JP2010105237A - Recording head, and recorder equipped therewith - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a recording head and a recorder, capable of covering favorably a control wire by a protecting material. <P>SOLUTION: A thermal head X1 includes a heating element H, a control IC 30 including control IC groups 30a, 30b, and a conductive layer 51 including a conductive layer group 51a connected to the control IC group 30a, and a conductive layer group 51b connected to the control IC group 30b, the conductive layer group 51a has wiring areas 51a<SB>1</SB>, 51a<SB>2</SB>, a separation distance d<SB>12a</SB>of the conductive layer 51 of the wiring area 51a<SB>1</SB>gets shorter toward an arrow mark D4 direction, a separation distance d<SB>12b</SB>of the conductive layer 51 of the wiring area 51a<SB>2</SB>gets longer toward the arrow mark D4 direction, a separation distance of the conductive layer 51 in a boundary of the wiring areas 51a<SB>1</SB>, 51a<SB>2</SB>is shorter than a separation distance d<SB>H</SB>of the heating element H and a separation distance of a terminal 31 of the control IC 30, a separation distance d<SB>12c</SB>of the conductive layer 51 of the wiring area 51b gets longer toward the arrow mark D4 direction, and the conductive layer 51 of the wiring area 51a<SB>1</SB>, and a clearance thereof, are covered by a protection layer 62. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a heating element, a control element for the heating element, a recording head having a control wiring for connecting the control element and the heating element, and a recording apparatus including the recording head.

  As a printer such as a facsimile or a register, a thermal printer including a thermal head and a platen roller is used. A thermal head mounted on such a thermal printer has a plurality of heating elements arranged on a substrate and a control element that is located on the substrate and has a function of controlling driving of the heating elements. is there. The platen roller has a function of pressing a recording medium such as thermal paper on the heating element. In the thermal printer having such a configuration, the heat generating element generates heat according to a desired image, and the heat generated by the heat generating element is well transmitted to the recording medium by pressing the recording medium on the heat generating element with a platen roller. I am letting. By repeating this process, a desired image is printed on the recording medium.

Such a thermal head is formed by coating a heating element, a control element, a control wiring for electrically connecting them, and a precursor having fluidity on the control wiring, and then curing the coating. Some have protective material. A thermal head having such a configuration is described in Patent Document 1, for example.
JP-A-7-186428

  However, in the thermal print head described in Patent Document 1, the glass paste, which is a precursor of the protective layer, has fluidity, and an individual electrode pattern (corresponding to the “control wiring” described above) covers the glass paste. In some cases, it may become impossible to electrically connect to the driving IC (corresponding to the above-described “control element”), while the glass paste is used to reduce the possibility that the individual electrode pattern is covered. If the amount is reduced, the individual electrode pattern may be exposed and the individual electrode pattern may not be well protected, so it is necessary to adjust the amount of the glass paste to a predetermined range.

  While having such a technical problem, if the separation distance of the heat generating elements of the thermal head is reduced in order to increase the pixel density of the printed image, the separation distance between the control wirings is correspondingly reduced. Due to the capillary action that occurs, the precursor of the protective material tends to extend toward the control element. For this reason, the adjustment range of the coating amount of the precursor of the protective material is narrowing, and it is difficult to satisfactorily coat the control wiring with the protective material. Such a narrowing of the adjustment range is not limited to the increase in the density of the heat generating elements, but can also be caused by a reduction in the distance between the heat generating elements and the control element.

  The present invention has been conceived under such circumstances, and an object thereof is to provide a recording head capable of satisfactorily covering a control wiring with a protective material and a recording apparatus including the recording head. To do.

  The recording head according to the first aspect of the present invention includes a substrate, a plurality of heating elements arranged along the main scanning direction on the substrate, and the plurality of heating elements spaced apart from each other in the sub-scanning direction. Electrically connecting a plurality of control elements disposed on the substrate and a plurality of heating elements disposed on the substrate and a plurality of terminals provided on each of the plurality of control elements; A plurality of control wirings, wherein the plurality of control elements include a first control element group arranged along the main scanning direction, and the first control element group arranged along the sub-scanning direction. A second control element group located between the plurality of heating elements and arranged along the main scanning direction, wherein the plurality of control wirings are included in the first control element group A first control wiring group connected to the control element of the A second control wiring group connected to the control elements of the second control element group, wherein the first control wiring group includes a first wiring region located on the plurality of heating element sides, And a second wiring region located closer to the control element than the first wiring region, and the separation distance along the main scanning direction between the plurality of control wirings in the first wiring region is the heat generation The distance from the element side to the control element side becomes shorter, and the separation distance along the main scanning direction between the plurality of control wirings in the second wiring region is from the heating element side to the control element side. The separation distance along the main scanning direction between the plurality of control wirings at the boundary between the first wiring region and the second wiring region is along the main scanning direction between the plurality of heating elements. Separation distance and in front of the control element The distance between the plurality of control wirings in the second control wiring group in the main scanning direction is shorter from the heating element side toward the control element side. At least a part of the plurality of control wirings in the first wiring region and a part of the plurality of control wirings in the second control wiring group, and a gap between the plurality of control wirings cured the precursor. It is characterized by being covered with a protective material.

  The recording head according to the second aspect of the present invention includes a substrate, a plurality of heating elements arranged on the substrate along the main scanning direction, and the plurality of heating elements spaced apart from each other in the sub-scanning direction. Electrically connecting a plurality of control elements disposed on the substrate and a plurality of heating elements disposed on the substrate and a plurality of terminals provided on each of the plurality of control elements; A plurality of control wirings, wherein the plurality of control elements include a first control element group arranged along the main scanning direction, and the first control element group arranged along the sub-scanning direction. A second control element group located between the plurality of heating elements and arranged along the main scanning direction, wherein the plurality of control wirings are included in the first control element group A first control wiring group connected to the control element of the A second control wiring group connected to the control elements of the second control element group, wherein the first control wiring group includes a first wiring region located on the plurality of heating element sides, A second wiring region located closer to the control element than the first wiring region, and a third wiring region located between the first wiring region and the second wiring region, A separation distance along the main scanning direction between the plurality of control wirings in the first wiring region is shortened from the heating element side toward the control element side, and the plurality of control wirings in the second wiring region is The separation distance along the main scanning direction is longer from the heating element side toward the control element side, and the separation distance along the main scanning direction between the plurality of control wirings in the third wiring region Is between the plurality of heating elements. It is shorter than the separation distance along the scanning direction and the separation distance between the plurality of terminals of the control element, and has substantially the same length from the first wiring region side to the second wiring region side. And the separation distance along the main scanning direction between the plurality of control wirings in the second control wiring group is longer from the heating element side to the control element side, and at least in the first wiring region A part of the plurality of control wires and the gap between the plurality of control wires in the plurality of control wires and the second control wire group are covered with a protective material obtained by curing the precursor.

  The recording head of the present invention includes a connector member that is disposed on the substrate and that receives input signals to the plurality of control elements, and the plurality of terminals of the control element that are disposed on the substrate. And a plurality of second control wirings that electrically connect the plurality of terminals provided on the connector member, and the plurality of second control wirings include the first control wirings. A third control wiring group connected to a control element of the element group; and a fourth control wiring group connected to a control element of the second control element group, wherein the third control wiring group includes: A separation distance along the main scanning direction between the plurality of second control wirings is longer from the connector member side toward the control element side, and the fourth control wiring group is positioned on the connector member side. A fourth wiring area and the fourth wiring area A fifth wiring region located closer to the control element, and a separation distance along the main scanning direction between the plurality of second control wirings in the fourth wiring region is the connector member The distance between the plurality of second control wirings in the fifth wiring region along the main scanning direction is shorter from the connector member side to the control element side. The separation distance along the main scanning direction between the plurality of second control wires at the boundary between the fourth wiring region and the fifth wiring region is longer than the plurality of terminals of the control element. The distance between the plurality of terminals of the connector member is shorter than the distance between the plurality of terminals of the connector member and the distance between the plurality of terminals of the connector member. Gap between the plurality of second control lines and the plurality of second control lines in the fourth wiring region is preferably covered by a second protective material formed by curing a precursor.

  The recording head of the present invention is provided on the connector member, which is disposed on the substrate, to which input signals to the plurality of control elements are input, the plurality of terminals of the control element, and the connector member. A plurality of second control wirings that are electrically connected to the plurality of terminals, the plurality of second control wirings being connected to the control elements of the first control element group; A third control wiring group and a fourth control wiring group connected to the control elements of the second control element group, and between the plurality of second control wirings in the third control wiring group The separation distance along the main scanning direction is longer from the connector member side toward the control element side, and the fourth control wiring group includes a fourth wiring region located on the connector member side, Located on the control element side from the fourth wiring region A plurality of second control wirings in the fourth wiring region, and a fifth wiring region located between the fourth wiring region and the fifth wiring region. The separation distance along the main scanning direction is shorter from the connector member side toward the control element side, and in the main scanning direction between the plurality of second control wirings in the fifth wiring region. The spaced distance along the connector member side is longer from the connector member side toward the control element side, and the spaced distance along the main scanning direction between the plurality of second control wirings in the sixth wiring region is the control distance. The distance between the plurality of terminals of the element along the main scanning direction and the distance between the plurality of terminals of the connector member are shorter than the fourth wiring area side and the fifth wiring area. Cross to the side Between the plurality of second control wires and the plurality of second control wires in at least a part of the plurality of control wires in the third control wire group and the fourth wiring region. The gap is preferably covered with a second protective material obtained by curing the precursor.

  In the recording head of the present invention, the width along the main scanning direction between the second control wirings located on the outermost side among the plurality of second control wirings in the fourth wiring region is the connector member side. It is preferable that the length becomes shorter toward the control element side. In this recording head, it is preferable that the width along the main scanning direction of each of the plurality of second control wirings in the fourth wiring region is shorter from the connector member side toward the control element side. .

  In the recording head of the present invention, it is preferable that an end of the fourth wiring region on the control element side is located between the control elements in the second control element group.

  In the recording head of the present invention, the width along the main scanning direction between the second control wirings located on the outermost side among the plurality of second control wirings in the fifth wiring region is the connector member side. It is preferable that it becomes long toward the said control element side.

  In the recording head according to the aspect of the invention, the width along the main scanning direction between the control wirings located on the outermost side among the plurality of control wirings in the first wiring region may be from the heating element side to the control element side. It is preferable that the length is shorter. In this recording head, it is preferable that a width along the main scanning direction of each of the plurality of control wirings in the first wiring region is shorter from the heating element side toward the control element side.

  In the recording head according to the aspect of the invention, it is preferable that an end of the first wiring region on the control element side is located between the plurality of control elements in the second control element group.

  In the recording head according to the aspect of the invention, a width along the main scanning direction between the control wirings located on the outermost side among the plurality of control wirings in the second wiring region may be from the heating element side to the control element side. It is preferable that it becomes long toward it.

  In the recording head according to the aspect of the invention, it is preferable that a width along the main scanning direction of each of the plurality of control wirings in the second wiring region is longer from the heating element side toward the control element side.

  In the recording head of the present invention, the length of the control element along the main scanning direction is larger than the width along the main scanning direction of the arrangement region of the plurality of heating elements controlled by the control element. It is preferable that it is long.

  In the recording head of the present invention, the control element is covered with a third protective material obtained by curing the precursor, and a peripheral end portion of the third protective material is located on the protective material. Is preferred.

  A recording apparatus of the present invention includes the recording head of the present invention and a transport mechanism for transporting a recording medium.

  A recording head according to a first embodiment of the present invention includes a substrate, a plurality of heating elements arranged along the main scanning direction on the substrate, and a plurality of heating elements spaced apart from the plurality of heating elements in the sub-scanning direction. A plurality of control elements electrically connected to a plurality of control elements disposed on the substrate, a plurality of heating elements provided on the substrate, and a plurality of terminals provided on each of the plurality of control elements. And a plurality of control elements arranged between the first control element group and the plurality of heating elements in the sub-scanning direction. And a second control element group arranged along the main scanning direction, and a plurality of control wirings are connected to the control elements of the first control element group And a second control wiring group connected to the control elements of the second control element group And the first control wiring group has a first wiring area located on the plurality of heating element sides and a second wiring area located on the control element side from the first wiring area. In addition, the separation distance along the main scanning direction between the plurality of control wirings in the first wiring region is shortened from the heating element side toward the control element side. Therefore, in the recording head according to the first embodiment of the present invention, when the precursor of the protective material is applied to the first wiring area, the separation distance along the main scanning direction between the control wirings in the first wiring area is small. Due to the shortening from the heating element side to the control element side, a capillary phenomenon is caused, and the precursor of the protective material can be spread over the first wiring region, thus protecting the first wiring region. It can be satisfactorily coated with the material. Thereby, in the recording head according to the first embodiment of the present invention, for example, even when the coating amount of the precursor of the protective material is smaller than a desired amount, the first wiring region can be satisfactorily covered with the protective material. it can.

  In the recording head according to the first aspect of the present invention, the separation distance along the main scanning direction between the plurality of control wirings in the second wiring region is longer from the heating element side to the control element side, The separation distance along the main scanning direction between the plurality of control wires at the boundary between the first wiring region and the second wiring region is the separation distance along the main scanning direction between the plurality of heating elements and between the plurality of terminals of the control element. It is shorter than the separation distance. Therefore, in the recording head according to the first embodiment of the present invention, when the precursor of the protective material is applied to the first wiring region, the precursor of the protective material that tends to extend from the first wiring region to the second wiring region. As a result, the surface tension acts satisfactorily, and the precursor can be reduced from extending to the end on the control element side in the second wiring region. Thereby, in the recording head according to the first embodiment of the present invention, for example, even when the coating amount of the precursor of the protective material is larger than the desired amount, the precursor is extended to the end on the control element side in the second wiring region. Covering with the body can be reduced well.

  Furthermore, in the recording head according to the first aspect of the present invention, the separation distance along the main scanning direction between the plurality of control wirings in the second control wiring group becomes longer from the heating element side to the control element side. . Therefore, in the recording head according to the first embodiment of the present invention, when the precursor of the protective material is applied to the second control wiring group, the protective material precursor that tends to extend from the heating element side to the control element side is used. The surface tension acts favorably, and the precursor can be reduced from extending to the end on the control element side in the second control wiring group.

  Therefore, in the recording head according to the first embodiment of the present invention, the precursor of the protective material can be satisfactorily applied to the first control wiring group and the second control wiring group having different lengths, and the control wiring is protected. It can be satisfactorily coated with the material.

  A recording head according to a second aspect of the present invention includes a substrate, a plurality of heating elements arranged along the main scanning direction on the substrate, and a plurality of heating elements spaced apart from each other in the sub-scanning direction. A plurality of control elements that are electrically connected to a plurality of control elements disposed on the substrate, a plurality of heating elements disposed on the substrate, and a plurality of terminals provided on each of the plurality of control elements. And a plurality of control elements arranged between the first control element group and the plurality of heating elements in the sub-scanning direction. And a second control element group arranged along the main scanning direction, and a plurality of control wirings are connected to the control elements of the first control element group And a second control wiring group connected to the control elements of the second control element group A first wiring region located on the plurality of heating element sides, a second wiring region located on the control element side from the first wiring region, and a first wiring region And a third wiring region located between the wiring region and the second wiring region, and the distance along the main scanning direction between the plurality of control wirings in the first wiring region is controlled from the heating element side. It becomes shorter toward the element side. Therefore, in the recording head according to the second aspect of the present invention, when the precursor of the protective material is applied to the first wiring region, the separation distance along the main scanning direction between the control wirings in the first wiring region is small. Due to the shortening from the heating element side to the control element side, a capillary phenomenon is caused, and the precursor of the protective material can be spread over the first wiring region, thus protecting the first wiring region. It can be satisfactorily coated with the material. Thereby, in the recording head according to the second embodiment of the present invention, for example, even when the coating amount of the precursor of the protective material is smaller than a desired amount, the first wiring region can be satisfactorily covered with the protective material. it can.

  In the recording head according to the second embodiment of the present invention, the separation distance along the main scanning direction between the plurality of control wirings in the second wiring region is longer from the heating element side to the control element side. Therefore, in the recording head according to the second embodiment of the present invention, when the precursor of the protective material is applied to the first wiring region, the precursor of the protective material that tends to extend from the first wiring region to the second wiring region. As a result, the surface tension acts satisfactorily, and the precursor can be reduced from extending to the end on the control element side in the second wiring region. Thereby, in the recording head according to the second embodiment of the present invention, for example, even when the coating amount of the precursor of the protective material is larger than the desired amount, the precursor is extended to the end on the control element side in the second wiring region. Covering with the body can be reduced well.

  Furthermore, in the recording head according to the second aspect of the present invention, the separation distance along the main scanning direction between the plurality of control wirings in the third wiring region is such that the separation distance along the main scanning direction between the plurality of heating elements and the control. The distance from the first wiring region is shorter than the distance between the plurality of terminals of the element, and is substantially the same length from the first wiring region side to the second wiring region side. Capillary phenomenon occurs in the precursor of the protective material that is going to extend to the second wiring region, and the precursor can be satisfactorily extended.

  Furthermore, in the recording head according to the second embodiment of the present invention, the separation distance along the main scanning direction between the plurality of control wirings in the second control wiring group becomes longer from the heating element side to the control element side. Yes. Therefore, in the recording head according to the second embodiment of the present invention, when the precursor of the second protective material is applied to the second control wiring group, the precursor of the protective material that tends to extend from the heating element side to the control element side. Surface tension acts favorably on the body, and the precursor can be reduced from extending to the end on the control element side in the second control wiring group.

  Therefore, in the recording head according to the second embodiment of the present invention, the precursor of the protective material can be satisfactorily applied to the first control wiring group and the second control wiring group having different lengths, and the control wiring is protected. It can be satisfactorily coated with the material.

  The recording head of the present invention is provided on a connector member arranged on a substrate for inputting input signals to the plurality of control elements, and on a plurality of terminals and connector members of the control element arranged on the substrate. A plurality of second control wirings that are electrically connected to the plurality of terminals, and the plurality of second control wirings are connected to the control elements of the first control element group. A third control wiring group and a fourth control wiring group connected to the control elements of the second control element group, and a main control line between a plurality of second control wirings in the third control wiring group. When the separation distance along the scanning direction is longer from the connector member side toward the control element side, when the second protective material precursor is applied to the third control wiring group, the control element from the connector member side The surface tension of the second protective material precursor Acts on good, the precursor can be reduced to try Nobiyo to the end of the control element side in the third control wiring group.

  In this recording head, the fourth control wiring group has a fourth wiring area located on the connector member side and a fifth wiring area located on the control element side from the fourth wiring area. When the separation distance along the main scanning direction between the plurality of second control wirings in the fourth wiring region is shortened from the connector member side toward the control element side, the precursor of the second protective material When the coating is applied to the fourth wiring region, the separation distance along the main scanning direction between the second control wirings in the fourth wiring region is shortened from the connector member side toward the control element side. Thus, a capillary phenomenon can be caused to spread the precursor of the second protective material over the fourth wiring region, and the fourth wiring region can be satisfactorily covered with the second protective material. Thereby, in this recording head, for example, even when the coating amount of the precursor of the second protective material is smaller than a desired amount, the second protective material can be satisfactorily covered on the fourth wiring region.

  Further, in this recording head, the separation distance along the main scanning direction between the plurality of second control wirings in the fifth wiring area is longer from the connector member side to the control element side, and the fourth wiring area The separation distance along the main scanning direction between the plurality of second control wirings at the boundary with the fifth wiring region is the separation distance along the main scanning direction between the plurality of terminals of the control element and between the plurality of terminals of the connector member. When the second protective material precursor is applied to the fourth wiring region, the second protective material that tends to extend from the fourth wiring region to the fifth wiring region is shorter than the separation distance. The surface tension acts favorably on the precursor, and it can be reduced that the precursor tends to extend to the end on the control element side in the fifth wiring region. Thereby, in this recording head, for example, even when the coating amount of the precursor of the second protective material is larger than a desired amount, the end portion on the control element side in the fifth wiring region is covered with the precursor. Can be reduced satisfactorily.

  Therefore, in this recording head, the precursor of the second protective material can be satisfactorily applied to the third control wiring group and the fourth control wiring group having different lengths, and the control wiring is formed by the second protective material. It can coat well.

  The recording head of the present invention includes a plurality of connector members that input input signals to the plurality of control elements, and a plurality of terminals that are electrically connected to a plurality of terminals of the control elements and a plurality of terminals provided on the connector member. A second control wiring, and the plurality of second control wirings are connected to the control elements of the first control element group, and the control of the second control element group And a separation distance along the main scanning direction between the plurality of second control wirings in the third control wiring group from the connector member side to the control element side. When the second protective material precursor is applied to the third control wiring group, the surface tension is applied to the second protective material precursor that tends to extend from the connector member side to the control element side. Works well, and the precursor is controlled in the third control wiring group. It can be reduced to try Nobiyo to the end of the element side.

  The recording head includes a fourth wiring region in which the fourth control wiring group is located on the connector member side, a fifth wiring region located on the control element side from the fourth wiring region, and a fourth wiring region. And a sixth wiring region located between the wiring region and the fifth wiring region, and the separation distance along the main scanning direction between the plurality of second control wirings in the fourth wiring region is a connector member. When the second protective material precursor is applied to the fourth wiring region when the length is reduced from the side toward the control element side, in the main scanning direction between the second control wirings in the fourth wiring region. Due to the fact that the separation distance along the side is shortened from the connector member side toward the control element side, a capillary phenomenon is caused to spread the precursor of the second protective material to the fourth wiring region. And the fourth wiring region is satisfactorily covered with the second protective material. It is possible. Thereby, in this recording head, for example, even when the coating amount of the precursor of the second protective material is smaller than a desired amount, the second protective material can be satisfactorily covered on the fourth wiring region.

  Further, the recording head has a second protection function when a distance along the main scanning direction between the plurality of second control wirings in the fifth wiring region is increased from the connector member side to the control element side. When the precursor of the material is applied to the fourth wiring region, the surface tension acts favorably on the precursor of the second protective material that tries to extend from the fourth wiring region to the fifth wiring region. An attempt to extend to the end portion on the control element side in the fifth wiring region can be reduced. Thereby, in this recording head, for example, even when the coating amount of the precursor of the second protective material is larger than a desired amount, the end portion on the control element side in the fifth wiring region is covered with the precursor. Can be reduced satisfactorily.

  Furthermore, in this recording head, the separation distance along the main scanning direction between the plurality of second control wirings in the sixth wiring region is such that the separation distance along the main scanning direction between the plurality of terminals of the control element and the connector member. The distance from the fourth wiring region to the fifth wiring region is shorter than the distance between the plurality of terminals and is substantially the same length from the fourth wiring region side to the fifth wiring region side. Capillary phenomenon occurs in the precursor of the second protective material that tries to extend into the wiring region, and the precursor can be satisfactorily extended.

  Therefore, in this recording head, the precursor of the second protective material can be satisfactorily applied to the third control wiring group and the fourth control wiring group having different lengths, and the second control wiring is connected to the second control wiring. It can be satisfactorily covered with a protective material.

  In the recording head of the present invention, the width along the main scanning direction between the second control wirings located on the outermost side among the plurality of second control wirings in the fourth wiring region is from the connector member side to the control element side. When the amount of the precursor of the second protective material is small, the precursor is led to the fifth wiring region side by reducing the area covered by the precursor, even when the amount of the precursor of the second protective material is small. Four wiring regions can be satisfactorily covered. In this recording head, when the width along the main scanning direction of each of the plurality of second control wirings in the fourth wiring region is shortened from the connector member side to the control element side, each second control wiring The separation distance between the precursors of the second protective material positioned therebetween can be reduced. Therefore, in this recording head, the upper surface of the second control wiring can be satisfactorily covered with the second protective material even when the plurality of second control wirings extend long.

  In the recording head of the present invention, when the end on the control element side of the fourth wiring region is located between the control elements in the second control element group, the end on the control element side of the fourth wiring region is the second protection. It can be satisfactorily coated with the material.

  In the recording head of the present invention, the width along the main scanning direction between the second control wirings located on the outermost side among the plurality of second control wirings in the fifth wiring region is from the connector member side to the control element side. When the amount of the precursor of the second protective material is large, the surface tension of the precursor is favorably applied to the precursor by increasing the area covered by the precursor. It is possible to reduce the fifth wiring region from being covered with the precursor.

  In the recording head of the present invention, the width along the main scanning direction between the outermost control wirings among the plurality of control wirings in the first wiring region becomes shorter from the heating element side toward the control element side. In the case where the amount of the precursor of the protective material is small, by reducing the area covered by the precursor, the precursor is guided to the second wiring region side, and the first wiring region is satisfactorily covered. Can do. In this recording head, when the width along the main scanning direction of each of the plurality of control wirings in the first wiring region is shortened from the heating element side toward the control element side, the plurality of control wirings positioned between the control wirings are arranged. The separation distance between the precursors of the protective material can be reduced. Therefore, in this recording head, the upper surface of the control wiring can be satisfactorily covered with the protective material even when the plurality of control wirings extend long.

  In the recording head of the present invention, when the end on the control element side of the first wiring region is located between the plurality of control elements in the second control element group, the end on the control element side of the first wiring region is a protective material. Can be coated satisfactorily.

  In the recording head of the present invention, when the width along the main scanning direction of each of the plurality of control wirings in the second wiring region is longer from the heating element side to the control element side, the area covered by the precursor By enlarging, it is possible to further reduce the precursor from extending to the end on the control element side in the third wiring region.

  In the recording head of the present invention, the width along the main scanning direction between the outermost control wirings among the plurality of control wirings in the second wiring region becomes longer from the heating element side to the control element side. When the amount of the precursor of the protective material is large, by increasing the area covered by the precursor, the surface tension is favorably applied to the precursor, and the precursor is applied to the second wiring region. Can be reduced.

  In the recording head of the present invention, the length of the control element along the main scanning direction is longer than the width along the main scanning direction of the arrangement region of the plurality of heating elements controlled by the control element. Even in this case, the separation distance along the main scanning direction between the control wirings in the first wiring region is longer from the control element side toward the heat generating element side, and therefore, with respect to the protective material precursor. The surface tension can be satisfactorily applied, and the heating element can be further reduced from being coated with the precursor.

  In the recording head of the present invention, when the control element is covered with the third protective material obtained by curing the precursor, and the peripheral end portion of the third protective material is located on the protective material, When the protective material precursor 3 is applied to the second wiring region, the separation distance along the main scanning direction between the control wirings in the second wiring region becomes shorter from the control element side toward the heating element side. As a result, a capillary phenomenon is caused, and the precursor of the third protective material can be satisfactorily extended to the first wiring region, and the second protective region can be satisfactorily covered with the third protective material. can do.

  The recording apparatus of the present invention includes the recording head of the present invention and a transport mechanism for transporting a recording medium. Therefore, the recording apparatus of the present invention can enjoy the effects of the recording head described above. Therefore, in the recording apparatus of the present invention, the control wiring of the recording head is satisfactorily covered with the protective material, so that the influence of the outside atmosphere can be reduced and the recording head can be driven stably for a long time.

<First Embodiment of Recording Head>
FIG. 1 is a plan view showing a schematic configuration of a thermal head X1, which is an example of a first embodiment of a recording head of the present invention.

  FIG. 2 is an enlarged plan view of a main part of the thermal head X1 shown in FIG.

  FIG. 3 is a plan view in which the main part of the thermal head X1 shown in FIG. 1 is enlarged and part of the configuration is omitted.

  FIG. 4 is a plan view further enlarging the main part of the thermal head X1 shown in FIG.

  FIG. 5 is an enlarged plan view of the main part of the thermal head X1 shown in FIG.

  6 is a cross-sectional view taken along line VI-VI in FIG.

  The thermal head X1 includes a substrate 10, a heat storage layer 20, a control IC 30 as a control element, an electric resistance layer 40, a conductive layer 50, a protective layer 60, and an external connection member 70. Yes.

  The substrate 10 has a function of supporting the heat storage layer 20, the control IC 30, the electrical resistance layer 40, the conductive layer 50, the protective layer 60, and the external connection member 70. The substrate 10 is configured in a rectangular shape extending in the main scanning direction (arrow directions D1 and D2) in plan view. Examples of the material for forming the substrate 10 include ceramics, glass, silicon, and sapphire. Among these materials, glass, silicon, and sapphire are preferable from the viewpoint of high density printing. Furthermore, sapphire is more preferable from the viewpoint of speeding up printing, and glass is more preferable from the viewpoint of reducing power consumption of printing.

  The heat storage layer 20 has a function of temporarily storing a part of heat generated in a heating element H (described later) of the electric resistance layer 40. That is, the heat storage layer 20 plays a role of improving the thermal response characteristics of the thermal head X by shortening the time required to raise the temperature of the heating element H. The heat storage layer 20 is located over the entire surface of the substrate 10. Further, the heat storage layer 20 has a protruding portion whose cross-sectional shape in the sub-scanning direction (arrow directions D3 and D4) orthogonal to the main scanning direction (arrow directions D1 and D2) is substantially semi-elliptical. Yes.

The control IC 30 has a function of controlling the heat generation of the plurality of heating elements H. The control IC 30 is disposed away from the protruding portion of the heat storage layer 20 in the sub-scanning direction (arrow directions D3 and D4). The control IC 30 has a connection terminal 31 and is connected to the conductive layer 50 through the connection terminal 31. Further, the control IC ₃₀ is configured such that the planar view widths W ₃₀ along the main scanning direction are substantially the same. In FIG. 3, FIG. 4, and FIG. 5, the control IC 30 is omitted.

The control IC 30 of this embodiment includes a first control IC group 30a and a second control IC group 30b. The control ICs 30 in the first control IC group 30a are arranged along the main scanning direction (arrow directions D1, D2). Each control IC 30 in the second control IC group 30b is disposed between the protruding portion of the heat storage layer 20 and the first control IC group 30a, and is arranged along the main scanning direction. Furthermore, control IC30 of the present embodiment, in each of the first control IC unit 30a and the second control IC group 30b, are arranged at substantially the same distance _{d 30} along the main scanning direction. The separation distance d ₃₀ is configured to be shorter than the planar view width W ₃₀ of the control IC ₃₀ .

  The electrical resistance layer 40 has a portion that functions as the heating element H. The electrical resistance layer 40 is configured such that the electrical resistance value per unit length is larger than the electrical resistance value per unit length of the conductive layer 50. The electrical resistance layer 40 is located on the heat storage layer 20. In the present embodiment, a portion of the electrical resistance layer 40 to which a voltage is applied from the conductive layer 50 where the conductor layer 40 is not formed functions as the heating element H. Examples of the material mainly forming the electric resistance layer 40 include a TaN-based material, a TaSiO-based material, a TaSiNO-based material, a TiSiO-based material, a TiSiCO-based material, and an NbSiO-based material. Here, the “material mainly comprising” means that the principal material is 50% by mass or more with respect to the whole, for example, an additive may be included.

The heating element H generates heat when a voltage is applied. The heat generating element H is configured such that the heat generation temperature due to voltage application from the conductive layer 50 is in the range of 200 [° C.] to 550 [° C.], for example. The heat generating element H is located on the protruding portion of the heat storage layer 20 and is disposed away from the control element 30 in the sub-scanning direction (arrow directions D3 and D4). Furthermore, the heating element H are arranged substantially at the same distance d _H in the main scanning direction (direction of the arrow D1, D2). Further, each of the heating elements H is configured in a rectangular shape in plan view. The heating element H is configured such that the planar view widths W _H (lengths in the arrow directions D1 and D2) along the arrow directions D1 and D2 are substantially the same. Further, the heating element H is configured such that the planar view lengths L _H (lengths in the arrow directions D3 and D4) along the arrow directions D3 and D4 are substantially the same. Here, “substantially the same” includes those within a general manufacturing error range, for example, a range in which an error with respect to an average value of dimensions of each part is within 10%. Here, “plan view” means a view in the direction of arrow D6. Here, the distance d _CH between the center of one heating element H and the center of another heating element H adjacent to the heating element H is, for example, not less than 5.2 [μm] and not more than 84.7 [μm]. The length of the range is mentioned. In the present embodiment, the length W _fH along the direction of the arrow D1, D2 of the formation region of the plurality of heat generating elements H are connected to a single drive IC30 is shorter in length than the plan view width W ₃₀ of the drive IC30 It is comprised so that it may become.

  The conductive layer 50 contributes to applying a voltage to the heating element H. The conductive layer 50 is located on the electric resistance layer 40. The conductive layer 50 includes a first conductive layer 51, a second conductive layer 52, and a third conductive layer 53. As a material mainly forming the conductive layer 50, for example, any one metal of aluminum, gold, silver, and copper, or an alloy thereof can be given.

  The first conductive layer 51 contributes to selectively applying a voltage to the heating element H. The first conductive layer 51 includes a first wiring part 511, a second wiring part 512, and a third wiring part 513. The first conductive layer 51 functions as a control wiring together with the electric resistance layer 40 located in the arrow D6 direction.

  In addition, the first conductive layer 51 of the present embodiment includes a first conductive layer group 51a and a second conductive layer group 51b. The first conductive layer group 51a is connected to the control IC 30 of the first control IC group 30a. The second conductive layer group 51b is connected to the control IC 30 of the second control IC group 30b.

One end of the first wiring portion 511 is connected to one end of the heat generating element H on the arrow D4 direction side. First wiring portion 511, the direction of the arrow D1, D2 plan view width W ₁₁ along is configured in plan view width W _H and substantially the same length of heating element H. Further, the first wiring portion 511, the mutual distance d ₁₁ along the direction of the arrow D1, D2 are configured to distance d _H and the substantially the same length of heating element H.

  One end of the second wiring portion 512 is connected to the other end of the first wiring portion 511. The configuration of the second wiring portion 512 is different between the first conductive layer group 51a and the second conductive layer group 51b.

The second wiring portion 512 of the first conductive layer group 51a includes a first wiring region 51a _1, is configured to include a second wiring region 51a _2.

The first wiring region 51a ₁ is located on the heating element H side (on the arrow D3 direction side) in the second wiring portion 512. The second wiring portion 512 in the first wiring region 51a ₁ has a plan view width W _12a along the arrow directions D1 and D2 that decreases from the heating element H side toward the control IC 30 side (in the arrow D4 direction). is configured, it is configured shorter in the length than the plan view width W ₁₁ of the first wiring portion 511 to. The second wiring portion 512 in the first wiring region 51a ₁ is, mutual distance _{d 12a} along that direction of the arrow D1, D2 is configured to be shorter toward the arrow D4. Further, the second wiring portion 512 electrically connected to one control IC 30 among the second wiring portions 512 in the first wiring region 51a ₁ is the second wiring located at both ends in the arrow directions D3 and D4. The planar view width W _fa1 along the arrow directions D1 and D2 between the portions 512 is configured to become shorter as it goes in the arrow D4 direction. The plan view width W _fa1 of the second wiring portion 512 is configured to be shorter than the length W _fH of the formation region of the heating element H connected to the first conductive layer group 51a.

The second wiring region 51a ₂ is (the arrow D4 side) to the control IC30 side in the second wiring portion 512 is located. The second wiring portion 512 in the second wiring region 51a _2, the direction of the arrow D1, D2 plan view width _{W 12b} along is configured to be longer toward the arrow D4. The second wiring portion 512 in the second wiring region 51a _2, the direction of the arrow D1, D2 of each other a distance _{d 12b} along is configured to be longer toward the arrow D4. Further, of the second wiring portions 512 in the second wiring region 51a ₂ , the second wiring portions 512 that are electrically connected to one control IC 30 are second ends located at both ends in the arrow directions D3 and D4. The planar view width W _fa2 along the arrow directions D1 and D2 between the wiring portions 512 is configured to become longer as it goes in the arrow D4 direction.

Further, the second wiring portion 512 in the second conductive layer group 51b is configured such that the planar view width _W12c along the arrow directions D1 and D2 becomes longer as it goes in the arrow D4 direction. The second wiring portion 512 of the second conductive layer group 51b, the direction of the arrow D1, D2 mutual distance d _12c along is configured to be longer toward the arrow D4. Further, of the second wiring portions 512 in the second conductive layer group 51b, the second wiring portions 512 that are electrically connected to one control IC 30 are second ends located at both ends in the arrow directions D3 and D4. The planar view width W _fb along the arrow directions D1 and D2 between the wiring portions 512 is configured to become longer as it goes in the arrow D4 direction. The plan view width W _fb of the second wiring portion 512 is configured to be longer than the length W _fH of the formation region of the heating element H connected to the second conductive layer group 51b.

The third wiring part 513 has one end connected to the other end of the second wiring part 512 and the other end connected to the control IC 30. Third wiring portion 513 of the present embodiment, the plan view width W ₁₃ along the direction of the arrow D1, D2 are configured short length as compared with the plan view width W ₁₁ of the first wiring portion 511. Further, the third wiring 513, the direction of the arrow D1, D2 mutual distance d ₁₃ along is configured distance and substantially the same length of the connection terminals 31 of the control IC 30.

  The second conductive layer 52 contributes to applying a voltage to the heating element H in pairs with the first conductive layer 51. The second conductive layer has an end connected to the other ends of the plurality of heating elements H and a power source (not shown). The second conductive layer 52 is located on the side of the heating element H in the direction of arrow D3.

  The third conductive layer 53 contributes to inputting an electric signal to the control IC 30. The third conductive layer 53 includes a fourth wiring part 531, a fifth wiring part 532, and a sixth wiring part 533. The third conductive layer 53 functions as a control wiring together with the resistor layer 30 located in the direction of the arrow D6.

  In addition, the third conductive layer 53 of the present embodiment includes a third conductive layer group 53a and a fourth conductive layer group 53b. The third conductive layer group 53a is connected to the control IC 30 of the first control IC group 30a. The fourth conductive layer group 53b is connected to the control IC 30 of the second control IC group 30b.

One end of the fourth wiring portion 531 is connected to the connection terminal 31 of the control IC 30. The fourth wiring portion 531 is configured to have substantially the same length in plan view width W ₃₁ along the arrow directions D1 and D2. Further, the fourth wiring portion 531 is configured such that the distance d ₃₁ between each other along the arrow directions D1 and D2 is substantially the same.

  One end of the fifth wiring portion 532 is connected to the other end of the fourth wiring portion 531. The fifth wiring portion 532 is different in configuration between the third conductive layer group 53a and the fourth conductive layer group 53b.

The fifth wiring portion 532 in the third conductive layer group 53a is configured such that the planar view width W _32a along the arrow directions D1 and D2 becomes shorter as it goes in the arrow D4 direction. Further, the fifth wiring portion 532 in the third conductive layer group 53a is configured such that the distance d _32a between each other along the arrow directions D1 and D2 becomes shorter as it goes in the arrow D4 direction. Further, among the fifth wiring portions 532 in the third conductive layer group 53a, the fifth wiring portions 532 electrically connected to one control IC 30 are fifth ends located at both ends in the arrow directions D3 and D4. A planar view width W _fc along the arrow directions D1 and D2 between the wiring portions 532 is configured to become shorter in the direction of the arrow D4.

The fifth wiring 532 of the fourth conductive layer group 53b includes a third wiring region 53b _1, is configured to include a fourth wiring region 53b _2.

The third wiring region 53b ₁ is located on the control IC 30 side (on the arrow D3 direction side) in the fifth wiring portion 532. The fifth wiring 532 in the third wiring region 53b ₁ is shorter as the direction of the arrow D1, a plan view width _{W 32 b} along the D2 is directed to the external connection member 70 side from the control IC30 side (the arrow D4) is configured such that is configured shorter in the length than the plan view width W ₃₁ of the fourth wiring portion 531. The fifth wiring 532 in the third wiring region 53b ₁ is mutual distance _{d 32 b} along that direction of the arrow D1, D2 is configured to be shorter toward the arrow D4. Moreover, out of the fifth wiring 532 in the third wiring region 53b _1, the fifth wiring 532 is electrically connected to one of the control IC30, the fifth wiring which is located at both ends in the direction of the arrow D3, D4 A planar view width W _fd1 along the arrow directions D1 and D2 between the portions 532 is configured to become shorter in the direction of the arrow D4.

Fourth wiring region 53b ₂ are (the arrow D4 side) to the control IC30 side in the fifth wiring 532 are located. The fifth wiring 532 in the fourth wiring region 53b _2, the direction of the arrow D1, D2 plan view width _{W 32c} along is configured to be longer toward the arrow D4. The fifth wiring 532 in the fourth wiring region 53b _2, the direction of the arrow D1, D2 mutual distance _{d 32c} along is configured to be longer toward the arrow D4. Furthermore, among the fourth wiring region 53b ₂ of the fifth wiring 532, the fifth wiring 532 is electrically connected to one of the control IC30 is first positioned at both ends in the direction of the arrow D3, D4 5 The planar view width W _fd2 along the arrow directions D1 and D2 between the wiring portions 532 is configured to become longer as it goes in the arrow D4 direction.

The sixth wiring part 533 has one end connected to the other end of the fifth wiring part 532 and the other end connected to the control IC 30. The sixth wiring portion 533 of the present embodiment is configured such that the planar view width W ₃₃ along the arrow directions D 1 and D 2 is shorter than the planar view width W ₃₁ of the fourth wiring portion 531. In addition, the sixth wiring portion 533 is configured such that the distance d ₃₃ between each other along the arrow directions D 1 and D 2 is substantially the same as the distance between the connection terminals 31 of the control IC 30.

  The protective layer 60 includes a first protective layer 61, a second protective layer 62, and a third protective layer 63. In FIG. 2, the protective layer 60 is omitted.

The first protective layer 61 has a function of protecting the heat generating element H and a part of the conductive layer 50. As a material mainly forming the first protective layer 61, for example, diamond-like carbon material, SiC-based material, SiN-based material, SiCN-based material, SiON-based material, SiONC-based material, SiAlON-based material, SiO ₂ -based material, Ta ₂ O ₅ -based material, TaSiO-based material, TiC-based material, TiN-based material, TiO ₂ -based material, TiB ₂ -based material, AlC-based material, and AlN-based material Al ₂ O ₃ -based material, ZnO-based material, B ₄ C-based material, and BN-based material. Here, the “diamond-like carbon material” refers to a film in which the proportion of carbon atoms (C atoms) taking sp ³ hybrid orbits is in the range of 1 [atomic%] to less than 100 [atomic%]. In addition, “a material mainly composed of a system material” herein refers to a material whose main material is 50 wt% or more with respect to the whole, and may contain, for example, an additive.

  The second protective layer 62 has a function of protecting a part of the conductive layer 50. Examples of the material for forming the second protective layer 62 include thermosetting or ultraviolet curable resins such as epoxy resins, silicone resins, and fluorine resins.

The second protective layer 62 of the present embodiment includes a first covering portion 62a and a second covering portion 62b. The first covering portion 62 a is configured to cover a part of the first wiring portion 511 and the second wiring portion 512. After the first protective layer 61 is formed, the first covering portion 62a is formed by applying a fluidic precursor of the first covering portion 62a on the first wiring portion 511 and curing the precursor. . The first covering portion 62a does not cover the region including the end of the third wiring portion 513 on the arrow D4 direction side, and a part of the third wiring portion 513 is exposed. The first covering portion 51 b is configured to cover the fifth wiring portion 532. It is formed by applying a precursor of the second covering portion 62b having fluidity on the fifth wiring portion 531 and curing the precursor. The second covering portion 62b does not cover the region including the end portion on the arrow D4 direction side of the sixth wiring portion 533, and a part of the sixth wiring portion 533 is exposed. When the second protective layer 62 is formed, if the distance d _H between the centers of the heat generating elements is 21.2 [μm] or less, the second protective layer 62 extends over the gaps between the plurality of first conductive layers 51. force by capillary phenomenon exerted to the precursor of the second protective layer 62, due to increased contrary to the separation distance d _H, it can extend the precursor good. On the other hand, since the acting force due to the capillary phenomenon is increased, the adjustment range of the coating amount of the precursor of the second protective layer 62 is decreased. The present invention produces a more remarkable effect when the action force due to the capillary action is increased.

  The third protective layer 63 has a function of protecting the third wiring portion 513 of the first conductive layer 51, the fourth wiring portion 531 of the third conductive layer 53, and the control IC 30. The third protective layer 63 is configured to cover the third wiring part 413, the fourth wiring part 531, and the control IC 30. Examples of the material for forming the third protective layer 63 include thermosetting or ultraviolet curable resins such as epoxy resins and silicone resins. The third protective layer 63 in the present embodiment is formed by applying a flowable precursor of the third protective layer 63 on the control IC 30 after the formation of the second protective layer 62 and curing the precursor. The

  The external connection member 70 has a function of supplying an electric signal for driving the heating element H. Examples of the external connection member 70 include a combination of a flexible cable and a connector. The external connection member 70 is electrically connected to the control IC 30 through the third conductive layer 53.

The thermal head X1 is disposed on the substrate 10, the plurality of heating elements H arranged on the substrate 10 along the arrow directions D1 and D2, and spaced apart from the plurality of heating elements H in the arrow directions D3 and D4. And a plurality of first conductive layers 51 electrically connecting a plurality of heating elements H and a plurality of terminals 31 provided in each of the plurality of control ICs 30. A plurality of control ICs 30 arranged along the arrow directions D1 and D2, and the first control IC group 30a and the plurality of heating elements H in the arrow directions D3 and D4. And a second control IC group 30b arranged along the arrow directions D1 and D2, and the plurality of first conductive layers 51 are controlled by the first control IC group 30a. Connected to IC30 The first conductive layer group 51a and the second conductive layer group 51b connected to the control IC 30 of the second control IC group 30b are included, and the first conductive layer group 51a is positioned on the plurality of heating elements H side. A first wiring area 51a ₁ and a second wiring area 51a ₂ located on the control IC 30 side of the first wiring area 51a _1, and a plurality of first wiring areas 51a ₁ are arranged in the first wiring area 51a ₁ . distance _{d 12a} along the direction of the arrow D1, D2 between the conductive layer 51 is shorter towards the control IC30 side from the heating element H side. Therefore, in the thermal head X1, when applied to the precursor of the second protective layer 62 in the first wiring region 51a _1, along the direction of the arrow D1, D2 between the first conductive layer 51 in the first wiring region 51a ₁ Due to the fact that the separated distance d _12a is shortened from the heating element H side toward the control IC 30 side, a capillary phenomenon is caused to cause the precursor of the second protective layer 62 to enter the first wiring region 51a ₁ . The first wiring region 51 a ₁ can be satisfactorily covered with the second protective layer 62. Thus, in the thermal head X1, for example, even if the coating amount of the precursor of the second protective layer 62 becomes less than the desired amount, to satisfactorily cover the second protective layer 62 in the first wiring region 51a ₁ it can.

Further, in the thermal head X1, the distance _{d 12b} along the direction of the arrow D1, D2 between the plurality of first conductive layer 51 in the second wiring region 51a ₂ is longer toward the control IC30 side from the heating element H side cage, the distance along the direction of the arrow D1, D2 between the plurality of first conductive layer 51 at the boundary between the first wiring region 51a ₁ and the second wiring region 51a ₂ is an arrow direction D1 between the plurality of heat generating elements H, is shorter than the distance between the plurality of terminals 31 spaced a distance d _H and control IC30 along D2. Therefore, in the thermal head X1, when applied to the precursor of the second protective layer 62 in the first wiring region 51a _1, the second protective layer to be Nobiyo from the first wiring region 51a ₁ to the second wiring region 51a ₂ surface tension work well to precursor 62, the precursor can be reduced to try Nobiyo to the end of the control IC30 side in the second wiring region 51a _2. Thus, in the thermal head X1, for example, even if the coating amount of the precursor of the second protective layer 62 becomes greater than the desired amount, covered by those precursor to the end of the control IC30 side in the second wiring region 51a ₂ Can be reduced satisfactorily.

Further, the thermal head X1 is the distance _{d 12c} along the direction of the arrow D1, D2 between the plurality of first conductive layer 51 in the second conductive layer group 51b is longer toward the control IC30 side from the heating element H side Yes. Therefore, in the thermal head X1, when the precursor of the second protective layer 62 is applied to the second conductive layer group 51b, the precursor of the second protective layer 62 that tends to extend from the heating element H side to the control IC 30 side. The surface tension acts favorably, and the precursor can be prevented from extending to the end on the control IC 30 side in the second conductive layer group 51b.

  Therefore, in the thermal head X1, the precursor of the second protective layer 62 can be satisfactorily applied to the first conductive layer group 51a and the second conductive layer group 51b having different lengths. 2 can be satisfactorily covered by the protective layer 62.

The thermal head X1 electrically connects an external connection member 70 for inputting input signals to the plurality of control ICs 30, and a plurality of terminals 31 of the control IC 30 and a plurality of terminals provided on the external connection member 70. A plurality of third conductive layers 53, wherein the third conductive layers 53 are connected to the control IC 30 of the first control IC group 30a, and 2 and the fourth conductive layer group 53b connected to the control IC 30 of the control IC group 30b, and the separation distance along the arrow directions D1 and D2 between the plurality of third conductive layers 53 in the third conductive layer group 53a. Since d _32a is longer from the external connection member 70 side toward the control IC 30 side, when the precursor of the second protective layer 62 is applied to the third conductive layer group 53a, the external connection member 70 side To the control IC 30 side Surface tension acts favorably on the precursor of the second protective layer 62 to be extended, and the precursor can be reduced from extending to the end of the third conductive layer group 53a on the control IC 30 side. .

Further, in the thermal head X1, the third conductive layer 53 in the fourth conductive layer group 53b is on the control IC 30 side with respect to the fourth wiring region 53b ₂ located on the external connection member 70 side and the third wiring region 53b _1. The third wiring region 53b ₁ located in the first wiring region 53b ₁ and the separation distance d _32c along the arrow directions D1 and D2 between the plurality of third conductive layers 53 in the fourth wiring region 53b ₂ is for external connection. since the direction from member 70 side to the control IC30 side is shorter, second precursor of the protective layer 62 when applied to the fourth wiring region 53b _2, 4 in the wiring region 531b ₂ each third conductive layer 53 distance d _32c along the direction of the arrow D1, D2 between the due to is shorter towards the external connection member 70 side to the control IC30 side and cause a capillary phenomenon, the second protective layer 62 The precursor of 4 can be spread in the wiring region 53b _2, it is possible to satisfactorily cover the fourth wiring region 53b ₂ by the second protective layer 62. Thus, in the thermal head X1, for example, even if the coating amount of the precursor of the second protective layer 62 becomes less than the desired amount, to satisfactorily cover the second protective layer 62 to the fourth wiring region 53b ₂ it can.

Further, in the thermal head X1, the distance d _32b along the arrow directions D1 and D2 between the plurality of third conductive layers 53 in the third wiring region 53b ₁ is longer from the external connection member 70 side toward the control IC 30 side. it is, the distance along the direction of the arrow D1, D2 between the plurality of third conductive layer 53 in the third boundary between the wiring region 53b ₁ and the fourth wiring region 53b ₂ are, between the plurality of terminals 31 of the control IC30 since is shorter than the distance between the plurality of terminals of the distance and the external connection member 70 along the direction of the arrow D1, D2, it was coated a precursor of the second protective layer 62 to the fourth wiring region 53b ₂ when the surface tension to the precursor of the second protective layer 62 to be Nobiyo from the fourth wiring region 53b ₂ in the third wiring region 53b ₁ acts well, control the precursors in the third wiring region 53b ₁ It can be reduced to try Nobiyo to the end of the IC30 side. Thus, in the thermal head X1, for example, even if the coating amount of the precursor of the second protective layer 62 becomes greater than the desired amount, covered by a third the precursor to the end of the control IC30 side in the wiring region 53b ₁ Can be reduced satisfactorily.

  Therefore, in the thermal head X1, the precursor of the second protective layer 62 can be satisfactorily applied to the third conductive layer group 53a and the fourth conductive layer group 53b having different lengths. 2 can be satisfactorily covered by the protective layer 62.

In the thermal head X1, the fourth plan view width _{W fd2} most along the direction of the arrow D1, D2 between the third conductive layer 53 that is located outside of the third conductive layer 53 more in the wiring region 53b _2, external Since the length is shortened from the connecting member 70 side toward the control IC 30 side, even when the amount of the precursor of the second protective layer 62 is small, the precursor is reduced by reducing the area covered by the precursor. The fourth wiring region 53b ₂ can be satisfactorily covered by guiding to the third wiring region 53b ₁ side.

In the thermal head X1, the width _{W fd2} along each direction of the arrow D1, D2 of a plurality of third conductive layer 53 in the fourth wiring region 53b ₂ is shortened toward the external connection member 70 side to the control IC30 side Therefore, the distance between the precursors of the plurality of second protective layers 62 located between the third conductive layers 53 can be reduced. Therefore, in the thermal head X1, even when the plurality of third conductive layers 53 extend long, the upper surface of the third conductive layer 53 can be satisfactorily covered with the second protective layer 62.

In the thermal head X1, the end of the fourth wiring region 53b ₂ of the control IC30 side, since the position between the control IC30 in the first control IC group 30a, the fourth end of the control IC30 of the wiring region 53b ₂ a 2 can be satisfactorily covered by the protective layer 62.

In the thermal head X1, the third plan view width _{W fd1} most along the direction of the arrow D1, D2 between the third conductive layer 53 that is located outside of the wiring region 53b plurality of third conductive layer 53 in _1, external Since it is longer from the connecting member 70 side to the control IC 30 side, even when the amount of the precursor of the second protective layer 62 is large, the area covered by the precursor is increased, On the other hand, it is possible to cause the surface tension to act satisfactorily and to reduce the third wiring region 53b _{1 from} being covered with the precursor.

In the thermal head X1, the plan view width _{W 12a} along the direction of the arrow D1, D2 between the first conductive layer 51 that are located outermost of the first wiring region 51a ₁ a plurality of first conductive layer 51 in the fever Since the length is shortened from the element H side toward the control IC 30 side, even when the amount of the precursor of the second protective layer 62 is small, the area covered by the precursor is reduced to reduce the precursor to the second. The first wiring region 51a ₁ can be satisfactorily covered by guiding to the wiring region 51a ₂ side.

In the thermal head X1, the plan view width _{W 12a} along each direction of the arrow D1, D2 of the first wiring region 51a a plurality of first conductive layer 51 in _1, is shorter towards the control IC30 side from the heating element H side Therefore, the distance between the precursors of the plurality of second protective layers 62 located between the first conductive layers 51 can be reduced. Therefore, in the thermal head X1, even when the plurality of first conductive layers 51 extend long, the upper surface of the first conductive layer 51 can be satisfactorily covered with the second protective layer 62.

In the thermal head X1, the end of the first wiring region 51a ₁ of the control IC30 side, since the positions between the plurality of control IC30 in the first control IC group 30a, the first end of the control IC30 of the wiring area 51a ₁ Can be satisfactorily covered with the second protective layer 62.

In the thermal head X1, the plan view width W _12a along the main scanning direction of each of the second wiring region 51a of the plurality of ₂ first conductive layer 51, since longer toward the control IC30 side from the heating element H side When the precursor of the second protective layer 62 is applied to the first wiring region 51a ₁ , the precursor covers the control element H side in the second wiring region 51a ₂ by increasing the area covered by the precursor. It is possible to further reduce the tendency to extend to the end portion.

In the thermal head X1, the plan view width _{W fa2} most along the direction of the arrow D1, D2 between the first conductive layer 51 located outside of the second wiring region 51a of the plurality of ₂ first conductive layer 51, heating Since it is longer from the element H side toward the control IC 30 side, even when the amount of the precursor of the second protective layer 62 is large, by increasing the area covered by the precursor, satisfactorily allowed to act surface tension, the precursor can be reduced from being covered to the second wiring region 51a _2.

In the thermal head X1, the length along the arrow directions D1 and D2 of the control IC 30 is the length W _fH along the arrow directions D1 and D2 of the arrangement region of the plurality of heating elements H controlled by the control IC 30. even when compared to is longer, a longer distance _{d 12a} along the direction of the arrow D1, D2 between the first conductive layer 51 in the first wiring region 51a ₁ is towards the heating element H side from the control IC30 side As a result, it is possible to cause the surface tension to act favorably on the precursor of the second protective layer 62, and to further reduce the covering of the precursor on the heating element H.

In the thermal head X1, the control IC 30 is covered with the third protective layer 63 obtained by curing the precursor, and the peripheral end portion of the third protective layer 63 is located on the second protective layer 62. when the precursor of the third protective layer 63 is applied to the second wiring region 51a _2, the distance _{d 12b} along the direction of the arrow D1, D2 between the first conductive layer 51 in the second wiring region 51a ₂ is controlled Due to the shortening from the IC 30 side toward the heating element H side, a capillary phenomenon is caused, and the precursor of the third protective layer 63 can be satisfactorily extended to the first wiring region 51a ₁ side, the second wiring region 51a ₂ can be satisfactorily cover the third protective layer 63.
<Second Embodiment of Recording Head>
FIG. 7 is a plan view showing a schematic configuration of a thermal head X2, which is an example of the second embodiment of the recording head of the present invention.

  FIG. 8 is a plan view in which the main part of the thermal head X2 shown in FIG. 7 is enlarged and part of the configuration is omitted.

  The thermal head X2 is different from the thermal head X1 in that the first conductive layer 51A is used instead of the first conductive layer 51. Other configurations of the thermal head X2 are the same as those described above with respect to the thermal head X1.

The first conductive layer 51A is in that the second wiring portion 512A of the first conductive layer group 51a is configured to include a fifth wiring region 51a _3, different from the first conductive layer 51. Other configurations of the first conductive layer 51A are the same as those described above with respect to the first conductive layer 51.

Fifth wiring region 51a ₃ is located between the first wiring region 51a ₁ and the second wiring region 51a _2. Substantially fifth second wiring portion 512A in the wiring area 51a _3, the (in the direction of the arrow D3, D4) the direction of the arrow D1, a plan view width _{W 12d} is a control IC30 side from the heating element H side along the D2 over by It is comprised so that it may become the same length. The planar view width W _12d of the second wiring portion 512A is configured to have substantially the same length as the planar view width W _12a at the end of the first wiring region 51a _{1 on} the arrow D4 direction side. The second wiring portion 512A in the fifth wiring region 51a _3, as mutual distance _{d 12d} along that direction of the arrow D1, D2 are substantially the same length over the direction of the arrow D3, D4 It is configured. Further, among the second wiring portion 512A of the fifth wiring region 51a _3, the second wiring portion 512A that is electrically connected to one of the control IC30, the second wiring are positioned at both ends in the direction of the arrow D3, D4 The planar view width W _fa3 along the arrow directions D1 and D2 between the side surfaces of the portion 512A is configured to have substantially the same length over the arrow directions D3 and D4. The plan view width W _fa3 of the second wiring portion 512A is configured in comparison with the length W _fH short length of the formation region of the heating element H is connected to the first conductive layer group 51a.

The thermal head X2 is separated from the substrate 10, the plurality of heating elements H arranged on the substrate 10 along the arrow directions D1 and D2, and the substrate 10 spaced apart from the plurality of heating elements H in the arrow directions D3 and D4. And a plurality of first conductive layers 51 electrically connecting a plurality of heating elements H and a plurality of terminals 31 provided in each of the plurality of control ICs 30. A plurality of control ICs 30 arranged along the arrow directions D1 and D2, and the first control IC group 30a and the plurality of heating elements H in the arrow directions D3 and D4. And a second control IC group 30b arranged along the arrow directions D1 and D2, and the plurality of first conductive layers 51 are controlled by the first control IC group 30a. Connected to IC30 The first conductive layer group 51a and the second conductive layer group 51b connected to the control IC 30 of the second control IC group 30b are included, and the first conductive layer group 51a is positioned on the plurality of heating elements H side. to the first wiring region 51a ₁ is, the second wiring region 51a ₂ lying in the control IC30 side of the first wiring region 51a _1, between the first wiring region 51a ₁ and the second wiring region 51a ₂ has a fifth wiring region 51a ₃ which is located, the distance _{W fa1} along the direction of the arrow D1, D2 between the plurality of first conductive layer 51 in the first wiring region 51a ₁ is, heating element H From the side to the control IC 30 side. Therefore, in the thermal head X2, when applied a precursor of the second protective layer 62 in the first wiring region 51a _1, along the direction of the arrow D1, D2 between the first conductive layer 51 in the first wiring region 51a ₁ Due to the fact that the separated distance d _12a is shortened from the heating element H side toward the control IC 30 side, a capillary phenomenon is caused to cause the precursor of the second protective layer 62 to enter the first wiring region 51a ₁ . The first wiring region 51 a ₁ can be satisfactorily covered with the second protective layer 62. Thus, in the thermal head X2, for example, even if the coating amount of the precursor of the second protective layer 62 becomes less than the desired amount, to satisfactorily cover the second protective layer 62 in the first wiring region 51a ₁ it can.

The thermal head X2 is the distance _{d 12b} along the direction of the arrow D1, D2 between the plurality of first conductive layer 51 in the second wiring region 51a ₂ is longer toward the control IC30 side from the heating element H side Yes. Therefore, in the thermal head X2, when applied a precursor of the second protective layer 62 in the first wiring region 51a _1, the second protective layer to be Nobiyo from the first wiring region 51a ₁ to the second wiring region 51a ₂ surface tension work well to precursor 62, the precursor can be reduced to try Nobiyo to the end of the control IC30 side in the second wiring region 51a _2. Thus, in the thermal head X2, for example, even if the coating amount of the precursor of the second protective layer 62 becomes greater than the desired amount, covered by the precursor to the end of the control IC30 side in the second wiring region 51a ₂ Can be reduced satisfactorily.

Further, the thermal head X2 is the distance _{d 12d} along the direction of the arrow D1, D2 between the plurality of first conductive layer 51 in the fifth wiring region 51a ₃ is along the direction of the arrow D1, D2 between a plurality of heat generating elements H The distance d _H is shorter than the distance between the plurality of terminals of the control IC 30 and is substantially the same length from the first wiring area 51a ₁ side to the second wiring area 51a ₂ side. due to the capillary phenomenon occurs from the first wiring region 51a ₁ to the precursor of the second protective layer 62 to be Nobiyo the second wiring region 51a _2, it can be extended the precursor good.

Furthermore, the thermal head X2 is the distance _{d 12b} along the direction of the arrow D1, D2 between the plurality of first conductive layer 51 in the second conductive layer group 51b is longer from the heating element H side to the control IC30 side ing. Therefore, in the thermal head X2, when the precursor of the second protective layer 62 is applied to the second conductive layer group 51b, the precursor of the second protective layer 62 that tends to extend from the heating element H side to the control IC 30 side. The surface tension acts favorably, and the precursor can be prevented from extending to the end on the control IC 30 side in the second conductive layer group 51b.

Therefore, in the thermal head X2, the precursor of the second protective layer 62 can be satisfactorily applied to the first conductive layer group 51a and the second conductive layer group 51b having different lengths. 2 can be satisfactorily covered by the protective layer 62.
<Third Embodiment of Recording Head>
FIG. 9 is a plan view showing a schematic configuration of a thermal head X3 which is an example of a third embodiment of the recording head of the present invention.

  FIG. 10 is a plan view in which the main part of the thermal head X3 shown in FIG. 9 is enlarged and part of the configuration is omitted.

  The thermal head X3 is different from the thermal head X1 in that the third conductive layer 53B is used instead of the third conductive layer 53. Other configurations of the thermal head X3 are the same as those described above with respect to the thermal head X1.

The third conductive layer 53B is in that the fifth wiring portion 532B of the fourth conductive layer group 53b is configured to include a sixth wiring region 53b _3, different from the third conductive layer 53B. Other configurations of the third conductive layer 53B are the same as those described above regarding the third conductive layer 53B.

The sixth wiring region 53b ₃ is located between the third wiring region 53b ₁ and the fourth wiring region 53b ₂ . Fifth wiring portion 532B in the sixth wiring region 53b ₃ is across from the direction of the arrow D1, a plan view width _{W 32d} along the D2 driving IC30 side to the external connection member 70 side (in the direction of the arrow D3, D4) Are configured to have substantially the same length. The planar view width W _32d of the fifth wiring portion 532B is configured to have substantially the same length as the planar view width W _32b at the end of the third wiring region 53b _{1 on} the arrow D4 direction side. The fifth wiring portion 532B in the sixth wiring region 53b _3, as mutual distance _{d 32d} along that direction of the arrow D1, D2 are substantially the same length over the direction of the arrow D3, D4 It is configured. Furthermore, among the fifth wiring portion 532B of the sixth wiring region 53b _3, the fifth wiring part 532B electrically connected to one of the control IC30, the fifth wiring which is located at both ends in the direction of the arrow D3, D4 The planar view width W _fd3 along the arrow directions D1 and D2 between the side surfaces 532Ba of the part 532B is configured to have substantially the same length over the arrow directions D3 and D4. The planar view width W _fd3 of the fifth wiring portion 532B is configured to be shorter than the planar view width W30 of the drive IC ₃₀ connected to the fourth conductive layer group 53b.

The thermal head X3, the third conductive layer 53 in the fourth conductive layer group 53b is, and a sixth wiring region 53b ₃ that is located between the third wiring region 53b ₁ and the fourth wiring region 53b ₂ cage, the distance _{d 32d} along the direction of the arrow D1, D2 between the plurality of third conductive layer 53 in the sixth wiring region 53b ₃ are spaced a distance along the direction of the arrow D1, D2 between the plurality of terminals 31 of the control IC30, and is shorter than the distance between a plurality of terminals for external connection member 70, and due to being substantially the same length from the third wiring region 53b ₁ side over the fourth wiring region 53b ₂ side to, capillary action resulting from the fourth wiring region 53b ₂ to the precursor of the second protective layer 62 to be Nobiyo the third wiring region 53b _1, can extend the precursor good.

Therefore, in the thermal head X3, the precursor of the second protective layer 62 can be satisfactorily applied to the third conductive layer group 53a and the fourth conductive layer group 53b having different lengths. The two protective layers 62 can be better coated.
<Recording device>
FIG. 11 is a diagram showing a schematic configuration of a thermal printer Y which is an example of an embodiment of a recording medium of the present invention.

  The thermal printer Y includes a thermal head X1, a transport mechanism 80, and a control mechanism 90.

  The transport mechanism 80 has a function of bringing the recording medium P into contact with the heating element H of the thermal head X1 while transporting the recording medium P in the direction of the arrow D3. The transport mechanism 80 includes a platen roller 81 and transport rollers 82, 83, 84, and 85. The transport mechanism 80 is configured to slide and transport the recording medium P to the third protective layer 63.

  The platen roller 81 has a function of pressing the recording medium P against the heating element H. The platen roller 81 is rotatably supported in contact with the protective layer 60 located on the heating element H. The platen roller 81 has a configuration in which an outer surface of a columnar base is covered with an elastic member. This base is made of, for example, a metal such as stainless steel, and this elastic member is made of, for example, butadiene rubber having a thickness dimension in the range of 3 [mm] to 15 [mm].

  The transport rollers 82, 83, 84, 85 have a function of transporting the recording medium P. That is, the transport rollers 82, 83, 84, 85 supply the recording medium P between the heating element H of the thermal head X 1 and the platen roller 81, and between the heating element H of the thermal head X 1 and the platen roller 81. It plays a role of pulling out the recording medium P from the recording medium. These transport rollers 82, 83, 84, 85 may be formed of, for example, a metal columnar member, or, for example, have a configuration in which the outer surface of a columnar base is covered with an elastic member, like the platen roller 81. There may be.

  The control mechanism 80 has a function of supplying image information to the control IC 30. That is, the control mechanism 80 plays a role of supplying image information for selectively driving the heat generating element H to the control IC 30 via the external connection member 62.

  The thermal printer Y is characterized by including a thermal head X1. Therefore, the thermal printer Y can enjoy the effects of the thermal head X1. Therefore, the thermal printer Y can be driven stably over a long period of time by reducing the influence of the outside atmosphere by satisfactorily covering the first conductive layer 61 of the thermal head X1 with the second protective layer 62. it can.

  The thermal printer Y includes a thermal head X that is covered with a third protective layer 63 obtained by curing the precursor by the control IC 30 and a transport mechanism 80 that transports the recording medium P. The transport mechanism 80 includes the recording medium. P is slid on the third protective layer 53 and conveyed. Therefore, in the thermal printer Y, the area covered with the third protective layer 53 can be adjusted well and can function well as a guide for the recording medium P.

  While specific embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications can be made without departing from the spirit of the invention.

  In this embodiment, the thermal head X1 is described as an example of the recording head, but the present invention is not limited to the thermal head. Even when the configuration of the present invention is employed in, for example, an inkjet head or an LED head, the same effect can be achieved.

  The first conductive layer 51 of the present embodiment includes the first wiring portion 511 and the third wiring portion 513, but is not limited to such a configuration. For example, the first conductive layer 51 is the second conductive layer 51. A configuration including only the wiring portion 512 may be employed.

  The third conductive layer 51 of the present embodiment is configured to include the fourth wiring portion 531 and the sixth wiring portion 533, but is not limited to such a configuration. For example, the third conductive layer 53 is the second conductive layer 53. A configuration including only the wiring portion 532 may be employed.

  In the second conductive layer 52 of the present embodiment, three or more heating elements H are connected. However, the present invention is not limited to such a structure. For example, the second conductive layer 52 is connected to two heating elements H. You may be comprised so that.

  The first protective layer 61 of the present embodiment is configured separately from the second protective layer 62, but is not limited to such a configuration, and the first protective layer 61 and the second protective layer 62 are integrated. It may be configured.

  The second protective layer 62 and the third protective layer 63 of the present embodiment are formed by curing a precursor having fluidity. However, the present invention is not limited to this, and has fluidity by a solvent, for example. It may be formed by curing a cured precursor.

1 is a plan view showing a schematic configuration of a thermal head which is an example of a first embodiment of a recording head of the present invention. FIG. 2 is an enlarged plan view of a main part of the thermal head shown in FIG. 1. FIG. 2 is a plan view in which a main part of the thermal head shown in FIG. 1 is enlarged and a part of the configuration is omitted. FIG. 4 is a plan view further enlarging a main part of the thermal head shown in FIG. 3. FIG. 4 is a plan view further enlarging a main part of the thermal head shown in FIG. 3. It is sectional drawing along the VI-VI line of FIG. It is a top view which shows schematic structure of the thermal head which is an example of 2nd Embodiment of the recording head of this invention. FIG. 8 is a plan view in which a main part of the thermal head shown in FIG. 7 is enlarged and a part of the configuration is omitted. It is a top view which shows schematic structure of the thermal head which is an example of 3rd Embodiment of the recording head of this invention. It is the top view which expanded the principal part of the thermal head shown in FIG. 9, and abbreviate | omitted one part structure. 1 is a diagram illustrating a schematic configuration of a thermal printer that is an example of an embodiment of a recording medium of the present invention. FIG.

Explanation of symbols

X1, X2, X3 Thermal head Y Thermal printer 10 Substrate 20 Thermal storage layer 30 Control IC (control element)
30a First control IC group (first control element group)
30b Second control IC group (second control element group)
40 Electrical resistor layer 50 Conductive layer 51 First conductive layer (control wiring)
51a 1st conductive layer group 51a _1st wiring area 51a ₂ 2nd wiring area 51b 2nd conductive layer group 511 1st wiring part 512 2nd wiring part 513 3rd wiring part 52 2nd conductive layer 53 3rd conductive layer ( Second control wiring)
53a 3rd conductive layer group 53b 4th conductive layer group 53b ₁ 3rd wiring area 53b ₂ 4th wiring area 531 4th wiring part 532 5th wiring part 533 6th wiring part 60 Protective layer 61 1st protective layer 62 2nd Protective layer 621 First covering portion (protective material)
622 2nd coating | coated part (2nd protective material)
63 3rd protective layer (3rd protective material)
70 External connection member (connector member)
80 Transport Mechanism 81 Platen Rollers 82, 83, 84, 85 Transport Roller 90 Drive Mechanism H Heating Element P Recording Medium

Claims (16)

A substrate, a plurality of heating elements arranged along the main scanning direction on the substrate, and a plurality of control elements arranged on the substrate apart from the plurality of heating elements in the sub-scanning direction; A plurality of control wirings disposed on the substrate and electrically connecting the plurality of heating elements and a plurality of terminals provided in each of the plurality of control elements;
The plurality of control elements are positioned between the first control element group arranged along the main scanning direction and the first control element group and the plurality of heating elements in the sub-scanning direction. And a second control element group arranged along the main scanning direction,
The plurality of control wirings include a first control wiring group connected to control elements of the first control element group, and a second control wiring group connected to control elements of the second control element group. And
The first control wiring group includes a first wiring region located on the plurality of heating element sides, and a second wiring region located on the control element side from the first wiring region. ,
The separation distance along the main scanning direction between the plurality of control wirings in the first wiring region is shortened from the heating element side toward the control element side,
A separation distance along the main scanning direction between the plurality of control wirings in the second wiring region is longer from the heating element side toward the control element side,
The separation distance along the main scanning direction between the plurality of control wirings at the boundary between the first wiring area and the second wiring area is the separation distance along the main scanning direction between the plurality of heating elements and the control. Shorter than the distance between the plurality of terminals of the element,
The separation distance along the main scanning direction between the plurality of control wirings in the second control wiring group is longer from the heating element side toward the control element side,
At least a part of the plurality of control wirings in the first wiring region and a part of the plurality of control wirings in the second control wiring group and a gap between the plurality of control wirings are covered with a protective material obtained by curing the precursor. A recording head. A substrate, a plurality of heating elements arranged along the main scanning direction on the substrate, and a plurality of control elements arranged on the substrate apart from the plurality of heating elements in the sub-scanning direction; A plurality of control wirings disposed on the substrate and electrically connecting the plurality of heating elements and a plurality of terminals provided in each of the plurality of control elements;
The plurality of control elements are positioned between the first control element group arranged along the main scanning direction and the first control element group and the plurality of heating elements in the sub-scanning direction. And a second control element group arranged along the main scanning direction,
The plurality of control wirings include a first control wiring group connected to control elements of the first control element group, and a second control wiring group connected to control elements of the second control element group. And
The first control wiring group includes a first wiring area located on the plurality of heating element sides, a second wiring area located on the control element side from the first wiring area, and the first wiring And a third wiring region located between the region and the second wiring region,
The separation distance along the main scanning direction between the plurality of control wirings in the first wiring region is shortened from the heating element side toward the control element side,
A separation distance along the main scanning direction between the plurality of control wirings in the second wiring region is longer from the heating element side toward the control element side,
The separation distance along the main scanning direction between the plurality of control wirings in the third wiring region is the separation distance along the main scanning direction between the plurality of heating elements and the separation between the plurality of terminals of the control element. It is shorter than the distance, and is substantially the same length from the first wiring region side to the second wiring region side,
The separation distance along the main scanning direction between the plurality of control wirings in the second control wiring group is longer from the heating element side toward the control element side,
At least a part of the plurality of control wirings in the first wiring region and a part of the plurality of control wirings in the second control wiring group and a gap between the plurality of control wirings are covered with a protective material obtained by curing the precursor. A recording head. A connector member that is disposed on the substrate and receives input signals to the plurality of control elements, and a plurality of terminals of the control element and the connector member that are disposed on the substrate. And a plurality of second control wirings electrically connecting the plurality of terminals,
The plurality of second control wirings include a third control wiring group connected to the control elements of the first control element group and a fourth control wiring group connected to the control elements of the second control element group. And
The separation distance along the main scanning direction between the plurality of second control wirings in the third control wiring group is longer from the connector member side toward the control element side,
The fourth control wiring group has a fourth wiring region located on the connector member side, and a fifth wiring region located on the control element side from the fourth wiring region,
The separation distance along the main scanning direction between the plurality of second control wirings in the fourth wiring region is shortened from the connector member side toward the control element side,
The separation distance along the main scanning direction between the plurality of second control wirings in the fifth wiring region is longer from the connector member side toward the control element side,
The separation distance along the main scanning direction between the plurality of second control wirings at the boundary between the fourth wiring region and the fifth wiring region is in the main scanning direction between the plurality of terminals of the control element. It is shorter than the separation distance along and the separation distance between the plurality of terminals of the connector member,
At least a part of the plurality of control wirings in the third control wiring group and the plurality of second control wirings in the fourth wiring region and the gaps between the plurality of second control wirings are cured precursors. The recording head according to claim 1, wherein the recording head is covered with a second protective material. A connector member that is disposed on the substrate and receives input signals to the plurality of control elements, and a plurality of terminals of the control element and the connector member that are disposed on the substrate. And a plurality of second control wirings electrically connecting the plurality of terminals,
The plurality of second control wirings include a third control wiring group connected to the control elements of the first control element group and a fourth control wiring group connected to the control elements of the second control element group. And
The separation distance along the main scanning direction between the plurality of second control wirings in the third control wiring group is longer from the connector member side toward the control element side,
The fourth control wiring group includes a fourth wiring area located on the connector member side, a fifth wiring area located closer to the control element than the fourth wiring area, the fourth wiring area, A sixth wiring region located between the fifth wiring regions;
The separation distance along the main scanning direction between the plurality of second control wirings in the fourth wiring region is shortened from the connector member side toward the control element side,
The separation distance along the main scanning direction between the plurality of second control wirings in the fifth wiring region is longer from the connector member side toward the control element side,
The separation distance along the main scanning direction between the plurality of second control wirings in the sixth wiring region is the separation distance along the main scanning direction between the plurality of terminals of the control element and the connector member. It is shorter than the separation distance between the plurality of terminals, and is substantially the same length from the fourth wiring region side to the fifth wiring region side,
At least a part of the plurality of control wirings in the third control wiring group and the plurality of second control wirings in the fourth wiring region and the gaps between the plurality of second control wirings are cured precursors. The recording head according to claim 1, wherein the recording head is covered with a second protective material.   The width along the main scanning direction between the second control wirings located on the outermost side among the plurality of second control wirings in the fourth wiring region is from the connector member side to the control element side. The recording head according to claim 3, wherein the recording head is shortened.   6. The width along the main scanning direction of each of the plurality of second control wirings in the fourth wiring region is shortened from the connector member side toward the control element side. The recording head described in 1.   7. The recording head according to claim 3, wherein an end of the fourth wiring region on the control element side is located between the control elements in the second control element group.   The width along the main scanning direction between the second control wirings located on the outermost side among the plurality of second control wirings in the fifth wiring region is from the connector member side to the control element side. The recording head according to claim 3, wherein the recording head is long.   A width along the main scanning direction between the control wirings located on the outermost side among the plurality of control wirings in the first wiring region is shortened from the heating element side toward the control element side. The recording head according to claim 1, wherein:   The width along the main scanning direction of each of the plurality of control wirings in the first wiring region is shorter from the heating element side toward the control element side. Recording head.   11. The recording head according to claim 1, wherein an end of the first wiring region on the control element side is located between the plurality of control elements in the second control element group. .   A width along the main scanning direction between the control wirings located on the outermost side among the plurality of control wirings in the second wiring region is longer from the heating element side toward the control element side. The recording head according to claim 1, wherein:   The width along the main scanning direction of each of the plurality of control wirings in the second wiring region is longer from the heating element side toward the control element side. Recording head.   The length of the control element along the main scanning direction is longer than the width along the main scanning direction of the arrangement region of the plurality of heating elements controlled by the control element. Item 14. The recording head according to any one of Items 1 to 13. The control element is covered with a third protective material obtained by curing the precursor,
The recording head according to claim 1, wherein a peripheral end portion of the third protective material is located on the protective material.   16. A recording apparatus comprising: the recording head according to claim 1; and a transport mechanism that transports a recording medium.

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