JP2010140989A5 - - Google Patents
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- Publication number
- JP2010140989A5 JP2010140989A5 JP2008314074A JP2008314074A JP2010140989A5 JP 2010140989 A5 JP2010140989 A5 JP 2010140989A5 JP 2008314074 A JP2008314074 A JP 2008314074A JP 2008314074 A JP2008314074 A JP 2008314074A JP 2010140989 A5 JP2010140989 A5 JP 2010140989A5
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- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008314074A JP5275001B2 (en) | 2008-12-10 | 2008-12-10 | Manufacturing method of multilayer flexible wiring board |
| CN200910163346.2A CN101754571B (en) | 2008-12-10 | 2009-08-07 | Flexible multilayer wiring plate and its manufacturing method |
| TW98126739A TWI433630B (en) | 2008-12-10 | 2009-08-10 | Method for manufacturing multilayer flexible wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008314074A JP5275001B2 (en) | 2008-12-10 | 2008-12-10 | Manufacturing method of multilayer flexible wiring board |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010140989A JP2010140989A (en) | 2010-06-24 |
| JP2010140989A5 true JP2010140989A5 (en) | 2011-08-11 |
| JP5275001B2 JP5275001B2 (en) | 2013-08-28 |
Family
ID=42350890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008314074A Active JP5275001B2 (en) | 2008-12-10 | 2008-12-10 | Manufacturing method of multilayer flexible wiring board |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP5275001B2 (en) |
| CN (1) | CN101754571B (en) |
| TW (1) | TWI433630B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016197675A (en) * | 2015-04-06 | 2016-11-24 | 大日本印刷株式会社 | Flexible multilayer circuit board for LED element |
| EP3564800A1 (en) * | 2016-12-28 | 2019-11-06 | Fujikura Ltd. | Wiring body, wiring board and touch sensor |
| CN110662342B (en) * | 2018-06-28 | 2021-02-02 | 鹏鼎控股(深圳)股份有限公司 | Rigid-flex board and manufacturing method thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB863115A (en) * | 1956-08-02 | 1961-03-15 | Fairey Co Ltd | Improvements relating to aerofoils or sheet material impregnated with a synthetic resin and to methods of making such aerofoils |
| JP3680321B2 (en) * | 1994-06-28 | 2005-08-10 | 日立化成工業株式会社 | Manufacturing method of multilayer printed wiring board |
| US7018704B2 (en) * | 2001-09-28 | 2006-03-28 | Kaneka Corporation | Polyimide film for flexible printed board and flexible printed board using the same |
| JP4228677B2 (en) * | 2002-12-06 | 2009-02-25 | パナソニック株式会社 | Circuit board |
| JP4063082B2 (en) * | 2003-01-10 | 2008-03-19 | 日本電気株式会社 | Flexible electronic device and manufacturing method thereof |
| JP2007129153A (en) * | 2005-11-07 | 2007-05-24 | Cmk Corp | Rigid-flex multilayer printed wiring board |
-
2008
- 2008-12-10 JP JP2008314074A patent/JP5275001B2/en active Active
-
2009
- 2009-08-07 CN CN200910163346.2A patent/CN101754571B/en not_active Expired - Fee Related
- 2009-08-10 TW TW98126739A patent/TWI433630B/en not_active IP Right Cessation