JP2010109550A - Imaging module and process of fabricating the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide the imaging module which can decrease the parts count. <P>SOLUTION: The imaging module 1 includes an imaging substrate 3 carrying image sensors 2, a lens 4 supported on a holder 5, and a shield member 6 which is fixed to the opening of the holder 5 and forms an inner space S for containing the imaging substrate 3, wherein the imaging substrate 3 is fixed to protrusions 6a which are arranged, continuously in the direction of the optical axis, at least two positions in the inner space S while holding the imaging substrate 3 therebetween. Since the imaging substrate 3 can be positioned and fixed easily and no extra member is required for fixing the imaging substrate 3 to the holder 5, the structural components of the imaging module 1 can be decreased. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an imaging module capable of reducing the number of parts and simplifying a manufacturing process.

  As a small imaging module using an image sensor such as a CCD as an imaging device, an imaging module is known in which an imaging substrate is attached to a holder that supports a lens by a plurality of pins (see, for example, Patent Document 1). .)

Such an imaging module collects light from a subject on an image sensor with an optical lens and converts the light into an electrical signal to obtain an image. The imaging board has through holes in four corners for passing pins. is doing. The pin passes through the imaging substrate, and has a function of fixing the imaging substrate to the holder by attaching a side surface of the pin in the longitudinal direction to the inside of the through hole of the imaging substrate. The pin has a function of aligning the imaging substrate by adjusting the distance between the imaging device and the lens and the angle between the lens and the imaging device when the imaging substrate is attached to the holder.
JP 2007-174358

  Since an image pickup device as disclosed in Patent Document 1 generates noise of an electric signal due to electromagnetic radiation noise as it is, a shield member is usually disposed around the image pickup device for the purpose of blocking electromagnetic radiation noise. Yes.

  The arrangement of the shield member around the imaging element is used, for example, to fit the shield member into the gap between the end surface of the imaging substrate and the inner wall of the opening of the holder, and attach the end surface of the shield member to the holder. This is done by attaching the pins with a connecting agent such as solder.

  However, in assembling such an imaging module, there is a problem in that the number of parts constituting the imaging module tends to increase because pins must be used when the imaging substrate is attached to the holder.

  Further, when the shield member is arranged around the imaging element, the gap between the end surface of the imaging substrate and the inner wall of the opening of the holder is small, so the shielding member is placed in the gap between the end surface of the imaging substrate and the inner wall of the opening of the holder. In addition, it is difficult to fit, and it is necessary to attach the shield member to the pins used to attach the imaging board to the holder with a connecting agent such as solder, which complicates the manufacturing process of the imaging module and increases the manufacturing efficiency. There was a problem that it was easy to get worse.

  Further, in an imaging module that employs a structure in which an imaging substrate is attached to a holder with a pin, when adjusting the focus by adjusting the distance between the imaging element and the lens and the angle between the lens and the direction in which the lens condenses and the imaging element, The degree of freedom of adjustment is low because there is little clearance between the inner surface of the through hole of the imaging board and the side surface in the longitudinal direction of the pin, which is provided to adjust the angle between the direction of light collection and the image sensor There is a problem that it is sometimes difficult to obtain a clear image.

  The present invention has been made in view of the problems in the conventional technology as described above, and an object of the present invention is to reduce the number of parts constituting the imaging module and to obtain a clear image. To provide a module. Moreover, it is providing the manufacturing method which can improve the efficiency which manufactures an imaging module.

  The imaging module of the present invention forms an inner space for housing the imaging board, which is attached to an opening of the holder and an imaging board on which an imaging element is mounted, a lens supported by the holder, and the inner space. And a shield member attached to the imaging substrate on convex portions that are arranged in at least two places with the imaging substrate sandwiched in the optical axis direction.

  In the imaging module of the present invention, in the above configuration, the inner space of the shield member has a rectangular parallelepiped shape, and a part along a ridge in the optical axis direction is bent into the inner space to form the convex portion. It is characterized by that.

  An image pickup module manufacturing method according to the present invention includes an image pickup board on which an image pickup element is mounted, a holder that supports a lens, and a pair of inner spaces that house the image pickup board by being attached to an opening of the holder. A step of preparing a shield member having convex portions that are continuous in the optical axis direction so as to sandwich the imaging substrate in at least two places of the inner space to be a side surface and an end surface; and a step of attaching the shield member to the holder; A step of positioning the imaging substrate in the inner space of the shield member, moving the imaging substrate along the convex portion, a step of attaching the positioned imaging substrate to the convex portion, and another pair And a step of storing the imaging substrate in the inner space formed by a shield member by closing a portion that becomes a side surface of the substrate. It is.

  An image pickup module manufacturing method according to the present invention includes an image pickup board on which an image pickup element is mounted, a holder that supports a lens, and a pair of inner spaces that house the image pickup board by being attached to an opening of the holder. A step of preparing a pair of shield members having convex portions that are continuous in the optical axis direction so as to sandwich the imaging substrate in at least two places of the inner space, which are side surfaces; and a step of attaching the shield member to the holder; A step of positioning the imaging substrate in the inner space of the shield member, moving the imaging substrate along the convex portion, a step of attaching the positioned imaging substrate to the convex portion, and another pair And the step of closing the portion which becomes the side surface and the end surface of the substrate and storing the imaging substrate in the inner space formed by a shield member. It is intended.

  According to the imaging module of the present invention, an imaging substrate on which an imaging element is mounted, a lens supported by the holder, an inner space that is attached to the opening of the holder and accommodates the imaging substrate is formed, and at least the inner space Since the image pickup board is provided with convex portions on the inner space side of the shield member at the time of assembling, the image pickup board is provided at the two convex portions that are arranged with the image pickup board sandwiched in the optical axis direction. By being attached to the part, a member such as a pin used to attach the imaging substrate to the holder is not necessary, and the number of parts can be reduced. In addition, in assembling the conventional imaging module, the angle between the direction in which the lens condenses and the angle between the imaging element is adjusted with a small clearance between the inner surface of the through hole of the imaging substrate and the side surface with respect to the longitudinal direction of the pin. On the other hand, the clearance between the end face of the imaging board and the convex part on the inner space side of the shield member is large, and the degree of freedom in adjusting the angle between the lens condensing direction and the imaging element is high. The alignment and installation can be easily performed, and a clear image can be obtained.

  According to the imaging module of the present invention, in the above configuration, the inner space of the shield member has a rectangular parallelepiped shape, and a part along the ridge in the optical axis direction is bent into the inner space to form a convex portion. Sometimes, the convex part on the inner space side of the shield member can be formed only by bending the end of the shield member that becomes the side surface of the inner space of the shield member into the inner space. Since it becomes possible to manufacture in a shape and the manufacturing process of an imaging module becomes easy, manufacturing efficiency can be improved.

  According to the method for manufacturing an imaging module of the present invention, a pair of an imaging board on which an imaging device is mounted, a holder that supports a lens, and an inner space for housing the imaging board by being attached to an opening of the holder. A step of preparing a shield member having convex portions that are continuous in the optical axis direction so as to sandwich the imaging substrate in at least two places of the inner space, which are the side surface and the end surface; a step of attaching the shield member to the holder; and an inner side of the shield member The step of positioning the imaging board in the space, moving the imaging board along the convex part, the step of attaching the positioned imaging board to the convex part, and closing the other pair of side surfaces with a shield member Storing the imaging substrate in the formed inner space, so that the pair of side surfaces and end surfaces of the shield member are previously attached to the holder. Therefore, unlike the conventional imaging module, there is no difficulty in fitting the shield member into the small gap between the end face of the imaging board and the inner wall of the opening of the holder, and the shield member is attached to the holder. Therefore, the manufacturing process of the imaging module is facilitated, and the manufacturing efficiency can be improved. In addition, the image pickup board positioned on the shield member of the part previously attached to the holder can be easily attached, and then the other pair of side surfaces which are the remaining part of the shield member are closed, and then the main part of the image pickup module Since the assembly is completed, the imaging module can be easily manufactured through a simplified process.

  According to the method for manufacturing an imaging module of the present invention, a pair of an imaging board on which an imaging element is mounted, a holder that supports a lens, and an inner space that houses the imaging board by being attached to an opening of the holder. A step of preparing a pair of shield members having convex portions that are continuous in the optical axis direction so as to sandwich the imaging substrate between at least two locations in the inner space, which are side surfaces, a step of attaching the shield member to the holder, and an inner side of the shield member Arranging the imaging board in the space, positioning the imaging board by moving the imaging board along the convex part, attaching the positioned imaging board to the convex part, and closing the other pair of side surfaces and end faces to shield Storing the imaging substrate in the inner space formed by the member, so that the pair of side surfaces of the shield member are attached to the holder in advance. Therefore, unlike the conventional imaging module, there is no difficulty in fitting the shield member into the small gap between the end face of the imaging substrate and the inner wall of the opening of the holder, and the shield member is not attached to the holder. Since the fixing process is simplified, the manufacturing process of the imaging module is facilitated, and the manufacturing efficiency can be improved. In addition, the imaging board can be easily attached to the portion of the shield member that has been previously attached to the holder, and then the other pair of side surfaces and end surfaces, which are the remaining portions of the shield member, are closed, and then the main part of the imaging module. Since the assembly of the parts is completed, the imaging module can be easily manufactured by a simplified process.

  Hereinafter, an imaging module of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a cross-sectional view showing an example of an embodiment of an imaging module of the present invention. In the following description, the subject side of the imaging module is referred to as the front side, and the opposite side is referred to as the back side.

  An imaging module 1 of this example shown in FIG. 1 includes an imaging substrate 3 on which an imaging element 2 is mounted, a lens 4 supported by a holder 5, and an inner side that is attached to an opening of the holder 5 and houses the imaging substrate 3. A space S is formed, and a shield member 6 having the imaging substrate 3 attached to convex portions 6a continuous in the optical axis direction, which is disposed with the imaging substrate 3 sandwiched between at least two locations in the inner space S, is provided.

  With such a configuration, at the time of assembly, the imaging substrate 3 is attached to the convex portion 6a on the inner space S side of the shield member 5, so that a member such as a pin used to attach the imaging substrate 3 to the holder 5 can be obtained. This is unnecessary and the number of parts can be reduced. In addition, in assembling the conventional imaging module, the angle between the direction in which the lens condenses and the angle between the imaging element is adjusted with a small clearance between the inner surface of the through hole of the imaging substrate and the side surface with respect to the longitudinal direction of the pin. On the other hand, the clearance between the end face of the imaging substrate 3 and the convex portion 6a on the inner space S side of the shield member 6 is large, and the degree of freedom in adjusting the angle between the direction in which the lens 4 condenses and the imaging element 2 is high. Therefore, it is possible to easily align and attach the imaging substrate 3 and obtain a clear image.

  The imaging module 1 includes an imaging element 2, an imaging substrate 3, a lens 4, a holder 5, and a shield member 6 as a basic configuration.

  Such an imaging module 1 is, for example, an imaging module 1 that is used for in-vehicle use, and has a function of imaging a white line on a road or imaging a blind spot of a driver driving a vehicle, and controls driving of an automobile. The operation is controlled by an ECU (Electronic Control Unit). The electrical signal output from the imaging module 1 is converted into an image signal by the ECU, and displayed on a display installed in front of the driver's seat, for example.

  The imaging element 2 is a semiconductor image sensor element such as a CCD image sensor or a CMOS image sensor.

  Further, the imaging substrate 3 is constituted by a printed wiring board formed by impregnating an epoxy resin into a glass cloth or by adding a glass filler to an epoxy resin, for example. On the surface or inside of the imaging substrate 3, an electrical connection with a terminal such as another component different from the mounted imaging element 2, or a wiring conductor for fixing them or a ground wiring for grounding are formed. For such wiring conductors and ground wirings, a method of forming a conductive metal such as copper or gold by a plating method, a method of bonding a metal foil previously formed in a wiring pattern shape, or a metal foil is deposited on the entire surface It is formed on the surface of the printed wiring board or inside by using a method of etching away unnecessary portions from the substrate by etching.

  Such an imaging substrate 3 is prepared, for example, by preparing a commercially available copper-coated substrate having a copper foil applied to the entire front and back surfaces, cutting the substrate into a desired size, and applying the copper foil applied to the surface to dilute hydrochloric acid or the like. It is manufactured by etching a desired wiring pattern with an acidic solution. If necessary, a through hole is formed using a laser or a drill, and the through hole is filled with a metal paste to embed the through conductor, thereby electrically connecting the wiring patterns on the front and back of the board. Is possible.

  On the main surface on the back side of the imaging board 3, an IC (not shown) that processes an electrical signal from the imaging device 2 and a cable (not shown) that electrically connects the wiring conductor of the imaging board 3 and the ECU. ) And other components such as a connector (not shown) are mounted.

  The lens 4 has a function of condensing light from a subject on the image sensor 2. For example, a first lens 41 having a convex shape on the front side in order to collect light at a wide angle, and a first lens 41. The lens group is composed of a second lens 42 and a third lens 43 for bringing the light that has passed through the lens close to parallel as a light beam. When the lens 4 includes these three lenses, for example, the first lens 41, the second lens 42, and the third lens 43 are arranged so as to overlap in this order from the front side.

  The holder 5 is for supporting the lens 4 located on the front side. In this example, the holder 5 includes a retainer 51 as a holding jig disposed on the front surface side and a barrel 52 as a lens holder disposed on the back surface side. The second lens 42 and the third lens 43 are fixed to the barrel 52 of the holder 5, and the first lens 41 is fixed so as to be pressed against the barrel 52 by the retainer 51.

  The retainer 51 and the barrel 52 are produced, for example, by the method described below.

  The barrel 52 has a predetermined shape by preparing a mold for injection molding having a cavity provided in accordance with the shape of the barrel 52, pouring the raw material for the barrel 52 into the cavity, solidifying and molding. It can be manufactured by using an injection molding method to be formed. Similarly, the retainer 51 is formed by preparing a mold for injection molding having a cavity formed in a shape corresponding to the shape of the retainer 51, and pouring the raw material for the retainer 51 into the cavity and solidifying it. By doing so, it can be formed in a predetermined shape. Such a retainer 51 and barrel 52 are made of a non-conductive resin such as polycarbonate (PC) or polyphthalamide (PPA), for example, to reduce the weight. Normally, in order to match the thermal expansion and thermal contraction of the retainer 51 and the barrel 52, it is preferable to use the same material for both.

  The shield member 6 is disposed so as to surround the image pickup device 2 and has a function of blocking electromagnetic radiation noise that enters the image pickup device 2 from the surroundings, such as a copper-nickel-zinc alloy or aluminum. It can be produced by cutting and molding a plate material made of a highly conductive metal material into a predetermined shape.

  Further, the shield member 6 in the camera module 1 of the present example forms an inner space S for housing the imaging substrate 3 by being attached to the opening of the holder 5, and at least two locations in the inner space S of the shield member 6. A convex portion 6a continuous in the optical axis direction is provided so as to sandwich the imaging substrate 3, and the imaging substrate 3 is attached to the convex portion 6a. Thereby, at the time of assembly, since the imaging board 3 is attached to the convex part 6a on the inner space S side of the shield member 6, members such as pins used to attach the imaging board to the holder are not necessary, and the number of parts can be reduced. It is possible to reduce. In addition, in assembling the conventional imaging module, the angle between the direction in which the lens condenses and the angle between the imaging element is adjusted with a small clearance between the inner surface of the through hole of the imaging substrate and the side surface with respect to the longitudinal direction of the pin. On the other hand, the clearance between the end face of the imaging substrate 3 and the convex portion 6a on the inner space S side of the shield member 6 is large, and the degree of freedom in adjusting the angle between the direction in which the lens 4 condenses and the imaging element 2 is high. Therefore, the imaging substrate 3 can be easily aligned and attached, and a clear image can be obtained.

  The convex portion 6 a on the inner space S side of the shield member 6 may be in the vicinity of the center portion of the side surface of the shield member 6. For example, a rod-shaped or prismatic member made of a highly conductive metal material such as copper-nickel-zinc alloy or aluminum may be attached to the inner space S side of the side surface of the shield member 6 by soldering or welding. At that time, it is preferable to provide a notch portion at the position of the imaging substrate 3 corresponding to the position of the convex portion 6 a on the inner space S side of the shield member 6.

  The shape of the shield member 6 is such that the inner space S of the shield member 6 has a rectangular parallelepiped shape as in another example of the embodiment shown in the partial perspective view in FIG. What is partially bent into the inner space S to form the convex portion 6a is preferable. In this case, the convex portion 6a on the inner space S side of the shield member 6 can be formed only by bending the end of the shield member 6 serving as the side surface of the inner space S of the shield member 6 into the inner space S. Since the shield member 6 can be manufactured in a predetermined shape relatively easily and the manufacturing process of the imaging module 1 is facilitated, the manufacturing efficiency can be increased.

  Next, the manufacturing method of the imaging module of this invention is demonstrated, referring FIG.

  FIGS. 3A to 3E are partial perspective sectional views for each process schematically showing an example of an embodiment of a method for manufacturing an imaging module of the present invention. Below, the manufacturing method of the imaging module of this invention is demonstrated for every process.

  First, as shown in FIG. 3A, the imaging board 3 on which the imaging device 2 is mounted, the holder 5 that supports the lens 4, and the inner space that houses the imaging board 3 by being attached to the opening of the holder 5. A shield member 6 is prepared which has a pair of side surfaces and end surfaces forming S and has convex portions 6a continuous in the optical axis direction so as to sandwich the imaging substrate 3 at at least two locations in the inner space S.

  Next, as shown in FIG. 3B, the shield member 6 is attached to the holder 5. In this step, either a method of integrally forming the holder 5 and the shield member 6 or a method of attaching the shield member 6 to the molded holder 5 later may be employed. For example, the side surface of the shield member 6 is fitted into a groove provided in the end surface of the opening of the holder 5, or the outside of the side surface of the shield member 6 is joined to the inner wall of the opening of the holder 5 with an adhesive such as solder or resin. The method to do is adopted.

  Next, as illustrated in FIG. 3C, the imaging substrate 3 is disposed in the inner space S of the shield member 6, and the imaging substrate 3 is moved along the convex portion 6 a and positioned. In this step, the pair of side surfaces and the end surface portions of the shield member 6 that form the inner space S of the shield member 6 are attached to the holder 5, so that, for example, the imaging substrate 3 is prepared using a separately prepared jig or the like. And the angle between the imaging element 2 and the distance between the imaging element 2 and the lens 4 and the direction in which the lens 4 condenses and the imaging element 2 may be adjusted.

  Next, as shown in FIG. 3D, the positioned imaging substrate 3 is attached to the convex portion 6a. In this step, for example, when the rectangular imaging substrate 3 having notches at the four corners is attached to the convex portion 6a on the inner space S side of the shield member 6, the notches at the four corners of the imaging substrate 3 and the convex portions 6a The soldering may be performed with a dispenser or the like between them, and the laser beam may be irradiated and heated to melt the solder.

  Then, as shown in FIG. 3E, the imaging substrate 3 is accommodated in the inner space S formed by the shield member 6 by closing the other pair of side surfaces. In this step, for example, the shield member 6 serving as the end surface of the shield member 6 attached to the holder 5 in advance and the shield member 6 serving as the other pair of side surfaces forming the inner space S are in the same plane. By forming the shield member 6 in advance, after the imaging substrate 3 is attached to the convex portion 6 a on the inner space S side of the shield member 6, another pair of side surfaces of the shield member 6 is attached to the end surface of the shield member 6. The inner space S may be closed by bending it at 90 degrees.

  According to the method for manufacturing an imaging module of the present invention, since the shield member 6 having the convex portion 6a on the inner space S side is attached to the holder 5 in advance, the shield member is attached as in the conventional imaging module. The difficulty of fitting into a small gap between the end face of the imaging substrate and the inner wall of the opening of the holder is eliminated, and the shield member 6 serving as another pair of side faces is bent at a right angle with respect to the end face of the shield member 6. Since the inner space S can be closed only by this, it is not necessary to attach the shield member to the pins used for attaching the imaging substrate or the imaging substrate to the holder with a connecting agent such as solder, and the manufacturing process of the imaging module 1 Is simplified, so that the production efficiency can be improved.

  Next, the manufacturing method of the imaging module of this invention is demonstrated, referring FIG.

  4A to 4E are partial perspective sectional views for each process schematically showing another example of the embodiment of the method for manufacturing the imaging module of the present invention. Below, the manufacturing method of the imaging module of this invention is demonstrated for every process.

  First, as shown in FIG. 4A, the imaging board 3 on which the imaging device 2 is mounted, the holder 5 that supports the lens 4, and the inner space that houses the imaging board 3 by being attached to the opening of the holder 5. A pair of shield members 6 having a pair of side surfaces forming S and having convex portions 6a continuous in the optical axis direction so as to sandwich the imaging substrate 3 between at least two locations of the inner space S are prepared.

  Next, as shown in FIG. 4B, the shield member 6 is attached to the holder 5. In this step, either a method of integrally forming the holder 5 and the shield member 6 or a method of attaching the shield member 6 to the molded holder 5 later may be employed. For example, the side surface of the shield member 6 is fitted into a groove provided in the end surface of the opening of the holder 5, or the outside of the side surface of the shield member 6 is joined to the inner wall of the opening of the holder 5 with an adhesive such as solder or resin. The method to do is adopted.

  Next, as shown in FIG. 4C, the imaging substrate 3 is arranged in the inner space S of the shield member 6, and the imaging substrate 3 is moved along the convex portion 6a to be positioned. In this process, since the shield member 6 of the pair of side surfaces forming the inner space S of the shield member 6 is attached, for example, the imaging substrate is held by a separately prepared jig or the like, and imaging is performed. The imaging substrate 3 may be positioned by adjusting the distance between the element 2 and the lens 4 and the angle between the direction in which the lens 4 condenses and the imaging element 2.

  Next, as shown in FIG. 4D, the positioned imaging substrate 3 is attached to the convex portion 6a. In this step, for example, when the rectangular imaging substrate 3 having notches at the four corners is attached to the convex portion 6a on the inner space S side of the shield member 6, the notches at the four corners of the imaging substrate 3 and the convex portions 6a The soldering may be performed with a dispenser or the like between them, and the laser beam may be irradiated and heated to melt the solder.

  Thereafter, as shown in FIG. 4E, the imaging substrate 3 is accommodated in the inner space S formed by the shield member 6 by closing the other pair of side surfaces and the end surfaces. In this step, the shield member 6 formed into a U-shape, which is the other pair of side surfaces and end surfaces of the inner space S, is joined to the shield member 6 which is a pair of side surfaces previously attached to the holder by soldering or the like. It may be attached by welding or welding.

  According to the method for manufacturing an imaging module of the present invention, since the shield member 6 having the convex portion 6a on the inner space S side is attached to the holder 5 in advance, the shield member is attached as in the conventional imaging module. The difficulty of fitting into the small gap between the end face of the imaging substrate and the inner wall of the opening of the holder is eliminated, and the other pair of side surfaces and end faces of the inner space S are replaced with a pair of U-shaped shield members 6. It is necessary to attach the shield member to the pins used for attaching the imaging board or the imaging board to the holder with a connecting agent such as solder, because the inner space S can be closed simply by attaching the shield member 6 to the side surface Since the manufacturing process of the imaging module 1 is simplified, the manufacturing efficiency can be improved. In addition, when the positioned imaging substrate 3 is attached to the convex portion 6a on the inner space S side of the shield member 6, the shield member 6 is not yet attached to the end face that forms the inner space S of the shield member 6. In the process, since the area around the contact portion between the imaging substrate 3 and the convex portion 6a and covered with the shield member 6 decreases, for example, the laser beam can be irradiated from the end face side of the shield member 6. In addition, the process of melting the solder and attaching the imaging substrate 3 to the shield member 6 is facilitated, and the manufacturing efficiency can be improved.

  As the imaging module 1 of the present invention, a barrel 52 and a retainer 51 were formed, and a holder 5 including the barrel 52 and the retainer 51 and a lens 4 supported by the holder 5 were prepared. Further, an imaging substrate 3 made of a glass cloth base epoxy resin and having a notch at a corner on a diagonal line was prepared, and a CCD image sensor was mounted on the imaging substrate 3 as the imaging element 2. In addition, a rectangular parallelepiped inner space S was formed, and a shield member 6 that accommodates the imaging substrate 3 in the inner space S was prepared. In the following description of the embodiments, each shield member 6 that forms the side surface of the inner space S is referred to as a side shield member 6.

  The pair of side shield members 6 are formed such that a part of one end of each of the side shield members 6 is bent in the inner space S. In addition, one end of each side shield member 6 bent in the inner space S is positioned on a diagonal line of the imaging substrate 3. In addition, the other pair of side shield members 6 are formed so as to be flush with the shield member 6 serving as the end face of the inner space S.

  And the imaging module 1 was assembled with the assembly method shown below.

  The main dimensions of each member are as shown below. In the following description, the vertical direction in FIG. 1 is referred to as vertical, the horizontal direction in FIG. 1 is referred to as horizontal, and the depth direction in FIG. 1 is referred to as depth.

  The imaging substrate 3 had a length of 25.1 mm, a width of 0.8 mm, and a depth of 25.1 mm. The holder 5 has a length of 31.5 mm, a width of 19 mm, a depth of 31.5 mm, a thickness of the side wall of the opening of the holder 5 of 3 mm, and the inner space S of the opening of the holder 5 has a length of 25.5 mm. The width was 8 mm and the depth was 25.5 mm. The pair of side shield members 6 is 25.5 mm in a direction parallel to the end face of the inner space S, and a portion 2 mm from one end of each side shield member 6 is bent into the inner space S. 27 mm in the direction along the optical axis, and the portion (convex portion 6 a) bent in the inner space S was 19 mm from the end on the lens side along the optical axis. The other pair of side shield members 6 was 23.5 mm in a direction parallel to the end face of the inner space S and 27 mm in a direction along the optical axis. The thickness of the shield member 6 was 0.2 mm.

  The imaging module 1 of this example set as described above was assembled by the following method. The mounting of the image pickup device 2 and the like on the image pickup substrate 3 and the support of the lens 4 by the holder 5 are each completed in advance using a known method.

  The assembly method of the imaging module 1 of this example basically includes a first assembly process in which the shield member 6 is integrally formed with the holder 5, a second assembly process for determining the position of the imaging board 3, and the imaging board 3 and the shield. A third assembling step for fixing the members 6 to each other and a fourth assembling step for closing the inner space S of the shield member 6 are provided.

  In the first assembly step, the holder 5 and the shield member 6 were integrally formed so that the pair of side shield members 6 in the inner space S were attached to the opening of the holder 5.

  In the second assembling step, one of the pair of side shield members 6, each of which is a pair of side shield members 6, which are located on the diagonal line of the imaging substrate 3 and bent at the corners of the imaging substrate 3, are folded into the inner space S. The focal point was adjusted by moving along the edge and adjusting the distance between the image sensor 2 and the lens 4 and the angle between the direction in which the lens 4 is condensed and the image sensor 2.

  In the third assembling step, contact between the cutout portion of the corner portion of the imaging substrate 3 located on the diagonal line of the imaging substrate 3 and one end of each shield member 6 bent in the inner space S is performed. The imaging substrate 3 was attached to the shield member 6 by applying solder to the part by a dispenser, applying laser light to the solder, and melting the solder.

  In the fourth assembly step, the inner space S is closed by bending the other pair of side shield members 6 that are in the same plane as the shield member 6 serving as the end surface of the inner space S at a right angle to the end surface of the inner space S. It is.

  Since one end of each of the pair of side shield members 6 attached to the holder 5 in advance by the above assembling method is bent into the inner space S to form the convex portion 6a, the imaging board 3 The imaging substrate 3 can be fixed to the holder 5 simply by attaching the notched portion of the corner to one end bent into the inner space S, and the manufacturing process of the imaging module 1 becomes easy. Manufacturing efficiency could be improved.

  As a result, such an imaging module 1 which is the imaging module of the present invention was able to reduce the number of parts required for assembly. Further, since the degree of freedom in adjusting the angle between the direction in which the lens 4 condenses and the image pickup device 2 is high, the image pickup device 2 and the image pickup substrate 3 can be easily positioned and attached, and a clear image can be obtained. did it. Furthermore, since the inner space S has higher sealing performance than the case where one end of each of the pair of side shield members 6 is not bent into the inner space S, a clearer image can be obtained. It was.

  The present invention is not limited to the embodiments described above, and various changes and improvements can be made without departing from the scope of the present invention.

  For example, in the example of the imaging module 1 described above, one end of each side shield member 6 that is bent into the inner space S and becomes the convex portion 6 a is two positions located on the diagonal line of the imaging substrate 3. Although the case has been described as an example, the end of the side shield member 6 bent into the inner space S serving as the convex portion 6a may be provided at three or four locations.

  Moreover, as the convex part 6a, instead of the one end of each of the pair of side shield members 6 being bent, for example, a bar-like shape made of a highly conductive metal material such as a copper-nickel-zinc alloy or aluminum, or A prismatic member may be attached to one end on the inner space S side of the pair of side shield members 6 by soldering or welding. Further, the rod-like or prismatic member as the convex portion 6 a may be near the central portion on the inner space S side of the pair of side shield members 6. Further, with respect to such a convex portion 6a, the imaging substrate 3 may be provided with a notch portion at a position corresponding to the position of the rod-shaped or prismatic member on the inner space S side of the shield member 6. Thereby, positioning and attachment of the imaging board 3 with respect to the convex part 6a can be performed easily and stably.

It is sectional drawing which shows an example of embodiment of the imaging module of this invention. It is a partial perspective view which shows the other example of embodiment of the imaging module of this invention. (A)-(e) is a partial see-through | perspective perspective view for every process which shows typically an example of embodiment of the manufacturing method of the imaging module of this invention, respectively. (A)-(e) is the partial see-through | perspective perspective view for every process which shows typically the other example of embodiment of the manufacturing method of the imaging module of this invention, respectively.

Explanation of symbols

1: Imaging module 2: Imaging device 3: Imaging substrate 4: Lens
41: 1st lens
42: Second lens
43: Third lens 5: Holder
51: Retainer
52: Barrel 6: Shield member 6a: Convex part S: Inner space

Claims (4)

An imaging board on which an imaging device is mounted;
A lens supported by a holder;
The imaging board is formed in an convex space that is attached to the opening of the holder to form an inner space for housing the imaging board, and is arranged in at least two locations of the inner space with the imaging board sandwiched therebetween. An imaging module comprising: a shield member to which is attached.   2. The imaging according to claim 1, wherein the inner space of the shield member has a rectangular parallelepiped shape, and a part along a ridge in the optical axis direction is bent into the inner space to form the convex portion. module. An imaging substrate on which an imaging element is mounted, a holder that supports a lens, and a pair of side surfaces and end surfaces that form an inner space for housing the imaging substrate by being attached to an opening of the holder. Preparing a shield member having convex portions that are continuous in the optical axis direction so as to sandwich the imaging substrate in at least two places;
Attaching the shield member to the holder;
Placing the imaging board in the inner space of the shield member, and moving and positioning the imaging board along the convex part; and
Attaching the positioned imaging substrate to the convex part;
And a step of closing the other pair of side surfaces and storing the imaging substrate in the inner space formed by a shield member. An imaging substrate on which an imaging element is mounted, a holder that supports a lens, and a pair of side surfaces that form an inner space for housing the imaging substrate by being attached to an opening of the holder, and at least two of the inner space Preparing a pair of shield members having convex portions that are continuous in the optical axis direction so as to sandwich the imaging substrate at a location;
Attaching the shield member to the holder;
Placing the imaging board in the inner space of the shield member, and moving and positioning the imaging board along the convex part; and
Attaching the positioned imaging substrate to the convex part;
And a step of closing the other pair of side surfaces and end surfaces and storing the imaging substrate in the inner space formed by a shield member.

Images