absorbing members 47 in the plane orthogonal to the heat propagation direction of the heat radiation is larger than the region on the radially inner side. Specifically, the arrangement density of the heat radiation absorbing member 47 is set so that the heat absorption amount per unit volume of the heat radiation absorbing member 47 becomes substantially constant according to the variation in the intensity of heat radiation received from the moving blade 42. It has been adjusted. Therefore, the heat radiation absorption mechanism 46 adjusts the temperature of the refrigerant supplied from the cooling device 55, so that the heat radiation that can cause a temperature change that adversely affects the operation of the members in the chamber 15 is generated in the chamber 15. It is possible to uniformly adjust the temperature of the entire region so as to suppress radiation toward the member.

  In the present embodiment, the light source device 12 also includes the vacuum device 67 similar to the vacuum device 27 described above, and therefore heat from the turbo molecular pump 63 that decompresses the communication portion 66 communicating with the chamber 28. Radiation can be absorbed by the heat radiation absorbing mechanism 68 and the heat sink 69.

Therefore, in this embodiment, the following effects can be obtained.
(1) In the present embodiment, the annular portion 49 of the heat radiation absorbing mechanism 46 is a radially outer region disposed at a position facing the radially outer region of the rotor blade 42 in the heat propagation direction of the heat radiation. However, the heat shielding rate against the heat radiation from the moving blade 42 becomes larger than the radially inner region disposed at a position facing the radially inner region of the moving blade 42 in the heat propagation direction of the heat radiation. It is configured as follows. For this reason, when the turbo molecular pump 34 is driven, even when the moving blade 42 forms a temperature distribution that gradually increases in temperature radially outward from the center of the rotation axis 43, the thermal radiation radiated from the moving blade 42 is used. Is absorbed by the annular portion 49 of the heat radiation absorbing mechanism 46 configured according to each region of the rotor blade 42 so as to cancel out variations in the intensity of heat radiation. For this reason, the annular portion 49 of the heat radiation absorbing mechanism 46 is orthogonal to the heat propagation direction so that the heat radiation radiated from the moving blade 42 does not affect the operation of the members in the chamber 15. It can be reduced uniformly in the plane. Therefore, even when the moving blade 42 undergoes a temperature change as the turbo molecular pump 34 is driven, the temperature of the member in the chamber 15 is suppressed from changing, and the inside of the chamber 15 is decompressed to a vacuum atmosphere. be able to.

  (2) In the present embodiment, the annular portion 49 of the heat radiation absorbing mechanism 46 is a radially outer region disposed at a position facing the radially outer region of the rotor blade 42 in the heat propagation direction of the heat radiation. However, the heat radiation in a plane perpendicular to the heat propagation direction of the heat radiation is larger than the radially inner region disposed at a position facing the heat radiation direction of the heat radiation with respect to the radially inner region of the rotor blade 42. It is comprised so that the arrangement | positioning density of the absorption member 47 may become large. Therefore, it is possible to easily realize a configuration in which the thermal radiation absorbing mechanism 46 absorbs thermal radiation so as to cancel out variations in the intensity of thermal radiation radiated from the moving blade 42 toward the thermal radiation absorbing mechanism 46.

  (3) In the present embodiment, the annular portion 49 of the heat radiation absorbing mechanism 46 has a substantially constant heat absorption amount per unit volume of the heat radiation absorbing member 47 according to variations in the intensity of heat radiation received from the moving blade 42. Thus, the arrangement density of the heat radiation absorbing member 47 in a plane orthogonal to the heat propagation direction of the heat radiation is adjusted. Therefore, the heat radiation absorbing mechanism 46 can uniformly adjust the temperature of the entire region so as to cancel out the variation in intensity of the heat radiation radiated from the moving blade 42 toward the heat radiation absorbing mechanism 46. Yes.

  (4) In the present embodiment, the annular portion 49 of the heat radiation absorbing mechanism 46 is arranged along the flow direction of the air flow flowing in the communicating portion 36 via the exhaust port 37 when the turbo molecular pump 34 is driven. A gap 50 is formed. Therefore, the flow resistance when the air flow passes through the thermal radiation absorption mechanism 46 is reduced, and even when the thermal radiation absorption mechanism 46 is arranged in the communication portion 36, the turbo molecular pump 34 is connected to the communication portion 36. It can be suppressed that the suction force (exhaust force) applied to the inside of the chamber 15 is reduced. Note that the thermal radiation absorption mechanism 46 in the present embodiment is configured such that the arrangement density or shape of the thermal radiation absorption member is different in a necessary region (for example, the first region or the second region). Does not reduce the suction force acting in the chamber 15.

  (5) In the present embodiment, the annular portion 49 of the heat radiation absorbing mechanism 46 is spaced from the heat radiation absorbing member 47 in the radial direction perpendicular to the axis 48 with the axis 48 extending in the direction in which the communicating portion 36 extends. And a multi-layer fin structure arranged concentrically with respect to each other. For this reason, the heat radiation absorbing member 47 is distributed and disposed in the entire cross section orthogonal to the axis 48 in the communication portion 36, and can absorb the heat radiation radiated from the turbo molecular pump 34 with high efficiency. it can.

  (6) In the present embodiment, the cooling part 51 of the heat radiation absorption mechanism 46 is formed with a conduit 52 through which the refrigerant supplied from the cooling device 55 flows. Therefore, the cooling unit 51 can exchange heat with the refrigerant through the inner wall surface of the pipe line 52 with high efficiency, and can quickly adjust the temperature.

  (7) In the present embodiment, the end of the turbo molecular pump 34 is connected to the communication unit 36 via the vibration damping unit 35. Therefore, even if vibration is generated from the turbo molecular pump 34, the vibration is almost absorbed by the expansion / contraction operation of the vibration damping unit 35. Therefore, it is possible to suppress the vibration based on the driving of the turbo molecular pump 34 from being transmitted to the chamber 15.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS. The second embodiment is different from the first embodiment in the configuration of the heat radiation absorption mechanism that absorbs the heat radiation radiated from the turbo molecular pump. Therefore, in the following description, parts different from those of the first embodiment will be mainly described, and the same or corresponding components as those of the first embodiment will be denoted by the same reference numerals and redundant description will be omitted. And

  As shown in FIGS. 7 and 8, the annular portion 74 of the thermal radiation absorbing mechanism 73 as the radiation reducing portion of the present embodiment has a plurality of (four in the present embodiment) substantially cylindrical radiations having different diameters. The heat radiation absorbing member 75 as a reducing member is centered on an axis 48 along the direction in which the end of the communication part 36 on the −Z direction side extends (that is, the Z-axis direction), and the like in a radial direction orthogonal to the axis 48. A multi-layer fin structure arranged concentrically so as to be spaced apart is formed. The annular portion 74 of the heat radiation absorbing mechanism 73 is the heat disposed radially outside of the heat radiation absorbing member 75 disposed so as to be adjacent to each other via the gap 50 in the radial direction with the axis 48 as the center. The radiation absorbing member 75 is configured to have a larger dimension in the heat propagation direction of heat radiation (that is, the Z-axis direction) than the heat radiation absorbing member 75 disposed on the radially inner side.

  Then, when the turbo molecular pump 34 is driven, if the moving blade 42 forms a temperature distribution that gradually increases in temperature radially outward from the center of the rotation axis 43, the region from the radially outer side of the moving blade 42 in the Z-axis direction The thermal radiation radiated along the straight line is absorbed by the thermal radiation absorbing member 75 configured so that the dimension along the heat propagation direction is relatively large. On the other hand, the thermal radiation radiated linearly from the radially inner region of the rotor blade 42 along the Z-axis direction is absorbed by the heat radiation so that the dimension along the heat propagation direction is relatively small. Absorbed by member 75.

  That is, the annular portion 74 of the heat radiation absorbing mechanism 73 has a relatively high intensity of heat radiation received from the moving blade 42 in a radially outer region where the intensity of heat radiation received from the moving blade 42 is relatively large. The heat capacity of the heat radiation absorbing member 75 that receives heat radiation is larger than that of the region on the radially inner side. Specifically, the thermal radiation absorbing mechanism 73 has a temperature change amount when the thermal radiation absorbing member 75 absorbs the thermal radiation according to the variation in the intensity of the thermal radiation received from the moving blade 42. The heat capacity of each heat radiation absorbing member 75 is set so as to be substantially constant in a plane orthogonal to the heat propagation direction. Therefore, the heat radiation absorption mechanism 73 adjusts the temperature of the refrigerant supplied from the cooling device 55, so that heat radiation that can cause a temperature change that adversely affects the operation of the members in the chamber 15 is absorbed by the heat radiation. The temperature of the entire region can be adjusted uniformly so as to suppress the radiation from the mechanism 73 toward the members in the chamber 15.

Therefore, in this embodiment, the following effects can be obtained in addition to the effects (1), (4), (5), (6), and (7) of the first embodiment.
(8) In the present embodiment, the annular portion 74 of the heat radiation absorbing mechanism 73 has an amount of change in temperature when absorbing heat radiation according to variations in the intensity of heat radiation received from the moving blade 42. The heat capacity of the heat radiation absorbing member 75 is set so as to be substantially constant in a plane orthogonal to the heat propagation direction. Therefore, the heat radiation absorbing mechanism 73 can uniformly adjust the temperature of the entire region so as to cancel out the variation in intensity of the heat radiation radiated from the moving blade 42 toward the heat radiation absorbing mechanism 73. Yes.

  (9) In the present embodiment, the annular portion 74 of the heat radiation absorbing mechanism 73 has heat received from the blade 42 in the radially outer region where the intensity of heat radiation received from the blade 42 is relatively large. The size of the heat radiation absorbing member 75 along the heat propagation direction of heat radiation is larger than that of the radially inner region where the intensity of radiation is relatively small. Therefore, the amount of change in temperature when the heat radiation absorption mechanism 73 absorbs the heat radiation is made uniform in the entire area according to the variation in the intensity of the heat radiation radiated from the moving blade 42 toward the heat radiation absorption mechanism 73. The structure to perform can be realized simply.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIGS. The third embodiment is different from the first embodiment and the second embodiment in the configuration of the heat radiation absorption mechanism that absorbs the heat radiation radiated from the turbo molecular pump. Therefore, in the following description, parts different from the first embodiment and the second embodiment will be mainly described, and the same or corresponding configurations as the first embodiment and the second embodiment are not included. The same reference numerals will be given and redundant description will be omitted.

  As shown in FIGS. 9 and 10, the heat radiation absorbing mechanism 76 as the radiation reducing unit of the present embodiment is a plurality of (four in the present embodiment) substantially semi-cylindrical radiation reducing members having different diameters. The thermal radiation absorbing member 77 is configured such that the interval gradually decreases toward the outer side in the radial direction around the axis 48 along the direction in which the end of the communication portion 36 on the −Z direction side extends (that is, the Z-axis direction). It has a circular arc part 78 forming a multi-layer fin structure concentrically. In the present embodiment, the arc portion 78 is located on the chamber 15 side (left side in FIG. 9) whose arc surface is on a straight line connecting the turbo molecular pump 34 and the exhaust port 37 in the communication portion 36. Are arranged to be.

  In the heat radiation absorbing mechanism 76, a substantially semi-circular cooling portion 79 is disposed outside the arc portion 78 so as to surround the arc portion 78 around the axis 48 from the outer periphery. In the cooling unit 79, a pipe line (not shown) through which the refrigerant flows is formed in a hollow shape. In addition, two flat metal plates 80 extending in the radial direction are installed on the inner peripheral surface of the cooling unit 79 so as to intersect each other at right angles. In other words, each heat radiation absorbing member 77 constituting the circular arc part 78 can be inserted in a state in which two metal plates 80 are arranged along the X-axis direction and the Y-axis direction orthogonal to the axis 48. (Not shown) is formed. And each metal plate 80 is connected with each heat radiation absorption member 77 of the circular arc part 78 by being inserted in each of these insertion holes. Further, the end of the cooling unit 79 on the + Y direction side is connected to the tip of the refrigerant supply channel 82 branched into a plurality (two in this embodiment) with the cooling device 81 side as the base end. In addition, a refrigerant supply channel 83 extending from the cooling device 81 is connected to an end portion on the −Y direction side of the cooling unit 79.

  When the turbo molecular pump 34 is driven, each heat radiation absorbing member formed so that the air flow (gas flow) flowing into the communication portion 36 from the chamber 15 via the exhaust port 37 is along the flow direction. 77 and the gap 84 between the heat radiation absorbing mechanism 76 and the right side wall surface of the communication portion 36 (that is, the wall surface facing the exhaust port 37 of the chamber 15 in the communication portion 36). Therefore, the flow resistance at the time when the air flow (gas flow) passes through the communication portion 36 is further reduced, so that the turbo molecular pump 34 can be operated even when the heat radiation absorbing mechanism 76 is arranged in the communication portion 36. A reduction in the suction force acting in the chamber 15 through the communication portion 36 is further suppressed.

  Further, the heat radiation absorbing mechanism 76 of the present embodiment includes the moving blade 42 in the region on the chamber 15 side (on the −Y direction side and on the left side in FIG. 9) at the −Z direction side end of the communication portion 36. The radially outer region of the arc portion 78 where the gap 50 between the heat radiation absorbing members 77 is narrowed at a position facing the radially outer region of the heat radiation in the heat propagation direction of heat radiation (that is, the Z-axis direction). Is arranged. In addition, the region on the chamber 15 side at the −Z direction end of the communication portion 36 faces the radially inner region of the rotor blade 42 in the heat propagation direction of heat radiation (that is, the Z-axis direction). A region on the radially inner side of the arc portion 78 in which the gap 50 between the heat radiation absorbing members 77 is wide is disposed at the position.

  That is, the arc portion 78 of the heat radiation absorbing mechanism 76 has a heat shielding rate against heat radiation that is linearly radiated from the rotor blade 42 in a direction parallel to the direction in which the gap 50 of the heat radiation absorbing member 77 extends. In order to reduce variation in strength, the radially outer region is configured to be larger than the radially inner region. Therefore, out of the heat radiation that has passed through the gap 50 between each heat radiation absorbing member 77 from the moving blade 42 and reached the inner wall surface of the communication portion 36, the end of the communication portion 36 on the −Z direction side is on the chamber 15 side. The thermal radiation that has passed vertically above the region along the direction in which the communicating portion 36 extends has a uniform intensity distribution in a plane orthogonal to the heat propagation direction. That is, the variation in intensity of the heat radiation radiated from the moving blade 42 is reduced in the process of passing through the heat radiation absorption mechanism 76. The heat sink 58 absorbs the heat radiation uniformly through the inner wall surface of the communication portion 36, so that new heat radiation is emitted toward the members in the chamber 15 through the exhaust port 37. It is possible to suppress.

  The thermal radiation radiated obliquely from the moving blade 42 in a direction intersecting with the direction in which the gap 50 of the heat radiation absorbing member 77 extends is a straight line connecting the moving blade 42 and the exhaust port 37 in the communicating portion 36. Since it is absorbed by the heat radiation absorbing member 77 located above, it does not reach the member in the chamber 15 through the exhaust port 37.

Therefore, in this embodiment, in addition to the effects (1) to (4), (6), and (7) of the first embodiment, the following effects can be obtained.
(10) In the present embodiment, the arc portion 78 of the heat radiation absorbing mechanism 76 is arranged at a position where the arc surface is on a straight line connecting the moving blade 42 and the exhaust port 37 in the communication portion 36. Yes. Further, a gap 84 is formed between the heat radiation absorbing mechanism 76 and the communication portion 36 through which an air flow flowing through the communication portion 36 passes through the exhaust port 37 when the turbo molecular pump 34 is driven. . Therefore, since the flow resistance when the air flow (gas flow) passes through the communication portion 36 is further reduced, the turbo-molecular pump 34 is arranged in accordance with the arrangement of the heat radiation absorbing mechanism 76 in the communication portion 36. Can be prevented from decreasing the suction force acting in the chamber 15 via the communication portion 36.

In addition, you may change the said embodiment into another embodiment as follows.
In the third embodiment, as shown in FIG. 11A, the arc portions 78 of the heat radiation absorbing mechanism 76 are equidistant so as to be adjacent to each other via the gap 50 in the radial direction around the axis 48. Among the heat radiation absorbing members 77 arranged in the heat radiation absorbing member 77, the heat radiation absorbing member 77 arranged on the radially outer side is more heat propagation direction of the heat radiation than the heat radiation absorbing member 77 arranged on the radially inner side ( That is, the dimension in the Z-axis direction) may be increased. Further, in this case, the heat radiation absorbing members 77 may be arranged such that the radial intervals around the axis 48 are different from each other.

  In the third embodiment, as shown in FIG. 11 (b), the arc portions 78 of the heat radiation absorbing mechanism 76 are equidistant so as to be adjacent to each other via the gap 50 in the radial direction centering on the axis 48. The heat radiation absorbing member 77 disposed radially outside of the heat radiation absorbing member 77 disposed in the shape of the heat radiation absorbing member 77 is bent along the heat propagation direction of heat radiation (or a dogleg shape). It may be configured.

  In this case, in the arc portion 78, the heat radiation absorbing member 77 disposed on the radially outer side has the heat propagation of the heat radiation to the moving blade 42 than the heat radiation absorbing member 77 disposed on the radially inner side. It is comprised so that the magnitude | size of the area | region which opposes in a direction may become large. The thermal radiation radiated linearly from the radially outer region of the rotor blade 42 along the Z-axis direction is absorbed with high efficiency by the thermal radiation absorbing member 77 disposed on the radially outer side. That is, the arc portion 78 of the heat radiation absorbing mechanism 76 cancels out the variation in the intensity of the heat radiation radiated from the moving blade 42 toward the heat radiation absorbing mechanism 76 by the heat shielding rate against the heat radiation from the moving blade 42. In this way, the radially outer region is configured to be larger than the radially inner region.

  Therefore, the variation in intensity of the heat radiation radiated from the moving blade 42 is reduced in the process of passing through the heat radiation absorption mechanism 76. Therefore, the heat sink 58 absorbs such heat radiation uniformly through the inner wall surface of the communication portion 36, so that new heat radiation is emitted toward the members in the chamber 15 through the exhaust port 37. It is possible to suppress.

  In addition, the arc portion 78 of the heat radiation absorbing mechanism 76 has a relatively high intensity of heat radiation received from the moving blade 42 in the radially outer region where the intensity of heat radiation received from the moving blade 42 is relatively large. The heat capacity of the heat radiation absorbing member 77 with respect to heat radiation is configured to be larger than that of the smaller radially inner region. Therefore, the arc portion 78 of the heat radiation absorbing mechanism 76 adjusts the temperature of the refrigerant supplied from the cooling device 81 to generate heat radiation that can cause a temperature change that adversely affects the operation of the members in the chamber 15. The temperature of the entire region can be uniformly adjusted so as to suppress the radiation from the heat radiation absorbing mechanism 76 toward the members in the chamber 15. In this case, the thermal radiation absorbing members 77 may be arranged such that the radial intervals around the axis 48 are different from each other.

  In the third embodiment, as shown in FIG. 11C, the arc portions 78 of the heat radiation absorbing mechanism 76 are equidistant so as to be adjacent to each other via the gap 50 in the radial direction centering on the axis 48. Among the heat radiation absorbing members 77 arranged in the heat radiation absorbing member 77, the heat radiation absorbing member 77 arranged outside in the radial direction is configured to have a curved shape (or curved shape) along the heat propagation direction of the heat radiation. May be. In this case, the arc portion 78 of the heat radiation absorbing mechanism 76 has a relatively high heat blocking rate and heat capacity against heat radiation in the radially outer region. Therefore, it is possible to suppress the radiation of heat that may cause a temperature change that adversely affects the operation of the members in the chamber 15 toward the members in the chamber 15.

  Further, the arc portion 78 of the heat radiation absorbing mechanism 76 is bent in the heat propagation direction of the heat radiation so as to adjust the heat blocking rate and the heat capacity against the heat radiation according to the intensity of the heat radiation radiated from the moving blade 42. You may comprise combining the heat radiation absorption member 77 which has a shape, and the heat radiation absorption member 77 which has a shape curved in the heat propagation direction of heat radiation.

  In the second embodiment, as shown in FIG. 12A, the annular portion 74 of the heat radiation absorbing mechanism 73 is equidistant so as to be adjacent to the axis 48 in the radial direction with the gap 50 in the center. Among the heat radiation absorbing members 75 disposed in the heat radiation absorbing member 75, the heat radiation absorbing member 75 disposed on the radially outer side may be configured to be bent along the heat propagation direction of the heat radiation.

  12B, the annular portion 74 of the heat radiation absorbing mechanism 73 has a shape in which the heat radiation absorbing member 75 disposed on the radially outer side is curved along the heat propagation direction of heat radiation. You may comprise.

  Further, the annular portion 74 of the heat radiation absorbing mechanism 73 is bent in the heat propagation direction of the heat radiation so as to adjust the heat blocking rate and the heat capacity against the heat radiation according to the intensity of the heat radiation radiated from the moving blade 42. You may comprise combining the heat radiation absorption member 75 which has a shape, and the heat radiation absorption member 75 which has the shape curved in the heat propagation direction of heat radiation.

  In each of the embodiments described above, the annular portions 49 and 74 (or the arc portions 78) of the heat radiation absorbing mechanisms 46, 73, and 76 are disposed on the radially outer side with the axis 48 as the center. , 77 may be configured such that the thickness dimension in the direction orthogonal to the heat propagation direction of heat radiation is larger than that of the heat radiation absorbing members 47, 75, 77 arranged radially inward.

  In this case, the annular portions 49 and 74 (or the circular arc portions 78) of the heat radiation absorbing mechanisms 46, 73, and 76 have a relatively large heat blocking rate and heat capacity against heat radiation in the radially outer region. Therefore, it is possible to suppress the radiation of heat that may cause a temperature change that adversely affects the operation of the members in the chamber 15 toward the members in the chamber 15.

  In each of the embodiments described above, the annular portions 49 and 74 (or the arc portions 78) of the heat radiation absorbing mechanisms 46, 73, and 76 are disposed on the radially outer side with the axis 48 as the center. , 77 may be configured such that the amount of reflection with respect to heat radiation is larger than that of the heat radiation absorbing members 47, 75, 77 arranged radially inside. In addition, the heat radiation absorbing member in each of the above embodiments may be a member that shields heat radiation emitted from the vacuum pump, and may be a member that reflects at least part of the heat radiation. Moreover, the heat sink in each said embodiment should just be a member which shields the heat radiation discharge | released from a vacuum pump, and may be a member which reflects at least one part of heat radiation.

  In this case, the annular portions 49 and 74 (or the arc portions 78) of the heat radiation absorbing mechanisms 46, 73, and 76 absorb heat radiation in a radially outer region where the intensity of heat radiation received from the moving blade 42 is large. The ratio of reflection to the moving blade 42 side without this becomes relatively high. That is, the annular portions 49 and 74 (or the arc portions 78) of the heat radiation absorbing mechanisms 46, 73, and 76 heat from the moving blades 42 so as to cancel out variations in the intensity of heat radiation radiated from the moving blades 42. The radiation absorption amount is adjusted. Therefore, the annular portions 49 and 74 (or the arc portions 78) of the heat radiation absorbing mechanisms 46, 73, and 76 adjust the temperature of the refrigerant supplied from the cooling devices 55 and 81, thereby operating the members in the chamber 15. The temperature is uniformly adjusted over the entire area so as to prevent the heat radiation that may cause a temperature change that has a negative effect on the heat from being radiated from the heat radiation absorption mechanisms 46, 73, 76 toward the members in the chamber 15. can do.

  In each of the above embodiments, a cryopump that condenses and traps gas on the surface thereof by exposing a cryogenic surface to a region communicating with the chamber 15 may be applied as the vacuum pump. In this case, when the cryopump becomes extremely cold as it is driven, heat radiation is radiated from the cryopump into the chamber 15 so that the temperature of the members in the chamber 15 is lower than the preset temperature. It can be.

  In this case, the heat radiation absorbing mechanisms 46, 73, 76 are arranged between the members in the chamber 15 and the cryopump, and the heat radiation radiated from the cryopump toward the heat radiation absorbing mechanisms 46, 73, 76 is obtained. A heating device that heats the heat radiation absorbing mechanisms 46, 73, and 76 is provided in place of the cooling devices 55 and 81 so as to cancel out variations in intensity. Then, the annular portions 49 and 74 (or the arc portions 78) of the heat radiation absorbing mechanisms 46, 73, and 76 are arranged in the entire region so as to have a desired temperature difference set in advance with the members in the chamber 15. The temperature can be adjusted uniformly, and the radiation of heat radiation from the heat radiation absorption mechanisms 46, 73, 76 toward the members in the chamber 15 can be suppressed.

In each of the above embodiments, the thermal radiation absorption mechanism may be configured to be disposed between a vacuum pump (eg, turbo molecular pump 34, etc.) and a vibration damping unit.
In each of the above embodiments, the vacuum pump may be arranged at a position facing the exhaust port of the chamber.

In each of the above embodiments, the plurality of heat radiation absorbing members may be arranged to have an annular multilayer structure, or may be arranged to have a polygonal multilayer structure or a lattice structure.
In each of the above embodiments, the light source device 12 emits light having a short wavelength such as ArF excimer laser (193 nm), F ₂ laser (157 nm), Kr ₂ laser (146 nm), Ar ₂ laser (126 nm), EB light, etc. A light source capable of output may be used. The light source device 12 amplifies the infrared or visible single wavelength laser light oscillated from the DFB semiconductor laser or fiber laser, for example, with a fiber amplifier doped with erbium (or both erbium and ytterbium). Alternatively, a light source capable of outputting a harmonic wave converted to ultraviolet light using a nonlinear optical crystal may be used.
In each of the above embodiments, the target is not limited to xenon, and for example, gaseous, solid, or liquid tin, or a compound containing the tin may be used.

  In each of the above embodiments, the exposure apparatus 11 manufactures a reticle or mask used in not only a microdevice such as a semiconductor element but also a light exposure apparatus, an EUV exposure apparatus, an X-ray exposure apparatus, and an electron beam exposure apparatus. Therefore, an exposure apparatus that transfers a circuit pattern from a mother reticle to a glass substrate or a silicon wafer may be used. The exposure apparatus 11 is used for manufacturing a display including a liquid crystal display element (LCD) and the like, and is used for manufacturing an exposure apparatus that transfers a device pattern onto a glass plate, a thin film magnetic head, and the like. It may be an exposure apparatus that transfers to a wafer or the like, and an exposure apparatus that is used to manufacture an image sensor such as a CCD. In addition, the exposure apparatus 11 is not limited to a reduction exposure type exposure apparatus, and may be, for example, an equal magnification exposure type or an enlargement exposure type exposure apparatus.

  Next, an embodiment of a microdevice manufacturing method using the device manufacturing method by the exposure apparatus 11 of the embodiment of the present invention in the lithography process will be described. FIG. 13 is a flowchart showing a manufacturing example of a micro device (a semiconductor chip such as an IC or LSI, a liquid crystal panel, a CCD, a thin film magnetic head, a micromachine, or the like).

  First, in step S101 (design step), function / performance design (for example, circuit design of a semiconductor device) of a micro device is performed, and pattern design for realizing the function is performed. Subsequently, in step S102 (mask manufacturing step), a mask (reticle R or the like) on which the designed circuit pattern is formed is manufactured. On the other hand, in step S103 (substrate manufacturing step), a substrate (a wafer W when a silicon material is used) is manufactured using a material such as silicon, glass, or ceramics.

  Next, in step S104 (substrate processing step), using the mask and substrate prepared in steps S101 to S104, an actual circuit or the like is formed on the substrate by lithography or the like, as will be described later. Next, in step S105 (device assembly step), device assembly is performed using the substrate processed in step S104. Step S105 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary. Finally, in step S106 (inspection step), inspections such as an operation confirmation test and a durability test of the microdevice manufactured in step S105 are performed. After these steps, the microdevice is completed and shipped.

FIG. 14 is a diagram illustrating an example of a detailed process of step S104 in the case of a semiconductor device.
In step S111 (oxidation step), the surface of the substrate is oxidized. In step S112 (CVD step), an insulating film is formed on the substrate surface. In step S113 (electrode formation step), an electrode is formed on the substrate by vapor deposition. In step S114 (ion implantation step), ions are implanted into the substrate. Each of the above steps S111 to S114 constitutes a pretreatment process at each stage of the substrate processing, and is selected and executed according to a necessary process at each stage.

  When the above-mentioned pretreatment process is completed in each stage of the substrate process, the posttreatment process is executed as follows. In this post-processing process, first, in step S115 (resist formation step), a photosensitive material is applied to the substrate. Subsequently, in step S116 (exposure step), the circuit pattern of the mask is transferred to the substrate by the lithography system (exposure apparatus 11) described above. Next, in step S117 (development step), the substrate exposed in step S116 is developed to form a mask layer made of a circuit pattern on the surface of the substrate. Subsequently, in step S118 (etching step), the exposed member other than the portion where the resist remains is removed by etching. In step S119 (resist removal step), the photosensitive material that has become unnecessary after the etching is removed. That is, in step S118 and step S119, the surface of the substrate is processed through the mask layer. By repeatedly performing these pre-processing steps and post-processing steps, multiple circuit patterns are formed on the substrate.

1 is a schematic block diagram that shows an exposure apparatus of a first embodiment. The schematic block diagram which shows the light source device of 1st Embodiment. Sectional drawing which shows the vacuum apparatus of 1st Embodiment. The perspective view which shows the thermal radiation absorption mechanism of 1st Embodiment. The top view which shows the thermal radiation absorption mechanism of 1st Embodiment. FIG. 6 is a cross-sectional view taken along line 6-6 in FIG. The top view which shows the heat radiation absorption mechanism of 2nd Embodiment. FIG. 8 is a cross-sectional view taken along line 8-8 in FIG. 7. The schematic block diagram which shows the thermal radiation absorption mechanism of 3rd Embodiment. The top view which shows the thermal radiation absorption mechanism of 3rd Embodiment. (A)-(c) is a schematic block diagram which shows the heat radiation absorption mechanism of another embodiment. (A), (b) is a schematic block diagram which shows the heat radiation absorption mechanism of another embodiment. The flowchart which shows the manufacture example of a device. The detailed flowchart regarding the board | substrate process in the case of a semiconductor device.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 11 ... Exposure apparatus, 12 ... Light source device, 15 ... Chamber, 16 ... Illumination optical system, 21 ... Projection optical system, 27 ... Vacuum apparatus, 28 ... Chamber, 34 ... Turbo molecular pump as a vacuum pump, 36 ... Communication part, DESCRIPTION OF SYMBOLS 43 ... Rotation axis, 46 ... Thermal radiation absorption mechanism as a radiation reduction part, 47 ... Thermal radiation absorption member as a radiation reduction member, 50 ... Gap as a fluidization part, 63 ... Turbo molecular pump as a vacuum pump, 66 ... Communication , 67... Vacuum device, 68... Heat radiation absorption mechanism as radiation reduction unit, 73... Heat radiation absorption mechanism as radiation reduction unit, 75... Heat radiation absorption member as radiation reduction member, and 76. Thermal radiation absorbing mechanism, 77... Thermal radiation absorbing member as radiation reducing member, EL... Exposure light as light, PL... Plasma, Ra... Patterned surface as first surface, W. Wa ... illuminated surface as the second surface.

Claims (18)

In a vacuum apparatus connected to a chamber having an internal vacuum atmosphere,
A vacuum pump for depressurizing the inside of the chamber or the communicating portion communicating with the chamber;
A radiation reducing unit that is disposed on a predetermined surface near the vacuum pump and reduces thermal radiation radiated from the vacuum pump into the chamber;
The vacuum device, wherein the radiation reducing unit is formed according to a first region where the thermal radiation on the predetermined surface is relatively high and a second region where the thermal radiation is relatively low. The vacuum apparatus according to claim 1, wherein
The said radiation reduction part has two area | regions from which the heat interruption rate which interrupts | blocks the said heat radiation differs from each other according to the said 1st area | region and the said 2nd area | region. The vacuum apparatus according to claim 1 or 2,
The vacuum apparatus according to claim 1, wherein the radiation reduction unit is configured such that the first region has a higher heat blocking rate for blocking the heat radiation than the second region. In the vacuum apparatus as described in any one of Claims 1-3,
The radiation reducing portion is formed with a fluidizing portion that causes the gas flowing into the communicating portion with the driving of the vacuum pump to flow toward the vacuum pump side,
Within the plane orthogonal to the heat propagation direction of the heat radiation, the area ratio of the fluidized portion occupying the first region is configured to be smaller than the area ratio of the fluidized portion occupying the second region. A vacuum apparatus characterized by that. The vacuum apparatus according to claim 4,
The said radiation reduction part is comprised including the some radiation reduction member arrange | positioned so that it may adjoin via the said flow part in the direction which cross | intersects the direction where the said flow part extends. The vacuum apparatus according to claim 5,
The radiation reduction unit may be configured such that a distance between the radiation reduction members via the flow portion in the first region is narrower than a distance between the radiation reduction members via the flow portion in the second region. It is comprised in the vacuum apparatus characterized by the above-mentioned. In the vacuum apparatus as described in any one of Claims 1-6,
The vacuum apparatus according to claim 1, wherein the radiation reduction unit is configured such that a heat capacity with respect to the heat radiation is larger on the first region side than on the second region side. In the vacuum apparatus as described in any one of Claims 1-6,
The vacuum apparatus according to claim 1, wherein the radiation reduction unit is configured such that a reflection amount with respect to the thermal radiation is larger on the first region side than on the second region side. The vacuum apparatus according to claim 7 or claim 8,
The vacuum apparatus according to claim 1, wherein the radiation reducing unit is configured such that a dimension of the heat radiation in a heat propagation direction is larger in the first region than in the second region. In the vacuum device according to any one of claims 1 to 9,
The vacuum apparatus according to claim 1, wherein the radiation reducing unit has a shape different between the first region side and the second region side. In the vacuum apparatus as described in any one of Claims 1-10,
The vacuum apparatus is a turbo molecular pump. The vacuum apparatus according to claim 11,
The first region is a region facing in the heat propagation direction of the heat radiation with respect to a radially outer region centered on a rotation axis in the turbo molecular pump,
The vacuum device according to claim 2, wherein the second region is a region facing in a heat propagation direction of the heat radiation to a radially inner region centering on a rotation axis in the turbo molecular pump. In the vacuum apparatus as described in any one of Claims 1-10,
The vacuum apparatus, wherein the vacuum pump is a cryopump. The vacuum apparatus according to claim 13,
The first region is a region facing in a heat propagation direction of the heat radiation with respect to a region close to a refrigerant flow path of a refrigerant that flows in the cryopump when the cryopump is driven,
The second region is a region facing in a heat propagation direction of the heat radiation with respect to a region separated from a refrigerant flow path of a refrigerant that flows in the cryopump when the cryopump is driven. Vacuum device. A light source device that generates plasma and supplies light emitted from the plasma,
A light source device comprising the vacuum device according to claim 1. The light source device according to claim 15;
An illumination optical system capable of illuminating the first surface with the light output from the light source device;
An exposure apparatus comprising: a projection optical system capable of projecting an image of a predetermined pattern onto a second surface different from the first surface. The vacuum apparatus according to any one of claims 1 to 14,
An illumination optical system capable of illuminating the first surface with light output from the light source device;
An exposure apparatus comprising: a projection optical system capable of projecting an image of a predetermined pattern onto a second surface different from the first surface. In the device manufacturing method,
A step of exposing a substrate using the exposure apparatus according to claim 16 or 17,
Processing the exposed substrate;
A device manufacturing method comprising:

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