JP2010125649A - Recording head and recording device equipped with the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a recording head which can favorably measure a temperature near a heating element, and a recording device equipped with the recording head. <P>SOLUTION: This thermal head X1 includes a substrate 10, a plurality of heating elements 21 arranged on the substrate 10 in arrow-head directions D1, D2, a control IC 60 arranged on the substrate 10, a plurality of the first electro-conductive layers 31 by which the plurality of heating elements 21 and a plurality of terminals attached to each of a plurality of control ICs 60 which are arranged on the substrate 10 are electrically connected, and a common connection part 322 which is commonly connected to the plurality of heating elements 21 connected to one control IC 60 arranged on the substrate 10. A thermistor 411 is installed along the common connection part 322. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a recording head such as a thermal head used as a printing device such as a facsimile, a barcode printer, a video printer, or a digital photo printer, and a recording apparatus including the recording head.

  For example, as disclosed in Patent Document 1, a thermal printer includes a thermal head in which a plurality of heating elements are arranged on the upper surface of a head substrate, and a transport mechanism that transports a recording medium toward the heating elements of the thermal head. And forms an image by transferring heat generated by each heating element to a recording medium such as thermal paper in accordance with a signal input to the thermal head. The heating element of the thermal head mounted on the thermal printer having such a configuration is connected to a conductive pattern, and power corresponding to a desired image is supplied through the conductive pattern.

In the above-described thermal head, the temperature of the heat generating element fluctuates due to the driving of the heat generating element, and thus the temperature necessary for image formation may fluctuate. Therefore, a thermal head in which a thermistor is provided on the lower surface of the head substrate has been developed and disclosed in, for example, Patent Document 2.
Japanese Patent Laid-Open No. 53-016638 JP 2006-297665 A

  However, in the thermal head disclosed in Patent Document 2, since the thermistor is provided on the lower surface of the substrate, it may take time to transfer the heat generated by the heating element.

  The present invention has been conceived under such circumstances, and an object thereof is to provide a recording head capable of satisfactorily measuring the temperature in the vicinity of a heating element and a recording apparatus including the recording head. To do.

  The recording head of the present invention is arranged on a substrate, a plurality of heating elements arranged on the substrate along the main scanning direction, a control element arranged on the substrate, and the substrate. A plurality of control wirings electrically connecting the plurality of heating elements and a plurality of terminals provided in each of the plurality of control elements, and the control disposed on the substrate. And a common wiring connected in common to a plurality of heating elements connected to the element, and a thermistor is provided along the common wiring.

  In the recording head according to the aspect of the invention, it is preferable that the common wiring has a through hole penetrating in the thickness direction, and the thermistor is provided inside the through hole of the common wiring. The recording head has a second control wiring connected to the thermistor and a connection terminal electrically connected to the outside. The second control wiring is connected to the connection terminal. More preferably. The recording head further includes a second control wiring connected to the thermistor, and the second control wiring is electrically connected to a common wiring surrounding the thermistor. More preferably, it is connected to the control element.

  The recording head of the present invention includes a second control wiring connected to the thermistor, a connection terminal electrically connected to the outside, and a plurality of connection wirings electrically connecting the connection terminal and the common wiring. The thermistor is provided in a region surrounded by the common wiring, the plurality of connection wirings, and the connection terminals, and the second control wiring is connected to the connection terminals. It is preferable that

  The recording head of the present invention has a second control wiring connected to the thermistor, and the thermistor has a narrow width in plan view compared to a connection portion connected to the second control wiring. It is preferable to have a narrow part.

  A recording apparatus of the present invention includes the recording head according to the present invention and a transport mechanism for transporting a recording medium.

  The recording head of the present invention includes a substrate, a plurality of heating elements arranged along the main scanning direction on the substrate, a control element arranged on the substrate, and a plurality of elements arranged on the substrate. A plurality of control wirings electrically connecting a plurality of heating elements and a plurality of terminals provided in each of the plurality of control elements, and connected to one control element disposed on the substrate A common wiring connected in common to the plurality of heating elements, and a thermistor is provided along the common wiring. Therefore, the recording head of the present invention can sense the heat of a plurality of heating elements connected to one control element that is transmitted via the common wiring. Therefore, in the recording head of the present invention, the temperature in the vicinity of the heating element can be measured well.

  In the recording head of the present invention, when the common wiring has a through-hole penetrating in the thickness direction and the thermistor is provided inside the through-hole of the common wiring, the common wiring surrounds the thermistor. The heat of the heat generating element to be transmitted can be sensed. Therefore, with this recording head, the temperature in the vicinity of the heating element can be measured better. When this recording head has a second control wiring connected to the thermistor and a connection terminal electrically connected to the outside, and the second control wiring is connected to the connection terminal, This is more suitable for utilizing the temperature change in the vicinity of the heating element measured using the thermistor for the control of the entire recording head. In addition, the recording head has a second control wiring connected to the thermistor, and the second control wiring is electrically connected to a common wiring surrounding the thermistor. The temperature change in the vicinity of the heating element measured using the thermistor is more suitable for use in controlling a plurality of heating elements connected to one control element.

  The recording head of the present invention includes a second control wiring connected to the thermistor, a connection terminal electrically connected to the outside, and a plurality of connection wirings electrically connecting the connection terminal and the common wiring. And the thermistor is provided in a region surrounded by the common wiring, the plurality of connection wirings, and the connection terminal, and the second control wiring is connected to the connection terminal, the connection wiring is It is also possible to sense the heat of the heating element transmitted through the sensor. Therefore, with this recording head, the temperature in the vicinity of the heating element can be measured better.

  The recording head of the present invention has a second control wiring connected to the thermistor, and the thermistor has a narrow portion that is narrower in plan view than the connecting portion connected to the second control wiring. When it has, the change of the resistance value with respect to the unit temperature of the thermistor can be enlarged. Therefore, with this recording head, the temperature in the vicinity of the heating element can be measured with higher accuracy.

  Since the recording apparatus of the present invention includes the above-described recording head of the present invention, it is possible to enjoy the effects of the recording head according to the above-described present invention. That is, this recording apparatus can form a good image by measuring the temperature in the vicinity of the heating element well.

<First form of recording head>
FIG. 1 is a plan view showing a schematic configuration of a thermal head X1 which is an example of an embodiment of a recording head of the present invention.

  FIG. 2 is an enlarged plan view of a main part of the thermal head X1 shown in FIG.

  3 is a cross-sectional view taken along the line III-III shown in FIG.

  The thermal head X1 includes a substrate 10, a first resistor layer 20, a conductive layer 30, a temperature measuring element 40, a protective layer 50, a driving IC 60, and an external connection member 70. .

  The substrate 10 has a function of supporting the first resistor layer 20, the conductive layer 30, the protective layer 50, and the driving IC 60. This board | substrate 10 is comprised by the rectangular shape extended in arrow direction D1, D2 in planar view. Here, the “plan view” means a view in the direction of arrow D6. Moreover, this board | substrate 10 has the thermal storage layer 11 on the main surface.

  The heat storage layer 11 has a function of temporarily storing a part of heat generated in a heating element 21 described later of the first resistor layer 20. That is, the heat storage layer 11 plays a role of improving the thermal response characteristics of the thermal head X1 by shortening the time required to raise the temperature of the heating element 21. The heat storage layer 11 is provided over the entire main surface of the substrate 10. In addition, the heat storage layer 11 has protrusions extending in the arrow directions D1 and D2. The projecting portion of the heat storage layer 11 has a substantially semi-elliptical cross section in the arrow directions D3 and D4 orthogonal to the arrow directions D1 and D2.

  The first resistor layer 20 has a portion that functions as the heating element 21. The first resistor layer 20 is configured such that the electrical resistance value per unit length is larger than the electrical resistance value per unit length of the conductive layer 30. In the present embodiment, a portion of the first resistor layer 20 to which a voltage is applied from the conductive layer 30 where the conductive layer 30 is not formed functions as the heating element 21. Examples of the material for forming the first resistor layer 20 include a TaN-based material, a TaSiO-based material, a TaSiNO-based material, a TiSiO-based material, a TiSiCO-based material, and an NbSiO-based material.

  The heating element 21 generates heat when power is supplied. The heat generating element 21 is configured such that a heat generation temperature by power supply from the conductive layer 30 is in a range of, for example, 200 [° C.] or more and 550 [° C.] or less. The heating elements 21 are positioned above the heat storage layer 11 and are arranged along the arrow directions D1 and D2. In the present embodiment, the arrangement direction of the heating elements 21 is the main scanning direction of the thermal head X1. In addition, each of the heating elements 21 is configured in a rectangular shape in plan view. In addition, the heating elements 21 are configured to have substantially the same planar view widths (lengths in the arrow directions D1 and D2) along the arrow directions D1 and D2, and are arranged at a density of about 300 dpi. ing. Here, “substantially the same” includes those within a general manufacturing error range, for example, a range in which an error with respect to the average value of the length of each part is within 10%. The heating element 21 of the present embodiment is connected to the driving IC 60, and constitutes a heating element group 21a for each connected driving IC 60.

  The conductive layer 30 has a function of applying a voltage to the heating element 21. A part of the conductive layer 30 is located on the first resistor layer 20. The conductive layer 30 includes a first conductive layer 31, a second conductive layer 32, and a third conductive layer 33. Examples of the material for forming the conductive layer 30 include any one of aluminum, gold, silver, and copper, or an alloy thereof.

  One end of the first conductive layer 31 is connected to one end of each heating element 21. The other end of the first conductive layer 31 is connected to the drive IC 60. The first conductive layer 31 of this embodiment constitutes a control wiring group 31a for each connected driving IC 60, and is connected corresponding to the heating element group 21a. The control wiring group 31a is alternately connected to an end portion on the arrow D3 direction side and an end portion on the arrow D4 direction side of the heating element groups 21a adjacent to each other.

  The second conductive layer 32 includes a wiring part 321, a common connection part 322, a first connection part 323, and a second connection part 324. The second conductive layer 32 of the present embodiment is provided between the control wiring groups 31a adjacent in the arrow directions D1 and D2.

  One end of the wiring part 321 is connected to the other end of each heating element 21.

  The common connection portion 322 is connected in common to the other ends of the plurality of wiring portions 321 connected to one heating element group 21a, and extends along the arrow directions D1 and D2.

  One end of each of the first connection part 323 and the second connection part 324 is connected to the common connection part 322. The first connection portion 323 and the second connection portion 324 are provided apart from each other in the arrow directions D1 and D2.

  The third conductive layer 33 has one end connected to the drive IC 60 and the other end connected to the external connection member 70. The third conductive layer 33 has a function of transmitting an electric signal input to the external connection member 70 to the drive IC 60.

  The temperature measuring element 40 contributes to measuring the temperature in the vicinity of the heating element 21. The temperature measuring element 40 includes a second resistor layer 41 and a fourth conductive layer 42.

  The second resistor layer 41 has a portion that functions as the thermistor 411. In the present embodiment, a portion of the second resistor layer 41 to which a voltage is applied from the fourth conductive layer 42 where the fourth conductive layer 42 is not formed functions as the thermistor 411. The second resistor layer 41 is made of a material having a larger rate of change in electrical resistance value with respect to a unit temperature change than the fourth conductive layer 42. Examples of the material for forming the second resistor layer 41 include TaN-based materials, TaSiO-based materials, TaSiNO-based materials, TiSiO-based materials, TiSiCO-based materials, and NbSiO-based materials.

  The thermistor 411 changes its electrical resistance value due to temperature changes. The thermistor 411 of this embodiment is formed of a resistor thin film. The thermistor 411 is provided in each of the regions surrounded by the common connection portion 322, the first connection portion 323, and the second connection portion 324 of each second conductive layer 32.

  The fourth conductive layer 42 has a function of applying a voltage to the thermistor 411. The fourth conductive layer 42 is located on the second resistor layer 41. The fourth conductive layer 42 extends in the arrow directions D 3 and D 4 and is connected to the external connection member 70. As a material for forming the fourth conductive layer 42, for example, any one of aluminum, gold, silver, and copper, or an alloy thereof can be used.

The protective layer 50 has a function of protecting the heat generating element 21 and the conductive layer 30. As a material mainly forming the protective layer 50, for example, diamond-like carbon material, SiC-based material, SiN-based material, SiCN-based material, SiON-based material, SiONC-based material, SiAlON-based material, and SiO ₂ Material, Ta ₂ O ₅ material, TaSiO material, TiC material, TiN material, TiO ₂ material, TiB ₂ material, AlC material, AlN material, Al Examples thereof include ₂ O ₃ -based materials, ZnO-based materials, B ₄ C-based materials, and BN-based materials. Here, the “diamond-like carbon material” refers to a film in which the proportion of carbon atoms (C atoms) taking sp ³ hybrid orbits is in the range of 1 [atomic%] to less than 100 [atomic%]. In addition, “to a material mainly composed of a system material” herein refers to a material whose main material is 50% by mass or more with respect to the whole, and may contain an additive, for example. The protective layer 50 of the present embodiment is formed by a sputtering method.

  The drive IC 60 has a function of controlling the heat generation of the plurality of heat generating elements 21. The drive IC 60 is connected to the other end of the first conductive layer 31. With such a configuration, the heat generating element 21 can selectively generate heat.

  The driving IC 60 of this embodiment constitutes two driving IC groups 60a and 60b arranged in the arrow directions D1 and D2. The drive IC groups 60a and 60b are provided on the arrow D3 direction side or the arrow D4 direction side of the row of the heat generating elements 21.

  The external connection member 70 has a function of supplying an electrical signal for driving the heating element 21. The external connection member 70 is electrically connected to the drive IC 60 through the third conductive layer 33. Examples of the external connection member 70 include a combination of a flexible cable and a connector.

  The thermal head X1 is disposed on the substrate 10, the plurality of heating elements 21 arranged on the substrate 10 along the arrow directions D1 and D2, the control IC 60 disposed on the substrate 10, and the substrate 10. A plurality of first conductive layers 31 electrically connecting a plurality of heating elements 21 and a plurality of terminals provided in each of the plurality of control ICs 60, and the substrate 10 are disposed on the substrate 10. And a common connection portion 322 commonly connected to the plurality of heating elements 21 connected to one control IC 60, and a thermistor 411 is provided along the common connection portion 322. Therefore, the thermal head X1 can sense the heat of the plurality of heating elements 21 connected to one control IC 60 transmitted via the common connection portion 322. Therefore, in the thermal head X1, the temperature in the vicinity of the heating element 21 can be measured well.

The thermal head X1 electrically connects the fourth conductive layer 42 connected to the thermistor 411, the external connection member 70 electrically connected to the outside, and the external connection member 70 and the common connection portion 322. The thermistor 411 is surrounded by the common connection part 322, the first connection part 323 and the second connection part 324, and the external connection member 70. Since the fourth conductive layer 42 is provided in the region and is connected to the external connection member 70, the heat of the heating element 21 transmitted through the first connection portion 323 and the second connection portion 324 is also sensed. can do. Therefore, in the thermal head X1, the temperature in the vicinity of the heating element 21 can be measured better.
<Second form of recording head>
FIG. 4 is a plan view showing a schematic configuration of a thermal head X2, which is another example of the embodiment of the recording head of the present invention.

  FIG. 5 is an enlarged plan view of a main part of the thermal head X2 shown in FIG.

  FIG. 6 is a cross-sectional view taken along the line VI-VI shown in FIG.

  The thermal head X2 includes a thermal head in that it is a substrate 10A instead of the substrate 10, a conductive layer 30A instead of the conductive layer 30, and a temperature measuring element 40A instead of the temperature measuring element 40. Different from X1. Other configurations of the thermal head X2 are the same as those described above with respect to the thermal head X1.

  The substrate 10A is different from the substrate 10 in that it has a through hole 10a that penetrates the substrate 10A. Other configurations of the substrate 10A are the same as those described above with respect to the substrate 10.

  The conductive layer 30A is different from the conductive layer 30 in that the second conductive layer 32A is used instead of the second conductive layer 32. Other configurations of the conductive layer 30A are the same as those described above with respect to the conductive layer 30.

  The second conductive layer 32A includes a wiring part 321 and a common connection part 322A.

  The common connection portion 322A is connected in common to the other ends of the plurality of wiring portions 321 connected to one heating element group 21a, and is connected to the external connection member 70. The common connection portion 322A has a through hole 322a so as to surround the through hole 10a of the substrate 10A.

  The temperature measuring element 40A includes a second resistor layer 41A and a fourth conductive layer 42A.

  The second resistor layer 41A has a portion that functions as the thermistor 411A. In the present embodiment, a portion of the second resistor layer 41A to which a voltage is applied from the fourth conductive layer 42A where the fourth conductive layer 42A is not formed functions as the thermistor 411A.

  The thermistor 411A changes its electrical resistance value due to temperature changes. The thermistor 411A is provided inside the through hole 322a of the common connection portion 322A, and is provided in a region on the substrate 10A surrounded by a surface that defines the through hole 322a.

  The fourth conductive layer 42A has a function of applying a voltage to the thermistor 411A. The fourth conductive layer 42A is located on the second resistor layer 41A. The fourth conductive layer 42A is connected to the back surface of the substrate 10A through the through hole 10a of the substrate 10A, and is connected to the external connection member 70.

  In the thermal head X2, the common connection portion 322A has a through hole 322a penetrating in the arrow directions D5 and D6, and the thermistor 411A is provided inside the through hole 322a of the common connection portion 322A. The heat of the heating element 21 transmitted through the common connection portion 322A surrounding 411A can be sensed. Therefore, in the thermal head X2, the temperature in the vicinity of the heating element 21 can be measured better.

The thermal head X2 has a fourth conductive layer 42A connected to the thermistor 411A and an external connection member 70 electrically connected to the outside. The fourth conductive layer 42A is connected to the external connection member 70. Therefore, the temperature change in the vicinity of the heating element 21 measured using the thermistor 411A is suitable for use in controlling the entire thermal head X2.
<Third Embodiment of Recording Head>
FIG. 7 is a plan view showing a schematic configuration of a thermal head X3 which is another example of the embodiment of the recording head of the present invention.

  FIG. 8 is an enlarged plan view of a main part of the thermal head X3 shown in FIG.

  9 is a cross-sectional view taken along line IX-IX shown in FIG.

  The thermal head X3 is different from the thermal head X2 in that a temperature measuring element 40B is used instead of the temperature measuring element 40A and a control IC 60B is used instead of the control IC 60. Other configurations of the thermal head X3 are the same as those described above with respect to the thermal head X2.

  The temperature measuring element 40B includes a second resistor layer 41B and a fourth conductive layer 42B.

  The second resistor layer 41B has a portion that functions as the thermistor 411B. In the present embodiment, a portion of the second resistor layer 41B to which a voltage is applied from the fourth conductive layer 42B, where the fourth conductive layer 42B is not formed functions as the thermistor 411B.

  The thermistor 411B changes its electric resistance value due to temperature change. The thermistor 411B is provided inside the through hole 322a of the common connection portion 322B, and is provided in a region on the substrate 10B surrounded by a surface defining the through hole 322a.

  The fourth conductive layer 42B has a function of applying a voltage to the thermistor 411B. The fourth conductive layer 42B is located on the second resistor layer 41B. The fourth conductive layer 42B is connected to the back surface of the substrate 10B through the through hole 10a of the substrate 10B, and is connected to the control IC 60B through the other through hole 10a.

  The drive IC 60B has a function of applying substantially the same voltage to the thermistor 411B via the fourth conductive layer 42B and measuring the temperature change of the thermistor 411B from the change in the amount of current flowing to the thermistor 411B. ing. The drive IC 60B is configured to control the power supplied to the heating element 21 using the measured temperature change of the thermistor 411B.

The thermal head X3 has a fourth conductive layer 42B connected to the thermistor 411B, and the fourth conductive layer 42B is electrically connected to the common connection 322B surrounding the thermistor 411B. Since it is connected to the element 21, it is suitable for utilizing the temperature change in the vicinity of the heating element 21 measured using the thermistor 411B for controlling the plurality of heating elements 21 connected to one control IC 60B.
<Recording device>
FIG. 10 is an overall view showing a schematic configuration of a thermal printer Y which is an example of an embodiment of a recording apparatus of the present invention.

  The thermal printer Y includes a thermal head X1, a transport mechanism 80, and a driving unit 90, and performs printing on a recording medium P transported in the direction of arrow D3. Here, examples of the recording medium P include a thermal paper or a thermal film whose surface density varies due to heating, and an image which forms an image by transferring ink components of an ink film melted by heat conduction onto a transfer sheet. . In the present embodiment, the thermal head X1 is employed as the thermal head, but the thermal head X2 or the thermal head X3 may be employed instead of the thermal head X1.

  The transport mechanism 80 has a function of bringing the recording medium P into contact with the heating element 21 of the thermal head X1 while transporting the recording medium P in the direction of the arrow D3. The transport mechanism 80 includes a platen roller 81 and transport rollers 82, 83, 84, and 85.

  The platen roller 81 has a function of pressing the recording medium P against the protective layer 50 on the heating element 21. The platen roller 81 is rotatably supported in contact with the protective layer 50 on the heating element 21. The platen roller 81 has a configuration in which an outer surface of a columnar base is covered with an elastic member. This base is made of, for example, a metal such as stainless steel, and this elastic member is made of, for example, butadiene rubber having a thickness dimension in the range of 3 [mm] to 15 [mm].

  The transport rollers 82, 83, 84, 85 have a function of transporting the recording medium P. That is, the transport rollers 82, 83, 84, 85 supply the recording medium P between the heating element 21 of the thermal head X 1 and the platen roller 81, and between the heating element 21 of the thermal head X 1 and the platen roller 81. It plays a role of pulling out the recording medium P from the recording medium. These transport rollers 82, 83, 84, 85 may be formed of, for example, a metal columnar member, or, for example, have a configuration in which the outer surface of a columnar base is covered with an elastic member, like the platen roller 81. There may be.

  The drive unit 90 has a function of supplying image information to the drive IC 60. That is, the driving means 90 plays a role of supplying an electric signal for selectively driving the heat generating element 21 to the driving IC 60 via the external connection member 70.

  The driving means 90 of the present embodiment is configured to control the thermal head X1 in accordance with the resistance value change of the thermistor 411 detected via the external connection member 70.

  The thermal printer Y includes a thermal head X1. Therefore, the thermal printer Y can enjoy the effects of the thermal head X1. That is, the thermal printer Y can form a good image by measuring the temperature in the vicinity of the heating element 21 well.

  While specific embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications can be made without departing from the spirit of the invention.

  In this embodiment, the thermal head is described as an example of the recording head, but the present invention is not limited to the thermal head. Even when the configuration of the present invention is employed in, for example, an inkjet head or an LED head, the same effect can be achieved.

  The thermistor 411 of the present embodiment is not limited to the configuration shown above, and for example, the configuration shown in FIG. The thermistor preferably has a narrow portion that is narrower in plan view than the connecting portion connected to the fourth conductive layer 42. In such a case, the change of the resistance value with respect to the unit temperature of the thermistor 411 can be increased, and the temperature near the heating element 21 can be measured with higher accuracy.

  The substrate 10A of the present embodiment has the through hole 10a, but is not limited to such a configuration. For example, a multilayer wiring board may be employed as the substrate, and a through hole penetrating at least one layer of the multilayer wiring board may be employed as the above-described through hole 10a.

  The drive IC 60B of the present embodiment measures the change in the electrical resistance value of the thermistor 411 by current control, but is not limited to such a configuration, and may change the electrical resistance value of the thermistor 411 by voltage control.

1 is a plan view showing a schematic configuration of a thermal head that is an example of an embodiment of a recording head of the invention. FIG. 2 is an enlarged plan view of a main part of the thermal head shown in FIG. 1. It is sectional drawing along the III-III line | wire shown in FIG. It is a top view which shows schematic structure of the thermal head which is the other example of embodiment of the recording head of this invention. It is the top view to which the principal part of the thermal head shown in FIG. 4 was expanded. FIG. 6 is a cross-sectional view taken along the line VI-VI shown in FIG. 5. It is a top view which shows schematic structure of the thermal head which is the other example of embodiment of the recording head of this invention. It is sectional drawing to which the principal part of the thermal head shown in FIG. 7 was expanded. It is sectional drawing along the IX-IX line shown in FIG. 1 is an overall view showing a schematic configuration of a thermal printer which is an example of an embodiment of a recording apparatus of the present invention. It is a top view which shows the modification of the thermistor of this invention.

Explanation of symbols

X1, X2, X3 Thermal head Y Thermal printer 10 Substrate 11 Heat storage layer 20 First resistor layer 21 Heat generating part 30 Conductive layer 31 First conductive layer 32 Second conductive layer 321 Wiring part 322 Common connection part 323 First connection part 324 Second connection portion 33 Third conductive layer 40 Temperature measuring element 41 Second resistor layer 411 Thermistor 42 Fourth conductive layer 50 Protective layer 60 Drive IC
70 External connection member 80 Conveying mechanism 81 Platen rollers 82, 83, 84, 85 Conveying roller 90 Driving means P Recording medium

Claims (8)

A substrate, a plurality of heating elements arranged along the main scanning direction on the substrate, a control element arranged on the substrate, and the plurality of heating elements arranged on the substrate; A plurality of control wirings electrically connecting a plurality of terminals provided in each of the plurality of control elements, and a plurality of control wirings disposed on the substrate and connected to the one control element. Common wiring connected to the heating elements of
A recording head, wherein a thermistor is provided along the common wiring. The common wiring has a through hole penetrating in the thickness direction,
The recording head according to claim 1, wherein the thermistor is provided inside the through hole of the common wiring. A second control wiring connected to the thermistor and a connection terminal electrically connected to the outside;
The recording head according to claim 2, wherein the second control wiring is connected to the connection terminal. A second control wiring connected to the thermistor;
The recording head according to claim 2, wherein the second control wiring is connected to the control element that is electrically connected to a common wiring surrounding the thermistor. A second control wiring connected to the thermistor, a connection terminal electrically connected to the outside, and a plurality of connection wirings electrically connecting the connection terminal and the common wiring;
The thermistor is provided in a region surrounded by the common wiring, the plurality of connection wirings, and the connection terminals,
The recording head according to claim 1, wherein the second control wiring is connected to the connection terminal. A second control wiring connected to the thermistor;
3. The recording head according to claim 1, wherein the thermistor has a narrow portion that is narrower in plan view than a connection portion connected to the second control wiring. 4. A second control wiring connected to the thermistor;
6. The recording head according to claim 3, wherein the thermistor has a narrow portion narrower in plan view than a connection portion connected to the second control wiring. .   A recording apparatus comprising: the recording head according to claim 1; and a transport mechanism that transports a recording medium.

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