JP2010113051A - Passive matrix type display device for organic electroluminescence - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a passive matrix display device for organic electroluminescence, which can downsize a wiring region while maintaining the image area size on substrate glass and can prevent invasion of outside air into a passive matrix element. <P>SOLUTION: The passive matrix display device 1 for organic EL has a multilayer wiring structure 8, wherein a plurality of lines of electrode wires B<SB>1</SB>-B<SB>n</SB>connected to a driving IC 6 are laminated in wiring regions 5a and 5b arranged in the peripheral region of the passive matrix element 3 on a substrate 2 for a plurality of lines of electrode wires B<SB>1</SB>-B<SB>n</SB>. In the multilayer wiring structure 8, the respective electrode wires B<SB>1</SB>-B<SB>n</SB>are disposed so that those in even-number layers are positioned between those in the adjacent odd-number layers. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a passive matrix display device for organic EL, and more particularly to a wiring structure of anode lines or cathode lines constituting a passive matrix element.

  Conventionally, various passive matrix display devices for organic EL have been proposed.

FIG. 5 is a plan view of a conventional general organic EL passive matrix display device.
As shown in FIG. 5, the organic EL passive matrix display device 21 includes a substrate glass 22 and a passive matrix element 23. A passive matrix element 23 is disposed on the substrate glass 22, and a sealing glass 24 is bonded onto the passive matrix element 23 using an adhesive or the like so as not to come into contact with outside air (humidity). .
A wiring region 25 having a width of length W ₁ is provided in the peripheral region (left and right region) of the passive matrix element 23 on the substrate glass 22.

Passive matrix device 23, an anode line _A 1 to A _m of the m rows, and the cathode lines _B 1 .about.B _n of the deployed n rows so as to intersect the anode lines _A 1 to A _m, anode lines _A 1 ~ and a driver IC26 Metropolitan to A _m and the cathode lines _B 1 .about.B _n are connected.
Anode lines _A 1 to A _m are wired from the driver IC26 toward a central region of the substrate glass 22. On the other hand, the cathode line _B 1 .about.B _n is wired as divided into left and right wiring region 25 with intersecting the anode lines _A 1 to A _m. The substrate glass 22 includes a lead line 27 connected to the driver IC 26, and the lead line 27 sends a luminance signal to the driver IC 26.

FIG. 6 is a diagram showing the configuration of the passive matrix element 23 in more detail.
As shown in FIG. 6, the driver IC 26 includes a column driver 26a and a row driver 26b.
Anode lines _A 1 to A _m is connected to each output of the column driver 26a, cathode lines _B 1 .about.B _n is connected to each output of the row driver 26b. The anode lines _A 1 to A _m and the cathode lines _B 1 .about.B _n, are arranged in a matrix so as to intersect each anode lines _A 1 to A _m are connected to the respective cathode lines _B 1 .about.B _n It is supposed to be. Then, the intersections of the anode lines _A 1 to A _m and the cathode lines _B 1 .about.B _n, the organic EL element 28 is provided, the respective organic EL elements 28, one pixel in the passive matrix device 23 Is responsible.

In the configuration of FIG. 6, _{one of} the cathode lines B _{1 to} B _n connected to the row driver 26 b has a low potential, so that it corresponds to the luminance signal 29 input from the lead line 27 (see FIG. 5). , the current _I 1 ~I _m flows to the organic EL element 28 direction from the column driver 26a, the organic EL element 28 will be turned on.
Then, the cathode lines B _{1 to} B _n connected to the row driver 26 b are sequentially lowered in potential, so that the passive matrix elements 23 are lit in units of rows, thereby displaying a predetermined pattern and image. .

On the other hand, Patent Document 1 discloses a liquid crystal display device used for a mobile phone, a television, and the like.
In the liquid crystal display device of Patent Document 1, a display area AR and a drive circuit DRV are provided on a substrate SUB1. A scanning signal line wiring region is provided in the peripheral region of the display region AR on the substrate SUB1, and the scanning signal line lead-out wires GLP1 and GLP2 are stacked in this wiring region via an insulating film. A multilayer wiring structure is provided.
JP 2008-145461 A

For example, when the configuration of FIG. 5 described above is applied to a large matrix (QVGA: 240 RGB × 320 rows) used for a mobile phone or the like, 160 cathode lines are arranged in the left and right wiring regions 25. . In this case, if the wiring pitch of the cathode lines B _{1 to} B _n is set to 0.05 mm, the wiring width W ₁ is considerably increased to 8 mm. Here, in order to keep the passive matrix display device 21 for organic EL within a predetermined width W, the area of the passive matrix element 23 on which an image or the like is displayed is reduced, or the wiring pitch of the cathode lines B _{1 to} B _n Need to be small.
However, when the area of the passive matrix element 23 is reduced, there is a problem that an image displayed on a mobile phone or the like is accordingly reduced. Further, when the wiring pitch of the cathode lines B _{1 to} B _n is reduced to reduce the width W ₁ of the wiring region 25, there is a problem that the wiring resistance increases and the driving voltage and power consumption increase.

On the other hand, in the configuration of Patent Document 1 described above, since provided a multilayer wiring structure by stacking a scan signal line lead lines GLP1, GLP2 in the wiring region, although it is possible to prevent the wiring width W ₁ is larger, multilayered There is a problem that the height of the wiring region increases due to the provision of the wiring structure. As the height of the wiring region increases in this way, it becomes difficult to reduce the size of the entire device.
Further, in the configuration of the above-described Patent Document 1, an insulating film is disposed between the scanning signal line lead-out lines GLP1 and GLP2 in order to maintain insulation between the layers. In this case, the insulating film must be formed so as to be higher than the height of the scanning signal line lead lines GLP1 and GLP2, and the height of the wiring area becomes large. As described above, when the height of the wiring region is increased, the bonding interval between the substrate and the sealing glass is increased, and as a result, there is a risk that outside air (humidity) that deteriorates the light emission characteristics of the passive matrix element may enter. .

  The present invention has been made in view of such a situation, and an object of the present invention is to make it possible to reduce the size of the wiring area while maintaining the size of the image area on the substrate glass, and to allow the outside air to pass through the passive matrix element. It is to provide a passive matrix display device for organic EL that can also prevent intrusion.

  In order to solve the above-described problems of the prior art, in the present invention of claim 1, a wiring region of a plurality of columns of electrode lines connected to the driving IC is provided in the peripheral region of the passive matrix element on the substrate, and the wiring In the organic EL passive matrix display device having a multilayer wiring structure in which the plurality of rows of electrode lines are stacked in a region, each even-numbered electrode line in the multilayer wiring structure is positioned between adjacent electrode lines in the odd-numbered layer. Are arranged to be.

  According to the second aspect of the present invention, the passive matrix element is configured to be divided into two units, and the driving IC includes two or more driver ICs and is configured to drive the two units in a divided manner. In the wiring area, a control signal wiring and a power supply wiring for connecting the two or more driver ICs are provided.

  In the present invention of claim 3, a laminated structure in which the control signal wiring and the power supply wiring are laminated is provided on the upper side of the multilayer wiring structure in the wiring area, and each wiring in the even layer in the laminated structure is provided. The odd-numbered layers are arranged between adjacent wirings.

As described above, according to the passive matrix display device for organic EL according to the present invention, the wiring region of the electrode lines of a plurality of columns connected to the driving IC is provided in the peripheral region of the passive matrix element on the substrate, and the wiring region In the passive matrix display device for organic EL provided with a multilayer wiring structure in which the plurality of rows of electrode lines are stacked on each other, each even-numbered electrode line in the multilayer wiring structure is located between adjacent electrode lines in the odd-numbered layer Thus, not only the width of the wiring region is suppressed, but also the height of the multilayer wiring structure in the wiring region is suppressed. Thereby, size reduction of the passive matrix display device for organic EL is realizable, maintaining the area | region of the passive matrix element in which an image etc. are displayed.
In addition, according to the passive matrix display device for organic EL according to the present invention, the insulation between the electrode lines can be maintained even if the insulating material disposed between the electrode lines is formed thinner than the conventional one. As a result, the height of the multilayer wiring structure is suppressed, so that the bonding interval between the substrate and the sealing glass is smaller than the conventional one, and as a result, intrusion of outside air that deteriorates the light emission characteristics of the passive matrix element is prevented. Can be prevented.

  Further, according to the passive matrix display device for organic EL according to the present invention, the passive matrix element is divided into two units, and the driving IC includes two or more driver ICs and the 2 The unit is configured to divide and drive, and the wiring region is provided with a control signal wiring and a power supply wiring for connecting the two or more driver ICs. Even when the matrix element is divided into two units, the width and height of the multilayer wiring structure in the wiring region are suppressed. Thereby, size reduction of the passive matrix display device for organic EL is realizable, maintaining the area | region of the passive matrix element in which an image etc. are displayed.

Further, according to the passive matrix display device for organic EL according to the present invention, a laminated structure in which the control signal wiring and the power supply wiring are laminated is provided above the multilayer wiring structure in the wiring region, Since each wiring of the even layer in the laminated structure is arranged so as to be positioned between the adjacent wirings of the odd layer, the width of the wiring region even when the control signal wiring and the power supply wiring are arranged in the wiring region. Further, the height is suppressed, and further downsizing of the passive matrix display device for organic EL can be realized.
Furthermore, even when the control signal wiring and power supply wiring are stacked on the upper side of the multilayer wiring structure, the height of the stacked structure is suppressed, so that the bonding interval between the substrate and the sealing glass becomes smaller than the conventional one. As a result, it is possible to prevent intrusion of outside air that deteriorates the light emission characteristics of the passive matrix element.

  Hereinafter, a passive matrix display device for organic EL according to the present invention will be described with reference to the drawings.

[First Embodiment]
FIG. 1 is a plan view of a passive matrix display device for organic EL according to a first embodiment of the present invention.
As shown in FIG. 1, the organic EL passive matrix display device 1 includes a substrate glass 2 and a passive matrix element 3.
A passive matrix element 3 is disposed on the substrate glass 2, and a sealing glass 4 is bonded onto the passive matrix element 3 using an adhesive or the like so as not to come into contact with outside air. In addition, wiring regions 5 a and 5 b having a width of length W ₁ are provided in the peripheral region (left and right region) of the passive matrix element 3 on the substrate glass 2.

As shown in FIG. 1, the passive matrix device 3, and the anode line _A 1 to A _m of the m columns, the cathode lines _B 1 .about.B _n of the deployed n rows so as to intersect the anode lines _A 1 to A _m When, and a driver IC6 Metropolitan of anode lines _A 1 to A _m and the cathode lines _B 1 .about.B _n are connected.
Driver IC6, the longitudinal end portion is disposed near the anode line A ₁ to A _m of the substrate glass 2 is wired from the driver IC6 towards the central region of the substrate glass 2.

On the other hand, the cathode line _B 1 .about.B _n the left and right wiring region 5a with intersecting the anode lines _A 1 to A _m, are wired so as divided into 5b. The cathode lines B _{1 to} B _n extend in the longitudinal direction of the substrate glass 2 in the wiring regions 5a and 5b, and are connected to the driver IC 6 through the wiring regions 5a and 5b. In the present embodiment, the number of cathode lines B _{1 to} B _n is 320, and 160 cathode lines are arranged in the left and right wiring regions 5a and 5b. The substrate glass 2 includes a lead wire 7 connected to the driver IC 6, and the lead wire 7 sends a luminance signal to the driver IC 6.

Further, the passive matrix element 3 of the present embodiment has a configuration similar to the configuration of FIG. 6 described above.
From the above configuration, in the organic EL passive matrix display device 1 according to the present embodiment, the cathode lines B _{1 to} B _n connected to the driver IC 6 are sequentially set to a low potential, whereby the luminance input from the lead line 7. toward the organic EL element flows current corresponding to the signal through the anode lines a ₁ to a _m (see FIG. 6), thereby, it adapted to display a predetermined pattern and image.

FIG. 2 is a cross-sectional view taken along the line AA in FIG. 1, and shows an example in which a four-layer multilayer wiring structure 8 is provided in the wiring region 5b. As described above, in the present embodiment, 160 cathode lines are arranged in the wiring region 5b, but FIG. 2 shows only a part for easy understanding of the configuration.
As shown in FIG. 2, in the present embodiment, on the right side of the wiring area 5b, the cathode line B ₂ of a plurality of _rows, B _4, · · ·, a multilayer wiring structure 8 formed by stacking B _n are provided.
In the wiring region 5b on the substrate glass 2, a first cathode layer 9a composed of a plurality of cathode lines (for example, 40 of B ₂ , B ₄ ,..., B _n ) is formed. Here, the cathode line of the first cathode layer 9a is formed by forming a low resistance metal such as Al on the substrate glass 2 by sputtering and then patterning it.
A first insulating film 10a is formed on the first cathode layer 9a so as to be thinner than the cathode line of the first cathode layer 9a. In the present embodiment, the first insulating film 10a is formed of a resinous material such as a resist, for example.

As shown in FIG. 2, a second cathode layer comprising a plurality of cathode lines (for example, 40 of B ₂ , B ₄ ,..., B _n ) is formed on the first insulating film 10a. 9b is formed. Here, each cathode line of the second cathode layer 9b is disposed so as to be positioned between adjacent cathode lines of the first cathode layer 9a.
A second insulating film 10b is formed on the second cathode layer 9b so as to be thinner than the cathode line of the second cathode layer 9b. Here, the second insulating film 10b is formed of the same material as that of the first insulating film 10a, and is formed so as to have a flat surface.

As shown in FIG. 2, a third cathode layer 9c composed of a plurality of cathode lines (for example, 40 of B ₂ , B ₄ ,..., B _n ) is formed on the second insulating film 10b. Is formed. A third insulating film 10c is formed on the third cathode layer 9c so as to be thinner than the cathode line of the third cathode layer 9c. Here, the third insulating film 10c is formed of the same material as that of the first insulating film 10a.
Further, a fourth cathode layer 9d made of a plurality of cathode lines (for example, 40 of B ₂ , B ₄ ,..., _Bn ) is formed on the third insulating film 10c. Here, each cathode line of the fourth cathode layer 9d is disposed so as to be positioned between adjacent cathode lines of the third cathode layer 9c. A fourth insulating film 10d is formed on the fourth cathode layer 9d so as to be thinner than the fourth cathode layer 9d. Here, the fourth insulating film 10d is formed of the same material as that of the first insulating film 10a, and is formed so that the surface becomes flat.

As described above, according to the organic EL passive matrix display device 1 according to the first embodiment, the cathode lines of the even layers (the second cathode layer 9b and the fourth cathode layer 9d) in the multilayer wiring structure 8 are used. but odd layer (first cathode layer 9a, a third cathode layer 9c) since it is arranged so as to be positioned between adjacent cathode lines of the wiring region 5a, only to suppress the width W ₁ of 5b In addition, the height of the multilayer wiring structure 8 in the wiring regions 5a and 5b can be suppressed. For example, in the case of the four-layer multilayer wiring structure 8 as in the present embodiment, the height is conventionally about 8 mm, but can be suppressed to about 2 mm. Thereby, size reduction of the passive matrix display device 1 for organic EL is realizable, maintaining the area | region of the passive matrix element 3 in which an image etc. are displayed.

  Further, for example, in the configuration of the conventional Patent Document 1, in order to maintain the insulation between the cathode lines of each layer in the multilayer wiring structure, it is necessary to form an insulating film with a thickness greater than the height of the cathode lines. However, in the present embodiment, the cathode lines of the even layers (second cathode layer 9b, fourth cathode layer 9d) in the multilayer wiring structure 8 are replaced with odd layers (first cathode layer 9a, third cathode layer 9c). ), The insulating films 10a, 10b, 10c, and 10d formed between the cathode layers 9a, 9b, 9c, and 9d can be made thinner than the conventional one. Even if it is formed thin, it can retain insulation. Thereby, since the height of the multilayer wiring structure 8 is suppressed, the bonding interval between the substrate glass 2 and the sealing glass 4 becomes smaller than the conventional one, and as a result, the light emission characteristics of the passive matrix element 3 are deteriorated. Makes it difficult for outside air to enter.

[Second Embodiment]
Next, a passive matrix display device 1 for organic EL according to a second embodiment of the present invention will be described with reference to FIG.
FIG. 3 is a plan view of the organic EL passive matrix display device 1 according to the second embodiment of the present invention. In addition, about the member similar to what was demonstrated in 1st Embodiment mentioned above, the same code | symbol is attached | subjected and the overlapping description is abbreviate | omitted.

  As shown in FIG. 3, in this embodiment, the passive matrix element 3 is divided into two units 3a and 3b in order to increase the light emission luminance. The unit 3a is arranged in the vicinity of the end in the longitudinal direction of the substrate glass 2, while the unit 3b is arranged in the vicinity of the end on the opposite side of the unit 3a.

The first unit 3a includes 240 (RGB) columns of first anode lines A _{1 to} A ₂₄₀ and 160 rows of first cathodes arranged so as to intersect the _first anode lines A _{1 to} A _240. The line B _{1 to} B ₁₆₀ and the first driver IC 6 a to which the first anode lines A _{1 to} A ₂₄₀ and the first cathode lines B _{1 to} B ₁₆₀ are connected are configured.
The first cathode lines B _{1 to} B ₁₆₀ are wired so as to intersect the _first anode lines A _{1 to} A ₂₄₀ and to be divided into left and right wiring regions 5a and 5b. The first cathode lines B _{1 to} B ₁₆₀ extend in the longitudinal direction of the substrate glass 2 in the wiring regions 5a and 5b, and are connected to the first driver IC 6a through the wiring regions 5a and 5b. In this embodiment, 80 _first cathode lines B _{1 to} B ₁₆₀ are arranged in each of the left and right wiring regions 5a and 5b.

In addition, the second unit 3b includes the second anode lines C _{1 to} C ₂₄₀ in 240 (RGB) columns and the 160 rows of second lines arranged so as to intersect the second anode lines C _{1 to} C ₂₄₀ . Cathode lines D _{1 to} D ₁₆₀ , second anode lines C _{1 to} C _240, and second driver ICs 6 b to which the second cathode lines D _{1 to} D ₁₆₀ are connected.
The second cathode lines D _{1 to} D ₁₆₀ are wired so as to intersect the second anode lines C _{1 to} C ₂₄₀ and to be divided into left and right wiring regions 5a and 5b. The second cathode lines D _{1 to} D ₁₆₀ extend in the longitudinal direction of the substrate glass 2 in the wiring regions 5a and 5b, and are connected to the second driver IC 6b through the wiring regions 5a and 5b. In this embodiment, 80 second cathode lines D _{1 to} D ₁₆₀ are arranged in the left and right wiring regions 5a and 5b.
From the above configuration, in this embodiment, the two units 3a and 3b in the passive matrix element 3 are divided and driven by the two driver ICs 6a and 6b.

FIG. 4 is a cross-sectional view taken along the line BB in FIG. 3 and shows an example in which a multilayer wiring structure is provided in the wiring region 5b. As described above, in the present embodiment, 80 second cathode lines D _{1 to} D ₁₆₀ are arranged in the wiring region 5b, but only a part is shown in FIG. 4 for easy understanding of the configuration. ing.
As shown in FIG. 4, in the present embodiment, a multilayer wiring structure 8 in which a plurality of rows of cathode lines D ₂ , D ₄ ,..., D ₁₆₀ are stacked is provided in the right wiring region 5b. The configuration of the multilayer wiring structure 8 is the same as that in the first embodiment described above.
Further, on the upper side of the multilayer wiring structure 8 in the wiring area 5b, a control signal wiring for connecting the two units 3a and 3b (for example, a interlocking signal wiring between the two units 3a and 3b, a data bus, or the like). 11 and a power supply wiring 12 are stacked.

On the upper side of the multilayer wiring structure 8, a first wiring layer 14 a made of the control signal wiring 11 is formed. A first insulating layer 15a is formed on the first wiring layer 14a so as to be thinner than the first wiring layer 14a.
Further, as shown in FIG. 4, a second wiring layer 14b made of the power supply wiring 12 is formed on the first insulating layer 15a. Here, each power supply wiring 12 of the second wiring layer 14b is arranged so as to be positioned between the adjacent control signal wirings 11 of the first wiring layer 14a. On the second wiring layer 14b, the second insulating layer 15b is formed so as to be thinner than the second wiring layer 14b, and the surface thereof is flattened.
Note that the first and second insulating layers 15a and 15b described above are formed of a resinous material such as a resist, for example.

Thus, according to the passive matrix display device 1 for organic EL according to the second embodiment, the passive matrix element 3 is divided into two units 3a and 3b, and the two driver ICs 6a and 6b are provided. The two units 3a and 3b are configured to be divided and driven, and a laminated structure 13 in which a control signal wiring 11 and a power wiring 12 are laminated is provided above the multilayer wiring structure 8 in the wiring regions 5a and 5b. The power supply wirings 12 in the even layer (second wiring layer 14b) in the laminated structure 13 are arranged so as to be positioned between the adjacent control signal wirings 11 in the odd layer (first wiring layer 14a). since it is, even when placing the control signal line 11 and power line 12 wiring region 5a, the 5b, wiring region 5a, the width W ₁ and a height of 5b can be suppressed. Thereby, size reduction of the passive matrix display device 1 for organic EL is realizable, maintaining the area | region of the passive matrix element 3 in which an image etc. are displayed.

  Further, even when the control signal wiring 11 and the power supply wiring 12 are stacked on the upper side of the multilayer wiring structure 8, the height of the stacked structure 13 is suppressed, so that the bonding interval between the substrate glass 2 and the sealing glass 4 is reduced. As a result, it is possible to prevent intrusion of outside air that deteriorates the light emission characteristics of the passive matrix element 3 as compared with the conventional case.

  Although the embodiments of the present invention have been described above, the present invention is not limited to the above-described embodiments, and various modifications and changes can be made based on the technical idea of the present invention.

  For example, when the passive matrix device has a configuration of 240 × 320 RGB of QVGA, an anode line can be wired in the wiring region, and the anode line can have a multilayer wiring structure as in the above-described embodiment. As a result, the passive matrix display device for organic EL can be miniaturized, and intrusion of outside air that degrades the light emission characteristics of the passive matrix element can be prevented.

1 is a plan view showing a passive matrix display device for organic EL according to a first embodiment of the present invention. It is the sectional view on the AA line in FIG. It is the top view which showed the passive matrix type display apparatus for organic EL which concerns on the 2nd Embodiment of this invention. It is the BB sectional view taken on the line in FIG. It is the top view which showed the conventional passive matrix type display apparatus for organic EL. It is the figure which showed the detailed structure of the conventional passive matrix element.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Passive matrix type display device for organic EL 2 Substrate glass 3 Passive matrix element 4 Sealing glass 5a, 5b Wiring area 6 Driver IC
7 Leader 8 Multi-layer wiring structure 9a, 9b, 9c, 9d Cathode layer 10a, 10b, 10c, 10d Insulating film 11 Control signal wiring 12 Power wiring 13 Laminated structure 14a, 14b Wiring layers 15a, 15b Insulating layers A, C Anode line B, D Cathode line

Claims (3)

For organic EL in which a wiring region of a plurality of rows of electrode lines connected to a driving IC is provided in a peripheral region of a passive matrix element on a substrate, and a multilayer wiring structure in which the plurality of rows of electrode wires are stacked in the wiring region In passive matrix display devices,
A passive matrix display device for organic EL, wherein each of the even-numbered electrode lines in the multilayer wiring structure is disposed between adjacent electrode lines of the odd-numbered layer.   The passive matrix element is configured to be divided into two units, and the driving IC includes two or more driver ICs and is configured to drive the two units in a divided manner. In the wiring region, 2. The organic EL passive matrix display device according to claim 1, wherein a control signal wiring and a power supply wiring for connecting the two or more driver ICs are provided. 3.   A laminated structure in which the control signal wiring and the power supply wiring are laminated is provided on the upper side of the multilayer wiring structure in the wiring region, and each even-numbered wiring in the laminated structure is connected to an odd-numbered adjacent wiring. The passive matrix display device for organic EL according to claim 2, which is disposed so as to be positioned between them.

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