JP2010087178A - Automatic mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an automatic mounting device capable of preventing the damage of a work and a nozzle caused by a shock at the time of work suction and mounting. <P>SOLUTION: The automatic mounting device 10 is composed of a holder 11, a nozzle 12 and first and second shock-absorbing mechanisms 26 and 35. The first shock-absorbing mechanism 26 is composed of a first shock-absorbing spring 19 having a small spring constant, a spring pressing member 18, a positioning member 20, a nut 22, a sealing member 23 or the like. The second shock-absorbing mechanism 35 includes a second shock-absorbing spring 36 having a large spring constant, a fixed-side spring-bearing member 37, a movable-side spring-bearing member 38, a stopper member 39, an antirotational member 27 or the like, and further has an opening Sv specifying a sliding stroke of the nozzle 12 between the movable-side spring-bearing member 38 and the antirotational member 27. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an automatic mounting apparatus suitable for use when a workpiece is conveyed by vacuum suction and mounted on a mounting target component.

  This type of automatic mounting device, which is used when vacuum-sucking and transporting various surface-mounted components and electronic components such as bare chips and mounting them on the mounting surface of a printed circuit board or glass substrate, generally has a nozzle that slides with a holder. The nozzle is urged in a direction that protrudes from the holder by a buffer spring, and the shock when the electronic component comes into contact with the mounting surface of the board when the electronic component is mounted is buffered by the elastic deformation of the buffer spring. By doing so, damage of an electronic component or a nozzle is prevented (for example, refer to Patent Documents 1 to 3).

  If the reaction force (biasing force) against the nozzle is too strong, the shock absorbing effect will be reduced when the electronic component is brought into contact with the board, and the electronic component will be misaligned or deformed. In the case of, there is a risk of damage. On the other hand, if the pressure is too weak, the nozzle itself is sucked together with the electronic component when the electronic component is vacuum sucked, so that the position of the nozzle is greatly changed (increased). In this state, if the nozzle is lowered and the electronic component is pressed against the board, an error occurs in the amount of lowering, so that it cannot be pressed with an appropriate pressing force, causing a mounting failure. For example, when an electronic component is placed on a cream solder on a printed circuit board, if the pressing force is weak, a gap is generated between the electronic component and the printed circuit board, resulting in poor solder connection.

Japanese Patent Laid-Open No. 7-15178 JP 2000-340996 A JP 2007-27408 A

  By the way, as electronic components become smaller and lighter, the weight of the nozzle, sliding resistance, the spring constant of the buffer spring, etc. are reduced in order to reduce the impact when the electronic component and the nozzle come into contact with each other. A design that takes these measures is required. However, in such a design, when the degree of vacuum in the holder in which the nozzle is slidably housed when the electronic component is attracted increases and the nozzle is sucked up against the buffer spring, the sliding stroke of the nozzle The following problems arise.

(1) When the sliding stroke of the nozzle is long FIGS. 9A to 9C are diagrams for explaining a problem when the sliding stroke of the nozzle is relatively long. 3 is a nozzle, 4 is a buffer spring, and 5 is a printed circuit board on which the electronic component 2 is mounted. In FIG. 9A, the nozzle 3 descends to the workpiece adsorption height when the workpiece is adsorbed, so that the lower end comes into contact with the upper surface of the electronic component 2 and holds the electronic component 2 by vacuum suction. At this time, the nozzle 3 is lifted to a height position that balances the suction force (vacuum force) due to vacuum. Then, when the nozzle 3 rises to a predetermined conveyance height (FIG. 9B), the nozzle 3 moves above the printed circuit board 5 and stops, and then descends to the workpiece mounting height to mount the electronic component 2 on the printed circuit board 5. The suction holding of the electronic component 2 is released by bringing it into contact with the mounting surface and releasing it to the atmosphere. When the nozzle 3 is opened to the atmosphere and released from the vacuum force, the nozzle 3 is pushed down by the reaction force of the buffer spring 4 and strongly presses the electronic component 2 against the placement surface of the printed circuit board 5 (FIG. 9C). For this reason, a strong impact is applied to the electronic component 2 and the printed circuit board 5, causing an accident that the electronic component 2 is displaced or, in the worst case, the electronic component 2, the nozzle 3, or the printed circuit board 5 is damaged.

(2) When the sliding stroke of the nozzle is short FIGS. 10A to 10D are diagrams for explaining a problem when the sliding stroke of the nozzle is relatively short, and 6 is the rising stroke of the nozzle 3. The prescribed stopper 7 is a foreign matter. When the nozzle 3 descends to the workpiece suction height and sucks and holds the electronic component 2 (FIG. 10 (a)), the nozzle 3 is lifted by the vacuum force and stops by contacting the stopper 6 (FIG. 10 (b)). Then, the nozzle 3 is raised to the workpiece conveyance height (FIG. 10C), conveyed to the upper side of the printed circuit board 5, and the nozzle 3 is lowered to the workpiece mounting height (FIG. 10D). At this time, if the foreign material 7 remains on the printed circuit board 5, when the electronic component 2 collides with the foreign material 7, the nozzle 3 tends to rise due to the impact. However, since the nozzle 3 is in contact with the stopper 6, it cannot escape upward, and thus an accident occurs in which the electronic component 2 and the nozzle 3 are subjected to a large impact and are damaged. Further, if the impact when the electronic component 2 is brought into contact with the mounting surface of the printed circuit board 5 is large, the nozzle 3 rises and comes into contact with the stopper 6, thereby causing the same problem as described above.

  As described above, the conventional apparatus has a problem that the work and the nozzle are damaged regardless of the length of the movement stroke of the nozzle.

  The present invention has been made in order to solve the above-described conventional problems. The object of the present invention is to accurately cushion the impact when the workpiece is attracted and when the workpiece is mounted, and the workpiece and the nozzle have a large impact. It is an object of the present invention to provide an automatic mounting apparatus that can prevent accidents such as breakage.

  In order to achieve the above object, the present invention includes a nozzle that is slidably disposed in a holder and holds a workpiece by suction, a first buffer spring that biases the nozzle in a direction protruding from the holder, A first shock buffer mechanism that includes a first buffer spring adjusting means that variably sets the urging force of the first buffer spring, and that relieves shock when the nozzle comes into contact with the work during suction of the work; A second buffer spring having a larger spring constant than the first buffer spring; and second buffer spring adjusting means for variably setting an urging force of the second buffer spring, wherein the nozzle mounts the workpiece And a second shock absorbing mechanism that reduces the shock that occurs when the operation is performed.

  Further, the present invention is the above invention, wherein the first buffer spring adjusting means is slidably disposed in the holder, and one end of the first buffer spring is press-contacted, and one end Is connected to the spring retainer, and has a vertically adjustable position adjusting member whose other end protrudes outside from the holder, and a fixing means for fixing the position adjusting member to the holder.

  Further, the present invention is the above invention, wherein the second buffer spring adjusting means is fixed to the holder, and is fixed to the holder, and one end of the second buffer spring is in pressure contact, and slides on the holder. A movable spring receiving member that is freely provided and the other end of the second buffer spring is pressed against, a stopper member that receives and locks the movable spring receiving member, and the movable spring receiving member provided on the nozzle And a member for defining the sliding stroke of the nozzle.

  In the present invention, the fixed-side spring receiving member and the stopper member are fixed to the holder by a fixing means so that the height can be adjusted individually.

  Further, in the present invention according to the above invention, the member that limits the sliding stroke further has a function of preventing rotation and removal of the nozzle.

  Furthermore, the present invention is the above invention, wherein the holder includes a spline nut and the nozzle includes a spline shaft that is slidably fitted to the spline nut.

  In the present invention, since the first shock absorbing mechanism reduces the impact caused by the contact between the nozzle and the workpiece when the workpiece is attracted, there is no possibility that the nozzle or the workpiece is damaged. At the time of workpiece mounting, the second shock-absorbing mechanism alleviates the impact, so that there is no risk of damage to the workpiece or nozzle, and an automatic mounting device that can reliably hold and mount the workpiece is obtained. be able to.

  Further, in the present invention, the biasing force of the first buffer spring against the nozzle is freely adjusted by moving the position adjusting member of the first buffer spring adjusting means up and down to change the height of the spring presser. This makes it possible to adjust the rising stroke of the nozzle accompanying the increase in the degree of vacuum at the time of workpiece adsorption.

  Further, in the present invention, the second shock absorbing mechanism is a second buffer spring, a fixed side spring receiving member and a movable side spring receiving member to which each end of the buffer spring is pressed, and the movable side spring receiving member. Since it includes a stopper member that receives and locks and a member that is provided on the nozzle and defines the sliding stroke of the nozzle together with the movable side spring receiving member, the structure of the second shock absorbing mechanism is also simple, It is possible to buffer an impact when it collides with a mounting target part or a foreign object.

  In the present invention, since the heights of the fixed spring receiving member and the stopper member of the second buffer spring adjusting means can be adjusted freely, the second buffer spring is attached to the movable spring receiving member. The force and the sliding stroke of the nozzle can be freely adjusted.

  Further, in the present invention, since the member that regulates the rise of the nozzle has a function of preventing the nozzle from rotating and coming off, the number of parts can be reduced.

  Further, in the invention in which the nozzle is slidably held by the spline nut and the spline shaft, the spline nut and the spline shaft prevent the nozzle from rotating, so that a rotation preventing member made of a separate member is not required.

Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.
1 is a sectional view of an automatic mounting apparatus according to the present invention, FIG. 2 is a sectional view taken along line II-II in FIG. 1, FIG. 3 is a sectional view taken along line III-III in FIG. Sectional drawing and FIG. 5 are A arrow views of FIG. In these drawings, an automatic mounting apparatus generally indicated by reference numeral 10 sucks and holds the electronic component 2 as a work in the work tray 1 at the work suction position P and conveys it to the work mounting position R as a mounting target part. It is placed at the mounting position of the printed circuit board 5, and includes a holder 11, a nozzle 12 slidably accommodated in the holder 11, a holder 11 that holds the holder 11, and the workpiece suction position P and the workpiece mounting position R. A driving device or the like (not shown) that reciprocates between them is provided.

  The holder 11 is formed in a cylindrical body, and a central hole that slidably accommodates the nozzle 12 forms a vacuum chamber 13. The vacuum chamber 13 is evacuated when the electronic component 2 is sucked and held by the nozzle 12, and an opening 13 a that opens to the outer periphery of the holder 11 is provided on the upper end side, and one end of the upper end side opening 13 a is vacuum. The other end of the pipe 14 connected to the device 15 is connected via a pipe joint 16 and a seal member 17. The lower end of the vacuum chamber 13 is open to the lower surface of the holder 11, and the lower end of the nozzle 12 protrudes to the outside from the lower end opening 13b.

  In addition, a first shock buffering mechanism 26 is incorporated in the vacuum chamber 13 to buffer a shock when the nozzle 12 contacts the electronic component 2 when the electronic component 2 is sucked and held. The first shock absorbing mechanism 26 is slidably fitted into the vacuum chamber 13 and is spring-mounted between the spring retainer 18 and the nozzle 12 and positioned above the nozzle 12. The first buffer spring 19 is provided. The spring retainer 18 is formed in a cylindrical body that is open at both ends, and a position adjusting member 20 projects from the outer peripheral surface. The position adjusting member 20 is formed of a screw body, protrudes to the outside of the holder 11 through a long hole 21 formed in the peripheral surface of the holder 11 in the height direction, and has a nut (fixing means) 22 at the protruding end. Are screwed through the seal member 23 and the seal ring 24. Therefore, when the nut 22 is loosened and the position adjusting member 20 is moved up and down along the long hole 21, the height of the spring retainer 18 is adjusted, and the first impact is applied by the spring retainer 18, the position adjusting member 20 and the nut 22. A first buffer spring adjusting means 30 of the buffer mechanism 26 is configured. The seal ring 24 is fixed to the outer periphery of the holder 11 by a set screw 25 (FIG. 3).

  The first buffer spring 19 is a compression coil spring having a relatively small spring constant, and is elastically mounted between the spring retainer 18 and the nozzle 12 to urge the nozzle 12 downward. The first shock absorbing mechanism 26 is configured so that the vacuum force, the weight of the nozzle 12 itself, the sliding resistance, the first buffer spring 19, and the electrons when the degree of vacuum in the vacuum chamber 13 becomes high during workpiece adsorption. The rise of the nozzle 12 is regulated by the balance with the weight of the component 2.

  The nozzle 12 is formed in a cylindrical body open at both ends, so that the center hole 12a communicates with the vacuum device 15 through the vacuum chamber 13, the upper opening 13a, the hole 16a of the pipe joint 16, and the pipe 14. The electronic device 2 is configured to be evacuated to a predetermined degree of vacuum by driving the vacuum device 15 when sucking and holding the electronic component 2. Near the lower end of the outer peripheral surface of the nozzle 12, a member (rotation preventing member) 27 that prevents rotation is provided. The anti-rotation member 27 is made of a thin screw, and its tip is screwed into a screw hole 28 perpendicular to the axis formed near the lower end of the nozzle 12, and the head is long in the vertical direction formed at the lower end of the holder 11. It protrudes from the long hole 29 to the outside of the holder 11. The rotation preventing member 27 has a communication hole 31 orthogonal to the axis formed at the tip, and is screwed into the screw hole 28 so that the communication hole 31 communicates with the center hole 12 a of the nozzle 12. Yes. Further, the rotation preventing member 27 is inserted through the long hole 29 to prevent the nozzle 12 from dropping off from the holder 11 and rotating. The rotation preventing member 27 is pressed against the lower peripheral surface 29 a of the long hole 29 by the biasing force of the first buffer spring 19 against the nozzle 12.

  The holder 11 is further provided with a second shock absorbing mechanism 35. The second shock absorbing mechanism 35 includes the rotation preventing member 27, a second shock absorbing spring 36, a fixed side spring receiving member 37, a movable side spring receiving member 38, a stopper member 39, and the like. Further, the rotation preventing member 27, the second buffer spring 36, the fixed side spring receiving member 37, the movable side spring receiving member 38 and the stopper member 39 variably set the urging force of the second buffer spring 36. The second buffer spring adjusting means 40 is configured.

  The second buffer spring 36 is a compression coil spring having a larger spring constant than the first buffer spring 19 and is elastically mounted on the outer periphery of the holder 11, and includes a fixed-side spring receiving member 37 and a movable-side spring receiving member 38. It is being armed between.

  The fixed spring receiving member 37 is formed of a ring having an inner diameter substantially equal to the outer diameter of the holder 11, is slidably fitted on the outer periphery of the holder 11, and is fixed by a set screw 41 so that the height can be adjusted. The movable side spring receiving member 38 is formed of a ring having an inner diameter that is substantially equal to the outer diameter of the holder 11, and is slidably fitted on the outer periphery of the holder 11. It is in pressure contact with the top surface. An appropriate gap Sv is provided between the movable spring receiving member 38 and the rotation preventing member 27 as shown in FIG. This gap Sv defines the amount of movement (sliding stroke) when the nozzle 12 is raised when the electronic component 2 is attracted and mounted.

  The stopper member 39 is formed of a cylindrical body having both ends open, is slidably fitted to the lower end portion of the outer peripheral surface of the holder 11, and is fixed by a set screw 42 (FIGS. 4 and 5) so that the height can be adjusted. The movable side spring receiving member 38 is received and locked by the stopper member 39. When the height of the stopper member 39 is adjusted, the clearance Sv, in other words, the sliding stroke of the nozzle 12 and the height position of the movable spring receiving member 38 are adjusted. That is, when the stopper member 39 is lowered, the movable side spring receiving member 38 is also lowered, so that the interval between the rotation preventing member 27 and the movable side spring receiving member 38 is narrowed, and the sliding stroke (Sv value) of the nozzle 12 is reduced. Can be small. On the contrary, when the height of the stopper member 39 is increased, the movable side spring receiving member 38 is also raised, so that the interval between the rotation preventing member 27 and the movable side spring receiving member 38 is widened, and the sliding stroke (Sv value) of the nozzle 12 is increased. ) Can be increased. A vertical groove 43 is formed on the circumferential surface of the stopper member 39 over the entire length in the axial direction, and a protruding end portion protruding from the nozzle 12 of the rotation preventing member 27 is inserted into the vertical groove 43. A minus groove 44 is formed on the protruding end surface of the rotation preventing member 27, and the rotation preventing member 27 can be rotated from the outside of the stopper member 39 by inserting the tip of the driver into the minus groove 44.

Next, suction and mounting operations of the automatic mounting apparatus 10 having the above structure will be described.
When the electronic component 2 is attracted, the holder 11 stops when it is conveyed above the workpiece mounting position P, and descends to the workpiece attracting height to press the lower end of the nozzle 12 against the upper surface of the electronic component 2 with a predetermined pressure.

  The impact when the lower end of the nozzle 12 is brought into contact with the electronic component 2 is buffered by the nozzle 12 rising against the first buffer spring 19, thereby preventing the electronic component 2 or the nozzle 12 from being damaged. Is done. Since the first buffer spring 19 has a small spring constant and a small urging force against the nozzle 12, when the nozzle 12 comes into contact with the electronic component 2, the nozzle 12 is released upward and the shock is reliably buffered. Therefore, there is no possibility that the electronic component 2 or the nozzle 12 is damaged.

  Next, the vacuum device 15 is driven in a state where the nozzle 12 is pressed against the electronic component 2 so that the vacuum chamber 13 of the holder 11 has a predetermined degree of vacuum, and the electronic component 2 is sucked and held at the lower end of the nozzle 12.

  When the nozzle 12 completely holds the electronic component 2 by suction, the nozzle 12 rises as the degree of vacuum in the vacuum chamber 13 increases. The rising height of the nozzle 12 at this time is a height at which the weight of the first buffer spring 19, the weight of the nozzle 12, the sliding resistance and the weight of the electronic component 2 are balanced with the vacuum force at the time of suction, preferably rotating. The height until the prevention member 27 comes into contact with the movable side spring receiving member 38 is set. The rising height of the nozzle 12 by this suction force can be easily adjusted by moving the spring retainer 18 up and down to change the urging force of the first buffer spring 19. In this case, since the movable side spring receiving member 38 is urged downward by the second buffer spring 36, the nozzle 12 is raised by the suction force due to the degree of vacuum, and the rotation preventing member 27 is moved to the lower surface of the movable side spring receiving member 38. Even if it contacts, the movable side spring receiving member 38 does not rise. Thereby, the degree of vacuum in the vacuum chamber 13 can be set high. Moreover, if the degree of vacuum is high, the electronic component 2 is reliably held by suction, and there is no possibility of dropping during conveyance.

  After the nozzle 12 sucks and holds the electronic component 2 by the nozzle 12, the holder 11 moves up to the original height position, moves above the workpiece mounting position R, and stops. Then, the electronic component 2 that is lowered to the workpiece mounting height and sucked and held by the nozzle 12 is pressed against the upper surface of the printed circuit board 5 that has been transported to the workpiece mounting position R.

  The impact when the electronic component 2 is brought into contact with the upper surface of the printed circuit board 5 and pressed with a predetermined pressure can be buffered by the first shock buffer mechanism 26 or the first and second shock buffer mechanisms 26 and 35. . That is, when the impact force is relatively small, the ascending stroke of the nozzle 12 is short, and the rotation preventing member 27 does not come into contact with the movable side spring receiving member 38. The impact is buffered only by 19 compression deformations. On the other hand, when the impact force is large, when the rotation preventing member 27 rises and comes into contact with the lower surface of the movable spring receiving member 38, it is pushed up against the second buffer spring 36. Therefore, in addition to the first buffer spring 19, the second buffer spring 36 also compresses and deforms to buffer the impact. Therefore, there is no possibility that the electronic component 2 or the nozzle 12 is damaged.

  Further, it is assumed that parts other than the printed circuit board 5 are unexpectedly left or left under the holder 11 when the work is mounted. In that case, when the electronic component 2 collides with a component other than the printed circuit board 5 as the nozzle 12 is lowered, the electronic component 2 and the nozzle 12 receive a large impact. Also at this time, when the nozzle 12 is raised, the rotation preventing member 27 comes into contact with the movable side spring receiving member 38 and pushes up against the first and second buffer springs 19 and 36. Mechanisms 26 and 35 cushion the impact. Therefore, even when the electronic component 2 hits a component other than the printed circuit board 5, the electronic component 2 or the nozzle 12 is not damaged.

  In addition, the first and second buffer springs 19 and 36 can be greatly changed by exchanging them with ones having different spring constants or different natural lengths. By changing the fixing position of the spring receiving member 37, the reaction force of the first and second buffer springs 19 and 36 can be adjusted in a wide range.

  Furthermore, in the present invention, by adjusting the height of the stopper member 39 as described above, it is possible to easily adjust the amount (the sliding stroke Sv value) by which the nozzle 12 is lifted by the vacuum force when the workpiece is attracted.

  6 is a front view showing another embodiment of the present invention, FIG. 7 is a sectional view, and FIG. 8 is a sectional view taken along the line VIII-VIII in FIG. Note that the same components and portions as those in the above-described embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate. This embodiment shows an example in which the vertical sliding mechanism of the nozzle 12 is configured by a hollow spline. Therefore, a hollow spline is formed by a spline nut 50 provided in the vacuum chamber 13 of the holder 11 and a hollow spline shaft 51 provided in the nozzle 12 and slidably fitted into the spline nut 50. Thus, the rotation of the nozzle 12 is prevented. The spline nut 50 is fixed in the vacuum chamber 13 by a set screw 52. A ring-shaped removal preventing member 53 that prevents the spline nut 50 from dropping is fixed to the lower end opening 11 b of the holder 11 by a bolt 54.

  Further, an outer cylinder 55 is attached to the holder 11. The outer cylindrical body 55 includes a large-diameter cylindrical portion 55A on the upper end side and a small-diameter cylindrical portion 55B on the lower end side, and the large-diameter cylindrical portion 55A is fitted to the lower end portion of the outer peripheral surface of the holder 11 and fixed by a set screw 56. ing. The lower end portion of the nozzle 12 is loosely inserted into the small diameter cylindrical portion 55B, and the resin nozzle body 12B protrudes downward. Further, on the outer periphery of the small diameter cylindrical portion 55B, a second buffer spring 36, a fixed side spring receiving member 37, a movable side spring receiving member 38 and a stopper member 39 constituting the second shock absorbing mechanism 35 are provided. Corresponding to the stopper member 39, a pin (member) 57 projects from the outer peripheral surface lower end portion of the nozzle 12. The second buffer spring 36 is elastically mounted between the fixed side spring receiving member 37 and the movable side spring receiving member 38, and presses the movable side spring receiving member 38 against the stopper member 39. The fixed-side spring receiving member 37 and the stopper member 39 are fixed to the small-diameter cylindrical portion 55B by set screws 41 and 42 so that the height can be adjusted. An appropriate gap Sv is set between the lower surface of the movable spring receiving member 38 and the pin 57, thereby restricting the rise of the nozzle 2.

  The nozzle 12 includes a metal nozzle body 12A, the spline shaft 51 connected to the upper end of the nozzle body 12A, and a resin nozzle body 12B connected to the lower end of the nozzle body 12A.

  In the automatic mounting device having such a structure, since the nozzle 12 is slidably held by the spline nut 50 and the spline shaft 51 and prevented from rotating, a commercially available hollow spline can be used. The nozzle 12 can be slid smoothly.

  In the above embodiment, the present invention is applied to an automatic mounting apparatus used when mounting the electronic component 2 on the printed circuit board 5, but the present invention is not limited to this, and can be applied to articles other than electronic components. Can also be applied.

It is sectional drawing of the automatic mounting apparatus which concerns on this invention. It is the II-II sectional view taken on the line of FIG. It is the III-III sectional view taken on the line of FIG. It is the IV-IV sectional view taken on the line of FIG. It is A arrow directional view of FIG. It is a front view which shows other embodiment of this invention. It is sectional drawing. It is the VIII-VIII sectional view taken on the line of FIG. (A)-(c) is a figure for demonstrating the problem in case the sliding stroke of a nozzle is long. (A)-(d) is a figure for demonstrating the problem in case the sliding stroke of a nozzle is short.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 2 ... Electronic component, 5 ... Printed circuit board, 10 ... Automatic mounting apparatus, 11 ... Holder, 12 ... Nozzle, 13 ... Vacuum chamber, 18 ... Spring presser, 19 ... 1st buffer spring, 20 ... Position adjustment member, 21 ... Seal member, 22 ... nut, 26 ... first shock buffer mechanism, 27 ... rotation prevention member, 30 ... first buffer spring adjusting means, 35 ... second shock buffer mechanism, 36 ... second buffer spring, 37 ... fixed side spring receiving member, 38 ... movable side spring receiving member, 39 ... stopper member, 40 ... second adjusting means for buffer spring, 50 ... spline nut, 51 ... spline shaft.

Claims (6)

A nozzle that is slidably disposed in the holder and holds the workpiece by suction;
A first buffer spring for biasing the nozzle in a direction protruding from the holder; and a first buffer spring adjusting means for variably setting the biasing force of the first buffer spring, and the nozzle at the time of workpiece suction A first shock absorbing mechanism that reduces the shock when the abuts against the workpiece;
A second buffer spring having a larger spring constant than the first buffer spring; and second buffer spring adjusting means for variably setting an urging force of the second buffer spring, wherein the nozzle includes the workpiece. A second shock absorbing mechanism for mitigating a shock generated when mounting;
An automatic mounting device characterized by comprising: The automatic mounting apparatus according to claim 1, wherein
The adjusting means for the first buffer spring is slidably disposed in the holder, and has a spring press with which one end of the first buffer spring is press-contacted, one end connected to the spring press, and the other end An automatic mounting apparatus comprising: a position adjusting member that can be moved up and down protruding from the holder; and a fixing means that fixes the position adjusting member to the holder. The automatic mounting apparatus according to claim 1 or 2,
The second buffer spring adjusting means includes a fixed spring receiving member fixed to the holder and pressed against one end of the second buffer spring; and the second buffer spring slidably provided on the holder. A movable-side spring receiving member, the other end of which is pressed against, a stopper member for receiving and locking the movable-side spring receiving member, and a sliding stroke of the nozzle together with the movable-side spring receiving member provided on the nozzle. An automatic mounting device comprising a member. The automatic mounting apparatus according to claim 3, wherein
The automatic mounting apparatus, wherein the fixed-side spring receiving member and the stopper member are fixed to a holder by a fixing means so that the height can be adjusted independently of each other. The automatic mounting apparatus according to claim 3 or 4,
The automatic mounting device, wherein the member that limits the sliding stroke further has a function of preventing the nozzle from rotating and coming off. The automatic mounting apparatus according to claim 1 or 2,
2. The automatic mounting apparatus according to claim 1, wherein the holder includes a spline nut, and the nozzle includes a spline shaft that is slidably fitted to the spline nut.

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