JP2010135550A - Substrate treatment device and substrate treatment method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate treatment device that prevents not only the useless treatment of a substrate to be treated by avoiding the treatment itself if the substrate itself to be treated is in distortion and so on, but also the useless treatment in post treatment if the substrate which has been treated does not satisfy predetermined requirements. <P>SOLUTION: The substrate treatment device includes: a holding portion 15 for holding the substrate to be treated 60; a laser irradiation device 20 for irradiating laser light L; a laser moving portion 22 for moving the laser irradiation device 20; and a detection device 50 for detecting an end of the substrate 60 to be treated and a position of the extreme peripheral side of a portion to be treated of a film surface 61. The end of the film surface 61 of the substrate 60 to be treated is removed by moving the irradiating position to the film surface 61 of the laser light L irradiated from the laser irradiation device 20 only if a relation between the position of the end of the substrate 60 to be treated detected by the detection device 50 and that of the utmost peripheral side of the portion to be treated of the film surface 61 is satisfied by the predetermined requirements. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method for performing processing by irradiating an edge portion of a film surface with laser light among substrates to be processed having a substrate and a film surface provided on the substrate.

  Conventionally, by irradiating a part of the film surface laminated on the transparent insulating substrate with a laser beam, a part of the film surface is removed and patterned, and the film laminated on the transparent insulating substrate A method of manufacturing a thin-film solar cell including a step of removing the edge of the film surface by irradiating the edge of the surface with laser light is known (see, for example, Patent Document 1).

JP 2006-332453 A

  The reason why the edge of the film surface is removed is to ensure the insulation of the substrate to be processed, and the range of the edge of the film surface to be removed needs to be a predetermined size or more. On the other hand, in order to function as a battery, the film surface located on the outermost peripheral side and the film surface after being removed (the film surface located between the position on the most peripheral side of the processed portion of the film surface) Needs to be larger than a predetermined size.

  From these, when the substrate to be processed itself is distorted (for example, has a trapezoidal shape), or when the positioning accuracy of the substrate to be processed is poor, the range of the edge of the film surface to be removed, or The film surface located on the outermost peripheral side after being removed cannot satisfy a predetermined size, and even if manufactured, it becomes a defective product. For this reason, it is preferable to remove the substrate to be processed in such a state from the processing step.

  The present invention has been made in consideration of such points, and when the substrate to be processed itself is distorted (in a trapezoidal shape), the substrate to be processed is avoided by avoiding processing as it is. It is an object of the present invention to prevent this processing, or to prevent unnecessary processing in a subsequent process when the processed substrate does not satisfy the predetermined requirements.

A substrate processing apparatus according to a first aspect of the present invention includes:
In a substrate processing apparatus for processing a substrate to be processed having a substrate and a film surface provided on the substrate and processed at a predetermined processing location,
A holding unit for holding the substrate to be processed;
A laser irradiation device for irradiating laser light;
An end portion of the substrate to be processed, and a detector that detects a position on the most peripheral side of a processing portion of the film surface,
Irradiated from the laser irradiation apparatus only when the positional relationship between the position of the edge of the substrate to be processed detected by the detector and the position of the processing surface of the film surface on the most peripheral side satisfies a predetermined condition. The irradiation position of the laser beam to the film surface is moved to remove the edge of the film surface of the substrate to be processed.

The substrate processing apparatus according to the second aspect of the present invention comprises:
In a substrate processing apparatus for processing a substrate to be processed having a substrate and a film surface provided on the substrate,
A holding unit for holding the substrate to be processed;
A laser irradiation device for irradiating laser light;
A detector for detecting an end of the substrate to be processed,
Move the irradiation position on the film surface of the laser light irradiated from the laser irradiation device, remove the edge of the film surface of the substrate to be processed,
The detector detects the position of the end of the film surface remaining without being removed and the position of the end of the substrate to be processed.

In the substrate processing apparatus according to the first aspect of the present invention,
The detector detects at least two positions of the end portion of the substrate to be processed to detect the position of the end portion, and detects at least two positions on the most peripheral side of the processing position to detect the processing position. It is preferable to detect the position of the most peripheral side.

In the substrate processing apparatus according to the second aspect of the present invention,
The detector detects at least two positions of the end portion of the substrate to be processed, detects the position of the end portion of the substrate to be processed, and at least two positions of the end portion of the film surface that remains without being removed. It is preferable to detect the position of the end portion of the film surface by detecting.

In the substrate processing apparatus according to the present invention,
A reflective member is provided on the opposite side of the detector with respect to the substrate to be processed;
When viewed from the detector side with respect to the substrate to be processed, it is preferable that at least a part of the reflecting member is positioned outside the periphery of the substrate to be processed held by the holding portion.

The substrate processing method according to the first aspect of the present invention comprises:
In a substrate processing method of processing a substrate to be processed having a substrate and a film surface provided on the substrate and processed at a predetermined processing location,
Holding the substrate to be processed by a holding unit;
The step of detecting the edge of the substrate to be processed and the position on the most peripheral side of the processed portion of the film surface by a detector;
Laser light is emitted from the laser irradiation apparatus only when the positional relationship between the position of the edge of the substrate to be processed detected by the detector and the position on the most peripheral side of the processing portion of the film surface satisfies a predetermined condition. Irradiating and moving the irradiation position of the laser beam on the film surface to remove the edge of the film surface of the substrate to be processed;
It has.

The substrate processing method according to the second aspect of the present invention comprises:
In a substrate processing method for processing a substrate to be processed having a substrate and a film surface provided on the substrate,
Holding the substrate to be processed by a holding unit;
Irradiating laser light from a laser irradiation device;
Removing the edge of the film surface of the substrate to be processed by moving the irradiation position of the laser beam on the film surface;
Detecting the position of the end of the film surface that is not removed by the detector and the position of the end of the substrate to be processed;
It has.

  According to the present invention, only when the positional relationship between the position of the end portion of the substrate to be processed detected by the detector and the position on the most peripheral side of the processing portion of the film surface satisfies a predetermined condition, Since the edge of the film surface is removed, when the substrate to be processed itself is distorted (in a trapezoidal shape), it is possible to avoid processing as it is and to prevent unnecessary processing of the substrate to be processed. be able to.

  Also, the edge of the film surface of the substrate to be processed is removed, and then the detector detects the position of the end of the film surface that remains without being removed and the position of the edge of the substrate to be processed. When the substrate to be processed that has been processed does not satisfy the predetermined requirement, it can be prevented that the substrate is processed in a later step. Furthermore, when the film surface to be removed is not completely removed, the edge of the film surface can be processed again, and the film surface located on the outermost periphery side can be removed in a more accurate range. .

BEST MODE FOR CARRYING OUT THE INVENTION

First Embodiment Hereinafter, a first embodiment of a substrate processing apparatus and a substrate processing method according to the present invention will be described with reference to the drawings. Here, FIG. 1 to FIG. 6 are diagrams relating to the first embodiment of the present invention.

  The substrate processing apparatus includes a glass substrate (substrate) 62 and a substrate to be processed 60 that is provided on the glass substrate 62 (in the previous step) and processed at a predetermined processing location 61a (see FIG. 4). Among them, it is used for processing the edge portions 61p and 61q of the film surface 61 (see FIGS. 2 and 3B and 3E). In addition, as such a to-be-processed substrate 60, although the board | substrate used for a thin film solar cell can be mentioned, for example, it is not restricted to this.

As shown in FIGS. 1A and 1B, the substrate processing apparatus adsorbs the substrate 60 to be processed from above (one side) with the glass substrate 62 positioned above (one side) the film surface 61. A suction holding unit (holding unit) 10 that holds the laser beam, a laser irradiation device 20 that irradiates laser light L (see FIG. 2), a laser moving unit 22 that moves the laser irradiation device 20 in the horizontal direction, and a substrate 60 to be processed. And a detector 50 that detects a position 61 a _l (see FIG. 4) on the most peripheral side of the processing location 61 a of the film surface 61. Here, the detector 50 is movable in the horizontal direction by a detector driving unit (not shown).

  1A is an upper plan view of the substrate processing apparatus according to the present embodiment as viewed from above (the suction holding unit 10 is not shown), and FIG. 1B is a side view of the substrate processing apparatus. It is the side view seen from.

Further, as shown in FIG. 2, a control device 55 is connected to the detector 50, the laser irradiation device 20, the laser moving unit 22, the rotation drive unit 15 (described later) and the notification unit 59 (described later). Then, the control unit 55, the positional relationship satisfies a predetermined condition of the most peripheral side of the position 61a _l of machining spot 61a positions and film surface 61 of the end portion of the substrate 60 detected by the detector 50 (See FIG. 4). More specifically, the control device 55, the distance and the film plane to the end of the substrate 60 between the most peripheral side position 61a _l of machining spot 61a end and the film surface 61 of the substrate 60 61 the slope of the most peripheral side of the position 61a _l of machining spot 61a is, determines whether a predetermined condition is satisfied, when a predetermined condition is satisfied, while a laser beam L from the laser irradiation device 20, a laser irradiation By moving the apparatus 20, the edges 61p and 61q of the film surface 61 of the substrate 60 to be processed are removed. On the other hand, when the predetermined condition is not satisfied, the fact is notified by the notification unit 59 including a display screen and a sound device.

Note that the detector 50 according to the present embodiment detects at least two positions (for example, 60e ₁ and 60e _{2 in} FIG. 4) of the end of the substrate 60 to be processed, and detects the position of the end. at least two places on the most peripheral side of the position 61a _l point 61a (e.g., _61a l1, _{61a l2} in FIG. 4) is configured to detect the most peripheral side of the position 61a _l of detection to the machining spot 61a of Yes. More specifically, the control device 55 has an image processing function, and each position (60e ₁ , 60e ₂ ) of the detected end portion of the target substrate 60 is connected by a straight line by the image processing function. together, by connecting each of the most peripheral side of the position 61a _l of the detected machining spot 61a a _(61a l1, _{61a l2)} in a straight line, most circumference of the machining spot 61a end and the film surface 61 of the substrate 60 the distance between the position 61a _l edge side, are configured to determine the inclination of the position 61a _l of most peripheral side of the machining spot 61a of the film surface 61 relative to the end of the substrate 60.

  Further, as shown in FIGS. 1B and 2, a rotation driving unit 15 that rotates the substrate 60 by rotating the suction holding unit 10 is provided on the suction holding unit 10. . In the present embodiment, a description will be given using a mode in which the rotation driving unit 15 is provided on the upper part of the suction holding unit 10. However, the present invention is not limited to this. A mode in which the irradiation device 20 and the laser moving unit 22 are rotated may be used.

  Further, as shown in FIG. 1B, the lower end of the laser irradiation device 20 is located above the upper end of the adsorption holding unit 10 (one side from the end), and the adsorption holding unit 10 is a rotation driving unit. Even when rotated by 15, the suction holding unit 10 and the laser irradiation device 20 are configured not to collide.

  As shown in FIGS. 1A and 1B, a pair of transfer units 1 that transfer the substrate 60 to be processed are provided on the upstream side of the laser irradiation device 20 and the laser moving unit 22. Further, in the vicinity of the transport unit 1, a pair of positioning units 5l that sandwich and position the substrate 60 to be processed in the transport direction, and two pairs that position the substrate 60 to be processed in a direction orthogonal to the transport direction. A positioning part 5s is provided.

  In the present embodiment, the transport unit 1, the laser irradiation device 20, the laser moving unit 22, and the detector 50 have been described using different modes. However, the present invention is not limited to this. Absent. For example, the laser irradiation device 20, the laser moving unit 22, and the detector 50 may be provided above the transport unit 1. In this case, the substrate 60 to be processed is moved in the horizontal direction by the suction holding unit 10. There is no need, and work efficiency can be improved.

  Next, the operation of the present embodiment having such a configuration will be described. 3A to 3E used in the following description, only one laser irradiation device 20 and a laser moving unit 22 are shown to simplify the drawing, but in this embodiment, As shown in FIG. 1A, a pair of laser irradiation devices 20 and a laser moving unit 22 are used. Further, in FIGS. 3A to 3E, the detector 50 is not shown in order to simplify the drawing.

  First, the substrate to be processed 60 to be processed is transferred by the transfer unit 1 (see FIGS. 1A and 1B). Then, when the substrate 60 to be processed is transferred to a predetermined position, the transfer unit 1 is stopped, whereby the transfer of the substrate 60 to be processed is stopped. At this time, the glass substrate 62 is positioned above the film surface 61, and the transport unit 1 is in contact with a portion of the film surface 61 that is removed by a laser beam L described later.

  Next, the substrate to be processed 60 is sandwiched and positioned by the pair of positioning portions 5l in the transport direction, and the substrate to be processed 60 is sandwiched and positioned by the two pairs of positioning portions 5s in the direction orthogonal to the transport direction. (See FIGS. 1A and 1B).

  Next, the substrate to be processed 60 held between the positioning portions 5s and 5l is sucked and held by the suction holding unit 10 from above. And the to-be-processed substrate 60 is conveyed by the suction holding | maintenance part 10 to a laser processing position (refer FIG.1 (b)).

Next, the detector 50 detects at least two locations (for example, 60e ₁ and 60e _{2 in} FIG. 4) of the end portion of the substrate 60 to be processed, and detects the position of the end portion, and also the processing portion 61a. at least two places on the most peripheral side of the position 61a _l (e.g., _61a l1, _{61a l2} in FIG. 4) the most peripheral side of the position 61a _l of being detected the machining spot 61a is detected.

Next, each of the detected positions (60e ₁ , 60e ₂ ) of the end portion of the substrate 60 to be processed is connected by a straight line by the image processing function in the control device 55, and the most peripheral portion of the detected processing location 61a is connected. each position 61a _l edge side _(61a l1, _{61a l2)} are connected by a straight line, by this, between the most peripheral side of the position 61a _l of machining spot 61a end and the film surface 61 of the substrate 60 the distance, the inclination of the position 61a _l of most peripheral side of the machining spot 61a of the film surface 61 relative to the end of the substrate 60 is determined.

Next, by the control device 55, the distance between the end portion of the substrate 60 to be processed and the position 61 a ₁ on the most peripheral side of the processing location 61 a of the film surface 61, or the film surface 61 with respect to the end portion of the substrate 60 to be processed. the slope of the most peripheral side of the position 61a _l of machining spot 61a is determined whether a predetermined condition is satisfied. When a predetermined condition is satisfied, the laser beam L is emitted from the laser irradiation device 20 based on a signal from the control device 55, and the laser irradiation device 20 is attached to the substrate 60 to be processed by the laser moving unit 22. By moving along the edge (substantially in the X direction), one edge 61p of the film surface 61 of the substrate 60 to be processed is processed (see FIGS. 3A and 3B). On the other hand, when it is determined by the control device 55 that the predetermined condition is not satisfied, this is notified by the notification unit 59 including a display screen, an audio device, and the like (see FIG. 2).

  In the present embodiment, the laser irradiation apparatus 20 moves along the end portion (substantially X direction) of the substrate 60 to be processed, and then moves in the positive direction of the Y direction (direction orthogonal to the X direction). It moves to the inside of the substrate 60 to be processed, and then moves in the direction along the end (substantially X direction) of the substrate 60 to be processed and in the opposite direction (FIG. 3 ( a) (see arrow in (b)). Then, by appropriately repeating such a movement, one edge 61p of the substrate to be processed 60 can be processed in a desired range. 4 indicates the range of the film surface 61 to be removed by the laser light L.

As described above, when one edge 61p of the substrate to be processed 60 is processed, the substrate to be processed 60 is rotated by the rotation driving unit 15 (see FIG. 3C). the other edge 61q, together with at least two positions are detected by the position of the end portion of the end portion of the substrate 60 is detected, at least two locations to detect the most peripheral side of the position 61a _l of machining spot 61a is the position 61a _l of most peripheral side of the machining spot 61a is detected (see FIG. 4).

Then, the control unit 55, and the distance between the most peripheral side of the position 61a _l of machining spot 61a end and the film surface 61 of the substrate 60, the processing of the film surface 61 relative to the end of the substrate 60 When the inclination of the position 61a ₁ on the most peripheral side of the position 61a satisfies the predetermined condition, and when the predetermined condition is satisfied, the laser beam L from the laser irradiation device 20 is based on the signal from the control device 55. And the laser moving unit 22 moves the laser irradiation apparatus 20 along the end of the substrate 60 to be processed, whereby one edge 61p of the film surface 61 of the substrate 60 to be processed is processed. . On the other hand, when it is determined that the predetermined condition is not satisfied, this is notified by the notification unit 59 including a display screen, an audio device, and the like.

  As described above, according to the present embodiment, in the case where the substrate 60 itself is distorted (having a trapezoidal shape), a defective product is manufactured even if the substrate 60 is processed as it is. In this case, it is possible to avoid processing such a substrate 60 to be processed, and it is possible to prevent unnecessary processing of the substrate 60 to be processed.

  The movement of the laser irradiation apparatus 20 when the other edge portion 61q is processed also moves the laser irradiation apparatus 20 along the end portion (substantially X direction) of the substrate 60 (FIG. 3D). (See (e)). For this reason, the moving distance of the laser irradiation apparatus 20 can be shortened as much as possible, and processing efficiency can be improved.

  Moreover, according to this Embodiment, since the glass substrate 62 of the to-be-processed substrate 60 is adsorbed and hold | maintained from the upper direction by the adsorption holding part 10 in the state which the glass substrate 62 is located above the film surface 61 ( 1B and FIG. 2), the lower film surface 61 is not pressed by a pin-shaped substrate support (not shown). Further, according to the present embodiment, since the suction holding unit 10 can hold the glass substrate 62 other than the portion through which the laser light L is transmitted, in a wide range, the substrate 60 to be processed is surely bent. Can be prevented.

  From these things, according to this Embodiment, it can prevent reliably that the to-be-processed substrate 60 bends, without having a bad influence on the film | membrane surface 61, and by extension, the processing precision of the film | membrane surface 61 is made high. can do.

  In the present embodiment, the lower end of the laser irradiation device 20 is positioned above the upper end of the suction holding unit 10 (see FIG. 1B), and the suction holding unit 10 is rotated by the rotation driving unit 15. Since the suction holding unit 10 and the laser irradiation device 20 are configured so as not to collide with each other, the size of the suction holding unit 10 in the horizontal direction can be increased as much as possible. It can prevent more reliably that 60 bends.

  Incidentally, as shown in FIG. 5, a reflective member 70 may be provided on the opposite side (downward) from the detector 50 with respect to the substrate 60 to be processed. Thus, when viewed from the detector 50 side, it is positioned outside the periphery of the substrate 60 to be processed held by the holding portion. By providing such a reflection member 70, when the edge part of the to-be-processed substrate 60 is detected by the detector 50, the edge part can be detected more accurately.

  That is, when viewed from the detector 50, the end of the substrate 60 to be processed is rounded, so that it appears dark due to irregular reflection of light. However, by providing the reflecting member 70, the substrate 60 to be processed is provided. Light can be specularly reflected at a position outside the end (see FIG. 5). For this reason, the contrast can be increased between the end of the glass substrate and the outside of the end, and the end of the substrate to be processed 60 can be detected more accurately.

  In the above description, the suction holding unit 10 that holds the target substrate 60 by suction from above is described as the holding unit. However, the present invention is not limited to this, and as shown in FIG. You may use the lower holding | maintenance part 16 which supports and hold | maintains from below. When the lower holding portion 16 is used as described above, the substrate support portion (not shown) of the lower holding portion 16 that supports the film surface 61 has a pin shape in order to reduce the contact area with the film surface 61. It is preferable.

Second Embodiment Next, a second embodiment of the present invention will be described. The first preferred embodiment shown in FIGS. 1 through 6 embodiment, the detector 50 of the most peripheral side of the position 61a _l of machining spot 61a positions and film surface 61 of the end portion of the substrate 60 detected by When the positional relationship satisfies a predetermined condition, the edge portions 61p and 61q of the film surface 61 of the substrate 60 to be processed are removed by moving the laser irradiation device 20 while irradiating the laser beam L from the laser irradiation device 20. However, in the second embodiment shown in FIG. 7, instead of irradiating the laser beam L from the laser irradiation device 20, the laser irradiation device 20 is moved to move the substrate 60 to be processed. The edges 61p and 61q of the film surface 61 are removed, and then the detector 50 detects the position of the remaining end of the film surface 61 and the position of the end of the substrate 60 to be processed. Other configurations are shown in FIGS. This is substantially the same as the first embodiment shown in FIG.

  In the second embodiment shown in FIG. 7, the same parts as those in the first embodiment shown in FIGS.

  Hereinafter, functions and effects of the substrate processing apparatus according to the present embodiment will be described.

  First, the substrate to be processed 60 to be processed is transferred by the transfer unit 1 (see FIGS. 1A and 1B). Then, when the substrate 60 to be processed is transferred to a predetermined position, the transfer unit 1 is stopped, whereby the transfer of the substrate 60 to be processed is stopped.

  Next, the substrate to be processed 60 is sandwiched and positioned by the pair of positioning portions 5l in the transport direction, and the substrate to be processed 60 is sandwiched and positioned by the two pairs of positioning portions 5s in the direction orthogonal to the transport direction. (See FIGS. 1A and 1B).

  Next, the substrate to be processed 60 held between the positioning portions 5s and 5l is sucked and held by the suction holding unit 10 from above. And the to-be-processed substrate 60 is conveyed by the suction holding | maintenance part 10 to a laser processing position (refer FIG.1 (b)).

  Next, the laser irradiation apparatus 20 is irradiated with the laser light L, and the laser moving unit 22 moves the laser irradiation apparatus 20 along the end portion (substantially in the X direction) of the substrate 60 to be processed. One edge 61p of the film surface 61 of the substrate 60 is processed (see FIG. 3B). At this time, the start position of the laser irradiation by the laser irradiation apparatus 20 is based on the corner of the substrate 60 to be processed.

Next, the detector 50 detects the position of the end of the remaining film surface 61 and the position of the end of the substrate to be processed 60 for one edge 61p. More specifically, the detector 50 detects at least two locations (for example, 60e ₁ and 60e _{2 in} FIG. 7A) of the end portion of the substrate 60 to be processed, and detects the end portion of the substrate 60 to be processed. While the position is detected, at least two positions (for example, 61e ₁ and 61e _{2 in} FIG. 7A) of the end of the film surface 61 that is not removed are detected, and the end of the film surface 61 is detected. The position is detected. 7A to 7C show the range of the film surface 61 removed by the laser light L.

Next, each of the detected positions (60e ₁ , 60e ₂ ) of the end portion of the substrate 60 to be processed is connected by a straight line by the image processing function in the control device 55, and the remaining film surface 61 is not removed. Each of the end positions (61e ₁ , 61e ₂ ) is connected by a straight line, whereby the distance between the end portion of the substrate 60 to be processed and the end portion of the film surface 61 that remains without being removed. The inclination of the end portion of the film surface 61 that remains without being removed with respect to the end portion of the substrate 60 to be processed is determined.

  Next, the controller 55 removes the distance between the end of the substrate 60 to be processed and the end of the film surface 61 that remains without being removed, or the film that remains without being removed from the end of the substrate 60 to be processed. It is determined whether the inclination of the end of the surface 61 satisfies a predetermined condition. When the predetermined condition is satisfied, the rotation driving unit 15 is driven based on the signal from the control device 55 to rotate the substrate to be processed 60 (see FIG. 3C). On the other hand, when it is determined by the control device 55 that the predetermined condition is not satisfied, this is notified by the notification unit 59 including a display screen, an audio device, and the like (see FIG. 2).

Thus, according to the present embodiment, the processed substrate 60 is processed when the processed substrate 60 itself is distorted (having a trapezoidal shape) or when the positioning accuracy of the processed substrate 60 is poor. When 60 does not satisfy a predetermined requirement (for example, from the width D _{0 of} the outermost film surface 60 to be removed and left to be removed, the outermost film surface 60 that is removed and left from the outermost film surface 60 is left. when the width D ₁ is has become smaller: a diagram 7 (a) (b) has a D _{1 <D 0} in), defective be treated with a substrate to be processed 60 in a subsequent step as it is Can be prevented from performing a useless post-process.

According to the present embodiment, when the film surface 61 to be removed is not completely removed (removed and left from the width D ₀ of the film surface 60 positioned on the outermost periphery to be removed and left). When the width of the film surface 60 located on the outermost peripheral side is large: D ₂ > D ₀ in FIGS. 7A and 7C), the notification unit 59 indicates that the predetermined condition is not satisfied. The laser moving unit 22 and the laser irradiation device 20 are driven based on the signal from the control device 55, and the one edge portion 61p can be processed again. For this reason, the film surface 61 located in the edge parts 61p and 61q can be removed in a more accurate range.

  Incidentally, in FIGS. 7B and 7C, when the laser irradiation start position by the laser irradiation apparatus 20 is used as a reference at the lower right corner of the substrate to be processed 60, it is shown in FIG. 7B. On the other hand, when the upper right corner of the substrate 60 to be processed is used as a reference, the configuration shown in FIG.

  As described above, when the substrate to be processed 60 is rotated by the rotation driving unit 15, the laser irradiation device 20 is irradiated with the laser light L from the laser irradiation device 20, and the laser irradiation device 20 is at the end (substantially in the X direction). And the other edge 61q of the substrate 60 to be processed is processed (see FIGS. 3D and 3E).

  Then, the controller 55 removes the other edge portion 61q from the end portion of the substrate 60 to be processed and the end portion of the film surface 61 that remains without being removed, or the removal from the end portion of the substrate 60 to be processed. It is determined whether the inclination of the end of the remaining film surface 61 satisfies a predetermined condition. When the predetermined condition is satisfied, a post process is performed. On the other hand, when the control device 55 determines that the predetermined condition is not satisfied, the fact is displayed from the display screen, the audio device, or the like. Is notified by the notification unit 59.

  In addition, as for the other edge portion 61q, when the film surface 61 to be removed is not completely removed (instead of being notified by the notification portion 59 that the predetermined condition is not satisfied, the control device 55 Based on this signal, the laser moving unit 22 and the laser irradiation device 20 are driven, and the other edge 61q is processed again.

The upper side figure which looked at the substrate processing apparatus by the 1st Embodiment of this invention from upper direction, and the side view seen from the side. 1 is a perspective view showing a part of a substrate processing apparatus according to a first embodiment of the present invention. The upper top view which showed the aspect which processes the edge part of the film | membrane surface of a to-be-processed substrate one by one with the substrate processing apparatus of the 1st Embodiment of this invention. The upper top view which expanded and showed the aspect which processes the edge part of the film surface of a to-be-processed substrate by the substrate processing apparatus of the 1st Embodiment of this invention. The side view which showed the reflection member of the substrate processing apparatus by the modification of the 1st Embodiment of this invention. The perspective view which shows a part of substrate processing apparatus by another modification of the 1st Embodiment of this invention. The upper top view which expanded and showed the aspect which processes the edge part of the film surface of a to-be-processed substrate by the substrate processing apparatus of the 2nd Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Transfer part 5s, 5l Positioning part 10 Adsorption holding part 15 Rotation drive part 16 Lower holding part 20 Laser irradiation apparatus 22 Laser moving part 50 Detector 55 Control apparatus 59 Notification part 60 Substrate 61 Processed surface 61 Film surface 61p One edge 61q Other edge 62 Glass substrate (substrate)
70 Reflective member L Laser light

Claims (7)

In a substrate processing apparatus for processing a substrate to be processed having a substrate and a film surface provided on the substrate and processed at a predetermined processing location,
A holding unit for holding the substrate to be processed;
A laser irradiation device for irradiating laser light;
An end portion of the substrate to be processed, and a detector that detects a position on the most peripheral side of a processing portion of the film surface,
Irradiated from the laser irradiation apparatus only when the positional relationship between the position of the edge of the substrate to be processed detected by the detector and the position of the processing surface of the film surface on the most peripheral side satisfies a predetermined condition. A substrate processing apparatus, wherein an irradiation position of the laser beam to the film surface is moved to remove an edge of the film surface of the substrate to be processed. In a substrate processing apparatus for processing a substrate to be processed having a substrate and a film surface provided on the substrate,
A holding unit for holding the substrate to be processed;
A laser irradiation device for irradiating laser light;
A detector for detecting an end of the substrate to be processed,
Move the irradiation position on the film surface of the laser light irradiated from the laser irradiation device, remove the edge of the film surface of the substrate to be processed,
The said detector detects the position of the edge part of the film surface which remains without being removed, and the position of the edge part of the said to-be-processed substrate, The substrate processing apparatus characterized by the above-mentioned.   The detector detects at least two positions of the end portion of the substrate to be processed to detect the position of the end portion, and detects at least two positions on the most peripheral side of the processing position to detect the processing position. The substrate processing apparatus according to claim 1, wherein a position on the most peripheral side is detected.   The detector detects at least two positions of the end portion of the substrate to be processed, detects the position of the end portion of the substrate to be processed, and at least two positions of the end portion of the film surface that remains without being removed. The substrate processing apparatus according to claim 2, wherein the position of the end portion of the film surface is detected by detecting the position of the film. A reflective member is provided on the opposite side of the detector with respect to the substrate to be processed;
When viewed from the detector side with respect to the substrate to be processed, at least a part of the reflecting member is positioned outside the periphery of the substrate to be processed held by the holding unit. The substrate processing apparatus according to claim 1. In a substrate processing method of processing a substrate to be processed having a substrate and a film surface provided on the substrate and processed at a predetermined processing location,
Holding the substrate to be processed by a holding unit;
The step of detecting the edge of the substrate to be processed and the position on the most peripheral side of the processed portion of the film surface by a detector;
Laser light is emitted from the laser irradiation apparatus only when the positional relationship between the position of the edge of the substrate to be processed detected by the detector and the position on the most peripheral side of the processing portion of the film surface satisfies a predetermined condition. Irradiating and moving the irradiation position of the laser beam on the film surface to remove the edge of the film surface of the substrate to be processed;
A substrate processing method comprising: In a substrate processing method for processing a substrate to be processed having a substrate and a film surface provided on the substrate,
Holding the substrate to be processed by a holding unit;
Irradiating laser light from a laser irradiation device;
Removing the edge of the film surface of the substrate to be processed by moving the irradiation position of the laser beam on the film surface;
Detecting the position of the end of the film surface that is not removed by the detector and the position of the end of the substrate to be processed;
A substrate processing method comprising:

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