JP2010103735A - Method for manufacturing microphone - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To effectively suppress an adverse effect on a microphone function due to pressing during adhesive fixing while sufficiently securing adhesive strength between substrates in a method for manufacturing microphones each of which has a multilayered casing structure. <P>SOLUTION: When manufacturing microphones by dividing a microphone aggregate 110 into a plurality of microphones, a top substrate aggregate 124 and a bottom substrate aggregate 126 are respectively abutted on both upper and lower surfaces of a body substrate aggregate 122 in a state that adhesive sheet aggregates 154, 156 are respectively arranged on first and second adhesive areas 124a, 126a and pressed from both the upper and lower sides by first and second pressing plates 164, 166 to perform adhesive fixing. In this case, projection portions 164a to be abutted on connection positions between respective top substrates 24 on the upper surface of the top substrate aggregate 124 during the pressing are previously formed on positions opposed to the first adhesive areas 124a on the lower surface of the first pressing plate 164. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method of manufacturing a microphone having a so-called laminated housing structure.

  Conventionally, as described in, for example, “Patent Document 1” as a configuration of a microphone, the inside of a housing in which a top substrate and a bottom substrate are bonded and fixed to both upper and lower surfaces of an annular body substrate, respectively. In addition, it is known that a microphone element is accommodated in a state where the electronic component is mounted on a bottom substrate.

  As a method of manufacturing a microphone having such a stacked housing structure, a body substrate assembly in which a plurality of body substrates are arranged in a connected state as described in the above “Patent Document 1”. A microphone assembly is obtained by bonding and fixing a top substrate assembly in which a plurality of top substrates are arranged in a connected state and a bottom substrate assembly in which a plurality of bottom substrates are arranged in a connected state on both upper and lower surfaces of the body. A method of dividing the microphone assembly into a plurality of microphones after forming the body is known.

JP 2008-141289 A

  In the microphone manufacturing method, a first bonding region for bonding and fixing the top substrate assembly and the body substrate assembly is formed at a connection position between the top substrates on the lower surface of the top substrate assembly. In addition, a second bonding region for bonding and fixing the bottom substrate assembly and the body substrate assembly is formed at a connection position between the bottom substrates on the upper surface of the bottom substrate assembly. With the adhesive such as an adhesive sheet disposed in each of the first and second adhesive regions, the top substrate assembly and the bottom substrate assembly are brought into contact with the upper and lower surfaces of the body substrate assembly, respectively. The adhesive is fixed by pressing from above.

  This pressing is performed by pressing the first and second pressing plates from both the upper and lower sides against the top substrate assembly and the bottom substrate assembly, respectively. In many cases, a coating layer such as a conductive layer or an insulating layer is formed on the top surface of the top substrate and the bottom surface of the bottom substrate, which causes the following problems.

  That is, since the conventional first and second pressing plates are both constituted by a flat plate, the first pressing plate has a top surface on the top surface of the top substrate assembly. The second pressing plate is in contact with the coating layer formed at a position corresponding to each bottom substrate on the lower surface of the bottom substrate assembly, and the second pressing plate is in contact with the coating layer formed at a position corresponding to the substrate. Become. As a result, the top substrate assembly is deformed so that the portion located at the center of each top substrate bends downward, and the bottom substrate assembly is deformed so that the portion located at the center of each bottom substrate faces upward. Will be deformed as if bent.

  For this reason, there is a problem that the pressure against each of the first and second adhesion regions is insufficient, and the adhesion strength between the substrates cannot be sufficiently secured. In addition, the microphone manufactured in this way has a problem that the desired frequency characteristic cannot be obtained because the volume of the space in the housing is smaller than the design value.

  In particular, the deformation of the portion located on each top substrate in the top substrate assembly is likely to adversely affect the microphone function. That is, since the electronic component of the microphone element is mounted on the bottom substrate, the vibration film is disposed in the vicinity of the top substrate. For this reason, if the portion of the top substrate assembly located in the center of each top substrate is deformed so that it bends downward, the top substrate comes into contact with the vibrating membrane or an unnecessary load is applied to the vibrating membrane. The microphone function will be adversely affected.

  The present invention has been made in view of such circumstances, and in a method of manufacturing a microphone having a laminated housing structure, the adhesive strength between the substrates is sufficiently secured, and the pressing at the time of adhesion fixing An object of the present invention is to provide a method of manufacturing a microphone that can effectively suppress the adverse effects on the microphone function caused by the above.

  The present invention is intended to achieve the above object by devising the configuration of the pressing plate.

That is, the microphone manufacturing method according to the present invention is as follows.
The microphone element is housed in a state where the top substrate and the bottom substrate are bonded and fixed to the upper and lower surfaces of the body substrate formed in an annular shape, with the electronic components of the microphone element mounted on the bottom substrate. A method of manufacturing a microphone comprising:
A top substrate assembly in which a plurality of top substrates are arranged in a connected state and a plurality of bottom substrates are arranged in a connected state on both upper and lower surfaces of a body substrate assembly in which the plurality of body substrates are arranged in a connected state. In the method of manufacturing the microphone, the microphone assembly is formed by bonding and fixing the bottom substrate assembly formed, and then dividing the microphone assembly into a plurality of parts.
A first bonding region for bonding and fixing the top substrate assembly and the body substrate assembly is formed at a connection position between the top substrates on the lower surface of the top substrate assembly. A second bonding region for bonding and fixing the bottom substrate assembly and the body substrate assembly is formed at a connection position between the bottom substrates on the upper surface of the bottom substrate assembly. And with the adhesive disposed in each of the second bonding regions, the top substrate assembly and the bottom substrate assembly are brought into contact with the upper and lower surfaces of the body substrate assembly and pressed from both the upper and lower sides. , Perform the above-mentioned adhesive fixing,
At that time, by pressing the first and second pressing plates from the upper and lower sides against the top substrate assembly and the bottom substrate assembly, respectively, the pressing is performed,
And the protrusion part which contact | abuts the connection position between each said top board | substrates in the upper surface of the said top board | substrate assembly in the position which opposes the said 1st adhesion area | region in the lower surface of the said 1st press board at the time of the said press. Is formed in advance.

  In the above configuration, the term indicating the directionality such as “up and down” is used for the sake of convenience in order to clarify the positional relationship between the respective members constituting the microphone, and as a result, when the microphone is actually used. The directionality is not limited.

  The “microphone element” is not particularly limited as long as the electronic component has a configuration in which the electronic component is mounted on the bottom substrate.

  The “microphone assembly” has a configuration in which a plurality of microphones are arranged in a connected state, but the number of these microphones and the specific arrangement thereof are not particularly limited.

  If the “projection part” is configured to come into contact with a connection position between the top substrates on the top surface of the top substrate assembly at the time of pressing, at a position facing the first adhesion region. The specific configuration such as the height and width is not particularly limited.

  As shown in the above configuration, the microphone manufacturing method according to the present invention is to manufacture a microphone having a stacked housing structure by forming a microphone assembly and then dividing the microphone assembly into a plurality of parts. The top substrate assembly and the bottom substrate assembly are brought into contact with the upper and lower surfaces of the body substrate assembly in a state where the adhesive is disposed in each of the first and second adhesion regions, By pressing with the first and second pressing plates from both the upper and lower sides, the bonding and fixing are performed. At that time, at the position facing the first bonding region on the lower surface of the first pressing plate. Since the protrusions that contact the connecting positions between the top substrates on the top surface of the top substrate assembly are formed at the time of the pressing, the following operational effects can be obtained. Kill.

  That is, when the first pressing plate is pressed against the top substrate assembly, the protrusion is brought into contact with the connection position between the top substrates on the upper surface of the top substrate assembly, so that The pressing can be performed appropriately. As a result, the adhesive strength between the top substrate assembly and the body substrate assembly can be sufficiently ensured.

  Further, by bringing the protrusions of the first pressing plate into contact with the connecting positions between the top substrates in this way, the first pressing plate is formed at a position corresponding to each top substrate as in the prior art. It is possible to prevent the occurrence of a situation in which the portion located at the center of each top substrate is deformed so as to bend downwards in contact with the covering layer. As a result, it is possible to prevent the top substrate from coming into contact with the vibration film or applying unnecessary load to the vibration film, thereby adversely affecting the microphone function. Furthermore, by preventing the occurrence of such deformation, the volume of the space in the microphone housing can be maintained at a value close to the design value, so that it is possible to ensure the intended frequency characteristics. .

  As described above, according to the present invention, in the method of manufacturing a microphone having a laminated housing structure, the adhesive strength between the substrates is sufficiently ensured, and the adverse effect on the microphone function due to the pressing at the time of bonding and fixing is effective. Can be suppressed.

  In addition, when the adhesive fixing is performed by pressing while heating the adhesive, the first pressing plate is pressed in a heated state. The heat of the pressing plate can be efficiently transmitted from the protruding portion to the adhesive disposed in the first bonding region via the top substrate assembly.

  In the above configuration, the covering layer that contacts the protrusions of the first pressing plate at the time of pressing is surrounded at substantially the entire circumference at the connection position between the top substrates on the upper surface of the top substrate assembly. If formed in such a manner, the following effects can be obtained.

  That is, even when the first pressing plate is not pressed in a state where the first pressing plate is accurately positioned with respect to the microphone assembly at the time of the adhesive fixing, the protruding portion is formed at the connecting position between the top substrates. Therefore, it is possible to reliably press the adhesive disposed in the first adhesive region.

  In the above configuration, a protrusion is formed at the position facing the second adhesive region on the upper surface of the second pressing plate, and abuts against the connecting position between the bottom substrates on the lower surface of the bottom substrate assembly during the pressing. By doing so, the following effects can be obtained.

  That is, when the second pressing plate is pressed against the bottom substrate assembly, the protrusion is brought into contact with the connection position between the bottom substrates on the lower surface of the bottom substrate assembly, so that The pressing can be performed appropriately. As a result, the adhesive strength between the bottom substrate assembly and the body substrate assembly can be sufficiently secured.

  In addition, as described above, the second pressing plate is formed at a position corresponding to each bottom substrate by bringing the protrusion of the second pressing plate into contact with the connection position between the bottom substrates in this manner. It is possible to prevent the occurrence of a situation in which the portion located at the center of each bottom substrate is deformed so as to bend upward in contact with the covering layer. As a result, it is possible to prevent the occurrence of a problem that a load is applied to the electronic component mounted on the bottom substrate and the soldering fixing part is detached from the bottom substrate. It can be improved significantly. Furthermore, by preventing the occurrence of such deformation, the volume of the space in the microphone housing can be maintained at a value closer to the design value, so it is more reliable to ensure the desired frequency characteristics. It becomes possible.

  In this case, a coating layer that abuts against the protruding portion of the second pressing plate during the pressing is surrounded at a connecting position between the bottom substrates on the lower surface of the bottom substrate assembly over substantially the entire circumference. If formed in such a manner, the following effects can be obtained.

  That is, even when the second pressing plate is not pressed in a state where the second pressing plate is accurately positioned with respect to the microphone assembly at the time of the adhesive fixing, the protruding portion is formed at the connection position between the bottom substrates. Therefore, it is possible to reliably press the adhesive disposed in the second adhesive region.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view showing a microphone 10 that is an object of a manufacturing method according to an embodiment of the present invention, in which FIG. 1 (a) is a diagram showing the state of being placed upward, and FIG. 1 (b) is downward. It is a figure shown in the state arrange | positioned. FIG. 2 is a perspective view showing the microphone 10 in the state shown in FIG. 3 is a cross-sectional view taken along line III-III in FIG.

  As shown in these drawings, the microphone 10 that is the object of the manufacturing method according to the present embodiment is a small electret condenser microphone having a rectangular outer shape of about 3 × 4 mm in a plan view, and is a laminated housing. It has a body structure. That is, the microphone 10 has a configuration in which a microphone element 30 is accommodated in a housing 20 having a substantially rectangular parallelepiped outer shape.

  The casing 20 has a configuration in which a rectangular top substrate 24 and a rectangular bottom substrate 26 are bonded and fixed to upper and lower surfaces of a body substrate 22 formed in a substantially rectangular ring shape. The microphone 10 is surface-mounted on an external substrate (not shown) on the lower surface of the bottom substrate 26 of the housing 20.

  The microphone element 30 includes a capacitor structure portion 32, an IC chip 34 as an electronic component, and a contact spring 36. The IC chip 34 is mounted on the bottom substrate 26.

  The capacitor structure portion 32 includes a diaphragm subassembly 42 and a back electrode plate 44.

  The vibrating membrane subassembly 42 has a vibrating membrane 42A stretched and fixed on the upper surface of a metal support ring 42B formed in a substantially rectangular ring shape, and the vibrating membrane 42A has a high height with a metal vapor deposition film formed on the upper surface. Consists of molecular film. Projection pieces 42 a are respectively formed at the center positions of the respective sides on the outer peripheral surface of the vibration membrane subassembly 42.

  The back electrode plate 44 includes a metal electrode plate main body 44A and an electret layer 44B thermally fused to the upper surface of the electrode plate main body 44A, and a predetermined surface potential is applied to the electret layer 44B by polarization treatment. Has been. The outer diameter of the back electrode plate 44 is set to a value slightly larger than the inner diameter of the support ring 42B. A through-hole 44 a that penetrates the back electrode plate 44 in the vertical direction is formed at the center of the back electrode plate 44.

  In this capacitor structure portion 32, the diaphragm 42A of the diaphragm subassembly 42 and the electret layer 44B of the back electrode plate 44 are spaced at a predetermined minute distance via the support ring 42B of the diaphragm subassembly 42. Thus, a predetermined potential difference is generated between the vibrating membrane 42A and the electret layer 44B.

  The bottom substrate 26 covers the insulating substrate 26A, the conductive layers 26B1, 26B2, and 26B3 formed on the lower surface of the insulating substrate 26A, and the lower surfaces of the conductive layers 26B1, 26B2, and 26B3 so as to cover them in a square shape. And an insulating layer 26C formed on the insulating substrate 26A and conductive layers 26D1, 26D2, 26D3, and 26D4 formed on the upper surface of the insulating substrate 26A. The IC chip 34 is mounted on the bottom substrate 26 at the center of the upper surface.

  At that time, the conductive layer 26B1 constitutes a power supply terminal, the conductive layer 26B2 constitutes an output terminal, and the conductive layer 26B3 constitutes a ground terminal. The conductive layer 26B1 is electrically connected to the conductive layer 26D1 formed on the upper surface of the insulating substrate 26A through a through hole (not shown). The conductive layer 26D1 is electrically connected to a power supply terminal (not shown) of the IC chip 34. is doing. The conductive layer 26B2 is electrically connected to a conductive layer 26D2 formed on the upper surface of the insulating substrate 26A through a through hole (not shown), and is electrically connected to an output terminal (not shown) of the IC chip 34 in the conductive layer 26D2. is doing. Further, the conductive layer 26B3 is electrically connected to a conductive layer 26D3 formed on the upper surface of the insulating substrate 26A through a through hole (not shown). The conductive layer 26D3 is electrically connected to a ground terminal (not shown) of the IC chip 34. is doing.

  The body substrate 22 has the same outer shape as the bottom substrate 26 in plan view, and is mounted and fixed on the bottom substrate 26 so as to surround the IC chip 34. This mounting and fixing is performed via an adhesive sheet 56 as an adhesive. The adhesive sheet 56 will be described later.

  The body substrate 22 includes an insulating substrate 22A having an opening 22a formed with a slightly larger inner diameter than the back electrode plate 44, and conductive layers 22B and 22C formed on the upper and lower surfaces of the insulating substrate 22A, respectively. ing. At this time, the conductive layers 22B and 22C are electrically connected to each other through the through hole 22D.

  The through hole 22 </ b> D is formed over substantially the entire peripheral area excluding the four corners of the body substrate 22. At this time, the through holes 22D formed in the side wall portions of these sides are formed in a substantially semi-long cylindrical shape.

  The insulating substrate 22A has a general portion made of a glass cloth base epoxy resin, but a portion 22A1 located on the outer peripheral side of the through hole 22D is made of an epoxy resin. The four through holes 22D and the portion 22A1 located on the outer peripheral side thereof have an upper surface that is one step higher than the upper surface of the general portion of the insulating substrate 22A by the same thickness as the conductive layer 22B. The lower surface is one step lower than the lower surface of the general portion of the insulating substrate 22A by the same amount as the thickness of the conductive layer 22C.

  The top substrate 24 is placed and fixed on the body substrate 22 via the diaphragm subassembly 42. This mounting and fixing is performed via an adhesive sheet 54 as an adhesive. This adhesive sheet 54 will also be described later.

  The top substrate 24 includes an insulating substrate 24A having the same outer shape as the bottom substrate 26 in plan view, a conductive layer 24B formed in a rectangular ring shape on the lower surface of the insulating substrate 24A, and a substantially entire surface on the upper surface of the insulating substrate 24A. The conductive layer 24C is formed over the conductive layer 24C. At this time, each of the conductive layers 24B and 24C has an outer shape that is slightly smaller than the outer peripheral shape of the insulating substrate 24A. However, as for the conductive layer 24B, a protrusion 24Ba extending to the outer peripheral surface of the insulating substrate 24A is formed at the center position of each side on the outer periphery.

  The conductive layers 24 </ b> B and 24 </ b> C are electrically connected to each other through through holes 24 </ b> D formed at the four corners of the top substrate 24. As a result, the metal vapor deposition film of the vibration film 42A is electrically connected to the conductive layer 24C located on the upper surface of the top substrate 24, and the conductive layer 24C can also be electrically connected to the ground terminal of the external substrate.

  A sound hole 24 a penetrating the top substrate 24 in the vertical direction is formed at a position slightly off the center of the top substrate 24.

  The contact spring 36 is formed with a pair of projecting pieces protruding in parallel with each other at each corner portion of the frame portion formed in a square shape in plan view, and each pair of projecting pieces at two locations on the frame portion. In addition, it is composed of a metal leaf spring formed so as to be bent downward.

  The contact spring 36 is disposed in a state where the contact spring 36 is bent to some extent so as to surround the IC chip 34 in the frame portion. At this time, the contact spring 36 contacts the lower surface of the electrode plate main body 44A of the back electrode plate 44 at the frame portion, and contacts the four conductive layers 26D4 of the insulating substrate 26A at the four protruding pieces. Yes. The electrode plate main body 44A of the back electrode plate 44 and the input terminal (not shown) of the IC chip 34 are electrically connected via the contact spring 36 and the conductive layer 26D4.

  In the electret condenser microphone 10 according to the present embodiment, an impedance conversion element for converting the capacitance of the capacitor structure portion 32 into electrical impedance is incorporated in the IC chip 34 as an impedance conversion circuit.

  The adhesive sheet 54 is formed in a substantially rectangular ring shape with a substantially constant width in plan view, and the outer peripheral edge shape thereof coincides with the outer peripheral shape of the housing 20, and the inner peripheral edge shape is an insulating property in the top substrate 24. This substantially matches the outer peripheral shape of the conductive layer 24B formed on the lower surface of the substrate 24A. That is, the adhesive sheet 54 is disposed in a rectangular annular space formed on the outer peripheral side of the conductive layer 24B on the lower surface side of the insulating substrate 24A of the top substrate 24 and the diaphragm subassembly 42 laminated thereon. It has become.

  However, on the upper surface of the adhesive sheet 54, a two-step recess 54a is formed at the center of each side. Further, on the lower surface of the adhesive sheet 54, an overflow portion 54b is formed at each corner portion.

  At that time, each of the two-step recesses 54a is formed by the adhesive sheet 54 disposed in the space when the adhesive is fixed. The protrusions 42a of the vibration membrane subassembly 42 and the protrusions of the conductive layer 24B of the top substrate 24 are formed. It is formed by being pressed by the portion 24Ba. In addition, each overflow portion 54b has the adhesive sheet 54 disposed in the space portion lowered by one step on the upper surface of the insulating substrate 22A of the body substrate 22 by the thickness of the conductive layer 22B during the adhesive fixing. It is formed by overflowing into each corner.

  On the other hand, the adhesive sheet 56 is formed in a substantially rectangular ring shape with a substantially constant width in plan view, and the outer peripheral edge shape thereof coincides with the outer peripheral shape of the housing 20, and the inner peripheral edge shape thereof is the bottom substrate 26. The outer peripheral edge shape of the conductive layer 26D3 formed on the upper surface of the insulating substrate 26A in FIG. That is, the adhesive sheet 56 is arranged in a rectangular annular space formed on the outer peripheral side of the conductive layer 26D3 on the upper surface side of the insulating substrate 26A in the bottom substrate 26.

  However, an overflow portion 56 a is formed on the upper surface of the adhesive sheet 56 at each corner portion. In each of the overflow portions 56a, the adhesive sheet 56 disposed in the space portion is raised by one step on the lower surface of the insulating substrate 22A of the body substrate 22 by the thickness of the conductive layer 22C during the bonding and fixing. It is formed by overflowing into each corner.

  Next, a method for manufacturing the microphone 10 according to the present embodiment will be described.

  FIG. 4 is a perspective view showing a manufacturing process of the microphone 10.

  As shown in FIG. 5F, after forming the microphone assembly 110, the microphone 10 divides the microphone assembly 110 into a plurality (specifically, twelve) along the broken line. It is designed to be manufactured upside down.

  The microphone assembly 110 is manufactured by the following process.

  First, as shown in FIG. 4A, the bottom surface (an “upper surface” in the figure, the same applies hereinafter) of a rectangular diaphragm assembly 142A in which twelve diaphragms 42A are connected in a connected state, A diaphragm subassembly assembly in which twelve diaphragm subassemblies 42 are arranged in a connected state by tensioning and fixing a support ring assembly 142B in which the support rings 42B are arranged in a connected state. 142 (see FIG. 4B) is manufactured.

  Next, as shown in FIG. 4B, the diaphragm subassembly assembly 142 is laminated on the lower surface of the top substrate assembly 124 in which twelve top substrates 24 are arranged in a connected state.

  Next, as shown in FIG. 5C, a body in which twelve body substrates 22 are connected to the top substrate assembly 124 and the diaphragm subassembly assembly 142 in the stacked state. The substrate assembly 122 is laminated on the lower surface of the diaphragm subassembly assembly 142 via the adhesive sheet assembly 154.

  Next, as shown in FIG. 4D, the body substrate is applied to the top substrate assembly 124, the diaphragm subassembly assembly 142, the adhesive sheet assembly 154, and the body substrate assembly 122 in the laminated state. The back electrode plate 44 and the contact spring 36 are set upside down in the opening 22a of each body substrate 22 in the assembly 122.

  Next, as shown in FIG. 5E, the top substrate assembly 124, the diaphragm subassembly assembly 142, the adhesive sheet assembly 154, and the twelve back electrode plates 44 and the contact spring 36 are set. A bottom substrate assembly 126 in which twelve bottom substrates 26 are connected to the body substrate assembly 122 is laminated on the lower surface of the body substrate assembly 122 via an adhesive sheet assembly 156. .

  Finally, as shown in FIG. 5F, in a state where all the members constituting the microphone assembly 110 are stacked, they are pressed from both the upper and lower sides. This pressing is performed using a pair of pressing plates (not shown) (which will be described later). At this time, each of these pressing plates is heated in advance, and the heat is transmitted to the adhesive sheet assemblies 154 and 156 via the top substrate assembly 124 and the bottom substrate assembly 126, respectively, during the pressing. . As a result, the top substrate assembly 124 and the bottom substrate assembly 126 are bonded and fixed to the upper and lower surfaces of the body substrate assembly 122 to complete the microphone assembly 110. Then, twelve microphones 10 are taken out by dividing the microphone aggregate 110 along the broken line.

  As shown in FIG. 4C, the body substrate assembly 122 is provided at four locations around the opening 22a of each body substrate 22 in the insulating substrate assembly 122A in which twelve insulating substrates 22A are arranged in a connected state. In the plan view, a substantially oval through hole 122D is formed, and the inside of each through hole 122D is configured as a resin filling portion 122A1 filled with an epoxy resin.

  In addition, a conductive layer 22C is formed at the position of each body substrate 22 on the lower surface of the insulating substrate assembly 122A so as to surround the opening 22a and to be inscribed in the four through holes 122D around the opening 22a. ing.

  FIG. 5A is a plan view showing a part of the microphone assembly 110 shown in FIG. 4F turned upside down (that is, in a state of being placed upward). FIG. 2B is a diagram showing a conventional example in contrast to this.

  As shown in FIG. 6A, the microphone assembly 110 is divided into a plurality of microphones 10 by dividing the position indicated by the broken line in the drawing as a boundary line, but finally the size is slightly smaller than this. (The size indicated by the two-dot chain line in the figure).

  A coating layer 124 </ b> E is formed on the upper surface of the top substrate assembly 124 so as to surround each top substrate 24 over substantially the entire circumference at a connection position between the top substrates 24. At this time, the coating layer 124E is formed with a metal foil such as a copper foil at the same thickness as the conductive layer 24C when the conductive layer 24C is formed on the upper surface of the insulating substrate 24A in each top substrate 24. It is supposed to be formed.

  In this covering layer 124E, the corners around each top substrate 24 are formed in a circular shape in plan view, and the portions adjacent to the four sides around each top substrate 24 are slightly from each corner. It is formed in an oblong narrow band shape in plan view so as to be separated from each other. Note that the coating layer 124E does not remain as a part of the microphone 10 in the end.

  Fig.6 (a) is a figure which shows the process of the adhesion fixing shown in FIG.4 (f) as a sectional side view. FIG. 2B is a diagram showing a conventional example in contrast to this. FIG. 7 is a detailed view of a portion VII in FIG.

  As shown in these drawings, the first bonding for bonding and fixing the top substrate assembly 124 and the body substrate assembly 122 is performed at the connection position between the top substrates 24 on the lower surface of the top substrate assembly 124. Region 124a is formed. At this time, as the first adhesion region 124a, a concave portion formed between the conductive layers 24B formed at positions corresponding to the top substrates 24 is used.

  Since the diaphragm subassembly assembly 142 is interposed between the top substrate assembly 124 and the body substrate assembly 122, the first adhesion region 124a is a support ring for the diaphragm subassembly assembly 142. The punched holes formed at the connecting positions between the support rings 42B in the assembly 142B are deeper than the conductive layer 24B by the thickness of the support ring assembly 142B.

  On the other hand, a second bonding region 126a for bonding and fixing the bottom substrate assembly 126 and the body substrate assembly 122 is formed at a connection position between the bottom substrates 26 on the upper surface of the bottom substrate assembly 126. Yes. At this time, as the second adhesion region 126a, a recess formed between the conductive layers 26D3 formed at a position corresponding to each bottom substrate 26 is used.

  Further, as shown in these drawings, the pressure from both the upper and lower sides to the microphone assembly 110 performed at the time of the adhesive fixing is applied to the top substrate assembly 124 and the bottom substrate assembly 126 on both the upper and lower sides. The first and second pressing plates 164 and 166 are pressed against each other. At this time, by heating these first and second pressing plates 164 and 166 in advance, the adhesive sheet aggregates 254 and 156 are pressed while being heated.

  The first pressing plate 164 has a protrusion that is in contact with a connection position between the top substrates 24 on the upper surface of the top substrate assembly 124 at the position facing the first adhesive region 124a on the lower surface of the first pressing plate 164. A portion 164a is formed.

  The protrusions 164a are formed in a lattice shape so as to surround the conductive layer 24C of each top substrate 24. At this time, the width of the lattice-like portion in the protrusion 164a is set to a value slightly narrower than the interval between the conductive layers 24C, and the height is set to a value slightly larger than the thickness of the conductive layer 24C. Has been.

  On the other hand, the second pressing plate 166 has a position facing the second bonding region 126a on the upper surface thereof and a position where the bottom substrates 26 are connected to each other on the lower surface of the bottom substrate assembly 126 during the pressing. A projecting portion 166a is formed in contact therewith.

  The protrusions 166a are formed in a lattice shape so as to surround the conductive layer 26C of each bottom substrate 26. At this time, the width of the lattice-like portion in the protrusion 166a is set to a value slightly narrower than the interval between the conductive layers 26B3, and the height thereof is the thickness of the conductive layers 26B1, 26B2, and 26B3 (whichever And the thickness of the insulating layer 26C (that is, the total thickness of the coating layers formed at positions corresponding to the bottom substrates 26 on the lower surface of the bottom substrate assembly 126). It is set to a high value.

  As described above in detail, in the method of manufacturing the microphone 10 according to the present embodiment, the microphone assembly 110 is formed and then divided into twelve, thereby manufacturing the microphone 10 having a stacked housing structure. In the state where the adhesive sheet aggregates 154 and 156 are disposed in the first and second adhesive regions 124a and 126a, the top substrate aggregates are formed on both upper and lower surfaces of the body substrate aggregate 122. 124 and the bottom substrate assembly 126 are brought into contact with each other and pressed by the first and second pressing plates 164 and 166 from both the upper and lower sides thereof. Each position on the upper surface of the top substrate assembly 124 at the time of the pressing is placed at a position facing the first adhesive region 124a on the lower surface of the first pressing plate 164. Since Tsu so that the previously formed protrusions 164a abutting the connecting position between the flop substrate 24 each other, it is possible to obtain the following effects.

  That is, as shown in FIG. 6B, when the above-described pressing is performed using the conventional first pressing plate 164 ′ in which such a protrusion 164a is not formed, the first Since the pressing plate 164 'comes into contact with the conductive layer 24C formed on the upper surface of the top substrate assembly 124', the portion located at the center of the top substrate 24 in each microphone 10 is deformed so as to bend downward. Will end up. For this reason, the pressure against the first bonding region 124a becomes insufficient, and the bonding strength between the top substrate assembly 124 ′ and the body substrate assembly 122 cannot be sufficiently ensured.

  On the other hand, in the present embodiment, when the first pressing plate 164 is pressed against the top substrate assembly 124, the projection 164 a is a connecting position between the top substrates 24 on the upper surface of the top substrate assembly 124. Therefore, it is possible to appropriately press the first adhesive region 124a. As a result, the adhesive strength between the top substrate assembly 124 and the body substrate assembly 122 can be sufficiently secured.

  In addition, the projection 164a of the first pressing plate 164 is brought into contact with the connection position between the top substrates 24 in this way, so that the portion located at the center of each top substrate 24 is deformed so as to bend downward. Therefore, the top substrate 24 comes into contact with the vibration film 42A or an unnecessary load is applied to the vibration film 42A, thereby adversely affecting the microphone function. Can be prevented in advance.

  Furthermore, by preventing the occurrence of such deformation, the volume of the space in the housing 20 of the microphone 10 can be maintained at a value close to the design value, so that an intended frequency characteristic can be ensured. It becomes possible.

  As described above, according to the present embodiment, in the method of manufacturing the microphone 10 having the laminated housing structure, the adhesive strength between the substrates is sufficiently secured, and the adverse effect on the microphone function due to the pressing at the time of adhesion fixing is achieved. It can be effectively suppressed.

  In addition, in the present embodiment, the covering layer 124E that contacts the protruding portion 164a of the first pressing plate 164 at the time of the pressing is provided at the connecting position between the top substrates 24 on the upper surface of the top substrate assembly 124. Since the top substrate 24 is formed so as to surround substantially the entire circumference, the following effects can be obtained.

  That is, even when the first pressing plate 164 is not pressed in a state where the first pressing plate 164 is accurately positioned with respect to the microphone assembly 110 at the time of the adhesive fixing, the protrusion 164a is connected to the top substrates 22 between each other. Since it can be brought into contact with the coating layer 124E formed at the position, it is possible to reliably press the adhesive sheet aggregate 154 disposed in the first adhesive region 124a.

  Further, in the present embodiment, at the position facing the second adhesion region 126 a on the upper surface of the second pressing plate 166, the protruding portion that contacts the connecting position between the bottom substrates 26 on the lower surface of the bottom substrate assembly 126. Since 166a is formed, the following effects can be obtained.

  That is, as shown in FIG. 6B, when the above-described pressing is performed using the conventional second pressing plate 166 ′ in which such a protrusion 166a is not formed, the second Since the pressing plate 166 ′ comes into contact with the insulating layer 26 C and the conductive layers 26 B 1, 26 B 2, 26 B 3 formed on the lower surface of the bottom substrate assembly 126 ′, the portion located at the center of the bottom substrate 26 in each microphone 10 is It will be deformed so as to bend upward. For this reason, the pressure against the second bonding region 126a becomes insufficient, and the bonding strength between the bottom substrate assembly 126 ′ and the body substrate assembly 122 cannot be sufficiently ensured.

  On the other hand, in the present embodiment, when the second pressing plate 166 is pressed against the bottom substrate assembly 126, the projection 166a is a connecting position between the bottom substrates 26 on the lower surface of the bottom substrate assembly 126. Therefore, it is possible to appropriately press the second adhesive region 126a. As a result, the adhesive strength between the bottom substrate assembly 126 and the body substrate assembly 122 can be sufficiently secured.

  Further, the projection 166a of the second pressing plate 166 is brought into contact with the connecting position between the bottom substrates 26 in this way, so that the portion located at the center of each bottom substrate 26 is deformed so as to bend upward. Therefore, a load is applied to the IC chip 34 mounted on the bottom substrate 26, and the soldering fixing part is detached from the bottom substrate 26. Such a problem can be prevented from occurring. As a result, the mounting reliability of the IC chip 34 can be significantly improved. Furthermore, by preventing the occurrence of such deformation, the volume of the space in the housing 20 of the microphone 10 can be maintained at a value closer to the design value, so that an intended frequency characteristic can be ensured. Is possible more reliably.

  In addition, in the present embodiment, the covering layer 166E that contacts the protrusion 166a of the second pressing plate 166 at the time of the pressing is provided at the connecting position between the bottom substrates 26 on the lower surface of the bottom substrate assembly 126. Since the bottom substrate 26 is formed so as to surround substantially the entire circumference, the following operational effects can be obtained.

  That is, even when the second pressing plate 166 is not pressed in a state where the second pressing plate 166 is accurately positioned with respect to the microphone assembly 110 at the time of the adhesive fixing, the protruding portion 166a is connected between the bottom substrates 26. Since it can be brought into contact with the coating layer 166E formed at the position, it is possible to reliably press the adhesive sheet aggregate 156 disposed in the second adhesive region 126a.

  In the present embodiment, the adhesive sheet aggregates 154 and 156 are pressed while heating at the time of the adhesive fixing, and for this purpose, the first and second pressing plates 164 and 166 are heated. In this case, the heat of the first and second pressing plates 164 and 166 is transferred from the protrusions 164a and 166a through the top substrate assembly 124 and the bottom substrate assembly 126. Thus, the adhesive sheet aggregates 154 and 156 arranged in the first and second adhesive regions 124a and 126a can be efficiently transmitted.

  In the embodiment described above, the sound hole 24a is formed in the top substrate 24. However, instead of doing this, a configuration in which the same sound hole is formed in the bottom substrate 26 is also possible. is there. In addition, a directional microphone can be configured as a configuration in which sound holes are formed in both the top substrate 24 and the bottom substrate 26.

  In the above-described embodiment, the first and second pressing plates 164 and 166 are directly pressed against the microphone assembly 110. However, a state in which release sheets are interposed between the upper and lower surfaces of the microphone assembly 110. Thus, the first and second pressing plates 164 and 166 can be pressed against each other. By doing so, it is possible to easily separate the first and second pressing plates 164 and 166 from the microphone assembly 110 after the pressing.

  In the above embodiment, the case where the microphones 10 are taken out by dividing the microphone assembly 110 into 12 parts has been described. However, even when the number is other than this, the same effects as in the case of the above embodiment are obtained. be able to.

  In the above embodiment, the case where the microphone 10 to be manufactured is an electret condenser microphone has been described. However, a condenser microphone configured to be applied with a charge voltage or a microphone having other configurations is manufactured. Even in the case of the target, the same effects as those of the above embodiment can be obtained. At that time, instead of the diaphragm sub-assembly 42, the back electrode plate 44, the contact spring 36, and the like constituting the microphone element 30 of the above embodiment, a silicon microphone configured by MEMS technology or the like is mounted on the bottom substrate 26. It is also possible to adopt what has been done.

  In addition, the numerical value shown as a specification in the said embodiment is only an example, and of course, you may set these to a different value suitably.

It is a perspective view which shows the microphone used as the object of the manufacturing method which concerns on one Embodiment of this invention, Comprising: (a) is the state arrange | positioned upward, (b) is a sectional side view shown in the state arrange | positioned downward The perspective view which decomposes | disassembles into the component and shows the microphone of the state shown to Fig.1 (a) Sectional view taken along line III-III in FIG. The perspective view which shows the manufacturing process of the said microphone FIG. 4A is a plan view showing a part of the microphone assembly shown in FIG. 4F turned upside down (that is, in an upwardly arranged state), and FIG. It is a figure which shows an example. FIG. 4A is a side sectional view showing the bonding and fixing process shown in FIG. 4F, and FIG. 4B is a view similar to FIG. Detail view of part VII in Fig. 6 (a)

Explanation of symbols

10 Microphone 20 Housing 22 Body substrate 22A, 24A, 26A Insulating substrate 22A1 Parts located on the outer peripheral side of the through hole 22B, 22C, 24B, 24C, 26B1, 26B2, 26B3, 26D1, 26D2, 26D3, 26D4 Conductive layer 22D 122D Through-hole 22a Opening 24 Top substrate 24Ba Protrusion 24a Sound hole 26 Bottom substrate 26C Insulating layer 30 Microphone element 32 Capacitor structure 34 IC chip (electronic component)
36 Contact spring 42 Vibration membrane sub-assembly 42A Vibration membrane 42B Support ring 42a Projection piece 44 Back electrode plate 44A Electrode plate body 44B Electret layer 44a Through hole 54, 56 Adhesive sheet 54a Two-step concave portion 54b, 56a Overflow portion 110 Microphone assembly 122 Body substrate assembly 122A Insulating substrate assembly 122A1 Resin filling portion 124 Top substrate assembly 124E, 126E Cover layer 124a First adhesive region 126 Bottom substrate assembly 126a Second adhesive region 142 Vibration membrane sub-assembly assembly 142A Vibration Membrane assembly 142B Support ring assembly 154, 156 Adhesive sheet assembly 164 First pressing plate 164a, 166a Protruding portion 166 Second pressing plate

Claims (4)

The microphone element is housed in a state where the top substrate and the bottom substrate are bonded and fixed to the upper and lower surfaces of the body substrate formed in an annular shape, with the electronic components of the microphone element mounted on the bottom substrate. A method of manufacturing a microphone comprising:
A top substrate assembly in which a plurality of top substrates are arranged in a connected state and a plurality of bottom substrates are arranged in a connected state on both upper and lower surfaces of a body substrate assembly in which the plurality of body substrates are arranged in a connected state. In the method of manufacturing the microphone, the microphone assembly is formed by bonding and fixing the bottom substrate assembly formed, and then dividing the microphone assembly into a plurality of parts.
A first bonding region for bonding and fixing the top substrate assembly and the body substrate assembly is formed at a connection position between the top substrates on the lower surface of the top substrate assembly. A second bonding region for bonding and fixing the bottom substrate assembly and the body substrate assembly is formed at a connection position between the bottom substrates on the upper surface of the bottom substrate assembly. And with the adhesive disposed in each of the second bonding regions, the top substrate assembly and the bottom substrate assembly are brought into contact with the upper and lower surfaces of the body substrate assembly and pressed from both the upper and lower sides. , Perform the above-mentioned adhesive fixing,
At that time, by pressing the first and second pressing plates from the upper and lower sides against the top substrate assembly and the bottom substrate assembly, respectively, the pressing is performed,
And the protrusion part which contact | abuts the connection position between each said top board | substrates in the upper surface of the said top board | substrate assembly in the position which opposes the said 1st adhesion area | region in the lower surface of the said 1st press board at the time of the said press. A method for manufacturing a microphone, characterized by comprising:   A covering layer that is in contact with the protruding portion of the first pressing plate at the time of the pressing is surrounded at a connecting position between the top substrates on the upper surface of the top substrate assembly over substantially the entire circumference. The method for manufacturing a microphone according to claim 1, wherein the microphone is formed in such a manner as to be formed.   Protrusions that contact the connecting positions between the bottom substrates on the bottom surface of the bottom substrate assembly at the time of pressing are formed at positions facing the second adhesion region on the top surface of the second pressing plate. The method for manufacturing a microphone according to claim 1 or 2, wherein:   A covering layer that abuts against the protruding portion of the second pressing plate at the time of pressing is surrounded at substantially the entire circumference at a connecting position between the bottom substrates on the lower surface of the bottom substrate assembly. 4. The method of manufacturing a microphone according to claim 3, wherein the microphone is formed in such a manner as to be formed.

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