JP2010105719A - Injection-molded product with ic tag - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To make it possible to set an IC tag which is buried in an injection-molded product by using insert molding technology, in a freely selected position advantageous to the installation of the IC tag by making it possible to dispose the IC tag attached to an insert material body opposite to a gate hole. <P>SOLUTION: A molded article is formed by injection molding with an insert material body 2 as insert material. The IC tag 8 is buried between the molded article 5 and the insert material body 2. A whole surface of the IC tag 8 opposite to the gate-mark-piece 7 of the molded article 5 is covered with a thermoplastic resin protective sheet 13 which is excellent in heat resistance performance and mechanical strength, thereby protecting the IC tag 8 from the heat and pressure of melted resin. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an injection-molded product made of a thermoplastic resin in which a non-contact IC tag is embedded and fixed.

RFID (Radio
A non-contact IC tag, also called Frequency Identification, can write and read various data using a dedicated communication device. This IC tag is directly attached to a product such as a container. Management of goods and distribution management are performed by exchanging data with an IC tag attached to the.

  Since the IC tag attached to this product may be damaged early due to collision with other products or adhesion of water, etc., if the molded product such as a container constituting the product is made of synthetic resin The structure embedded in the wall of this molded product has been proposed.

In other words, the technique disclosed in Japanese Patent Application Laid-Open No. 2005-321935 is a conventional technique in which an IC tag is assembled and fixed to an insert material body that is outside the top surface portion that has been injection-molded, and the insert material body that is assembled with this IC tag. The IC tag is set in the mold as an insert material so that the IC tag is positioned in the molding space, and the molded body is injection-molded, whereby a molded product that is a screw cap is injection-molded.
JP 2005-321935 A

  In this prior art, since the IC tag can be embedded and disposed in the top wall portion of the molded product that is a screw cap, the IC tag is not damaged by collision or wetting, and the IC tag is flat. Since it can be embedded in the top surface portion in a flat posture, it is possible to accurately transfer data without contact.

  However, in the above prior art, the heat of the injected molten resin and the IC tag set in the mold together with the insert material are not destroyed by the heat and pressure of the injected molten resin. It had to be arranged at a place where pressure acts directly, that is, a place not facing the gate hole.

  For this reason, in the above-described prior art, in general, a gate hole must be provided in a portion that avoids the top wall portion, instead of a gate hole that faces the top wall portion of the molded product. This complicates the structure of the injection mold apparatus and requires a plurality of gate holes in order to obtain the uniformity of the flow of the injection resin, resulting in troublesome and complicated injection molding operations. there were.

  That is, when an IC tag is embedded in a general synthetic resin injection-molded product, there is a problem that an advantageous portion cannot be freely selected as an embedded portion of the IC tag.

  Therefore, the present invention was devised to solve the above-mentioned problems in the prior art, and it is a technical problem to make it possible to place an IC tag attached to an insert material body at a position opposed to a gate hole. Therefore, an object of the present invention is to make it possible to freely select and set an IC tag embedded in an injection-molded product by using an insert molding technique, which is advantageous for installation of the IC tag.

  The main structure of the injection molded product with an IC tag of the present invention is that an insert material is molded in advance using an insert material body that has been molded in a desired shape in advance, and an IC tag is embedded between the molded body and the insert material body. The IC tag has an IC tag inlet in which an IC chip and an antenna are fixed to the surface of the base sheet.

  The IC tag is embedded to face the gate mark piece of the molded body, and the entire surface of the gate mark piece side is covered with a protective sheet made of a thermoplastic resin excellent in heat resistance and mechanical strength.

  The IC tag attached to the insert material body is opposed to the gate trace of the molded body, which is injection-molded using the insert material body as an insert material. It will be located opposite the gate hole through which the material is injected.

  For this reason, the molten resin material of the molded body injected into the molding space from the gate hole is injected toward the IC tag, and exerts a large thermal action and pressure action on the IC tag.

  However, since the entire surface of the IC tag facing the gate hole is covered with a protective sheet made of a thermoplastic resin having excellent heat resistance and mechanical strength, the IC tag is injected by the protective sheet and melted. It is protected from the heat and pressure of the resin material and is not destroyed.

  In another configuration of the present invention, in addition to the main configuration described above, the protective sheet is formed of a biaxially stretched sheet made of polyethylene terephthalate or polyethylene naphthalate, and has a thickness of 50 microns or more.

  When the protective sheet is composed of a biaxially stretched sheet made of polyethylene terephthalate or polyethylene naphthalate and has a thickness of 50 microns or more, the melting point of the injected molten resin material is polyethylene terephthalate In the case of polyethylene naphthalate at 258 ° C., it is sufficiently high at 269 ° C., so that excellent heat resistance and high tensile strength with a thickness of 50 microns or more are stably exhibited.

  In addition to the main configuration described above, another configuration of the present invention is such that the surface side of the IC tag on which the IC chip and the antenna are located is covered with a protective sheet.

  In the case where the surface side of the IC tag is covered with a protective sheet, the protective sheet directly protects the IC chip and the antenna which are the main parts of the IC tag against the molten resin to be injected.

  In addition to the main configuration described above, another configuration of the present invention is such that the cover with the protective sheet is sealed.

  In the case where the cover with the protective sheet is hermetically sealed, the high tensile strength of the protective sheet effectively acts as a resistance against the injection pressure of the injected molten resin.

  In addition to the main configuration described above, another configuration of the present invention is such that an IC tag is sandwiched between a protective sheet and an auxiliary protective sheet made of the same material as the protective sheet. .

  If the IC tag is sandwiched between the protective sheet and the auxiliary protective sheet, the material and structure suitable for sealing and storing the IC tag can be freely selected as the protective sheet and auxiliary protective sheet. can do.

  In addition to the main configuration described above, another configuration of the present invention is one in which a molding agent is filled in the interior covered with a protective sheet in a sealed manner.

  In the case where the inside is covered with a protective sheet and sealed with a molding agent, the molding agent functions as a filler and acts as a heat insulating material and a cushioning material.

  In addition to the main configuration described above, another configuration of the present invention is an IC tag embedded in the bottom wall portion of the container.

  In the case where the IC tag is embedded in the bottom wall portion of the container-like body, the bottom wall portion of the container-like body is easy to have a flat wall structure, so that the IC tag can be suitably installed and positioned at the end of the container. Therefore, good communication with the reader / writer can be easily obtained, and gate traces can be made inconspicuous.

  In addition to the main configuration described above, another configuration of the present invention is an IC tag embedded in the top wall portion of the cap-shaped body.

  In the case where the IC tag is embedded in the top wall portion of the cap-like body, the top wall portion of the cap-like body is easy to have a flat wall structure, so that the IC tag can be preferably installed and positioned at the end of the container. Therefore, it is easy to obtain good communication with the reader / writer, and the gate pin piece can be made inconspicuous by adopting the inner pin gate structure.

Since the present invention has the above-described configuration, the following effects can be obtained.
In the injection molded product with an IC tag of the present invention, the entire surface of the IC tag facing the gate hole is covered with a protective sheet made of a thermoplastic resin excellent in heat resistance and mechanical strength. This protective sheet protects the injected molten resin material from the heat and pressure and does not break, thereby stably obtaining an injection molded product in which the IC tag is embedded and assembled.

  If the protective sheet is composed of a biaxially stretched sheet made of polyethylene terephthalate or polyethylene naphthalate and has a thickness of 50 microns or more, the melting point is sufficiently higher than the molten resin material to be injected. The IC chip and the antenna, which are the main parts of the IC tag, can be reliably secured from the heat and pressure of the injected molten resin material. It can be protected and the safety of the IC tag can be increased.

  In the case where the surface side of the IC tag is covered with a protective sheet, the IC sheet is directly protected from the injected molten resin material, so that the safety of the IC tag can be improved.

  When the cover with the protective sheet is sealed, the IC sheet has high pressure resistance because the high tensile strength of the protective sheet effectively acts as a drag against the injection pressure of the molten resin material. In this state, the IC tag can be embedded.

  If the IC tag is sandwiched between the protective sheet and the auxiliary protective sheet, the material and structure suitable for sealing and storing the IC tag can be freely selected as the protective sheet and auxiliary protective sheet. Therefore, the existing IC tag can be easily used.

  In the case where the inside is covered with a protective sheet and sealed with a molding agent, the molding agent functions as a filler and acts as a heat insulating material and cushioning material. Can be obtained.

  In the case where the IC tag is embedded in the bottom wall portion of the container-like body and the one embedded in the top wall portion of the cap-like body, the IC tag can be suitably installed in a portion that is easy to have a flat wall structure, Since it can be located at the end of the container, it is easy to obtain good communication with the reader / writer, and the gate trace can be made inconspicuous, so that the embedded IC tag can function effectively. .

  Hereinafter, exemplary embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a configuration example in which an IC tag 8 is embedded in a bottom wall portion of a container-like injection molded product 1, and FIG. 3 shows an IC tag 8 placed on a top wall portion of a cap-shaped injection molded product 1. An example of a buried configuration is shown.

  In FIG. 1, an insert material body 2 molded in a container-like desired shape with a screw formed in the mouth in advance is configured to form an inner part of a container-like injection-molded product 1, and its bottom wall The lower surface of the gate-facing wall 3 that is the portion facing the gate hole 19 is a flat surface, and an assembly recess 4 for setting the IC tag 8 to be immovable is formed at the center. .

  The molded body 5 formed by covering the entire outer surface of the main body cylinder part excluding the mouth cylinder part of the insert material body 2 is injection-molded to form the outer part of the container-like injection-molded product 1, At the center of the lower surface (outer surface) of the mold wall portion 6 which is the bottom wall portion, a gate trace piece 7 is formed in a remaining shape with a slightly protruding structure.

  In FIG. 3, an insert material body 2 molded into a cap-like desired shape is configured to form an outer portion of a screw cap-like injection-molded product 1, and a gate-facing wall portion 3 that is a top wall portion thereof. The lower surface facing the gate hole 19 is a flat surface, and the IC tag 8 is set immovably at the center of the lower surface.

  1 and 3, the insert material body 2 and the molded body 5 are not specified in the illustrated configuration, and if one is the insert material body 2, the other is the molded body 5. It is a relationship.

  A molded body 5 formed so as to cover the entire inner surface of the insert material body 2 is injection-molded so as to form an inner portion of the screw cap-shaped injection molded product 1 having a female screw, and its top wall portion. In the center of the lower surface of the mold wall portion 6, a gate trace 7 is formed in a remaining shape with a slightly protruding structure.

  As shown in FIG. 2, insert molding of the container-shaped injection-molded product 1 is performed by inserting an IC tag 8 whose surface is covered with a protective sheet 13 into the assembly recess 4 of the gate facing wall 3. Is achieved by closing the mold to the fixed mold 18 in a state where it is assembled to the core portion of the movable mold 17 of the injection mold apparatus 16.

  In the mold closing state of the mold apparatus 16, the gate hole 19 of the fixed side mold 18 is positioned facing the IC tag 8, and the molten resin material is injected from the gate hole 19 to inject the molded body 5. By molding, insert molding of the injection molded product 1 is achieved.

  As shown in FIG. 4, the insert molding of the cap-shaped injection-molded product 1 is performed by using an insert material body 2 in which an IC tag 8 whose surface is covered with a protective sheet 13 is assembled to a gate facing wall 3 and an injection mold. This is achieved by closing the mold to the stationary mold 18 in a state where it is assembled to the cavity portion of the movable mold 17 of the apparatus 16.

  When the mold apparatus 16 is in the closed state, the gate hole 19 formed in the screw core portion of the fixed mold 18 is positioned opposite to the IC tag 8 whose surface is covered with the protective sheet 13. An injection molding of the injection molded product 1 is achieved by injecting a molten resin material from 19 and injection molding the molded body 5.

  The IC tag 8 (refer to FIG. 5 and FIG. 6 hereinafter) is an IC tag inlet 9 in which a combination of an IC chip 10 and an antenna 11 is fixed to the surface of a base sheet 12 generally using a biaxially stretched film made of polyethylene terephthalate. The combination of the IC chip 10 and the antenna 11 of the IC tag inlet 9 is covered with a thin protective film.

  The IC tag 8 used in the present invention is mainly composed of an IC tag inlet 9 to which a combination of an IC chip 10 and an antenna 11 is fixed, and the entire surface portion thereof is biaxially stretch-molded, 50 microns. The protective sheet 13 made of a polyethylene terephthalate sheet having the above thickness is covered.

  In the case of the embodiment shown in FIG. 5, the IC tag 8 is sandwiched and sealed between a protective sheet 13 and an auxiliary protective sheet 14, and filled with a molding agent 15 such as added hot melt.

  The filled molding agent 15 holds the IC tag 8 in a stationary manner, but by providing flexibility, it exerts a buffering action against the external force acting on the IC tag 8. , A protective effect can be obtained.

  In the case of the configuration shown in FIG. 5, the dimensions of the protective sheet 13 and the auxiliary protective sheet 14 can be set without being restricted by the dimensions of the IC tag 8. be able to.

  In the case of the embodiment shown in FIG. 6, the protective sheet 13 is brought into close contact with the base sheet 12 of the IC tag 8 to seal the combination of the IC chip 10 and the antenna 11, and the added molding agent 15 such as hot melt. It is constituted by filling.

  In the case of the configuration shown in FIG. 6, the auxiliary protective sheet 14 is unnecessary, and thus the structure can be simplified. For the purpose of combination with the protective sheet 13, the base sheet 12 is previously provided. It is necessary to set the dimensions.

  As shown in FIG. 7, the IC tag 8 is assembled to the gate facing wall portion 3 of the insert member 2 with the protective sheet 13 in the gate hole 19 of the fixed mold 18 with the mold device 16 closed. This is achieved with the attitude of facing each other.

  As shown in FIG. 8, the structure of the gate hole 19 formed in the fixed mold 18 is formed on the outlet side of the gate hole 19, and the diameter-enlarged gate hole 20 having a flared concave structure is formed. By forming it, the injected molten resin material can easily flow in the direction of the arrow in the figure, and accordingly, the influence of heat and pressure of the molten resin material on the IC tag 8 can be weakened.

  Moreover, although the box-shaped container and the screw cap are shown as the illustrated embodiment, the present invention is not limited to this, and can be implemented in other various injection-molded products.

  As described above, since the injection molded product with an IC tag of the present invention can safely embed and place the IC tag at a position where the IC tag can function suitably, the IC for embedding and fixing the IC tag. A wide range of usage can be expected as an injection-molded product with a tag.

1 is a half longitudinal sectional view showing an embodiment of the present invention. It is a longitudinal cross-sectional view which shows the state at the time of shaping | molding of the Example shown in FIG. It is a half longitudinal cross-sectional view which shows the other Example of this invention. It is a longitudinal cross-sectional view which shows the state at the time of shaping | molding of the Example shown in FIG. It is a longitudinal cross-sectional view which shows one Example of the IC tag used for this invention. It is a longitudinal cross-sectional view which shows the other Example of the IC tag used for this invention. It is an expanded sectional view which shows the attachment state of an IC tag. FIG. 5 is an enlarged explanatory view showing a gate hole portion advantageous for carrying out the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1; Injection molded article 2; Insert material body 3; Gate opposing wall part 4; Assembly recessed part 5; Molded object 6; Mold wall part 7; Gate trace piece 8; IC tag 9; IC tag inlet 10; Antenna 12; Base sheet 13; Protection sheet 14; Auxiliary protection sheet 15; Adhesive 16; Mold device 17; Movable mold 18; Fixed mold 19; Gate hole 20;

Claims (8)

The molded body is injection-molded using the insert material body molded in a desired shape in advance as an insert material, an IC tag is embedded between the molded body and the insert material body, and the IC tag is placed on the surface of the base sheet as an IC chip. And a protective sheet made of a thermoplastic resin having excellent heat resistance and mechanical strength over the entire surface of the IC tag embedded opposite to the gate trace of the molded body. Injection molded product with IC tag covered with. The injection-molded article with an IC tag according to claim 1, wherein the protective sheet is composed of a biaxially stretched sheet made of polyethylene terephthalate or polyethylene naphthalate and has a thickness of 50 microns or more. The injection molded product with an IC tag according to claim 1 or 2, wherein the surface side of the IC tag on which the IC chip and the antenna are located is covered with a protective sheet. The injection molded product with an IC tag according to claim 3, wherein the cover with the protective sheet is sealed. The injection molded product with an IC tag according to any one of claims 1 to 4, wherein an IC tag is sandwiched between a protective sheet and an auxiliary protective sheet made of the same material as the protective sheet. The injection-molded article with an IC tag according to any one of claims 1 to 5, wherein a molding agent is filled in a sealant-covered interior with a protective sheet. The injection molded product with an IC tag according to any one of claims 1 to 6, wherein the IC tag is embedded in a bottom wall portion of the container-like body. The injection molded product with an IC tag according to any one of claims 1 to 6, wherein the IC tag is embedded in a top wall portion of the cap-like body.

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