JP2010114223A - Method of mounting chip component and substrate module mounted with chip component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To achieve higher-density mounting by arranging chip components with higher degree of freedom on a circuit substrate. <P>SOLUTION: When three chip components 20, 22, and 24 are mounted on a mounting surface of the circuit substrate 12, land parts 14 and 15, and 17 and 19 are previously formed at corresponding positions for the two chip components 20 and 22, which can be soldered by making cream solders S1 and S2 applied thereover reflow. For the remaining chip component 24, a cream solder S2 is applied over a resist film 18 from the adjacent land parts 15 and 17, and made to reflow in a state wherein the chip component 24 is arranged thereupon. Consequently, the electrodes 24a and 24b can be soldered to adjacent electrodes 20a and 22b respectively. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a mounting method of a chip component that is surface-mounted on a circuit board and a substrate module on which the chip component is mounted.

  Conventionally, as a method of mounting chip components arranged close to each other on a circuit board by reflow processing, a printed board having a pair of land portions provided in advance on a straight line is prepared. After applying cream solder to the land part and the intermediate position between them, two chip parts with one end part (electrode) close to each other are placed in a straight line at the intermediate position, and a reflow process is performed through a heating furnace. Prior art is known (for example, refer to Patent Document 1).

  In the above prior art, in the reflow process, the other end portions of the two chip components are soldered to the pair of land portions, respectively, and the one end portions are soldered to each other in a state of being pulled to the intermediate position. . In the prior art, another land portion may be provided at an intermediate position. In this case, the two chip component electrodes are soldered on one land portion in a close proximity.

In any case, according to the mounting method of the prior art, the chip component can be mounted at an appropriate position by the pulling action in the reflow process, so it is necessary to fix the chip component on the substrate with an adhesive in advance. There is no, and it can improve productivity.
JP 2000-269628 A

  As described above, the prior art is excellent in workability in the case where the chip parts are mounted on a substrate in a straight line. In addition, at the intermediate position between the land portions arranged in a straight line, the soldering is performed in a state in which the one end portions of the chip components are attracted to each other. Also excellent in terms.

  In addition, the inventors of the present invention focused on the fact that in the prior art mounting method, the arrangement of chip components adjacent to each other on the substrate is limited to a straight line, and further improvements have been studied.

  The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a technique for further developing high-density mounting by realizing a more flexible arrangement of chip components on a substrate.

The present invention employs the following means for solving the above problems.
First, the present invention is a method for mounting a chip component mounted on a mounting surface of a circuit board, and includes the following steps.

[Step 1]
In this step 1, the first and second chip parts to be mounted at the first and second mounting positions close to each other on the mounting surface, respectively, and close to both the first and second mounting positions. Third chip components to be mounted at the third mounting position are prepared.

[Step 2]
In step 2, a circuit board is prepared. In order to solder each electrode in advance at the first and second mounting positions on the circuit board prepared here in accordance with the arrangement of the electrodes formed at both ends of the first and second chip components. A plurality of land portions are formed, and the periphery of the land portion including the third mounting position is covered with an insulating layer.

[Step 3]
In step 3, cream solder is applied to each of the plurality of land portions at the first and second mounting positions, and the two land portions adjacent to the third mounting position are respectively straddled across the insulating layer. Apply cream solder to 3 mounting position. In the case where the insulating layer is provided on the periphery (outside) with a space from the land portion, cream solder may be applied so as to straddle the insulating layer beyond the upper surface of the outer circuit board from the land portion.

[Step 4]
In step 4, the first to third chip components are arranged at the corresponding first to third mounting positions, and the first and second chip components are respectively placed on the cream solder applied in the land portion. The electrodes are positioned, and for the third chip component, the two electrodes formed at both ends thereof are respectively positioned on the cream solder applied by extending from the two land portions to the third mounting position.

[Step 5]
In step 5, by reflowing the circuit board, the respective electrodes of the first and second chip components are soldered to the land portions, and the third chip components are formed at the two end portions thereof. One of the electrodes is soldered to one electrode of the first chip component, and the other electrode is soldered to one electrode of the second chip component.

  By performing the above steps 1 to 5, two mounting positions (first and second) where the land portion is formed in advance are formed even if the land portion is not formed on the circuit board at the beginning. If it is adjacent to both of the (mounting positions), the chip component can be easily added and mounted at that position by setting it as the third mounting position. For this reason, since it is possible to add chip parts relatively freely without being restricted by the presence or absence of the land portion, it is possible to flexibly carry out the work of changing the circuit configuration from the initial plan or improving the performance thereof. it can.

  Further, even if there is a position where it is difficult to form the land portion due to the arrangement of the circuit board, it is possible to easily mount the chip component by defining it as the third mounting position. Therefore, it is possible to effectively utilize the space on the circuit board and contribute to higher density mounting.

  In the mounting method of the present invention, the first and second chip components have a shape that occupies a rectangular mounting range on the mounting surface, and the first and second mounting positions are the first and second mounting positions. When the axis in the longitudinal direction of each chip part is extended on the mounting surface, these two axes intersect each other. The third mounting position is preferably set to a position including the intersection of two axes on the mounting surface.

  In this case, the third chip component also has a positional relationship adjacent to the first and second chip components at an angle. Further, when the third chip component is brought closer to one of the first and second chip components on the mounting surface, the third chip component is brought closer to the other at the same time. Therefore, when the extended cream solder is melted by the reflow process, the third chip component is attracted to both the first and second chip components with the flow from the insulating layer at that time (so-called self-alignment action). Therefore, the soldering in the above step 5 can be realized easily and reliably.

  In this regard, in a form in which the first to third chip components are arranged on the same straight line, when the third chip component is drawn to one of the chip components, the positional relationship is away from the other chip component. Therefore, although the self-alignment action is difficult to work, the present invention has an advantage that the self-alignment action works easily.

  In the present invention, it is preferable that the outer shape of the third chip component is set smaller than the first and second chip components in the mounted state.

  With such a magnitude relationship, the third chip component can be mounted in close proximity to both the first and second chip components close to each other, so that the mounting method of the present invention is further utilized ( Realization).

  Secondly, the present invention provides a substrate module on which a chip component is mounted. That is, in the board module of the present invention, a land for soldering is formed on the mounting surface, and a circuit board whose periphery is covered with an insulating layer, and electrodes are formed at both ends, respectively. In the state where all the electrodes are soldered on the land portion, the first and second chip components mounted at positions close to each other on the mounting surface and the first and second chip components are close to each other. In a state where one of the two electrodes formed at both ends and one of the two electrodes is on the insulating layer is soldered to one electrode of the first chip component, and the other is on the insulating layer. And a third chip component soldered to one electrode of the second chip component.

  As described above, the board module of the present invention can be easily obtained by performing soldering using the electrodes of the adjacent first and second chip components even at a position where the land portion is not originally provided. A third chip component can be mounted. For this reason, the initial circuit configuration is changed or its performance is improved by appropriately adding a third chip component using the space between the first and second chip components. be able to. Further, it is possible to effectively utilize the space on the circuit board and promote the high-density mounting.

  In the substrate module of the present invention, the first and second chip components have a shape that occupies a rectangular mounting range on the mounting surface, and the longitudinal axes of the first and second chip components respectively When extending on the mounting surface, it is desirable that these two axes intersect each other. And it is preferable that the 3rd chip component is mounted in the position containing the intersection of two axis lines on a mounting surface.

  If it is said positional relationship, the soldering with a 3rd chip component and a 1st and 2nd chip component will become more reliable by the self-alignment effect | action at the time of soldering.

  In addition, it is preferable that the area occupied by the third chip component on the mounting surface is set smaller than the area occupied by the first and second chip components on the mounting surface.

  In this case, since the third chip component can be easily laid out in a limited space, high-density mounting can be achieved.

  As described above, the mounting method and the substrate module of the present invention can realize further high-density mounting on the circuit board by mounting the chip components in a more flexible arrangement.

  Hereinafter, the chip component mounting method and the substrate module on which the chip component is mounted according to the present invention will be described with reference to preferred embodiments.

[First Embodiment]
FIG. 1 is a partially enlarged plan view showing a circuit board 12 constituting the board module 10 of the first embodiment in a completed state. At this stage, the chip component is not yet mounted on the mounting surface (the illustrated surface) of the circuit board 12. First, the procedure of the mounting method will be described.

[Step 1]
For example, in step 1 of the mounting method, a chip component (not shown in FIG. 1) to be mounted on the circuit board 12 is separately prepared. The number of chip components required depends on the circuit configuration of the substrate module 10 to be finally completed, but at least three chip components are prepared here. Note that there is no particular limitation on what kind of electronic component (capacitor, resistor, coil, semiconductor, etc.) the chip component is.

[Mounting position]
The three prepared chip components are mounted at mounting positions P1, P2, and P3 that are close to each other on the mounting surface of the circuit board 12, as indicated by a two-dot chain line in FIG. Overall, the mounting positions P1 and P2 are close to each other, and the mounting position P3 is close to both of the other mounting positions P1 and P2. Note that how close the mounting positions P1, P2, and P3 are actually is relatively determined from the relationship with other mounting components on the circuit board 12, and some reference (for example, how many mm or less) Is not).

[Relationship between mounting positions]
The mounting positions P1, P2, and P3 shown in FIG. 1 correspond to the mounting range when the outer shape of the chip component is projected onto the mounting surface. That is, each chip component to be mounted on the circuit board 12 has a shape that occupies a rectangular mounting range on the mounting surface. In each chip component, electrodes are formed at both end portions (for example, both end surfaces and upper and lower surfaces and both side surfaces near both ends) viewed in the longitudinal direction.

  Of the three mounting positions P1, P2 and P3, for two mounting positions P1 and P2, longitudinal axes L1 and L2 (virtual lines) of the chip components mounted on the mounting positions P1 and P2 are extended on the mounting surface. In this case, the axes L1 and L2 are in a positional relationship where they intersect (here, substantially orthogonal). Further, the remaining mounting position P3 is provided at a position including the intersection C of the axis lines L1 and L2.

[Relationship between chip parts]
Furthermore, the size of the outer shape of the chip component mounted thereon differs between the two mounting positions P1 and P2 and the remaining one mounting position P3. That is, the outer shape (size) of the chip component mounted at the mounting position P3 is smaller than the chip components mounted at the mounting positions P1 and P2. At the mounting position P3, chip components are mounted in an oblique direction (for example, 40 degrees to 50 degrees) with respect to the edge of the circuit board 12.

[Step 2]
Next, in step 2 of the mounting method, the circuit board 12 is prepared. Land portions 14, 15, 17, and 19 are formed in advance on the circuit board 12 at appropriate positions in accordance with the arrangement of the electrodes of the chip components mounted at the mounting positions P1 and P2.

  On the mounting surface of the circuit board 12, a resist film 18 is formed around each land portion 14-19. In this example, a part (one edge) of each land part 14 to 19 is covered with a resist film 18 (so-called over resist). Further, the opening 18a of the resist film 18 extends from the land portions 14 to 19 to a position closer to the center of the chip component.

  In addition, the circuit board 12 is provided with a wiring pattern 16 connected to the land portions 14 to 19 and through holes (not shown). In addition to the mounting positions P1, P2 and P3, actually, mounting positions for a large number of chip components are defined, but the illustration thereof is omitted here for convenience.

[Step 3]
FIG. 2 is a plan view showing an operation example in step 3 of the mounting method. In step 3, cream solders S1 and S2 are applied on the mounting surface of the circuit board 12. The cream solders S1 and S2 can be printed by a squeezing method with a metal mask (not shown) placed on the circuit board 12, for example. An opening is formed in advance in a metal mask (not shown) in accordance with the application range of the cream solders S1 and S2.

  Here, in each of the mounting positions P1 and P2, the cream solder S1 is appropriately applied only to the land portions 14 and 19 located on the side not adjacent to the mounting position P3 within the range of the opening 18a. On the other hand, in the land portions 15 and 17 located on the side adjacent to the mounting position P3, the cream solder S2 is applied so as to extend over the resist film 18 beyond the range of the opening 18a. That is, the cream solder S2 extends from the land portions 15 and 17 across the resist film 18 to the mounting position P3. Since no land is provided at the mounting position P3, the cream solder S2 is applied to the surface of the resist film 18 within the mounting position P3.

[Step 4]
FIG. 3 is a plan view showing an operation example in step 4 of the mounting method. In step 4, the prepared three chip components 20, 22, and 24 are arranged at corresponding mounting positions P1, P2, and P3, respectively.

  At this time, for the chip components 20 and 22 mounted at the mounting positions P1 and P2, the electrodes 20a and 20b are respectively applied to the cream solders S1 and S2 applied in the land portions 14 to 19 (in the range of the opening 18a). , 22a, 22b. On the other hand, with respect to the chip component 24 mounted at the mounting position P3, the two electrodes 24a and 24b are provided on the cream solder S2 at the portions extended from the land portions 15 and 17 to the mounting position P3 as described above. Position.

[Step 5]
FIG. 4 is a plan view showing a state in which soldering is completed through step 5 of the mounting method. In step 5 of the mounting method, the reflow processing of the circuit board 12 is performed in a state where the chip components 20, 22, and 24 are arranged as described above.

[Mounting positions P1, P2]
As a result, for the chip components 20 and 22 mounted at the mounting positions P1 and P2, the electrodes 20a, 20b, 22a, and 22b correspond to the corresponding land portions 15, 14, 19, and 17 (corresponding to the code order). Soldered.

[Mounting position P3]
On the other hand, for the chip component 24 mounted at the mounting position P3, the electrodes 24a and 24b are not positioned on the land portions 15 and 17, and most of them are originally positioned on the resist film 18. Is. For this reason, when the cream solder S2 is melted during reflow, most of the solder flows away from the resist film 18 and adheres to the metal surfaces of the land portions 15 and 17 and the electrodes 20a, 24a, 22b, and 24b (so-called paint-up). As a result, the electrodes 24a and 24b of the chip component 24 are soldered to one of the electrodes 20a and 22b of the adjacent chip components 20 and 22.

  At this time, the chip component 24 is attracted to the adjacent chip components 20 and 22 with the flow of the melted solder solder S2 (so-called self-alignment action). As a result, the chip component 24 moves slightly from the place where it was arranged in step 3, and settles to the final mounting position (no reference in FIG. 4). Note that FIG. 4 shows not the cream solder state but the solder solidified through the reflow process (denoted by the same reference numerals S1 and S2).

〔Post-process〕
Thereafter, for example, a cleaning process and a drying process of the circuit board 12 are performed and the residual flux is removed, whereby a finished product of the board module 10 is obtained. The board module 10 may be further diced, or may be connected to another board.

[Cross-section structure example]
FIG. 5 is a longitudinal sectional view (a VV section in FIG. 4) showing a structural example of the substrate module 10. As described above, the solidified solder (symbol S2 in the figure) is retracted from the resist film 18 and attached to the surface of the land portion 15 and the surfaces of the electrodes 20a and 24a. In this state, it can be seen that the electrode 24 a of the chip component 24 is mainly soldered to the electrode 20 a of the adjacent chip component 20. Therefore, it can be said that the electrode 24 a of the chip component 24 is soldered to the land portion 15 via the electrode 20 a of the adjacent chip component 20. Here, the soldering state between the chip component 24 mounted at the mounting position P3 and the chip component 20 mounted at one of the mounting positions P1 and P2 is shown. The soldering state can be considered similarly.

[Usage example]
FIG. 6 is a plan view partially showing a structural example of the board module 10 configured by using the mounting method described above. In this example, in addition to the three chip components 20, 22, and 24 mentioned above, a larger number of chip components 26 are mounted on the mounting surface of the circuit board 12.

  For example, it is assumed that the circuit configuration of the board module 10 is originally planned with only the other chip parts 20, 22, and 26 without mounting the chip part 24 on the circuit board 12. In this case, since the land portion corresponding to the chip component 24 is not provided on the circuit board 12, it is basically difficult to add and mount the chip component 24 later. However, if the mounting method described above is used, the chip component 24 can be easily added to change the circuit configuration of the board module 10 or to improve its performance.

  Alternatively, even if it is difficult to mount the chip component 26 of the same size between the chip components 20 and 22 due to the layout of the circuit board 12, if the mounting method described above is used, a dedicated land portion is particularly provided. The small-sized chip component 24 can be easily mounted without providing it. Therefore, a vacant space (symbol A in the figure) on the circuit board 12 can be effectively used, and can greatly contribute to higher density mounting.

[Second Embodiment]
FIG. 7 is a partially enlarged plan view showing the circuit board 12 constituting the board module 10 of the second embodiment in a completed state. In the first embodiment described above, only a part of each land portion 14, 15, 17, 19 (one edge portion located on both ends of the chip components 20, 22) was covered with the resist film 18. In the second embodiment, the four edge portions of the land portions 14, 15, 17, and 19 are covered with the resist film 18 (entire over resist).

  Hereinafter, the second embodiment will be described in comparison with the first embodiment. Moreover, about the matter which is common in 1st Embodiment, although the overlapping description is abbreviate | omitted using a common code | symbol with illustration, the structure peculiar to 2nd Embodiment shall be demonstrated suitably.

[Step 1]
Also in the second embodiment, for example, in step 1 of the mounting method, a chip component that is to be mounted on the circuit board 12 is separately prepared in common with the first embodiment. Further, the mounting positions P1, P2, and P3 viewed on the mounting surface of the circuit board 12, the positional relationship between them, and the size of the outer shape of the chip component mounted at each mounting position P1, P2, and P3 are also described. Common to one embodiment.

[Step 2]
In step 2 of the mounting method, a circuit board 12 having the configuration shown in FIG. 7 is prepared. At this time, on the circuit board 12, land portions 14, 15, 17, and 19 are formed in advance at appropriate positions in accordance with the arrangement of the electrodes of the chip components mounted at the mounting positions P1 and P2. A resist film 18 covering the entire circumference (four edge portions) is formed around 14 to 19. Therefore, in the second embodiment, the opening 18a of the resist film 18 does not extend to the outside of the land portions 14 to 19, and the area of the opening 18a is smaller than that of the first embodiment. The circuit board 12 is the same as the first embodiment in that a wiring pattern 16 and a through hole (not shown) are provided.

[Step 3]
FIG. 8 is a plan view illustrating an operation example in step 3 of the mounting method applied to the second embodiment. Also in the second embodiment, cream solders S1 and S2 are applied on the mounting surface of the circuit board 12 in step 3. Further, in each of the mounting positions P1 and P2, the cream solder S1 is appropriately applied to the land portions 14 and 19 located on the side not adjacent to the mounting position P3 only within the range of the opening 18a. In the land portions 15 and 17 located on the side adjacent to the mounting position P3, the solder paste S2 is applied to the resist film 18 so as to extend beyond the range of the opening 18a. The form is the same.

[Step 4]
Although not particularly illustrated, also in the second embodiment, the three chip components 20, 22, 24 prepared in step 4 are arranged at the corresponding mounting positions P1, P2, P3. At this time, for the chip components 20 and 22 mounted at the mounting positions P1 and P2, the respective electrodes 20a on the cream solders S1 and S2 applied in the land portions 14 to 19 (within the range of the opening 18a). , 20b, 22a, 22b, and the chip component 24 mounted at the mounting position P3 has two electrodes 24a, 24b on the cream solder S2 at the portions extending from the land portions 15, 17 to the mounting position P3, respectively. The point of positioning is the same as in the first embodiment.

[Step 5]
Although not shown in the figure, in step 5 of the mounting method, the circuit board 12 is reflowed in a state where the chip components 20, 22, and 24 are arranged as described above. Thus, also in the second embodiment, for the chip components 20 and 22 mounted at the mounting positions P1 and P2, the land portions 15, 14, 19, and 17 (each corresponding to the respective electrodes 20a, 20b, 22a, and 22b) ( For the chip component 24 that is soldered in a corresponding order) and mounted at the mounting position P3, its electrodes 24a and 24b are soldered to one of the electrodes 20a and 22b of the adjacent chip components 20 and 22.

  Further, the point that the chip component 24 is attracted to the adjacent chip components 20 and 22 as the cream solder S2 melted at this time flows is the same as in the first embodiment. Thereafter, a cleaning process and a drying process of the circuit board 12 are performed to remove the residual flux, whereby a finished product of the board module 10 of the second embodiment is obtained.

[Cross-section structure example]
FIG. 9 is a longitudinal sectional view showing a structural example of the substrate module 10 completed in the second embodiment (corresponding to FIG. 6 mentioned in the first embodiment). Similarly in the second embodiment, the solidified solder (symbol S2 in the figure) is withdrawn from the resist film 18 and attached to the surface of the land portion 15 and the surfaces of the electrodes 20a and 24a. In the second embodiment, since the entire periphery of the land portion 15 is covered with the resist film 18, the solder S <b> 2 is contained inside the opening 18 a even at a position near the center of the chip component 20.

  Similar to the first embodiment, in the second embodiment, the electrode 24a of the chip component 24 is mainly soldered to the electrode 20a of the adjacent chip component 20. Similarly, the electrode 24 a of the chip component 24 is soldered to the land portion 15 via the electrode 20 a of the adjacent chip component 20.

[Third Embodiment]
Next, a third embodiment will be described. FIG. 10 is a partially enlarged plan view showing the circuit board 12 constituting the board module 10 of the third embodiment in a completed state. In the third embodiment, each land portion 14, 15, 17, 19 is not covered with a resist film 18 (so-called normal resist).

  Hereinafter, the third embodiment will be described in comparison with the first embodiment. In the third embodiment as well, matters common to the first embodiment will be omitted by using the same reference numerals as those shown in the drawing, and a description specific to the configuration unique to the third embodiment will be given as appropriate.

[Step 1]
Also in the third embodiment, for example, in step 1 of the mounting method, a chip component to be mounted on the circuit board 12 is separately prepared, which is common to the first and second embodiments described above. Further, the mounting positions P1, P2, and P3 viewed on the mounting surface of the circuit board 12, the positional relationship between them, and the size of the outer shape of the chip component mounted at each mounting position P1, P2, and P3 are also described. 1 and 2nd embodiment.

[Step 2]
Next, in step 2 of the mounting method, a circuit board 12 having the configuration shown in FIG. 10 is prepared. Here, similarly, land portions 14, 15, 17, and 19 are formed in advance on the circuit board 12 at appropriate positions in accordance with the arrangement of the electrodes of the chip components mounted at the mounting positions P1 and P2. However, in the third embodiment, the resist film 18 is formed around the land portions 14 to 19 at intervals. Accordingly, in the third embodiment, the opening 18a of the resist film 18 extends to the outside of the entire circumference of each land portion 14 to 19, and the area of the opening 18a is larger than that of the first and second embodiments. Yes. The circuit board 12 is the same as the first and second embodiments in that a wiring pattern 16 and through holes (not shown) are provided.

  In FIG. 10, the areas of the land portions 14 to 19 and the opening 18 a are shown to be relatively large. However, in the third embodiment, the land portions 14 to 19 are not covered with the resist film 18. The area of the land portions 14 to 19 may be made smaller than that of the embodiment, and the area of the opening 18a may be set to be smaller accordingly.

[Step 3]
FIG. 11 is a plan view illustrating an operation example in step 3 of the mounting method applied to the third embodiment. Also in the third embodiment, cream solders S1 and S2 are applied on the mounting surface of the circuit board 12 in step 3. Further, in each of the mounting positions P1 and P2, the land portions 14 and 19 located on the side not adjacent to the mounting position P3 are appropriately coated with cream solder S1 only within the range of the upper surface thereof. In addition, in FIG. 11, although the application area of cream solder S1 is shown comparatively small, you may enlarge an application area from this.

  In the case of the third embodiment, the land portions 15 and 17 located on the side adjacent to the mounting position P3 extend from the upper surface to the outside (the upper surface of the circuit board 12), and further to the solder resist on the surrounding resist film 18 S2 is extended and applied. As described above, in the third embodiment, in addition to the upper surfaces of the land portions 14 and 19 and the resist film 18, the upper surface (background surface) of the circuit board 12 exposed outside the land portions 14 and 19 (inside the opening 18a). ) Is different from the first and second embodiments in that cream solder S2 is applied.

[Step 4]
Although not particularly illustrated, also in the third embodiment, the three chip components 20, 22, 24 prepared in step 4 are arranged at the corresponding mounting positions P1, P2, P3, respectively. At this time, for the chip components 20 and 22 mounted at the mounting positions P1 and P2, the electrodes 20a, 20b, 22a and 22b are positioned on the cream solders S1 and S2 applied to the land portions 14 to 19, respectively. As for the chip component 24 mounted at the mounting position P3, the two electrodes 24a and 24b are positioned on the cream solder S2 in the portions extended from the land portions 15 and 17 to the mounting position P3, respectively. This is the same as the second embodiment.

[Step 5]
Although not shown in the figure, in step 5 of the mounting method, the circuit board 12 is reflowed in a state where the chip components 20, 22, and 24 are arranged as described above. Accordingly, also in the third embodiment, for the chip components 20 and 22 mounted at the mounting positions P1 and P2, the respective land portions 15, 14, 19, and 17 (corresponding to the respective electrodes 20a, 20b, 22a, and 22b) ( For the chip component 24 that is soldered in a corresponding order) and mounted at the mounting position P3, its electrodes 24a and 24b are soldered to one of the electrodes 20a and 22b of the adjacent chip components 20 and 22.

  Further, the point that the chip component 24 is attracted to the adjacent chip components 20 and 22 along with the flow of the cream solder S2 melted at this time is the same as in the first and second embodiments. Then, after the circuit board 12 is cleaned and dried to remove the residual flux, a finished product of the board module 10 of the third embodiment is obtained.

[Cross-section structure example]
FIG. 12 is a longitudinal sectional view showing a structural example of the substrate module 10 completed in the third embodiment (corresponding to FIG. 6 described in the first embodiment). Similarly in the third embodiment, the solidified solder (symbol S2 in the figure) is retracted from the resist film 18 and the upper surface (background) of the circuit board 12, and adheres to the surface of the land portion 15 and the surfaces of the electrodes 20a and 24a. is doing. In the third embodiment, since the land portion 15 is not covered with the resist film 18, the solder S <b> 2 is within the range on the land 15 at the position outside the both ends of the chip component 20 and the position near the center. Is in the range.

  Also in the third embodiment, the electrode 24a of the chip component 24 is mainly soldered to the electrode 20a of the adjacent chip component 20. Similarly, the electrode 24 a of the chip component 24 is soldered to the land portion 15 via the electrode 20 a of the adjacent chip component 20.

  Also in the second and third embodiments described above, the chip components 24 can be easily added by applying the mounting methods mentioned above, and the circuit configuration of the board module 10 can be changed or the performance can be improved. You can plan. In addition, by effectively utilizing the vacant space on the circuit board 12, it is possible to greatly contribute to higher density mounting.

[Other forms]
In the mounting methods described in the first to third embodiments, the two chip components 20 and 22 are arranged with an opening of 90 degrees, but the angle between them is not particularly limited. Further, the chip component 24 may be the same size as the two chip components 20 and 22, or may be larger than these.

  In the mounting method described above, the chip component 24 is mounted outside the corners of the two chip components 20 and 22 opened at 90 degrees, but the chip component 24 may be mounted inside.

  Furthermore, the various forms described with reference to the drawings are merely preferred examples, and the shapes of the chip components 20 to 24 and the land portions 14 to 19 and the application ranges of the cream solders S1 and S2 can be changed as appropriate.

It is the top view which expanded and showed partially the circuit board which comprises the board | substrate module of 1st Embodiment in a completion state. It is a top view which shows the work example in the process 3 of the mounting method. It is a top view which shows the work example in the process 4 of the mounting method. It is a top view which shows the state which soldering was completed through the process 5 of the mounting method. It is a longitudinal cross-sectional view (VV cross section in FIG. 4) which shows the structural example of a board | substrate module. It is a top view which shows partially the structural example of the board | substrate module comprised using the mounting method. It is the top view which expanded and showed partially the circuit board which comprises the board | substrate module of 2nd Embodiment in a completion state. It is a top view which shows the work example in the process 3 of the mounting method applied to 2nd Embodiment. It is a longitudinal cross-sectional view which shows the structural example of the board | substrate module completed in 2nd Embodiment. It is the top view which expanded and showed partially the circuit board which comprises the board | substrate module of 3rd Embodiment in a completion state. It is a top view which shows the work example in the process 3 of the mounting method applied to 3rd Embodiment. It is a longitudinal cross-sectional view which shows the structural example of the board | substrate module 10 completed in 3rd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Board | substrate module 12 Circuit board 14, 15 Land part 16 Wiring pattern 17 Land part 18 Resist film (insulating layer)
18a Opening (resist removal)
19 Land part 20 Chip part (first chip part)
20a, 20b Electrode 22 Chip component (second chip component)
22a, 22b Electrode 24 Chip component (third chip component)
24a, 24b Electrode 26 Electrode P1, P2, P3 Mounting position (first to third mounting positions)

Claims (6)

A chip component mounting method mounted on a circuit board mounting surface,
A first and second chip parts that are to be mounted at first and second mounting positions close to each other on the mounting surface, respectively, and a third close to both the first and second mounting positions. Preparing each third chip component to be mounted at the mounting position;
A plurality of land portions for soldering individual electrodes at the first and second mounting positions in advance are formed in accordance with the arrangement of the electrodes formed at both ends of each of the first and second chip components. And a step of preparing a circuit board in a state where the periphery of the land portion including the third mounting position is covered with an insulating layer;
The solder paste is applied to each of the plurality of land portions at the first and second mounting positions, and the two land portions close to the third mounting position are respectively straddled across the insulating layer. Extending the cream solder to the third mounting position and applying;
The first to third chip components are arranged at the corresponding first to third mounting positions, and the first and second chip components are respectively placed on the cream solder applied in the land portion. Positioning electrodes and positioning the two electrodes formed at both ends of the third chip component on the cream solder applied by extending from the two land portions to the third mounting position. When,
By reflowing the circuit board, each of the electrodes for the first and second chip components is soldered to the land portion, and for the third chip component, two electrodes formed at both end portions thereof are soldered. A method of mounting a chip component, comprising: soldering one of the electrodes to one electrode of the first chip component and soldering the other electrode to one electrode of the second chip component. The chip component mounting method according to claim 1,
The first and second chip components are:
It has a shape that occupies a rectangular mounting range on the mounting surface,
The first and second mounting positions are:
When the longitudinal axes of the first and second chip components are respectively extended on the mounting surface, the two axes are in a positional relationship intersecting each other,
The third mounting position is
A chip component mounting method, wherein the chip component is set at a position including an intersection of the two axes on the mounting surface. In the chip component mounting method according to claim 1 or 2,
A chip component mounting method, wherein an outer shape of the third chip component is set smaller than that of the first and second chip components. A circuit board in which a land for soldering is formed on the mounting surface and the periphery of the land is covered with an insulating layer;
Electrodes are formed at both ends, and both of these electrodes are soldered onto the land portion, and the first and second chip components mounted at positions close to each other on the mounting surface;
One electrode of the first chip component in a state in which one of the two electrodes formed on both ends is mounted on the insulating layer and is mounted at a position close to both the first and second chip components. And a third chip component that is soldered to one electrode of the second chip component with the other on the insulating layer. Board module. In the board module which mounts the chip component according to claim 4,
The first and second chip components are:
When the mounting surface has a shape that occupies a rectangular mounting range, and when the longitudinal axes of the first and second chip components are respectively extended on the mounting surface, these two axes are In a positional relationship that intersects each other,
The third chip component is:
A board module having a chip component mounted thereon, wherein the board module is mounted at a position including an intersection of the two axes on the mounting surface. In the board module which mounts the chip component according to claim 4 or 5,
A substrate module having a chip component mounted thereon, wherein an outer shape of the third chip component is set smaller than that of the first and second chip components.