JP2010137514A - Substrate assembly, inkjet head, and method and apparatus for constructing the substrate assembly - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate assembly or the like which can be simply assembled and can be constructed compact. <P>SOLUTION: The substrate assembly includes a base plate 21 with respective adhesion parts on both surfaces, and a pair of film substrates composed of continuity parts 27 bent in a "L" shape from flat substrate bodies 26. The substrate assembly has one pair of the film substrates attached to the base plate 21 through an arrangement process S1 in which one pair of the film substrates are arranged oppositely having each continuity part 27 directed inward with a predetermined interval, an insertion process S2 in which an insertion end surface of the base plate 21 is butted to the front end of each continuity part 27 in the interval, and an adhesion process S3 in which each substrate body 26 is bonded to the adhesion part by bringing each film substrate close to the inside. The front ends of one pair of continuity parts 27 are formed slantwise and complementary to each other in an extension direction of the insertion end surface. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate assembly, an inkjet head, a substrate assembly assembling method, and a substrate assembly assembling apparatus in which a pair of film substrates are assembled to a base plate so that the front end surfaces of a pair of conducting portions are opposed to each other with a minute gap. .

Conventionally, a flow path forming substrate in which a pressure generation chamber communicating with a nozzle opening for discharging ink droplets is formed, a piezoelectric element that causes a pressure change in the pressure generation chamber, and a protection having a piezoelectric element holding portion for protecting the piezoelectric element There is known a liquid ejecting head (inkjet head) including a substrate assembly that is provided on a substrate and a protective substrate and includes a driving IC for driving a piezoelectric element (see Patent Document 1).
In this substrate assembly, the driving IC is fixed on the driving wiring formed on the surface of the protective substrate by an adhesive mixed with a granular insulator, and the conductive portion of the driving IC and the driving wiring are formed of bonding wires. Connected by connection wiring.
JP 2004-148813 A

  However, in such a substrate assembly, since the driving IC is connected to the driving wiring on the protective substrate by a bonding wire, it is necessary to use a special device for performing wire bonding for assembling the liquid ejecting head. There has been a problem that it is difficult to reduce the size (high density) of the ejection head (protective substrate).

  It is an object of the present invention to provide a substrate assembly, an inkjet head, a substrate assembly assembling method, and a substrate assembly assembling apparatus that can be easily assembled and can be configured compactly.

  The substrate assembly of the present invention includes a base plate having adhesive portions on both sides, and a pair of film substrates including a flat substrate body and a conductive portion bent in an “L” shape from the substrate body. A step of disposing the pair of film substrates facing each other with the gap facing inward and a predetermined gap, and inserting the base plate relative to the gap to push the insertion end face of the base plate into the tip portion of the pair of conductive portions A pair of film substrates so that the tip surfaces of the pair of conducting portions are opposed to each other with a minute gap through the bonding step of bringing the pair of film substrates inward and bonding the substrate bodies to the bonding portions. The film substrate is assembled to the base plate, and the tip portions of the pair of conducting portions are respectively inclined and complementary in the extending direction of the insertion end surface. Made is characterized in that is.

By the way, in the above-described substrate assembly assembled through a plurality of processes, when the bonding operation (adhesion process) of the pair of film substrates is performed in a state where the insertion end surface of the base plate is not in contact with each conductive part, the tip of the conductive part Such a problem arises that the part abuts against the side surface of the base plate and the attaching operation is not successful, or a gap is generated between the insertion end surface of the base plate and the conductive portion of the attached film substrate. For this reason, it is necessary to abut the insertion end surface of the base plate against the tip portion of each conducting portion and perform the pasting operation using this portion as a guide. However, in this case, it is necessary to lengthen the protruding dimension of the pair of conducting portions, and in order to stick the pair of film substrates to the base plate so that the pair of conducting portions are opposed to each other with a minute gap, It is necessary to form the base plate thicker than necessary.
According to said structure, each conduction | electrical_connection part is made into a trapezoid shape by planar view by forming the front-end | tip part of a pair of conduction | electrical_connection part in the extending direction (longitudinal direction) of the insertion end surface of a baseplate diagonally and in a complementary shape, respectively. Forming. As a result, the wide portions of the respective conductive portions are shaped so as to greatly enter each other, so that a sufficient interval between each adhesive portion and each substrate body can be secured, and the insertion end surface of the base plate can be The guide function is not impaired by contact with the conducting portion. That is, the total dimension of the projecting dimensions of the pair of conductive portions can be shortened without impairing the guide function at the distal end portion of the pair of conductive portions, and the base plate can be formed thin accordingly. Therefore, the substrate assembly itself can be reduced in size.

  In this case, it is preferable that each adhesion part is comprised with the double-sided adhesive tape.

  According to this configuration, the pair of film substrates (substrate body) can be easily and firmly bonded to the base plate.

  Moreover, in this case, it is preferable that each conducting portion has a plurality of alignment marks for positioning each film substrate at the tip portion.

  According to this configuration, the pair of film substrates can be assembled to the base plate while accurately positioning. Thereby, the substrate assembly can be manufactured with a predetermined accuracy.

  The ink jet head of the present invention is characterized in that the head substrate connected to the head driving unit is constituted by any one of the above-described substrate assemblies.

  According to this configuration, a small inkjet head using a miniaturized substrate assembly can be configured.

  In this case, the head driving unit and the head substrate are preferably connected by an anisotropic conductive adhesive.

  According to this configuration, even if the substrate assembly is downsized, the head drive unit and the head substrate can be connected easily and appropriately, and a special device for wire bonding is required as in the prior art. And not.

  In this case, the head driving unit is preferably a plurality of piezoelectric elements corresponding to a plurality of ejection nozzles.

  According to this configuration, it is possible to discharge droplets with high accuracy as in the past while reducing the size.

  The substrate assembly assembling method of the present invention is the above-described method for assembling a substrate assembly, wherein the conductive portions of the pair of film substrates are arranged inwardly and facing each other with a predetermined gap therebetween, Inserting the base plate relative to each other, recognizing the image of the insertion step of abutting the insertion end face of the base plate against the tip portion of the pair of conductive portions, and a plurality of alignment marks of the conductive portions opposed to each other, based on the recognition result And a bonding step of bringing a pair of film substrates inward and bonding each substrate body to each bonding portion.

  An assembly apparatus for a substrate assembly according to the present invention is the assembly apparatus for a substrate assembly described above, and holds a pair of film substrates facing each other so that each conductive portion faces inward, and holds the pair of films held Image recognition of arrangement / movement means for moving the substrates in the direction of contact with each other, insertion means for holding the base plate and inserting the held base plate relative to the gap, and a plurality of alignment marks of each conductive part arranged opposite to each other Image recognition means, and control means for controlling the placement / movement means and the insertion means, and the control means places the conductive portions of the pair of film substrates facing each other inward with a predetermined gap therebetween. An arrangement operation and an insertion operation in which the base plate is relatively inserted into the gap, and the insertion end surface of the base plate is abutted against the distal end portions of the pair of conductive portions. A plurality of alignment marks of each conductive portion arranged opposite to each other are image-recognized, and based on the recognition result, a bonding operation of bringing a pair of film substrates inward and bonding each substrate body to each bonding portion is performed. Features.

  According to these configurations, since the base plate can be formed thin, the substrate assembly can be configured thin. Moreover, a pair of film board | substrate can be assembled | attached to a baseplate in the state positioned correctly. Thereby, a small and highly accurate substrate assembly can be constituted.

  Hereinafter, a head substrate (substrate assembly) and an assembly apparatus to which the head substrate assembly method of the present invention is applied will be described with reference to the accompanying drawings. This head substrate is configured by adhering to both surfaces of a base plate so that a pair of COF substrates (film substrates) having a pair of conducting portions are opposed to each other, and a plurality of piezoelectric elements corresponding to the discharge nozzles of the inkjet head. It is connected to the element (head drive unit). First, the ink jet head will be described.

  As shown in FIGS. 1 and 2, the inkjet head 1 protects a nozzle plate 11 in which a discharge nozzle 16 is formed, a flow path forming substrate 12 in which a plurality of pressure chambers 12 a are formed, and a piezoelectric element 19. A protective substrate 13, a flow path forming substrate 12, a seal substrate 14 that seals the common chamber 17 that communicates with the protective substrate 13, and a head case 15 that forms the exterior of the inkjet head 1 are stacked in order from the bottom. Has been. In addition, the head substrate 2 is incorporated in the inkjet head 1 so as to penetrate the head case 15 and the protective substrate 13 and to stand on the flow path forming substrate 12. The head substrate 2 is formed by bonding a pair of COF substrates 22 (film substrates) on which a drive circuit 25 for driving the piezoelectric element 19 is mounted to both side surfaces of the base plate 21. The bent portion (conducting portion 27 described later) is electrically connected to an electrode (lead electrode 18 described later) on the flow path forming substrate 12.

  The nozzle plate 11 is formed of stainless steel or the like, and is bonded to one surface of the flow path forming substrate 12 with an adhesive or the like. In addition, a plurality of discharge nozzles 16 are formed at equal pitches on the nozzle surface of the nozzle plate 11, and the plurality of discharge nozzles 16 constitute two nozzle rows arranged in parallel to each other. Yes.

  In the flow path forming substrate 12, a plurality of pressure chambers 12 a partitioned by partition walls are arranged in parallel in two rows in the width direction so as to correspond to the plurality of discharge nozzles 16. A common chamber 17 for storing functional liquid supplied from a functional liquid supply device (not shown) is formed in a region on the outer side in the longitudinal direction of the flow path forming substrate 12, and each pressure chamber 12a and common chamber 17 are: Each communicates via a supply path 12b. The common chamber 17 communicates with the protective substrate 13 and receives the supply of the functional liquid from the functional liquid supply device via the functional liquid introduction port 15 a provided in the head case 15.

  The protective substrate 13 is connected to the flow path forming substrate 12 via the elastic film 13a and the insulator film 13b in this order from the flow path forming substrate 12 side. A number of piezoelectric elements 19 corresponding to the plurality of pressure chambers 12a are formed on the insulator film 13b. A through-hole 13c penetrating in the thickness direction is formed in the protective substrate 13, and each piezoelectric element 19 is formed. A mechanism portion 13d for accommodating the element 19 is recessed inward. One end of the lead electrode 18 is connected to each piezoelectric element 19, and the other end of the lead electrode 18 extends so as to be exposed in the through hole 13 c. The other end portion of the lead electrode 18 is connected to the head substrate 2 (more precisely, the conductive portion 27 of each COF substrate 22). Then, by applying a voltage to the piezoelectric element 19 to deform the insulator film 13b (and the elastic film 13a), the functional liquid is introduced from the common chamber 17 using the volume change of the pressure chamber 12a, and the discharge nozzle 16 ejects functional droplets.

  The head case 15 is connected to the protective substrate 13 via a sealing substrate 14 including a sealing film 14a and a fixing plate 14b in this order from the protective substrate 13 side. The common chamber 17 is sealed only by the sealing film 14a. The head case 15 is provided with a head substrate holding hole 15b that communicates with a through hole 13c provided in the protective substrate 13, and the head substrate 2 is inserted into the head substrate holding hole 15b to be bonded with an adhesive (anisotropic). Is connected to the lead electrode 18 via a conductive conductive paste).

  Next, the head substrate 2 (substrate assembly) will be described with reference to FIGS. As described above, the head substrate 2 includes the base plate 21 that is a plate member made of stainless steel, and the pair of COF substrates 22 (Chip On Film) that are attached to both side surfaces of the base plate 21. Although not shown in detail, the base plate 21 is formed by forming a concave notch in the middle upper part of a substantially rectangular stainless steel plate. When the head substrate 2 is connected to the lead electrode 18, a portion of this notch is formed. Thus, the head substrate 2 is pressed.

  Each COF substrate 22 includes a drive circuit 25 for driving the piezoelectric element 19, a drive circuit 25 mounted thereon, a flat substrate body 26 bonded to the base plate 21, and an “L” shape from the substrate body 26. And a conduction portion 27 that is bent (formed by bending). The pair of COF substrates 22 are arranged so that the front end portions of the respective conductive portions 27 face each other inward and along the lower end surface of the base plate 21, and are attached to both side surfaces of the base plate 21 with double-sided adhesive tape 23. Has been. The pair of conductive portions 27 are abutted on the flow path forming substrate 12 and connected to the lead electrode 18 via an adhesive.

  The tip portions of the pair of conductive portions 27 are formed in an oblique and complementary shape in the extending direction (longitudinal direction) of the insertion end surface 24 of the base plate 21 (the bottom surfaces of FIGS. 3C and 3D). reference). In addition, a pair of COF set holes 28 that engage with a pair of COF set pins 55 projecting from each holding arm 52 described later are formed in the longitudinal direction and both ends of the substrate body 26 (both are shown in the figure). 5), a plurality of (two each) alignment marks M for positioning each COF substrate 22 are formed in the longitudinal direction of each conductive portion 27 and at both tip portions.

  Here, the assembly procedure of the head substrate 2 will be briefly described. First, the pair of COF substrates 22 are arranged opposite to each other with the conductive portions 27 facing inward (see FIG. 3A), and the base plate 21 is relatively inserted into the gap between the COF substrates 22 (FIG. 3B). )reference). Then, in a state where the insertion end surface 24 of the base plate 21 is abutted against the distal end portions of the pair of conducting portions 27 (see FIG. 3C), each COF substrate 22 is moved inward (to the base plate 21 side) and each substrate body 26 is moved. Is bonded to each double-sided adhesive tape 23 (see FIG. 3D). Thus, the head substrate 2 is completed in which the pair of COF substrates 22 are assembled to the base plate 21 so that the tip surfaces of the pair of conducting portions 27 face each other with a minute gap.

  As described above, the pair of conductive portions 27 plays a role as a guide when each COF substrate 22 is attached (at the time of bonding). For this reason, in order to abut the insertion end face 24 against the tip portion of each conduction part 27 while providing a gap where each double-sided adhesive tape 23 of the base plate 21 and each substrate body 26 do not contact each other, The dimensions need to take into account the gap and the guide portion. If the base plate 21 is not thick, the conductive portions 27 of the pair of COF substrates 22 assembled to the base plate 21 come into contact with each other.

  Therefore, in the present embodiment, the right portion is solved by forming the tip portions of the pair of conducting portions 27 in an oblique and complementary shape in the extending direction (longitudinal direction) of the insertion end surface 24 of the base plate 21. ing. Specifically, each conduction portion 27 is formed in a trapezoidal shape in plan view with one width being narrow and the other being wide in the longitudinal direction, and each COF substrate 22 has a pair of conduction portions 27 having a width. Are arranged so that the narrow side and the wide side face each other (see the bottom of FIG. 3C). Then, the pair of COF substrates 22 are bonded to the base plate 21 with the end surfaces of the pair of conducting portions 27 obliquely spaced in the longitudinal direction (see the bottom surface in FIG. 3D). That is, even if the total size of the protruding dimensions of the pair of conductive portions 27 is reduced, the conductive portion 27 on the wide side is disposed at a position entering the center side of the base plate 21, so that the guide function is impaired. In addition, each double-sided adhesive tape 23 and each substrate body 26 can be sufficiently spaced from each other, and the insertion end face 24 of the base plate 21 can be in reliable contact. Thereby, since the base plate 21 can be formed thinly, the head substrate 2 can be reduced in size.

  Next, the assembly apparatus 3 for the head substrate 2 will be described with reference to FIGS. The assembling apparatus 3 includes a substrate incorporating unit 30 that holds a pair of COF substrates 22, a plate incorporating unit 31 that holds the base plate 21, an image recognition unit 32 (image recognition means) provided along with the substrate incorporating unit 30, and an assembling apparatus. 3 and a control unit 33 (control means) that performs overall control.

  As shown in FIG. 4, the board built-in unit 30 is configured to be capable of sliding the width adjusting mechanism 34 (arrangement / moving means) that separates the pair of COF boards 22 arranged opposite to each other and the width adjusting mechanism 34 in the Y-axis direction. A supporting Y-axis moving mechanism 35 and a machine base 36 on which the width adjusting mechanism 34 and the Y-axis moving mechanism 35 are placed are provided.

  As shown in FIG. 5, the width adjusting mechanism 34 has a pair of width adjusting arm portions 41 that dispose (set) the pair of COF substrates 22 with the conductive portions 27 facing inward, and the width adjusting arm portions 41. A pair of X-axis guide rails 42 slidably supported in the X-axis direction, an X-axis mechanism part 43 for centering the pair of width-adjusting arm parts 41 via the X-axis guide rails 42, and an X-axis mechanism part And an X-axis motor 44 for driving 43.

  The width adjustment arm portion 41 is a pair of X-axis slide arms 51 that are slidably engaged with a pair of X-axis guide rails 42 and a pair of COF substrates 22 facing each other with the mutual conduction portions 27 facing inward. Holding arm 52 and a fine adjustment mechanism 53 that moves one of the holding arms 52 in the Y-axis direction.

  The pair of X-axis slide arms 51 are arranged so as to be aligned in the X-axis direction, and extend so as to cross the pair of X-axis guide rails 42. Each X-axis slide arm 51 is slidably engaged with each X-axis guide rail 42 by a pair of X-axis sliders 54 provided on the back surface thereof.

  Each of the pair of holding arms 52 is a member formed in a rectangular parallelepiped, and each holding arm 52 is an end of each X-axis slide arm 51 extending in the longitudinal direction so that one portion protrudes from the X-axis guide rail 42. It is fixed to the site. Each holding arm 52 is disposed so that the other end faces thereof are opposed to each other, and a plurality of suction holes (not shown) communicating with a vacuum suction device (not shown) are formed on the opposing end faces of each holding arm 52. ) Is formed. In addition, a pair of COF set pins 55 that project into a pair of COF set holes 28 formed in the COF substrate 22 (substrate body 26) protrude from the opposing end surfaces of the holding arms 52. In the present embodiment, by engaging each COF set hole 28 with each COF set pin 55, it can be temporarily fixed in a positioned state. Then, by driving the vacuum suction device and applying a suction force to each COF substrate 22 (the substrate body 26 thereof) through the plurality of suction holes, the COF substrate 22 can be stably held on each holding arm 52. ing.

  The fine adjustment mechanism 53 manually rotates the operation knob 56 to move the other holding arm 52 minutely in the Y-axis direction with reference to one holding arm 52, and the Y-axis direction of the pair of COF substrates 22. This adjusts the positional deviation. Thereby, the pair of COF substrates 22 set by vacuum suction can be aligned (positioned) with high accuracy.

  The X-axis motor 44 is composed of a stepping motor or the like, and by rotating forward, moves the pair of width-adjusting arm portions 41 via the X-axis mechanism portion 43 so that the COF substrates 22 are mutually connected. Move inward. Further, by reversing, the pair of width-adjusting arm portions 41 are moved away from each other via the X-axis mechanism portion 43, and the COF substrates 22 are pulled away from each other in the outward direction. Instead of the X-axis motor 44 and the X-axis mechanism unit 43, a linear motor may be used.

  As shown in FIG. 4, the Y-axis moving mechanism 35 includes a Y-axis table 45 (stepping motor or the like) on which a width adjusting mechanism 34 is mounted, and a pair of Y-axis that slidably supports the Y-axis table 45 in the Y-axis direction. A guide rail 46, a Y-axis mechanism portion 47 that moves the Y-axis table 45 in the Y-axis direction via the Y-axis guide rail 46, and a Y-axis motor 48 that drives the Y-axis mechanism portion 47 are provided. The Y-axis moving mechanism 35 reciprocates the width adjusting mechanism 34 between a material supply position A1 (front side in FIG. 4) and an alignment position A2 (back side in FIG. 4) of the pair of COF substrates 22.

  On the machine base 36 between the pair of Y-axis guide rails 46, a pair of CCD cameras 70 (described later) included in the image recognition unit 32 are fixedly arranged so as to be aligned in the Y-axis direction. The table 45 is formed with a camera opening 49 through which the pair of CCD cameras 70 face.

  The substrate built-in unit 30 moves the pair of COF substrates 22 held by the pair of holding arms 52 onto the camera openings 49 facing the pair of CCD cameras 70. Then, from the image recognition result of the alignment mark M formed on each conductive portion 27, the pair of COF substrates 22 is positioned (aligned) in the Y-axis direction. Thereafter, each COF substrate 22 is centered by the width adjusting mechanism 34 and bonded to the base plate 21 inserted between the pair of COF substrates 22.

  As shown in FIG. 6, the plate built-in unit 31 includes a plate clamping mechanism 37 that holds the base plate 21, a Z-axis movement mechanism 38 that supports the plate clamping mechanism 37 slidably in the Z-axis direction, a plate clamping mechanism 37, and And a bracket base 39 that supports the Z-axis moving mechanism 38 above the board mounting portion.

  The plate clamping mechanism 37 includes a clamping arm portion 61 that holds the base plate 21 so as to be sandwiched from both sides in the longitudinal direction, a pair of Y-axis arm guide rails 62 that slidably support the clamping arm portion 61 in the Y-axis direction, A Y-axis cylinder unit 63 that linearly moves the clamping arm portion 61 via the shaft arm guide rail 62.

  The sandwiching arm portion 61 includes a pair of Y-axis slide arms 64 that are slidably engaged with the pair of Y-axis arm guide rails 62, a sandwiching arm body 65 that protrudes from the lower end of each Y-axis slide arm 64, and sandwiching A sandwiching portion 66 projecting from the free end of the arm body 65 so as to face each other.

  The pair of Y-axis slide arms 64 are arranged so as to be aligned in the Y-axis direction, and the upper part thereof extends so as to cross the pair of Y-axis arm guide rails 62. Each Y-axis slide arm 64 is slidably engaged with each Y-axis arm guide rail 62 by a pair of Y-axis sliders provided on the back surface thereof. Each clamping part 66 clamps the base plate 21 in contact with the longitudinal direction of the base plate 21 and both side surfaces (edge portions).

  The pair of Y-axis cylinder units 63 is constituted by a backward-acting air cylinder driven by air supplied from an air supply device (not shown).

  Similar to the width adjusting mechanism 34, the plate clamping mechanism 37 is composed of a centering mechanism that moves the respective clamping arms 61 in a detachable manner toward the center. With the pair of Y-axis cylinder units 63, the holding arms 61 (holding portions 66) are moved inward, and the longitudinally opposite side surfaces (edge portions) of the base plate 21 are sandwiched to hold the base plate 21 in a horizontal vertical posture.

  The Z-axis moving mechanism 38 includes a Z-axis table 68 on which the plate clamping mechanism 37 is mounted, a pair of Z-axis guide rails 67 that slidably support the Z-axis table 68 in the Z-axis direction, and a Z-axis guide rail 67. And a Z-axis cylinder unit 69 for moving the Z-axis table 68 directly.

  The Z-axis cylinder unit 69 is configured by a backward-acting air cylinder driven by air supplied from an air supply device, like the above-described Y-axis cylinder units 63. Note that a stepping motor or a linear motor may be used instead of the air cylinder. Although details will be described later, the plate built-in portion 31 drives the Z-axis cylinder unit 69 to move the base plate 21 sandwiched by the plate sandwiching mechanism 37 in the Z-axis direction, thereby providing a predetermined gap in the width adjusting mechanism 34. It is inserted into the gap between the pair of COF substrates 22 that have been set.

  As shown in FIG. 4, the image recognition unit 32 is a pair of CCD cameras 70, and is arranged side by side in the Y-axis direction between the pair of Y-axis guide rails 46 as described above. The alignment mark M of the pair of COF substrates 22 facing the camera opening 49 of the table 45 is imaged. Note that each image recognition unit 32 is not limited to the CCD camera 70, and an imaging unit of another imaging method such as a CMOS camera may be used.

  As shown in FIG. 7, the control unit 33 is composed of a personal computer (PC) (see FIG. 4), and controls the entire assembly apparatus 3 as a whole. The control unit 33 is an input device such as a keyboard. 71 is used to receive various parameters from the user, and the state of the assembling apparatus 3 is presented (notified) to the user by output means such as the display 72 and the speaker 73. The control unit 33 includes an interface 74 for connecting the units 30, 31, and 32, a storage area that can be temporarily stored, a RAM 75 that is used as a work area for control processing, and various storage areas. ROM 76 for storing control programs and control data, HDD 77 for storing various data from each means, and for storing programs for processing various data, and programs stored in ROM 76 and HDD 77 In accordance with the above, a CPU 78 that performs arithmetic processing on various data and a bus 79 that connects them to each other are provided.

  Next, a method for assembling the head substrate 2 using the assembling apparatus 3 will be described with reference to FIG. In the method of assembling the head substrate 2, an arrangement step S1 in which the conductive portions 27 of the pair of COF substrates 22 face each other inward and with a predetermined gap therebetween, and the base plate 21 is relatively inserted into the gap. Then, the insertion step S2 in which the insertion end face 24 of the base plate 21 is abutted against the tip portion of the pair of conductive portions 27, and the plurality of alignment marks M of the respective conductive portions 27 arranged to face each other are image-recognized, and a pair is determined based on the recognition result. The COF substrate 22 is moved inward, and the substrate main body 26 is bonded to each double-sided pressure-sensitive adhesive tape 23. In the placement step S1 and the bonding step S3, the board built-in portion 30 is used, and in the insertion step S2, the plate built-in portion 31 is used. In the following description, it is assumed that the base plate 21 is already clamped by the plate clamping mechanism 37 of the plate built-in portion 31.

  First, the user drives the Y-axis moving mechanism 35 to move the width adjusting mechanism 34 to the material supply position A1. Then, after temporarily fixing the COF substrate 22 to the COF set pins 55 so that the respective conductive portions 27 are directed downward and facing each other, the vacuum suction device is driven to drive the pair of COF substrates 22. Is set by vacuum suction (arrangement step S1). At this time, it is preferable that the holding arms 52 be separated widely at the material supply position A1 so that the temporary fixing operation can be easily performed.

  After the COF substrate 22 is set by vacuum suction, the Y-axis moving mechanism 35 is driven and the width adjusting mechanism 34 is moved to the alignment position A2. Then, the width adjusting mechanism 34 is driven to move each COF substrate 22 so as to form a predetermined gap. The size of the gap is such that the double-sided adhesive tape 23 affixed to both sides of the base plate 21 does not contact the COF substrate 22 when the base plate 21 is inserted in the subsequent insertion step S2. Since this gap varies depending on the thickness of the base plate 21 and the maximum width of the conducting portion 27, it is assumed that it is obtained in advance by calculation and input as a parameter to the control portion 33 via the input device 71.

  Next, the Z-axis moving mechanism 38 is driven, and the sandwiched base plate 21 is moved in the Z-axis direction and inserted into the gap formed by the pair of COF substrates 22 (insertion step S2). The movement distance in the Z-axis direction in the insertion step S2 is set in advance, and the insertion end surface 24 of the base plate 21 comes into contact with the conduction portion 27 by moving by the set distance.

  After the insertion end surface 24 of the base plate 21 comes into contact with each conduction portion 27, the user operates the fine adjustment mechanism 53 while confirming the alignment mark M of each conduction portion 27 displayed on the display 72, thereby each COF substrate 22. The positional deviation in the Y-axis direction is corrected (aligned). Note that the control unit 33 may perform this automatically.

  After the alignment is completed, the width adjusting mechanism 34 is driven to move each COF substrate 22 so as to sandwich the inserted base plate 21 from both sides, and each substrate body 26 is adhered to each double-sided adhesive tape 23. (Adhesion process S3). Then, the control unit 33 determines whether or not the displacement of the COF substrates 22 in the Y-axis direction is within a predetermined range after the COF substrates 22 are bonded to the base plate 21. It is assumed that the allowable range of deviation is input as a parameter to the control unit 33 via the input device 71 in advance.

  According to the above configuration, since the tip portions of the pair of conducting portions 27 are formed in an oblique and complementary shape in the extending direction (longitudinal direction) of the insertion end surface 24 of the base plate 21, each double-sided adhesive tape 23 and the substrate main body 26 can be sufficiently spaced, and the insertion end surface 24 of the base plate 21 can easily come into contact with the conductive portions 27. Therefore, the head substrate 2 can be reduced in size while securing the contact portion of each conduction portion 27. Accordingly, it is possible to reduce the size of the inkjet head 1 using the same. In the inkjet head 1 of the present embodiment, the miniaturized head substrate 2 and each piezoelectric element 19 (lead electrode 18) are simply and appropriately connected by an adhesive (anisotropic conductive paste). Therefore, it is possible to prevent problems such as a short circuit of the connecting portion and destruction of the drive circuit 25.

It is a disassembled perspective view of the inkjet head which concerns on this embodiment. It is sectional drawing of the inkjet head which concerns on this embodiment. It is the side view and bottom view explaining the assembly procedure of the head substrate which concerns on this embodiment. It is a perspective view of the assembly apparatus which concerns on this embodiment. It is a perspective view of the board | substrate built-in part of an assembly apparatus. It is a perspective view of the plate built-in part of an assembling apparatus. It is a block diagram of the control part of an assembly apparatus. It is a flowchart explaining the assembly method of a head board | substrate.

Explanation of symbols

  1: inkjet head, 2: head substrate, 19: piezoelectric element, 21: base plate, 22: COF substrate, 23: double-sided adhesive tape, 26: substrate body, 27: conducting portion, M: alignment mark

Claims (8)

A base plate having an adhesive part on each side, and a pair of film substrates including a flat substrate body and a conductive portion bent in an “L” shape from the substrate body,
An arrangement step in which the pair of film substrates face each other with the conductive portions facing inward and with a predetermined gap therebetween, and the base plate is relatively inserted into the gap, and the insertion end face of the base plate is An insertion step of abutting against a tip portion of the pair of conduction portions, and an adhesion step of bringing the pair of film substrates inward and bonding the substrate bodies to the adhesion portions, and then leading ends of the pair of conduction portions A substrate assembly in which the pair of film substrates are assembled to the base plate so that the surfaces face each other with a minute gap;
The substrate assembly, wherein tip portions of the pair of conducting portions are formed obliquely and in a complementary shape in the extending direction of the insertion end surface.   The substrate assembly according to claim 1, wherein each of the bonding portions is made of a double-sided adhesive tape.   The substrate assembly according to claim 1, wherein each of the conductive portions has a plurality of alignment marks for positioning the film substrates at the tip portion.   An ink-jet head, wherein a head substrate connected to the head drive unit is constituted by the substrate assembly according to any one of claims 1 to 3.   The inkjet head according to claim 4, wherein the head driving unit and the head substrate are connected by an anisotropic conductive adhesive.   The inkjet head according to claim 4, wherein the head driving unit is a plurality of piezoelectric elements corresponding to a plurality of ejection nozzles. A method for assembling a substrate assembly according to claim 3,
An arrangement step of arranging the conductive portions of the pair of film substrates facing each other inward and with a predetermined gap therebetween;
An insertion step in which the base plate is relatively inserted into the gap, and an insertion end surface of the base plate is abutted against a tip portion of the pair of conduction portions;
Image recognition of the plurality of alignment marks of each of the conductive portions facing each other, and based on the recognition result, the bonding step of bringing the pair of film substrates inward and bonding the substrate bodies to the bonding portions; A method for assembling a substrate assembly, comprising: An assembly apparatus for a substrate assembly according to claim 3,
An arrangement / moving means for holding the pair of film substrates facing each other so that each of the conductive portions faces inward, and for moving the held pair of film substrates in the direction of separation from each other;
An insertion means for holding the base plate and inserting the held base plate relative to the gap;
Image recognizing means for recognizing the plurality of alignment marks of each of the conductive portions arranged to face each other;
Control means for controlling the placement / movement means and the insertion means,
The control means is configured to dispose the conductive portions of the pair of film substrates inwardly and facing each other with a predetermined gap, and relatively inserting the base plate into the gap, An insertion operation that abuts the insertion end face against the tip portion of the pair of conductive portions, and the plurality of alignment marks of the conductive portions that are arranged to face each other are image-recognized. And a bonding operation for bonding the substrate bodies to the bonding portions.

Images