JP2010133167A - Composite rubber chip mat for forming floor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily and inexpensively provide a rubber chip mat capable of properly obtaining shock-absorbing properties required on each construction site, though the rubber chip mat has the diverse shock-absorbing properties required depending on the construction site. <P>SOLUTION: This composite rubber chip mat for forming a floor includes a rubber chip mat 1 for forming a floor surface, and a rubber chip mat 2 for increasing a volume; a plurality of coupling holes 3 are provided in the undersurface of the rubber chip mat 1; a coupling protrusion 4 made of a rubber chip 5 is integrally and protrusively provided on the top surface of the rubber chip mat 1; the rubber chip mat 2 is superposed on the undersurface of the rubber chip mat 1; and the coupling protrusion 4 is fitted into the coupling hole 3. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a composite rubber chip mat that forms an outdoor or indoor floor.

  Rubber chip mats are known in which waste rubber such as rubber tires and industrial rubber is pulverized to form rubber chips of about 1 to 10 mm, and a large amount of the rubber chips are consolidated into a plate shape.

  These rubber chip mats have moderate buffering properties and water permeability, and are widely used as sidewalks, parking lots, livestock barns, buffer mats under playground equipment, and the like. It can also be used as a flooring material for rooftops, balconies, verandas, etc.

  Many of the above rubber chip mats are blended with a large amount of rubber chips, mixed with pigment, kneaded, molded into a plate shape using a mold, and colored green, yellow, red, etc. depending on the application. A rubber chip mat has been obtained.

  Thus, the cushioning properties of the rubber chip mat required at each construction site vary depending on the application, and the rubber chip mat cannot cope with the various applications.

  If the above rubber chip mats are stacked and bonded together through an adhesive and the thickness is increased, the buffering property can be increased. However, the adhesive layer reduces buffering and water permeability as well as causing an excessive increase in thickness. This creates problems and increases costs.

  On the other hand, rubber chip mats of various thicknesses that could meet the demands of construction sites must be produced and stored, which is uneconomical.

  The present invention makes it possible to easily provide a rubber chip mat capable of imparting a shock-absorbing property according to a request according to the use at each construction site.

  The present invention comprises a floor surface forming rubber chip mat and a raising rubber chip mat, wherein a plurality of coupling holes or coupling protrusions are provided on the lower surface of the floor forming rubber chip mat, and a plurality of coupling projections are provided on the upper surface of the raising rubber chip mat. Alternatively, a coupling hole is provided, and the rubber chip mat for raising is overlaid on the rubber chip mat for floor surface formation, and the coupling protrusion is fitted into the coupling hole on the superposed surface so as to obtain a required thickness increase and buffering property. Provided is a composite rubber chip mat for forming a floor.

  The raising rubber chip mat is composed of one or a plurality of mats. When the raising rubber chip mat is composed of a plurality of rubber chip mats, a coupling protrusion is provided on one of the upper surface or the lower surface of each raising rubber chip mat, and a coupling hole is provided on the other. A pair of raising rubber chip mats are stacked, and the coupling protrusion is fitted into the coupling hole on the superimposed surface.

  The coupling hole and the coupling protrusion are arranged at a position corresponding to a quarter width of the mat width from one side of the rubber chip mat for floor formation and the rubber chip mat for raising, and a quarter of the mat width from the other side. It is arranged at a position corresponding to one width so that the floor surface forming rubber chip mat and the raising rubber chip mat are shifted in position so as to be stacked and laminated.

  The floor-forming rubber chip mat and the raising rubber chip mat are made to be mats of the same shape and the same thickness, and the mating protrusions and the coupling holes are fitted to each other so that they can be laminated.

  Alternatively, the rubber chip mat for raising is made several times the size of the rubber chip mat for forming the floor, and a plurality of rubber chips for forming the floor are stacked on the upper surface of one rubber chip for raising, and the coupling protrusion and the coupling hole are fitted. Thus, a plurality of floor surface forming rubber chip mats can be stacked on the raising rubber chip mat.

  As described above, the rubber chip mat has various buffering properties required depending on the construction site, but the present invention makes it easy to obtain the rubber chip mat that can appropriately obtain the mat thickness and buffering property according to the request at each construction site. In addition, it can be provided at low cost.

  In addition, a structure in which the rubber chip mat for forming the floor surface and the rubber chip mat for raising the surface are fitted and positioned on the overlapping surface can provide a composite rubber chip mat having a desired thickness without impairing the buffering properties of the individual rubber chip mats. .

The best mode for carrying out the present invention will be described below with reference to FIGS.
1 and 2 show a rubber chip mat 1 for forming a floor, and FIG. 3 shows a rubber chip mat 2 for raising.

  The rubber chip mats 1 and 2 pulverize waste rubber such as rubber tires and industrial rubber to form a rubber chip 5 of about 1 to 10 mm, and a large amount of the rubber chip 5 is mixed with an adhesive and a pigment. These are kneaded, formed into a plate shape using a mold, and colored green, yellow, red, or the like.

  Both the floor surface forming rubber chip mat 1 and the raising rubber chip mat 2 are made into mats having the same shape and thickness. That is, a square mat having the same size and thickness is formed.

  The lower surface of the rubber chip mat 1 for forming the floor surface is provided with a coupling hole 3 defined by the wall surfaces of a plurality of rubber chips 5, while the coupling protrusion 4 comprising the rubber chip 5 is integrally projected on the upper surface of the rubber chip mat 2 for raising. Set up. The coupling holes 3 and the coupling protrusions 4 are arranged on the upper and lower concentric sides of the mats 1 and 2 in the same number.

  Further, for example, the coupling hole 3 and the coupling protrusion 4 are arranged at an equal distance from the mat center on the two diagonal lines of the square mats 1 and 2. That is, it arrange | positions at each corner | angular part on a virtual square locus.

  A floor-forming rubber chip mat 2 is placed on the lower surface of the floor-forming rubber chip mat 1 and the floor-forming rubber chip mat 2 has a cushioning property and water permeability required by fitting the coupling protrusions 4 into the coupling holes 3 on the superimposed surface. Constructs a composite rubber chip mat.

  The lower surface of the floor surface forming rubber chip mat 1 and the upper surface of the raising rubber chip mat 2 overlap at a free contact surface. Rainwater that has permeated through the floor surface forming rubber chip mat 1 penetrates well into the raising rubber chip mat 2 that overlaps the rain water through the free contact surface.

  It is possible to reinforce the fitting between the coupling protrusions 4 and the coupling holes 3 by using an adhesive only. Further, if the mats 1 and 2 do not bond the entire overlapping surface, the local portions of the overlapping surface can be dotted or lined.

  As shown in FIGS. 1A and 1C, the upper surface of the rubber chip mat 1 for forming a floor surface is provided with vertical or / and horizontal grooves 6 serving both as a decoration and drainage, and the grooves 6 define a plurality of square cells 6a. To do.

  Or as shown to FIG. 2A and FIG. 2C, the arc-shaped groove | channel 6 is arranged in parallel and it divides | segments into many sector cell 6b. The sector cell 6b and the square cell 6a may be mixed.

  Rain water or water sprinkling on the upper surface of the floor surface forming rubber chip mat 1 flows into the groove 6 and permeates through the groove bottom wall 6c to permeate the raising rubber chip mat 2.

  Further, as shown in FIGS. 1B and 1C (FIGS. 2B and 2C), the bottom surface of the rubber chip mat 1 for floor surface formation is flat, and the rubber chip mat for raising is raised as shown in FIGS. 3A, 3B, and 3C. The upper and lower surfaces of 2 are flat, and the planes are closely overlapped with each other so that the coupling hole 3 and the coupling protrusion 4 are closely fitted. The coupling hole 3 and the coupling projection 4 have the same diameter as each other, or the coupling projection 4 is slightly larger in diameter than the coupling hole 3 and is fitted substantially densely.

  As shown in FIGS. 4A, 5A and 5B, the raising rubber chip mat 2 is composed of one or a plurality of mats, and when it is composed of a plurality of rubber chip mats 2a and 2b, each of the raising rubber chip mats 2a and 2b. The coupling protrusions 4 are respectively provided on the upper surface, and the coupling holes 3 are respectively provided on the lower surfaces of the raising rubber chip mats 2a and 2b. In this case, the coupling hole 3 is provided on the lower surface of the floor surface forming rubber chip mat 1.

  Alternatively, as shown in FIG. 4B, in the case of a plurality of rubber chip mats 2a, 2b, a coupling hole 3 is provided on the upper surface of each raising rubber chip mat 2a, 2b, and on the lower surface of each raising rubber chip mat 2a, 2b. Each of the coupling protrusions 4 is provided. In this case, the coupling protrusion 4 is provided on the lower surface of the floor surface forming rubber chip mat 1.

  The coupling protrusions 4 and the coupling holes 3 of the rubber chip mats 1, 2a, 2b are arranged vertically concentrically, that is, on the same axis.

  As described above, the coupling protrusion 4 is formed by the rubber chip 5 and integrally protrudes from the mats 1 and 2, and the coupling hole 3 is defined by the wall surface of the rubber chip 5.

  In the illustration of FIG. 4B, the unused coupling protrusion 4 remains on the lower surface of the lowest raising rubber chip mat 2b in contact with the construction surface, but it is cut off during construction or left as it is and embedded in the construction surface.

  In the illustration of FIG. 4A, the unused coupling protrusion 4 does not remain on the lower surface of the lowest raising rubber chip mat 2b in contact with the construction surface.

  4A and 4B, it is possible to prepare a plurality of one kind of raising rubber chip mats 2 having a square shape and an equal thickness, and superimposing two or more pieces to obtain a required mat thickness.

  As an example of construction, the mat shown in FIG. 4A will be described. As shown in FIG. 5A, a single rubber chip mat 2 for raising is superposed on the lower surface of the rubber chip mat 1 for floor surface formation to form the rubber chip mat 1 for floor surface formation. The joint protrusion 4 of the upper rubber chip mat 2 for raising the bulk is closely fitted into the joint hole 3 to form a two-piece structure.

  When further thickening is required, as shown in FIG. 5B, another raising rubber chip mat 2b is polymerized to the raising rubber chip mat 2a, and the lower raising rubber chip is placed in the coupling hole 3 of the upper raising rubber chip mat 2a. The mating protrusions 4 of the mat 2b are fitted to form a composite rubber chip mat for floor formation of three or more layers.

  In FIG. 4B, the coupling hole 3 and the coupling protrusion 4 are fitted in reverse to the case shown in FIGS. 5A and 5B.

  The lower surface of the floor surface forming rubber chip mat 1 and the upper surface of the raising rubber chip mat 2, and the lower surface of the raising rubber chip mat 2 a and the upper surface of the raising rubber chip mat 2 b overlap with each other on free contact surfaces.

  As an example, as shown in FIG. 4, the mats 1 and 2 are formed in a square shape, and the mating holes 3 and the mating protrusions 4 are formed from one side of the floor forming rubber chip mat 1 and the raising rubber chip mat 2. Are arranged at a position corresponding to a quarter width W1 of the mat width W from the opposite side surfaces of the mats 1 and 2.

  Therefore, as shown in FIG. 6, the floor-forming rubber chip mat 1 and the raising rubber chip mat 2 are shifted in position by a half width W2 so as to be stacked and laminated. Cut and align the ears of the mat that protrudes from the floor width.

  As a modification, the above-mentioned raising rubber chip mat 2 is made a multiple of the floor surface forming rubber chip mat 1, and a plurality of floor forming rubber chip mats 1 are stacked on the upper surface of one raising rubber chip mat 2. The mat 2 can be fitted with the coupling protrusion 4 and the coupling hole 3.

  In any example, the unit mats 1, 2a, 2b are made to have the same thickness, for example, 20 mm each, so that the unit mats 1, 2a are stacked to be 40 mm and the unit mats 1, 2a, 2b are three. A buffer rubber chip mat having a thickness of 60 mm is obtained by stacking the sheets.

  As shown in FIGS. 7A, 7B, and 7C, connecting means for connecting the mats 1 to each other is provided on the side of the rubber chip mat 1 for floor surface formation. As a specific example, connecting rings 7 are integrally provided with the mat 1 on two or four sides of the rubber chip mat 1 for forming a floor surface which face each other.

  As a preferred example, a semicircular concave notch 8 that can be opened vertically and laterally is provided on two or four sides of the rubber chip mat 1 for forming a floor surface, and half of the connecting ring 7 is accommodated in the concave notch 8. Then, when the other half protrudes to the side and the mats 1 are arranged so that the side surfaces of the mats 1 are close to or in contact with each other, the protruding portions of the connection ring 7 are accommodated in the recesses 8 of the other side, It is possible to form a state in which the rings 7 and 7 are substantially overlapped in a hole formed by matching of the adjacent recessed portions 8 and 8. The overlapped connecting rings 7 and 7 are connected to each other by a wire connection, a pin 9 or the like, and adjacent rubber chip mats 1 for forming a floor surface are connected to each other.

  For example, as shown in FIG. 7C, the connecting means has a split shaft structure having a large-diameter head 9b at one end of a short shaft 9a, and a split groove 9c formed along the axis on the shaft 9a. Using a connecting pin 9 having a spiral crest or a plurality of concentric annular crests 9d on the peripheral surface, the connecting pin 9 is forcibly inserted into the overlapping connecting rings 7, 7, and both rings 7, 7 are connected. Connect the mats 1, 1 to each other.

  That is, the connecting shaft 9a is limited to the inner diameter of the ring, and is forcedly pushed in while being reduced in diameter by the split groove 9c, and engages the spiral mountain or annular mountain 9d with the rings 7 and 7 on the outlet side, so that the ring does not fall off. 7 and 7 can be connected. The connecting pin 9 is pushed in while rotating by inserting a screwdriver into a tool engaging groove 9e formed on the top surface of the head 9b.

  The connecting ring 7 is integrally provided with a connecting leg 7a, and the connecting leg 7a is integrated with the mat 1 by embedding it within the layer thickness of the floor surface forming rubber chip mat 1.

  The connecting ring 7 and the connecting leg 7a can be made of either synthetic resin or metal.

  As shown in FIGS. 5A and 5B, when the floor surface forming rubber chip mat 1 and the raising rubber chip mat 2 are polymerized and fitted to form a composite mat, the composite mats are connected to each other in the floor surface forming rubber chip mat 1. They are connected via a ring 7.

  8 and 9 show another embodiment of the present invention. As shown in FIG. 8A, two coupling holes 3 are provided on one diagonal line of the lower surface of the rubber chip mat 1 for forming a square floor surface.

  On the other hand, as shown in FIG. 8B, two coupling protrusions 4 are provided on one diagonal on the upper surface of the raising rubber chip mat 2, and two coupling holes 3 are provided on the other diagonal. In addition, two coupling holes 3 are provided on one diagonal on the lower surface of the rubber chip mat 2 for raising, and two coupling projections 4 are provided on the other diagonal.

  In the above example, the lower coupling hole 3 is arranged concentrically with the coupling protrusion 4 on the upper surface of the raising rubber chip mat 2, and the lower coupling projection 4 is arranged concentric with the coupling hole 3 on the upper surface.

  The coupling hole 3 and the coupling protrusion 4 are arranged at an equal distance from the center of the mat on the two diagonal lines of the square mats 1 and 2. That is, it arrange | positions at each corner | angular part on a virtual square locus.

  The above-described advantages are that when the rubber chip mat 2 for raising is stacked on the rubber chip mat 1 for forming the floor surface, or when another rubber chip mat 2b for raising is stacked on the rubber chip mat 2a for raising, and two or three are stacked. The above-mentioned fitting can be obtained by superimposing the rubber chip mat 2a for use irrespective of the front and back.

  The coupling hole 3 and the coupling protrusion 4 described above are not limited to a circle but may be a polygon such as a square.

A is a top view showing an example of a rubber chip mat for forming a floor surface, B is a bottom view thereof, and C is a cross-sectional view thereof. A is a top view showing another example of a floor surface forming rubber chip mat, B is a bottom view thereof, and C is a sectional view thereof. A is a top view showing a rubber chip mat for raising, B is a bottom view, and C is a cross-sectional view. A is a cross-sectional view showing the relationship between the coupling protrusions and the coupling holes of the floor surface forming rubber chip mat and the raising rubber chip mat in a state before superposition, and B is a cross-sectional view showing the other example. 4A is a cross-sectional view showing a state in which two floor surface forming rubber chip mats and a raising rubber chip mat shown in FIG. 4A are stacked, and B is a cross sectional view showing a state in which the same floor surface forming rubber chip mat and three raising rubber chip mats are stacked. . Sectional drawing which shows the state which shifted the position by the width | variety of the width | variety and the rubber chip mat for floor surface formation, and the rubber chip mat for raising | lifting were polymerized. 1A is a top view showing a connecting means for connecting floor surface forming rubber chip mats, FIG. 2B is a sectional view thereof, and FIG. 3C is a perspective view showing a relationship between a connecting pin and a connecting ring constituting the connecting means. A is a bottom view showing an example in which the coupling holes are arranged on the diagonal line on the lower surface of the rubber chip mat for forming the floor surface, and B is a coupling projection arranged on the diagonal line on the upper surface of the rubber chip mat for raising and on the other diagonal line. The top view which shows the example which has arrange | positioned the coupling hole, C is a bottom view which shows the example which has arrange | positioned the coupling hole on the diagonal of the lower surface of the mat | matte, and has arrange | positioned the coupling protrusion on the other diagonal. Sectional drawing which shows the fitting state of the joint protrusion and joint hole when the rubber chip mat for floor surface formation shown in the said FIG. 8A, B, and C and the rubber chip mat for raising are piled up.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Rubber chip mat for floor surface formation, 2, 2a, 2b ... Raising rubber chip mat, 3 ... Connection hole, 4 ... Connection protrusion, 5 ... Rubber chip, 6 ... Groove, 6a ... Square cell, 6b ... Fan-shaped cell, 6c ... Groove bottom wall, 7 ... connecting ring, 7a ... connecting leg, 8 ... recessed notch, 9 ... connecting pin, 9a ... connecting shaft of connecting pin, 9b ... same head, 9c ... same split groove, 9d ... same spiral mountain or An annular crest, 9e, the tool engaging groove, W, a mat width, W1, a quarter width of the mat, and W2, a half width of the mat.

Claims (4)

The rubber chip mat for floor surface formation and the rubber chip mat for raising are provided, and a plurality of coupling holes or coupling projections are provided on the lower surface of the rubber chip mat for floor surface formation, and a plurality of coupling projections or coupling holes are provided on the upper surface of the rubber chip mat for raising floor. The floor forming composite rubber chip mat is configured such that the rubber chip mat for raising is superposed on the rubber chip mat for floor surface formation, and the coupling protrusion is fitted into the coupling hole on the superposed surface. The raising rubber chip mat is composed of a plurality of mats, each of the raising rubber chip mats is provided with a coupling protrusion on one of the upper surface or the lower surface and a coupling hole on the other, and a plurality of the raising rubber chip mats are overlapped. The composite rubber chip mat for floor formation according to claim 1, wherein the coupling protrusions are fitted into the coupling holes on the mating surfaces. The coupling hole and the coupling protrusion are arranged at a position corresponding to a quarter width of the mat width from one side of the rubber chip mat for floor formation and the rubber chip mat for raising, and a quarter of the mat width from the other side. 3. The composite rubber chip mat for floor formation according to claim 1, wherein the composite rubber chip mat is disposed at a position corresponding to one width. 4. The floor forming composite rubber chip mat according to claim 1, 2 or 3, wherein both the floor surface forming rubber chip mat and the raising rubber chip mat are isomorphic and equal thickness mats.

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