JP2010137515A - Temporary fixing jig and assembly method for inkjet head using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a temporary fixing jig or the like for efficiently performing an assembly process and an adhesion process at the time when a substrate assembly is connected to an electrode of a positive part via an anisotropic conductive paste. <P>SOLUTION: The temporary fixing jig 3 maintains a state that the substrate assembly is mounted on the active part prior to the process of heating and bonding a film substrate of the substrate assembly fixed to a base plate 21 to the electrode of the active part with the anisotropic conductive paste applied thereon. The temporary fixing jig includes a setting part 30 whereby the active part is set in a positioning state and a pressing part 31 which maintains a state that the mounted substrate assembly is pressed to the active part on the setting part 30. The setting part 30 is attached freely removably to an assembling apparatus which mounts the substrate assembly onto the active part. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a temporary fixing jig for maintaining a state in which a substrate assembly is mounted on an active component when the substrate assembly is heated and bonded to an electrode of the active component via an anisotropic conductive paste (adhesive). The present invention relates to a method for assembling an inkjet head used.

Conventionally, a jig is known in which two metal plates (aluminum plate, stainless steel plate) having different thermal conductivities are brought into close contact with each other (see Patent Document 1).
This jig is disposed on the heater block, and a wiring board is set on the jig in the thermocompression bonding apparatus. And the to-be-bonded object piled up via the anisotropic conductive film is pressed with respect to the wiring board on a jig | tool with a heater tool, and it is heated and thermocompression-bonded.
JP-A-9-266233

However, in thermocompression bonding using an anisotropic conductive film or the like, it is necessary to apply heat at a relatively low temperature and maintain the pressed state for a certain period of time. In a thermocompression bonding apparatus using a jig (temporary fixing jig) as described above, the work efficiency is remarkably high because the wiring board and the object to be bonded cannot be set in the jig unless the thermocompression work is completed. There was a problem of getting worse.
In order to solve this problem, it is conceivable that a plurality of workpieces in a state where the wiring board and the object to be bonded are temporarily fixed are collectively loaded into the heating device. The problem of shifting is assumed.

  The present invention relates to a temporary fixing jig for efficiently performing an assembling process and an adhering process when a substrate assembly is electrically connected to an electrode of an active component through an anisotropic conductive paste, and an ink jet head using the same. It is an object to provide a method.

  The temporary fixing jig of the present invention is a state in which the substrate assembly is mounted on the active component prior to the step of heat bonding the film substrate of the substrate assembly fixed to the base plate to the electrode of the active component coated with the anisotropic conductive paste. A set part in which the active component is set in a positioning state, and a pressing part that maintains the mounted substrate assembly pressed against the active component on the set part. The set unit is detachably attached to an assembling apparatus that mounts the board assembly on the active component.

  According to this configuration, the temporary fixing operation of the active component and the board assembly using the temporary fixing jig can be performed on the assembly apparatus. As a result, the active component (temporarily fixed object) on which the board assembly is mounted can be set on the temporary fixing jig without taking it out of the assembling apparatus. It can be carried out to the apparatus which performs the next process (adhesion process). Therefore, the assembly process and bonding process of the board assembly and the active component can be performed efficiently.

  In this case, it is preferable that the pressing portion is configured to be detachable with respect to the set portion.

  According to this configuration, the substrate assembly can be mounted on the active component set in the set portion with the pressing portion removed. Thereby, it becomes easy to secure a space for the mounting operation in the assembling apparatus. That is, in the assembling apparatus, the pressing portion does not get in the way.

  Further, in this case, the pressing portion receives the jig frame, the pressing pin that contacts the center portion of the base plate, presses the film substrate against the electrode of the active component via the base plate, and presses the pressing pin. It is preferable to have a pressing spring that biases in the direction, and a pressing release mechanism that is attached to the jig frame and separates the pressing pin from the base plate against the pressing spring.

  According to this configuration, after the mounting operation is completed, the substrate assembly can be urged and pressed against the active component with a predetermined pressing force. Moreover, after finishing the heat bonding, the urging (pressing) can be easily released without removing the pressing portion. As a result, the temporary fixing can be surely performed, and the active component on which the board assembly is mounted can be easily taken out.

  Further, in this case, it is preferable that a space constituted by the set portion and the pressing portion is configured with a pair of clamp portion spaces facing the clamp portion of the assembling apparatus that sandwiches the substrate assembly.

  According to this configuration, the substrate assembly sandwiched between the clamp portions of the assembling apparatus can be mounted on the active component and temporarily fixed while being sandwiched between the clamp portions. Thus, when the temporary fixing operation is performed, the mounting position of the substrate assembly in the active component is not shifted, and thus the temporary fixing of the substrate assembly and the active component can be performed while maintaining high assembly accuracy.

  In this case, it is preferable that the base plate has a recess with which the pressing pin abuts.

  According to this configuration, the pressing pin fits into the recess, so that an accurate and uniform pressing force can be transmitted to the base plate, and stable heating bonding (main fixing) is possible.

  In this case, it is preferable that the substrate assembly is a head substrate of an inkjet head, and the active component is a head body of the inkjet head having a plurality of piezoelectric elements.

  According to this configuration, the head substrate can be efficiently assembled with high accuracy with respect to the head body.

  An ink jet head assembly method of the present invention is an ink jet head assembly method performed using the temporary fixing jig described above, and a set portion mounting step for mounting the set portion on the assembly device, A head main body setting step for setting the head main body in a positioning state, a mounting step for mounting the head substrate in a positioning state by an assembling apparatus on the set head main body, and a pressing portion on the set portion, and a head substrate on the head main body A jig assembling process for pressing the ink jet head to temporarily fix the inkjet head, and a bonding process for removing the temporarily fixing jig from the assembling apparatus and carrying it in the heating apparatus, and heating and bonding the head substrate to the head body with the heating apparatus; It is characterized by providing these.

  According to this configuration, the inkjet head (temporarily fixed object) can be set on the temporary fixing jig without taking it out of the assembling apparatus. It can be carried out to the apparatus which implements a process (heating adhesion process). Therefore, the assembly process of the board assembly and the active component and the heat bonding process can be performed efficiently.

  In this case, the mounting step includes a first step of mounting the head substrate sandwiched between the clamp portions on the head body, and a second step of releasing the clamping portion after the first step, and the jig assembly step includes: It is preferable to be performed between the first step and the second step.

  According to this configuration, the temporary fixing operation can be performed while being sandwiched between the clamp portions. Thereby, the mounting position of the substrate assembly in the active component does not shift during the jig assembling process, so that the ink jet head can be surely temporarily fixed with high assembling accuracy.

  Hereinafter, a temporary fixing jig of the present invention, a head assembly apparatus for an inkjet head using the temporary fixing jig, and an assembly method will be described with reference to the accompanying drawings. This temporary fixing jig conducts a head substrate formed by adhering to both surfaces of a base plate so that a pair of COF substrates (film substrates) having a pair of conducting portions face each other to a plurality of piezoelectric elements of an inkjet head. This is used for a part of the process. First, the ink jet head will be described.

  As shown in FIGS. 1 and 2, the inkjet head 1 includes a head main body 10 that constitutes a main part of the inkjet head 1, and a head substrate 2 that is connected to the head main body 10 and on which a drive circuit for the inkjet head 1 is formed. , Is composed of. The head body 10 includes a nozzle plate 11 in which a discharge nozzle 16 is formed, a flow path forming substrate 12 in which a plurality of pressure chambers 12 a are formed, a protective substrate 13 that protects the piezoelectric element 19, and a flow path forming substrate 12. The sealing substrate 14 that seals the common chamber 17 that communicates with the protective substrate 13 and the head case 15 that forms the exterior of the inkjet head 1 are stacked in order from the bottom. The head substrate 2 is incorporated so as to stand on the flow path forming substrate 12 through the head case 15 and the protective substrate 13. The head substrate 2 is formed by bonding a pair of COF substrates 22 (film substrates) on which a drive circuit 25 for driving the piezoelectric element 19 is mounted to both side surfaces of the base plate 21. The bent portion (conducting portion 27 described later) is electrically connected to an electrode (lead electrode 18 described later) on the flow path forming substrate 12.

  The nozzle plate 11 is formed of stainless steel or the like, and is bonded to one surface of the flow path forming substrate 12 with an adhesive or the like. In addition, a plurality of discharge nozzles 16 are formed at equal pitches on the nozzle surface of the nozzle plate 11, and the plurality of discharge nozzles 16 constitute two nozzle rows arranged in parallel to each other. Yes.

  In the flow path forming substrate 12, a plurality of pressure chambers 12 a partitioned by partition walls are arranged in parallel in two rows in the width direction so as to correspond to the plurality of discharge nozzles 16. A common chamber 17 for storing functional liquid supplied from a functional liquid supply device (not shown) is formed in a region on the outer side in the longitudinal direction of the flow path forming substrate 12, and each pressure chamber 12a and common chamber 17 are: Each communicates via a supply path 12b. The common chamber 17 communicates with the protective substrate 13 and receives the supply of the functional liquid from the functional liquid supply device via the functional liquid introduction port 15 a provided in the head case 15. Further, on the flow path forming substrate 12, head alignment marks are marked at the same positions as four substrate alignment marks M present in a conduction portion 27 of the COF substrate 22 described later.

  The protective substrate 13 is connected to the flow path forming substrate 12 via the elastic film 13a and the insulator film 13b in this order from the flow path forming substrate 12 side. A number of piezoelectric elements 19 corresponding to the plurality of pressure chambers 12a are formed on the insulator film 13b. A through-hole 13c penetrating in the thickness direction is formed in the protective substrate 13, and each piezoelectric element 19 is formed. A mechanism portion 13d for accommodating the element 19 is recessed inward. One end of the lead electrode 18 is connected to each piezoelectric element 19, and the other end of the lead electrode 18 extends so as to be exposed in the through hole 13 c. The other end portion of the lead electrode 18 is connected to the head substrate 2 (more precisely, the conductive portion 27 of each COF substrate 22). Then, by applying a voltage to the piezoelectric element 19 to deform the insulator film 13b (and the elastic film 13a), the functional liquid is introduced from the common chamber 17 using the volume change of the pressure chamber 12a, and the discharge nozzle 16 ejects functional droplets.

  The head case 15 is connected to the protective substrate 13 via a sealing substrate 14 including a sealing film 14a and a fixing plate 14b in this order from the protective substrate 13 side. The common chamber 17 is sealed only by the sealing film 14a. The head case 15 is provided with a head substrate holding hole 15b that communicates with a through hole 13c provided in the protective substrate 13, and the head substrate 2 is inserted into the head substrate holding hole 15b to be bonded with an adhesive (anisotropic). Is connected to the lead electrode 18 via a conductive conductive paste).

  Next, the head substrate 2 (substrate assembly) will be described with reference to FIGS. As described above, the head substrate 2 includes the base plate 21 that is a plate member made of stainless steel, and the pair of COF substrates 22 (Chip On Film) that are attached to both side surfaces of the base plate 21. The base plate 21 is formed by forming a concave notch 28 in the middle upper part of a substantially rectangular stainless steel plate. When the head substrate 2 is connected to the lead electrode 18, the notch 28 is a portion of the head substrate. 2 is pressed.

  Each COF substrate 22 includes a drive circuit 25 for driving the piezoelectric element 19, a drive circuit 25 mounted thereon, a flat substrate body 26 bonded to the base plate 21, and an “L” shape from the substrate body 26. And a conduction portion 27 that is bent (formed by bending). The pair of COF substrates 22 are arranged so that the front end portions of the respective conductive portions 27 face each other inward and along the lower end surface of the base plate 21, and are attached to both side surfaces of the base plate 21 with double-sided adhesive tape 23. Has been. A plurality (two each) of substrate alignment marks M for positioning each COF substrate 22 are formed in the longitudinal direction of each conductive portion 27 and at both tip portions. The pair of conductive portions 27 are abutted on the flow path forming substrate 12 and connected to the lead electrode 18 via an adhesive.

  Next, the temporary fixing jig 3 will be described with reference to FIGS. 4 and 5. The temporary fixing jig 3 includes a set unit 30 in which the head main body 10 is set in a positioning state, a pressing unit 31 that maintains a state in which the mounted head substrate 2 is pressed against the head main body 10 on the set unit 30; It is composed of

  The set part 30 is formed of a rectangular parallelepiped thick plate member, and the head body 10 is set so as to cross the set part 30 at the upper surface and the center thereof. A pair of head reference holes (not shown) are provided at both ends of the head body 10 in the longitudinal direction, and a portion where the head body 10 is set is fitted into the pair of head reference holes (not shown). A head reference pin (not shown) for projecting is provided. In addition, a plurality of suction holes 32 for vacuum-sucking the set head body 10 are formed in the center portion of the set portion 30 so as to penetrate in the thickness direction (see FIG. 5B). The plurality of suction holes 32 communicate with a vacuum suction device (not shown) when set in the head assembly device 4 described later. In the present embodiment, each reference pin is fitted into each reference hole, so that the head main body 10 is placed in a positioned state, and the head is passed through the plurality of suction holes 32 by driving the vacuum suction device. The main body 10 is fixed by applying a suction force.

  In addition, a pair of connection reference pins 33 used for positioning when connecting the pressing portion 31 on the set portion 30 are projected from both ends of one long side on the upper surface of the set portion 30 (FIG. 5 ( a)). Furthermore, hooks 34 for fixing the connection between the set portion 30 and the pressing portion 31 are provided on the longitudinal direction and both side surfaces of the set portion 30.

  The pressing portion 31 includes a “U” -shaped jig frame 35 that opens downward, a pressing member 36 that is slidably supported by the jig frame 35, and biases the pressing member 36 toward the set portion 30. And a pressing pin 38 connected to the center of the lower surface of the pressing member 36, and a pressing release mechanism 39 that pulls up the pressing member 36 against the pressing spring 37.

  A pair of pressing slide rails 351 extending in the Z-axis direction are provided on both inner side surfaces of the jig frame 35 so that the pressing member 36 is slidably engaged via pressing sliders 352 provided at both ends. Match. In addition, a pair of connection reference holes 353 are formed on the contact surface of the jig frame 35 with the set portion 30 so as to correspond to the pair of connection reference pins 33 (see FIG. 5B). When the connection reference pin 33 is fitted in each connection reference hole 353, the pressing portion 31 is mounted on the set portion 30 in a positioned state. Further, a locking mechanism 354 that engages with the hook 34 of the set portion 30 is provided on both outer side surfaces of the jig frame 35. With the pressing portion 31 placed on the set portion 30, the locking mechanism By engaging 354 with the hook 34, the set part 30 and the pressing part 31 are completely connected. The locking mechanism 354 and the hook 34 are configured by so-called patched locks.

  The pressing member 36 includes a pressing block 361 on which a pressing pin 38 is protruded, and a pair of slider joining members 362 provided in an “L” shape on both side surfaces of the pressing block 361. A pressing pin 38 protrudes from the center of the lower surface of the pressing block 361. Both side surfaces of the pair of slider joining members 362 are connected to the respective pressing sliders 352 and hold the pressing pins 38 (pressing blocks 361) so as to be slidable in the Z-axis direction. In addition, a pair of square spaces surrounded by the pressing block 361, each slider joining member 362, and the set portion 30 are formed as a clamp portion space 363 that the clamp portion 541 of the head assembly device 4 faces, as will be described in detail later. Yes.

  The lower end of the pressure spring 37 is in contact with the pressure block 361 and receives the top surface of the jig frame 35 to urge the pressure block 361 toward the set portion 30. The pressing pin 38 is a rod-shaped member that engages with the notch portion 28 of the head substrate 2 mounted on the head main body 10 on the set portion 30 and is pressed by the pressing spring 37 to press the head substrate 2. To do.

  The press release mechanism 39 is connected to a press block 361 at the lower end, and rotates to a rod 391 extending through the jig frame 35 in the Z-axis direction and a cam mounting portion of the rod 391 protruding from the upper surface of the jig frame 35. An eccentric cam 392 that is freely supported and a handle 393 for rotating the eccentric cam 392 are provided.

  The outer peripheral surface (cam surface) of the eccentric cam 392 is in contact with the upper surface of the jig frame 35, and the upper surface of the jig frame 35 functions as a cam follower. Further, a handle 393 protrudes from a part of the outer peripheral surface of the eccentric cam 392. The user holds the handle 393 and rotates the eccentric cam 392 by 180 ° to thereby press the pressing member via the rod 391. 36 can be moved up and down in the Z-axis direction. At the position of the handle 393 in FIG. 4, the pressing member 36 is lowered, and in this state, the pressing member 36 is urged downward by the pressing spring 37. At this time, the eccentric cam 392 is slightly lifted from the upper surface of the jig frame 35. On the other hand, when the handle 393 is rotated by 180 °, the eccentric cam 392 comes into contact with the upper surface of the jig frame 35, and then the pressing member 36 rises against the pressing spring 37, and the pressing to the head substrate 2 is released. . Reference numeral 394 in the figure denotes a chordal cam portion (a part of the cam surface) for regulating the position of the eccentric cam 392 rotated 180 °. When the eccentric cam 392 is rotated 180 °, this chordal shape The cam portion 394 comes into contact with the upper surface of the jig frame 35.

  Next, a head assembly device 4 (assembly device) of the inkjet head 1 using the temporary fixing jig 3 will be described with reference to FIGS. 6 and 7. The head assembly apparatus 4 includes a set unit 30 in which the head main body 10 is set and a built-in unit 41 that holds the head substrate 2, a substrate clamp unit 42 that clamps the head substrate 2 held in the built-in unit 41, and a built-in unit. 41 includes a first image recognition unit 43 provided alongside 41, a second image recognition unit 44 attached to the built-in unit 41, and a control unit 45 that performs overall control of the entire head assembly device 4. The built-in unit 41, the substrate clamp unit 42, and the first image recognition unit 43 are mounted on the machine base 46.

  The built-in unit 41 includes a jig fixing unit 51 on which the set unit 30 on which the head body 10 is set, a mask fixing unit 52 on which a glass mask 523 for positioning and setting the head substrate 2 is mounted, and a jig fixing unit. 51 and a Y-axis moving mechanism 53 that supports the mask fixing portion 52 slidably in the Y-axis direction.

  The jig fixing unit 51 includes a set table 511 for positioning and placing the set unit 30 on which the head main body 10 is set, and a fine adjustment mechanism 512 for minutely moving the set table 511 in each axial direction (X, Y, θ). And.

  An “L” -shaped degree 513 to which the set unit 30 is abutted is fixed to the set table 511, and the two sides of the set unit 30 are abutted against the 513 each time so that the set table 511 is set on the set table 511. The unit 30 is set in a positioned state.

  The fine adjustment mechanism 512 is a mechanism (micrometer head) for independently adjusting the deviations of the X-axis, Y-axis, and θ-axis of the set table 511, and includes three operation knobs 514 corresponding to each axis. It has been. Although not particularly shown, the set table 511 is mounted on a mechanism that can be moved minutely in each of the X-axis, Y-axis, and θ-axis, and the user manually rotates each operation knob 514, The set part 30 on the set table 511 can be precisely aligned (positioned) by being moved slightly in the axial direction.

  The mask fixing unit 52 includes a mask table 521 on which a glass mask 523 for positioning and setting the head substrate 2 is placed, and a pair of mask support frames 522 that support the mask table 521.

  A mask alignment mark is marked on the glass mask 523 at the same position as the four substrate alignment marks M of the head substrate 2 described above. The mask table 521 has a first lower camera opening (not shown) facing a pair of lower cameras 57 of the first image recognition unit 43 described later, and is set on the mask table 521 through the first lower camera opening. The mask alignment mark thus formed is recognized as an image. This recognition result is used as information for positioning when the head substrate 2 is mounted on the head body 10.

  The Y-axis moving mechanism 53 includes a Y-axis table 531 on which the jig fixing unit 51 and the mask fixing unit 52 are mounted, a pair of Y-axis guide rails 532 that support the Y-axis table 531 slidably in the Y-axis direction, A Y-axis mechanism unit 533 that linearly moves the Y-axis table 531 via the axis guide rail 532 and a Y-axis motor 534 that drives the Y-axis mechanism unit 533 are provided.

  The Y-axis motor 534 is composed of a stepping motor or the like, and reciprocally moves the jig fixing portion 51 and the mask fixing portion 52 in the Y-axis direction via the Y-axis mechanism portion 533 by forward and reverse rotation. In FIG. 6, the jig fixing portion 51 is placed on the near side, and the mask fixing portion 52 is placed on the far side. In FIG. 6, the position where the jig fixing portion 51 exists is the material supply position A1, and the position facing the substrate clamp portion 42 is the assembly position A2. Instead of the Y-axis motor 534 and the Y-axis mechanism 533, a linear motor may be used.

  A pair of lower cameras 57 included in the first image recognition unit 43 are arranged in the Y-axis direction at the assembly position A2 on the machine base 46 between the pair of Y-axis guide rails 532. Similar to the mask table 521, the table 531 is formed with a second lower camera opening 535 facing the pair of lower cameras 57. Needless to say, the pair of lower cameras 57 are calibrated to each other.

  As shown in FIG. 6, the substrate clamping unit 42 includes a substrate clamping mechanism 54 that holds the head substrate 2, a Z-axis moving mechanism 55 that supports the substrate clamping mechanism 54 slidably in the Z-axis direction, and a substrate clamping mechanism 54. And a bridge mount 56 that supports the Z-axis moving mechanism 55 above the built-in portion 41.

  The substrate clamping mechanism 54 includes a clamp portion 541 that holds the head substrate 2 so as to be sandwiched from both side surfaces, a pair of X-axis arm guide rails 542 that slidably support the clamp portion 541 in the Y-axis direction, and an X-axis arm An X-axis cylinder unit 543 that linearly moves the clamp portion 541 via the guide rail 542.

  The clamp portion 541 includes a pair of X-axis slide arms 545 slidably engaged with the pair of X-axis arm guide rails 542, a holding arm body 546 projecting from the lower end of each X-axis slide arm 545, and a holding arm A sandwiching portion 547 projecting from the free end portion of the main body 546 so as to face each other.

  The pair of X-axis slide arms 545 are arranged so as to cross the pair of X-axis arm guide rails 542 in the X-axis direction. Each X-axis slide arm 545 is slidably engaged with each X-axis arm guide rail 542 by a pair of X-axis slider portions 548 provided on the back surface thereof. Each clamping part 547 is in contact with both planar portions (both side surfaces) of the head substrate 2 to clamp the head substrate 2.

  The pair of X-axis cylinder units 543 is composed of a return air cylinder driven by air supplied from an air supply device (not shown). Note that a stepping motor or a linear motor may be used instead of the air cylinder.

  The substrate clamping mechanism 54 constitutes a centering mechanism that moves each clamp portion 541 toward and away from the center. With the pair of X-axis cylinder units 543, the clamp portions 541 (clamping portions 547) are moved inward, and the two flat portions (both side surfaces) of the head substrate 2 are sandwiched to hold the head substrate 2 in a vertical vertical posture. is doing.

  The Z-axis moving mechanism 55 includes a Z-axis table 551 on which the substrate clamping mechanism 54 is mounted, a pair of Z-axis guide rails 552 that support the Z-axis table 551 slidably in the Z-axis direction, and a Z-axis guide rail 552. A Z-axis cylinder unit 553 that linearly moves the Z-axis table 551. The Z-axis cylinder unit 553 is configured by a return air cylinder that is driven by air supplied from an air supply device, in the same manner as each X-axis cylinder unit 543 described above.

  The bridge mount 56 is placed on the machine base 46 so as to straddle the pair of Y-axis guide rails 532 so as not to hinder the movement of the jig fixing portion 51 and the mask fixing portion 52 in the Y-axis direction by the Y-axis moving mechanism 53. It stands upright and is supported by a pair of reinforcing ribs from the back.

  Although details will be described later, the substrate clamping unit 42 drives the Z-axis cylinder unit 553 to lower the head substrate 2 sandwiched by the substrate sandwiching mechanism 54 and is set by vacuum suction to the set unit on the set table 511. Mounted on the head body 10.

  The first image recognition unit 43 includes a pair of CCD-type lower cameras 57 and is arranged between the pair of Y-axis guide rails 532 in the Y-axis direction as described above. The head alignment mark and the substrate alignment mark M facing the first lower camera opening and the second lower camera opening 535 are imaged. Note that the imaging method is not limited to the CCD method, and other imaging methods such as a CMOS method may be used.

  Similar to the lower camera 57, the second image recognition unit 44 includes a pair of upper cameras 61 of the CCD system, a camera support frame 62 that supports each upper camera 61, and an X-axis camera table 63 that mounts the camera support frame 62. A pair of X-axis camera guide rails 64 that slidably support the X-axis camera table 63 in the X-axis direction, and an X-axis camera cylinder unit that directly moves the X-axis camera table 63 via each X-axis camera guide rail 64 65, and a camera mount 66 on which the above-described components are mounted. The X-axis camera cylinder unit 65 is composed of a backward-acting air cylinder driven by air supplied from an air supply device, as with the cylinder units 543 and 553 described above.

  The second image recognition unit 44 is attached to the side surface of the assembling unit 41 and slides the pair of upper cameras 61 in the X-axis direction so as to face the assembling position A2. Then, the pair of upper cameras 61 recognizes an image of the mask alignment mark (glass mask 523) or the head alignment mark (head body 10) facing the assembly position A2. The pair of upper cameras 61 are calibrated with each other, and the pair of upper cameras 61 and the pair of lower cameras 57 are also calibrated with each other.

  As shown in FIG. 8, the control unit 45 is composed of a personal computer (PC) (see FIG. 6), and controls the entire head assembly device 4 as a whole. The control unit 45 is input from a keyboard or the like. The device 71 is used to receive input of various parameters from the user, and the state of the head assembly device 4 is presented (notified) to the user by output means such as the display 72 and the speaker 73. The control unit 45 has an interface 74 for connecting each unit, a storage area that can be temporarily stored, a RAM 75 that is used as a work area for control processing, and various storage areas. ROM 76 for storing programs and control data, various data from each means, HDD 77 for storing programs for processing various data, and various data in accordance with programs stored in ROM 76 and HDD 77 A CPU 78 that performs arithmetic processing and a bus 79 that connects them to each other are provided.

  Next, a method for assembling the inkjet head 1 using the head assembling apparatus 4 will be described with reference to FIG. The assembly method of the inkjet head 1 includes a set part mounting step S1 in which the set part 30 of the temporary fixing jig 3 is disposed on the set table 511, and a member setting step S2 in which the head body 10 and the head substrate 2 are set at predetermined positions. An alignment step S3 for aligning the positions of the set head body 10 and the head substrate 2, a mounting step S4 for mounting the head substrate 2 in a positioning state by the head assembly device 4 on the set head body 10, and a set unit The pressing part 31 is attached to the head 30, the head assembly 2 is pressed against the head main body 10 to place the inkjet head 1 in a temporarily fixed state, and the temporary fixing jig 3 is detached from the head assembly apparatus 4. It is carried into a heating device (not shown) and the head substrate 2 is heated and bonded to the head body 10 by the heating device. A step S6, is Oita. In the following description, it is assumed that the temporary fixing jig 3 is already separated into the set part 30 and the pressing part 31. Further, it is assumed that a glass mask 523 is positioned and set on the mask table 521.

  First, the user positions and sets the set unit 30 by abutting 513 per degree at the material supply position A1 (set unit mounting step S1).

  Subsequently, the head main body 10 and the head substrate 2 are set (member setting step S2). The member setting step S2 includes a head main body setting step S21 for setting the head main body 10 in a positioning state on the set portion 30 and a head substrate setting step for setting the glass mask 523 on the mask table 521 in a positioning state. S22. The user sets the head main body 10 so as to match the head reference pin on the setting unit 30 (head main body setting step S21). Further, the head substrate 2 is set on the glass mask 523 (head substrate setting step S22). Note that either the head main body setting step S21 or the head main body setting step S21 may be the previous step.

  Next, the set head body 10 and the head substrate 2 are aligned (alignment step S3). In the alignment step S3, a lower camera recognition step S31 for recognizing each substrate alignment mark M and each mask alignment mark with the pair of lower cameras 57, and an image recognition for each head alignment mark and each mask alignment mark with the pair of upper cameras 61. The upper camera recognition step S32 and the alignment step S33 for aligning the head body 10 and the head substrate 2 from the recognition results of the lower camera recognition step S31 and the upper camera recognition step S32.

The user drives the Z-axis moving mechanism 55 to lower the substrate clamping mechanism 54 and clamps the head substrate 2 by the clamp portion 541. In this state, the controller 45 recognizes each substrate alignment mark M and each mask alignment mark with the pair of lower cameras 57 and stores the recognition result in the RAM 75. Thereafter, the Z-axis moving mechanism 55 is driven to raise the sandwiched head substrate 2.
Thereafter, the X-axis camera cylinder unit 65 is driven to bring the pair of upper cameras 61 to the installation position A2. Then, each mask alignment mark is image-recognized by the pair of upper cameras 61, and the recognition result is stored in the RAM 75. At this time, the coordinate information of each mark, which is the recognition result between the lower camera 57 and the upper camera 61, is acquired.
Thereafter, the Y-axis moving mechanism 53 is driven so that the head main body 10 on the set unit 30 faces the assembly position A2. Then, the user corrects the deviation between each head alignment mark of the head main body 10 displayed on the display 72 and the two previously stored recognition results by operating the fine adjustment mechanism 512 while confirming the display on the display 72. (Alignment) Note that the control unit 45 may perform this automatically. When the alignment step S3 is completed, the pair of upper cameras 61 are moved backward from the assembly position A2.

  Next, the head substrate 2 is mounted on the head body 10 in a positioned state (mounting step S4). The mounting step S4 includes a first step S41 for mounting the head substrate 2 sandwiched between the clamp portions 541 to the head body 10, and a second step S42 for releasing the clamping portion 541 after the first step S41. The jig assembling step S5 is performed between the first step S41 and the second step S42. First, the head substrate 2 temporarily retracted for the alignment step S3 is lowered again, and the head substrate 2 is pressed against the accurately positioned head body 10 (first step S41). In this state, the pressing portion 31 is mounted on the set portion 30 and the temporary fixing jig 3 is assembled (jig assembly step S5). At this time, the clamping arm main body 546 (the clamping part 547) still holds the head substrate 2, but the clamping arm main body 546 and the pressing part 31 are separated by the clamp part space 363 formed in the temporary fixing jig 3. The temporary fixing jig 3 can be assembled without interference. Then, the handle 393 is rotated and the head substrate 2 is pressed against the head body 10 by the pressing pin 38. Thereafter, the clamping portion 541 is released (second step S42).

  Next, the temporary fixing jig 3 is moved away from the head assembling apparatus 4 by moving to the material supply position A1. When a plurality of temporary fixing jigs 3 for temporarily fixing the head main body and the head substrate 2 are prepared in this way, the plurality of temporary fixing jigs 3 are collectively brought into a heating device (not shown). Thus, the head substrate 2 is heated and bonded to the head main body 10 (bonding step S6). In this embodiment, thermocompression bonding is completed at 80 ° C. for 30 minutes.

  According to the above configuration, the temporary fixing operation of the head main body 10 and the head substrate 2 using the temporary fixing jig 3 can be performed on the head assembly device 4. As a result, the head main body 10 on which the head substrate 2 is mounted can be set on the temporary fixing jig 3 without being taken out from the head assembling apparatus 4. Therefore, the bonding process S6 is performed while maintaining the assembling accuracy of the two at the time of mounting. It can be carried out to the apparatus which implements. Therefore, compared to the case where the jig assembling step S5 and the bonding step S6 are performed by one apparatus, the tact time is remarkably shortened, and the assembling step and the heat bonding step of the inkjet head 1 can be performed efficiently.

It is a disassembled perspective view of the inkjet head which concerns on this embodiment. It is sectional drawing of the inkjet head which concerns on this embodiment. It is the perspective view (a) and bottom view (b) of a head substrate. It is a side view of a temporary fixing jig. It is a perspective view of a temporary fixing jig. It is a perspective view of a head assembly apparatus. It is a perspective view of the built-in part of a head assembly apparatus. It is a block diagram of the control part of a head assembly apparatus. It is a flowchart explaining the assembly method of the inkjet head using a head assembly apparatus.

Explanation of symbols

  1: inkjet head, 2: head substrate, 3: temporary fixing jig, 10: head body, 19: piezoelectric element, 21: base plate, 30: set part, 31: pressing part, 35: jig frame, 37: pressing Spring, 38: Press pin, 39: Press release mechanism, 541: Clamp part

Claims (8)

Temporary fixing jig for maintaining the state where the substrate assembly is mounted on the active component prior to the step of heat-bonding the film substrate of the substrate assembly fixed to the base plate to the electrode of the active component coated with the anisotropic conductive paste Because
A set part in which the active component is set in a positioning state;
A pressing unit that maintains the mounted substrate assembly pressed against the active component on the set unit, and
The temporary fixing jig, wherein the set portion is detachably attached to an assembly apparatus that mounts the substrate assembly on the active component.   The temporary fixing jig according to claim 1, wherein the pressing portion is configured to be detachable with respect to the set portion. The pressing portion is
A jig frame,
A pressing pin that contacts the center of the base plate and presses the film substrate against the electrode of the active component via the base plate;
In response to the jig frame, a pressing spring that biases the pressing pin in the pressing direction;
The temporary fixing treatment according to claim 1, further comprising: a pressing release mechanism attached to the jig frame and configured to release the pressing pin from the base plate against the pressing spring. Ingredients.   The space formed by the set part and the pressing part includes a pair of clamp part spaces facing a clamp part of the assembly apparatus that sandwiches the substrate assembly. The temporary fixing jig according to any one of 3 above.   The temporary fixing jig according to claim 3 or 4, wherein the base plate has a recess with which the pressing pin abuts. The substrate assembly is a head substrate of an inkjet head;
6. The temporary fixing jig according to claim 2, wherein the active component is a head main body of an ink jet head having a plurality of piezoelectric elements. An assembly method of an ink jet head performed using the temporary fixing jig according to claim 6,
A set part mounting step of mounting the set part on the assembly device;
A head main body setting step for setting the head main body in a positioning state with respect to the set portion that is mounted,
A mounting step of mounting the head substrate in a positioning state by the assembly apparatus with respect to the set head body;
A jig assembling step of mounting the pressing portion on the set portion and pressing the head substrate against the head body to temporarily fix the inkjet head.
An adhesion step in which the temporary fixing jig is detached from the assembly device and carried into a heating device, and the head substrate is heated and bonded to the head body by the heating device. Assembling method of inkjet head. The mounting step includes a first step of mounting the head substrate sandwiched between the clamp portions on the head body;
After the first step, it comprises a second step of releasing the clamping portion,
The method of assembling an inkjet head according to claim 7, wherein the jig assembling step is performed between the first step and the second step.

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