JP2010124233A - Device for manufacturing piezoelectric-vibration device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device for manufacturing a piezoelectric-vibration device, for correcting a reference value of each manufacturing process means. <P>SOLUTION: The device for manufacturing a piezoelectric-vibration device includes: a workpiece holding part 2 on which a workpiece 4 is placed; a plurality of manufacturing process means (a first transport means 50, a position adjustment means 80, a position measurement means, a first application means 10, a second transport means 60, a second application means 30, imaging inspection means 20, 40 and a third transport means 70) for applying a manufacturing process to the workpiece 4; a control part 6 for transmitting a control signal for controlling the operation of each manufacturing process means to the manufacturing process means; an adjustment block 3 to which a correction data acquisition process using the manufacturing process means is applied; a correction data creation part 7 for providing correction data to be attached to the control signal based on the result of the correction data acquisition process applied to the adjustment block 3; and a transport part for transporting the adjustment block 3 and the workpiece holding part 2. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a piezoelectric vibration device manufacturing apparatus that manufactures a piezoelectric vibration device by performing a plurality of manufacturing processes on a workpiece.

  As an example of a conventional piezoelectric vibration device, there is a crystal resonator using a crystal piece, and as an example of this crystal resonator, as shown in FIG. 13, a bottom portion 111a and a bank portion 111b stacked on the bottom portion 111a are formed. A casing 110 composed of a box-shaped base 111 and a plate-shaped lid 112, a pair of electrode pads 121 and 122 formed on the bottom 111 a of the base 111, and a cavity of the base 111. Some of them are composed of a crystal vibrating piece 130.

  A pair of excitation electrodes 131 and 132 and lead electrodes 131 a and 132 a extending from the excitation electrodes 131 and 132 are formed on both main surfaces (one main surface and the other main surface) of the quartz crystal vibrating piece 130. Yes. Furthermore, the quartz crystal resonator element 130 is mechanically fixed to the electrode pads 121 and 122 by conductive resin bonding materials 141 and 142 at both corners at one end where the lead electrodes 131a and 132a are extended. , 132 are electrically connected to the electrode pads 121, 122 via lead electrodes 131a, 132a and conductive resin bonding materials 141, 142.

  The conductive resin bonding materials 141 and 142 are formed by curing the conductive resin applied on the electrode pads 121 and 122 after disposing the crystal vibrating piece 130.

  A plurality of external connection electrodes (not shown) electrically connected to the electrode pads 121 and 122 are formed on the lower surface of the base 111.

  Further, in this crystal resonator, the outer peripheral edge portion of the upper surface of the base 111 and the outer peripheral edge portion of the lower surface of the lid 112 are bonded by the sealing bonding material 160, and the inside of the housing 110 is hermetically sealed. In FIG. 13, in order to illustrate the inside of the housing 110, the lid 112 is illustrated as being shifted above the base 111.

  As an example of a conventional piezoelectric vibration device manufacturing apparatus, there is a crystal oscillator manufacturing apparatus as shown in FIG. This quartz crystal manufacturing apparatus includes a disk-shaped index table 101 that can be intermittently rotated in a direction indicated by an arrow Z101 (counterclockwise direction), and an index table 101 along an outer peripheral end of the index table 101. A plurality of work holding units 102 arranged at predetermined intervals on the upper surface, and a plurality of manufacturing processing units arranged around the index table 101 for performing various manufacturing processes are provided.

  Examples of the plurality of manufacturing processing units include a first transport unit 104, a position adjusting unit 105, a first coating unit 106a, a second transport unit 107, a second coating unit 106b, and a third transport unit 108.

  The first transport unit 104 stores a base 111 that is a work transported on the index table 101, holds the base 111, and transports the base 111 from the first pallet 104a to the work holding unit 102. And a first handling system 104b. In addition, in FIG. 14, the conveyance direction of the base 111 by the 1st conveyance means 104 is shown using the arrow Z102.

  The position adjusting unit 105 is a positioning device that immediately adjusts the position of the base 111 after the first conveying unit 104 arranges the base 111 on the upper surface of the work holding unit 102. This position adjustment is performed by pressing the side surface of the base 111 from four sides with the four position adjusting pieces constituting the position adjusting device, and rubbing the base 111 on the upper surface of the work holding unit 102 to move to a preset position. Is implemented.

  The first application means 106a includes a syringe filled with a paste-like conductive resin that forms the conductive resin bonding materials 141 and 142 by curing, and discharges the conductive resin from a needle provided at one end of the syringe. In particular, the first coating means 106 a performs the undercoating that is performed before the crystal vibrating piece 130 is placed.

  The second conveying means 107 is a second pallet 107a for storing a plurality of crystal vibrating pieces 130 as a work, and takes out the crystal vibrating pieces 130 from the second pallet 107a and conveys them to the cavity of the base 111, so And a second handling system 107b for disposing a crystal vibrating piece 130 on the upper surfaces of the electrode pads 121 and 122 that have been applied. In addition, in FIG. 14, the conveyance direction of the crystal vibrating piece 130 by the 2nd conveyance means 107 is shown using the arrow Z103.

  The second application unit 106b includes a syringe filled with the conductive resin, and discharges the conductive resin from a needle provided at one end of the syringe, so that the extraction electrodes 131a and 132a of the crystal vibrating piece 130 are extended. The conductive resin is applied to the upper surfaces of the electrode pads 121 and 122 together with both corners of the provided one end. In particular, the second coating means 106b performs top coating that is performed after the quartz crystal vibrating piece 130 is placed. As a conventional example of a piezoelectric vibration device in which the excitation electrodes 131 and 132 and the electrode pads 121 and 122 are electrically and mechanically connected using such a paste-like conductive resin and a method for manufacturing the piezoelectric vibration device, There is a crystal vibrating device and a method for manufacturing the crystal vibrating device disclosed in Japanese Patent Application Laid-Open No. 2007-96945 of Patent Document 1 below.

  Although not shown, an inspection camera, which is a manufacturing processing means, is further arranged around the index table 101. This inspection camera images the inside of the base 111 in a state where the top application is performed by the second application unit 106b. After this imaging, an inspection is performed to determine whether the base 111 is a good product or a defective product based on the applied state of the conductive resin and the arrangement state of the crystal vibrating piece 130 using the obtained image data. The

  The third transport unit 108 includes a third handling system 108b for discharging the base 111 from the work holding unit 102 disposed on the index table 101, and a third pallet 108a for storing the discharged base 111. When discharging the base 111, only the base 111 determined to be non-defective is conveyed to the third pallet 108a, and the base 111 determined to be defective is another pallet (a pallet for storing defective products) not shown. To be transported. In addition, in FIG. 14, the conveyance direction of the base 111 by the 3rd conveyance means 108 is shown using the arrow Z104.

  Furthermore, the first handling system 104b, the second handling system 107b, and the third handling system 108b include holding arms 104b1, 107b1, and 108b1 each having a vacuum suction collet that holds a work by vacuum suction or a pair of holding pieces that hold the work. And arm driving units 104b2, 107b2, and 108b2 for moving the holding arms 104b1, 107b1, and 108b1 in the horizontal direction and the vertical direction, respectively. In this specification, “horizontal direction” is a direction parallel to the top surface of the index table 101, and “vertical direction” is a direction perpendicular to the top surface of the index table 101.

Further, the work holding portion 102 is a thin plate-like member, and as shown in FIG. 15, a positioning mark 102a is provided on the work placement surface. The mark 102a is, for example, a recess or a through-hole, and is used for positioning the manufacturing processing means when applying a conductive resin to the upper surfaces of the electrode pads 121 and 122 or when placing the quartz crystal vibrating piece 130 inside the base 111. .
JP 2007-96945 A

  In the conventional crystal resonator manufacturing apparatus as described above, means for contacting the workpiece when performing the manufacturing process (for example, the first transport means, the position adjusting means, the second transport means, the second coating means, and the second coating means). Position information indicating a stop position at the time of performing the manufacturing process for positioning of the means for carrying out the manufacturing process on the workpiece (for example, the inspection camera, the first applying means, the second applying means, etc.). Is set during initial setup. And at the time of manufacturing process implementation, operation control of each manufacturing process means is implemented according to this positional information.

  Further, the vacuum suction collet, the sandwiching piece, and the position adjusting piece need to be replaced due to aging, while the syringe needs to be replaced (or dismantled and cleaned) by hardening of the adhesive attached to the needle tip. For example, the syringe needs to be replaced about every 8 hours depending on the type of adhesive. However, when such replacement is performed, the positions of the vacuum suction collet, the clamping piece, the position adjusting piece, and the syringe may be shifted before and after replacement.

  Therefore, in the conventional crystal resonator manufacturing apparatus, the operator can place the workpiece in the correct position by the vacuum suction collet, the clamping piece, and the position adjusting piece, or the conductive resin after application is placed on the upper surface of the electrode pad. It was confirmed by visual inspection whether it was applied at the correct position. In addition, if there is a deviation because it is not placed or applied at the correct position, the manufacturing process is performed again after adjusting the stop position (processing execution position) during the manufacturing process as a correction for the deviation. Visual inspection was performed.

  For this reason, it is necessary to have a skill and time required for judgment and correction of deviation in visual inspection, and a defect occurs before correction of deviation is completed, resulting in a decrease in yield and an increase in manufacturing cost. There was a problem such as.

  On the other hand, the setting of the scale of the image obtained by the inspection camera has been carried out, for example, by imaging from above the mark whose upper end surface provided on the upper surface of the work holding unit is a circular recess or through-hole. . Specifically, after extracting the image of the mark from the circular image data obtained by imaging the mark, obtaining a value representing the diameter of this image in terms of the number of pixels, the actual size of the mark diameter is obtained from this pixel. By dividing by the number, the actual size per pixel was obtained and used as a scale. However, the mark holding portion gradually wears when the workpiece holding portion comes into contact with the position adjusting piece or the like. For this reason, there is a problem that the outer peripheral shape of the mark cannot be accurately extracted from the image data and the scale cannot be set.

  The present invention has been devised to solve such problems, and its purpose is to perform a manufacturing process on the workpiece of each manufacturing processing means (for example, a vacuum suction collet, a clamping piece, a position adjusting piece, and a position adjusting piece). Manufacture of a piezoelectric vibration device capable of correcting data (reference value) used as a reference for operation and judgment in performing manufacturing processing such as correction of a processing execution position of a syringe and the like and calibration of a scale of an inspection camera. To provide an apparatus.

  In order to solve the above-described problems, a piezoelectric vibrating device manufacturing apparatus according to the present invention includes a piezoelectric vibrating piece on which an excitation electrode is formed, a casing that hermetically seals the piezoelectric vibrating piece, the casing is disposed in the casing, For manufacturing a piezoelectric vibration device comprising an electrode pad electrically connected to an excitation electrode, as shown in FIG. 1, a work holding unit 2 on which a work 4 is placed, and a work 4 A plurality of manufacturing processing means (for example, a first conveying means 50, a position adjusting means 80, a position measuring means, a first applying means 10, a second conveying means 60, a second applying means 30 to be described later). Imaging inspection means 20, 40 and third transport means 70), a control unit 6 for transmitting a control signal for controlling the operation of each manufacturing processing means to the manufacturing processing means, and correction data acquisition using the manufacturing processing means For adjustment to be processed A lock 3 is made and a correction data creation unit 7 to obtain the correction data is added to the control signal based on a result of the applied to the adjustment block 3 the correction data acquisition process. Further, the piezoelectric vibration device manufacturing apparatus may include a transport unit that transports the adjustment block 3 and the work holding unit 2.

  Thereby, the reference value of each manufacturing processing means can be corrected based on the result of the manufacturing processing applied to the adjustment block.

  Further, at least one of the plurality of manufacturing processing means (for example, the first applying means 10 and the second applying means 30) discharges the adhesive from the discharge portion as the manufacturing process and applies the adhesive. A position for contacting the processing execution position or the adjustment block from the standby position by displacing the position of the support means. The piezoelectric vibration device manufacturing apparatus includes an initial set value of a distance that the support means moves while moving the ejection unit from the standby position to the contact position. Is further provided with comparison data storage means for preliminarily storing comparison data indicating. In such a configuration, the correction data acquisition process includes a step of moving the ejection unit from the standby position to the contact position to contact the adjustment block, and the correction data generation unit waits for the ejection unit. Movement distance data indicating the distance that the support means has moved while moving from the position to the contact position is acquired as a result of the manufacturing process, and the difference between the acquired movement distance data and the comparison data is determined as the one manufacturing processing means. It may be obtained as correction data to be added to a control signal for controlling the operation.

  In this case, the processing execution position can be corrected by adding correction data to the control signal, and as a result, the adhesive can be applied in a state where the ejection unit is arranged at a correct position.

  In addition, at least one of the plurality of manufacturing processing means (for example, the first conveying means 50, the position adjusting means 80, the second conveying means 60, and the third conveying means 70) is a workpiece as the manufacturing process. A processing execution means for holding and transporting, a support means for supporting the processing execution means, and a position of the support means is displaced so that the tip of the processing execution means comes into contact with the processing execution position or the adjustment block from the standby position. Drive means for moving to a contact position that is a position to be moved, and in the piezoelectric vibration device manufacturing apparatus, the support means is moved while the tip of the processing execution means is moved from the standby position to the contact position. The apparatus further includes comparison data storage means for previously storing comparison data indicating an initial set value of the distance to be transmitted. In such a configuration, the correction data acquisition process includes a step of moving the processing execution unit from the standby position to the contact position to contact the adjustment block, and the correction data creation unit includes the processing execution unit. As a result of the manufacturing process, movement distance data indicating the distance that the support means has moved during the period from the standby position to the contact position is acquired, and the acquired movement distance data and the discharge unit are set to the standby position. Even if the difference from the comparison data indicating the distance to which the support means should move while moving from the contact position to the contact position is obtained as correction data added to the control signal for controlling the operation of the one manufacturing processing means. Good.

  In this case, the processing execution position can be corrected by adding correction data to the control signal, and as a result, the workpiece can be conveyed (or moved) to the correct position.

  In addition, at least one of the plurality of manufacturing processing means (for example, the imaging inspection means 20) is replaced with another manufacturing processing means (for example, the first transport means 50, the position adjusting means 80, the first coating means). 10, image pickup means for obtaining image data by picking up an image of the work holder after the manufacturing process is performed by the second transfer means 60, the second coating means 30, and the third transfer means 70), and image processing on the image data A comparison data storage in which the piezoelectric vibration device manufacturing apparatus stores, in advance, comparison data indicating an initial set value of a position where the manufacturing process is performed by the other manufacturing processing unit, along with the position where the manufacturing process is performed. Means are further provided. In such a configuration, the correction data acquisition process performs a manufacturing process by other manufacturing processing means on the adjustment block, and obtains image data by imaging the adjustment block using the imaging means. And the step of performing image processing on the image data using the image processing means and acquiring position data indicating the position where the manufacturing process has been performed, and the correction data creating unit acquires the acquired position data. And the comparison data may be obtained as correction data added to a control signal for controlling the operation of the other manufacturing processing means.

  In this case, the manufacturing process can be performed at the correct position by adding the correction data to the control signal.

  In addition, at least one manufacturing processing unit (for example, an imaging inspection unit) of the plurality of manufacturing processing units captures the workpiece holding unit to obtain image data, and performs image processing on the image data. And an image processing means for detecting the number of pixels constituting an image of a preset part of the workpiece holding unit, and the piezoelectric vibration device manufacturing apparatus includes: The apparatus further includes comparison data storage means for previously storing comparison data indicating the dimension of a preset part. In such a configuration, the correction data acquisition processing is performed by imaging the adjustment block using the imaging unit to obtain image data, and performing image processing on the image data using the image processing unit for adjustment. Detecting a number of pixels constituting an image of a predetermined portion of the block for use, wherein the correction data creating unit divides the value obtained by dividing the comparison data by the number of detected pixels. It may be obtained as correction data to be added to a control signal for controlling the operation.

  In this case, by adding correction data to the control signal, it is possible to calibrate the scale of the imaging means (the actual size of the imaging object per pixel).

  In addition, at least one of the plurality of manufacturing processing means (for example, position measuring means) measures the position of a preset part of the work holding unit and determines the position of the preset part. The apparatus for manufacturing the piezoelectric vibration device includes position data for obtaining position data to be shown, and the manufacturing apparatus for the piezoelectric vibration device stores comparison data in which comparison data indicating an initial set value of a position of a preset portion of the adjustment block is stored in advance. Means are further provided. In such a configuration, the correction data acquisition process includes a step of acquiring position data indicating a position of a preset part of the adjustment block using a position measurement unit, and the correction data generation unit includes the correction data generation unit. The difference between the comparison data and the acquired position data may be obtained as correction data added to a control signal for controlling the operation of the one manufacturing processing means.

  In this case, the calibration error can be calibrated by adding correction data to the control signal.

  Since the present invention is configured as described above, the correction of the reference value of each manufacturing processing means can be performed using one adjustment block.

  Hereinafter, an embodiment of a piezoelectric vibration device manufacturing apparatus of the present invention will be described with reference to the drawings.

  FIG. 1 is an explanatory view showing an embodiment of a manufacturing apparatus of a piezoelectric vibration device of the present invention.

  In addition, the solid line arrow in a figure shows transmission / reception of data, and the dashed-two dotted line arrow has shown that the manufacturing process by a manufacturing process means is implemented.

  The piezoelectric vibration device manufacturing apparatus includes a plurality of work holding units 2 on which the work 4 is placed, and a plurality of manufacturing processing means (for example, first application means 10 described later, Imaging inspection means 20, 40, second coating means 30, position measuring means, first conveying means 50, second conveying means 60, third conveying means 70, position adjusting means 80, etc.) and the operation of each manufacturing processing means. A control unit 6 that outputs a control signal to be controlled, an adjustment block 3 that is subjected to correction data acquisition processing using the manufacturing processing means, and added to the control signal based on the result of the correction data acquisition processing A correction data creation unit 7 that obtains correction data, a comparison data storage unit 8 that stores comparison data used when the correction data creation unit 7 obtains correction data, a work holding unit 4 and an adjustment block 3 Consisting conveying unit for conveying (not shown).

  The work holding part 2 is a thin plate-like member whose upper surface shape is a rectangle, and unlike the work holding part shown in FIG.

  The adjustment block 3 is used when creating correction data to be added to a control signal for controlling the operation of the manufacturing processing means.

  The said conveyance part is comprised by the index table or the belt conveyor, for example.

  The comparison data stored in the comparison data storage unit 8 is an initial setting value set in advance based on the installation state when the piezoelectric vibration device manufacturing apparatus is installed in the production line, and a specific example will be described later.

  Between the control unit 6 and each manufacturing processing unit, a control signal is transmitted from the control unit 6 to each manufacturing processing unit, and the state of each manufacturing processing unit is indicated from each manufacturing processing unit to the control unit 6 (for example, Process status data is transmitted (indicating that the manufacturing process is complete).

  FIG. 2 is an explanatory diagram illustrating an example of a piezoelectric vibration device manufactured using the piezoelectric vibration device manufacturing apparatus illustrated in FIG. 1.

  This piezoelectric vibration device includes a casing 91 composed of a box-shaped base 91a and a plate-shaped lid 91b, each of which includes a bottom 91a1 and a bank 91a2 stacked on the bottom 91a1, and a bottom 91a1 of the base 91a. The crystal resonator 90 is composed of a pair of electrode pads 92a and 92b formed on the base plate and a crystal vibrating piece 93 disposed in the cavity of the base 91a.

  A pair of excitation electrodes 93a1 and 93a2 and lead electrodes 93a11 and 93a21 extending from the excitation electrodes 93a1 and 93a2 are formed on both main surfaces (one main surface and the other main surface) of the quartz crystal vibrating piece 93. Yes. Further, the crystal vibrating piece 93 is mechanically fixed to the electrode pads 92a and 92b by conductive resin bonding materials 94a and 94b at both ends of the ends where the drawers 93a11 and 93a21 are extended. 93a2 is electrically connected to electrode pads 92a and 92b via lead electrodes 93a11 and 93a21 and conductive resin bonding materials 94a and 94b.

  The conductive resin bonding materials 94a and 94b are formed by curing the conductive resin applied on the electrode pads 92a and 92b after disposing the crystal vibrating piece 93.

  In addition, a plurality of external connection electrodes (not shown) electrically connected to the electrode pads 92a and 92b are formed on the lower surface of the base 91a.

  Further, in this crystal resonator 90, the outer peripheral edge portion of the upper surface of the base 91a and the outer peripheral edge portion of the lower surface of the lid 91b are bonded by a sealing bonding material 96, and the inside of the housing 91 is hermetically sealed. In FIG. 2, in order to illustrate the inside of the housing 91, the lid 91 b is illustrated as being shifted above the base 91 a.

  In this embodiment, the crystal resonator 90 having the configuration shown in FIG. 2 is shown as an example of the piezoelectric vibration device. However, in the present invention, the piezoelectric vibration device is not limited to this form. For example, the shape and configuration of the casing 91 and the shapes and positions of the excitation electrodes 93a1 and 93a2 may be different.

  FIG. 3 is an explanatory diagram illustrating an example of a work holding unit, a plurality of manufacturing processing units, an adjustment block, and a conveyance unit that configure the manufacturing apparatus of the piezoelectric vibration device illustrated in FIG. 1.

  As shown in the drawing, the transport section can intermittently rotate in the direction indicated by the arrow A (counterclockwise direction) with the disk-shaped index table 1 and the plane-side center point as an axis. A rotation mechanism (not shown) is provided as a transport unit.

  On the upper surface of the index table 1, a plurality of work holding portions 2 and one adjustment block 3 are arranged concentrically at regular intervals along the outer peripheral end of the index table 1.

  Further, in the peripheral portion of the index table 1, as a plurality of manufacturing processing means, a first transport means 50, a position adjustment means 80, a position measurement means (not shown), a first application means 10, a second transport means 60, a second 2 coating means 30, imaging inspection means 20, 40, third transport means 70, etc. are sequentially arranged in a counterclockwise direction. These manufacturing processing means are merely examples, and can be changed according to the contents of the manufacturing processing to be performed. Further, the arrangement of each manufacturing processing means is merely an example, and can be changed in accordance with the order in which the manufacturing processing is performed.

  The first transport means 50 stores a first pallet 51 that stores a base 91 a that is a work 4 transported on the index table 1, and a first pallet 51 that holds the base 91 a and transports it from the first pallet 51 to the work holding unit 2. And a handling system 52. In FIG. 3, the conveyance direction of the base 91a by the first conveyance means 50 is indicated by using an arrow B1.

  Further, the first handling system 52 includes a support means 52a as a processing execution means having a suction port for sucking the work with negative pressure air that holds and conveys the work, and supports the support means 52a and the top surface of the index table 1 First moving means 52b that moves in a direction parallel to the X-Y direction (XY direction), and second moving means that moves the moving means 52b in a direction perpendicular to the top surface of the index table 1 (Z direction) And an actuator (not shown) for operating the first moving means and the second moving means.

  The position adjusting means 80 is a positioning device that adjusts the position of the base 91a immediately after the base 91a is arranged on the upper surface of the work holding unit 2. More specifically, although not shown in the drawing, a processing execution means (for example, a position adjusting piece) for holding and transporting the workpiece as the manufacturing process, a supporting means for supporting the position adjusting piece, It comprises driving means for displacing the position and moving the tip of the position adjusting piece from a standby position to a processing position or a contact position that contacts the adjustment block. Position adjustment is performed by pressing the side surface of the base 91a from four sides with four position adjustment pieces, and moving the base 91a to a preset position by rubbing on the upper surface of the work holding unit 2.

  The imaging inspection means 40 performs an inspection in which a predetermined part of the base 91a is imaged to acquire information indicating the position of the electrode pad (that is, the electrode pad arrangement state), the inclination of the base 91a, and the like. For example, an electronic camera that images the base 91a from above and an image processing unit that detects the arrangement of the electrode pads based on the obtained image data are provided. The first application unit 10 described later determines the processing execution position based on the inspection result of the imaging inspection unit 40.

  Although not shown, a position measuring means for measuring the position of a preset part of the workpiece 4 and obtaining the position data of the preset part and the like may be arranged together with the imaging inspection means 40. Good. This imaging inspection means includes, for example, a laser displacement meter having a mechanism for irradiating a laser beam toward a predetermined portion or irradiating while scanning in a matrix, and the height of the upper surface of the electrode pad (that is, The height of the upper surface of the electrode pad relative to the upper surface of the index table 1) is measured.

  The first application means 10 includes a syringe filled with a paste-like conductive resin that forms the conductive resin bonding materials 94a and 94b by curing as a processing execution means, and the conductive resin is provided at one end of the syringe. In particular, the first application means 10 performs the undercoating that is performed before the quartz vibrating piece 93a1 is placed.

  Further, although not shown, the first application means 10 is a support means for supporting the syringe, and the position of the support means is displaced to move the discharge portion (needle) of the syringe from the standby position to the processing execution position or the adjustment block. Drive means for moving to a contact position, which is a position in contact with.

  The second conveying means 60 has a second pallet 61 for storing a plurality of crystal vibrating pieces 93 as the work 4, and takes out the crystal vibrating piece 93 from the second pallet 61 and conveys it to the cavity of the base 91a, so And a second handling system 62 for disposing a crystal vibrating piece 93 on the upper surfaces of the electrode pads 92a and 92b that have been applied. In FIG. 3, the conveyance direction of the crystal vibrating piece 93 by the second conveyance means 60 is indicated by an arrow B <b> 2.

  Further, the second handling system 62 includes a support means 62a as a process execution means having a suction port for sucking the work with negative pressure air that holds and conveys the work, and supports the support means 62a and the top surface of the index table 1 First moving means 62b that moves in a direction parallel to the X-Y direction (XY direction), and second moving means that moves the moving means 62b in a direction perpendicular to the top surface of the index table 1 (Z direction) And an actuator (not shown) for operating the first moving means and the second moving means.

  In addition, undercoat imaging with the same configuration as the undercoating position measuring means and the imaging inspection means 40 having the same configuration as the position measuring means between the first applying means 10 and the second transport means 60. At least one of the inspection means may be arranged. In this case, before carrying the crystal vibrating piece 93, the height of the conductive resin applied undercoat is measured by the lower coating position measuring means to confirm the height when placing the crystal vibrating piece 93. The application position of the conductive resin can be detected by the undercoat imaging inspection means, and the quality of the application position can be determined. Further, as the undercoating position measuring means, for example, a laser beam is irradiated toward a predetermined portion (the top of the conductive resin or the central portion of the conductive resin) or is irradiated while being scanned in a matrix form. The thing provided with the laser displacement meter provided with the mechanism is used.

  The second application unit 30 includes a syringe filled with the conductive resin (or non-conductive resin) as a processing execution unit, and discharges the conductive resin from a needle provided at one end of the syringe, The conductive resin is applied to the upper surfaces of the electrode pads 92a and 92b together with both corners of one end portion where the lead electrodes 93a11 and 93a21 of the vibrating piece 93 are extended. In particular, the second coating unit 30 performs top coating that is performed after the quartz crystal vibrating piece 93 is placed.

  Further, although not shown, the second application means 30 is a support means for supporting the syringe, and the position of the support means is displaced so that the discharge portion (needle) of the syringe is moved from the standby position to the processing execution position or the adjustment block. Drive means for moving to a contact position, which is a position in contact with. Note that the top coating of the conductive resin by the second coating unit 30 may be omitted depending on the configuration of the crystal unit 90 and the required fixing strength.

  The imaging inspection unit 20 has the same configuration as the imaging inspection unit 40 described above, and images the base 91a after the top coating is performed by the second coating unit 30. The image data obtained by this imaging is used when checking the arrangement state of the conductive resin bonding materials 94a and 94b and the crystal vibrating piece 93 and checking whether or not the arrangement state is set in advance. . If it is not in a preset arrangement state, it is determined as defective, and if it is in a preset arrangement state, it is determined as a non-defective product. More specifically, the imaging inspection unit 20 captures an image of a workpiece from above the workpiece holding unit 2 to obtain image data (for example, an electronic camera, an imaging unit 22 described later), and the image data. The image processing means (image processing unit 23 described later) for detecting the number of pixels constituting an image of a preset part of the work holding unit 2 by performing image processing.

  Although not shown, an upper application position measuring unit having the same configuration as the position measuring unit may be further arranged together with the imaging inspection unit 20. In this case, pass / fail judgment is carried out by measuring the height of the conductive resin applied by the upper application position measuring means and checking whether the conductive resin is in a preset arrangement state. be able to. Further, as the upper application position measuring means, for example, a laser beam is irradiated toward a predetermined portion (the top of the conductive resin or the central portion of the conductive resin) or is irradiated while scanning in a matrix form. The thing provided with the laser displacement meter provided with the mechanism is used.

  Further, before the inspection by the imaging inspection unit 20, the conductive resin is cured by performing a heat treatment on the conductive resin applied to the upper surfaces of the electrode pads 92a and 92b using a heat processing unit (not shown). Conductive resin bonding materials 94a and 94b may be formed.

  The third conveying means 70 includes a third handling system 72 for discharging the base 91a as the work 4 from the work holding unit 2 arranged on the index table 1, and a third pallet 71 for storing the discharged base 91a. ing. When discharging the base 91a, only the base 91a determined to be non-defective is conveyed to the third pallet 71, and the base 91a determined to be defective is another pallet (a pallet for storing defective products) not shown. To be transported. In FIG. 3, the conveyance direction of the base 91a by the third conveyance means 70 is indicated by an arrow B3.

  Further, the third handling system 72 includes a support means 72a as a processing execution means having a suction port for sucking the work with negative pressure air to hold and transport the work, and supports the support means 72a and an index table. First moving means 72b for moving in a direction parallel to the upper surface (XY direction), and second moving means for moving the moving means 72b in a direction (Z direction) perpendicular to the upper surface of the index table 1 (Not shown) and an actuator (not shown) for operating the first moving means and the second moving means. Note that the support means of the third handling system may be configured to sandwich the workpiece instead of suction.

  Further, by transporting the discharged base 91a to the first pallet 51 instead of the third pallet 71, the base 91a before the manufacturing process and the base 91a after the manufacturing process are used in the same pallet (first pallet 51). It may be stored. In this case, the third conveying means 70 can be omitted.

  Further, the first conveying means 50, the second conveying means 60, and the third conveying means 70 described above may include a pair of clamping pieces for clamping the workpiece, instead of the suction port that sucks the workpiece with negative pressure air. In addition, a robot hand may be provided instead of the handling system.

  When the crystal resonator shown in FIG. 2 is manufactured using the piezoelectric vibration device manufacturing apparatus shown in FIG. 3, first, the first handling system 52 holds one workpiece on the upper surface of the index table 1 from the first pallet 51. The base 91a is conveyed to the upper surface of the part 2.

  Next, when the base 91a is arranged in the working range of the position adjusting unit 80 by the rotation and stop of the index table 1, the position adjustment by the position adjusting unit 80 is performed.

  Further, when the base 91a is arranged in the work area of the imaging inspection means 40 by rotating and stopping the index table 1, an inspection is performed, and information on the positions of the electrode pads 92a and 92b and the inclination of the base 91a is obtained. To be acquired.

  Subsequently, when the base 91a is disposed in the work area of the first application means 10 by the rotation and stop of the index table 1, the conductive resin is applied to the electrode pads. At this time, after the processing execution position in the XY direction is adjusted based on the inspection result by the imaging inspection means 40, the position adjustment of the first coating means 10 in the XY direction is performed according to the adjusted processing execution position. In this state, a conductive resin is applied to the electrode pad. In addition, when the measurement by the position measurement unit is performed, after the treatment execution position is adjusted in the Z direction based on the measurement result by the position measurement unit, the support unit is set according to the adjusted process execution position. The conductive resin is applied to the electrode pad in a state where the descent distance (movement distance in the Z direction) is adjusted.

  After that, when the base 91a is arranged in the work area of the second conveying means 60 by the index table 1 rotating and stopping, the crystal vibrating piece 93 is moved from the second pallet 61 to the cavity of the base 91a by the second handling system 62. Is transported. At this time, the mounting position on the base 91a is adjusted based on the information related to the inclination of the base 91a obtained by the inspection by the imaging inspection means 40.

  Further, when the index table 1 is rotated and stopped, the base 91a is disposed in the work area of the second application unit 30, and the conductive resin is applied onto the electrode pads. At this time, after the processing execution position in the XY direction is adjusted based on the inspection result by the imaging inspection means 40, the position adjustment of the second coating means 30 in the XY direction is performed according to the adjusted processing execution position. In this state, a conductive resin is applied to the electrode pad. In addition, when the measurement by the position measurement unit is performed, after the treatment execution position is adjusted in the Z direction based on the measurement result by the position measurement unit, the support unit is set according to the adjusted process execution position. The conductive resin is applied to the electrode pad in a state where the descent distance (movement distance in the Z direction) is adjusted.

  Subsequently, when the index table 1 is rotated and stopped, the base 91a is arranged in the work area of the imaging inspection unit 20, and the arrangement state of the conductive resin bonding materials 94a and 94b and the crystal vibrating piece 93 is set by the imaging inspection unit 20. And check whether or not the arrangement state is set in advance. In addition, when the said top application position measurement means is arrange | positioned with the imaging test | inspection means 20, confirmation of the height of the conductive resin joining materials 94a and 94b based on the measurement result by the said top application position measurement means is also implemented. .

  Finally, when the index table 1 is rotated and stopped so that the base 91a is arranged in the work area of the third transport means 70, the third handling system 72 causes the base 91a to move from the work holding unit 2 on the index table 1 to the second position. 3 pallets 71 are conveyed.

  In the piezoelectric vibration device manufacturing apparatus shown in FIG. 3, it is preferable that all manufacturing processing means simultaneously execute each manufacturing process while the index table 1 is stopped.

  Next, a specific example of the reference value correction procedure of the manufacturing processing means using the adjustment block will be described.

<Specific Example 1 of Reference Value Correction Procedure>
First, specific example 1 of the reference value correction procedure of the manufacturing processing means using the adjustment block will be described with reference to the drawings.

  FIG. 4 is an explanatory diagram showing an example of the manufacturing processing means constituting the piezoelectric vibration device manufacturing apparatus shown in FIG. 1, and FIG. 5 is a specific example of the reference value correction procedure of the manufacturing processing means shown in FIG. It is a flowchart to show.

  In this specific example, the first application means 10 used when applying the conductive resin on the electrode pad formed on the bottom inside the base is an example of the manufacturing processing means.

  As shown in FIG. 4, the first application means 10 includes a syringe 11 containing a conductive resin, a needle 11a provided at one end of the syringe 11 (lower end on the paper surface), and the other end of the syringe (upper end on the paper surface). The support hose 12 is connected to the supply hose 12 for supplying pressurized air and the support member 13 for supporting the syringe 11. Further, although not shown, the horizontal direction and the vertical direction (Z direction) of the support member 13 are provided. And a contact detection means for detecting contact between the first application means 10 (particularly, the tip of the needle 11a) and the adjustment block 3. As this contact detection means, for example, a measuring device that detects contact based on a change in an electrical signal (that is, a displacement meter that detects that the syringe has slightly displaced due to contact with the adjustment block 3), or A photoelectric sensor that detects contact by a change in an optical signal can be used.

  The supply hose 12 is connected to the syringe 11 via the connection member 12a. Further, a holding member 13 a for fixing the syringe 11 in a detachable state is fixed to the support member 13. The syringe 11 can be replaced by releasing the connection between the connecting member 12a and the syringe 11, removing the supply hose 12, and removing the syringe 11 from the holding member 13a while releasing the holding by the holding member 13a. .

  The first application means 10 lowers the needle tip to a preset position with respect to the electrode pad, and then supplies pressurized air to discharge the conductive resin from the tip of the needle 11a. A manufacturing process such as applying a conductive resin to the pad is performed.

  Further, in this specific example, the comparison data storage unit 8 stores in advance comparison data indicating an initial set value of the distance to which the support member 13 moves while moving the needle 11a serving as the discharge unit from the standby position to the contact position. Has been.

  Generally, in the 1st application means 10 which has such a structure, it is necessary to replace | exchange regularly the needle | hook 11a with the syringe 11 (or dismantling washing | cleaning) by hardening with time of the conductive resin with which the syringe was filled. There is a case where the tip of the needle 11a is displaced before and after the replacement. Here, a description will be given of a case where the deviation generated in the vertical direction of the tip of the needle 11a is corrected using the adjustment block.

  In this specific example, a direction approaching the index table 1 (downward direction) is defined as a negative direction, and a direction away from the index table 1 (upward direction) is defined as a positive direction. Furthermore, it is assumed that “−30 mm” is stored as comparison data in the comparison data storage unit 8.

  In this specific example, after replacing the syringe 11, first, according to the control signal transmitted from the control unit 6, the index table 1 is rotated after a predetermined angle and then stopped, so that the first application unit 10 is moved downward. The adjustment block 3 is arranged (step S1).

  Subsequently, the support member 13 is continuously lowered according to the control signal transmitted from the control unit 6 (step S2).

  Thereafter, when the contact detection means detects that the tip of the needle 11a (indicated by a two-dot chain line) has contacted the upper surface of the adjustment block 3 (when the determination result in step S3 changes from NO to YES), the support is performed. The member 13 stops and rises to the standby position, and the correction data creation unit 7 calculates the distance traveled from when the support member 13 starts to descend until it stops, and acquires the travel distance data (step). S4).

  Finally, the correction data creation unit 7 obtains the difference between the comparison data and the movement distance data acquired in step S4 as correction data (step S5). Thereafter, the correction data is transmitted from the correction data creation unit 7 to the control unit 6.

  The calculation formula for obtaining the correction data can be expressed by, for example, the formula (1).

Correction data = Comparison data−Movement distance data (1)
After obtaining the correction data by such a procedure, the application of the conductive resin to the electrode pad by the first application means 10 is resumed. At this time, the control unit 6 adds the correction data to a control signal for controlling the operation of the drive mechanism. As a result of this addition, the movement distance of the support member 13 changes by the amount of correction data compared to before the replacement. Therefore, the tip of the needle 11a can be disposed at a preset position above the electrode pad.

  For example, when the position of the tip of the needle 11a is shifted by 1 mm in the direction approaching the index table 1 due to the replacement, the moving distance data is “−29 mm” in Step 4, that is, the correction data is “−1 mm”, and the manufacturing process The moving distance of the support member 13 at the time of implementation can be made 1 mm shorter than before replacement. Therefore, it is possible to correct the deviation caused by the replacement of the syringe 11. If the position of the tip of the needle 11a is shifted by 1 mm in the direction away from the index table 1 due to the replacement, the movement distance data becomes “−31 mm” in step S4, that is, the correction data becomes “+1 mm”, and the manufacturing process is performed. The moving distance of the support member 13 at the time can be made 1 mm longer than before the replacement. Therefore, it is possible to correct the deviation caused by the replacement of the syringe 11.

  Since the piezoelectric vibration device manufacturing apparatus according to the present embodiment performs such a reference value correction procedure, the position of the tip of the needle 11a in the vertical direction is shifted before and after the replacement. The correction data created using the adjustment block can also be added to the control signal to correct the movement distance of the support member 13 (that is, the position of the tip of the needle 11a). As a result, the conductive resin can always be discharged under certain conditions.

  In addition, the 1st application means 10 shown in FIG. 4 is only an example of the manufacturing process means which apply | coats a conductive adhesive, and is not limited to this form. The same applies not only to the first application unit but also to other manufacturing processing units (for example, the second application unit 30, the first conveyance unit 50, the second conveyance unit 60, the third conveyance unit 70, and the position adjustment unit 80). The reference value related to height can be corrected by the procedure. For example, when the reference value is corrected for the first transport unit 50, the correction data may be generated by bringing the clamping piece of the first transport unit 80 into contact with the adjustment block instead of the needle.

<Specific Example 2 of Reference Value Correction Procedure>
Next, a specific example 2 of the reference value correction procedure of the manufacturing processing means using the adjustment block will be described with reference to the drawings.

  FIG. 6 is an explanatory view showing another example of the manufacturing processing means constituting the manufacturing apparatus of the piezoelectric vibration device shown in FIG. 1, and FIG. 7 shows another reference value correction procedure of the manufacturing processing means shown in FIG. FIG. 8 is a flowchart illustrating a specific example, and FIG. 8 is an explanatory diagram illustrating a specific example of the state of the piezoelectric vibration device manufacturing apparatus in the process of performing the reference value correction procedure illustrated in FIG.

  As shown in FIG. 6, this specific example includes an imaging unit 22 that captures the upper surface of the adjustment block 3 and obtains image data, and an image processing unit 23 that performs image processing on the obtained image data. The imaging inspection unit 20 is an example of a manufacturing processing unit.

  The imaging unit 22 obtains image data by imaging the upper surface of the adjustment block 3 after the manufacturing process is performed on the adjustment block 3 by other manufacturing processing means. For example, a CCD (charge- It is composed of a coupled device (CMOS) camera or a CMOS (complementary metal-oxide semiconductor) camera.

  The image processing unit 23 performs image processing on the image data, and acquires position data indicating in which position of the adjustment block 3 the manufacturing process has been performed.

  The imaging inspection means 20 inspects, for example, whether or not the conductive resin bonding materials 94a and 94b and the crystal vibrating piece 93 are arranged at preset positions in the cavity. Data indicating the inspection result is transmitted to the control unit 6, and when the data is not arranged at a preset position, it is determined that a defect has occurred in the control unit 6. More specifically, the inspection by the imaging inspection means 20 is performed, for example, after the top application of the conductive resin by the second application means 30 is completed, and the image pickup unit 22 images the cavity of the base 91a to obtain image data. Then, the image processing unit 23 performs image processing on the image data, detects the center portion of the crystal vibrating piece 93, and determines whether or not the center portion is in the correct position (preset position). It is carried out by the procedure. When determining whether or not the center is in the correct position, the number of pixels from the pixel indicating the center to the pixel indicating one part in the cavity is detected, and the imaging unit is calculated based on the detected number of pixels. An actual dimension from the central part to the one part may be calculated by multiplying the scale by 22, and the determination may be performed based on the actual dimension.

  Although only the imaging inspection unit 20 has been described here, the imaging inspection unit 40 also has the same configuration.

  Here, the first application means 10 shown in FIG. 4 is taken as an example of the other manufacturing processing means, and the horizontal (X-Y direction) deviation of the tip of the needle 11a caused by the replacement of the syringe 11 is adjusted using a block for adjustment. A case where correction is performed using these will be described.

  In this specific example, the central portion of the upper surface of the adjustment block 3 is preset at a position where the manufacturing process is performed, and the comparison data storage unit 8 performs the manufacturing process by the other manufacturing processing means. As comparison data indicating the initial position setting value, comparison data indicating the position of the central portion of the upper surface of the adjustment block 3 is stored in advance.

  In this specific example, after replacement of the syringe 11, first, the index table is rotated by a preset angle in accordance with a control signal transmitted from the control unit 6, and then adjusted to the lower side of the first application unit 10. The block 3 for use is arranged (step S11).

  Next, after the index table is stopped, the needle 11a is lowered and stopped until the tip of the needle 11a is disposed at a preset position above the adjustment block 3, and then the conductive resin is discharged from the needle 11a for adjustment. Conductive resin 21 is applied to the upper surface of block 3 (step S12; see FIG. 8A). After application, the needle 11a rises to the position before descent.

  Subsequently, the adjustment block 3 is arranged below the imaging unit 22 by stopping after the index table has been rotated by a preset angle in accordance with the control signal transmitted from the control unit 6 (step S13). 8 (b)).

  Next, after the index table is stopped, imaging by the imaging unit 22 is performed, and the imaging unit 22 obtains image data of the upper surface of the adjustment block 3 including the conductive resin 21 (step S14). This image data is transmitted from the imaging unit 22 to the image processing unit 23. In addition, after this imaging, the conductive resin 21 applied to the upper surface of the adjustment block 3 is removed by performing at least one of wiping and washing before curing.

  Thereafter, the image processing unit 23 performs image processing on the image data to detect position data indicating the application position of the conductive resin 21 on the upper surface of the adjustment block 3 from the image data (step S15). Data is transmitted to the correction data creation unit 7. As an example of the position data detection procedure, first, an image area of the conductive resin 21 is extracted from the image data, and position data indicating the position of the center of gravity of the image area is used as a position indicating the position where the manufacturing process is performed. For example, it can be acquired as data.

  Finally, the correction data creation unit 7 compares the comparison data with the position data transmitted from the image processing unit 23 to calculate a difference. Further, in order to eliminate this difference, it is calculated in which direction and how much distance the syringe 11 (that is, the support member) needs to be moved, and this calculation result is used as correction data (step S16). Thereafter, the correction data is transmitted from the correction data creation unit 7 to the control unit 6.

  After obtaining the correction data by such a procedure, the application of the conductive resin to the electrode pad by the first application means 10 is resumed. At this time, the control unit 6 adds the correction data to a control signal for controlling the operation of the drive mechanism. With this addition, when the manufacturing process is performed, the moving distance and moving direction of the support member 13 are changed by the correction data compared to before the replacement, and the tip of the needle 11a is correctly placed at the processing execution position above the electrode pad.

  Here, imaging or the like is performed using the imaging inspection means 20, but the imaging inspection means 40 may be used instead of the imaging inspection means 20, and when other imaging inspection means are arranged. Other imaging inspection means may be used.

  Since the piezoelectric vibration device manufacturing apparatus of the present embodiment performs such a reference value correction procedure, the position of the tip of the needle 11a in the horizontal direction is shifted before and after the replacement. The correction data created by using the adjustment block can be added to the control signal to correct the movement distance and movement direction of the support member 13. As a result, it is possible to always discharge the conductive resin from a fixed processing position.

  Moreover, by obtaining information on the size and shape of the conductive resin, it can also be used to determine whether or not appropriate conductive bonding can be performed.

  Here, the first application unit 10 has been described as another manufacturing processing unit, but the first conveyance unit, the position adjustment unit, the second conveyance unit, the second application unit, and the third conveyance unit are also described. A positional shift in the horizontal direction can be corrected. For example, when correcting the positional deviation of the support means 52a of the first transport means 50, after the base is transported onto the adjustment block, the adjustment block is imaged, and the center of gravity of the adjustment block and the center of gravity of the base are calculated. If a deviation occurs, the reference value may be corrected based on the direction and distance of the deviation.

  Further, in the first specific example described above, the vertical deviation of the needle tip is corrected, and in the second specific example, the horizontal deviation of the needle tip is corrected. The reference value correction procedure shown in FIG.

<Specific Example 3 of Reference Value Correction Procedure>
Next, specific example 3 of the reference value correction procedure of the manufacturing processing means using the adjustment block will be described with reference to the drawings.

  FIG. 9 is a flowchart showing a specific example of the reference value correction procedure of the manufacturing processing means shown in FIG. 6, and FIG. 10 shows image data obtained in the process of executing the reference value correction procedure shown in FIG. It is explanatory drawing which shows the specific example. Note that the squares in FIG. 10 schematically show a plurality of pixels arranged in a matrix, and are shown in a state where the size of each pixel is changed larger than the actual size for easy understanding.

  Here, the case where the imaging inspection unit shown in FIG. 8 is taken as an example of the manufacturing processing unit and the scale of the imaging unit 22 constituting the imaging inspection unit is calibrated using the adjustment block will be described.

  In this specific example, the comparison data storage unit 8 stores in advance comparison data indicating the dimension of a preset portion of the adjustment block 3.

  First, according to the control signal transmitted from the control unit 6, the adjustment block 3 is arranged below the imaging unit 22 by stopping after the index table has been rotated by a preset angle (step S21). .

  Next, after the index table is stopped, imaging by the imaging unit 22 is performed, and the imaging unit 22 obtains image data on the upper surface of the adjustment block 3 (step S22). For example, as shown in FIG. 10, the image data includes an image area 31 a of an adjustment block in the imaging area 31.

  Thereafter, the image data is transmitted from the imaging unit 22 to the image processing unit 23, and the image processing unit 23 extracts the image area 31a of the adjustment block from the imaging area 31 (step S23). Here, since the adjustment block whose upper surface shape is rectangular is used as an example, a rectangular image region 31a is obtained.

  Subsequently, the image processing unit 23 detects the number of pixels (the number of pixels) constituting the image of the preset portion of the adjustment block in the image region 31a (step S24). Here, the preset part is the long side of the adjustment block 3. Therefore, the number of pixels obtained is “8”. The obtained number of pixels is transmitted from the image processing unit 23 to the correction data creating unit 7.

  Finally, the correction data creation unit 7 calculates a value obtained by dividing the comparison data by the number of pixels, and calculates a scale that is a size per pixel as correction data.

  After obtaining the correction data by such a procedure, the inspection by the imaging inspection means is resumed, and the inspection result is obtained using the scale (correction data) calculated instead of the preset scale.

  Here, the description is made using the rectangular adjustment block 3, but the shape of the adjustment block 3 is not limited to this. For example, when the upper surface shape of the adjustment block 3 is circular, the scale can be calculated using the dimension of the diameter of the upper surface of the adjustment block 3.

  Since the piezoelectric vibration device manufacturing apparatus of the present embodiment performs such a reference value correction procedure, the scale can be calibrated using the adjustment block without using the mark of the work holding part.

<Specific Example 4 of Reference Value Correction Procedure>
Next, specific example 4 of the reference value correction procedure of the manufacturing processing means using the adjustment block will be described with reference to the drawings.

  FIG. 11 is a flowchart showing a specific example of the reference value correction procedure of the manufacturing processing means using the adjustment block that constitutes the manufacturing apparatus of the piezoelectric vibration device shown in FIG. 1, and FIG. 12 is a reference location shown in FIG. It is explanatory drawing which shows the specific example of the state of the manufacturing apparatus of the piezoelectric vibration device in the process in which the correction | amendment means is implemented.

  In this specific example, a laser displacement meter 41, which is an example of a position measuring unit, will be described as a manufacturing processing unit.

  The laser displacement meter 41 measures the heights of all electrode pads before applying a conductive resin, for example, and transmits data indicating the measurement results to the control unit during the manufacturing process. The part adjusts the height (position in the vertical direction) of the needle tip during application based on this measurement result.

  The laser displacement meter 41 includes a semiconductor laser, a condensing lens, and the like, and the measurement light C is reflected by the light emitting unit that outputs the measurement light C and the upper surface of the measurement object (for example, the adjustment block 3 or the electrode pad) The light receiving part that receives the reflected light D obtained by the above and outputs an electric signal corresponding to the amount of light received, and the vertical position of the upper surface of the adjustment block 3 and the upper surface of the electrode pad based on the electric signal output from the light receiving part ( That is, it comprises an arithmetic processing unit that obtains position data indicating the height from the top surface of the index table 1.

  In general, the laser displacement meter 41 is shipped after performance tests and initial settings are performed, and is used as a non-contact inspection means for measuring the position of a part set in advance at the shipping destination. However, the performance of the laser displacement meter 41 may be affected by instrument calibration, and a correct detection result may not be obtained depending on the use environment (particularly temperature). For this reason, a correct detection result cannot be obtained at the time of use, and a measurement error may occur.

  In this specific example, a case where calibration of the measurement error of the laser displacement meter 41 is performed using the adjustment block 3 will be described.

  In this specific example, the comparison data storage unit 8 stores the position of the upper surface of the adjustment block 3 (from the upper surface of the index table 1) as comparison data indicating the initial set value of the position of the preset portion of the adjustment block 3. It is assumed that “30 mm” is stored.

  In this specific example, before the manufacturing process using the laser displacement meter 41 is performed, according to the control signal transmitted from the control unit 6, the index table 1 is rotated after a predetermined angle and then stopped. The adjustment block 3 is arranged in the measurement region of the laser displacement meter 41 (step S31).

  Subsequently, as indicated by an arrow C in FIG. 12, the measurement light C is irradiated on the upper surface of the adjustment block 3 from the light emitting portion of the laser displacement meter 41, and the reflected light D reflected on the upper surface of the adjustment block 3 is received by the light receiving portion. (Step S32). In addition, the performance of the laser displacement meter 41 is stabilized by taking a sufficient time from the power-on to the irradiation of the measurement light C.

  Next, the arithmetic processing unit obtains position data indicating the position of the upper surface of the adjustment block 3 based on the received reflected light D (step S33).

  Finally, the correction data creation unit 7 compares the comparison data with the position data transmitted from the arithmetic processing unit to obtain a difference as correction data (step S34). Thereafter, the correction data is transmitted from the correction data creation unit 7 to the control unit 6.

  The calculation formula for obtaining the correction data can be expressed by, for example, formula (2).

Correction data = Comparison data−Position data (2)
After obtaining the correction data by such a procedure, the measurement of the height of the electrode pad by the laser displacement meter 41 is started. At this time, since the control unit 6 adds correction data to the control signal, the position data (measurement result) output from the laser displacement meter 41 changes by the correction data, and the measurement error of the laser displacement meter 41 is calibrated. The

  For example, when the position data obtained in step S33 is “29 mm”, the correction data is “+1 mm”. Therefore, when the manufacturing process is performed, the measurement result output from the laser displacement meter 41 is 1 mm larger than that before correction, and a correct measurement result is obtained. If the position data obtained in step S33 is “31 mm”, the correction data is “−1 mm”. Therefore, when the manufacturing process is performed, the measurement result output from the laser displacement meter 41 is 1 mm smaller than before correction, and a correct measurement result is obtained.

  Since the piezoelectric vibration device manufacturing apparatus of the present embodiment performs such a reference value correction procedure, it is possible to calibrate the measurement error of the laser displacement meter in a use environment where the manufacturing process is performed.

  In Specific Example 1 described above, the adjustment block is preferably formed using a material that can easily wipe the conductive resin. In specific examples 2 and 3, the adjustment block may be a color that can clearly extract the boundary between the index table and the conductive resin during image processing in order to improve the accuracy of image processing. preferable. Moreover, in the above-described specific examples 1 to 4, the trimming block may be formed using, for example, ceramic.

  Further, the number of adjustment blocks on the index table may be one or plural. However, in order to prevent that the reference value correction cannot be performed accurately due to the difference in the arrangement state (for example, the arrangement position, height, and inclination) of each adjustment block, It is more preferable that the number of adjustment blocks in is one.

  Furthermore, the adjustment block may be installed between work holding parts arranged at equal intervals. In this case, one adjustment block may be installed between any one of the workpiece holding units, or a plurality of adjustment blocks may be installed by being installed between the plurality of workpiece holding units.

  The piezoelectric vibration device manufacturing apparatus of the present invention can be utilized when manufacturing a small piezoelectric vibration device.

It is explanatory drawing which shows one Embodiment of the manufacturing apparatus of the piezoelectric vibration device of this invention. It is explanatory drawing which shows an example of the piezoelectric vibration device manufactured using the manufacturing apparatus of the piezoelectric vibration device shown in FIG. It is explanatory drawing which shows an example of the workpiece | work holding | maintenance part which comprises the manufacturing apparatus of the piezoelectric vibration device shown in FIG. 1, several manufacturing process means, an adjustment block, and a conveyance part. It is explanatory drawing which shows an example of the manufacturing process means which comprises the manufacturing apparatus of the piezoelectric vibration device shown in FIG. It is a flowchart which shows a specific example of the reference value correction | amendment procedure of the manufacturing process means shown in FIG. It is explanatory drawing which shows the other example of the manufacturing process means which comprises the manufacturing apparatus of the piezoelectric vibration device shown in FIG. 6 is a flowchart showing another specific example of the reference value correction procedure of the manufacturing processing means shown in FIG. It is explanatory drawing which shows the specific example of the state of the manufacturing apparatus of the piezoelectric vibration device in the process which is performing the reference value correction | amendment procedure shown in FIG. It is a flowchart which shows a specific example of the reference value correction | amendment procedure of the manufacturing process means shown in FIG. It is explanatory drawing which shows the specific example of the image data obtained in the process in which the reference value correction | amendment procedure shown in FIG. 9 is implemented. 3 is a flowchart showing a specific example of a reference value correction procedure of manufacturing processing means using an adjustment block that constitutes the manufacturing apparatus of the piezoelectric vibration device shown in FIG. 1. It is explanatory drawing which shows the specific example of the state of the manufacturing apparatus of the piezoelectric vibration device in the process in which the reference | standard ground correction | amendment means shown in FIG. 11 is implemented. It is explanatory drawing which shows an example of the conventional piezoelectric vibration device. It is explanatory drawing which shows an example of the manufacturing apparatus of the conventional piezoelectric vibration device. It is explanatory drawing which shows an example of the workpiece holding part which comprises the manufacturing apparatus of the conventional piezoelectric vibration device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Index table 2 Work holding part 3 Adjustment block 4 Work 6 Control part 7 Correction data creation part 8 Comparison data storage part 10 1st application | coating means 20, 40 Imaging inspection means 30 2nd application means 50 1st conveyance means 60 2nd Conveying means 70 Third conveying means 80 Position adjusting means

Claims (7)

Piezoelectric vibration comprising a piezoelectric vibrating piece on which an excitation electrode is formed, a casing for hermetically sealing the piezoelectric vibrating piece, and an electrode pad disposed in the casing and electrically connected to the excitation electrode. In an apparatus for manufacturing a piezoelectric vibration device for manufacturing a device,
A workpiece holding unit on which a workpiece is placed; a plurality of manufacturing processing units that perform manufacturing processing on the workpiece; and a control unit that transmits a control signal for controlling the operation of each manufacturing processing unit to the manufacturing processing unit. An adjustment block that is subjected to correction data acquisition processing using the manufacturing processing means, and a correction data creation unit that obtains correction data to be added to the control signal based on a result of the correction data acquisition processing. An apparatus for manufacturing a piezoelectric vibration device, comprising:   The piezoelectric vibration device manufacturing apparatus according to claim 1, further comprising a transport unit that transports the adjustment block and the work holding unit. In the manufacturing apparatus of the piezoelectric vibration device according to claim 1 or 2,
At least one manufacturing processing means of the plurality of manufacturing processing means discharges the adhesive from the discharge section as the manufacturing process and applies the adhesive, and supports to support the processing execution means And a drive means for displacing the position of the support means and moving the tip of the discharge part from a standby position to a contact position that is a position that contacts the processing execution position or the adjustment block,
It further comprises comparison data storage means for preliminarily storing comparison data indicating an initial set value of the distance to which the support means moves while moving the discharge unit from the standby position to the contact position,
The correction data acquisition process includes a step of moving the ejection unit from the standby position to the contact position to contact the adjustment block;
The correction data creation unit acquires movement distance data indicating the distance that the support unit has moved while moving the ejection unit from the standby position to the contact position, and compares it with the acquired movement distance data. A piezoelectric vibration device manufacturing apparatus that obtains a difference from data as correction data added to a control signal for controlling the operation of the one manufacturing processing means. In the manufacturing apparatus of the piezoelectric vibration device according to claim 1, 2, or 3,
At least one of the plurality of manufacturing processing means includes a processing execution means for holding and transporting the workpiece as the manufacturing processing, a support means for supporting the processing execution means, and a displacement of the support means. And driving means for moving the tip of the processing execution means from a standby position to a contact position that is a position to contact the processing execution position or the adjustment block,
It further comprises comparison data storage means for preliminarily storing comparison data indicating an initial set value of the distance to which the support means moves while moving the tip of the processing means from the standby position to the contact position,
The correction data acquisition process includes the step of moving the processing execution unit from the standby position to the contact position to contact the adjustment block;
The correction data creation unit acquires movement distance data indicating the distance that the support unit has moved before the tip of the processing execution unit moves from the standby position to the contact position, as a result of the manufacturing process. An apparatus for manufacturing a piezoelectric vibration device, wherein the difference between the travel distance data and the comparison data is obtained as correction data added to a control signal for controlling the operation of the one manufacturing processing means. In the manufacturing apparatus of the piezoelectric vibration device according to claim 1, 2, 3, or 4,
At least one manufacturing processing unit of the plurality of manufacturing processing units captures the workpiece holding unit after the manufacturing process is performed by another manufacturing processing unit and obtains image data; and the image data Image processing means for performing image processing and obtaining position data indicating the position where the manufacturing process is performed;
It further comprises comparison data storage means for preliminarily storing comparison data indicating an initial set value of a position where the manufacturing process by the other manufacturing processing means is performed,
The correction data acquisition process includes a step of performing a manufacturing process by another manufacturing processing unit on the adjustment block, a step of capturing the adjustment block using the imaging unit, and obtaining image data, and the image processing. And performing image processing on the image data using means to obtain position data indicating the position where the manufacturing process has been performed,
The piezoelectric vibration device manufacturing apparatus in which the correction data creation unit obtains the difference between the acquired position data and the comparison data as correction data added to a control signal for controlling the operation of the other manufacturing processing means. . In the manufacturing apparatus of the piezoelectric vibration device according to claim 1, 2, 3, 4 or 5,
At least one manufacturing processing means of the plurality of manufacturing processing means picks up the work holding unit and obtains image data; and image processing is performed on the image data, and the work holding unit Image processing means for detecting the number of pixels constituting an image of a preset part of
It further comprises comparison data storage means for preliminarily storing comparison data indicating the dimension of a preset portion of the adjustment block,
In the correction data acquisition process, an adjustment block is imaged using the imaging unit to obtain image data, and image processing is performed on the image data using the image processing unit, and the adjustment block is preset. The step of detecting the number of pixels constituting the image of the part of
Manufacturing of a piezoelectric vibration device in which the correction data creation unit obtains a value obtained by dividing the comparison data by the number of detected pixels as correction data added to a control signal for controlling the operation of the one manufacturing processing means. apparatus. In the manufacturing apparatus of the piezoelectric vibration device according to claim 1, 2, 3, 4, 5 or 6,
At least one manufacturing processing unit of the plurality of manufacturing processing units is configured to measure a position of a preset part of the workpiece holding unit and obtain position data indicating the position of the preset part. Has
It further comprises comparison data storage means for preliminarily storing comparison data indicating an initial setting value of a position of a preset part of the adjustment block,
The correction data acquisition process includes a step of acquiring position data indicating a position of a preset part of the adjustment block using a position measurement unit,
The piezoelectric vibration device manufacturing apparatus in which the correction data creation unit obtains a difference between the comparison data and the acquired position data as correction data added to a control signal for controlling the operation of the one manufacturing processing means. .

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