JP2010122161A - Inspection probe for electrooptical device and method of manufacturing the same, and inspection device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection probe of an electrooptical device capable of improving durability while having appropriate contact properties, to provide a method of manufacturing the inspection probe, and to provide an inspection device. <P>SOLUTION: The inspection probe 1 of an electrooptical device includes a substrate 2, and a connection section 3 that is provided on the substrate 2 and is electrically connected to a liquid crystal display. The connection section 3 has a plurality of bump electrodes 11 comprising an undercoat resin 9 disposed in a through-hole 7 of the substrate 2 and a plurality of conductive films 15 for partially covering the undercoat resin 9 projecting to the side of a first surface 2A of the substrate 2. Each of the plurality of bump electrodes 11 is connected to each terminal of the liquid crystal display. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an inspection probe for an electro-optical device, a manufacturing method thereof, and an inspection device.

  In general, in the manufacturing process of a liquid crystal display device, an inspection process for inspecting a short circuit, disconnection, display characteristics, or the like is provided. In such an inspection process, an inspection apparatus having an inspection probe is used. Such a probe for inspection has a conductive portion (connecting portion) including a plurality of contact terminals connected to an external connection terminal, a scanning line terminal, and a data line terminal of a liquid crystal display device which is a device to be inspected. It corresponds to the distance between connection terminals. In the following Patent Document 1, the inspection probe is provided with a conductive portion (connecting portion) including the connecting terminal on a flexible substrate made of polyimide (PI), polyethylene terephthalate (PET), or the like. However, since a flexible substrate is used, it is difficult to make a narrow pitch wiring, and an increase in manufacturing cost is expected.

Therefore, an inspection probe using a base resin bump as in Patent Document 2 has been proposed. Here, a plurality of wiring portions on the resin protrusion provided on the silicon substrate are contact portions with the wiring of the electro-optical device.
JP 2000-56285 A JP 2006-78319 A

  In Patent Document 2, since a silicon substrate is used, narrow pitch wiring is possible, and the contact property by the resin protrusion is also good. However, the deformation of the resin protrusion only from the surface of the silicon substrate has a problem that the contact property is not sufficient depending on the conditions and the durability is low.

  The present invention has been made in view of the above-described problems of the prior art, and provides an inspection probe for an electro-optical device that has good contact properties and can improve durability, a method for manufacturing the same, and an inspection device. The purpose is that.

  In order to solve the above problems, an inspection probe according to the present invention includes a substrate and a connection probe provided on the substrate and electrically connected to the electro-optical device. The connection portion includes a plurality of contacts including a base resin disposed in the through-hole of the substrate and a plurality of conductive films partially covering the base resin protruding from the first surface of the substrate. It has a terminal.

  In the present invention, the connecting portion having a plurality of contact terminals partially protrudes from the first surface of the substrate, and when connecting to the electro-optical device, it is inside the conductive film constituting the contact terminals. Connection is made using resin deformation of the base resin. For this reason, the contact area of the contact terminal with respect to the terminal on the electro-optical device side to be connected later is increased, and the connection reliability is improved. Further, the base resin of the present invention is disposed in the through hole, and the connection strength with the terminal on the electro-optical device side is further improved as compared with the terminal structure having a resin protrusion provided on the conventional substrate. At the same time, the pressure bonding can be sufficiently performed only with the resin. Thereby, the contact property in a connection part is favorable and durability can be improved. Further, in the inspection probe of the present invention, it is possible to avoid a short circuit with a substrate and a short circuit between terminals due to protrusion of a low melting point metal such as solder, so that the connection reliability is improved as compared with the conventional case.

Moreover, it is preferable that the front-end | tip of the said contact terminal is the curved surface shape which becomes convex toward outward.
According to the present invention, the contact terminal can be easily deformed when connected to the terminal on the electro-optical device side.

Moreover, it is preferable that the said contact terminal is thin toward the front-end | tip.
According to the present invention, since the stress at the time of connection with the terminal on the electro-optical device side can be relieved, the connection reliability is improved.

Moreover, it is preferable that a part of the base resin is exposed between the plurality of conductive films.
According to the present invention, a short circuit between terminals can be avoided.

Moreover, it is preferable that the surface of the base resin exposed between the plurality of conductive films is formed to be lower than the surfaces of the plurality of conductive films.
According to the present invention, each contact terminal in the connection portion is reliably and satisfactorily connected to each terminal on the electro-optical device side.

Moreover, it is preferable that the said electrically conductive film is formed with the single-piece | unit or several metal film which has a malleability.
According to the present invention, a conductive film formed of a single or a plurality of metal films having spreadability is easily deformed together with the base resin.

Moreover, it is preferable that the side surface on the base side of the contact terminal is covered with a base layer provided in the through hole and protruding from the first surface of the substrate.
According to the present invention, it is possible to avoid a short circuit between the deformed contact terminal and the substrate.

Moreover, it is preferable that the inspection electronic component that is electrically connected to the plurality of contact terminals is mounted on the substrate.
According to the present invention, since the drive signal can be supplied to the electro-optical device through the plurality of contact terminals connected to the terminal on the electro-optical device side, the electric characteristic inspection of the electro-optical device can be performed satisfactorily.

Further, it is preferable that the inspection electronic component mounted on a different substrate different from the substrate is connected to the contact terminal.
According to the present invention, since the drive signal can be supplied to the electro-optical device through the plurality of contact terminals connected to the terminal on the electro-optical device side, the electric characteristic inspection of the electro-optical device can be performed satisfactorily.

Moreover, it is preferable that an insulating layer is provided on the wiring pattern provided on the substrate.
According to the present invention, since the wiring pattern can be protected, disconnection or the like hardly occurs.

In order to solve the above problems, a method for manufacturing an inspection probe according to the present invention includes a step of forming a via from the second surface of a substrate, a step of forming a base layer on the inner surface of the via, and a step on the base layer. Forming a conductive film; patterning the conductive film into a plurality of regions; filling a resin in the via; thinning the substrate and penetrating the via; Removing the base layer protruding from one surface to expose a plurality of the conductive films;
It is provided with.

  An inspection probe having a resin core bump structure protruding from the first surface of the substrate can be obtained. In the present invention, the contact terminal is constituted by the resin disposed in the through hole and the conductive film covering the surface thereof. When connecting to a semiconductor device, the contact terminals in the connection portion are connected by being deformed in contact with the terminals of the semiconductor device. Since the resin arranged in the through hole is deformed in the contact terminal according to the present invention, the contact is more sufficient than the deformation of the conventional contact terminal composed of the resin protrusion provided on the substrate and the conductive film covering the surface. Sex can be obtained. Thereby, it is possible to provide an inspection probe capable of performing a highly reliable probe inspection on a semiconductor device.

In the step of forming the via, it is preferable that the bottom surface of the via is formed in a curved shape.
According to the present invention, since the tip of the contact terminal can be formed in a curved shape, it is deformed at the time of connection and the connection strength can be obtained with certainty.

In the step of forming the via, the inner surface of the via is preferably formed in a tapered shape.
According to the present invention, since the contact terminal that becomes narrower toward the tip can be formed, it is possible to obtain a terminal that has good contact with the terminal on the electro-optical device side.

Further, it is preferable that the surface of the base resin exposed between the plurality of patterned conductive films is formed to be lower than the surfaces of the plurality of conductive films.
According to the present invention, each contact terminal can be favorably connected to the terminal on the electro-optical device side.

In the step of removing the underlayer, it is preferable that the underlayer partially remains on the base side of the contact terminal.
According to the present invention, since the base side of the contact terminal is covered with the base layer, it is possible to avoid the contact terminal deformed when connected to the electro-optical device side from being short-circuited with the substrate.

In addition, it is preferable to include a step of mounting inspection electronic components electrically connected to the plurality of conductive films on the substrate.
According to the present invention, handling is facilitated by integrating with an inspection probe.

Moreover, it is preferable to have the process of electrically connecting the inspection electronic component mounted on another substrate to the plurality of conductive films.
According to the present invention, the inspection electronic component can be easily replaced, and a highly reliable inspection can be performed.

Moreover, it is preferable to have the process of forming an insulating film on the wiring pattern arrange | positioned at the said board | substrate.
According to the present invention, since the wiring pattern can be protected, disconnection or the like can be prevented.

The inspection apparatus according to the present invention includes the inspection probe for the electro-optical device.
According to the inspection apparatus of the present invention, since the above-mentioned inspection probe eliminates the connection failure with the electro-optical device, it is possible to improve the inspection accuracy of the probe inspection of the electro-optical device.

  Embodiments of the present invention will be described below with reference to the drawings. In each drawing used for the following description, the scale of each member is appropriately changed to make each member a recognizable size.

(Inspection probe of the first embodiment)
1A and 1B are perspective views showing a schematic configuration of an inspection probe according to an embodiment of the present invention, in which FIG. 1A is a diagram viewed from the first surface 2A side, and FIG. 1B is a second surface 2B side. FIG. FIG. 2 is a cross-sectional view taken along line AA in FIG. 1 and 2, reference numeral 1 denotes an inspection probe. The inspection probe 1 is used by being electrically connected to a tester (not shown) for detecting and measuring various electrical characteristics. is there.

  As shown in FIGS. 1A and 1B, an inspection probe 1 includes a substrate 2, a connection portion 3 protruding from the first surface 2A of the substrate 2, and a second surface opposite to the first surface 2A. Wiring patterns 4 and 5 formed on 2B, and a driving IC 6 (inspection electronic component) are provided. Furthermore, it has a base layer 12, a metal layer 13, a conductive film 15, and a base resin 9.

  The substrate 2 is made of, for example, a rectangular silicon substrate. Other examples of the substrate 2 include a ceramic substrate and a resin substrate. Such a substrate 2 is formed with a through hole 7 having a rectangular shape in plan view that penetrates the thickness direction thereof, that is, the first surface 2A and the second surface 2B. As shown in FIG. 2, the through-hole 7 has a tapered shape that tapers toward the first surface 2 </ b> A side in the plate thickness direction of the substrate 2.

  The connecting portion 3 has a plurality of bump electrodes 11 (contact terminals) protruding on the first surface 2A of the substrate 2. These bump electrodes 11 are composed of a base resin 9 disposed in the through hole 7 and a plurality of strip-like conductive films 15 partially covering the base resin 9. Specifically, the plurality of bump electrodes 11 are formed by the plurality of conductive films 15 and a part of the base resin 9 (end portion 9 </ b> A) covered with the plurality of conductive films 15. That is, the exposed portions of each conductive film 15 and the base resin 9 (end portion 9A) located inside thereof are each independently functioning as the bump electrode 11. These bump electrodes 11 can be inspected by being electrically connected to the external circuit mounting terminals 202 of the liquid crystal display device 100 (electro-optical device) shown in FIG. 5 to be inspected.

  The underlayer 12 is made of SiO2 (silicon oxide), and is not limited to this, and may be made of a resin-based material such as a nitride film or epoxy. The underlayer 12 is provided to prevent the occurrence of current leakage between the metal layer 13 and the substrate 2 and the erosion of the substrate 2 due to oxygen, moisture, and the like. It is formed so as to cover substantially the entire surface 2B. The end portion 12e of the foundation layer 12 is extended so as to project a predetermined amount outward from the opening 7A of the through hole 7. A side surface of the base portion of each bump electrode 11 is covered with the end portion 12e.

  The metal layer 13 is made of a metal material such as TiW (titanium tungsten), and is patterned simultaneously with the conductive film 15 and the wiring patterns 4 and 5. This metal film 13 functions to ensure adhesion between the conductive film 15 and the wiring patterns 4 and 5 with respect to the base layer 12 and to adhere each of them well. Therefore, the metal layer 13 is interposed between the base layer 12 and the conductive film 15 and the wiring patterns 4 and 5 so that at least the base layer 12, the conductive film 15 and the wiring patterns 4 and 5 are planar. It is provided in a size including a region overlapping in view (FIG. 2).

  Further, the end portion 13 e of each metal layer 13 protrudes from the opening 7 A on the first surface 2 A side of the through hole 7 and extends to the same position as the end portion 12 e of the base layer 12.

  The conductive film 15 and the wiring patterns 4 and 5 are made of a single layer or a plurality of types of metal films having malleability such as Au, TiW, Cu, Cr, Ni, Ti, W, NiV, Al, Pd, and lead-free solder. It consists of laminated ones. In particular, since the conductive film 15 is elastically deformed together with the base resin 9 by being connected to a terminal 202 on the liquid crystal display device 100 side, which will be described later, it is preferable to use Au particularly excellent in spreadability.

  The base resin 9 is disposed in the center so as to be embedded in the through hole 7, and is made of a photosensitive insulating resin such as polyimide resin, acrylic resin, phenol resin, silicone resin, silicone-modified polyimide resin, epoxy resin, or thermosetting insulation. It is made of resin. The material (hardness) and shape of the base resin 9 are appropriately selected and designed according to the shape of the bump electrode 11 and the like. The base resin 9 is interposed between the metal layers 13 in the through hole 7.

  The wiring pattern 4 and the wiring pattern 5 are disposed on the second surface 2B side of the substrate 2, that is, on the surface opposite to the first surface 2A on which the connection portion 3 is formed. Under the wiring patterns 4 and 5, a plurality of wiring-like metal layers 13 corresponding to the wirings 4a and 5a are formed. That is, in the present embodiment, as described above, the wiring patterns 4 and 5 and the base layer 12 are provided so as to include a region where the wiring layers 4 and 5 are planarly overlapped and a region where the conductive film 15 and the base layer 12 are planarly overlapped. The metal layer 13 ensures the adhesion of the conductive film 15 and the wiring patterns 4 and 5 to the underlayer 12.

  The wiring patterns 4 and 5 are electrically connected to the driving IC 6 at predetermined positions on the substrate 2. The wiring patterns 4 and 5 are partially covered with an insulating layer 17 provided on the second surface 2B of the substrate 2, and a driving IC 6 is provided on the end of each wiring 4a and 5a exposed from the opening 17a. Implemented. The wiring patterns 4 and 5 are protected by the insulating layer 17.

In the wiring pattern 4, the end of each wiring 4 a opposite to the driving IC 6 is connected to each conductive film 15 in the through hole 7.
The wiring pattern 5 is connected to a connector 8 for electrically connecting to a tester (not shown) at the end opposite to the driving IC 6. The connector 8 is made of, for example, a flexible substrate, and is mechanically connected to the substrate 2 via an ACF or the like.

Under such a configuration, the plurality of conductive films 15 provided on the surface of the base resin 9 are connected (conductive) to the driving IC 6 and the connector 8 independently of each other.
Therefore, each conductive film 15 functions independently as the bump electrode 11 according to the present invention, together with the base resin 9 located inside thereof.

  The driving IC 6 is mounted on the substrate 2 in a face-down structure, and among the plurality of terminals, a terminal 6a that outputs a driving signal to an object to be inspected (the liquid crystal display device 100: FIG. 5) is provided. A terminal 6 b connected to the end of the wiring pattern 4 connected to the bump electrode 11 and receiving a signal from a tester or the like is connected to the end of the wiring pattern 5. Note that a resin may be disposed between the driving IC 6 and the substrate 2 to seal the connection portions between the terminals 6 a and 6 b and the wiring patterns 4 and 5.

  A reinforcing member 16 is provided on the second surface 2B of the substrate 2 so as to cover a part of the wiring pattern 4 and the base resin 9 exposed at the opening 7B of the through hole 7. The reinforcing member 16 is made of a plate-like member having a predetermined thickness having an area larger than at least the opening 7B of the through hole 7, and is stuck on the second surface 2B with an adhesive or the like. This reinforcing member 16 increases the mechanical strength of the inspection probe 1. The reinforcing member 16 may be provided as necessary, and is not an essential component.

  In the inspection probe 1 of this embodiment, the tip of the bump electrode 11 has a hemispherical shape (curved surface), and the bump electrode 11 is deformed when connected to the terminal 202 on the liquid crystal display device 100 side, thereby causing a liquid crystal display. The electrical connection with the terminal on the apparatus side is performed well. Further, in the present embodiment, the surface of each conductive film 15 protrudes from the surface of the base resin 9 exposed between the conductive films 15, and the connection with the terminal 202 on the liquid crystal display device 100 side can be reliably performed. It has become.

<Inspection device>
FIG. 3 is a schematic view showing an example of an inspection apparatus 70 provided with the inspection probe 1 described above.
In FIG. 3, the inspection device 70 includes a holder 72 that holds the liquid crystal display device 100 that is an inspection target device, and an adjustment mechanism 71 that can adjust the position and orientation of the holder 72. The holder 72 holds an area other than the predetermined area 204 provided with the terminal 202 in the liquid crystal display device 100. In the position facing the predetermined area 204 of the liquid crystal display device 100 held by the holder 72, the connecting portion 3 of the inspection probe 1 is disposed. A pressing member 73 made of an elastic body is provided on the upper side with the connection portion 3 and the liquid crystal display device 100 interposed therebetween. In the inspection device 70, the inspection probe 1 is pressed by the pressing member 73 made of an elastic body in a state where the terminals 202 of the liquid crystal display device 100 and the bump electrodes 11 in the connection portion 3 of the inspection probe 1 are aligned. The liquid crystal display device 100 is pressed against. Thereby, the terminal 202 and the bump electrode 11 are brought into close contact with each other, and electrical connection is obtained. The plurality of terminals 202 in the liquid crystal display device 100 are supplied with the same drive signal as when the drive IC 6 (FIG. 1) is COG-mounted on each terminal 202 portion of the liquid crystal display device 100. Therefore, if the liquid crystal display in this state is discriminated by image analysis using a CCD or the like, visual inspection, etc., it is possible to perform display inspection for pixel defects and the like.

<Electrical property inspection method>
Next, an electrical property inspection method for the liquid crystal display device 100 using the inspection device 70 will be described. 4A and 4B are side sectional views for explaining the electrical property inspection method.
In order to perform the electrical characteristic inspection, first, as shown in FIG. 4A, the terminal (external circuit mounting terminal) 202 of the liquid crystal display device 100 is opposed to the bump electrode 11 on the connection portion 3 of the inspection probe 1. And the terminal 202 are aligned. Then, each terminal 202 is brought into contact with each bump electrode 11 in the connection portion 3, and in this state, the terminal 202 is relatively pressed against the connection portion 3 by a pressing means (not shown) at a predetermined pressure or higher.

  Then, as shown in FIG. 4B, the bump electrode 11 is compressed by being pressed by the substrate on the liquid crystal display device 100 side. Here, the bump electrode 11 is easily deformed because its tip is curved. Further, since the deformed taper-shaped bump electrode 11 is in a state where the contact area with the terminal 202 is widened, electrical connection between the two is ensured and good connection can be made. Further, the conductive film 15 on the surface is connected to the terminal 202 with high strength by the elastic restoring force (repulsive force) of the base resin 9. Inspection is performed in such a state.

(Liquid crystal display device)
Next, an example of a liquid crystal display device inspected by the inspection probe 1 of the present invention will be described. FIG. 5A is a plan view illustrating a schematic configuration of the liquid crystal display device, and FIG. 5B is a cross-sectional view taken along the line HH ′ in FIG.
As shown in FIGS. 5A and 5B, the liquid crystal display device 100 includes a TFT array substrate 30 provided with a thin film transistor (hereinafter referred to as TFT) as a pixel switching element, a counter substrate 40, Are bonded together by a sealing material 52, and the liquid crystal layer 50 is sealed inside the sealing material 52. A light-shielding film (peripheral parting) 53 made of a light-shielding material is formed inside the formation region of the sealing material 52. A data line driving circuit 201 is formed along one side of the TFT array substrate 30 in the peripheral circuit region outside the sealing material 52, and a scanning line driving circuit 104 is formed along two sides adjacent to the one side. ing.

  On the remaining side of the TFT array substrate 30, a plurality of wirings 105 are provided for connecting the two scanning line driving circuits 104 provided on both sides of the display area to each other. In the corner portion of the counter substrate 40, an inter-substrate conductive material 106 for providing electrical continuity between the TFT array substrate 30 and the counter substrate 40 is disposed.

  A large number of external circuit mounting terminals 202 are arranged in a row outside the data line driving circuit 201 on the TFT array substrate 10. As shown in FIG. 5B, the outer shape of the TFT array substrate 30 is larger than the outer shape of the counter substrate 40, and the region where the external circuit mounting terminal 202 is provided at the edge of the TFT array substrate 10 is the area of the counter substrate 40. It arrange | positions so that it may protrude outside from an edge.

  In the liquid crystal display device 100 having such a configuration, for example, after the TFT array substrate 30 and the counter substrate 40 are bonded to each other through a sealing material 52 to form an empty liquid crystal cell, the liquid crystal display device 100 is formed in the liquid crystal cell by vacuum injection. Liquid crystal is injected. Then, it manufactures by sealing a liquid-crystal inlet with a sealing material.

  Then, the electrical property inspection as described above is performed on the completed liquid crystal display device 100 in order to examine whether the electrical property satisfies the regulation.

  As shown in FIG. 4B, the inspection probe 1 of the liquid crystal display device 100 of the present embodiment and the inspection device 70 including the inspection probe 1 have a contact area of the deformed bump electrode 11 with respect to the terminal 202 increased. Thus, the electrical connection between the two is ensured and a good connection can be made. Further, the conductive film 15 on the surface is connected to the terminal 202 with high strength by the elastic restoring force (repulsive force) of the base resin 9. Thereby, since durability and connection reliability in the connection portion can be improved, the reliability of the electrical characteristic inspection itself is improved.

  In addition, the bump electrode 11 in the present embodiment is configured by the base resin 9 disposed in the through hole 7 and the conductive film 15 that partially covers the surface of the base resin 9. The load applied at the time of connection can be suitably absorbed by the deformation of the entire base resin 9, and conventionally, the bump electrode made of the resin protrusion disposed on the substrate surface and the conductive film covering the surface thereof is more suitable at the time of connection. Since the deformation becomes sufficient, the contact property can be improved.

  In addition, the inspection probe 1 according to the present embodiment can avoid a short circuit with the substrate 2 and a short circuit between terminals, which are problems in connection using a low melting point metal such as solder. Thereby, the malfunction at the time of a connection is eliminated and a highly reliable test result is obtained.

  Furthermore, in this embodiment, since a plurality of bump electrodes 11 can be arranged in one through hole 7 (opening 7A), a further narrow pitch of about 20 μm or less can be achieved. As a result, the overall apparatus can be significantly reduced in size.

  In the present embodiment, an electrical short circuit between the deformed bump electrode 11 and the substrate 2 is avoided by the base layer 12 protruding from the opening 7A of the through hole 7.

<Inspection probe manufacturing method>
Next, a method for manufacturing the inspection probe 1 of this embodiment will be described. FIG. 6 is a flowchart showing the manufacturing process of the inspection probe, and FIGS. 7 and 8 are cross-sectional views showing the manufacturing process of the inspection probe. Here, in this embodiment, when the inspection probe 1 is formed, a plurality of inspection probes 1 are simultaneously collected on the silicon wafer 300 by using a W-CSP (Wafer level Chip Scale Package) technique. A manufacturing method for forming and rearranging the rearrangement wiring and then separating the test probe 1 will be described.

  7 and 8 showing the intermediate steps of manufacturing the inspection probe 1, the drawings are simplified and one inspection probe 1 formed on the silicon wafer 300 is shown. Note that the silicon wafer 300 and the inspection probe 1 used in the following description of the manufacturing process are the same.

  First, as shown in FIG. 7A, vias 7b are formed from the second surface 2B side of the substrate 2 (S1). In the present embodiment, vias 7b having a diameter of 50 μm and a depth of 100 μm are formed by dry etching at predetermined positions on a silicon substrate having a plate thickness of 625 μm. At this time, the bottom surface of the via 7b was adjusted to be a curved surface. Further, for etching, a SiO 2 film may be used as a photoresist mask or a hard mask, or a photoresist mask and a hard mask may be used in combination. Further, the etching method is not limited to dry etching, and wet etching, laser processing, or a combination thereof may be used.

  Next, the base layer 12 that covers the second surface 2B of the substrate 2 and the inner surface of the via 7b is formed (S2). Here, the SiO2 film is formed to a thickness of 3000 mm or more by using the CVD method. In this embodiment, SiO2 is used, but tetraethyl silicate (Si (OC2H5) 4: hereinafter referred to as TEOS) formed by PECVD (Plasma Enhanced Chemical Vapor Deposition), that is, PE- TEOS and TEOS (O3-TEOS) formed using ozone CVD can also be used.

Next, as shown in FIG. 7B, a TiW film 13A is formed on the underlayer 12 (S3). Here, a TiW film 13A having a thickness of 1000 mm is formed in the second surface 2B of the substrate 2 and the through hole 7 by using a sputtering method.
Subsequently, an Au film 15A is formed on the metal layer 13 (S4). Here, an Au film 15A having a thickness of 5000 mm is formed in the second surface 2B of the substrate 2 and the through hole 7 by sputtering.

  Thereafter, as shown in FIG. 7C, the Au film 15A and the TiW film 13A are simultaneously patterned by known photolithography and etching methods (S5). Thus, the plurality of strip-like conductive films 15 partially covering the inside of the through-hole 7, the wiring pattern 4 electrically connected to the plurality of conductive films 15 on the second surface 2B, and the connector are electrically connected. Wiring pattern 5 is formed. At the same time, a plurality of metal layers 13 having the same shape as those of the conductive film 15 and the wiring patterns 4 and 5 are patterned. These metal layers 13 ensure the adhesion between the underlying layer 12 and the conductive film 15 or the wiring patterns 4 and 5. If necessary, the resistance value may be lowered by Au plating or the like. Further, another metal layer may be formed in order to ensure adhesion with the resin material filled in the through hole 7 in a later step.

  Next, as shown in FIG. 7D, the resin material is filled into the through holes 7 to form the base resin 9 (S6). Here, polyimide was used. In the present embodiment, since the bottom surface of the through-hole 7 has a curved surface, it can be filled without causing bubbles or the like to enter the resin.

  Next, as shown in FIG. 7E, an insulating layer 17 thicker than the wiring patterns 4 and 5 is formed on the second surface 2B of the substrate 2 (S7). Here, a photosensitive resin such as an epoxy resin or a polyimide resin is applied on the second surface 2B, exposed, and developed to expose both ends of the wiring patterns 4 and 5 facing the photosensitive resin layer. Opening 17a is formed. Further, the opening 17a may be formed by using dry etching or the like. In this way, the insulating layer 17 is formed on the second surface 2B.

  Next, as shown in FIG. 8F, the second surface 2 </ b> B side of the substrate 2 is supported by a support member 120 made of a glass substrate or the like provided with an adhesive 121. Then, the substrate 2 is polished to a predetermined thickness by performing, for example, CMP (Chemical Mechanical Polishing) from the second surface 2B side of the substrate 2 with the substrate 2 attached to the support member 120. Then, the thickness of the substrate 2 is reduced (S8). Specifically, processing is performed until just before the foundation layer 12 is exposed. By reinforcing the support member 120, it is possible to correct the warp of the substrate 2 and to prevent cracks generated during processing or handling.

  Next, the substrate 2 is selectively thinned by dry etching or wet etching to penetrate the via 7b, and the base layer 12 protrudes from the second surface 2B side by a predetermined protrusion amount (S9). For the etching, it is desirable to use a material having a sufficiently low etching rate of the underlayer 12 with respect to silicon. In the case of dry etching, inductive coupling plasma etching (ICP) or the like can be used. In the case of wet etching, HF, HNO3, a mixture thereof, KOH, or the like is used as an etchant. 12 protrusions are possible. The protrusion amount L1 of the underlayer 12 is preferably about 2% to 20% of the post length L. In this step, a through hole 7 that penetrates the thickness direction of the substrate 2 is formed.

  Next, as shown in FIG. 8G, the exposed portion of the base layer 12 is removed to expose the underlying metal layer 13 (S10). The underlayer 12 is removed using dry etching or wet etching. In the case of dry etching, reactive ion etching (RIE) can be used, and CF4, O2 or the like is used as a gas in that case. In the case of wet etching, it is necessary to select an etchant that can remove the underlying layer 12 without damaging the TiW layer. When the underlayer 12 is SiO2, dilute hydrofluoric acid is used.

  Further, when the base layer 12 is protruded from the silicon substrate in the previous step, the base layer 12 may be removed until the metal layer 13 is exposed by wet etching. In this case, it is possible to remove the underlayer 12 and expose the metal layer 13 in one step.

  Next, as shown in FIG. 8H, silicon etching is performed again to selectively thin the substrate 2, thereby protruding the end 12e of the base layer 12 by a predetermined amount (S11). In the case of dry etching, ICP and RIE are used. At this time, the protrusion amount L2 of the underlayer 12 was set to about 2% to 20% of the post length L.

  Next, as shown in FIG. 8I, the metal layer 13 is removed to expose the conductive film 15 (S12). Since the metal layer 13 is made of TiW, it is removed by wet etching to expose the conductive film 15. Since Au is not formed with an oxide film, the connection reliability with the terminal 202 on the liquid crystal display device 100 side can be ensured even when it is exposed until it is used (connected to the liquid crystal display device). As a result, a plurality of bump electrodes 11 (connecting portions 3) protruding on the second surface 2B of the substrate 2 are formed.

Next, as shown in FIG. 8 (j), after the support member 120 supporting the substrate 2 is peeled off, the driving IC 6 is mounted on the first surface 2 </ b> A of the substrate 2. In the present embodiment, the driving IC 6 is flip-chip bonded to the first surface 2 </ b> A, and a terminal 6 a that outputs a driving signal to the liquid crystal display device 100 among the plurality of terminals is connected to the bump electrode 11. A terminal 6 b to which a signal from a tester or the like is input is connected to the end of the wiring pattern 5. Here, in order to hold the connection portions between the wiring patterns 4 and 5 and the terminals 6a and 6b, these are molded with a resin 29.
The mounting of the driving IC 6 may employ a wire bonding structure, but it is preferable to employ the above-described flip chip bonding structure in order to reduce the thickness of the entire apparatus.

Next, the silicon wafer 300 is cut along the dicing line D to be separated into a plurality of inspection probes 1.
In this way, the inspection probe 1 of the present embodiment is obtained.

  In the manufacturing method of the inspection probe 1 of the present embodiment, the bump electrode 11 is formed immediately above (through the extension) of the through hole 7, so that the front-back conduction of the substrate 2 can be obtained simultaneously with the formation of the bump electrode 11. The number of processes can be reduced and the cost can be reduced.

(Second Embodiment)
Next, a second embodiment of the inspection probe of the present invention will be described with reference to FIG. FIG. 9A is a cross-sectional view showing a schematic configuration of the inspection probe according to the second embodiment, and FIG. 9B is an enlarged perspective view showing the main part of FIG. The basic structure of the inspection probe of the present embodiment shown below is substantially the same as that of the first embodiment, except that the bump electrode 11 and the driving IC 6 are connected via a through electrode. Different. Therefore, in the following description, a configuration different from the previous embodiment will be described in detail, and description of common parts will be omitted. In each drawing used for the description, the same reference numerals are given to the same components as those in FIGS.

  As shown in FIG. 9A, the inspection probe 20 of the present embodiment is provided with a connection portion 3, a driving IC 6, and wiring patterns 24 and 25 on the first surface 2 </ b> A side of the substrate 2. ing. Furthermore, the inspection probe 20 of the present embodiment includes an electrode having a plurality of through electrodes 21 corresponding to each of the bump electrodes 11 between the connection portion 3 and the driving IC 6 at the approximate center of the substrate 2. A portion 22 is provided. The plurality of bump electrodes 11 and the driving IC 6 are connected via the wiring pattern 24 and the plurality of through electrodes 21.

  The through electrode 21 is formed by using a through hole 23 that penetrates the first surface 2A and the second surface 2B of the substrate 2. The through hole 23 is provided in parallel with the through hole 7. The inner surface of the through hole 7 is tapered, whereas the inner surface of the through hole 23 is straight. Inside the through-hole 23, an underlayer 12b, a metal layer 13b, and a conductive film 15b are provided in this order from the inner surface 23a side, and each of them is connected via a portion 12c, 13c, 10c on the second surface 2B. It is formed integrally with each of the base layer 12a, the metal layer 13a, and the conductive film 15a on the third side.

  A resin 26 serving as a core of the through electrode 21 is embedded in the center of the through hole 23. As this resin material, the same resin material as the base resin 9 on the bump electrode 11 side is used. An end 24a opposite to the end 24b on the driving IC 6 side of the wiring 24a is connected to a part of the conductive film 15b on the opening 23A side of the through hole 23. Each through electrode 21 is not electrically connected to the substrate 2 by the base layer 12 b protruding from the substrate 2.

  One end side of the through electrode 21 is connected to the driving IC 6 via the wiring pattern 24 on the first surface 2A of the substrate 2, and the other end side is routed on the second surface 2B of the substrate 2. Further, it is connected to the bump electrode 11 (conductive film 15) on the first surface 2A side via the wiring (reference numeral 15c in FIG. 9B). With the through electrodes 21, the plurality of conductive films 15 a in the connection portion 3 are independently connected (conductive) to the driving IC 6. With such a configuration, each of the plurality of conductive films 15 in the connection portion 3 functions as the bump electrode 11 according to the present invention together with the internal base resin 9.

On the second surface 2 </ b> B of the substrate 2, a wiring pattern 25 formed in the same process as the wiring pattern 24 is disposed, and this wiring pattern 25 is also electrically connected to the driving IC 6.
Furthermore, a connector (not shown) for electrically connecting to a tester (not shown) is connected to the wiring pattern 25 at the end opposite to the driving IC 6.

  In a predetermined region of the first surface 2A of the substrate 2, an underlayer 12d made of an insulating material such as a resin is provided with a predetermined film thickness. The underlayer 12d includes at least the formation regions of the wiring patterns 24 and 25, ensures insulation between the wiring patterns 24 and 25 and the substrate 2, and protects the wirings 24a and 25a.

  Further, a wiring-like metal layer 13d patterned together with the wirings 24a and 25a is interposed between the base layer 12d and the wirings 24a and 25a. These metal layers 13d improve the adhesion of the wirings 24a and 25a to the base layer 12.

  A reinforcing member 28 is provided on the second surface 2B side of the substrate 2 with an adhesive 27 interposed therebetween. The reinforcing member 28 is formed in a size that covers substantially all of the second surface 2B including the openings of the through holes 7 and 23, and is caused by a load applied to the connection portion 3 when connected to the terminal 202 on the liquid crystal display device 100 side. It is provided to prevent the substrate 2 from being damaged.

  According to the inspection probe 20 of the present embodiment, since the connection portion 3 having the plurality of bump electrodes 11 and the driving IC 6 are provided on the first surface 2A side of the substrate 2, handling becomes easy. . Further, since the one surface side of the substrate 2 is covered by the reinforcing member 28, the mechanical strength of the entire inspection probe 20 is also improved.

(Third embodiment)
Next, a third embodiment of the inspection probe of the present invention will be described with reference to FIG. FIG. 10 is a perspective view showing a schematic configuration of the inspection probe of the third embodiment. The inspection probe of the present embodiment described below is different from the first embodiment in that the driving IC 6 is provided on a substrate different from the bump electrode 11. Therefore, in the following description, a configuration different from the first embodiment will be described in detail, and description of common parts will be omitted. Moreover, in each drawing used for description, the same code | symbol shall be attached | subjected to the same component as FIGS.

  The inspection probe 41 according to the present embodiment includes a probe component 42, an electronic component 43, and a flexible substrate 44 that connects them.

  The probe component 42 includes the substrate 45, the connection portion 3, the wiring pattern 4, the reinforcing member 16, and the like, and other components are the same as those in the first embodiment except that the size of the substrate 45 is smaller than that of the substrate 2. The configuration is substantially the same as the form.

  The electronic component 43 includes a substrate 46, an insulating layer 47 formed on one surface of the substrate 46, a plurality of terminals 48 aligned on the insulating layer 47, and a driving IC 6. In the driving IC 6, a plurality of terminals 6 b on the input side are connected to the respective terminals 48, and a plurality of terminals 6 a on the output side are connected to each wiring of the flexible substrate 44 mechanically connected on the substrate 46. .

  The end portion of the flexible substrate 44 opposite to the electronic component 43 side is electrically connected to the end portion of the wiring pattern 4 provided on the substrate 45 of the probe component 42. As a result, the plurality of conductive films 15 covering the base resin 9 are electrically connected to the driving IC 6, and each of the conductive films 15 and the base resin 9 located inside thereof are independently formed in this embodiment. The bump electrode 11 functions.

  According to the configuration of the present embodiment, the probe component 42 and the electronic component 43 can be manufactured separately, and the manufacturing efficiency is improved.

(Fourth embodiment)
Next, a fourth embodiment of the inspection probe of the present invention will be described with reference to FIG. FIG. 11 is a perspective view illustrating a schematic configuration of an inspection probe according to the fourth embodiment. The inspection probe of the present embodiment shown below is different from the second embodiment in that the driving IC 6 is provided on a substrate different from the bump electrode 11. Therefore, in the following description, a configuration different from the second embodiment will be described in detail, and description of common parts will be omitted. Moreover, in each drawing used for description, the same code | symbol shall be attached | subjected to the same component as FIGS. 1-10.

  The inspection probe 61 of the present embodiment includes a probe component 62, an electronic component 43, and a flexible substrate 44 that connects them.

  The probe component 62 includes the substrate 65, the connection portion 3, the wiring pattern 24, the reinforcing member 16, and the like, and other components are the same as those in the second embodiment except that the size of the substrate 65 is smaller than that of the substrate 2. The configuration is substantially the same as the form.

  The probe component 62 and the electronic component 43 are connected via a flexible substrate 44, and the end of the flexible substrate 44 opposite to the electronic component 43 side is provided on the substrate 65 of the probe component 62. It is electrically connected to the end of 24. Thereby, the plurality of conductive films 15 covering the base resin 9 are electrically connected to the driving IC 6 through the corresponding plurality of through electrodes 21, and each of the conductive films 15 and the base resin 9 located inside thereof are It functions independently as the bump electrode 11 according to the present embodiment.

  Also in the configuration of the present embodiment, the probe component 62 and the electronic component 43 can be manufactured separately, so that the manufacturing efficiency is improved.

  The preferred embodiments according to the present invention have been described above with reference to the accompanying drawings. However, it goes without saying that the present invention is not limited to such examples, and the above embodiments may be combined. It is obvious for those skilled in the art that various changes or modifications can be conceived within the scope of the technical idea described in the claims. It is understood that it belongs to.

It is a perspective view which shows 1st Embodiment of the probe for a test | inspection. It is sectional drawing of the probe for a test | inspection. It is a mimetic diagram showing one embodiment of an inspection device. It is a figure for demonstrating the electrical property inspection method using the probe for a test | inspection. It is a figure which shows schematic structure of a liquid crystal display device. It is a figure which shows the flowchart of the manufacturing process of the probe for a test | inspection. It is a figure for demonstrating an example of the manufacturing process of the probe for a test | inspection. It is a figure for demonstrating an example of the manufacturing process of the probe for a test | inspection. It is a schematic block diagram which shows 2nd Embodiment of the probe for a test | inspection. It is a schematic block diagram which shows 3rd Embodiment of the probe for a test | inspection. It is a schematic block diagram which shows 4th Embodiment of the probe for a test | inspection.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Inspection probe, 2 ... Board | substrate, 2A ... 1st surface, 2B ... 2nd surface, 3 ... Connection part, 11 ... Bump electrode (contact terminal), 4 ... Wiring pattern, 5 ... Wiring pattern, 7 ... Through-hole , 7b ... via, 9 ... underlying resin, 15 ... conductive film, 6 ... driving IC (electronic component for inspection), 17 ... insulating layer, 100 ... liquid crystal display device (device to be inspected), 206 ... scanning line terminal, 70 ... Inspection equipment

Claims (19)

An inspection probe for an electro-optical device, comprising: a substrate; and a connection portion provided on the substrate and electrically connected to the electro-optical device,
The connection portion has a plurality of contact terminals including a base resin disposed in the through hole of the substrate and a plurality of conductive films partially covering the base resin protruding from the first surface of the substrate. An inspection probe for an electro-optical device. 2. The inspection probe for an electro-optical device according to claim 1, wherein a tip of the contact terminal has a curved surface that is convex outward. 3. The inspection probe for an electro-optical device according to claim 1, wherein the contact terminal is tapered toward the tip. 4. The inspection probe for an electro-optical device according to claim 1, wherein a part of the base resin is exposed between the plurality of conductive films. 5. The surface of the base resin exposed between the plurality of conductive films is formed so as to be lower than the surfaces of the plurality of conductive films. 2. An inspection probe for the electro-optical device according to 1. 6. The inspection probe for an electro-optical device according to claim 1, wherein the conductive film is formed of a single or a plurality of metal films having spreadability. The side surface on the base side of the contact terminal is covered with a base layer provided in the through hole and protruding from the first surface of the substrate. 2. An inspection probe for the electro-optical device according to 1. 8. The electro-optical device inspection device according to claim 1, wherein an inspection electronic component electrically connected to the plurality of contact terminals is mounted on the substrate. probe. The inspection of the electro-optical device according to claim 1, wherein the inspection electronic component mounted on a different substrate different from the substrate is connected to the contact terminal. Probe. The inspection probe for an electro-optical device according to claim 1, wherein an insulating layer is provided on the wiring pattern disposed on the substrate. Forming vias from the second surface side of the substrate;
Forming a base layer on the inner surface of the via;
Forming a conductive film on the underlayer;
Patterning the conductive film into a plurality of regions;
Filling the vias with resin;
Thinning the substrate and penetrating the via;
And a step of removing the base layer protruding from the first surface of the substrate to expose the plurality of conductive films. A method of manufacturing an inspection probe for an electro-optical device, comprising: In the step of forming the via,
12. The method of manufacturing an inspection probe for an electro-optical device according to claim 11, wherein the bottom surface of the via is formed in a curved surface shape. In the step of forming the via,
13. The method of manufacturing an inspection probe for an electro-optical device according to claim 11, wherein the inner surface of the via is formed in a tapered shape. The surface of the base resin exposed between the plurality of patterned conductive films is formed so as to be lower than the surface of the plurality of conductive films. A method for producing an inspection probe for an electro-optical device according to claim 1. In the step of removing the underlayer,
15. The method of manufacturing an inspection probe for an electro-optical device according to claim 11, wherein the base layer partially remains on a base side of the contact terminal. The inspection of the electro-optical device according to claim 11, further comprising a step of mounting an inspection electronic component electrically connected to the plurality of conductive films on the substrate. Manufacturing method for a probe.   16. The method of manufacturing an inspection probe for an electro-optical device according to claim 11, further comprising a step of electrically connecting an inspection electronic component mounted on another substrate to the plurality of conductive films. 18. The method of manufacturing an inspection probe for an electro-optical device according to claim 11, further comprising a step of forming an insulating film on a wiring pattern disposed on the substrate.   An inspection apparatus comprising the inspection probe for an electro-optical device according to claim 1.

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