JP2010110679A - Rack for cleaning substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a rack for cleaning substrates capable of restraining the vibration of the substrates during cleaning without sacrificing cleaning effect. <P>SOLUTION: With the rack 10 for cleaning substrates, the cleaning work of the substrates 14 is done by housing a plurality of substrates 14 in a rack body 12 in a standing state, and streaming fluid such as a cleaning liquid in the up to down direction through a flow path 12a thereof. The rack body 12 has members 16 for holding both ends and a member 18 for holding down parts provided therein to hold edge side parts of the both sides and edge side parts of the down side of the substrates 14 by the members 16 for holding both ends and the member 18 for holding down parts respectively; and a member 20 for holding upper parts is attached in the rack body 12 in a state of housing the substrates 14 so as to hold edge side parts of the upper side of the substrates 14 by the member 20 for holding upper parts. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a substrate cleaning rack for storing a substrate when, for example, an electronic component or the like is soldered to the substrate, and then the remaining flux is washed away or subsequently dried.

  2. Description of the Related Art Conventionally, there is known a substrate cleaning rack having a structure in which a plurality of pairs of substrate insertion portions are provided on opposite side surface portions and a cleaning liquid is passed between substrates inserted in these substrate insertion portions (see Patent Document 1). . In particular, this substrate cleaning rack is provided with a partition plate between the substrate insertion portions, thereby forming a plurality of substrate cleaning areas with substantially the same area between the end surface portion of the rack and the partition plate and between the two partition plates. .

  According to the substrate cleaning rack described above, even if the substrate is not accommodated in all the substrate insertion portions, a wide space and a narrow space are not formed in the substrate insertion portion. It can be distributed. For this reason, even when the number of substrates to be cleaned is less than the capacity accommodated in the rack, it is not necessary to mount a dummy substrate in a wide space portion, and it is considered that the work can be saved as much.

Further, the substrate cleaning rack of the prior art generates intense turbulent flow by circulating the cleaning liquid in a state where the entire surface is finely divided. Since the cleaning liquid strongly contacts the surface of the substrate due to the turbulent flow at this time, it is considered that the cleaning effect can be enhanced accordingly.
Japanese Patent Laid-Open No. 11-145093

  However, if the flow rate of the cleaning liquid is increased to a certain level in the rack as in the prior art described above and violent turbulence is generated, this may cause large vibrations on the entire substrate. If the substrate is deformed (distortion is generated) due to the vibration at this time, for example, excessive stress is applied to the soldered portion between the wiring pattern and the electronic component, and there is a possibility that a problem such as cracking, chipping or peeling of the soldered portion may occur. However, if the flow rate of the cleaning liquid is decreased too much, there is a problem that a sufficient cleaning effect cannot be obtained.

  Therefore, an object of the present invention is to provide a technique for suppressing the vibration of the substrate during cleaning without sacrificing the cleaning effect.

The present invention employs the following means for solving the above problems.
That is, the present invention is a substrate cleaning rack for storing a substrate to be cleaned, and for cleaning or drying the substrate by flowing a fluid in one direction along the substrate. In particular, the substrate cleaning rack of the present invention is configured to hold a substrate using the first holding member material and the second holding member material.

  Of these, the first holding member material holds the two edge portions located on both sides of the substrate as viewed in the fluid flow direction. The second holding member material has a plate shape extending in the fluid flow direction, and holds at least the edge portion located on the upstream side of the two edge portions of the substrate facing in the fluid flow direction. is there.

  Normally, just holding the edges on both sides of the substrate when the fluid flows, the substrate is free between them (particularly at the center of the flow), and as described above, the entire substrate is brought into contact with the fluid. Vibration will occur.

  Therefore, in the present invention, not only the edge portions on both sides as seen in the fluid flow direction but also the two edge portions facing each other in the flow direction are held together so that at least the upstream edge portion is held in total, so that at least three in total. The edge is held. This prevents the substrate from becoming free between the edges on both sides when the fluid is flowing, and suppresses the occurrence of vibration.

  In addition, since the second holding member has a plate shape whose structure extends in the fluid flow direction, even if it is disposed between the edge portions on both sides (the center position of the flow), the second holding member is excessively resistant to the flow of the fluid. Does not cause a significant decrease in flow rate.

  The substrate cleaning rack according to the present invention has a structure in which a flow path through which a fluid is circulated is formed, and a square cylindrical rack body in which a first holding member is provided on each of a pair of opposed inner wall surfaces. It may be. In this case, the second holding member is preferably provided so as to be detachable from the rack body.

  With the above structure, when the board is accommodated in the rack body, the second holding member is first removed from the rack body, and the board is inserted into the flow path of the rack body along the fluid flow direction. By doing so, the edge portions on both sides can be held by the first holding member. Next, when the second holding member is attached to the rack body, the edge portions of the substrates opposed in the flow direction can be held by the second holding member.

  Further, after the substrate cleaning operation (cleaning or drying) using the substrate cleaning rack is completed, the substrate can be easily extracted from the rack body by removing the second holding member from the rack body.

  In the substrate cleaning rack of the present invention, a plurality of preferred embodiments can be exemplified below particularly for the second holding member.

(1) The second holding member has a triangular groove formed at an angle of 90 degrees or less with respect to the thickness direction of the substrate, and the edge of the substrate is received in the triangular groove. The mode which controls the vibration or a deformation | transformation to the thickness direction of a board | substrate may be sufficient. In this case, the restriction may be either vibration or deformation, or both (the same applies hereinafter). That is, when “vibration” is restricted, periodic distortion of the substrate can be suppressed, and when “deformation” is restricted, distortion in one direction seen in the thickness direction can be suppressed.

  In this case, since the triangular groove is in a state where the mouth is opened at an angle of 90 degrees or less with respect to the edge of the substrate, the edge of the substrate can be easily received in the triangular groove. Moreover, since the edge part of a board | substrate is restrained relatively by making the edge contact the inner surface of a triangular groove | channel, it can suppress generation | occurrence | production of a vibration at the time of the distribution | circulation of a fluid by it.

  In the above aspect (1), the first holding member may have a plurality of holding grooves extending in the fluid flow direction so as to hold the plurality of substrates arranged in parallel with each other at a substantially constant interval. In this case, it is desirable that the second holding member has a plurality of triangular grooves at positions corresponding to the plurality of substrates in a state where the edge portions on both sides are held by the first holding member.

  In this case, since the plurality of substrates can be simultaneously held using the first holding member and the second holding member in a state where the plurality of substrates are accommodated in the substrate cleaning rack, the efficiency of the cleaning operation is increased accordingly. be able to.

(2) Alternatively, in the second holding member, an entrance portion that receives an edge portion of the substrate is formed as a tapered groove having an angle of 90 degrees or less with respect to the thickness direction of the substrate, and a portion deeper than the entrance portion Is formed as a parallel groove extending in the receiving direction of the edge portion of the substrate with a substantially constant width slightly larger than the thickness of the substrate, and in the thickness direction of the substrate with the edge portion of the substrate being received in the parallel groove through the tapered groove It may be an aspect that regulates vibration or deformation.

  In the above aspect (2), the taper groove is in a state where the mouth is opened at an angle of 90 degrees or less with respect to the edge of the substrate, so that the substrate is accommodated in the substrate cleaning rack. When the edge portion of the substrate is held by the two holding members, the edge portion of the substrate can be easily received first through the tapered groove. And since the edge of the substrate is received in the parallel groove at the back of the taper groove, the displacement in the thickness direction is reliably restricted there, thereby preventing the occurrence of vibration when the fluid is circulated.

  In the above aspect (2), the first holding member may have a plurality of holding grooves extending in the fluid flow direction so as to hold the plurality of substrates arranged in parallel with each other at a substantially constant interval. The second holding member has a plurality of tapered grooves and parallel grooves at positions corresponding to the plurality of substrates in a state where the edge portions on both sides are held by the first holding member, While restricting vibration or deformation in the thickness direction of each substrate in a state where the edge portion of the substrate is received, it is possible to absorb variations in the length dimension of the substrate viewed in the fluid flow direction.

  In this case as well, since a plurality of substrates can be simultaneously held using the first holding member and the second holding member in a state where a plurality of substrates are accommodated in the substrate cleaning rack, the cleaning operation can be performed accordingly. Efficiency can be increased.

  Furthermore, even if there are variations in length (dimensional tolerance) among a plurality of substrates, since the variations are absorbed in the parallel grooves, all substrates using the first holding member and the second holding member are used. Can be held well.

  The substrate cleaning rack of the present invention can effectively suppress the vibration of the substrate while sufficiently exhibiting the cleaning effect and the drying action by the fluid. Thereby, it can suppress that a board | substrate deform | transforms during washing | cleaning or drying, and can prevent that a malfunction generate | occur | produces in a soldering part.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[First Embodiment]
FIG. 1 is a perspective view illustrating a structural example of a substrate cleaning rack 10 according to the first embodiment. In FIG. 1, a part of the substrate cleaning rack 10 is cut away and partly disassembled.

[Rack body]
The substrate cleaning rack 10 includes a rack body 12 having a rectangular tube shape. The rack body 12 is formed as a fluid flow passage 12a having a rectangular cross section inside, and the plurality of substrates 14 to be cleaned can be accommodated in the flow passage 12a in an upright state, for example. In addition, when cleaning or drying the substrate 14, a cleaning liquid or drying air can be circulated from top to bottom.

[First holding member]
The rack body 12 has a pair of both end holding members 16 attached to a pair of inner wall surfaces 12b facing each other in the flow passage 12a. Each of the both end holding members 16 has a plurality of holding grooves 16a extending in the vertical direction. When the substrate 14 is accommodated in the rack body 12, the edge portions on both sides of the substrate 14 are guided by the holding grooves 16 a, so that the plurality of substrates 14 are arranged in parallel in the rack body 12 at substantially equal intervals. Be placed. In this state, the both-end holding member 16 holds the edge portions on both sides of the substrate 14 by the holding groove 16a.

[Second holding member]
The rack body 12 is provided with a lower holding member 18 at a lower position in the flow passage 12a. The lower holding member 18 extends between another pair of inner wall surfaces 12c facing each other in the flow passage 12a, and both ends thereof are joined to the corresponding inner wall surfaces 12c. When the substrate 14 is accommodated in the rack body 12, the substrate 14 is inserted to a position where the lower edge portion (lower end surface) contacts the lower holding member 18.

  Although not shown in FIG. 1 because it is in a hidden position, a plurality of triangular grooves 18 a are formed in the lower holding member 18 at positions that contact the edge of the substrate 14. These triangular grooves 18 a are formed in the longitudinal direction along the upper edge of the lower holding member 18, and each of them opens in a triangular shape (V-shape) in the thickness direction of the substrate 14. It is configured as a notch groove. When the substrate 14 is inserted to a position where it contacts the lower holding member 18 as described above, the lower edge of the substrate 14 is received in the corresponding triangular groove 18a. In this state, the lower holding member 18 can hold the lower edge of the substrate 14.

  On the other hand, an upper holding member 20 is attached to the rack body 12 at an upper position in the flow passage 12a. The upper holding member 20 can be attached to and detached from the rack body 12, and the upper holding member 20 is shown in a state separated from the rack body 12 in FIG. The upper holding member 20 is attached by being inserted into the rack body 12 from above in a state where the substrate 14 is accommodated in the rack body 12 as described above. When the upper holding member 20 is attached to the rack body 12, the upper holding member 20 comes into contact with the upper edge of the substrate 14.

  Here, the upper holding member 20 has a pair of side holding plates 20a and a connecting plate 20b facing each other, and the side holding plates 20a and the connecting plates 20b are combined in a square tube (or square frame) shape. The upper holding member 20 has a center holding plate 20c parallel to the pair of side holding plates 20a. The center holding plate 20c extends between the pair of connecting plates 20b, and both ends are joined to the inner surfaces of the corresponding connecting plates 20b.

  As shown in FIG. 1, the side holding plate 20a and the center holding plate 20c of the upper holding member 20 have a plurality of triangular grooves 20d (in FIG. 1) at positions where they contact the upper edge of the substrate 14, respectively. , Only a part is given a reference numeral). These triangular grooves 20d are arranged in the longitudinal direction along the lower edges of the holding plates 20a and 20c, and each of them is triangular (V-shaped) in the thickness direction of the substrate 14. It is configured as a notch groove that is open to the top. As described above, when the upper holding member 20 is attached to the rack body 12 and comes into contact with the upper edge of the substrate 14, the upper edge of the substrate 14 is received in the corresponding triangular groove 20d. In this state, the upper holding member 20 can hold the upper edge portion of the substrate 14.

  FIG. 2 is a longitudinal sectional view (II-II cross section in FIG. 1) of the substrate cleaning rack 10. As described above, the plurality of substrates 14 are accommodated in the rack body 12 with the edge portions on both sides being guided into the holding grooves 16 a of the both-end holding members 16. Further, the lower edge portion of the substrate 14 is in contact with the lower holding member 18 while being inserted into the rack body 12, and is received in the corresponding triangular groove 18a.

  The upper holding member 20 is attached by being inserted into the rack body 12, and in this state, the upper holding member 20 is in contact with the upper edge portion of the substrate 14 by its own weight. The upper holding member 20 receives the upper edge of the substrate 14 in the triangular groove 20d formed in the lower edge of each holding plate 20a, 20c, and holds the upper edge in this state.

  3 is a longitudinal sectional view (III-III cross section in FIG. 1) of the substrate cleaning rack 10 as seen from a direction different from FIG. That is, FIG. 2 shows a longitudinal section viewed in the thickness direction of the accommodated substrate 14, but FIG. 3 shows a longitudinal section viewed in a direction parallel to the substrate 14.

  When viewed in the width direction of the accommodated substrate 14, the lower holding member 18 is provided just at the center of the substrate 14. For this reason, the lower holding member 18 can hold the center position of the lower edge portion. In addition, the attachment position of such a lower holding member 18 is an example to the last, and may be provided in the position which shifted | deviated from the center with respect to the board | substrate 14 in the width direction. Alternatively, the lower holding member 18 may be provided at a plurality of locations.

  Further, the upper holding member 20 is attached at a substantially central position when viewed in the width direction of the accommodated substrate 14. Thereby, the upper holding member 20 holds the center position of the upper edge portion by the center holding plate 20c, and holds the upper edge portion at substantially equal positions (three places in total) by the two side holding plates 20a on both sides thereof. can do.

  FIG. 4 is a cross-sectional view of the substrate cleaning rack 10 (IV-IV cross section in FIG. 1). As described above, the both-end holding member 16 is formed with a plurality of holding grooves 16 a at a constant interval in the arrangement direction of the substrates 14. The width of each holding groove 16 a is set slightly larger than the thickness of the substrate 14. Further, when viewed from the pair of both end holding members 16, the interval between the holding grooves 16 a facing each other is set slightly larger than the width dimension of the substrate 14. For this reason, the operation | work at the time of accommodating the board | substrate 14 in the rack main body 12, or extracting the board | substrate 14 from the rack main body 12 becomes easy.

  FIG. 5 is an enlarged view of the triangular groove 20d. Here, the side holding plate 20a or the center holding plate 20c of the upper holding member 20 is taken as an example, but the same applies to the lower holding member 18, and therefore the lower holding member 18 and its triangular groove 18a in the figure. The reference numerals are also indicated in parentheses as appropriate. For this reason, in the following description, the term “triangular groove” also applies to the triangular groove 18 a of the lower holding member 18.

  As described above, the triangular groove 20d is formed in the lower edge portion (the upper edge portion in the case of the lower holding member 18) of the side holding plate 20a or the center holding plate 20c and opens in the direction of the edge portion of the substrate 14. Yes. At this time, the triangular groove 20d has an angle θ with respect to the thickness direction of the substrate 14, and 90 ° or less is appropriate as the range of the angle θ here. Further, the opening width of the triangular groove 20 d is set larger than the thickness of the substrate 14.

  For this reason, when the board | substrate 14 and the upper holding member 20 (or lower holding member 18) are made to contact, the edge part of the board | substrate 14 will be easily received in the triangular groove | channel 20d of a respectively corresponding position. In this state, the edge of the edge portion of the substrate 14 contacts the inner surface of the triangular groove 20d, so that the edge portion of the substrate 14 is securely held. In addition, when the dimension seen in the longitudinal direction (vertical direction in the drawing) of the plurality of substrates 14 varies, the edges of the edge portions of some substrates 14 are slightly separated from the inner surface of the triangular groove 20d. There is also. The reason why the angle θ is set to 90 degrees or less is that vibrations can be more effectively suppressed even when there is the substrate 14 that does not contact the inner surface of the triangular groove 20d due to dimensional variations as described above.

[Example of cleaning work]
FIG. 6 is a diagram showing an example of the outline of the cleaning operation of the substrate 14 performed using the substrate cleaning rack 10. Here, the substrate 14 is cleaned by a so-called direct pass method. In this case, the cleaning liquid is circulated in the cleaning tank 30 with the substrate cleaning rack 10 in the state where the substrate 14 is accommodated installed in the cleaning tank 30. The washing tank 30 is provided with an inlet 30a and an outlet 30b on the upper and lower sides, respectively, and a circulation channel 32 is connected to the inlet 30a and the outlet 30b.

  A circulation device 36 such as a pump is installed in the middle of the circulation channel 32, and the cleaning liquid filled in the circulation channel 32 can be circulated.

  Along with the circulation of the cleaning liquid, the cleaning liquid flows into the cleaning tank 30 from the inlet 30a, and the cleaning liquid flows in the substrate cleaning rack 10 from the top to the bottom while cleaning the substrate 14. For example, if the substrate 14 has undergone the reflow process, residual flux after soldering is washed away.

  The cleaning liquid that has cleaned the substrate 14 passes through the substrate cleaning rack 10, is discharged from the discharge port 30 b into the circulation flow path 32, and is collected into the circulation device 36. In the circulation device 36, foreign matters mixed in the cleaning liquid are filtered and then sent out again into the circulation flow path 32 as the cleaning liquid.

  The above is the outline of the cleaning operation of the substrate 14 using the substrate cleaning rack 10. At this time, since the substrate 14 is accommodated in the substrate cleaning rack 10 in a state of being erected along the flow direction of the cleaning liquid, the cleaning action can be satisfactorily exhibited by contact with the flowing cleaning liquid.

  On the other hand, pressure is applied to the substrate 14 in the thickness direction by the fluid (cleaning liquid) that comes into contact. However, if the pressure balance fluctuates on both surfaces of the substrate 14, a force in the thickness direction acts on the substrate 14 thereby. become. The force at this time causes the substrate 14 to vibrate in the thickness direction, which tends to deform and deform the substrate 14. As described above, the substrate cleaning rack 10 includes the lower holding member 18 and Since the upper holding member 20 is provided, the vibration of the substrate 14 during cleaning is suppressed thereby.

〔Measurement result〕
FIG. 7 is a diagram illustrating a measurement result of strain generated in the substrate 14 during cleaning. FIG. 7A shows a measurement result (comparative example) when a conventional substrate cleaning rack is used (when the lower holding member 18 and the upper holding member 20 are not provided). 7B shows the measurement results (first embodiment) when the lower holding member 18 and the upper holding member 20 are provided. The measurement was performed with a strain gauge attached to an appropriate position (for example, the center position) on the surface of the substrate 14.

[Comparative Example]
7A: When the cleaning operation is performed using a conventional substrate cleaning rack (a rack that holds only the edges on both sides of the substrate 14), the substrate is started from the start of the cleaning operation (time t0 in the drawing). 14 was distorted, and large strains were observed periodically thereafter. This means that the substrate 14 is vibrated in the thickness direction as the cleaning liquid flows. In this case, stress may be generated in the soldered portion of the substrate 14 due to vibration, and in some cases, cracking, chipping, peeling, or the like may occur in the soldered portion.

[First Embodiment]
In FIG. 7, (B): In contrast, when the substrate holding rack 10 is provided with the lower holding member 18 and the upper holding member 20 and the cleaning operation is performed, the cleaning operation starts slightly (from time t0 in the drawing). Although the substrate 14 is distorted, the distortion itself is at a much smaller level than the previous comparative example. This means that even when the cleaning liquid is circulated, the substrate 14 hardly vibrates (deforms).

  Therefore, according to the substrate cleaning rack 10 of the first embodiment, excessive stress is prevented from being generated in the soldered portion of the substrate 14 during cleaning, and the substrate 14 is protected from damage such as cracking, chipping, and peeling. be able to.

[Dry]
Although the above is for the time of cleaning, the occurrence of distortion due to vibration of the substrate 14 can be similarly suppressed during drying after cleaning. That is, at the time of drying, the substrate cleaning rack 10 is transferred to a drying furnace (not shown), and drying substrate is circulated from the top to the bottom to dry the substrate 14. At this time, if the pressure of the fluid (drying air) changes on both surfaces of the substrate 14, a force is generated to cause the substrate 14 to vibrate in the thickness direction. As described above, the lower holding member 18 and the upper holding member are retained. By using the member 20, the vibration of the substrate 14 can be suppressed. Accordingly, it is possible to minimize the distortion of the substrate 14 even during drying and to prevent the soldered portion from being defective.

[Second Embodiment]
Next, a second embodiment of the substrate cleaning rack 10 will be described.
The substrate cleaning rack 10 of the second embodiment has the same basic configuration as that of the first embodiment, but the forms of the lower holding member 18 and the upper holding member 20 are different. Hereinafter, the difference from the first embodiment will be mainly described.

  FIG. 8 is an enlarged view showing an example of the lower holding member 18 or the upper holding member 20 applied to the substrate cleaning rack 10 of the second embodiment. Here, the side holding plate 20a or the center holding plate 20c of the upper holding member 20 is taken as an example. However, since the same applies to the lower holding member 18, reference numerals as the lower holding member 18 are also shown in parentheses in the drawing. Show.

  In the first embodiment, the triangular grooves 18a and 20d are formed in the lower holding member 18 and the upper holding member 20, but in the second embodiment, a tapered groove 20e and a parallel groove 20f are formed instead. Yes. The tapered groove 20e and the parallel groove 20f are formed continuously in the receiving direction of the edge of the substrate 14, and both form a continuous groove.

  First, the tapered groove 20e corresponds to the entrance portion when viewed in the receiving direction of the edge portion of the substrate 14. That is, the taper groove 20e is formed in the lower edge portion of the side holding plate 20a or the center holding plate 20c or the upper edge portion of the lower holding member 18 and opens in the direction of the corresponding substrate 14. Further, the taper groove 20e has an angle θ with respect to the thickness direction of the substrate 14. Here, the range of the angle θ is suitably 90 degrees or less. Further, the opening width of the tapered groove 20 e is set larger than the thickness of the substrate 14.

  Next, the parallel groove 20 f is a part of the flange more than the tapered groove 20 e (entrance part) when viewed in the receiving direction of the edge of the substrate 14. Unlike the tapered groove 20e, the parallel groove 20f extends with a substantially constant width, and its end is processed into, for example, a semicircular shape. The width of the parallel groove 20 f is set slightly larger than the thickness of the substrate 14.

  In the second embodiment, when the substrate 14 and the upper holding member 20 (or the lower holding member 18) are brought into contact with each other, the edge portion of the substrate 14 is easily received in the tapered groove 20e at the corresponding position first. As the acceptance further proceeds, the edge of the substrate 14 is received in the parallel groove 20f through the tapered groove 20e. In this state, both sides of the edge portion of the substrate 14 are embedded in the parallel grooves 20f, whereby the edge portion of the substrate 14 is reliably held in the thickness direction. At this time, the edge of the edge portion of the substrate 14 may be in contact with the inner surface of the end of the parallel groove 20f.

  The parallel groove 20f has a certain depth (length) D in the receiving direction of the substrate 14. Due to this depth D, the variation in dimension seen in the longitudinal direction (vertical direction in the drawing) of the plurality of substrates 14 is absorbed in the parallel grooves 20f.

[Summary of Embodiment]
According to the first embodiment and the second embodiment described above, when the substrate 14 is accommodated in the rack body 12 in a standing state, the edge portions on both sides thereof are held by the both-end holding members 16 and the lower edge side. The portion is held by the lower holding member 18. Furthermore, by attaching the upper holding member 20 to the rack body 12, the upper edge portion of the substrate 14 is held by the upper holding member 20.

  Accordingly, since the substrate 14 is in a state where all four edges are held, even if a fluid (cleaning liquid or drying air) is circulated during cleaning or drying, distortion generated in the substrate 14 is minimized. Can do.

  Moreover, since the lower holding member 18 and the upper holding member 20 are plate-shaped extending along the flow direction of the fluid, the smooth flow of the fluid is not hindered. For this reason, the board | substrate 14 can be hold | maintained reliably, without sacrificing especially the cleaning power and drying efficiency by a fluid.

[Other Embodiments]
FIG. 9 is a perspective view showing another example of the upper holding member 20. In the previous embodiment, the center holding plate 20c is provided at one location, but in this embodiment, the center holding plates 20c are provided at a plurality of locations. In this case, since the edge portion can be held at more positions as viewed in the width direction of the substrate 14, the substrate 14 can be held firmly to that extent, and the occurrence of distortion can be further suppressed. Although the triangular groove 20d is applied in the embodiment of FIG. 9, the tapered groove 20e and the parallel groove 20f may be applied in this embodiment.

  In each embodiment, a support member may be simply used in place of the lower holding member 18. The support member is not formed with the triangular groove 18a, the tapered groove 20e, the parallel groove 20f, or the like, and has no function of holding the edge of the substrate 14. In this case, the support member simply has contact with the lower end surface of the substrate 14 and has a function of preventing the fall. However, even in this case, by applying the upper holding member 20, at least three of the edge portions on both sides and the upper edge portion of the substrate 14 are held. Therefore, similarly to each embodiment, it is possible to minimize the distortion of the substrate 14 at the time of cleaning and drying, and to prevent a defect from occurring in the soldered portion.

  Alternatively, in each embodiment, a form in which the triangular groove 18a is applied to the lower holding member 18 and the tapered groove 20e and the parallel groove 20f are applied to the upper holding member 20 may be adopted. A form in which a triangular groove 20d is applied to 20 and a tapered groove 20e and a parallel groove 20f are applied to the lower holding member 18 may be adopted.

  In each embodiment, 90 degrees or less is appropriate as the range of the angle θ, but the lower limit thereof can be appropriately set within a range where there is no problem in receiving the edge of the substrate 14 (for example, about 15 degrees).

  In addition, the number of substrates 14 accommodated in the substrate cleaning rack 10 is not particularly limited. Accordingly, the size of the rack main body 12 and the sizes of the both-end holding member 16, the lower holding member 18 and the upper holding member 20 are appropriately changed according to the number of substrates 14 accommodated, and combined with the triangular grooves 18a and 20d and the tapered grooves. The number and arrangement of 20e, parallel grooves 20f, and the like can be changed.

It is a perspective view which shows the structural example of the rack for board | substrate washing | cleaning of 1st Embodiment. It is a longitudinal cross-sectional view (II-II cross section in FIG. 1) of the board | substrate washing | cleaning rack. FIG. 3 is a longitudinal sectional view (III-III section in FIG. 1) of the substrate cleaning rack as viewed from a direction different from FIG. It is a cross-sectional view (IV-IV cross section in FIG. 1) of the substrate cleaning rack. It is the figure which expanded and showed the triangular groove | channel. It is a figure which shows the outline | summary of the washing | cleaning operation | work of the board | substrate performed using the board | substrate washing rack as an example. It is a figure which shows the measurement result of the distortion which arose in the board | substrate during washing | cleaning. It is an enlarged view which shows the example of a form of the lower holding member or the upper holding member applied to the board | substrate cleaning rack of 2nd Embodiment. It is a perspective view which shows another example of an upper holding member.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Substrate washing rack 12 Rack main body 12a Flow path 12b, 12c Inner wall surface 14 Substrate 16 Both-end holding member 16a Holding groove 18 Lower holding member 18a Triangular groove 20 Upper holding member 20a Side holding plate 20c Center holding plate 20d Triangular groove 20e Taper groove 20f Parallel groove

Claims (6)

A substrate cleaning rack for storing a substrate to be cleaned, for cleaning or drying the substrate by flowing a fluid in one direction along the substrate,
A first holding member for holding two edge portions located on both sides of the substrate as viewed in the fluid flow direction;
A second holding member that has a plate shape extending in the fluid flow direction and that holds the edge portion located at least upstream of the two edge portions of the substrate facing in the fluid flow direction; Board cleaning rack provided. The substrate cleaning rack according to claim 1,
A flow path through which the fluid flows is formed; and a square cylindrical rack body provided with the first holding member on each of a pair of opposed inner wall surfaces;
The second holding member is
A substrate cleaning rack, which is detachably attached to the rack body. The rack for cleaning substrates according to claim 1 or 2,
The second holding member is
A triangular groove formed at an angle of 90 degrees or less with respect to the thickness direction of the substrate, and vibration or deformation in the thickness direction of the substrate in a state where the edge of the substrate is received in the triangular groove. A substrate cleaning rack characterized by restricting The rack for cleaning substrates according to claim 3,
The first holding member is
A plurality of holding grooves extending in the flow direction of the fluid to hold the plurality of substrates arranged in parallel with each other at substantially constant intervals;
The second holding member is
A substrate cleaning rack, comprising: a plurality of triangular grooves at positions corresponding to the plurality of substrates in a state where the edge portions on both sides are held by the first holding member. The rack for cleaning substrates according to claim 1 or 2,
The second holding member is
The entrance portion that receives the edge of the substrate is formed as a tapered groove having an angle of 90 degrees or less with respect to the thickness direction of the substrate, and the portion deeper than the entrance portion is slightly larger than the thickness of the substrate. It is formed as a parallel groove extending in the receiving direction of the edge portion of the substrate with a substantially constant width,
A substrate cleaning rack, wherein vibration or deformation in the thickness direction of the substrate is restricted in a state where an edge portion of the substrate is received in the parallel groove through the tapered groove. The rack for cleaning substrates according to claim 5,
The first holding member is
A plurality of holding grooves extending in the flow direction of the fluid to hold the plurality of substrates arranged in parallel with each other at substantially constant intervals;
The second holding member is
The first holding member has a plurality of the tapered grooves and the parallel grooves at positions corresponding to the plurality of substrates in a state where both edge portions are held by the first holding member. For substrate cleaning, which absorbs variations in the length of the substrate as viewed in the direction of fluid flow while regulating vibration or deformation in the thickness direction of each of the substrates in a state where an edge is received rack.

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