JP2010092143A - Method and apparatus for manufacturing ic sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing an IC sheet which prevent increase in element count and prevent its structure from becoming complicated. <P>SOLUTION: The IC sheet manufacturing apparatus 200 includes: a surface sheet detaching means 210 which detaches a surface sheet from a substrate sheet, in a sheet body 241 composed of a substrate sheet 242 which has an adhesive front surface and a non-adhesive back surface and a surface sheet 243 which is detachably attached to the adhesive front surface of the substrate sheet; an IC inlet attaching means 220 which attaches IC inlet 252 to the adhesive surface of the substrate sheet; and a surface sheet attaching means 230 which attaches the surface sheet detached from the substrate sheet by the surface sheet detaching means to the adhesive surface of the substrate sheet to cover the IC inlet. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an IC sheet manufacturing method and an IC sheet manufacturing apparatus.

  An example of the IC sheet manufacturing apparatus is described in Japanese Patent Application Laid-Open No. 2006-178807.

  FIG. 5 is a schematic configuration diagram of an IC sheet manufacturing apparatus 100 described in the publication.

  The IC sheet manufacturing apparatus 100 includes a release paper feeder 110, a hot melt gun 120, an IC inlet sticker 130, a seal member sticker 150, and an IC sheet winder 180.

  The release paper feeder 110 includes a rotation shaft 111 and a release paper roll 112 attached to the rotation shaft 111. The rotating shaft 111 rotates at a predetermined speed, whereby the release paper 113 is continuously supplied from the release paper roll 112 in a certain direction (direction of the IC sheet winder 180).

  The hot melt gun 120 is installed on the most upstream side on the supply path of the release paper 113 supplied from the release paper supply machine 110, and the hot melt adhesive in a molten state is placed on the release surface of the release paper 113 at a predetermined interval. Apply.

  The IC inlet sticking machine 130 is composed of an IC inlet supply part 131 and an IC inlet sticking part 132, and is installed on the downstream side of the hot melt gun 120 on the supply path of the release paper 113.

  The IC inlet supply unit 131 includes a rotating shaft 134 and an IC inlet roll 133 attached to the rotating shaft 134. The IC inlet roll 133 is obtained by winding a substrate on which a non-contact type IC inlet composed of an IC chip and an antenna to which the IC chip is connected is formed in a row.

  By rotating the rotating shaft 134 at a predetermined speed, the IC inlet is supplied from the IC inlet roll 133 to the IC inlet sticking portion 132 in a belt-like state. The IC inlet sticking portion 132 is divided into individual IC inlets 135 by cutting the band-shaped IC inlet into a predetermined size and shape, and the individual IC inlets are placed on the hot melt adhesive applied by the hot melt gun 120. IC inlet 135 is mounted.

  The seal member sticking machine 150 includes a seal member supply unit 151 and a seal member sticking roll 152, and is installed on the downstream side of the IC inlet sticking machine 130 on the supply path of the release paper 113. .

  The seal member supply unit 151 includes a rotation shaft 155 and a seal member roll 154 attached to the rotation shaft 155. The seal member roll 154 is obtained by winding a belt-like seal member 153 having a pressure-sensitive adhesive applied on one side.

  By rotating the rotary shaft 155 at a predetermined speed, the seal member 153 is supplied to the seal member sticking roll 152.

  The seal member sticking roll 152 sticks the seal member 153 supplied from the seal member supply unit 151 from above the IC inlet 135.

An IC sheet winder 180 is provided at the most downstream position on the supply path of the release paper 113, and the IC sheet winder 180 includes the release paper 113, the IC inlet 135, and the seal member 153 as described above. The rotating shaft 181 can be rotated at a predetermined speed so that the bonded IC sheet 182 can be wound around the rotating shaft 181.
JP 2006-178807 A

  In the conventional IC sheet manufacturing apparatus 100 shown in FIG. 5, since the adhesive layer is not formed on the release paper 113, it is necessary to apply a hot melt adhesive to one surface of the release paper 113 with the hot melt gun 120. It was.

  In the conventional IC sheet manufacturing apparatus 100, after the IC inlet 135 is disposed on the release paper 113, a seal member 153 is pasted on the release paper 113 in order to protect the IC inlet 135.

  In order to form an adhesive layer on one surface of the release paper 113, it is necessary to dispose the hot melt gun 120. In order to attach the seal member 153 on the release paper 113, a seal member sticking machine 150 is provided. It is necessary.

  For this reason, in the IC sheet manufacturing apparatus 100, it is inevitable that the number of parts increases and the structure becomes complicated.

  The present invention has been made in view of such problems in the conventional IC sheet manufacturing apparatus 100, and is capable of preventing an increase in the number of components and avoiding a complicated structure. An object is to provide a device and an IC sheet manufacturing method.

  Hereinafter, means for solving the above-described problems will be described using reference numerals used in the “Embodiments of the Invention”. These reference signs are added only to clarify the correspondence between the description of “Claims” and the description of “Embodiments of the Invention”. It should not be used to interpret the technical scope of the invention described in.

  In order to achieve the above object, the present invention provides a base material sheet (242) having an adhesive surface and a non-adhesive back surface, and releasably attached to the adhesive surface of the base material sheet (242). A first step of peeling the surface layer sheet (243) from the base material sheet (242) in a sheet body (241) composed of the surface layer sheet (243) being formed, and the adhesion of the base material sheet (242) A second step of attaching the IC inlet (252) on the surface of the surface, and the surface layer sheet (243) peeled off from the base sheet (242) in the first step, the IC inlet (252). And a third process of sticking on the adhesive surface of the base sheet (242) so as to cover the IC sheet.

  The IC sheet manufacturing method according to the present invention preferably further includes a fourth step of cutting the surface layer sheet (243) for each IC inlet (252) after the third step.

  The IC sheet manufacturing method according to the present invention preferably further includes a fifth step of printing on the non-adhesive back surface of the base sheet (242).

  The present invention further includes a base sheet (242) having an adhesive surface and a non-adhesive back surface, and a surface layer sheet (removably attached to the adhesive surface of the base sheet (242)). 243) and a surface layer sheet peeling means (210) for peeling the surface layer sheet (243) from the base material sheet (242) on the adhesive surface of the base material sheet (242). IC inlet sticking means (220) for sticking the IC inlet (252) to the surface, and the surface layer sheet (243) peeled from the base sheet (242) by the surface layer sheet peeling means (210). (252) and a surface layer sheet adhering means (230) for adhering on the adhesive surface of the base sheet (242) so as to cover the substrate sheet (242). 200) to provide.

  The IC sheet manufacturing apparatus (200) according to the present invention preferably further includes a cutting means (310) for cutting the surface layer sheet (243) for each IC inlet (252).

  It is preferable that the IC sheet manufacturing apparatus (200) according to the present invention further includes a printing unit (410) that performs printing on the non-adhesive back surface of the base sheet (242).

  In the IC sheet manufacturing apparatus according to the present invention, since a base sheet having an adhesive surface is used in advance, a member corresponding to the hot melt gun 120 is used unlike the conventional IC sheet manufacturing apparatus 100 shown in FIG. There is no need.

  Moreover, in the IC sheet manufacturing apparatus according to the present invention, the surface layer sheet peeled off from the base sheet is reused, so that unlike the conventional IC sheet manufacturing apparatus 100 shown in FIG. There is no need to use a corresponding member. In particular, the surface layer sheet peeled off from the base material sheet was often discarded without being reused as it was, but according to the IC sheet manufacturing apparatus according to the present invention, the surface layer sheet was reused. It is possible to reduce the amount and promote the reuse of resources.

(First embodiment)
FIG. 1 is a schematic configuration diagram of an IC sheet manufacturing apparatus 200 according to the first embodiment of the present invention.

  As shown in FIG. 1, an IC sheet manufacturing apparatus 200 according to this embodiment includes a surface layer peeling means 210, an IC inlet sticking means 220, a surface sheet sticking means 230, a sheet body roll 240, and an IC sheet. And a roll 250.

  The sheet body roll 240 is obtained by winding a sheet body 241 in a roll shape.

  FIG. 2A is a perspective sectional view of the sheet body 241.

  As shown in FIG. 2A, the sheet body 241 is detachably attached to the base material sheet 242 having an adhesive surface and a non-adhesive back surface, and the adhesive surface of the base material sheet 242. And a surface layer sheet 243.

  The IC sheet roll 250 is obtained by winding an IC sheet 251 (described later) in a roll shape.

  FIG. 2C is a perspective sectional view of the IC sheet 251.

  As shown in FIG. 2C, the IC sheet 251 includes a plurality of IC inlets 252 arranged in a row between the base sheet 242 and the surface layer sheet 243 of the sheet body 241.

  The sheet body 241 is unwound from the sheet body roll 240, processed into the IC sheet 251 on the way, and then wound around the IC sheet roll 250.

  That is, the sheet body 241 (or the IC sheet 251) advances from the sheet body roll 240 toward the IC sheet roll 250.

  The surface layer peeling means 210 includes a first roller 211, a second roller 212, a third roller 213, and a fourth roller 214.

  As shown in FIG. 1, the first roller 211 and the second roller 212 are arranged in parallel with a gap in the horizontal direction, and the third roller 213 and the fourth roller 214 include the first roller 211 and the first roller 211. Below the two rollers 212, they are arranged in parallel with a gap in the horizontal direction.

  The first roller 211 and the third roller 213 are arranged in parallel at a distance from each other in the vertical direction.

  On the upstream side of the first roller 211 and the second roller 212, the surface layer sheet 243 of the sheet body 241 is peeled from the base material sheet 242. Thereafter, the surface layer sheet 243 is sent to the surface layer sheet adhering means 230 via the first roller 211 and the second roller 212, and the substrate sheet 242 is transferred to the IC inlet adhering means 220 via the third roller 213 and the fourth roller 214. Sent.

  The IC inlet sticking means 220 includes an IC inlet roll 221, a pair of IC inlet sticking rollers 222, 223, a base sheet stripping roller 224, and a base sheet winding roll 225.

  The IC inlet roll 221 is obtained by winding an IC inlet sheet 226 in a roll shape.

  FIG. 2B is a perspective sectional view of the IC inlet sheet 226.

  As shown in FIG. 2B, the IC inlet sheet 226 is attached in a row on the base material sheet 227 having an adhesive surface on which an adhesive layer is formed, and the adhesive surface of the base material sheet 227. And a plurality of IC inlets 252.

  The base material sheet 242 sent to the IC inlet sticking means 220 via the third roller 213 and the fourth roller 214 is sandwiched between the pair of IC inlet sticking rollers 222 and 223, and is attached to the surface layer sheet sticking means 230. Sent.

  The base sheet stripping roller 224 is disposed in contact with the IC inlet sticking roller 223 located below the pair of IC inlet sticking rollers 222 and 223.

  The IC inlet sheet 226 advances from the IC inlet roll 221 toward the pair of IC inlet sticking rollers 222 and 223, and the base material sheet 227 is peeled off by the base material sheet peeling roller 224. That is, only the IC inlet 252 on the base material sheet 227 is taken out by the base material sheet peeling roller 224. The IC inlet 252 thus taken out is stuck on the adhesive surface of the base sheet 242 by a pair of IC inlet sticking rollers 222 and 223.

  The base sheet 227 stripped off by the base sheet stripping roller 224 is wound around the base sheet winding roll 225.

  The base material sheet 242 having the IC inlet 252 attached on the adhesive surface is sent to the surface layer sheet attaching means 230.

  As shown in FIG. 1, the surface layer sheet adhering means 230 includes a pair of surface layer sheet adhering rollers 231 and 232.

  The surface layer sheet 243 sent to the surface layer sheet adhering means 230 via the first roller 211 and the second roller 212 is adhered onto the base material sheet 242 by a pair of surface layer sheet adhering rollers 231 and 232, and an IC sheet. 251 is formed.

  At this stage, as shown in FIG. 2C, a plurality of IC inlets 252 are sandwiched between the base material sheet 242 and the surface layer sheet 243 of the sheet body 241.

  The IC sheet manufacturing apparatus 200 according to this embodiment having the above-described structure operates as follows.

  The sheet body 241 is separated into the base material sheet 242 and the surface layer sheet 243 in the surface layer sheet peeling means 210, and the surface layer sheet 243 is sent to the surface layer sheet adhering means 230 via the first roller 211 and the second roller 212. The sheet 242 is sent to the IC inlet sticking means 220 via the third roller 213 and the fourth roller 214.

  The IC inlet 252 taken out from the base material sheet 227 by the base material sheet peeling roller 224 is sent from the pair of IC inlet sticking rollers 222 and 223 via the third roller 213 and the fourth roller 214. Affixed on the adhesive surface of sheet 242.

  Next, the base material sheet 242 having the IC inlet 252 attached on the adhesive surface is sent to the surface layer sheet attaching means 230, and the surface layer is formed on the base material sheet 242 by a pair of surface layer sheet attaching rollers 231 and 232. A sheet 243 is attached.

  At this stage, an IC sheet 251 in which an IC inlet 252 is sandwiched between the base sheet 242 and the surface layer sheet 243 is formed.

  The IC sheet 251 is wound around the IC sheet roll 250.

  The IC sheet manufacturing apparatus 200 according to the present embodiment has the following effects.

  First, in the IC sheet manufacturing apparatus 200 according to the present embodiment, since the base sheet 242 having an adhesive surface is used in advance, unlike the conventional IC sheet manufacturing apparatus 100 shown in FIG. There is no need to use a member corresponding to 120.

  Second, in the IC sheet manufacturing apparatus 200 according to the present embodiment, the surface layer sheet 243 peeled off from the base sheet 242 is reused, so that unlike the conventional IC sheet manufacturing apparatus 100 shown in FIG. There is no need to use a member corresponding to the member sticking machine 150.

  In particular, the surface layer sheet 243 peeled from the base material sheet 242 was often discarded without being reused as it is, but according to the IC sheet manufacturing apparatus 200 according to the present embodiment, the surface layer sheet 243 is used. Since the IC sheet 251 is formed, the amount of waste can be reduced and the reuse of resources can be promoted.

(Second embodiment)
FIG. 3 is a partial schematic configuration diagram of an IC sheet manufacturing apparatus according to the second embodiment of the present invention.

  The IC sheet manufacturing apparatus according to this embodiment further includes a cutting unit 310 as compared with the IC sheet manufacturing apparatus 200 according to the first embodiment.

  As shown in FIG. 2, the cutting means 310 is disposed between the surface sheet adhering means 230 and the IC sheet roll 250.

  The cutting means 310 includes a cutter 311 and a cutter cradle 312.

  The cutter 311 is configured to be movable up and down above the IC sheet 251, and the vertical movement of the cutter 311 is controlled by a control device (not shown).

  The cutter 311 cuts only the surface layer sheet 243 of the IC sheet 251 sent from the surface layer sheet sticking means 230 for each IC inlet 252. That is, the cutter 311 cuts the surface layer sheet 243 before and after the IC inlet 252 in the traveling direction.

  By making such cuts in the surface layer sheet 243, the surface layer sheet 243 can be peeled for each IC inlet 252 and the IC inlets 252 can be easily taken out individually.

(Third embodiment)
FIG. 4 is a partial schematic configuration diagram of an IC sheet manufacturing apparatus according to the third embodiment of the present invention.

  The IC sheet manufacturing apparatus according to the present embodiment further includes a printing unit 410 as compared with the IC sheet manufacturing apparatus 200 according to the first embodiment.

  The printing unit 410 is disposed between the third roller 213 and the fourth roller 214.

  The printing unit 410 performs printing on the non-adhesive back surface of the base sheet 242.

  The printing unit 410 is not necessarily arranged between the third roller 213 and the fourth roller 214, and can be arranged at an arbitrary position. For example, it is possible to arrange between the IC inlet adhering means 220 and the surface layer sheet adhering means 230 or between the surface layer sheet adhering means 230 and the IC sheet roll 250.

  Further, although the IC sheet manufacturing apparatus according to the present embodiment includes one printing unit 410, a plurality of printing units 410 may be provided.

FIG. 1 is a schematic configuration diagram of an IC sheet manufacturing apparatus according to a first embodiment of the present invention. 2A is a perspective sectional view of the sheet body, FIG. 2B is a perspective sectional view of the IC inlet sheet, and FIG. 2C is a perspective sectional view of the IC sheet. FIG. 3 is a partial schematic configuration diagram of an IC sheet manufacturing apparatus according to the second embodiment of the present invention. FIG. 4 is a partial schematic configuration diagram of an IC sheet manufacturing apparatus according to the third embodiment of the present invention. FIG. 5 is a schematic configuration diagram of a conventional IC sheet manufacturing apparatus.

Explanation of symbols

200 IC sheet manufacturing apparatus 210 according to the first embodiment of the present invention 210 Surface sheet peeling means 211 First roller 212 Second roller 213 Third roller 214 Fourth roller 220 IC inlet sticking means 221 IC inlet rolls 222, 223 IC Inlet sticking roller 224 Base sheet stripping roller 225 Base sheet winding roll 226 IC inlet sheet 227 Base sheet 230 Surface layer sheet sticking means 240 Sheet body roll 241 Sheet body 242 Base sheet 243 Surface layer sheet 250 IC sheet roll 251 IC sheet 252 IC inlet 231, 232 Surface sheet sticking roller

Claims (6)

In the sheet | seat body which consists of a base material sheet which has an adhesive surface and a non-adhesive back surface, and the surface layer sheet which has been peelably stuck on the said adhesive surface of the said base material sheet, the said surface layer sheet is said base material A first process of peeling from the sheet;
A second step of attaching an IC inlet onto the adhesive surface of the substrate sheet;
A third step of sticking the surface layer sheet peeled from the base material sheet in the first step onto the adhesive surface of the base material sheet so as to cover the IC inlet;
An IC sheet manufacturing method comprising: The IC sheet manufacturing method according to claim 1, further comprising a fourth step of cutting the surface layer sheet for each IC inlet after the third step. The IC sheet manufacturing method according to claim 1, further comprising a fifth step of printing on the non-adhesive back surface of the base sheet. In the sheet | seat body which consists of a base material sheet which has an adhesive surface and a non-adhesive back surface, and the surface layer sheet which has been peelably stuck on the said adhesive surface of the said base material sheet, the said surface layer sheet is said base material Surface sheet peeling means for peeling from the sheet;
IC inlet sticking means for sticking an IC inlet onto the adhesive surface of the base sheet;
A surface layer sheet attaching means for attaching the surface layer sheet peeled from the base sheet by the surface layer sheet peeling means on the adhesive surface of the base sheet so as to cover the IC inlet;
An IC sheet manufacturing apparatus comprising: The IC sheet manufacturing apparatus according to claim 4, further comprising a cutting unit that cuts the surface layer sheet for each IC inlet. The IC sheet manufacturing apparatus according to claim 4, further comprising a printing unit that performs printing on the non-adhesive back surface of the base sheet.

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