JP2010118628A5

JP2010118628A5 -

Info

Publication number: JP2010118628A5
Application number: JP2008292798A
Authority: JP
Filing date: 2008-11-14
Publication date: 2012-01-05
Anticipated expiration: 2028-11-14

Description

上記のような目的を達成するため、請求項１の発明は、内部を真空とすることが可能な処理室内に、被処理物に対向して配置され、プラズマ処理用のガスの流路を構成する穴が形成された複数のガスノズルを有するプラズマ処理装置において、前記複数のガスノズルは、互いの間に隙間を保持可能な状態で前記処理室の上下方向に重なり合う位置に、複数配置され、前記複数のガスノズルは、穴を通過するガスの圧力損失が変化するように、相対的に変位可能に設けられていることを特徴とする。
In order to achieve the above object, the invention of claim 1 is arranged in a processing chamber in which the inside can be evacuated so as to face an object to be processed, and constitutes a gas flow path for plasma processing. in the plasma processing apparatus having a plurality of gas nozzles holes are formed for the plurality of gas nozzles are in a position overlapping in the vertical direction of the processing chamber capable of holding a state a gap therebetween, a plurality of arranged, said plurality moth Sunozuru, as the pressure loss of the gas passing through the holes is changed, characterized in that is provided so as to be relatively displaceable.

請求項２の発明は、請求項１のプラズマ処理装置において、第１のガスノズルと、これに対向して回動可能に設けられた第２のガスノズルとを有し、前記第１のガスノズルにおける穴は、前記回動中心と同心の円上に複数配設され、前記第２のガスノズルにおける穴は、前記第１ガスノズルに配設された複数の穴に対応する円上に複数配設され、前記第１のガスノズルにおける穴と前記第２のガスノズルにおける穴とが、周方向にずれた部分を有することを特徴とする。
According to a second aspect of the invention, in the plasma processing apparatus according to claim 1, comprising: a first gas nozzle, a second nozzle which is provided rotatably so as to face thereto, the holes in the first gas nozzle , said a plurality disposed on the rotation center concentric circle, the hole in the second gas nozzles are more disposed on a circle corresponding to a plurality of holes disposed in the first gas nozzle The hole in the first gas nozzle and the hole in the second gas nozzle have a portion shifted in the circumferential direction.

請求項３の発明は、請求項１のプラズマ処理装置において、少なくとも一つのガスノズルと、これに対向するガスノズルとの間隔が、可変に設けられていることを特徴とする。
以上のような請求項３の発明では、両ガスノズルの穴の位置が接近している場合、圧力損失が大きくガスが流れ難くなり、穴の位置が離れている場合、圧力損失が小さくガスが流れ易くなるので、ガスノズルの間隔を変えることにより、処理速度を制御できる。
The invention of claim 3 provides the plasma processing apparatus according to claim 1, at least one gas nozzle, the distance between the gas nozzle opposed thereto, characterized in that provided variably.
In the invention of claim 3 as described above, when the positions of the holes of both gas nozzles are close to each other, the pressure loss is large and the gas hardly flows. When the positions of the holes are separated, the pressure loss is small and the gas flows. Since it becomes easy, processing speed is controllable by changing the space | interval of a gas nozzle.

請求項５の発明は、請求項４のプラズマ処理装置において、前記被処理物の被処理面から前記排気部側において、前記駆動機構と前記ガスノズルを接続する支持部を有し、前記支持部は、処理室の内壁の少なくとも一部を覆う位置に設けられていることを特徴とする。
以上のような請求項５の発明では、処理室の内壁を覆う支持部によって、処理時のガスから内壁が保護される。 The invention of claim 5 provides the plasma processing apparatus according to claim 4, wherein in the exhaust side from the processed surface of the object has a support portion for connecting said gas nozzle and said drive mechanism, said support portion Further, it is provided at a position covering at least a part of the inner wall of the processing chamber.
In the invention of claim 5 as described above, the inner wall is protected from the gas during processing by the support portion covering the inner wall of the processing chamber.

Claims

In a plasma processing apparatus having a plurality of gas nozzles arranged in a processing chamber that can be evacuated inside and opposed to an object to be processed, and formed with holes that constitute a flow path for a plasma processing gas,
Wherein the plurality of gas nozzles are placed in a position overlapping in the vertical direction of the processing chamber capable of holding a state a gap therebetween,
Wherein the plurality of gas Sunozuru, as the pressure loss of the gas passing through the holes is changed, the plasma processing apparatus characterized by being arranged to be relatively displaceable.

A first gas nozzle and a second gas nozzle rotatably provided opposite to the first gas nozzle;
The holes in the first gas nozzles are more disposed on the rotation center concentric circle,
The hole in the second gas nozzles are more disposed on a circle corresponding to a plurality of holes disposed in said first nozzle,
The plasma processing apparatus according to claim 1, wherein the hole in the first gas nozzle and the hole in the second gas nozzle have portions that are shifted in the circumferential direction.

At least the one gas nozzle, the distance between the gas nozzle you opposed thereto, the plasma processing apparatus according to claim 1, wherein the provided variable.

The processing chamber is provided with a gas exhaust part,
The plasma processing apparatus according to any one of claims 1 to 3, wherein a driving mechanism that drives at least one of the gas nozzles is located on the exhaust portion side from a surface to be processed of the object to be processed.

Wherein in the exhaust side from the processed surface of the object has a support portion for connecting said gas nozzle and said drive mechanism,
The plasma processing apparatus according to claim 4, wherein the support portion is provided at a position covering at least a part of the inner wall of the processing chamber.